CN117396572A

CN117396572A - Laminated film

Info

Publication number: CN117396572A
Application number: CN202280038843.3A
Authority: CN
Inventors: 越智元气; 冲田奈津子; 野吕弘司
Original assignee: Nitto Denko Corp
Current assignee: Nitto Denko Corp
Priority date: 2021-05-31
Filing date: 2022-05-24
Publication date: 2024-01-12
Also published as: TW202313332A; JP2022183682A; KR20240017845A; WO2022255165A1

Abstract

The invention provides a laminated film capable of improving the operation efficiency in the manufacturing process of a semiconductor device. The laminated film of the present invention is a laminated film obtained by laminating a first separator, a first adhesive layer, a base material, a second adhesive layer, and a second separator in this order, wherein the first adhesive layer contains a low-adhesion adhesive layer, the second adhesive layer contains a releasable adhesive layer, and F (1), F (2), P (2), and P' (2) satisfy the following formula: f (2) is less than or equal to F (1), P (2) is more than or equal to F (1), P ' (2)/P (2) is less than 1.20, P ' (2) is less than 1.00, F (1) is the peeling force of the first spacer to 180 DEG peeling of the first adhesive layer, F (2) is the peeling force of the second spacer to 180 DEG peeling of the second adhesive layer, P (2) is the adhesive force of the second adhesive layer to 180 DEG peeling of the glass plate, and P ' (2) is the adhesive force of the second adhesive layer to 180 DEG peeling of the glass plate (N/50 mm) after 5 minutes at 160 ℃. In the "F (1). Ltoreq.F (2)" of claim 1, the description of paragraphs 0009, 0015, 0018 to 0022, examples and claim 2 shows that "F (2). Ltoreq.F (1)" is a mistake, and therefore, the "F (2). Ltoreq.F (1)" is replaced with "F (2). Ltoreq.F (1)" and then examined.

Description

Laminated film

Technical Field

The present invention relates to a laminated film.

Background

In the manufacturing process of a semiconductor device, a semiconductor wafer is generally diced while being temporarily fixed to a dicing tape, and the diced semiconductor chips are pressed from the dicing tape side on the back surface of the wafer by a pin member, picked up by a suction jig called a collet, and mounted on a mounting substrate such as a circuit board (for example, patent document 1).

Prior art literature

Patent literature

Patent document 1: japanese patent application laid-open No. 2019-9203

Disclosure of Invention

Problems to be solved by the invention

However, as the micromachining technology advances, miniaturization and thinning of semiconductor chips are advancing, and the semiconductor chips are easily damaged when picked up by a collet. Further, miniaturization and multilayering of semiconductor devices are advancing, and there is also a demand for a method of densely multilayering a plurality of fine semiconductor chips on a mounting substrate, picking up the chips by a collet, and individually mounting the chips with a lower efficiency.

As a method for solving such damage and poor mounting efficiency of the semiconductor chip, for example, the following method can be considered: the plurality of electronic components, which are made into a single piece by dicing, are received on a transfer double-sided adhesive film temporarily fixed on a carrier substrate, and then transferred onto a mounting substrate at one time.

However, in such a method, in the laminated film in which both sides of the transfer double-sided adhesive film are protected by the spacers, there is a problem that an error occurs in the peeling treatment of the surface protective film (spacer) on the adhesive surface, or a warpage occurs from the carrier substrate when the surface protective film (spacer) is peeled off after being attached to the carrier substrate, or the transfer double-sided adhesive film is difficult to peel off from the carrier substrate at the time of recycling, or a problem that the working efficiency is lowered such as a tacky residue occurs.

The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a laminated film which is free from errors in separation processing of a spacer temporarily fixed to a carrier substrate and receiving a semiconductor chip or the like, is free from separation from the carrier substrate when the semiconductor chip or the like is transferred to a mounting substrate, is free from separation from the carrier substrate when the semiconductor chip or the like is separated from the mounting substrate after the semiconductor chip or the like is transferred to the mounting substrate, and is free from contamination such as adhesive residue, and is excellent in reworkability.

Means for solving the problems

As a result of intensive studies to achieve the above object, the present inventors have found that, when a laminated film having a surface protective film (first spacer), a first adhesive layer for temporarily fixing a fine electronic component such as a semiconductor chip, a base material, a second adhesive layer for temporarily fixing a carrier substrate, and a surface protective film (second spacer), the peeling force F (1) of the first spacer to the first adhesive layer, the peeling force F (2) of the second spacer to the second adhesive layer, the adhesive force P (2) of the second adhesive layer to a glass plate, and the adhesive force P' (2) of the second adhesive layer to the glass plate after 5 minutes at 160 ℃) satisfy a specific relationship is used, an error in peeling of the spacer when the laminated film is adhered to the carrier substrate and the electronic component is temporarily fixed, the peeling is not generated from the carrier substrate when the electronic component is transferred to the mounting substrate, and the adhesive residue is easily peeled off from the carrier substrate after the electronic component is transferred to the mounting substrate. The present invention has been completed based on these findings.

That is, the present invention provides a laminated film obtained by laminating a first separator, a first adhesive layer, a base material, a second adhesive layer, and a second separator in this order, the first adhesive layer including a low-adhesion adhesive layer, the second adhesive layer including a releasable adhesive layer, F (1), F (2), P (2), and P' (2) satisfying the relationship of the following formula:

F(2)≤F(1)、

P(2)≥F(1)、

P’(2)/P(2)＜1.20、

P’(2)＜1.00，

f (1) is a peel force (N/50 mm) of 180 DEG peeling of the first separator to the first adhesive layer measured under the conditions of 23 ℃, 50% R.H. and a peel speed of 0.3 m/min, F (2) is a peel force (N/50 mm) of 180 DEG peeling of the second separator to the second adhesive layer measured under the conditions of 23 ℃, 50% R.H. and a peel speed of 0.3 m/min, P (2) is an adhesive force (N/50 mm) of 180 DEG peeling of the second adhesive layer to a glass plate measured under the conditions of 23 ℃, 50% R.H. and a pull speed of 0.3 m/min, P' (2) is an adhesive force (N/50 mm) of 180 DEG peeling of the second adhesive layer to a glass plate measured under the conditions of 160 ℃ for 5 minutes and then 23 ℃, 50% R.H. and a pull speed of 0.3 m/min.

The above laminated film preferably also satisfies the relationship of the following formula.

F(2)/F(1)＜0.80

P(2)/F(1)＞1.00

The laminated film preferably satisfies the following relationship between T (1), T (2) and the adhesive force P (2):

T(1)/T(2)＞1.05、

P(2)/T(1)＜1.00，

t (1) is the 90℃initial peel force (N/50 mm) of the first adhesive layer to the first separator measured at 23℃at 50% R.H. and a pull rate of 0.3 m/min, and T (2) is the 90℃initial peel force (N/50 mm) of the second adhesive layer to the second separator measured at 23℃at 50% R.H. and a pull rate of 0.3 m/min.

Effects of the invention

The laminated film of the present invention is free from errors in peeling off the spacer when temporarily fixing the laminated film to the carrier substrate and receiving the semiconductor chip or the like, is free from peeling off the carrier substrate when transferring the semiconductor chip or the like to the mounting substrate, and is capable of peeling off the semiconductor chip or the like from the carrier substrate after transferring the semiconductor chip or the like to the mounting substrate without causing contamination such as adhesive residue, and is excellent in reworkability, and therefore, can improve the work efficiency in the manufacturing process of the semiconductor device.

Drawings

Fig. 1 is a schematic cross-sectional view showing an embodiment of a laminated film of the present invention.

Fig. 2 is a schematic cross-sectional view showing an embodiment of a first step in a mounting method for mounting an electronic component on a mounting substrate using the laminated film shown in fig. 1.

Fig. 3 is a schematic cross-sectional view showing an embodiment of a second step in a mounting method of an electronic component onto a mounting substrate using the laminated film shown in fig. 1.

Fig. 4 is a schematic sectional view showing a process from temporary fixation of the laminated film of the present invention to the carrier substrate until peeling.

