CN117476559B - 具有嵌入式电力电子器件的电力电子组件 - Google Patents

具有嵌入式电力电子器件的电力电子组件

Info

Publication number
CN117476559B
CN117476559B CN202310938970.5A CN202310938970A CN117476559B CN 117476559 B CN117476559 B CN 117476559B CN 202310938970 A CN202310938970 A CN 202310938970A CN 117476559 B CN117476559 B CN 117476559B
Authority
CN
China
Prior art keywords
layer
assembly
metal layer
power electronics
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202310938970.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN117476559A (zh
Inventor
周锋
请川纮嗣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Engineering and Manufacturing North America Inc
Original Assignee
Toyota Motor Engineering and Manufacturing North America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Engineering and Manufacturing North America Inc filed Critical Toyota Motor Engineering and Manufacturing North America Inc
Publication of CN117476559A publication Critical patent/CN117476559A/zh
Application granted granted Critical
Publication of CN117476559B publication Critical patent/CN117476559B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
CN202310938970.5A 2022-07-27 2023-07-27 具有嵌入式电力电子器件的电力电子组件 Active CN117476559B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/874,462 US12108563B2 (en) 2022-07-27 2022-07-27 Power electronics assemblies having embedded power electronics devices
US17/874,462 2022-07-27

Publications (2)

Publication Number Publication Date
CN117476559A CN117476559A (zh) 2024-01-30
CN117476559B true CN117476559B (zh) 2026-04-21

Family

ID=89626416

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310938970.5A Active CN117476559B (zh) 2022-07-27 2023-07-27 具有嵌入式电力电子器件的电力电子组件

Country Status (3)

Country Link
US (1) US12108563B2 (https=)
JP (1) JP7594058B2 (https=)
CN (1) CN117476559B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12238906B2 (en) * 2023-01-17 2025-02-25 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronic device assemblies having heat spreaders and electrically insulating layer
US12249554B2 (en) * 2023-02-01 2025-03-11 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronic device assemblies having an electrically insulating S-cell
US12284792B2 (en) * 2023-02-23 2025-04-22 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics assemblies having power electronics devices embedded within a flip chip
DE102023111238A1 (de) * 2023-05-02 2024-11-07 Schaeffler Technologies AG & Co. KG Vorrichtung zur Kühlung mindestens eines Leistungshalbleiters eines Schaltungsträgers

