CN117445036A - Groove processing tool and groove processing method - Google Patents

Abstract

The invention provides a groove processing tool, which can strip resin film in a mode that the resin film of thin skin is remained at the groove bottom, and can perform groove processing without stripping at the intersection point part when processing the strip grooves in the X-Y direction crossing each other. The tool comprises a tool body (1), wherein a tool edge forming part (2) is arranged at the lower part of the tool body (1), the tool edge forming part (2) comprises a front surface (2 a), left and right side surfaces (2 c, 2 d) and a bottom surface (2 e) which face the moving direction of the tool, and a blade part (3) which is formed at the lower edge part of the front surface (2 e), the blade part (3) is formed by a first blade surface (5) which is inclined obliquely upwards from the vicinity of the end edge of the bottom surface (2 e), an upward second blade surface (6) which is intersected with the first blade surface at an acute angle, and a sharp tool edge (7) which is formed by the first blade surface and the second blade surface, and the left and right side surfaces (3 a, 3 b) of the blade part (3) are formed in an inclined manner that the width is narrower as the blade part approaches the first blade surface which is the lower surface.

Description

Groove processing tool and groove processing method

Technical Field

The present invention relates to a groove processing tool and a groove processing method for forming a groove in a resin film laminated on a brittle material substrate, and more particularly, to a groove processing tool and a groove processing method using the groove processing tool suitable for processing a resin film in a vicinity of a predetermined cutting line to be removed in a band shape in advance when cutting a glass substrate or the like to which the resin film is attached.

Background

Conventionally, various devices are patterned on a brittle material substrate such as a glass substrate, and then a dicing bar is processed on the substrate by a substrate cutting tool such as a scribing wheel and the substrate is divided, whereby the devices are mass-produced.

In this device manufacturing process, as shown in fig. 7, predetermined cutting lines S1 and S2 in the X-Y direction intersecting each other are set on a large mother substrate W, and the substrates are cut along these cutting lines to be divided into square unit substrates W1 each constituting each device.

Various devices are manufactured by the above-described manufacturing process, but there are devices in which a functional resin film is laminated on the surface of a substrate, such as a fingerprint sensor.

In the glass substrate on which the resin film is laminated, since the difference in physical properties between the resin film and the glass is large, it is difficult to process the glass substrate and the resin film simultaneously by using a scoring wheel that forms a bead on the glass substrate. Therefore, after the resin film is peeled in a band shape along a predetermined cutting line by a groove processing tool for processing a groove in the resin film, a dicing bar is cut on the substrate by a dicing wheel or the like from the front surface of the glass substrate or the back surface of the glass substrate (without the resin film) exposed to the groove bottom to be peeled, and finally the substrate is cut along the predetermined cutting line by bending the substrate or the like.

For example, patent documents 1 and 2 disclose conventional examples of groove processing tools capable of processing grooves in a resin film.

The peeling cutter (groove processing tool) disclosed in patent document 1 is a peeling cutter having a cutting edge such as a carving knife that can be used when cutting a polarizing plate of a liquid crystal panel, and includes a cutting edge portion having a sharp cutting edge of a predetermined width. In addition to the approximately V-shaped cross-section (fig. 1), the cross-section of the edge is formed in various edge shapes (fig. 32) such as a shape, a stepped shape, a semicircular shape, and a circular shape in order to widen the peeling width, and when the polarizing plate is cut, the resin film is peeled off and removed in the cross-section of the edge (fig. 2, etc.) like a carving knife by forming a relief angle in the entire edge tip region, bringing only the edge tip into line contact with the glass surface, and moving the edge while pressing the edge.

The peeling tool is used for cutting, peeling, and removing a film (including a film such as a polarizing plate, a resin film, and a protective film) on a glass substrate to completely expose the surface of the glass substrate. Therefore, the edge tip of the peeling cutter is brought into contact with the glass surface of the glass substrate, and the tip edge is moved while pressing the glass substrate.

