CN117858337A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN117858337A CN117858337A CN202410116479.9A CN202410116479A CN117858337A CN 117858337 A CN117858337 A CN 117858337A CN 202410116479 A CN202410116479 A CN 202410116479A CN 117858337 A CN117858337 A CN 117858337A
- Authority
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- China
- Prior art keywords
- carrier
- circuit board
- wire
- front surface
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 238000000034 method Methods 0.000 claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000010949 copper Substances 0.000 claims abstract description 14
- 238000009958 sewing Methods 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 239000003365 glass fiber Substances 0.000 claims description 23
- 239000004744 fabric Substances 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000013307 optical fiber Substances 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 9
- 238000007731 hot pressing Methods 0.000 claims description 8
- 238000010586 diagram Methods 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 claims description 5
- 239000012943 hotmelt Substances 0.000 claims description 4
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 3
- 229910001020 Au alloy Inorganic materials 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 239000003353 gold alloy Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 7
- 238000003475 lamination Methods 0.000 abstract description 6
- 238000005553 drilling Methods 0.000 abstract description 4
- 238000007747 plating Methods 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/0045—Cable-harnesses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/04—Flexible cables, conductors, or cords, e.g. trailing cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a circuit board and a manufacturing method thereof.A wire is used as a sewing thread to be sewn and fixed on a carrier, each wire penetrates into the carrier from the front surface of the carrier, and penetrates back to the front surface of the carrier after a certain distance in the carrier; or each wire passes through the carrier from the carrier front to the carrier back at a distance, and then passes through the carrier from the carrier back to the carrier front, and the wires positioned on the carrier front form a circuit pattern on the front of the substrate. The invention can directly connect circuits on two sides of the insulating carrier by using the wires according to the requirements without drilling copper plating, has flexible wiring and short process circuit, directly uses the wires to pass through (or penetrate into) the carrier to fix the positions of the wires by using the carrier, does not need to newly add fixed wires, has good lamination flowability in the manufacturing process, and is easy to manufacture and obtain the circuit board with uniform plate thickness.
Description
Technical Field
The invention relates to a copper-clad plate production and manufacturing technology, in particular to a circuit board and a manufacturing method thereof.
Background
The existing CCL (Copper Clad Laminate, copper clad laminate, abbreviated as "copper clad laminate") technology mainly has two kinds:
one is to integrate the prepreg (PP) with the conductor (copper foil) by hot pressing, and further etch the prepreg according to the circuit shape of the printed circuit board (Printed Circuit Board, PCB) to obtain the required circuit board pattern. The method has long process route, needs copper foil etching, and has low effective utilization of copper materials.
The other is to fix the wire on the prepreg by insulating wire, and integrate the wire and the prepreg by hot pressing according to circuit pattern. The mode needs to fix the wire by the insulated wire, the thickness of the insulated wire of the fixed wire can influence the thickness after lamination, and the wire distance is influenced by the fixed insulated wire.
Disclosure of Invention
The technical problem to be solved by the invention is to provide the circuit board and the manufacturing method thereof, which have flexible wiring, short process, no need of adding new fixing wires, good lamination fluidity in the manufacturing process and easy manufacture of the circuit board with uniform board thickness.
In order to solve the technical problems, the circuit board provided by the invention comprises a substrate, wherein the substrate comprises a carrier 1 and at least one wire 2;
the carrier 1 is made of insulating material, is sheet-shaped and is provided with a front surface and a back surface;
the lead 2 penetrates into the carrier 1 from the front surface of the carrier 1, and penetrates back to the front surface of the carrier 1 after the carrier 1 passes a certain distance; or,
the lead 2 passes through the carrier 1 from the front surface of the carrier 1 to the back surface of the carrier 1 at a certain distance and then passes through the carrier 1 from the back surface of the carrier 1 to the front surface of the carrier 1;
the conductors 2 on the front side of the carrier 1 form a circuit pattern on the front side of the substrate.
Preferably, the conductive wire 2 is an insulated enameled wire, a bare wire or an optical fiber wire.
Preferably, the conductive wire 2 is a metal sewing wire, and is made of one or more of copper, silver, nickel or gold, or one or more of copper, silver, nickel or gold alloy.