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52135678A (en) * 1976-05-10 1977-11-12 Toshiba Corp Semiconductor device and its productions
FR2654387B1 (fr) 1989-11-16 1992-04-10 Lorraine Carbone Materiau multicouche comprenant du graphite souple renforce mecaniquement, electriquement et thermiquement par un metal et procede de fabrication.
US20080265403A1 (en) * 2004-12-29 2008-10-30 Metal Matrix Cast Composites, Llc Hybrid Metal Matrix Composite Packages with High Thermal Conductivity Inserts
US20090186195A1 (en) 2006-09-08 2009-07-23 Reactive Nanotechnologies, Inc. Reactive Multilayer Joining With Improved Metallization Techniques
JP5025328B2 (ja) 2007-05-16 2012-09-12 株式会社東芝 熱伝導体
US8081468B2 (en) 2009-06-17 2011-12-20 Laird Technologies, Inc. Memory modules including compliant multilayered thermally-conductive interface assemblies
CN201706427U (zh) 2010-05-13 2011-01-12 嘉兴市旷逸新光源科技有限公司 用于安装led灯的金属化陶瓷安装座
KR101049678B1 (ko) 2010-06-21 2011-07-14 주식회사 심텍 방열 인쇄회로기판 및 이를 제조하는 방법
JP5316602B2 (ja) 2010-12-16 2013-10-16 株式会社日本自動車部品総合研究所 熱拡散部材の接合構造、発熱体の冷却構造、及び熱拡散部材の接合方法
CN202025797U (zh) 2011-03-16 2011-11-02 张申雄 一种用于大功率led发光二极管的复铜碳基石墨散热板
CN104754913B (zh) * 2013-12-27 2018-06-05 华为技术有限公司 导热复合材料片及其制作方法
CN105744718A (zh) 2014-12-11 2016-07-06 深南电路有限公司 散热pcb及其加工方法
JP6750379B2 (ja) 2016-08-04 2020-09-02 日産自動車株式会社 冷却装置
US10347601B1 (en) * 2018-01-29 2019-07-09 Toyota Motor Engineering & Manufacturing North America Power electronics assemblies with metal inverse opal bonding, electrical contact and cooling layers, and vehicles incorporating the same
US11690173B2 (en) * 2021-06-22 2023-06-27 Unimicron Technology Corp. Circuit board structure
KR102189945B1 (ko) 2019-01-09 2020-12-11 정성환 고방열 연성회로기판(gfpcb) 및 이의 제조 방법, 차량용 led 램프
CN209515738U (zh) 2019-04-10 2019-10-18 黄山学院 大功率GaN基LED的散热结构
TWI698969B (zh) * 2019-08-14 2020-07-11 朋程科技股份有限公司 功率元件封裝結構
TWI743557B (zh) 2019-09-05 2021-10-21 朋程科技股份有限公司 功率元件封裝結構
US11632860B2 (en) * 2019-10-25 2023-04-18 Infineon Technologies Ag Power electronic assembly and method of producing thereof
US11527456B2 (en) 2019-10-31 2022-12-13 Ut-Battelle, Llc Power module with organic layers
CN111302834B (zh) 2020-04-15 2020-10-23 湖南省美程陶瓷科技有限公司 一种微波磁控管绝缘陶瓷环
US11849539B2 (en) * 2020-08-13 2023-12-19 Toyota Motor Engineering & Manufacturing North America, Inc. Embedded cooling systems utilizing heat pipes
US11665813B2 (en) * 2020-08-14 2023-05-30 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics cooling assemblies and methods for making the same
AU2022323907B2 (en) * 2021-08-06 2024-12-19 Novocure Gmbh Electrode assembly for applying tumor treating fields (ttfields) with a sheet of anisotropic material
US11997838B2 (en) * 2022-02-01 2024-05-28 Toyota Motor Engineering & Manufacturing North America, Inc. Power device assemblies and methods of fabricating the same
US11910521B2 (en) * 2022-03-21 2024-02-20 Toyota Motor Engineering & Manufacturing North America, Inc. Power device assemblies having embedded PCBS and enhanced cooling and methods of fabricating the same

Also Published As

Publication number Publication date
JP7594058B2 (ja) 2024-12-03
US20240038624A1 (en) 2024-02-01
CN117476559A (zh) 2024-01-30
US12108563B2 (en) 2024-10-01
JP2024019075A (ja) 2024-02-08

Similar Documents

Publication Publication Date Title
CN117476559B (zh) 具有嵌入式电力电子器件的电力电子组件
US6016007A (en) Power electronics cooling apparatus
JP7749530B2 (ja) 埋め込みｐｃｂを有するパワーデバイスアセンブリ及びその製造方法
JP3641232B2 (ja) インバータ装置及びその製造方法
JP7592799B2 (ja) 電気絶縁層を有するパワーエレクトロニクスデバイスアセンブリ
JP7500792B2 (ja) パワーエレクトロニクスアセンブリ及びその製造方法
JP7638337B2 (ja) Ｓセルを組み込んだコールドプレート
US12238906B2 (en) Power electronic device assemblies having heat spreaders and electrically insulating layer
JP7659025B2 (ja) パワーエレクトロニクスデバイスを組み込んだパワーエレクトロニクスアセンブリ
US12249554B2 (en) Power electronic device assemblies having an electrically insulating S-cell
US12207450B2 (en) Cold plates incorporating reactive multilayer systems and S-cells
JP7697082B2 (ja) パワーエレクトロニクスデバイスがフリップチップ内に組み込まれたパワーエレクトロニクスアセンブリ
US12096596B2 (en) Power electronics device assemblies including dual graphite layers and cold plates incorporating the same

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant