CN117471137A - Probe card and test equipment - Google Patents

Probe card and test equipment Download PDF

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Publication number
CN117471137A
CN117471137A CN202210862131.5A CN202210862131A CN117471137A CN 117471137 A CN117471137 A CN 117471137A CN 202210862131 A CN202210862131 A CN 202210862131A CN 117471137 A CN117471137 A CN 117471137A
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CN
China
Prior art keywords
probes
isolation
test
probe
probe card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210862131.5A
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Chinese (zh)
Inventor
牛刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Manufacturing International Shanghai Corp
Semiconductor Manufacturing International Tianjin Corp
Original Assignee
Semiconductor Manufacturing International Shanghai Corp
Semiconductor Manufacturing International Tianjin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Manufacturing International Shanghai Corp, Semiconductor Manufacturing International Tianjin Corp filed Critical Semiconductor Manufacturing International Shanghai Corp
Priority to CN202210862131.5A priority Critical patent/CN117471137A/en
Publication of CN117471137A publication Critical patent/CN117471137A/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

A probe card and test equipment, the probe card includes: the test probes are used for being electrically connected with an object to be tested and loading signals for the object to be tested; and the isolation probes are positioned between the adjacent test probes and are used for realizing signal isolation of the test probes positioned at two sides of the isolation probes. The invention is beneficial to improving the test precision of the probe card.

Description

Probe card and test equipment
Technical Field
The embodiment of the invention relates to the field of semiconductor manufacturing, in particular to a probe card and test equipment.
Background
In the process of manufacturing semiconductors, before dicing the wafer into packaged chips, electrical performance testing is performed on the chips in the wafer, and defective chips in the wafer are marked, and then the marked chips are discarded before the subsequent packaging process. The testing link is of great importance, and can confirm the performance of the chip to screen the chip, thereby reducing the packaging cost. To ensure efficient testing of chip functionality and yield, the test equipment is required to have a detection accuracy that is always within the specification range within the manufacturing plant, so that periodic calibration of the instrumentation used in the manufacturing process is required.
Among them, a probe inspection apparatus is an inspection apparatus used for analyzing characteristics of devices on a wafer in the semiconductor field. The probe inspection apparatus includes a tester, a probe station, and a probe card (probecard). The tester is used for applying the signal and measuring the signal fed back. The main function of the probe station is to load and load the chip to be tested and accurately position the sample to be tested and the probes on the probe card. The probe card is an interface between a chip to be tested and the tester in the wafer test, when the test is performed, the probes on the probe card are directly contacted with the welding pads on the chip, chip signals are led out and fed back to the tester, the tester analyzes the signals fed back by the probe card, so that the electrical characteristics of the chip are known, and whether the wafer has defects in the manufacturing process is mastered.
Disclosure of Invention
The embodiment of the invention solves the problem of providing a probe card and test equipment, and improves the test precision of the probe card.
To solve the above problems, an embodiment of the present invention provides a probe card, including: the test probes are used for being electrically connected with an object to be tested and loading signals for the object to be tested; and the isolation probes are positioned between the adjacent test probes and are used for realizing signal isolation of the test probes positioned at two sides of the isolation probes.
Correspondingly, the embodiment of the invention also provides test equipment, which comprises the probe card provided by the embodiment of the invention.
Compared with the prior art, the technical scheme of the embodiment of the invention has the following advantages:
in the probe card provided by the embodiment of the invention, a plurality of isolation probes are positioned between adjacent test probes, and the isolation probes are used for realizing signal isolation of the test probes positioned at two sides of the isolation probes; the isolation probes are arranged between the adjacent test probes, so that electromagnetic noise generated between the adjacent test probes and electromagnetic noise generated in the working environment of the test probes are shielded in the working process of the probe card, the influence of the electromagnetic noise on the working performance of the test probes is reduced, the testing precision of the test probes is improved, and the testing precision of the probe card is further improved.
Drawings
FIG. 1 is a schematic diagram of a probe card;
fig. 2 to 3 are schematic structural views of a probe card according to an embodiment of the invention.
Detailed Description
As known from the background art, it is difficult to improve the test accuracy of the probe card.
Now, in combination with a probe card, the reason why it is difficult to improve the test accuracy of the probe card at present is analyzed.
Fig. 1 is a schematic diagram of a probe card.
The probe card includes: the plurality of test probes 20 are used for being electrically connected with the object to be tested and loading signals for the object to be tested; a gold finger 60 for loading a signal to the test probe 20; a substrate 50 for mounting the test probe 20 and the gold finger 60.
In the testing process, the adjacent test probes 20 easily generate electromagnetic noise, and the test probes 20 are also easily influenced by the electromagnetic noise in the working environment, so that the working performance of the test probes 20 is influenced, the testing precision of the test probes 20 is influenced, and the testing precision of the probe card is further influenced.
In order to solve the technical problem, the present invention provides a probe card, comprising: the test probes are used for being electrically connected with an object to be tested and loading signals for the object to be tested; and the isolation probes are positioned between the adjacent test probes and are used for realizing signal isolation of the test probes positioned at two sides of the isolation probes.
In the probe card provided by the embodiment of the invention, a plurality of isolation probes are positioned between adjacent test probes, and the isolation probes are used for realizing signal isolation of the test probes positioned at two sides of the isolation probes; the isolation probes are arranged between the adjacent test probes, so that electromagnetic noise generated between the adjacent test probes and electromagnetic noise generated in the working environment of the test probes are shielded in the working process of the probe card, the influence of the electromagnetic noise on the working performance of the test probes is reduced, the testing precision of the test probes is improved, and the testing precision of the probe card is further improved.
In order that the above objects, features and advantages of embodiments of the invention may be readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
Referring to fig. 2 and 3 in combination, a schematic diagram of a probe card according to the present invention is shown. Wherein fig. 3 is a partial enlarged circuit diagram of the test probe and the isolation probe of fig. 2.
The probe card includes: a plurality of test probes 200 (shown by dotted lines in fig. 2) for electrically connecting with the test object and loading signals to the test object; a plurality of isolation probes 100 (shown in solid lines in fig. 2) are positioned between adjacent test probes 200, and the isolation probes 100 are used to isolate signals of the test probes 200 positioned at both sides of the isolation probes 100.
Due to the rapid introduction of increasingly complex integrated circuits, materials and processes, it is almost impossible to meet the specification requirements for every chip in the existing silicon wafer manufacturing process, in order to correct the problems in the manufacturing process and to ensure that the defective chips are not sent to the customer, chip testing (CP) has been introduced in the integrated Circuit manufacturing process.
