CN111970813B - Wire-implanted circuit board, processing method and processing equipment thereof - Google Patents
Wire-implanted circuit board, processing method and processing equipment thereof Download PDFInfo
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- CN111970813B CN111970813B CN202010822030.6A CN202010822030A CN111970813B CN 111970813 B CN111970813 B CN 111970813B CN 202010822030 A CN202010822030 A CN 202010822030A CN 111970813 B CN111970813 B CN 111970813B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
Abstract
A wire-implanted circuit board comprises: the prepreg layer comprises a reinforcing part and a bonding part, and the reinforcing part is provided with grains; the wire layer, the wire layer implants bonding department, and the wire layer is arranged according to the line. A processing method of a wire-implanted circuit board comprises the following steps: and arranging the leads on the prepreg directly according to the set lead arrangement requirement. A processing equipment of wire-planting circuit board comprises: and the wiring machine is used for arranging the conducting wire on the bonding part of the prepreg according to the grains of the reinforcing part of the prepreg. Accordingly, the present invention can achieve the technical effects that the roughness of the wire layer and the physical properties of the wire layer in the bonding part are uniform, so that the electrical performance of the wire layer is improved (uniform impedance, low loss, good electromagnetic performance, etc.), the mechanical performance is reliable, and the present invention is suitable for transmitting high-speed and high-frequency electrical signals. Moreover, according to the processing method provided by the invention, the wire-planted circuit board can be manufactured by adopting the processing equipment provided by the invention.
Description
Technical Field
The invention relates to the field of design and production of wire-implanted circuit boards, in particular to a wire-implanted circuit board, a processing method of the wire-implanted circuit board and processing equipment of the wire-implanted circuit board.
Background
The printed circuit board in the prior art is manufactured in the following way: the method is simply summarized that a needed strip line or a needed microstrip line is formed on a copper-clad plate through etching and is used for signal transmission.
In the 4G era, the single-channel signal transmission rate of the PCB is increased from 10Gbps to 25Gbps, and the 5G era is expected to be further increased to more than 50 Gbps. The signal high speed/high frequency is that the signal transmission is more and more concentrated on the surface layer of the wire (called skin effect), when the frequency reaches 1GHz, the transmission thickness of the signal on the surface of the wire is only 2.1 μm, if the roughness of the surface of the conductor is 3-5 μm, the signal transmission is only carried out in the thickness range of the roughness; when the signal transmission frequency is increased to 10GHz, the transmission thickness of signals on the surface of the conductor is 0.7 μm, and the signal transmission is carried out in a roughness range. The signal is transmitted in the roughness range, the standing wave and reflection of the transmitted signal become more and more serious, and the signal transmission path is lengthened, and the loss is increased.
The copper-clad plate in the prior art is mainly a plate-shaped material which is prepared by coating one side or two sides of a prepreg (glass fiber cloth or other reinforced materials are soaked with resin) with copper foil and hot-pressing. The glass fiber cloth part in the prepreg is an insulator in the prepreg part, and the copper foil part is a conductor. In the prior art, improvements are made on glass fiber cloth and copper foil to attempt to obtain better electrical characteristics. Chinese patent document CN102803576A discloses a roughened copper foil and a manufacturing method thereof, a copper-clad laminate and a printed circuit board, wherein the main technical scheme is that the roughened copper foil is formed by roughening the surface roughness Rz of the copper foil by 0.05-0.3 mu m, the surface roughness Rz after the roughening treatment is less than 1.1 mu m, and the roughened surface is formed by convex roughened particles with the width of 0.3-0.8 mu m, the height of 0.4-1.8 mu m and the height-to-width ratio (height/width) of 1.2-3.5 and sharp front ends. The technical effect of the scheme is that the copper foil is inserted into the resin base material by utilizing the surface roughness, so that the manufacturability, reliability and other mechanical properties of the connection between the copper foil and the resin base material are improved. But the roughness also affects the electromagnetic performance, increases the energy loss and impairs the transmission speed of high-speed signals. In the prepreg, the glass cloth or other reinforcing material corresponds to the rigid portion, and the resin corresponds to the flexible portion. In the prior art, a designer usually can only design and arrange on a macroscopic scale aiming at the fiber direction of glass fiber cloth and the like, and from a microscopic view, if the designer arranges wires according to the warp and weft directions, the part of the wires is actually on the warp, the