CN117479421A - High-frequency high-speed prepreg, copper-clad plate and circuit board and manufacturing method - Google Patents
High-frequency high-speed prepreg, copper-clad plate and circuit board and manufacturing method Download PDFInfo
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- CN117479421A CN117479421A CN202311332074.0A CN202311332074A CN117479421A CN 117479421 A CN117479421 A CN 117479421A CN 202311332074 A CN202311332074 A CN 202311332074A CN 117479421 A CN117479421 A CN 117479421A
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- Prior art keywords
- glass fiber
- warp
- weft
- metal
- fiber bundles
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 96
- 239000002184 metal Substances 0.000 claims abstract description 96
- 239000003365 glass fiber Substances 0.000 claims abstract description 70
- 239000012779 reinforcing material Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000005530 etching Methods 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims abstract description 7
- 238000001035 drying Methods 0.000 claims abstract description 5
- 238000002791 soaking Methods 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- 239000011889 copper foil Substances 0.000 claims description 14
- 239000004744 fabric Substances 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 230000003746 surface roughness Effects 0.000 claims description 5
- 238000005553 drilling Methods 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 4
- 238000007731 hot pressing Methods 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000004513 sizing Methods 0.000 claims description 3
- 238000009941 weaving Methods 0.000 claims description 3
- 230000002500 effect on skin Effects 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 7
- 239000000463 material Substances 0.000 description 12
- 150000002739 metals Chemical class 0.000 description 5
- 230000002787 reinforcement Effects 0.000 description 5
- 230000008054 signal transmission Effects 0.000 description 5
- 238000010276 construction Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
The invention discloses a high-frequency high-speed prepreg which comprises warp-direction linear metal, warp-direction glass fiber bundles and weft-direction glass fiber bundles; warp-direction linear metal and warp-direction glass fiber bundles are woven into a reinforcing material of the prepreg by the same weft-direction glass fiber bundles; and soaking and drying the reinforcing material by using glue solution to obtain the prepreg. The high-frequency high-speed prepreg can meet the requirement of low linewidth and linewidth while reducing the etching process when the printed circuit board is prepared, and can also avoid the glass fiber effect and the skin effect in the high-frequency high-speed application of the prepared printed circuit board. The invention also discloses a copper-clad plate. The invention also discloses a circuit board and a manufacturing method thereof.
Description
Technical Field
The invention relates to a circuit board production and manufacturing technology, in particular to a high-frequency high-speed prepreg, a copper-clad plate, a circuit board and a manufacturing method.
Background
A Printed Circuit Board (PCB) is an important electronic component, a support for electronic components, and a carrier for electrically interconnecting the electronic components. The Copper Clad Laminate (CCL) is used as a base material for installing electronic elements. The copper-clad plate is a plate-shaped material which is prepared by dipping electronic glass fiber cloth or other reinforcing materials with resin, curing to a certain degree to form a prepreg, and then coating copper foil on one or both sides and hot-pressing. The copper foil on the copper-clad plate is etched to form a circuit, and the etching causes waste of energy and metal copper and pollution. In addition, the line width and line spacing are smaller and smaller, and the requirements on the etching process are higher and higher, so that the conventional process faces challenges. With the development of technology, the types of Printed Circuit Boards (PCBs) are becoming more and more diversified, as are the requirements for copper-clad plates and prepregs.
The dielectric layer of the common Printed Circuit Board (PCB) is formed by interweaving and mixing glass fiber bundles embedded in epoxy resin, gaps among the glass fiber bundles can cause local change of relative dielectric constant of the dielectric layer (glass fiber effect), the dielectric layer can generate non-negligible influence on signals during high-speed transmission, and the high-speed development of signal transmission puts higher demands on the Printed Circuit Board (PCB). When the signal rate on the system bus increases to the Gbps level, the assumption that the dielectric layer of the Printed Circuit Board (PCB) previously thought by the electronics industry to be uniform is no longer applicable.
