JP7594058B2 - 埋め込まれたパワーエレクトロニクスデバイスを有するパワーエレクトロニクスアセンブリ - Google Patents

埋め込まれたパワーエレクトロニクスデバイスを有するパワーエレクトロニクスアセンブリ Download PDF

Info

Publication number
JP7594058B2
JP7594058B2 JP2023120819A JP2023120819A JP7594058B2 JP 7594058 B2 JP7594058 B2 JP 7594058B2 JP 2023120819 A JP2023120819 A JP 2023120819A JP 2023120819 A JP2023120819 A JP 2023120819A JP 7594058 B2 JP7594058 B2 JP 7594058B2
Authority
JP
Japan
Prior art keywords
layer
power electronics
assembly
metal layer
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023120819A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024019075A5 (https=
JP2024019075A (ja
Inventor
チョウ フォン
紘嗣 請川
Original Assignee
トヨタ モーター エンジニアリング アンド マニュファクチャリング ノース アメリカ，インコーポレイティド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by トヨタ モーター エンジニアリング アンド マニュファクチャリング ノース アメリカ，インコーポレイティド filed Critical トヨタ モーター エンジニアリング アンド マニュファクチャリング ノース アメリカ，インコーポレイティド
Publication of JP2024019075A publication Critical patent/JP2024019075A/ja
Publication of JP2024019075A5 publication Critical patent/JP2024019075A5/ja
Application granted granted Critical
Publication of JP7594058B2 publication Critical patent/JP7594058B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
JP2023120819A 2022-07-27 2023-07-25 埋め込まれたパワーエレクトロニクスデバイスを有するパワーエレクトロニクスアセンブリ Active JP7594058B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/874,462 US12108563B2 (en) 2022-07-27 2022-07-27 Power electronics assemblies having embedded power electronics devices
US17/874,462 2022-07-27

Publications (3)

Publication Number Publication Date
JP2024019075A JP2024019075A (ja) 2024-02-08
JP2024019075A5 JP2024019075A5 (https=) 2024-08-28
JP7594058B2 true JP7594058B2 (ja) 2024-12-03

Family

ID=89626416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023120819A Active JP7594058B2 (ja) 2022-07-27 2023-07-25 埋め込まれたパワーエレクトロニクスデバイスを有するパワーエレクトロニクスアセンブリ

Country Status (3)

Country Link
US (1) US12108563B2 (https=)
JP (1) JP7594058B2 (https=)
CN (1) CN117476559B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12238906B2 (en) * 2023-01-17 2025-02-25 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronic device assemblies having heat spreaders and electrically insulating layer
US12249554B2 (en) * 2023-02-01 2025-03-11 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronic device assemblies having an electrically insulating S-cell
US12284792B2 (en) * 2023-02-23 2025-04-22 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics assemblies having power electronics devices embedded within a flip chip
DE102023111238A1 (de) * 2023-05-02 2024-11-07 Schaeffler Technologies AG & Co. KG Vorrichtung zur Kühlung mindestens eines Leistungshalbleiters eines Schaltungsträgers

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5100737A (en) 1989-11-16 1992-03-31 Le Carbone Lorraine Multi-layer material comprising flexible graphite which is reinforced mechanically, electrically and thermally by a metal and a process for the production thereof
US20080286602A1 (en) 2007-05-16 2008-11-20 Kabushiki Kaisha Toshiba Heat conductor
US20120152510A1 (en) 2010-12-16 2012-06-21 Nippon Soken, Inc. Bonding structure and bonding method of heat diffusion member, and cooling unit using the same
US20160209133A1 (en) 2013-12-27 2016-07-21 Huawei Technologies Co., Ltd. Thermally conductive composite sheet and method for making same
JP2018022792A (ja) 2016-08-04 2018-02-08 日産自動車株式会社 冷却装置
US20210210477A1 (en) 2019-10-31 2021-07-08 Ut-Battelle, Llc Power module with organic layers