The probe card is a testing tool, mainly tests a chip, connects a tester and the chip, and tests chip parameters through transmission signals.
Specifically, the probe card is mainly used for wafer acceptance test (Wafer Acceptable Test, WAT) and reliability test, which means that after all processes are completed on a semiconductor, a test probe 200 is used to feed back test signals to a test structure of the wafer, and the feedback signals are analyzed, so that the electrical characteristics of the wafer are known, and whether defects occur in the wafer during the manufacturing process is mastered. The main purpose of the probe card is to directly contact the test probe 200 on the probe card with the bonding pad or bump on the chip to lead out the chip signal, and then to cooperate with the peripheral test instrument and software control to achieve the purpose of automatic measurement.
The test probe 200 is used for electrically connecting with an object to be tested and loading signals for the object to be tested.
Specifically, the test probe 200 inputs a current or voltage signal into a device under test (DUT, device Under Test), and feeds back a test signal of the device under test to an external tester for analysis. Wherein the Device Under Test (DUT) is the object under test.
In this embodiment, the test probes 200 include first test probes 210 and second test probes 220, the first test probes 210 are arranged in a first column along a first direction (as shown in an X direction in fig. 3), the second test probes 220 are arranged in a second column along the first direction, and the first column and the second column are arranged in parallel along a second direction (as shown in a Y direction in fig. 3), and the first direction is perpendicular to the second direction.
The first test probe 210 and the second test probe 220 can be used for testing in different working environments, and the first test probe 210 and the second test probe 220 are arranged regularly and are easy to install, and the first test probe 210 and the second test probe 220 are arranged in a row, so that in the testing process, the identification is easy, and the corresponding applicable test probe 200 is selected.
In this embodiment, the material of the test probe 200 comprises a rhenium tungsten alloy.
The isolation probe 100 is used to achieve signal isolation of the test probes 200 located on both sides of the isolation probe 100.
The isolation probes 100 are arranged between the adjacent test probes 200, so that electromagnetic noise generated between the adjacent test probes 200 and electromagnetic noise generated in the working environment of the test probes 200 can be shielded in the working process of the probe card, the influence of the electromagnetic noise on the working performance of the test probes 200 can be reduced, the test precision of the test probes 200 can be improved, and the test precision of the probe card can be improved.
In this embodiment, the isolation probe 100 is used for grounding.
The isolation probes 100 are grounded, so that electromagnetic crosstalk between adjacent test probes 200 can be conducted away through the isolation probes 100, thereby being beneficial to eliminating the electromagnetic crosstalk between the adjacent test probes 200 as much as possible, further reducing the influence of electromagnetic noise on the working performance of the test probes 200, improving the test precision of the test probes 200, and further improving the test precision of the probe card.
In other embodiments, the isolation probe may not be grounded.
In this embodiment, the isolation probe 100 includes a first isolation probe 110 and a second isolation probe 120, and the materials of the first isolation probe 110 and the second isolation probe 120 are different.
By adopting different materials to form the first isolation probe 110 and the second isolation probe 120, the first isolation probe 110 and the second isolation probe 120 can be respectively applied to different signal shielding environments, so that the first isolation probe 110 and the second isolation probe 120 can be respectively used for testing different working environments, the application range of the probe card can be enlarged, and the application degree of the probe card can be improved.
As an example, the first isolation probe 110 is used to isolate electromagnetic signals of high frequency, and the second isolation probe 120 is used to isolate electromagnetic signals of low frequency, so that the test probe 200 isolated by the first isolation probe 110 is used for high frequency testing, and the test probe 200 isolated by the second isolation probe 120 is used for low frequency testing, thereby improving the integration level of the probe card.
In other embodiments, the isolation probes may all be the same material.
In this embodiment, the material of the first isolation probe 110 includes a carbon doped metal material; the material of the second isolation probe 120 includes a nickel and phosphorous doped metallic material.
The carbon-doped metal material has a good shielding effect on high-frequency electromagnetic signals, and the nickel-doped and phosphorus-doped metal material has a good shielding effect on low-frequency electromagnetic signals, so that the material of the first isolation probe 110 is the carbon-doped metal material, and the material of the second isolation probe 120 is the nickel-doped and phosphorus-doped metal material.
Specifically, in the present embodiment, the material of the first isolation probe 110 includes carbon-doped iron; the material of the second isolation probe 120 includes nickel and phosphorous doped aluminum.
The carbon-doped iron has a good shielding effect on high-frequency electromagnetic signals, and the nickel-doped and phosphorus-doped aluminum has a good shielding effect on low-frequency electromagnetic signals.
Accordingly, in the present embodiment, the first isolation probes 110 are located between adjacent first test probes 210, and the second isolation probes 120 are located between adjacent second test probes 220.
The first isolation probes 110 are positioned between adjacent first test probes 210, the first isolation probes 110 are used for isolating electromagnetic signals of high frequency, the first test probes 110 are used for testing of high frequency, the second isolation probes 120 are positioned between adjacent second test probes 220, the second isolation probes 120 are used for isolating electromagnetic signals of low frequency, and the second test probes 220 are used for testing of low frequency.
It should be noted that, as shown in fig. 3, in order to further ensure shielding of electromagnetic noise around the test probes 200 and reduce the influence of electromagnetic noise on the test probes 200, the test probes 200 at the end portion may be disposed on the side of the isolation probes 100 facing away from the adjacent test probes 200, and thus the test probes 200 may be better wrapped therein, thereby ensuring the shielding effect.