Detailed Description

[ laminated film ]

The laminated film of the present invention has a laminated structure obtained by laminating a first separator, a first adhesive layer, a base material, a second adhesive layer, and a second separator in this order. That is, the laminated film of the present invention has a laminated structure in which the adhesive surface of the transfer double-sided adhesive film (the adhesive surface of the first adhesive layer and the second adhesive layer) including the first adhesive layer, the base material, and the second adhesive layer is protected by the first separator and the second separator.

The first adhesive layer includes a low-adhesion adhesive layer, the second adhesive layer includes a releasable adhesive layer, and F (1), F (2), P (2), and P' (2) satisfy the following relationship:

F(2)≤F(1)、

P(2)≥F(1)、

P’(2)/P(2)＜1.20、

P’(2)＜1.00，

f (1) is a peel force (N/50 mm) of 180 DEG peel of the first separator from the first adhesive layer measured at 23 ℃ under 50% R.H. and a peel speed of 0.3 m/min,

F (2) is a peel force (N/50 mm) of 180 DEG peel of the second separator from the second adhesive layer measured at 23 ℃ under 50% R.H. and a peel speed of 0.3 m/min,

p (2) is the adhesion (N/50 mm) of the second adhesive layer to 180℃peeling of the glass plate measured at 23℃under 50% R.H. and a pulling speed of 0.3 m/min,

p' (2) is the adhesive force (N/50 mm) of the second adhesive layer to 180℃peeling of the glass plate measured under conditions of 160℃for 5 minutes, 23℃and 50% R.H. and a pulling speed of 0.3 m/min.

Hereinafter, an embodiment of the laminated film of the present invention will be described with reference to the drawings, but the laminated film of the present invention is not limited to this embodiment.

In fig. 4 a, the second separator 120 is peeled from the adhesive layer 12 of the laminated film 1 adsorbed on an adsorption stage (not shown). At this time, no warpage occurs at the interface of the first spacer 110 and the first adhesive layer 11. Thereafter, the adhesive surface of the second adhesive layer 12 is bonded to the carrier substrate 22 (not shown).

In fig. 4 (b), the first separator 110 is peeled from the adhesive layer 11. At this time, no warpage occurs at the interface of the second adhesive layer 22.

In fig. 4 (c), the step of receiving the electronic component 21 after dicing in fig. 2 by the first adhesive layer 11 and the step of transferring the electronic component 21 received in the first adhesive layer 11 onto the mounting substrate 30 in fig. 3 are performed using a double-sided adhesive sheet temporarily fixed to the carrier substrate 22 by the second adhesive layer 12.

In fig. 4 d, the second adhesive layer 12 is peeled off (not shown) from the carrier substrate 22. The second adhesive layer 12 exhibits such excellent reworkability that it can be peeled off without contamination such as paste residue, and thus the carrier substrate 22 can be easily reused.

In the laminated film of the present invention, F (2). Ltoreq.F (1) makes it possible to prevent the first separator from being peeled off from the first adhesive layer when the second separator is peeled off from the second adhesive layer.

Here, F (2)/F (1) (the ratio of F (2) to F (1)) is 1.00 or less (F (2)/F (1). Ltoreq.1.00), preferably 0.90 or less (F (2)/F (1). Ltoreq.0.90), more preferably less than 0.80 (F (2)/F (1) < 0.80), still more preferably less than 0.50 (F (2)/F (1) < 0.50). Although not particularly limited, for example, F (2)/F (1) is preferably 0.10 or more (F (2)/F (1). Gtoreq.0.10).

F (1) is preferably less than 0.50N/50mm (F (1) < 0.50), more preferably 0.40N/50mm or less (F (1). Ltoreq.0.40), still more preferably 0.35N/50mm or less (F (1). Ltoreq.0.35), from the viewpoint of workability at the time of peeling the first separator and balance of the adhesive force P (2) of the adhesive 2 to the carrier substrate. In addition, F (1) is preferably 0.04N/50mm or more (F (1). Gtoreq.0.04), more preferably 0.05N/50mm or more (F (1). Gtoreq.0.05), still more preferably 0.06N/50mm or more (F (1). Gtoreq.0.06), from the viewpoint of the spacer tilting during processing and transportation of the transfer sheet.

F (2) is preferably less than 0.20N/50mm (F (2) < 0.20), more preferably 0.15N/50mm or less (F (2). Ltoreq.0.15), still more preferably 0.10N/50mm or less (F (2). Ltoreq.0.10), from the viewpoint of workability at the time of peeling the second separator and balance with the first separator peeling force F (1). In addition, F (2) is preferably 0.01N/50mm or more (F (1). Gtoreq.0.01), more preferably 0.02N/50mm or more (F (2). Gtoreq.0.02), and still more preferably 0.04N/50mm or more (F (2). Gtoreq.0.04) from the viewpoint of the spacer tilting during the transfer sheet processing and the conveyance.

In the laminated film of the present invention, when the first separator is peeled from the first pressure-sensitive adhesive layer, the peeling of the second pressure-sensitive adhesive layer from the carrier substrate is less likely to occur by P (2) > F (1).

Here, P (2)/F (1) (ratio of P (2) to F (1)) is 1.00 or more (P (2)/F (1) > 1.00), preferably greater than 1.00 (P (2)/F (1) > 1.00), more preferably 1.20 or more (P (2)/F (1) > 1.20). In addition, although not particularly limited, for example, P (2)/F (1) is preferably 4.50 or less (P (2)/F (1). Ltoreq.4.50).

From the viewpoint of improving reworkability that can be peeled from a carrier substrate without causing contamination such as adhesive residue, P (2) is preferably less than 1.10N/50mm (P (2) < 1.10), more preferably 1.00N/50mm or less (P (2). Ltoreq.1.00), and still more preferably 0.90N/50mm or less (P (2). Ltoreq.0.90). In view of the adhesiveness of the carrier substrate to the second pressure-sensitive adhesive layer, P (2) is preferably 0.10N/50mm or more (P (2). Gtoreq.0.10), more preferably 0.20N/50mm or more (P (2). Gtoreq.0.20), and still more preferably 0.30N/50mm or more (P (2). Gtoreq.0.30).

When F (1), F (2) and P (2) satisfy the above-mentioned relation, an error is less likely to occur in the separator peeling process when the transfer double-sided adhesive film is attached to the carrier substrate.

In the second adhesive layer of the present invention, from the viewpoint that the adhesion force of the second adhesive layer to the carrier substrate does not rise even by thermocompression bonding at the time of transferring and mounting the electronic component onto the mounting substrate, and peels off well and reworkability is excellent, the ratio of P ' (2)/P (2) (P ' (2) to P (2) is less than 1.20 (P ' (2)/P (2) < 1.20), preferably 1.0 or less (P ' (2)/P (2). Ltoreq.1.0), more preferably 0.8 or less (P ' (2)/P (2). Ltoreq.0.8. Although not particularly limited, for example, the ratio of P ' (2)/P (2) is preferably 0.01 or more (P ' (2)/P (2). Gtoreq.0.01), more preferably 0.03 or more (P ' (2)/P (2). Gtoreq.0.03).

In the second adhesive layer of the present invention, P '(2) is less than 1.00N/50mm (P' (2) < 1.00), preferably 0.6N/50mm or less (P '(2). Ltoreq.0.6), more preferably 0.4N/50mm or less (P' (2). Ltoreq.0.4), from the viewpoint of easy detachment of the transfer double-sided adhesive film from the carrier substrate without leaving any adhesive paste and excellent reworkability. Although not particularly limited, P ' (2) is, for example, preferably 0.01N/50mm or more (P ' (2). Gtoreq.0.01), more preferably 0.02N/50mm or more (P ' (2). Gtoreq.0.02).

By satisfying the above relationship between P (2) and P' (2), the transfer double-sided adhesive film is less likely to peel off from the carrier substrate when transferring a semiconductor chip or the like to the mounting substrate, and the transfer double-sided adhesive film is likely to peel off from the carrier substrate after transferring a semiconductor chip or the like to the mounting substrate, so that the adhesive paste is less likely to remain.

In the laminated film of the present invention, the 90 ° initial release force T (1) (N/50 mm) of the first adhesive layer to the first separator measured at 23 ℃ under 50% r.h. and the pulling rate of 0.3 m/min, the 90 ° initial release force T (2) (N/50 mm) of the second adhesive layer to the second separator measured at 23 ℃ under 50% r.h. and the pulling rate of 0.3 m/min, and the adhesive force P (2) preferably satisfy the following relationship.