Preferably, if the length of the wire 2 located on the front surface of the carrier 1 is greater than the set length, the wire 2 is fixed to the carrier 1 with an insulating wire at a middle position of the length.
Preferably, a length of wire 2 on the front side of the carrier 1 is fixed to the carrier 1 by an insulating wire at a transverse bending position of the length of wire 2 when being bent transversely.
Preferably, the insulating thread is an electronic glass fiber sewing thread.
Preferably, the carrier 1 is glass fiber cloth or prepreg; .
The prepreg comprises resin and glass fiber cloth;
warp 11 and weft 12 of the glass fiber cloth are non-hot melt insulating materials.
Preferably, the circuit board comprises two substrates;
the two substrates are fixed together back to back;
the wire is a metal wire;
at least one metal wire pressing guide ring 5 is arranged between the back surfaces of the two substrates;
the same metal wire pressing guide ring 5 short-circuits the metal wires 2 of the two substrates needing short-circuit.
Preferably, the circuit board comprises two substrates;
the lead 2 is an optical fiber line;
at least one optocoupler module is arranged between the back surfaces of the two substrates;
the same optical coupling module is connected with two optical fiber wires which need to be short-circuited.
In order to solve the above technical problems, the present invention provides a method for manufacturing a circuit board, which is to stitch at least one conductive wire 2 onto a carrier 1 to obtain a substrate, and form a circuit pattern on the front surface of the substrate on the conductive wire 2 on the front surface of the carrier 1.
Preferably, at least one wire 2 is sewn to the carrier 1, and the intermediate position of each wire 2 with a length greater than a set length on the front surface of the carrier 1 is fixed to the carrier 1 by an insulating wire; the method comprises the steps of,
the lateral bending position of each length of wire 2 on the front side of the carrier 1 is fixed to the carrier 1 with an insulating wire.
Preferably, the carrier 1 is made of glass fiber cloth which is coiled without glue, after being unfolded, the conducting wires are fed for stitching to form a circuit pattern on the front surface of the substrate, the glass fiber cloth which is stitched by the conducting wires is glued and baked, and the glue layer, the conducting wires and the glass fiber cloth are combined into an integrated substrate;
then, slicing the substrate according to the size of the circuit diagram, overlapping, and further performing hot pressing and curing to obtain a semi-finished circuit board;
and then, an electronic element is additionally arranged on the semi-finished circuit board, and the circuit board is obtained by connecting the lead wires existing in the adhesive layer.
Preferably, the carrier 1 is a sheet-shaped prepreg, and the prepreg is directly sewn by using the lead 2 to obtain a substrate with a circuit pattern on the front side of the substrate;
then, slicing the substrate according to the size of the circuit diagram, overlapping, and further performing hot pressing and curing to obtain a semi-finished circuit board;
and then, an electronic element is additionally arranged on the semi-finished circuit board, and the circuit board is obtained by connecting the lead wires existing in the adhesive layer.
According to the circuit board and the manufacturing method thereof, the wires 2 are fixed on the carrier 1 by sewing as sewing threads, and each wire 2 penetrates into the carrier 1 from the front surface of the carrier 1, and penetrates back to the front surface of the carrier 1 after a certain distance in the carrier 1; or each wire 2 passes through the carrier 1 from the front surface of the carrier 1 to the back surface of the carrier 1 at a distance, and then passes through the carrier 1 from the back surface of the carrier 1 to the front surface of the carrier 1, and the wires 2 positioned on the front surface of the carrier 1 form a circuit pattern on the front surface of the substrate. The invention can directly connect circuits on two sides of the insulating carrier 1 by using the wires 2 according to the requirements without drilling copper plating, has flexible wiring and short process circuit, directly uses the wires 2 to pass through (or penetrate into) the carrier 1 to fix the positions of the wires 2 by using the carrier 1 without adding new fixing wires, has good lamination flowability in the manufacturing process, and is easy to manufacture and obtain the circuit board with uniform plate thickness.
Drawings
In order to more clearly illustrate the technical solutions of the present invention, the following brief description of the drawings is given for the purpose of the present invention, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings can be obtained according to these drawings without the need for inventive work for a person skilled in the art.
FIG. 1 is a schematic view of a circuit board according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a two-layer substrate according to an embodiment of the present invention.
Reference numerals illustrate:
1 a carrier; 11 warp threads; 12 wefts; 2, conducting wires; 5, a wire pressing guide ring.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by a person skilled in the art based on the embodiments of the invention without any inventive effort, are intended to fall within the scope of the invention.
The terms "first," "second," and the like, as used herein, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", "front", "rear", etc. are used merely to indicate relative positional relationships, which may also change accordingly when the absolute position of the object to be described changes.
It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other.
Example 1
A circuit board as shown in fig. 1 and 2 comprises a substrate, wherein the substrate comprises a carrier 1 and at least one wire 2;
the carrier 1 is made of insulating material, is sheet-shaped and is provided with a front surface and a back surface;
the lead 2 penetrates into the carrier 1 from the front surface of the carrier 1, and penetrates back to the front surface of the carrier 1 after the carrier 1 passes a certain distance; or,
the lead 2 passes through the carrier 1 from the front surface of the carrier 1 to the back surface of the carrier 1 at a certain distance and then passes through the carrier 1 from the back surface of the carrier 1 to the front surface of the carrier 1;
the conductors 2 on the front side of the carrier 1 form a circuit pattern on the front side of the substrate.
The lead 2 penetrates into the carrier 1 from the front surface of the carrier 1, and penetrates back to the front surface of the carrier 1 after the carrier 1 passes a certain distance; or,
the lead passes through the carrier 1 from the front surface of the carrier 1 to the back surface of the carrier 1 at a distance, and then passes through the carrier 1 from the back surface of the carrier 1 to the front surface of the carrier 1;
the conductors 2 on the front side of the carrier 1 form a circuit pattern on the front side of the substrate.
Preferably, the conductive wire 2 is an insulated enameled wire, a bare wire or an optical fiber wire. The wires 2 are insulated enameled wires, and the density of the wires 2 with the same area is high.
Preferably, the conductive wire 2 is a metal sewing wire, and is made of one or more of copper, silver, nickel or gold, or one or more of copper, silver, nickel or gold alloy.
In the circuit board of the first embodiment, the wires 2 are fixed to the carrier 1 as sewing threads, and each wire 2 penetrates into the carrier 1 from the front surface of the carrier 1, and penetrates back to the front surface of the carrier 1 after a certain distance in the carrier 1; or each wire 2 passes through the carrier 1 from the front surface of the carrier 1 to the back surface of the carrier 1 at a distance, and then passes through the carrier 1 from the back surface of the carrier 1 to the front surface of the carrier 1, and the wires 2 positioned on the front surface of the carrier 1 form a circuit pattern on the front surface of the substrate. The circuit board of the first embodiment can directly connect circuits on two sides of the insulating carrier 1 by using the wires 2 according to requirements without drilling copper plating, has flexible wiring and short process circuit, directly uses the wires 2 to pass through (or penetrate into) the carrier 1 warp (weft) wires to fix the positions of the wires 2 by using the carrier 1 without adding new fixing wires, has good lamination flowability in the manufacturing process, and is easy to manufacture and obtain the circuit board with uniform plate thickness.
Example two
Based on the circuit board of the first embodiment, if the length of a length of the wire 2 located on the front surface of the carrier 1 is greater than the set length, the wire 2 is fixed to the carrier 1 with an insulating wire at the intermediate position of the length.
Preferably, a length of wire 2 on the front side of the carrier 1 is fixed to the carrier 1 by an insulating wire at a transverse bending position of the length of wire 2 when being bent transversely.
Preferably, the insulating thread is an electronic glass fiber sewing thread.
Example III
Based on the circuit board of the first embodiment, the carrier 1 is glass fiber cloth or prepreg; .
The prepreg comprises resin and glass fiber cloth;
warp 11 and weft 12 of the glass fiber cloth are non-hot melt insulating materials.
In the circuit board of the third embodiment, the warp and weft of the glass fiber cloth are non-hot-melt insulating materials, so that the damage to the arrangement of the wires 2 caused by the flowing of the glass fiber cloth in the high-temperature lamination process can be avoided, and the controlled layout of the wires 2 can be obtained in the circuit board manufacturing process.
Example IV
According to an embodiment, as shown in fig. 2, the circuit board includes two substrates;
the two substrates are fixed together back to back;
the wire is a metal wire;
at least one metal wire pressing guide ring 5 is arranged between the back surfaces of the two substrates;
the same metal wire pressing guide ring 5 short-circuits the metal wires 2 of the two substrates needing short-circuit.
In the circuit board of the fourth embodiment, the wire pressing guide ring 5 can be sewn by wires, and the wires 2 of the upper and lower layers of substrates, which need to be short-circuited, are contacted and conducted through the wire pressing guide ring 5.
Example five
According to a first embodiment, the circuit board comprises two substrates;
the lead 2 is an optical fiber line;
at least one optocoupler module is arranged between the back surfaces of the two substrates;
the same optical coupling module is connected with two optical fiber wires which need to be short-circuited.
Example six
In the method for manufacturing the circuit board according to the first embodiment, at least one wire 2 is sewn to the carrier 1 to obtain a substrate, and the wire 2 on the front surface of the carrier 1 forms a circuit pattern on the front surface of the substrate.
Preferably, at least one wire 2 is sewn to the carrier 1, and the intermediate position of each wire 2 with a length greater than a set length on the front surface of the carrier 1 is fixed to the carrier 1 by an insulating wire; the method comprises the steps of,
the lateral (perpendicular to the front-back direction, or parallel to the front surface of the carrier 1) bending position of each length of wire 2 on the front surface of the carrier 1 is fixed to the carrier 1 with an insulating wire.
In the manufacturing method of the circuit board in the sixth embodiment, at least one wire 2 is sewn on the carrier 1 to obtain a substrate, the wire 2 on the front surface of the carrier 1 forms a circuit pattern on the front surface of the substrate, and the wire 2 can be directly used for connecting circuits on two sides of the insulating carrier according to requirements without drilling copper plating, so that the wiring is flexible, and the process route is shortened; the carrier 1 is used for fixing the wire positions without adding new fixing wires, so that the pressure and flow properties are good in the manufacturing process, and the circuit board with uniform plate thickness is easy to manufacture.
Example seven
According to the manufacturing method of the circuit board based on the sixth embodiment, the carrier 1 is made of a coiled glass fiber cloth without glue, after being unfolded, the conducting wires 2 are fed for sewing to form a circuit pattern on the front side of the substrate, the glass fiber cloth sewn by the conducting wires is glued and baked, and the glue layer, the conducting wires and the glass fiber cloth are combined into an integrated substrate;
then, slicing the substrate according to the size of the circuit diagram, overlapping, and further performing hot pressing and curing to obtain a semi-finished circuit board;
and then, an electronic element is additionally arranged on the semi-finished circuit board, and the circuit board is obtained by connecting the lead wires existing in the adhesive layer.
In the method for manufacturing a circuit board according to the seventh embodiment, the substrate may be continuously produced or wound.
Example eight
Based on the circuit board method of the sixth embodiment until the method, the carrier 1 is a sheet-shaped prepreg, and the prepreg is directly sewn by using the lead 2 to obtain a substrate with a circuit pattern on the front side of the substrate;
then, slicing the substrate according to the size of the circuit diagram, overlapping, and further performing hot pressing and curing to obtain a semi-finished circuit board;
and then, an electronic element is additionally arranged on the semi-finished circuit board, and the circuit board is obtained by connecting the lead wires existing in the adhesive layer.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather to enable any modification, equivalent replacement, improvement or the like to be made within the spirit and principles of the invention.
Claims (13)
1. A circuit board, characterized in that it comprises a substrate comprising a carrier (1) and at least one wire (2);
the carrier (1) is made of insulating material and is sheet-shaped and provided with a front surface and a back surface;
the lead (2) penetrates into the carrier (1) from the front surface of the carrier (1), and penetrates back to the front surface of the carrier (1) after the carrier (1) penetrates a certain distance; or,
the lead (2) passes through the carrier (1) from the front surface of the carrier (1) to the back surface of the carrier (1) at a certain distance, and then passes through the carrier (1) from the back surface of the carrier (1) to the front surface of the carrier (1);
the lead (2) on the front side of the carrier (1) forms a circuit pattern on the front side of the substrate.