In this embodiment, the probe card further includes: a mounting ring 300 for enclosing the test probe 200 and the isolation probe 100, the mounting ring 300 being electrically connected to the isolation probe 100 and electrically isolated from the test probe 200.
In the actual test process, the operator mounts the probe card to the machine by holding the mounting ring 300, and the mounting ring 300 also serves to dissipate heat during the high temperature test.
In this embodiment, the mounting ring 300 is electrically connected to the isolation probe 100 and electrically isolated from the test probe 200, so that the isolation probe 100 can be all at the same potential through the mounting ring 300.
In this embodiment, the mounting ring 300 is used for grounding.
The mounting ring 300 is electrically connected to the isolation probe 100, and the mounting ring 300 is grounded, thereby grounding both isolation probes 100.
In this embodiment, the probe card further includes: a plurality of connection points (not shown) are distributed on the outer circumference of the mounting ring 300 and are in one-to-one correspondence with the test probes 200 and the mounting ring 100.
The connection points are used for leading out the electrical property of the test probe 200 and the mounting ring 100, and the connection points are in one-to-one correspondence with the test probe 200 and the mounting ring 100, so that corresponding potentials can be loaded on the test probe 200 and the isolation probe 100 through the connection points.
In this embodiment, the connection point electrically connected to the test probe 200 is used as a first connection point, the first connection point is used to draw out the electrical property of the test probe 200, the connection point electrically connected to the mounting ring 300 is used as a second connection point, and the mounting ring 300 is grounded through the second connection point.
The test probe 200 is loaded with signals through the first connection point and the isolation probes 100 are all grounded through the second connection point.
In other embodiments, the isolation probes may not be electrically connected to the mounting ring, and the second connection point of the plurality of connection points may also correspond to all of the isolation probes, such that all of the isolation probes are grounded by grounding the second connection point.
In this embodiment, the probe card further includes: the plurality of golden fingers 600, the plurality of golden fingers 600 enclose a ring shape, enclose a plurality of tie points inside, and the quantity of golden fingers 600 is greater than or equal to the quantity of tie points.
The golden finger is used for being electrically connected with the test machine, corresponding potential is applied to the connection points, and the number of the golden fingers 600 is larger than or equal to that of the connection points, so that in the actual test process, each connection point can be applied to the test by the applied potential.
Specifically, in the present embodiment, the golden finger 600 includes a first golden finger (not labeled) for loading signals and a second golden finger (not labeled) for grounding, and the golden finger 600 is electrically connected to the external test machine.
The first gold finger is used for being electrically connected with a first connecting point through which signals are loaded to the test probe 200, and the second gold finger is used for being electrically connected with a second connecting point through which the isolation probe 100 is grounded.
In this embodiment, the probe card further includes: a plurality of metal wires (not shown) for electrically connecting the connection points with the corresponding gold fingers 600.
The plurality of metal wires can electrically connect the connection points with the corresponding golden fingers 600 in a wire-open mode, so that the circuit is flexible and changeable, visual and easy to operate.
In this embodiment, the probe card further includes: the circuit board 500 has circuit wiring therein, in the circuit board 500.
In this embodiment, the circuit board 500 is a printed circuit (Printed Circuit Board, PCB) board, and the PCB board is adopted to wire the circuit in the PCB board in advance, so as to improve the circuit integration level, and facilitate omitting the process of manually wire-laying in the testing process, so as to improve the testing efficiency.
In this embodiment, the test probe 200 and the isolation probe 100 are disposed on the circuit board 500, and the circuit board 500 electrically connects the connection points with the corresponding gold fingers through circuit wirings.
The circuit board 500 is used for electrically connecting the connection point with the corresponding golden finger, and is also used for fixing the test probe 200 and the isolation probe 100, and the circuit board 500 is used for electrically connecting the connection point with the corresponding golden finger, so that the workload of artificial wiring in the test process is reduced, the test efficiency is improved, and the structure of the probe card is more visual and neat in a hidden line mode, and the operation is easy during the test.
In this embodiment, the circuit board 500 includes at least two layers of sub-circuit boards, and the test probes 200 and the isolation probes 100 are electrically connected to the circuit wirings of the sub-circuit boards of different layers, respectively.
The test probe 200 needs to load signals through the circuit wiring, and the isolation probe 100 needs to be grounded through the circuit wiring, so that the test probe 200 and the isolation probe 100 are respectively electrically connected with the circuit wiring of the sub-circuit boards in different layers, mutual interference between the circuit wiring respectively electrically connected with the test probe 200 and the isolation probe 100 is reduced, the circuit structure is clear and easy to distinguish, and the probability of misoperation in the test process is reduced.
The embodiment of the invention also provides test equipment, which comprises the probe card provided by the embodiment of the invention.
As can be seen from the foregoing embodiments, in the probe card provided by the embodiments of the present invention, a plurality of isolation probes are located between adjacent test probes, and the isolation probes are used for implementing signal isolation of the test probes located at two sides of the isolation probes; the isolation probes are arranged between the adjacent test probes, electromagnetic noise generated between the adjacent test probes and electromagnetic noise generated in a working environment for shielding the test probes are facilitated in the working process of the probe card, so that the influence of the electromagnetic noise on the working performance of the test probes is reduced, the test precision of the test probes is improved, and the test precision of the probe card is further improved.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be assessed accordingly to that of the appended claims.