weft and the resin, or some final wires are completely on the resin material. This makes the wire in an environment not in a uniform resin system but in an environment in which the glass cloth and the resin are randomly mixed. Another wiring method is to use 45 degree oblique longitude and latitude lines to perform wiring, so as to eliminate random errors, or in other words, to make the bad characteristics at different places as consistent as possible. The wiring is performed by etching, so that the wiring cannot be performed according to the texture of the glass cloth, the wiring is relatively random, the electrical performance of the strip line is affected by the texture, and the impedance of the lead layer (the strip line or the microstrip line) is uneven. Furthermore, avoiding the foregoing, the errors in etching due to the diffraction effects of light have caused the final etched lines to differ significantly from the desired lines. Therefore, the impedance is very difficult to control due to tolerance problems with etched microstrip lines or striplines. The current processing technology can only keep the fluctuation range of the impedance within +/-10 percent. And because of the limitations of the etching process, the cross-section of the stripline can only be in a geometry that is predominantly rectangular. Copper is currently used as the main metal for processing copper clad laminate, and is characterized by good processability and low cost, but is not the best high-frequency high-speed material, for example, silver has better conductivity than copper. Current etching processes cannot be applied if silver is desired.
The following problems exist in the prior art.
First, the roughness on the copper foil surface influences the electromagnetic performance while promoting its mechanical properties, impairs the transmission speed of high-speed signals, and increases the loss.
Second, the environment in which the strip line is located is not in a completely homogeneous resin system, but rather has a reinforced glass cloth as an intermediate medium. The texture of the glass cloth is not well known when the glass cloth is wired by etching, and the texture affects the electrical properties of the strip line, such as uneven impedance.
Third, the etched microstrip lines have large tolerances, the cross-sectional shapes cannot be optimized, and the transmission of high-speed signals is greatly affected only by the limitation of copper and the like.
And fourthly, the copper-clad plate is mainly made of copper, and is not the best high-frequency high-speed material.
In summary, the printed circuit manufacturing method and the printed circuit board structure of the prior art have been unable to meet the requirement of high-speed signal transmission.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: under the high-speed and high-frequency signal transmission, how to improve the electrical property of the wire in the circuit board, so that the wire has uniform impedance, improved electromagnetic property and reduced loss, and can further meet the requirement of the current signal transmission.
In order to solve the above technical problems, the present invention provides a wire-embedded circuit board, which aims to improve the impedance uniformity of a wire layer (similar to a strip line or a microstrip line), reduce the loss of the wire layer, and improve the electromagnetic performance of the wire.
In order to achieve the above object, the present invention provides a wire-bonding circuit board, comprising:
the prepreg layer comprises a reinforcing part and a bonding part, wherein the reinforcing part is provided with grains;
the wire layer is implanted into the bonding part and is arranged according to the grains.
Preferably, the material of the conducting wire layer is a metal material with set conductivity, the material of the conducting wire layer comprises one or more of copper, silver, nickel or gold, the shape of the conducting wire layer is one or a combination of rectangle, trapezoid, circle, ellipse, triangle, T-shape and I-shape, and the conducting wire is smooth.
Preferably, the prepreg layer comprises two layers; the reinforcing part is made of glass fiber cloth and is woven by glass fiber warps and wefts, and the warps and the wefts form grains; the bonding part is resin;
the wire is arranged in a bonding part on the warp or weft of one prepreg layer to form a wire layer, the other prepreg layer is covered on the wire layer, the grains of the two layers of prepregs are aligned in parallel under the set measuring frame, and the bonding parts are arranged in a way of abutting against each other;
the formed wire layer is positioned in the bonding part, the two surfaces of the bonding part are both provided with reinforcing parts, and the outer surfaces of the two reinforcing parts are also both provided with bonding parts.
In order to solve the above technical problems, the present invention further provides a method for processing a wire-implanted circuit board, which aims to process the wire-implanted circuit board having uniform impedance, low loss and good electromagnetic performance.
In order to achieve the above object, the present invention further provides a method for processing a wire-bonding circuit board, comprising: and arranging the leads on the prepreg directly according to the set lead arrangement requirement.