However, since the peeling cutter moves in line with the glass surface only at the tip of the sharp edge in the advancing direction like a graver, the edge always acts in the downward biting direction, and when the edge is strongly contacted with the glass surface, the substrate is easily damaged. Further, since only the narrow line contact surface of the edge tip is in contact with the substrate, it is difficult to adjust the pressure applied to the narrow contact surface, and it is difficult to control the pressing force so that the edge is not in strong contact with the glass surface.

When the contact with the edge of the peeling cutter causes damage to the glass surface, cracks are generated in a direction different from the predetermined cutting line when bending and cutting the glass substrate in the subsequent process, which is a main cause of occurrence of defective products. Further, there is a possibility that a flaw such as a cutting defect is generated on the cut end face, and a high-quality product cannot be obtained.

Further, depending on the device, there are cases where the edge is not allowed to directly contact the glass substrate from various viewpoints such as device structure, function, performance, yield, and the like.

For example, in a fingerprint sensor device, when a part of a functional resin film is peeled off by a groove processing tool, the groove processing tool is not preferably in contact with the surface of a substrate, and therefore, in order to reliably prevent the edge of the groove processing tool from contacting the surface of glass, it is necessary to peel off the functional resin film in a state where a thin skin remains slightly at the groove bottom, for example, in a state where a thin skin of 10 to 15 μm remains when the thickness of the resin film is 50 μm, and therefore, a groove processing tool suitable for the groove processing as described above is required.

In this regard, patent document 2 describes that the peeling tool (groove processing tool) has vertical left and right side walls, a rectangular bottom surface sandwiched between the left and right side walls, and a rake surface obliquely rising from the bottom surface, the bottom surface and the rake surface are blade surfaces, edges of the blade surfaces are blade edges, and the resin film can be peeled at a constant groove width by moving the blade edges while the bottom surface is in a posture of being in parallel ground contact with the main surface (resin film surface) of the substrate.

According to this peeling tool, the bottom surface serves as a suppression surface for the main surface (resin film surface) to suppress biting of the blade edge (edge), and the groove can be machined by scooping up the resin portion peeled off by the blade edge. Therefore, according to the peeling tool, the thin skin of the resin film can be peeled off while remaining on the surface of the substrate so that the edge does not come into contact with the surface of the glass substrate.

Patent document 1: japanese patent laid-open No. 2008-116969

Patent document 2: japanese patent application laid-open No. 2015-229259

However, when grooves in the X-Y directions perpendicular to each other are processed by the peeling tool described in patent document 2, film peeling of the resin film may occur at specific portions of the intersections. That is, as shown in fig. 8, when the groove V2 in the Y direction is processed in the groove that is initially processed, for example, the groove V1 in the X direction, film separation (black-coated portion in the drawing) may occur at the corner of the unit substrate W1 that is the product on the front side (tool exit side) in the tool advancing direction at the intersection portion with the groove V1. When such film peeling occurs, not only the quality of the cut unit substrate W1 is reduced, but also in the case where the resin film is a functional film such as a fingerprint sensor, the film peeling may have a large influence on the device performance.

Disclosure of Invention

In view of the above, an object of the present invention is to provide a groove processing tool and a groove processing method capable of performing groove processing with a predetermined groove width and with high accuracy without causing film peeling along predetermined cutting lines intersecting each other.

Another object of the present invention is to provide a groove processing tool and a groove processing method that can peel off a resin film relatively stably in a state where a small amount of thin skin of the resin film remains at the groove bottom, so that the edge of the groove processing tool does not directly contact the substrate surface.