2. The circuit board of claim 1, wherein the circuit board is configured to,
the lead (2) is an insulated enamelled metal wire, a bare metal wire or an optical fiber wire.
3. The circuit board of claim 1, wherein the circuit board is configured to,
the conducting wire (2) is a metal sewing wire, and is made of one or more of copper, silver, nickel or gold, or one or more of copper, silver, nickel or gold alloy.
4. The circuit board of claim 1, wherein the circuit board is configured to,
if the length of a section of wire (2) located on the front side of the carrier (1) is greater than the set length, the wire is fixed to the carrier (1) with an insulating wire at the intermediate position of the section of wire (2).
5. The circuit board of claim 4, wherein the circuit board is further configured to,
a length of wire (2) on the front side of the carrier (1) is secured to the carrier (1) with insulated wires at the transverse bending position of the length of wire (2) when bent transversely.
6. The circuit board of claim 5, wherein the circuit board is further configured to,
the insulating thread is an electronic glass fiber sewing thread.
7. The circuit board of claim 1, wherein the circuit board is configured to,
the carrier (1) is glass fiber cloth or prepreg; .
The prepreg comprises resin and glass fiber cloth;
warp (11) and weft (12) of the glass fiber cloth are non-hot melt insulating materials.
8. The circuit board of claim 1, wherein the circuit board is configured to,
the circuit board comprises two substrates;
the two substrates are fixed together back to back;
the wire is a metal wire;
at least one metal wire pressing guide ring (5) is arranged between the back surfaces of the two substrates;
the same metal line pressing guide ring (5) is used for shorting the metal wires (2) of the two substrates, which need to be shorted.
9. The circuit board of claim 1, wherein the circuit board is configured to,
the circuit board comprises two substrates;
the lead (2) is an optical fiber line;
at least one optocoupler module is arranged between the back surfaces of the two substrates;
the same optical coupling module is connected with two optical fiber wires which need to be short-circuited.
10. A method for manufacturing a circuit board as defined in claim 1, wherein,
and sewing at least one wire (2) on the carrier (1) to obtain a substrate, and forming a circuit pattern on the front surface of the substrate on the wire (2) on the front surface of the carrier (1).
11. The method for manufacturing a circuit board according to claim 10, wherein,
sewing at least one wire (2) to the carrier (1), and fixing the middle position of each wire (2) with the length larger than the set length on the front surface of the carrier (1) to the carrier (1) by using an insulating wire; the method comprises the steps of,
the transverse bending position of each section of wire (2) positioned on the front surface of the carrier (1) is fixed to the carrier (1) by an insulating wire.
12. The method for manufacturing a circuit board according to claim 11, wherein,
the carrier (1) is made of non-adhesive coiled glass fiber cloth, the carrier is unfolded and then is woven by a conducting wire to form a circuit pattern on the front side of the substrate, the glass fiber cloth which is woven by the conducting wire is glued and baked, and the glue layer, the conducting wire and the glass fiber cloth are combined into an integrated substrate;
then, slicing the substrate according to the size of the circuit diagram, overlapping, and further performing hot pressing and curing to obtain a semi-finished circuit board;
and then, an electronic element is additionally arranged on the semi-finished circuit board, and the circuit board is obtained by connecting the lead wires existing in the adhesive layer.
13. The method for manufacturing a circuit board according to claim 11, wherein,
the carrier (1) is a sheet-shaped prepreg, and the prepreg is directly sewn by a lead (2) to obtain a substrate with a circuit pattern on the front side of the substrate;
then, slicing the substrate according to the size of the circuit diagram, overlapping, and further performing hot pressing and curing to obtain a semi-finished circuit board;
and then, an electronic element is additionally arranged on the semi-finished circuit board, and the circuit board is obtained by connecting the lead wires existing in the adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410116479.9A CN117858337A (en) | 2024-01-29 | 2024-01-29 | Circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410116479.9A CN117858337A (en) | 2024-01-29 | 2024-01-29 | Circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117858337A true CN117858337A (en) | 2024-04-09 |
Family
ID=90546291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410116479.9A Pending CN117858337A (en) | 2024-01-29 | 2024-01-29 | Circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117858337A (en) |
-
2024
- 2024-01-29 CN CN202410116479.9A patent/CN117858337A/en active Pending
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