Preferably, the prepreg is woven by glass fiber warps and wefts, the warps and wefts run as reinforced parts in the prepreg, and after enlargement, the warps and wefts are approximately linearly arranged along one direction but have bends thereon,
the conductor arrangement requires that after the starting point and the end point are set, the conductor is arranged above the same warp or the same weft after the enlarged display, and the conductor is also bent at the bent part of the same warp or weft.
Preferably, the wire is selected from one or more of copper, silver, nickel or gold or from one or more of copper, silver, nickel or gold alloy, the cross-sectional shape of the wire can be made into one or a combination of rectangle, trapezoid, circle, ellipse, triangle, T-shape and I-shape, and the wire is made by one or more processes of pressing, drawing or electroplating according to different wire arrangement designs.
Preferably, under the set measurement frame, another prepreg with the same texture as the prepreg is selected,
after all the leads are arranged, another prepreg is covered, and the prepreg is pressed for a set time at a set temperature and a set pressure by a hot pressing method.
Preferably, one or two of the two prepregs are coated with glue and then covered and hot-pressed.
In order to solve the above technical problems, the present invention further provides a processing apparatus for a wire-planted circuit board, which is capable of performing the above processing method and manufacturing the linear circuit board.
In order to achieve the above object, the present invention further provides a processing apparatus for a wire-implanted circuit board, comprising:
and the wiring machine is used for arranging the conducting wire on the bonding part of the prepreg according to the grains of the reinforcing part of the prepreg.
Preferably, the processing equipment of the wire-implanted circuit board further comprises:
the hot press is used for hot-pressing the conducting wire in the bonding parts of the two prepregs;
a glue coating machine for coating glue on the wire layer or another solidified sheet;
the wiring machine comprises a warp and weft detector;
the longitude and latitude detector comprises a magnifier, and the magnification of the magnifier is more than 10 to obtain texture data; or, the longitude and latitude line detector comprises a camera and an image processor, and can record lines formed by interweaving the longitude lines and the latitude lines of the enhancement part into images and process the images into line data;
the fabric cutting machine selects two prepregs with consistent textures under a set measuring frame according to texture data measured by the warp and weft detectors, and the two prepregs are arranged in parallel and opposite to each other in lines;
the wiring machine comprises a wiring data processor, wherein the wiring data processor inputs preliminary wiring data comprising set two end points of a wire, the two end points of the wire are corrected according to texture data and are positioned above warps or wefts, the wire is arranged on the same warp or the same weft according to the texture data of the warps or the wefts, and the wire can be bent according to the texture data and the bending of the warps or the wefts.
Compared with the prior art, the invention provides a wire-planting circuit board, which comprises: the prepreg layer comprises a reinforcing part and a bonding part, wherein the reinforcing part is provided with grains; the wire layer is implanted into the bonding part and is arranged according to the grains. The invention also provides a processing method of the wire-planting circuit board, which comprises the following steps: and arranging the leads on the prepreg directly according to the set lead arrangement requirement. The invention also provides a processing device of the wire-planting circuit board, which comprises: and the wiring machine is used for arranging the conducting wire on the bonding part of the prepreg according to the grains of the reinforcing part of the prepreg. Accordingly, the present invention can achieve the technical effects that the roughness of the wire layer and the physical properties of the wire layer in the bonding part are uniform, so that the electrical performance of the wire layer is improved (uniform impedance, low loss, good electromagnetic performance, etc.), the mechanical performance is reliable, and the present invention is suitable for transmitting high-speed and high-frequency electrical signals. Moreover, according to the processing method provided by the invention, the wire-planted circuit board can be manufactured by adopting the processing equipment provided by the invention.
Drawings
Fig. 1 is a schematic structural diagram of a wire-bonding circuit board according to an embodiment of the present invention.
Fig. 2A, fig. 2B, fig. 2C and fig. 2D are schematic diagrams illustrating a part of steps of an embodiment of a wire-implanted circuit board processing method provided by the present invention.
Description of reference numerals:
1a, 1b prepreg layers
11 reinforcing part
12 bonding part
13 warp yarn
14 weft
2 layer of conductor
21 conducting wires.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings.
Referring to fig. 1, a cross-sectional view of an embodiment of the wire-bonding circuit board provided by the present invention is shown, which is not used to limit the weaving process of the glass fiber cloth, but is only used to illustrate the basic structural relationship between the components of the wire-bonding circuit board according to the present invention. The invention provides a wire-planting circuit board, comprising: the prepreg layers 1a and 1b include a reinforcing portion 11 and a bonding portion 12, and the reinforcing portion 11 has a texture. As shown in fig. 1, the grain is formed by warp 13 and weft 14. The wire layer 2, the wire layer 2 is implanted in the bonding portion 12, and the wire layer 2 is arranged according to the grains 13 and 14. Accordingly, the conductor layer 2 can be formed in conformity with the texture. The invention is shown in fig. 1 with the conductor layer 2 coinciding with the warp threads 13.
The material of the conducting wire layer 2 is a metal material with set conductivity, and the material of the conducting wire layer comprises one or more of copper, silver, nickel or gold. The copper-clad plate mainly needs to use copper foil to etch and process the metal wire layer, so the material of the wire layer 2 in the prior art is practically limited to copper. The invention can apply one or more of copper, silver, nickel or gold to the circuit board, mainly depending on the design requirement of the circuit board. In high-frequency and high-speed circuits, silver wires have better signal transmission performance than copper.
The cross section of the wire layer is in one or a combination of a rectangle shape, a trapezoid shape, a circle shape, an oval shape, a triangle shape, a T shape and an I shape, and the wire is smooth. The embodiment represented in fig. 1 is circular. The electrical performance of the round wire is better than that of the rectangular wire. However, in the prior art, the copper foil is limited to a thin layer formed on a plane and then is etched, and in the photolithography, the etching speed is theoretically the same in one direction, so that a rectangular cross-sectional shape is formed. In a combined embodiment, two isosceles trapezoids are arranged with their short sides abutting each other, forming a shape similar to 8, the middle recess acting to improve mechanical stability. However, the two circular halves also form a similar 8-shape. The I-shaped and T-shaped mechanical characteristics are good. The smooth wire means that the roughness of the wire is low, the lower the wire is, the better the wire is, the processed wire is selected, secondary processing such as etching and the like is not needed, coarsening treatment is not needed to improve the mechanical property, and the roughness Rz of the wire can be basically ensured to be less than 0.6 μm.
The prepreg layers 1a, 1b include two layers; the reinforcing part 11 is made of glass fiber cloth and is woven by glass fiber warps 13 and wefts 14, and the warps 13 and the wefts 14 form lines. Also, the warp 13 and the weft 14 are portions to bear load. The adhesive portion 12 is resin. The bond 12 is flexible.
The wires 21 are arranged in the bonding portions 12 on the warp 13 or the weft 14 of one prepreg layer 1a to form a wire layer 2, the other prepreg layer 1b is covered on the wire layer 2, the two layers of prepregs 1a and 1b are aligned in parallel under the set measuring frame, the textures 13 and 14 are aligned, and the bonding portions 12 are arranged in a mutual abutting mode. Parallel alignment means that: the warp or weft of the upper prepreg layer and the lower prepreg layer are correspondingly parallel when the grain direction is consistent when viewed on the cross section; and in the plan view or the projection to the surface formed by the prepreg layer on the basis of fig. 1, the upper and lower warps or wefts are coincident. The measuring frame is set to be a parting concept, and because the microscopic patterns of the glass fiber cloth can show more inconsistency in smaller scale in a certain process and a certain manufacturing precision, the warp and the weft are ensured to be aligned in parallel on the set measuring frame and the set tolerance. The bonds 12 actually have four portions, two bonds 12 in the middle, i.e., when the prepreg 1b is overlaid on the prepreg 1a, two opposite bonds 12 need to be pressed together to form a whole.
Thus, the lead layer 2 is formed in the bonded portion 12, and the reinforced portions 11 are provided on both sides of the bonded portion 12, and the bonded portion 12 is provided on the outer surface of each of the reinforced portions 11.
Referring to fig. 1, a wiring board according to an embodiment of the present invention shown in the figure will be fully described. For convenience of description, the final structure is a symmetrical structure. The description is in one direction as shown, and is not intended to limit its orientation. Described from the bottom up.