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52135678A (en) * 1976-05-10 1977-11-12 Toshiba Corp Semiconductor device and its productions
US20080265403A1 (en) * 2004-12-29 2008-10-30 Metal Matrix Cast Composites, Llc Hybrid Metal Matrix Composite Packages with High Thermal Conductivity Inserts
US20090186195A1 (en) 2006-09-08 2009-07-23 Reactive Nanotechnologies, Inc. Reactive Multilayer Joining With Improved Metallization Techniques
US8081468B2 (en) 2009-06-17 2011-12-20 Laird Technologies, Inc. Memory modules including compliant multilayered thermally-conductive interface assemblies
CN201706427U (zh) 2010-05-13 2011-01-12 嘉兴市旷逸新光源科技有限公司 用于安装led灯的金属化陶瓷安装座
KR101049678B1 (ko) 2010-06-21 2011-07-14 주식회사 심텍 방열 인쇄회로기판 및 이를 제조하는 방법
CN202025797U (zh) 2011-03-16 2011-11-02 张申雄 一种用于大功率led发光二极管的复铜碳基石墨散热板
CN105744718A (zh) 2014-12-11 2016-07-06 深南电路有限公司 散热pcb及其加工方法
US10347601B1 (en) * 2018-01-29 2019-07-09 Toyota Motor Engineering & Manufacturing North America Power electronics assemblies with metal inverse opal bonding, electrical contact and cooling layers, and vehicles incorporating the same
US11690173B2 (en) * 2021-06-22 2023-06-27 Unimicron Technology Corp. Circuit board structure
KR102189945B1 (ko) 2019-01-09 2020-12-11 정성환 고방열 연성회로기판(gfpcb) 및 이의 제조 방법, 차량용 led 램프
CN209515738U (zh) 2019-04-10 2019-10-18 黄山学院 大功率GaN基LED的散热结构
TWI698969B (zh) * 2019-08-14 2020-07-11 朋程科技股份有限公司 功率元件封裝結構
TWI743557B (zh) 2019-09-05 2021-10-21 朋程科技股份有限公司 功率元件封裝結構
US11632860B2 (en) * 2019-10-25 2023-04-18 Infineon Technologies Ag Power electronic assembly and method of producing thereof
CN111302834B (zh) 2020-04-15 2020-10-23 湖南省美程陶瓷科技有限公司 一种微波磁控管绝缘陶瓷环
US11849539B2 (en) * 2020-08-13 2023-12-19 Toyota Motor Engineering & Manufacturing North America, Inc. Embedded cooling systems utilizing heat pipes
US11665813B2 (en) * 2020-08-14 2023-05-30 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics cooling assemblies and methods for making the same
AU2022323907B2 (en) * 2021-08-06 2024-12-19 Novocure Gmbh Electrode assembly for applying tumor treating fields (ttfields) with a sheet of anisotropic material
US11997838B2 (en) * 2022-02-01 2024-05-28 Toyota Motor Engineering & Manufacturing North America, Inc. Power device assemblies and methods of fabricating the same
US11910521B2 (en) * 2022-03-21 2024-02-20 Toyota Motor Engineering & Manufacturing North America, Inc. Power device assemblies having embedded PCBS and enhanced cooling and methods of fabricating the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5100737A (en) 1989-11-16 1992-03-31 Le Carbone Lorraine Multi-layer material comprising flexible graphite which is reinforced mechanically, electrically and thermally by a metal and a process for the production thereof
US20080286602A1 (en) 2007-05-16 2008-11-20 Kabushiki Kaisha Toshiba Heat conductor
US20120152510A1 (en) 2010-12-16 2012-06-21 Nippon Soken, Inc. Bonding structure and bonding method of heat diffusion member, and cooling unit using the same
US20160209133A1 (en) 2013-12-27 2016-07-21 Huawei Technologies Co., Ltd. Thermally conductive composite sheet and method for making same
JP2018022792A (ja) 2016-08-04 2018-02-08 日産自動車株式会社 冷却装置
US20210210477A1 (en) 2019-10-31 2021-07-08 Ut-Battelle, Llc Power module with organic layers

Also Published As

Publication number Publication date
US20240038624A1 (en) 2024-02-01
CN117476559B (zh) 2026-04-21
CN117476559A (zh) 2024-01-30
US12108563B2 (en) 2024-10-01
JP2024019075A (ja) 2024-02-08

Similar Documents

Publication Publication Date Title
JP7594058B2 (ja) 埋め込まれたパワーエレクトロニクスデバイスを有するパワーエレクトロニクスアセンブリ
US20070236883A1 (en) Electronics assembly having heat sink substrate disposed in cooling vessel
JP7749530B2 (ja) 埋め込みｐｃｂを有するパワーデバイスアセンブリ及びその製造方法
JP7592799B2 (ja) 電気絶縁層を有するパワーエレクトロニクスデバイスアセンブリ
JP7500792B2 (ja) パワーエレクトロニクスアセンブリ及びその製造方法
CN109994441A (zh) 具有增强的高功率密度的电子组件
JP7638337B2 (ja) Ｓセルを組み込んだコールドプレート
JP7659025B2 (ja) パワーエレクトロニクスデバイスを組み込んだパワーエレクトロニクスアセンブリ
US6057612A (en) Flat power pack
US12238906B2 (en) Power electronic device assemblies having heat spreaders and electrically insulating layer
US12249554B2 (en) Power electronic device assemblies having an electrically insulating S-cell
US12207450B2 (en) Cold plates incorporating reactive multilayer systems and S-cells
JP7697082B2 (ja) パワーエレクトロニクスデバイスがフリップチップ内に組み込まれたパワーエレクトロニクスアセンブリ
US12096596B2 (en) Power electronics device assemblies including dual graphite layers and cold plates incorporating the same

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231011

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240820

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240820

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20240820

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20241105

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20241121

R150 Certificate of patent or registration of utility model

Ref document number: 7594058

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350