T(1)/T(2)＞1.05

P(2)/T(1)＜1.90

The initial release force T (1) is the maximum value (maximum stress) of the release force recorded at the initial stage of release when the first separator is released from the first adhesive layer, and the initial release force T (2) is the maximum value (maximum stress) of the release force recorded at the initial stage of release when the second separator is released from the second adhesive layer.

In the laminated film of the present invention, T (1)/T (2) (ratio of T (1) to T (2)) is preferably greater than 1.05 (T (1)/T (2) > 1.05, more preferably 1.10 or more (T (1)/T (2) > 1.10), still more preferably 1.15 or more (T (1)/T (2) > 1.15), from the viewpoint that peeling of the first separator from the first pressure-sensitive adhesive layer is less likely to occur when the second separator is peeled from the second pressure-sensitive adhesive layer. In addition, T (1)/T (2) is preferably 3.50 or less (T (1)/T (2). Ltoreq.3.50), for example, although not particularly limited.

In the laminated film of the present invention, P (2)/T (1) (ratio of P (2) to T (1)) is preferably less than 1.90 (P (2)/T (1) < 1.90), more preferably 1.50 or less (P (2)/T (1). Ltoreq.1.50), even more preferably less than 1.00 (P (2)/T (1) < 1.00), and particularly preferably 0.90 or less (P (2)/T (1). Ltoreq.0.90), from the viewpoint that peeling of the second pressure-sensitive adhesive layer from the carrier substrate is less likely to occur when the first separator is peeled off from the first pressure-sensitive adhesive layer. Although not particularly limited, for example, the ratio of P (2)/T (1) is preferably 0.20 or more (P (2)/T (1). Gtoreq.0.20), more preferably 0.40 or more (P (2)/T (1). Gtoreq.0.40).

T (1) is preferably 0.10N/50mm or more (T (1). Gtoreq.0.10), more preferably 0.15N/50mm or more (T (1). Gtoreq.0.15), still more preferably 0.20N/50mm or more (T (1). Gtoreq.0.20). In addition, T (1) is, for example, preferably 1.00N/50mm or less (T (1). Ltoreq.1.00), more preferably 0.85N/50mm or less (T (1). Ltoreq.0.85), still more preferably 0.70N/50mm or less (PT (1). Ltoreq.0.70), although not particularly limited.

T (2) is preferably 0.50N/50mm or less (T (2). Ltoreq.0.50), more preferably 0.45N/50mm or less (T (2). Ltoreq.0.45), still more preferably 0.40N/50mm or less (T (2). Ltoreq.0.40). Although not particularly limited, T (1) is, for example, preferably 0.10N/50mm or more (T (2). Gtoreq.0.10), more preferably 0.15N/50mm or more (T (2). Gtoreq.0.15).

By satisfying the above relationship with T (1), T (2), and P (2), an error is less likely to occur in the separator peeling process when the transfer double-sided adhesive film is attached to the carrier substrate.

As described above, by optimizing the overall constitution of the peeling force and the adhesive force so that F (1), F (2), P' (2), T (1), and T (2) satisfy the above-described relationship, the work efficiency can be improved in the manufacturing process of the semiconductor device.

The above-mentioned F (1), F (2), P' (2), T (1), and T (2) can adjust the adhesive force based on the kind or composition of the adhesive constituting the first adhesive layer and the second adhesive layer, the degree of crosslinking, and the like; WBL (Weak Boundary Layer: weak interface layer) is formed by blending a light debonding agent and a plasticizer; the thickness, the material of construction, the peeling treatment, and the like of the first spacer and the second spacer are adjusted.

< first adhesive layer >)

In the double-sided adhesive film for transfer of the present invention, the first adhesive layer is an adhesive layer for receiving and holding an electronic component, and contains a low-adhesion adhesive layer. The first adhesive layer is preferably formed to include a low-adhesion adhesive layer in view of reducing the force applied to the electronic component when the electronic component is received and suppressing damage to the electronic component. When the first adhesive layer receives the electronic component in a noncontact manner, for example, the electronic component is peeled off from the dicing tape by pressing the electronic component with a pin member or the like, and the electronic component is dropped onto the first adhesive layer. However, when the first adhesive layer receives the dropped electronic component, the electronic component may bounce and cannot be received with high accuracy. When this occurs, the positional accuracy of the electronic product may be lowered, and contact failure may occur. The configuration in which the first adhesive layer includes a low-adhesion adhesive layer is also suitable in that the electronic component is easily captured by the first adhesive layer without bouncing up when the first adhesive layer receives the electronic component in a noncontact manner and can be received with good positional accuracy. Further, it is also preferable in view of being able to easily peel off the electronic component received by the transfer double-sided adhesive film from the first adhesive layer when mounting the electronic component on the mounting substrate.

The first adhesive layer is formed by adjusting the type or composition of the adhesive to be formed, the degree of crosslinking, and the like; the WBL (Weak Boundary Layer: weak interfacial layer) is formed by blending a light releaser and a plasticizer, whereby a low-adhesion pressure-sensitive adhesive layer can be produced.

In the laminated film of the present invention, the storage modulus (E' 1 a) at 25℃at a frequency of 1Hz obtained by AFM-DMA (dynamic viscoelasticity measurement (nDMA: nano Dynamic Mechanical Analysis) by atomic force microscopy (AFM: atomic Force Microscope)) of the first adhesive layer is preferably 50MPa or less. This configuration is preferable in terms of reliably adhering the electronic component received by the first adhesive layer. If the E'1a is too high, the adhesiveness of the electronic component to the first pressure-sensitive adhesive layer may be reduced, and defects such as misalignment and dropping of the electronic component may occur. From the viewpoint of adhesiveness of the electronic component to the first adhesive layer, E'1a is preferably 40MPa or less, more preferably 30MPa or less. In addition, the pressure may be 20MPa or less and 10MPa or less. On the other hand, E'1a is preferably 0.1MPa or more from the viewpoint of transferability from the first pressure-sensitive adhesive layer to the circuit board. If E'1a is too low, the tackiness of the electronic component to the first pressure-sensitive adhesive layer may become too high, and the transferability of the electronic component to be mounted on a mounting board may be impaired. From the viewpoint of transferability of the electronic component to the mounting substrate, E'1a is preferably 0.2MPa or more, more preferably 0.5MPa or more.

In the laminated film of the present invention, the storage modulus (E' 1 b) at 25℃at a frequency of 1kHz as measured by AFM-DMA of the first adhesive layer is preferably 100MPa or less. This configuration is preferable in that the electronic component is not sprung up on the surface of the first adhesive layer when the first adhesive layer receives the electronic component in a noncontact manner, and the electronic component can be received with good positional accuracy. When E'1b is too high, the electronic component is dropped and received without being brought into contact with the surface of the first adhesive layer, and the electronic component is sprung up and is deviated from a predetermined position or turned over, and the positional accuracy is easily lowered. From the viewpoint of positional accuracy of the electronic component on the first adhesive layer, E'1b is preferably 90MPa or less, more preferably 80MPa or less. The pressure may be 70MPa or less, 60MPa or less, 50MPa or less, 40MPa or less, or 30MPa or less, and particularly 20MPa or less. On the other hand, E'1b is preferably 0.5MPa or more from the viewpoint of transferability from the first pressure-sensitive adhesive layer to the circuit board. If E'1b is too low, the adhesiveness of the electronic component to the first adhesive layer may be high, and if the electronic component is dropped, the electronic component may be buried in the first adhesive layer, and the transferability may be impaired when the electronic component is mounted on a mounting board. From the viewpoint of transferability of the electronic component to the mounting substrate, E'1b is preferably 0.7MPa or more, and more preferably 1MPa or more.

In the laminated film of the present invention, the ratio (E '1b/E'1 a) of the storage modulus (E '1 b) at 25℃at a frequency of 1kHz measured by AFM-DMA of the first adhesive layer to the storage modulus (E' 1 a) at 25℃at a frequency of 1Hz measured by AFM-DMA of the first adhesive layer is preferably greater than 1. This configuration is preferable in terms of improving balance of the adhesiveness, positional accuracy, transferability to a mounting substrate, and the like of the electronic component on the first adhesive layer. From the viewpoint of balance of adhesiveness, positional accuracy, transferability to a mounting substrate, and the like of an electronic component, E '1b/E'1a is preferably 1.05 or more, more preferably 1.1 or more. The upper limit of E '1b/E'1a is not particularly limited, but is preferably 3 or less from the viewpoint of the balance.