The first bonding portion 12 of the first semi-cured sheet 1 a.
The reinforcing portion 11 of the first semi-cured sheet 1 a.
The second bonding portion 12 of the first semi-cured sheet 1 a.
The wire 21 located in the second bond 12 of the first prepreg 1a forms the wire layer 2, and the wire 21 is also located in the third bond 12 of the second prepreg 1 b. And, as seen from the figure, the wire 21 is directly opposite to the warp 13 of the first prepreg 1a and the second prepreg 1 b. The cross-sectional shape of the wire 21 is circular.
And a third bond 12 of the second prepreg 1 b. The third bonding portion 12 of the second prepreg 1b and the second bonding portion 12 of the first prepreg 1a abut against each other, and are joined to form an integrated bonding portion 12, and the wire 21 is enclosed in the bonding portion 12.
The reinforcement part 11 of the second prepreg 1 b. In this figure it can be seen that the warp threads 13 are aligned above and below (viewed in the vertical direction) and the weft threads 14 are parallel.
And a fourth bond 12 of the second prepreg 1 b.
The invention also provides a processing method of the wire-planting circuit board, which comprises the following steps: and arranging the leads on the prepreg directly according to the set lead arrangement requirement.
The prepreg is woven by glass fiber warps and glass fiber wefts, the directions of the warps and the wefts are reinforced parts in the prepreg, and after the prepreg is enlarged, the warps and the wefts are approximately linearly arranged along one direction and are provided with bent parts. The conductor arrangement requires that after the starting point and the end point are set, the conductor is arranged above the same warp or the same weft after the enlarged display, and the conductor is also bent at the bent part of the same warp or weft.
The lead is made of one or more selected from copper, silver, nickel or gold or one or more selected from copper, silver, nickel or gold alloy, the cross section of the lead can be made into one or more of a rectangle shape, a trapezoid shape, a circle shape, an oval shape, a triangle shape, a T shape and an I shape, and the lead is made by one or more processes of pressing, stretching or electroplating according to different lead arrangement designs.
And under the set measuring frame, selecting another prepreg with the same grain as the prepreg. After all the wires are arranged, another prepreg is covered, and the prepreg is pressed for a set time at a set temperature and a set pressure F by a hot pressing method. The temperature is set at less than 200 ℃.
And coating glue on one or two of the two prepregs, then covering and hot-pressing.
To facilitate understanding of the method for processing the wire-implanted circuit board, a specific embodiment of the present invention is disclosed, and fig. 2A to 2D show the main steps. Some of the following steps may be performed synchronously and are not limited in order.
The material is selected. Mainly the wires 21 and the prepregs 1a, 1 b. The wire 21 is selected from related metal wires which are directly delivered from a factory, and does not need to be roughened, so that the surface is kept smooth. Two prepregs need to be selected, and the lines of the prepregs are consistent within an allowable tolerance range (a combination of a plurality of tolerance ranges, such as straightness, a length direction dimensional tolerance, a width direction dimensional tolerance and the like, can reflect a measurement frame set in fractal). The term "identical" means that the two sheets are aligned in parallel when they are superposed. Symmetry in some directions can also be consistent after coverage.
And arranging the conducting wires. Referring to fig. 2A, the conductive wire 21 is designed according to the design requirement (the trend and the starting point in the design requirement) and the grain of the glass fiber cloth, the design requirement can only give the arrangement on the macro scale of the conductive wire, the grain can give the arrangement requirement on the micro scale, and the conductive wire is parallel to the warp or the weft. An operation is performed on the prepreg 1 a.
And covering the prepreg. Referring to fig. 2B, a prepreg 1B is placed directly above the prepreg 1 a. On a microscopic scale, the texture is guaranteed to be consistent, i.e., aligned in parallel.
And (5) hot pressing. Referring to fig. 2C, the prepreg is pressed at a predetermined temperature and a predetermined pressure for a predetermined time to tightly abut the facing bonds of the two prepregs to form an integrated structure, and to tightly cover the conductive wires. Glue can be applied to the bonding portion to be abutted, so that the bonding force is enhanced.
And (5) molding. Referring to fig. 2D, the final finished product of the wire-bonded circuit board after releasing the pressure and returning to room temperature is shown.