In order to eliminate the glass fiber effect, the following measures are generally adopted: using a flat glass fiber cloth; using higher grade materials; the circuit avoids horizontal and vertical routing, avoiding the directions of warp and weft. These all increase the cost of the circuit board.
Meanwhile, the skin effect exists in the alternating current, and the skin depth is smaller as the frequency is higher. For high frequency circuit boards, the signal transmission thickness on the wire surface is only 2.1 μm when the frequency reaches 1 GHz. When the signal transmission frequency was increased to 10GHz, the transmission thickness of the signal on the conductor surface was 0.7 μm. If the surface roughness of the conductor is 3-5 mu m, the signal transmission is only carried out within the thickness range of the roughness, the standing wave and reflection of the transmitted signal become more and more serious, and the signal transmission path becomes longer and the loss increases.
In order to avoid skin effect, reduction of surface roughness of copper foil is mainly adopted, and ultra-low profile or even profile-free copper foil is used. The method not only increases the production cost, but also reduces the peeling strength of the copper foil, and influences the reliability of the product.
Disclosure of Invention
The invention aims to solve the technical problem of eliminating the glass fiber effect and the skin effect in high-frequency and high-speed application of a circuit board.
In order to solve the above technical problems, the present invention provides a high-frequency high-speed prepreg comprising warp-line shaped metal 11, warp glass fiber bundles 21 and weft glass fiber bundles 22;
warp-direction linear metal 11 and warp-direction glass fiber bundles 21 are woven into a prepreg reinforcing material by weft-direction glass fiber bundles 22;
and soaking and drying the reinforcing material by using glue solution to obtain the prepreg.
Preferably, the high-frequency high-speed prepreg further comprises weft-wise linear metal 12;
warp-direction linear metal 11, weft-direction linear metal 12, warp-direction glass fiber bundles 21 and weft-direction glass fiber bundles 22 are woven into a prepreg reinforcing material;
and soaking and drying the reinforcing material by using glue solution to obtain the prepreg.
Preferably, the warp-direction linear metal 11 and the weft-direction linear metal 12 are made of gold, silver, copper, aluminum or alloys thereof;
the cross sections of the warp and weft strip metals 11 and 12 are circular, elliptical or rectangular.
Preferably, the warp-direction linear metal 11 and the weft-direction linear metal 12 are aluminum with gold, silver or copper on the surface, or copper with gold or silver on the surface;
the surface roughness Rz of the warp and weft strip metals 11 and 12 is less than 1 μm.
Preferably, the warp linear metal 11 and/or the weft linear metal 12 are S metal wires, and S is a positive integer;
at least one of the warp glass fiber bundles 21 and/or weft glass fiber bundles 22 incorporates the warp strip metal 11 and/or weft metal wire 12.
Preferably, the warp strip-shaped metal 11 and/or the weft strip-shaped metal 12 are parallel double wires formed by 2 mutually insulated metal wires.
Preferably, the warp linear metal 11 and/or the weft linear metal 12 are metal strips;
p unidirectional glass fiber bundles are woven between two adjacent unidirectional metal belts, wherein P is a positive integer;
the width of the metal bands is the same as the width of the warp or weft glass fiber bundles 21, 22.
In order to solve the technical problems, the copper-clad plate is formed by laminating one, two or more high-frequency and high-speed prepregs together, covering copper foil on one or two sides, and hot-pressing;
an insulating layer is arranged between the copper foil and the high-frequency high-speed prepreg.
In order to solve the technical problems, the invention provides a circuit board which is made of the copper-clad plate.