In the laminated film of the present invention, the loss modulus (E "1 a) at 25 ℃ at a frequency of 1Hz measured by AFM-DMA of the first adhesive layer is preferably 7MPa or less. This configuration is preferable from the viewpoint of excellent transferability of the electronic component to the mounting substrate. If E "1a is too high, the adhesiveness of the electronic component to the first adhesive layer may be too high, and the transferability of the electronic component to the mounting board may be impaired. From the viewpoint of transferability of the electronic component to the mounting substrate, E "1a is preferably 5MPa or less, and more preferably 3MPa or less. If the value E "1a is too low, the tackiness of the electronic component to the first pressure-sensitive adhesive layer may be reduced, resulting in defects such as misalignment and dropping of the electronic component. In view of adhesiveness of the electronic component to the first pressure-sensitive adhesive layer, E "1a is preferably 0.01MPa or more, more preferably 0.03MPa or more.

The storage modulus (E '1 a) at a frequency of 1Hz and 25 ℃ and the storage modulus (E '1 b) at a frequency of 1kHz and 25 ℃ and the loss modulus (E '1 a) at a frequency of 1Hz and 25 ℃ as measured by AFM-DMA of the first adhesive layer can be adjusted by the kind or composition of the adhesive to be formed, the degree of crosslinking, and the like.

In the laminated film of the present invention, the adhesion force of the first adhesive layer to a stainless steel plate (diameter 5 mm) is preferably 10gf/Φ5mmSUS to 250gf/Φ5mmSUS. The constitution in which the adhesion force is 10gf or more/Φ5mmsus is preferable, and 20gf or more/Φ5mmsus is more preferable from the viewpoints of the adhesiveness and positional accuracy of the electronic component on the first adhesive layer. On the other hand, from the viewpoint of transferability of the electronic component to the mounting substrate, the above-mentioned constitution having an adhesive force of 250gf or less/Φ5mmsus is preferable, and 200gf or less/Φ5mmsus is more preferable.

The adhesion of the first adhesive layer to a stainless steel plate (diameter 5 mm) can be adjusted by the type or composition of the adhesive to be formed, the degree of crosslinking, additives such as fatty acid esters and fluorine-containing surfactants, and the like.

In the laminated film of the present invention, the surface force of the first adhesive layer is preferably-500. Mu.N to-100. Mu.N. The surface force is preferably-500. Mu.N or more, more preferably-400. Mu.N or more, from the viewpoints of the adhesiveness and positional accuracy of the electronic component on the first adhesive layer. On the other hand, from the viewpoint of transferability of the electronic component to the mounting substrate, the constitution in which the surface force is-100. Mu.N or less is preferable, and-50. Mu.N or less is more preferable.

The surface force of the first adhesive layer can be adjusted by the type or composition of the adhesive to be formed, the degree of crosslinking, additives such as fatty acid esters and fluorine-containing surfactants, and the like.

In the transfer double-sided adhesive film of the present invention, the thickness of the first adhesive layer is not particularly limited, but is preferably 1 μm or more, and more preferably 3 μm or more. When the thickness is a certain value or more, the first adhesive layer is preferable in that it is easy to receive electronic components with high accuracy. The upper limit of the thickness of the first adhesive layer is not particularly limited, but is preferably 100 μm, and more preferably 75 μm. When the thickness is equal to or less than a predetermined value, it is preferable that the electronic component be easily transferred to the mounting board with high accuracy.

In the laminated film of the present invention, the haze (according to JIS K7136) of the first adhesive layer is not particularly limited, and is preferably 10% or less, more preferably 5.0% or less. When the haze is 10% or less, excellent transparency can be obtained, and for example, a pattern (for example, a mark indicating a transfer position of an electronic component) provided on the carrier substrate can be visually recognized when the laminated film is attached to the carrier substrate, which is preferable. The haze can be measured, for example, as follows: the first adhesive layer was formed on the separator and allowed to stand at normal (23 ℃ C., 50% RH) for at least 24 hours, then the separator was peeled off, and the first adhesive layer was attached to a glass slide (for example, a glass slide having a total light transmittance of 91.8% and a haze of 0.4%) to be used as a sample, and the sample was measured using a haze meter (product name "HM-150", manufactured by Toku color technology Co., ltd.).

In the laminated film of the present invention, the total light transmittance of the first adhesive layer in the visible light wavelength range (according to JIS K7361-1) is not particularly limited, and is preferably 85% or more, more preferably 88% or more. When the total light transmittance is 85% or more, excellent transparency can be obtained, and for example, a pattern (for example, a mark indicating a transfer position of an electronic component) provided on the carrier substrate can be visually recognized when the laminated film is attached to the carrier substrate, which is preferable. The total light transmittance can be measured, for example, as follows: the first adhesive layer was formed on the separator and allowed to stand at normal (23 ℃ C., 50% RH) for at least 24 hours, then the separator was peeled off, and the first adhesive layer was attached to a glass slide (for example, a glass slide having a total light transmittance of 91.8% and a haze of 0.4%) to be used as a sample, and the sample was measured using a haze meter (product name "HM-150", manufactured by Toku color technology Co., ltd.).

The pressure-sensitive adhesive constituting the first pressure-sensitive adhesive layer is not particularly limited, and examples thereof include: silicone-based adhesives, urethane-based adhesives, acrylic-based adhesives, rubber-based adhesives, polyester-based adhesives, polyamide-based adhesives, epoxy-based adhesives, vinyl alkyl ether-based adhesives, fluorine-containing adhesives, and the like. Among them, from the viewpoint of being able to receive electronic components with good positional accuracy without damaging the electronic components and good transferability to a mounting substrate, silicone adhesives, urethane adhesives, and acrylic adhesives that are easy to control to low adhesion are preferred, silicone adhesives and urethane adhesives are more preferred, and silicone adhesives are even more preferred.

(Silicone-based adhesive)

The silicone-based adhesive is not particularly limited, and known or conventional silicone-based adhesives can be used, and for example, addition-type silicone-based adhesives, peroxide-curable silicone-based adhesives, condensation-type silicone-based adhesives, and the like can be used. The silicone-based adhesive may be either one-component type or two-component type. The silicone-based adhesive can be used singly or in combination of two or more.

The addition type silicone-based adhesive is generally an adhesive in which an organopolysiloxane having an alkenyl group such as a vinyl group on a silicon atom and an organopolysiloxane having a hydrosilyl group are subjected to an addition reaction (hydrosilylation reaction) using a platinum compound catalyst such as chloroplatinic acid to produce a silicone-based polymer. The peroxide-curable silicone-based adhesive is generally an adhesive that produces a silicone-based polymer by curing (crosslinking) organopolysiloxane with peroxide. In addition, the condensed type silicone-based adhesive is generally an adhesive that generates a silicone-based polymer by dehydration or dealcoholization reaction between polyorganosiloxanes having hydrolyzable silyl groups such as silanol groups or alkoxysilyl groups at the ends.

As the silicone-based adhesive, from the viewpoint of easy control to low adhesion, for example, there can be mentioned: a silicone adhesive composition comprising a silicone rubber and a silicone resin.

The silicone rubber is not particularly limited as long as it is a silicone rubber component, and for example, an organopolysiloxane having dimethylsiloxane, methylphenylsiloxane, or the like as a main structural unit can be used. In addition, depending on the type of reaction, a silicone rubber having an alkenyl group bonded to a silicon atom (an alkenyl-containing organopolysiloxane; in the case of an addition reaction type), a silicone rubber having at least a methyl group (in the case of a peroxide curing type), a silicone rubber having a silanol group or a hydrolyzable alkoxysilyl group at the terminal (in the case of a condensation type), or the like can be used. The weight average molecular weight of the organopolysiloxane in the silicone rubber is usually 15 ten thousand or more, preferably 28 ten thousand to 100 ten thousand, and particularly preferably 50 ten thousand to 90 ten thousand.

The silicone resin is not particularly limited as long as it is a silicone resin used for a silicone-based adhesive, and examples thereof include:a silicone resin or the like comprising an organopolysiloxane comprising a compound having a structural unit selected from the group consisting of "R ₃ Si _1/2 "M unit comprising structural unit" SiO ₂ "Q unit comprising a structural unit" RSiO _3/2 T unit and containing structural unit R ₂ Polymers (copolymers) of at least one of the D units of SiO'. R in the above structural unit represents a hydrocarbon group or a hydroxyl group. Examples of the hydrocarbon group include: aliphatic hydrocarbon groups (alkyl groups such as methyl and ethyl), alicyclic hydrocarbon groups (cycloalkyl groups such as cyclohexyl), aromatic hydrocarbon groups (aryl groups such as phenyl and naphthyl), and the like. The ratio (ratio) of the M unit to at least one unit selected from the group consisting of Q unit, T unit, and D unit is preferably, for example, the former/latter (molar ratio) =about 0.3/1 to about 1.5/1 (preferably about 0.5/1 to about 1.3/1). Various functional groups such as vinyl groups may be introduced into the organopolysiloxane in such a silicone resin as needed. The functional group to be introduced may be a functional group capable of undergoing a crosslinking reaction. As the silicone resin, MQ resin containing M units and Q units is preferable. The weight average molecular weight of the organopolysiloxane in the silicone resin is usually 1000 or more, preferably 1000 to 20000, and particularly preferably 1500 to 10000.

The blending ratio of the silicone rubber to the silicone resin is not particularly limited, and from the viewpoint of easy control to low adhesion, for example, the silicone resin is preferably 100 to 220 parts by weight (particularly 120 to 180 parts by weight) relative to 100 parts by weight of the silicone rubber.

In the silicone-based adhesive composition containing the silicone rubber and the silicone resin, the silicone rubber and the silicone resin may be mixed together, or may react with each other to form a condensate (particularly, a partial condensate), a crosslinked reaction product, an addition reaction product, or the like.

In addition, in the silicone adhesive composition containing silicone rubber and silicone resin, a crosslinking agent is generally contained in order to form a crosslinked structure, in view of easy control to low adhesion. The crosslinking agent is not particularly limited, and a siloxane crosslinking agent (silicone crosslinking agent) and a peroxide crosslinking agent can be preferably used. The crosslinking agent can be used singly or in combination of two or more.

As the siloxane-based crosslinking agent, for example, a polyorganosiloxane having 2 or more hydrogen atoms bonded to silicon atoms in the molecule can be preferably used. In such a polyorganosiloxane, various organic groups may be bonded to the silicon atom to which the hydrogen atom is bonded, in addition to the hydrogen atom. Examples of the organic group include: alkyl groups such as methyl and ethyl; aryl groups such as phenyl; and haloalkyl groups, etc., methyl groups are preferred from the standpoint of synthesis and handling. The skeleton structure of the polyorganosiloxane may have any of a linear, branched, and cyclic skeleton structure, and is preferably linear.

As the peroxide-based crosslinking agent, for example, there can be used: diacyl peroxides, alkyl peroxyesters, peroxydicarbonates, monoperoxycarbonates, peroxyketals, dialkyl peroxides, hydroperoxides, ketone peroxides, and the like. More specifically, for example, it is possible to list: benzoyl peroxide, t-butyl peroxybenzoate, dicumyl peroxide, t-butylcumene peroxide, di-t-butyl peroxide, 2, 5-dimethyl-2, 5-di-t-butylhexane peroxide, 2, 4-dichlorobenzoyl peroxide, di-t-butyldiisopropylbenzene peroxide, 1-bis (t-butylperoxy) -3, 5-trimethylcyclohexane, 2, 5-dimethyl-2, 5-di-t-butylperoxy hexyne-3, and the like.

As the addition type silicone adhesive, for example, trade names "KR-3700", "KR-3701", "X-40-3237-1", "X-40-3240", "X-40-3291-1", "X-40-3306" (manufactured by Xinyue chemical Co., ltd.) are commercially available. Further, as the peroxide-curable silicone-based adhesive, for example, trade names "KR-100", "KR-101-10", "KR-130" (manufactured by Xinyue chemical industries Co., ltd.) and the like are commercially available.

The addition type silicone adhesive composition preferably contains a curing catalyst such as a platinum catalyst. As the platinum Catalyst, for example, a trade name "CAT-PL-50T" (manufactured by Xinyue chemical Co., ltd.), a trade name "DOWSIL NC-25Catalyst", "DOWSIL SRX212 Catalyst" (manufactured by Tao Shidong Co., ltd.), and the like are commercially available. From the viewpoint of balance of receptivity, positional accuracy, transferability to a mounting substrate, and the like of the electronic component of the first adhesive layer, the content of the curing catalyst is preferably about 0.1 parts by weight to about 10 parts by weight with respect to 100 parts by weight of the silicone-based polymer (including silicone rubber, silicone resin, and the like) as the base polymer.

(urethane type adhesive)

The urethane adhesive is not particularly limited, and a known or conventional urethane adhesive can be used, and a urethane adhesive composition containing a polyol, a polyfunctional isocyanate compound and a catalyst is preferable from the viewpoint of easy control to low adhesion.

Any suitable polyol may be used as the polyol as long as it has 2 or more hydroxyl groups. Examples of such polyols include: a polyol having 2 hydroxyl groups (diol), a polyol having 3 hydroxyl groups (triol), a polyol having 4 hydroxyl groups (tetraol), a polyol having 5 hydroxyl groups (pentaol), a polyol having 6 hydroxyl groups (hexaol), and the like. The polyhydric alcohol can be used singly or in combination of two or more.

The polyol preferably contains a polyol having a number average molecular weight (Mn) of 400 to 20000. The content of the polyol having a number average molecular weight (Mn) of 400 to 20000 in the total amount of the polyol is preferably 50 to 100% by weight, more preferably 70 to 100% by weight, still more preferably 90 to 100% by weight, particularly preferably 95 to 100% by weight, and most preferably substantially 100% by weight. By adjusting the content ratio of the polyol having a number average molecular weight (Mn) of 400 to 20000 in the polyol to be within the above range, for example, a urethane adhesive with low adhesion can be provided.

Examples of the polyol include: polyester polyols, polyether polyols, polycaprolactone polyols, polycarbonate polyols, castor oil polyols, and the like.

The polyester polyol can be obtained, for example, by an esterification reaction of a polyol component and an acid component.

Examples of the polyol component include: ethylene glycol, diethylene glycol, 1, 3-butanediol, 1, 4-butanediol, neopentyl glycol, 3-methyl-1, 5-pentanediol, 2-butyl-2-ethyl-1, 3-propanediol, 2, 4-diethyl-1, 5-pentanediol, 1, 2-hexanediol, 1, 6-hexanediol, 1, 8-octanediol, 1, 9-nonanediol, 2-methyl-1, 8-octanediol, 1, 8-decanediol, octadecanediol, glycerol, trimethylolpropane, pentaerythritol, hexanetriol, polypropylene glycol, and the like.

Examples of the acid component include: succinic acid, methylsuccinic acid, adipic acid, pimelic acid, azelaic acid, sebacic acid, 1, 12-dodecanedioic acid, 1, 14-tetradecanedioic acid, dimer acid, 2-methyl-1, 4-cyclohexanedicarboxylic acid, 2-ethyl-1, 4-cyclohexanedicarboxylic acid, terephthalic acid, isophthalic acid, phthalic acid, isophthalic acid, terephthalic acid, 1, 4-naphthalenedicarboxylic acid, 4' -biphenyl dicarboxylic acid, anhydrides thereof, and the like.

Examples of the polyether polyol include: polyether polyols obtained by addition polymerization of alkylene oxides such as ethylene oxide, propylene oxide, and butylene oxide using water, low molecular polyols (propylene glycol, ethylene glycol, glycerin, trimethylolpropane, pentaerythritol, and the like), bisphenols (bisphenol a and the like), dihydroxybenzenes (catechol, resorcinol, hydroquinone, and the like), and the like as initiators. Specifically, examples thereof include: polyethylene glycol, polypropylene glycol, polytetramethylene glycol, and the like.

Examples of the polycaprolactone polyol include: caprolactone type polyester diols obtained by ring-opening polymerization of cyclic ester monomers such as epsilon-caprolactone and sigma-valerolactone.