In order to solve the above problems, it is thought that the following problems occur as a result of examining the cause of the film peeling problem at the intersection point. That is, when the grooves are machined by the stripping tool of patent document 2, since the left and right wall surfaces of the tool are perpendicular, the left and right side surfaces of the groove V thus formed are also perpendicular surfaces as shown in fig. 6 (b). Therefore, when a groove in any one direction is machined by using the tool, for example, after a groove V1 in the X direction is machined, a groove V2 in the Y direction orthogonal to the groove V1 is machined, the tool tip advances while being cut by abutting against the vertical wall surface of the groove V1 at the intersection point with the groove V1 machined first. At this time, since the cross-sectional area of the tool as seen in the advancing direction of the blade edge is relatively large, and the left and right wall surfaces of the tool are also in vertical contact with the vertical wall surfaces of the groove, when the tool is cut and advanced, the resin film at the corner of the unit substrate, which is the product, is peeled off by being scooped up by the vertical wall surfaces of the tool while receiving a large resistance from the wall surfaces of the groove, and film peeling occurs at the intersection.

Therefore, in order to achieve the above object, the present invention discloses the following technical solutions. That is, the groove working tool of the present invention includes a tool body having a cutting edge forming portion at a lower portion thereof, the cutting edge forming portion including a front surface facing a tool moving direction, left and right side surfaces, a bottom surface, and a blade portion formed at a lower edge portion of the front surface, the blade portion being formed of a first blade surface inclined obliquely upward from a vicinity of an end edge of the bottom surface, an upward second blade surface intersecting the first blade surface at an acute angle, and a sharp cutting edge formed of the first blade surface and the second blade surface, the left and right side surfaces of the blade portion being formed so as to be narrower in width as approaching the first blade surface serving as a lower surface.

Here, the inclination angle of the first blade surface with respect to the bottom surface of the edge forming portion may be formed within a range of 1 to 30 degrees.

Preferably, the angle of the cutting edge formed by the first blade surface and the second blade surface is in the range of 30 to 85 degrees.

Further, it is preferable that the length L of the first blade surface is formed in a range of 10 to 200 μm.

The inclination angle of the left and right side surfaces of the blade portion with respect to the first blade surface is in the range of 40 to 60 degrees.

According to the present invention, the left and right side surfaces of the blade portion are inclined so as to be narrower as they come closer to the lower side, and therefore the left and right side walls of the processed groove are inclined so as to be upwardly expanded. When a groove perpendicular to the groove to be machined first is machined, the tool edge abuts against the inclined side wall of the groove to be machined first at the intersection point and is cut and advanced. In this case, since the side wall portion of the groove is inclined except for the small cross-sectional area seen from the advancing direction of the blade edge, the resistance of the blade portion from the side wall of the groove is significantly reduced compared to the case of cutting the vertical side wall surface in the prior art. Further, since the inclined left and right side surfaces of the blade portion are formed in a shape to press the film surface, film peeling can be prevented from occurring at the front side in the tool advancing direction at the intersection portion, and a high-quality product can be obtained.

In the present invention, when the groove is machined, the left and right side surfaces of the blade portion are inclined so as to be narrower as they come closer to the lower side, so that the blade edge is likely to cut into the resin film. On the other hand, the second blade surface on the upper surface side of the blade portion serves as a rake surface, whereby the peeled portion is easily lifted upward and released, and the first blade surface on the lower surface side serves as a pressing surface in surface contact with the workpiece surface in parallel with the workpiece surface, whereby excessive biting of the cutting edge can be suppressed. Accordingly, the positional accuracy and the pressing force of the tool with respect to the substrate can be stabilized, fine adjustment can be facilitated, a highly accurate groove can be formed while leaving a thin skin at the bottom of the groove, and breakage of the glass plate surface due to the edge can be prevented.

Drawings

Fig. 1 is a perspective view showing a groove working tool according to an embodiment of the present invention.

Fig. 2 is an enlarged view of the blade portion of the groove processing tool.

Fig. 3 is a side view showing a posture when the groove processing tool is used.

Fig. 4 is an enlarged side view of the blade portion when the groove processing tool is used.

Fig. 5 is a schematic front view showing an example of a scribing apparatus to which a groove processing tool is attached.