The invention also provides a processing device of the wire-planting circuit board, comprising: and the wiring machine is used for arranging the conducting wire on the bonding part of the prepreg according to the grains of the reinforcing part of the prepreg.
The processing equipment of planting line circuit board still contains: and the hot press is used for placing the lead in the bonding part of the two prepregs in a hot pressing manner. And executing the hot press molding step.
And the glue coater is used for coating glue on the wire layer or another curing sheet. The aforementioned step of applying glue on the opposite adhesive layer is performed.
The wiring machine comprises a warp and weft detector;
the longitude and latitude detector comprises a magnifier, and the magnification of the magnifier is more than 10 to obtain texture data; or, the longitude and latitude line detector comprises a camera and an image processor, and can record lines formed by interweaving the longitude lines and the latitude lines of the enhancement part into images and process the images into line data. Accordingly, it becomes possible to arrange the patterns. The image processing precision is determined according to the precision of warp and weft of the glass fiber cloth.
And the fabric cutting machine selects two prepregs with consistent lines under a set measuring frame according to the line data measured by the warp and weft detectors, and the two prepregs are arranged in parallel and opposite to each other. The selection of the semi-cured sheet in the aforementioned step of selecting a material is performed.
The wiring machine comprises a wiring data processor, wherein the wiring data processor inputs preliminary wiring data comprising set two end points of a wire, the two end points of the wire are corrected according to texture data and are positioned above warps or wefts, the wire is arranged on the same warp or the same weft according to the texture data of the warps or the wefts, and the wire can be bent according to the texture data and the bending of the warps or the wefts. In this way, the wire can be arranged right above the grains.
The above description is the specific implementation of the wire-implanted circuit board, the wire-implanted circuit board processing method and the wire-implanted circuit board processing equipment provided by the invention. Accordingly, the present invention can achieve the technical effects that the roughness of the wire layer and the physical properties of the wire layer in the bonding portion are uniform, and the wire is not required to be treated by roughening, etching, etc., which usually brings additional roughness, so that the roughness of the wire is very low, the wire is very smooth, and the sectional shape of the wire and the material of the wire can be selected in various ways, such as silver, round, etc., according to the electrical properties, so that the electrical properties of the wire layer are improved (uniform impedance, low loss, good electromagnetic properties, etc.), and the present invention is suitable for transmitting high-speed and high-frequency electrical signals. Moreover, the wires are wrapped in the bonding layer and are positioned above the warp or weft bearing load, and the wires are not positioned in a flexible part, namely a pure bonding layer (in cloth eyes), so that the mechanical performance is reliable. Moreover, according to the processing method provided by the invention, the wire-planted circuit board can be manufactured by adopting the processing equipment provided by the invention.
The above-mentioned embodiments and the accompanying drawings are only for illustrating the technical solutions and effects of the present invention, and are not to be construed as limiting the present invention. It is to be understood that those skilled in the art can modify and change the above-described embodiments without departing from the technical spirit and scope of the present invention as defined in the appended claims.
Claims (8)
1. A wire-implanted circuit board is characterized by comprising:
the prepreg layer comprises a reinforcing part and a bonding part, wherein the reinforcing part is provided with grains;
the wire layer is implanted into the bonding part and is arranged according to the grains;
the prepreg layer comprises two layers; the reinforcing part is made of glass fiber cloth and is woven by glass fiber warps and wefts, and the warps and the wefts form grains; the bonding part is resin;
the wire is arranged in a bonding part on the warp or weft of one prepreg layer to form a wire layer, the other prepreg layer is covered on the wire layer, the grains of the two layers of prepregs are aligned in parallel under the set measuring frame, and the bonding parts are arranged in a way of abutting against each other;
the formed wire layer is positioned in the bonding part, the two surfaces of the bonding part are both provided with reinforcing parts, and the outer surfaces of the reinforcing parts on the two surfaces are also both provided with bonding parts.
2. The wire-embedded circuit board of claim 1, wherein the wire layer comprises a wire, the material of the wire is a metal material with a set conductivity, the material of the wire comprises one or more of copper, silver, nickel, or gold, the cross-sectional shape of the wire is one or a combination of rectangular, trapezoidal, circular, oval, triangular, T-shaped, and I-shaped, and the wire is smooth.