Examples of the polycarbonate polyol include: a polycarbonate polyol obtained by polycondensation of the above polyol component with phosgene; polycarbonate polyols obtained by transesterification condensation of the above polyol component with a carbonic acid diester such as dimethyl carbonate, diethyl carbonate, dipropyl carbonate, diisopropyl carbonate, dibutyl carbonate, ethylbutyl carbonate, ethylene carbonate, propylene carbonate, diphenyl carbonate, dibenzyl carbonate, etc.; a copolycarbonate polyol obtained by combining two or more of the above polyol components; a polycarbonate polyol obtained by subjecting the above-mentioned various polycarbonate polyols to an esterification reaction with a carboxyl group-containing compound; polycarbonate polyols obtained by subjecting the above-mentioned various polycarbonate polyols to etherification reaction with a hydroxyl group-containing compound; polycarbonate polyols obtained by transesterification of the above-mentioned various polycarbonate polyols with an ester compound; polycarbonate polyols obtained by transesterification of the above-mentioned various polycarbonate polyols with a hydroxyl group-containing compound; a polyester-type polycarbonate polyol obtained by polycondensation reaction of the various polycarbonate polyols and a dicarboxylic acid compound; a copolymerized polyether type polycarbonate polyol obtained by copolymerizing the above-mentioned various polycarbonate polyols with an alkylene oxide; etc.

Examples of the castor oil type polyol include: castor oil type polyols obtained by reacting castor oil fatty acids with the above polyol component. Specifically, examples thereof include: castor oil type polyols obtained by reacting castor oil fatty acids with polypropylene glycol.

As the above polyol, a polyol (triol) having 3 hydroxyl groups is preferably used as an essential component from the viewpoints of low adhesion to electronic parts, wettability, and the like of the first adhesive layer body. The content of the polyol (triol) having 3 hydroxyl groups is preferably 50 to 100% by weight, more preferably 70 to 100% by weight, relative to the total amount of components constituting the above polyol.

Examples of the polyfunctional isocyanate compound include: aliphatic polyisocyanates, alicyclic polyisocyanates, aromatic polyisocyanate compounds, and the like.

Examples of the aliphatic polyisocyanate include: trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1, 2-propylene diisocyanate, 1, 3-butylene diisocyanate, dodecamethylene diisocyanate, 2, 4-trimethylhexamethylene diisocyanate, and the like.

Examples of the alicyclic polyisocyanate include: 1, 3-cyclopentene diisocyanate, 1, 3-cyclohexane diisocyanate, 1, 4-cyclohexane diisocyanate, isophorone diisocyanate, hydrogenated diphenylmethane diisocyanate, hydrogenated xylylene diisocyanate, hydrogenated toluene diisocyanate, hydrogenated tetramethylxylylene diisocyanate, and the like.

Examples of the aromatic polyisocyanate include: phenylene diisocyanate, 2, 4-toluene diisocyanate, 2, 6-toluene diisocyanate, 2 '-diphenylmethane diisocyanate, 4' -toluidine diisocyanate, 4 '-diphenyl ether diisocyanate, 4' -biphenyl diisocyanate, 1, 5-naphthalene diisocyanate, xylylene diisocyanate, and the like.

Among them, aliphatic polyisocyanates and modified products thereof are preferable. Compared with other isocyanate crosslinking agents, the aliphatic polyisocyanate and the modified product thereof have high flexibility of crosslinked structure and are easy to control to low adhesion. As the aliphatic polyisocyanate and its modified product, hexamethylene diisocyanate and its modified product are particularly preferable.

The equivalent ratio (NCO/OH) of the isocyanate group of the polyfunctional isocyanate compound to the hydroxyl group of the polyol is preferably 1 to 5, more preferably 1.1 to 3, and even more preferably 1.2 to 2, from the viewpoints of low adhesion to electronic parts and wettability of the first adhesive layer body.

The urethane adhesive composition preferably contains a catalyst such as an iron-containing compound and/or a tin-containing compound. Specifically, it is possible to list: tin-containing catalysts such as dibutyltin dilaurate and dioctyltin dilaurate; tris (acetylacetonato) iron, tris (hexane-2, 4-dione) iron, tris (heptane-3, 5-dione) iron, tris (5-methylhexane-2, 4-dione) iron, tris (octane-2, 4-dione) iron, tris (6-methylheptane-2, 4-dione) iron, tris (2, 6-dimethylheptane-3, 5-dione) iron, tris (nonane-2, 4-dione) iron, tris (nonane-4, 6-dione) iron, tris (2, 6-tetramethylheptane-3, 5-dione) iron, tris (tridecane-6, 8-dione) iron, tris (1-phenylbutane-1, 3-dione) iron tris (hexafluoroacetylacetonate) iron, tris (ethylacetoacetate) iron, tris (n-propyl acetoacetate) iron, tris (isopropyl acetoacetate) iron, tris (n-butyl acetoacetate) iron, tris (sec-butyl acetoacetate) iron, tris (tert-butyl acetoacetate) iron, tris (methyl propionylacetate) iron, tris (ethyl propionylacetate) iron, tris (n-propyl propionylacetate) iron, tris (isopropyl propionylacetate) iron, tris (n-butyl propionylacetate) iron, tris (sec-butyl propionylacetate) iron, tris (tert-butyl propionylacetate) iron, iron-containing catalysts such as tris (benzyl acetoacetate) iron, tris (dimethyl malonate) iron, tris (diethyl malonate) iron, trimethoxy iron, triethoxy iron, triisopropoxy iron, and ferric chloride.

The content (amount) of the catalyst contained in the urethane adhesive composition is preferably 0.002 to 0.5 parts by weight, more preferably 0.005 to 0.3 parts by weight, and even more preferably 0.01 to 0.1 parts by weight, based on 100 parts by weight of the polyol. When the amount is within this range, the rate of the crosslinking reaction becomes high at the time of forming the adhesive layer, and the pot life of the adhesive composition becomes long, which is a preferable mode.

In addition, as the urethane adhesive, a urethane adhesive composition containing a urethane prepolymer is also preferable from the viewpoint of easy control to low adhesion.

As the urethane-based adhesive composition containing the urethane prepolymer, for example, there can be mentioned: an adhesive composition comprising a polyurethane polyol as a urethane prepolymer and a polyfunctional isocyanate compound. The urethane prepolymers can be used singly or in combination of two or more. The polyfunctional isocyanate compound may be used singly or in combination of two or more.

The polyurethane polyol as the urethane prepolymer is preferably a polyurethane polyol obtained by reacting a polyester polyol and a polyether polyol with an organic polyisocyanate compound in the presence of a catalyst or in the absence of a catalyst.

As the polyester polyol, any suitable polyester polyol can be used. Examples of such polyester polyols include: polyester polyol obtained by reacting an acid component with a glycol component. Examples of the acid component include: terephthalic acid, adipic acid, azelaic acid, sebacic acid, phthalic anhydride, isophthalic acid, trimellitic acid, and the like. Examples of the diol component include: ethylene glycol, propylene glycol, diethylene glycol, butanediol, 1, 6-hexanediol, 3-methyl-1, 5-pentanediol, 3' -dimethylolheptane, polyoxyethylene glycol, polyoxypropylene glycol, 1, 4-butanediol, neopentyl glycol, butylethylpentanediol; glycerol, trimethylolpropane, pentaerythritol, and the like as polyol components. Examples of the polyester polyol include, in addition to the above: polyester polyols obtained by ring-opening polymerization of lactones such as polycaprolactone, poly (beta-methyl-gamma-valerolactone), and polycaprolactone.

As the molecular weight of the polyester polyol, it is possible to use from low molecular weight to high molecular weight. The polyester polyol preferably has a molecular weight of 500 to 5000. When the number average molecular weight is less than 500, reactivity becomes high, and gelation may be likely to occur. When the number average molecular weight is more than 5000, the reactivity decreases, and the cohesive force of the polyurethane polyol itself may become small. The amount of the polyester polyol used is preferably 10 to 90 mol% in the polyol constituting the polyurethane polyol.