Fig. 6 (a) is a cross-sectional view of a groove machined by the groove machining tool of the present invention, and fig. 6 (b) is a cross-sectional view of a groove machined by a conventional groove machining tool.

Fig. 7 is a plan view for explaining a cutting process of a glass substrate.

Fig. 8 is a plan view for explaining a film peeling phenomenon occurring at an intersection.

Description of the reference numerals

A: groove processing tool

B: scribing device

W: substrate board

1: tool body

2: knife edge forming part

2a: front surface

2b: rear surface

2c, 2d: left and right side surfaces

2e: bottom surface

3: blade part

5: a first blade surface

6: a second blade face

7: knife tip

20: brittle material substrate

21: resin film

Detailed Description

The present invention will be described in detail below with reference to the drawings.

Fig. 1 is a perspective view showing an embodiment of the groove working tool of the present invention, and fig. 2 is an enlarged view of the blade portion. The groove processing tool a is composed of a plate-like body 1 and a cutting edge forming portion 2, wherein the plate-like body 1 is a mounting portion of a scribing head 17 mounted on a scribing device B shown in fig. 5, and the cutting edge forming portion 2 is integrally formed at a lower end portion of the plate-like body 1. The edge forming portion 2 is formed of a front surface 2a, a rear surface 2b, left and right side surfaces 2c, 2d, and a bottom surface 2e, which face the tool moving direction, and is made of a hard material such as cemented carbide or sintered diamond. The edge portion 3 is formed at either one of the front surface side and the rear surface side of the edge forming portion 2 or both of them, the edge portion 3 is formed. In the present embodiment, the blade 3 is provided at a lower edge portion of the front surface 2a that is the tip side in the tool advancing direction.

As shown in the enlarged view of fig. 2, the blade 3 is formed of a first blade surface 5 inclined obliquely upward from the vicinity of the edge of the bottom surface 2e of the blade edge forming portion 2, a second blade surface 6 intersecting the first blade surface 5 at an acute angle, and a sharp blade edge 7 formed by these first and second blade surfaces 5, 6.

The inclination angle α1 of the first blade surface 5 with respect to the bottom surface 2e of the edge forming portion 2 is set to be in the range of 1 to 30 degrees, and 10 degrees in this embodiment. The angle of inclination α1 is formed to distinguish the bottom surface 2e from the first facet 5. In this way, the first blade surface 5 is caused to function as a contact surface with the substrate surface at the time of use described later, and this is to function as a stable pressing surface for suppressing biting of the blade edge, and to prevent the contact area from exceeding the required value. The length L of the first blade surface 5 is in the range of 10 to 200 μm, preferably 50 to 100 μm.

The angle α2 of the blade 3 formed by the first blade surface 5 and the second blade surface 6 is set to be in the range of 30 to 85 degrees, and is more preferably formed at an angle of approximately 60 degrees in view of the balance between strength and sharpness.

Further, as shown in fig. 2 (b), the left and right side surfaces 3a, 3b of the blade 3 are formed so as to be inclined closer to the first blade surface 5, which is a contact surface with the substrate, and so as to be narrower in width. The inclination angle α3 of the first blade surface 5 is set in the range of 40 to 60 degrees, and more preferably in the range of 50 to 55 degrees. The width of the bottom of the blade 3, that is, the width D of the first blade surface 5 is set to be in the range of 0 to 70 μm, preferably 30 to 60 μm, and more preferably 40 μm. Although the smaller the width D of the first blade surface 5, the more easily the resin film is cut into, setting to 30 μm or more makes it easier to suppress excessive biting of the blade edge 7, and also makes it difficult to break and abrade the brittle material substrate even when the brittle material substrate is in contact therewith. When the width D of the first facet 5 exceeds 70 μm, it is difficult to set the inclination angle α3 to an appropriate angle.

The body 1 of the groove processing tool a is not limited to a plate shape, and may be formed in a columnar shape or a polygonal columnar shape.