3. A method for manufacturing the wire-bonding circuit board according to claim 1 or 2, comprising: and arranging the leads in the prepreg directly according to the set lead arrangement requirement.
4. The method of manufacturing a wire-planted circuit board according to claim 3, wherein the prepreg is woven by warp and weft of glass fiber, the warp and weft are oriented as reinforcing portions in the prepreg, and after enlargement, the warp and weft are arranged in a straight line in one direction but have a bent portion thereon,
the conductor arrangement requires that after the starting point and the end point are set, the conductor is arranged above the same warp or the same weft after the enlarged display, and the conductor is also bent at the bent part of the same warp or weft.
5. The method for processing a wire-planted circuit board according to claim 3,
the lead is made of one or more selected from copper, silver, nickel or gold or one or more selected from copper, silver, nickel or gold alloy, the shape of the lead is made into one or a combination of a rectangle, a trapezoid, a circle, an oval, a triangle, a T shape and an I shape, and the lead is made by one or more processes of pressing, stretching or electroplating according to different lead arrangement designs.
6. The method for processing a wire-planted circuit board according to claim 3,
under the set measuring frame, another prepreg with the same grain as the prepreg is selected,
after all the leads are arranged, another prepreg is covered, and the prepreg is pressed for a set time at a set temperature and a set pressure by a hot pressing method.
7. The method according to claim 6, wherein the two prepregs are coated with glue on one or both prepregs, and then covered and hot-pressed.
8. The utility model provides a processing equipment of plant line circuit board which characterized in that contains:
the wiring machine is used for arranging the conducting wire on the bonding part of the prepreg according to the grains of the reinforcing part of the prepreg;
the hot press is used for hot-pressing the conducting wire in the bonding parts of the two prepregs;
a glue coating machine for coating glue on the wire layer or another solidified sheet;
the wiring machine comprises a warp and weft detector;
the longitude and latitude detector comprises a magnifier, and the magnification of the magnifier is more than 10 to obtain texture data; or, the longitude and latitude line detector comprises a camera and an image processor, and can record lines formed by interweaving the longitude lines and the latitude lines of the enhancement part into images and process the images into line data;
the fabric cutting machine selects two prepregs with consistent textures under a set measuring frame according to texture data measured by the warp and weft detectors, and the two prepregs are arranged in parallel and opposite to each other in lines;
the wiring machine comprises a wiring data processor, wherein the wiring data processor inputs preliminary wiring data comprising set two end points of a wire, the two end points of the wire are corrected according to texture data and are positioned above warps or wefts, the wire is arranged on the same warp or the same weft according to the texture data of the warps or the wefts, and the wire can be bent according to the texture data and the bending of the warps or the wefts.
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| CN202010822030.6A CN111970813B (en) | 2020-08-15 | 2020-08-15 | Wire-implanted circuit board, processing method and processing equipment thereof |
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| CN202010822030.6A CN111970813B (en) | 2020-08-15 | 2020-08-15 | Wire-implanted circuit board, processing method and processing equipment thereof |
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| CN111970813A CN111970813A (en) | 2020-11-20 |
| CN111970813B true CN111970813B (en) | 2022-03-04 |
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| CN107104091A (en) * | 2017-05-27 | 2017-08-29 | 华进半导体封装先导技术研发中心有限公司 | A kind of half embedment circuit substrate structure and its manufacture method |
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| CN104066281B (en) * | 2014-07-04 | 2017-10-27 | 华进半导体封装先导技术研发中心有限公司 | The manufacture method and odd number laminar substrate of odd number laminar substrate |
| CN107146781B (en) * | 2017-05-27 | 2019-08-30 | 华进半导体封装先导技术研发中心有限公司 | It is a kind of to have core plate structure and its manufacturing method for the two-sided of BOT encapsulation |
| CN207939834U (en) * | 2018-02-07 | 2018-10-02 | 浙江华正新材料股份有限公司 | A kind of prepreg |
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| CN107104091A (en) * | 2017-05-27 | 2017-08-29 | 华进半导体封装先导技术研发中心有限公司 | A kind of half embedment circuit substrate structure and its manufacture method |
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