As the polyether polyol, any suitable polyether polyol can be used. Examples of such polyether polyols include: polyether polyols obtained by polymerizing alkylene oxide compounds such as ethylene oxide, propylene oxide, butylene oxide, and tetrahydrofuran using low molecular weight polyols such as water, propylene glycol, ethylene glycol, glycerin, and trimethylolpropane as an initiator. Specific examples of such polyether polyols include: polyether polyols having a functional group number of 2 or more, such as polypropylene glycol, polyethylene glycol, and polytetramethylene glycol.

As the molecular weight of the polyether polyol, it is possible to use from low molecular weight to high molecular weight. The polyether polyol preferably has a molecular weight of 1000 to 5000. When the number average molecular weight is less than 1000, reactivity becomes high, and gelation may be likely to occur. When the number average molecular weight is more than 5000, the reactivity decreases, and the cohesive force of the polyurethane polyol itself may become small. The amount of polyether polyol used is preferably 20 to 80 mol% in the polyol constituting the polyurethane polyol.

The polyether polyol may be partially replaced with a glycol such as ethylene glycol, 1, 4-butanediol, neopentyl glycol, butylethylpentanediol, glycerol, trimethylolpropane, pentaerythritol, or the like, as necessary; polyamines such as ethylenediamine, N-aminoethylethanolamine, isophoronediamine, xylylenediamine, and the like.

As the polyether polyol, only a bifunctional polyether polyol may be used, or a polyether polyol having a number average molecular weight of 1000 to 5000 and at least 3 or more hydroxyl groups in one molecule may be used partially or wholly. When a polyether polyol having an average molecular weight of 1000 to 5000 and having at least 3 or more hydroxyl groups in one molecule is partially or entirely used as the polyether polyol, the balance of adhesion and re-peelability can be made good. When the number average molecular weight of such polyether polyol is less than 1000, reactivity becomes high, and gelation may be likely to occur. In addition, when the number average molecular weight of such polyether polyol is more than 5000, the reactivity is lowered, and there is a possibility that the cohesive force of the polyurethane polyol itself becomes small. The number average molecular weight of such polyether polyol is more preferably 2500 to 3500.

As the organic polyisocyanate compound, any suitable organic polyisocyanate compound can be used. Examples of such organic polyisocyanate compounds include: aromatic polyisocyanates, aliphatic polyisocyanates, araliphatic polyisocyanates, alicyclic polyisocyanates, and the like.

Examples of the aromatic polyisocyanate include: 1, 3-phenylene diisocyanate, 4' -biphenyl diisocyanate, 1, 4-phenylene diisocyanate, 4' -diphenylmethane diisocyanate, 2, 4-toluene isocyanate, 2, 6-toluene isocyanate, 4' -tolidine diisocyanate, 2,4, 6-triisocyanatotoluene, 1,3, 5-triisocyanatophenyl, dianisidine diisocyanate, 4' -diphenyl ether diisocyanate, 4',4 "-triphenylmethane triisocyanate, and the like.

Examples of the aliphatic polyisocyanate include: trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1, 2-propylene diisocyanate, 2, 3-butylene diisocyanate, 1, 3-butylene diisocyanate, dodecamethylene diisocyanate, 2, 4-trimethylhexamethylene diisocyanate, and the like.

Examples of the aromatic aliphatic polyisocyanate include: omega, omega '-diisocyanato-1, 3-dimethylbenzene, omega' -diisocyanato-1, 4-diethylbenzene, 1, 4-tetramethylxylylene diisocyanate, 1, 3-tetramethylxylylene diisocyanate, and the like.

Examples of the alicyclic polyisocyanate include: 3-isocyanatomethyl-3, 5-trimethylcyclohexyl isocyanate, 1, 3-cyclopentanediisocyanate, 1, 3-cyclohexanediisocyanate, 1, 4-cyclohexanediisocyanate, methyl-2, 6-cyclohexanediisocyanate, 4' -methylenebis (cyclohexylisocyanate), 1, 4-bis (isocyanatomethyl) cyclohexane, and the like.

As the organic polyisocyanate compound, trimethylolpropane adducts, biuret forms obtained by reaction with water, trimer having isocyanurate rings, and the like can also be used in combination.

As the catalyst that can be used in obtaining the polyurethane polyol, any suitable catalyst can be used. Examples of such catalysts include: tertiary amine compounds, organometallic compounds, and the like.

Examples of the tertiary amine compound include: triethylamine, triethylenediamine, 1, 8-diazabicyclo (5.4.0) -undecene-7 (DBU), and the like.

Examples of the organometallic compound include: tin-containing compounds, non-tin-containing compounds, and the like.

Examples of the tin-containing compound include: dibutyl tin dichloride, dibutyl tin oxide, dibutyl tin dibromide, dibutyl tin dimaleate, dibutyl tin dilaurate (DBTDL), dibutyl tin diacetate, dibutyl tin sulfide, tributyl tin oxide, tributyl tin acetate, triethyl tin ethoxide, tributyl tin ethoxide, dioctyl tin oxide, tributyl tin chloride, tributyl tin trichloroacetate, tin 2-ethylhexanoate, and the like.

Examples of the non-tin-containing compound include: titanium-containing compounds such as dibutyl titanium dichloride, tetrabutyl titanate, and butoxytitanium trichloride; lead-containing compounds such as lead oleate, lead 2-ethylhexanoate, lead benzoate, and lead naphthenate; iron-containing compounds such as iron 2-ethylhexanoate and iron acetylacetonate; cobalt-containing compounds such as cobalt benzoate and cobalt 2-ethylhexanoate; zinc-containing compounds such as zinc naphthenate and zinc 2-ethylhexanoate; zirconium-containing compounds such as zirconium naphthenate; etc.

In the case of using a catalyst when obtaining a polyurethane polyol, in a system in which two polyols, namely a polyester polyol and a polyether polyol, are present, the catalyst system alone is liable to cause problems of gelation or turbidity of a reaction solution due to the difference in reactivity thereof. Therefore, by using two catalysts in obtaining the polyurethane polyol, it is easy to control the reaction rate, the selectivity of the catalyst, and the like, and these problems can be solved. Examples of such a combination of two catalysts include: the tertiary amine/organometallic compound, tin-containing compound/non-tin-containing compound, tin-containing compound/tin-containing compound is preferably a combination of tin-containing compound/tin-containing compound, more preferably dibutyltin dilaurate and tin 2-ethylhexanoate. Regarding the compounding ratio thereof, tin 2-ethylhexanoate/dibutyltin dilaurate is preferably less than 1, more preferably 0.2 to 0.6 in terms of weight ratio. If the mixing ratio is 1 or more, gelation may easily occur due to the balance of the catalyst activity.

In the case of using the catalyst in obtaining the polyurethane polyol, the amount of the catalyst to be used is preferably 0.01 to 1.0% by weight relative to the total amount of the polyester polyol, polyether polyol and organic polyisocyanate compound.

In the case of using a catalyst in obtaining the polyurethane polyol, the reaction temperature is preferably less than 100 ℃, more preferably 85 to 95 ℃. When the reaction temperature is 100℃or higher, it may be difficult to control the reaction rate and the crosslinked structure, and it may be difficult to obtain a polyurethane polyol having a predetermined molecular weight.

In obtaining the polyurethane polyol, a catalyst may not be used. In this case, the reaction temperature is preferably 100℃or higher, more preferably 110℃or higher. In addition, when the polyurethane polyol is obtained without a catalyst, it is preferable to react for 3 hours or more.

Examples of the method for obtaining the polyurethane polyol include: 1) A method of charging the entire amount of polyester polyol, polyether polyol, catalyst, and organic polyisocyanate into a flask; 2) A method in which a polyester polyol, a polyether polyol, and a catalyst are put into a flask and an organic polyisocyanate is added dropwise. As a method for obtaining the polyurethane polyol, the method of 2) is preferable from the viewpoint of controlling the reaction.

In obtaining the polyurethane polyol, any suitable solvent can be used. Examples of such solvents include: methyl ethyl ketone, ethyl acetate, toluene, xylene, acetone, and the like. Among these solvents, toluene is preferred.

The polyfunctional isocyanate compound can be the polyfunctional isocyanate compound mentioned above.

As a method for producing a polyurethane-based resin composition obtained from a composition containing a urethane prepolymer, any suitable production method can be used as long as it is a method for producing a polyurethane-based resin composition using a so-called "urethane prepolymer" as a raw material.