Fig. 5 is a view showing an example of a scribing apparatus for machining grooves in a substrate W, to which a groove machining tool a is attached. The scribing device B includes a stage 10 on which the substrate W is placed and which holds the suction level. The suction table 10 is formed to be movable in the front-rear direction in the drawing along a horizontal guide rail 11, and is driven by a screw shaft 12 rotated by a motor (not shown). The suction table 10 is rotatable in a horizontal plane by a rotation driving unit 13 incorporating a motor. In addition, a bridge 15 having a cross beam 14 is provided so as to straddle the suction table 10, and a horizontally extending guide 16 is provided on the cross beam 14. The scribing head 17 is provided on the guide 16 so as to be movable by a moving mechanism (not shown) using a motor 18 as a driving source. The groove working tool a is mounted to the scoring head 17 by a tool holder 19. The vertical height of the tool holder 19 can be adjusted with accuracy in micrometers by a lifting mechanism with a biasing mechanism, not shown, and is assembled so that the groove processing tool a presses the resin film with a constant pressure.

When a groove is formed in the substrate W by the groove processing tool a, as shown in fig. 3 and 4, the groove processing tool a is attached to the scribing head 17 of the scribing device B in a state in which the edge portion 7 is oriented in the moving direction of the arrow, and in a state in which the first blade surface 5 of the blade portion 3 is in contact with the surface of the substrate W, that is, in a state in which the groove processing tool a is inclined to the moving direction side by the inclination angle α1 of only the first blade surface 5. Thereafter, the first blade surface 5 of the groove processing tool a is pressed against the main surface (resin film surface) of the substrate W to adjust the height of the first blade surface 5 so that the resin film can be peeled at a desired thickness. At this time, the first blade surface 5 is set at a position which is located inside the resin film and is separated from the substrate surface of the brittle material substrate by 10 to 15 μm. Thereafter, the grooves V1 and V2 in the X-Y direction are formed by relatively moving the groove processing tool a with respect to the table 10 and peeling the resin film having a predetermined groove width along a predetermined cutting line.

In processing the grooves V1 and V2, the left and right side surfaces of the blade portion are inclined so as to have a narrower width as they approach the lower side, so that the blade edge is likely to cut into the resin film. On the other hand, the second blade surface 6 present on the upper surface side of the blade portion 3 serves as a rake surface capable of scooping up and releasing the peeled portion upward as shown in the drawing, and the first blade surface 5 on the lower surface side serves as a pressing surface that contacts the surface of the workpiece surface, so that excessive biting of the cutting edge 7 can be suppressed. This facilitates fine adjustment of the positional accuracy and pressing force of the tool a with respect to the substrate, and enables a highly accurate groove to be machined with the pellicle 23 remaining at the bottom of the groove as shown in fig. 6 (a). This can reliably eliminate the problem that the brittle material substrate surface of the substrate is broken by the cutting edge. In addition, the first blade surface 5 is brought into contact with the surface to be processed to become a pressing surface, so that the edge becomes stable, and a groove having a thin skin portion of 10 to 15 μm thickness remaining can be stably processed on a resin film of 50 μm thickness.

Since the left and right side surfaces 3a, 3b of the blade 3 are inclined so as to be narrower as they approach the first blade surface 5 on the lower surface, the processed groove V' has a shape in which the upper portion thereof is expanded as shown in fig. 6 (a), and the left and right side walls 22 of the groove are inclined so as to be farther from each other as they approach the upper end. Therefore, when machining a groove intersecting with a groove machined in advance, the tool nose abuts against the inclined side wall of the groove machined first at the intersection point and cuts it forward. At this time, since the side wall portion of the groove is inclined in addition to the smaller cross-sectional area seen from the advancing direction of the blade portion, the resistance that the blade portion receives from the side wall of the groove is greatly reduced compared with the resistance that is received when the vertical side wall surface is cut off in the conventional case. Further, since the inclined left and right side surfaces of the blade portion are shaped to press the film surface, film peeling does not occur at the corner of the unit substrate that becomes the product, at the front side in the tool advancing direction at the intersection point portion.