In order to solve the technical problems, the manufacturing method of the circuit board provided by the invention comprises the following steps:
s1, when weaving the glass fiber cloth, metal wires are doped into warp-wise glass fiber bundles or weft-wise glass fiber bundles, or the glass fiber bundles are replaced by metal wire belts, and other working procedures are not changed, so that the glass fiber cloth for the high-frequency high-speed prepreg is obtained;
s2, sizing the glass fiber cloth to obtain a high-frequency high-speed prepreg;
s3, pressing one, two or more high-frequency high-speed prepregs with copper foil to obtain a copper-clad plate;
s4, etching the copper-clad plate to manufacture a surface circuit;
s5, drilling, electroplating and plugging the copper-clad plate to form an internal circuit and communicating the internal circuit with the surface circuit.
The high-frequency high-speed prepreg is regularly doped with warp-direction linear metal 11 when the glass fiber cloth is woven, so that the reinforced material of the prepreg mixed with the lead is obtained, and the reinforced material of the prepreg is soaked in glue solution and dried to obtain the prepreg. When the high-frequency high-speed prepreg is used for preparing a Printed Circuit Board (PCB), the available space of a circuit in the PCB can be increased while the etching process is reduced, and the glass fiber effect and the skin effect of the prepared Printed Circuit Board (PCB) in high-frequency high-speed application can be eliminated.
Drawings
In order to more clearly illustrate the technical solutions of the present invention, the following brief description of the drawings is given for the purpose of the present invention, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings can be obtained according to these drawings without the need for inventive work for a person skilled in the art.
FIG. 1 is a schematic view of a first structure of a reinforcement material of a high frequency high speed prepreg according to the present invention;
FIG. 2 is a schematic view of a second construction of a reinforcement material for a high frequency high speed prepreg according to the present invention;
FIG. 3 is a schematic view of a third construction of a reinforcement material for a high frequency high speed prepreg according to the present invention;
FIG. 4 is a schematic view of a fourth construction of a reinforcement material for a high frequency high speed prepreg according to the present invention;
fig. 5 is a schematic diagram of a high frequency high speed circuit board of the present invention.
Reference numerals illustrate:
11 latitudinal linear metal; 12 weft-wise linear metal; 21 warp glass fiber bundles; 22 weft glass fiber bundles; 31 surface circuitry; 32 insulating holes; 33 conductive holes.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by a person skilled in the art based on the embodiments of the invention without any inventive effort, are intended to fall within the scope of the invention.
The terms "first," "second," and the like, as used herein, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other.
Example 1
A high frequency high speed prepreg comprising strip-shaped metal warp yarns 11, glass fiber bundles 21 and glass fiber bundles 22;
the warp-direction linear metal 11 and the warp-direction glass fiber bundles 21 are woven into a prepreg reinforcing material by the same weft-direction glass fiber bundles 22, as shown in fig. 1, 2, 3 and 4;
and soaking and drying the reinforcing material by using glue solution to obtain the prepreg.
The high-frequency high-speed prepreg of the first embodiment is regularly doped with warp-direction linear metal 11 when the glass fiber cloth is woven, so that the reinforced material of the prepreg mixed with the lead is obtained, and the reinforced material of the prepreg is soaked in glue solution and dried, so that the prepreg is obtained. The cross-sectional area of the warp beam shaped metal 11 and the proportion of the warp beam shaped metal 11 to be incorporated into the warp glass fiber bundles 21 are determined according to the magnitude of the current carried by the warp beam shaped metal 11 and the specifications of the glass fiber cloth.
The high-frequency high-speed prepreg of the first embodiment can reduce the etching process and increase the available space of circuits in a circuit board when the Printed Circuit Board (PCB) is prepared, and can also eliminate the glass fiber effect and the skin effect in the high-frequency high-speed application of the prepared Printed Circuit Board (PCB).
Example two
Based on the first embodiment, the high-frequency high-speed prepreg further comprises weft-wise linear metal 12;
warp-direction linear shape metal 11, weft-direction linear shape metal 12, warp-direction glass fiber bundles 21 and weft-direction glass fiber bundles 22 are woven into the reinforcement material of the prepreg.
Preferably, the warp and weft strip metals 11 and 12 are made of gold, silver, copper, aluminum or alloys thereof.
Preferably, the cross sections of the warp and weft strip metals 11 and 12 are circular, elliptical, rectangular, etc.
Preferably, the warp-direction linear metal 11 and the weft-direction linear metal 12 are aluminum with gold, silver or copper on the surface, or copper with gold or silver on the surface;
preferably, the surface roughness Rz of the warp and weft linear metals 11 and 12 is less than 1 μm.
Example III
Based on the high-frequency high-speed prepreg of the second embodiment, the warp-direction strip-shaped metal 11 and/or the weft-direction strip-shaped metal 12 are S metal wires, and S is a positive integer, as shown in fig. 1 and 2;
at least one of the warp glass fiber bundles 21 and/or weft glass fiber bundles 22 incorporates the warp strip metal 11 and/or weft metal wire 12.
Preferably, the warp strip-shaped metal 11 and/or the weft strip-shaped metal 12 are parallel double wires formed by 2 mutually insulated metal wires.
Example IV
The high-frequency high-speed prepreg according to the second embodiment, wherein the warp-direction strip-shaped metal 11 and/or the weft-direction strip-shaped metal 12 are metal strips, as shown in fig. 3 and 4;
p unidirectional glass fiber bundles are woven between two adjacent unidirectional metal belts, wherein P is a positive integer;
the width of the metal bands is the same as the width of the warp or weft glass fiber bundles 21, 22.
Preferably, the warp metal strips are formed from a bundle of parallel metal wires, as shown in fig. 3.
Preferably, the warp metal strips are formed by intertwining a plurality of metal wires, as shown in fig. 4.
Preferably, P is 1, 2, 3 or 4.
Example five
A copper-clad plate is formed by laminating one, two or more high-frequency and high-speed prepregs according to the first to fourth embodiments together, covering copper foil on one or two sides, and hot-pressing;
an insulating layer is arranged between the copper foil and the high-frequency high-speed prepreg.
The copper-clad plate of the fifth embodiment can reduce the etching process and increase the available space of circuits in the circuit board when the Printed Circuit Board (PCB) is prepared, and can also eliminate the glass fiber effect and the skin effect in the high-frequency and high-speed application of the prepared Printed Circuit Board (PCB).
Example six
A circuit board is made of the copper-clad plate in the fifth embodiment.
The circuit board of the sixth embodiment can connect the surface circuit with the built-in warp linear metal 11 and/or weft linear metal 12 by drilling and electroplating processes, which not only increases the available space for the circuit in the circuit board, but also eliminates the glass fiber effect and skin effect in the high-frequency and high-speed application of the preparation and has low cost.
Example seven
The method for manufacturing the circuit board according to the sixth embodiment includes the following steps:
s1, when weaving glass fiber cloth, metal wires are doped into warp-wise glass fiber bundles or weft-wise glass fiber bundles, or the glass fiber bundles are replaced by metal belts, and other working procedures are not changed, so that the glass fiber cloth (reinforcing material) for the high-frequency high-speed prepreg is obtained; the type, cross section, doping ratio and doping form of the wire or metal strip are determined by the circuit design;
s2, sizing the glass fiber cloth (reinforcing material) to obtain a high-frequency high-speed prepreg;
s3, pressing one, two or more high-frequency high-speed prepregs with copper foil to obtain a copper-clad plate;
s4, etching the copper-clad plate to manufacture a surface circuit 31, as shown in FIG. 5;
s5, drilling, electroplating and plugging the copper-clad plate to form an insulating hole 32 and a conductive hole 33, and forming an internal circuit and communicating with the surface circuit.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather to enable any modification, equivalent replacement, improvement or the like to be made within the spirit and principles of the invention.
Claims (10)
1. A high frequency high speed prepreg comprising warp-strand metal (11), warp glass fiber bundles (21) and weft glass fiber bundles (22);
the warp-direction linear metal (11) and the warp-direction glass fiber bundles (21) are woven into a prepreg reinforcing material by the same weft-direction glass fiber bundles (22);
and soaking and drying the reinforcing material by using glue solution to obtain the prepreg.
2. The high-frequency high-speed prepreg according to claim 1, wherein,
the high-frequency high-speed prepreg further comprises weft-wise linear metal (12);
the warp-direction linear metal (11), the weft-direction linear metal (12) and the warp-direction glass fiber bundles (21) are woven into the reinforcing material of the prepreg by the same weft-direction glass fiber bundles (22).
3. The high-frequency high-speed prepreg according to claim 2, wherein,
the warp-wise linear metal (11) and the weft-wise linear metal (12) are made of gold, silver, copper, aluminum or alloys thereof;
the cross sections of the warp-direction linear metal (11) and the weft-direction linear metal (12) are round, elliptic or rectangular.
4. The high-frequency high-speed prepreg according to claim 2, wherein,
the warp-wise linear metal (11) and the weft-wise linear metal (12) are aluminum with gold, silver or copper on the surface or copper with gold or silver on the surface;
the surface roughness Rz of the warp-direction linear metal (11) and the weft-direction linear metal (12) is less than 1 mu m.
5. The high-frequency high-speed prepreg according to claim 1, wherein,
the warp-wise linear metal (11) and/or the weft-wise linear metal (12) are S metal wires, and S is a positive integer;
at least one of the warp glass fiber bundles (21) and/or weft glass fiber bundles (22) incorporates the warp strip metal (11) and/or weft metal wire (12).
6. The high-frequency high-speed prepreg according to claim 5, wherein,
the warp-wise linear metal (11) and/or the weft-wise linear metal (12) are parallel double-stranded wires formed by 2 mutually insulated metal wires.
7. The high-frequency high-speed prepreg according to claim 1, wherein,
the warp-wise linear metal (11) and/or the weft-wise linear metal (12) are metal strips;
p unidirectional glass fiber bundles are woven between two adjacent unidirectional metal belts, wherein P is a positive integer;
the width of the metal belt is the same as the width of the warp glass fiber bundles (21) or the weft glass fiber bundles (22).
8. A copper-clad plate, which is characterized in that one, two or more high-frequency and high-speed prepregs according to any one of claims 1 to 7 are laminated together, copper foil is covered on one or two sides, and the copper-clad plate is formed after hot pressing;
an insulating layer is arranged between the copper foil and the high-frequency high-speed prepreg.
9. A circuit board characterized by being made of the copper-clad plate of claim 8.
10. A method of manufacturing a circuit board as defined in claim 9, comprising the steps of:
s1, when weaving the glass fiber cloth, metal wires are doped into warp-wise glass fiber bundles or weft-wise glass fiber bundles, or the glass fiber bundles are replaced by metal belts, and other working procedures are not changed, so that the glass fiber cloth for the high-frequency high-speed prepreg is obtained;
s2, sizing the glass fiber cloth to obtain a high-frequency high-speed prepreg;
s3, pressing one, two or more high-frequency high-speed prepregs with copper foil to obtain a copper-clad plate;
s4, etching the copper-clad plate to manufacture a surface circuit;
s5, drilling, electroplating and plugging the copper-clad plate to form an internal circuit and communicating the internal circuit with the surface circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311332074.0A CN117479421A (en) | 2023-10-16 | 2023-10-16 | High-frequency high-speed prepreg, copper-clad plate and circuit board and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311332074.0A CN117479421A (en) | 2023-10-16 | 2023-10-16 | High-frequency high-speed prepreg, copper-clad plate and circuit board and manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117479421A true CN117479421A (en) | 2024-01-30 |
Family
ID=89626638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311332074.0A Pending CN117479421A (en) | 2023-10-16 | 2023-10-16 | High-frequency high-speed prepreg, copper-clad plate and circuit board and manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117479421A (en) |
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2023
- 2023-10-16 CN CN202311332074.0A patent/CN117479421A/en active Pending
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