Claims (14)

1. A probe card, comprising:
the test probes are used for being electrically connected with an object to be tested and loading signals for the object to be tested;
and the isolation probes are positioned between the adjacent test probes and are used for realizing signal isolation of the test probes positioned at two sides of the isolation probes.
2. The probe card of claim 1, wherein the isolation probe is for grounding.
3. The probe card of claim 1, wherein the isolation probes comprise first isolation probes and second isolation probes, the first isolation probes and the second isolation probes being of different materials.
4. The probe card of claim 3, wherein the material of the first isolation probe comprises a carbon-doped metallic material; the material of the second isolation probe comprises a nickel and phosphorus doped metal material.
5. The probe card of claim 4, wherein the material of the first isolation probe comprises carbon-doped iron; the material of the second isolation probe comprises nickel and phosphorus doped aluminum.
6. The probe card of claim 3, wherein the test probes comprise first test probes and second test probes, the first test probes being arranged in a first column along a first direction, the second test probes being arranged in a second column along the first direction, the first column and the second column being arranged in parallel along a second direction, the first isolation probes being located between adjacent first test probes, the second isolation probes being located between adjacent second test probes, the first direction being perpendicular to the second direction.
7. The probe card of claim 1, wherein the probe card further comprises: and the mounting ring is used for enclosing the test probe and the isolation probe.
8. The probe card of claim 7, wherein the mounting ring is electrically connected to the isolation probes and electrically isolated from the test probes, the mounting ring being for grounding.
9. The probe card of claim 8, wherein the probe card further comprises: the plurality of connection points are distributed on the outer ring of the mounting ring and correspond to the test probes and the mounting ring one by one;
the connection point electrically connected with the test probe is used as a first connection point, the first connection point is used for leading out the electrical property of the test probe, the connection point electrically connected with the mounting ring is used as a second connection point, and the mounting ring is grounded through the second connection point.
10. The probe card of claim 9, wherein the probe card further comprises: the golden fingers are in an annular shape and enclose a plurality of connection points, and the number of the golden fingers is greater than or equal to the number of the connection points;
the golden finger comprises a first golden finger for loading signals and a second golden finger for grounding, and the golden finger is used for being electrically connected with an external test machine.
11. The probe card of claim 10, wherein the probe card further comprises: and the metal wires are used for electrically connecting the connecting points with the corresponding golden fingers.
12. The probe card of claim 10, wherein the probe card further comprises: a circuit board having a circuit wiring therein;
the test probes and the isolation probes are arranged on the circuit board, and the circuit board is used for electrically connecting the connection points with the corresponding golden fingers through the circuit wiring.
13. The probe card of claim 12, wherein the circuit board comprises at least two layers of sub-circuit boards, the test probes and the isolation probes being electrically connected to circuit wiring of the sub-circuit boards of different layers, respectively.
14. A test apparatus comprising a probe card according to any one of claims 1 to 13.
CN202210862131.5A 2022-07-20 2022-07-20 Probe card and test equipment Pending CN117471137A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210862131.5A CN117471137A (en) 2022-07-20 2022-07-20 Probe card and test equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210862131.5A CN117471137A (en) 2022-07-20 2022-07-20 Probe card and test equipment

Publications (1)

Publication Number Publication Date
CN117471137A true CN117471137A (en) 2024-01-30

Family

ID=89626180

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210862131.5A Pending CN117471137A (en) 2022-07-20 2022-07-20 Probe card and test equipment

Country Status (1)

Country Link
CN (1) CN117471137A (en)

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