While the present invention has been described with reference to the exemplary embodiments, the present invention is not necessarily limited to the above embodiments, and modifications and changes may be made thereto as appropriate without departing from the scope of the claims.

For example, in the above embodiment, the example in which the blade 3 is provided at the lower edge of the front surface of the edge forming portion 2 has been shown, but the blade 3 may be formed on both front and rear sides. Thus, if one of the cutting edges is worn or broken, the other cutting edge can be used as a new product by changing the installation direction of the groove working tool.

In the above embodiment, the resin film was peeled so that the thin skin of 10 to 15 μm remained, but the resin film may be peeled so that the thin skin hardly remained by conforming the first blade surface 5 to the surface of the brittle material substrate. Even in this case, since the first blade surface 5 is still oriented in a direction parallel to the surface of the brittle material substrate, the cutting edge 7 is less likely to bite into the brittle material substrate, and the X-Y grooves intersecting each other can be machined while preventing the substrate from being damaged by the cutting edge 7.

In the above embodiment, the groove processing of the functional resin film such as the fingerprint sensor has been described, but the present invention is not limited to this, and the present invention is applicable to a resin film laminated for protecting the surface of a substrate.

Possibility of industrial use

The present invention can be used when a ribbon-shaped groove is processed in advance along a predetermined cutting line when cutting a brittle material substrate such as a glass substrate having a resin film attached to a surface thereof.

Claims (7)

1. A groove processing tool, wherein,

comprises a tool body with a tool tip forming part at the lower part,

the nose forming part includes: a front surface facing the moving direction of the tool, left and right side surfaces, a bottom surface, and a blade portion formed at a lower edge portion of the front surface,

the blade part is formed by a first blade surface inclined obliquely upwards from the vicinity of the end edge of the bottom surface, an upward second blade surface intersecting the first blade surface at an acute angle, and a knife tip formed by the first blade surface and the second blade surface,

the left and right side surfaces of the blade portion are formed obliquely so that the width becomes narrower as they approach the first blade surface serving as the lower surface.

2. The groove working tool of claim 1 wherein,

the first blade surface is formed at an inclination angle in a range of 1 to 30 degrees with respect to the bottom surface of the blade edge forming portion.

3. The groove working tool of claim 1 wherein,

the angle of the cutting edge formed by the first cutting edge surface and the second cutting edge surface is in the range of 30-85 degrees.

4. The groove working tool of claim 1 wherein,

the length of the first facet is formed in the range of 10 to 200 μm.

5. The groove working tool of claim 1 wherein,

the inclination angle of the left and right side surfaces of the blade portion with respect to the first blade surface is formed in a range of 40 to 60 degrees.

6. A groove processing method for processing a resin film laminated on a brittle material substrate into a band-shaped groove in a first direction and a second direction crossing each other, wherein,

the groove processing method uses a groove processing tool,

the groove working tool includes a tool body having a nose forming portion at a lower portion,

the nose forming part includes: a front surface facing the moving direction of the tool, left and right side surfaces, a bottom surface, and a blade portion formed at a lower edge portion of the front surface,

the blade part is formed by a first blade surface inclined obliquely upwards from the vicinity of the end edge of the bottom surface, an upward second blade surface intersecting the first blade surface at an acute angle, and a knife tip formed by the first blade surface and the second blade surface,

the left and right side surfaces of the blade portion are formed obliquely so as to be narrower in width as they approach the first blade surface serving as the lower surface,

in the groove processing method, the first blade surface is brought into contact with the resin film surface and moved in the first direction to process a groove, and then moved in the second direction to process a groove.

7. The groove processing method according to claim 6, wherein,

the first blade surface is set at a position located inside the resin film and separated from the substrate surface of the brittle material substrate by 10 to 15 μm, and groove processing is performed by moving in the first direction and the second direction.