(acrylic adhesive)

The acrylic adhesive is not particularly limited, and known or conventional acrylic adhesives can be used, and for example, an acrylic adhesive composition containing an acrylic polymer as a base polymer can be exemplified from the viewpoint of easy control to low adhesion.

The acrylic polymer is a polymer containing a structural unit derived from an acrylic monomer (a monomer component having a (meth) acryloyl group in a molecule) as a structural unit of the polymer. The acrylic polymer is preferably a polymer having the largest amount of structural units derived from (meth) acrylic esters in terms of mass ratio. The acrylic polymer may be used alone or in combination of two or more. In this specification, "(meth) acrylic acid" means "acrylic acid" and/or "methacrylic acid" ("acrylic acid" and "methacrylic acid" are either or both), and the other is the same.

Examples of the (meth) acrylate include hydrocarbon group-containing (meth) acrylates. Examples of the hydrocarbon group-containing (meth) acrylate include: alkyl (meth) acrylates, cycloalkyl (meth) acrylates, aryl (meth) acrylates, and the like. Examples of the alkyl (meth) acrylate include: methyl, ethyl, propyl, isopropyl, butyl, isobutyl, sec-butyl, tert-butyl, pentyl, isopentyl, hexyl, heptyl, octyl, 2-ethylhexyl, isooctyl, nonyl, decyl, isodecyl, undecyl, dodecyl (lauryl), tridecyl, tetradecyl, hexadecyl, octadecyl, eicosyl and the like of (meth) acrylic acid. Examples of the cycloalkyl (meth) acrylate include: cyclopentyl, cyclohexyl, and the like, (meth) acrylic acid. Examples of the aryl (meth) acrylate include: phenyl and benzyl (meth) acrylates.

The above-mentioned hydrocarbon group-containing (meth) acrylates can be used singly or in combination of two or more. The ratio of the hydrocarbon group-containing (meth) acrylate is preferably 40 mass% or more, more preferably 60 mass% or more, of all the monomer components for forming the acrylic polymer, from the viewpoint of properly exhibiting basic properties such as adhesiveness derived from the hydrocarbon group-containing (meth) acrylate, and easily controlling to low adhesiveness.

In order to improve the cohesive force, heat resistance, adhesion, etc., the acrylic polymer may contain a structural unit derived from another monomer component copolymerizable with the hydrocarbon group-containing (meth) acrylate. Examples of the other monomer component include: carboxyl group-containing monomers, acid anhydride monomers, hydroxyl group-containing monomers, glycidyl group-containing monomers, sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, functional group-containing monomers such as acrylamide and acrylonitrile, vinyl ester monomers, and the like. Examples of the carboxyl group-containing monomer include: acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, and the like. Examples of the acid anhydride monomer include: maleic anhydride, itaconic anhydride, and the like. Examples of the hydroxyl group-containing monomer include: 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, 4-hydroxymethylcyclohexyl (meth) acrylate, and the like. Examples of the glycidyl group-containing monomer include: glycidyl (meth) acrylate, methyl glycidyl (meth) acrylate, and the like. Examples of the sulfonic acid group-containing monomer include: styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamido-2-methylpropane sulfonic acid, (meth) acrylamidopropane sulfonic acid, sulfopropyl (meth) acrylate, and (meth) acryloxynaphthalene sulfonic acid. Examples of the phosphate group-containing monomer include: 2-hydroxyethyl acryloyl phosphate, and the like. Examples of the vinyl ester monomer include: vinyl acetate, vinyl propionate, vinyl butyrate, vinyl pivalate, vinyl cyclohexane formate, and vinyl benzoate. The other monomer components mentioned above can be used singly or in combination of two or more. The total ratio of the other monomer components is preferably 60 mass% or less, more preferably 40 mass% or less, of all the monomer components for forming the acrylic polymer, from the viewpoint of properly exhibiting basic properties such as adhesiveness derived from the hydrocarbon group-containing (meth) acrylate ester, and easily controlling to low adhesiveness.

In order to form a crosslinked structure in the polymer skeleton of the above-mentioned acrylic polymer, a structural unit derived from a polyfunctional monomer capable of copolymerizing with a monomer component forming the acrylic polymer may be contained. Examples of the polyfunctional monomer include: hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate (e.g., polyglycidyl (meth) acrylate), polyester (meth) acrylate, urethane (meth) acrylate, and the like monomers having a (meth) acryloyl group and other reactive functional groups in the molecule. The above-mentioned polyfunctional monomers can be used singly or in combination of two or more. The ratio of the polyfunctional monomer is preferably 40 mass% or less, more preferably 30 mass% or less, of all the monomer components for forming the acrylic polymer, from the viewpoint of properly exhibiting basic properties such as adhesiveness derived from the hydrocarbon group-containing (meth) acrylate ester in the first adhesive layer and easily controlling to low adhesiveness.

The acrylic polymer is obtained by polymerizing one or more monomer components including an acrylic monomer. As the polymerization method, there may be mentioned: solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization, and the like.

The mass average molecular weight of the acrylic polymer is preferably 10 ten thousand or more, more preferably 20 ten thousand to 300 ten thousand. When the mass average molecular weight is 10 ten thousand or more, the low molecular weight substance in the pressure-sensitive adhesive layer tends to be small, and contamination of electronic parts and the like can be further suppressed.

The acrylic adhesive composition forming the first adhesive layer may contain a crosslinking agent. For example, the acrylic polymer can be crosslinked to further reduce low molecular weight species in the first adhesive layer. In addition, the mass average molecular weight of the acrylic polymer can be increased to control low adhesion. Examples of the crosslinking agent include: the polyisocyanate compound, the epoxy compound, the polyol compound (polyhydric phenol compound, etc.), the aziridine compound, the melamine compound, etc., preferably an isocyanate-based crosslinking agent and/or an epoxy-based crosslinking agent. When the crosslinking agent is used, the amount of the crosslinking agent to be used is preferably about 10 parts by mass or less, more preferably 0.1 to 10 parts by mass, based on 100 parts by mass of the acrylic polymer.

Examples of the isocyanate-based crosslinking agent include: aliphatic isocyanates, alicyclic isocyanates and aromatic isocyanates. Examples of the aliphatic isocyanate include: trimethylene diisocyanate, butylene diisocyanate, hexamethylene diisocyanate and dimer acid diisocyanate. Examples of the alicyclic isocyanate include: cyclopentylene diisocyanate, cyclohexylene diisocyanate, isophorone diisocyanate, and 1, 3-bis (isocyanatomethyl) cyclohexane. Examples of the aromatic isocyanates include: 2, 4-toluene diisocyanate, 4' -diphenylmethane diisocyanate and xylylene diisocyanate. The isocyanate-based crosslinking agent may be: trimethylol propane adduct of toluene diisocyanate (trade name "Coronate L", manufactured by Tosoh Co., ltd.), and isocyanuric acid form of hexamethylene diisocyanate (trade name "Coronate HX", manufactured by Tosoh Co., ltd.).

Examples of the epoxy-based crosslinking agent (polyfunctional epoxy compound) include: n, N' -tetraglycidyl m-xylylenediamine, diglycidyl aniline, 1, 3-bis (N, N-diglycidyl aminomethyl) cyclohexane, 1, 6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, sorbitan polyglycidyl ether, trimethylolpropane polyglycidyl ether, adipic acid diglycidyl ester, phthalic acid diglycidyl ester, tris (2-hydroxyethyl) isocyanurate triglycidyl ester, resorcinol diglycidyl ether and bisphenol S diglycidyl ether; in addition, it is also possible to list: an epoxy resin having 2 or more epoxy groups in the molecule. Examples of the commercially available epoxy-based crosslinking agent include: "tetra C" manufactured by Mitsubishi gas chemical corporation.

The adhesive composition constituting the first adhesive layer preferably contains a light release agent. By containing the light releasing agent, WBL (weak interface layer) is formed on the surface of the first adhesive layer, and thus, low adhesion can be easily controlled.

The light-weight release agent is not particularly limited, and known light-weight release agents can be used without limitation, and examples thereof include: silicone release agents, fluorine-containing surfactants, aliphatic esters, and the like, and these may be used singly or in combination.

The silicone-based release agent is not particularly limited, and examples thereof include: a thermosetting silicone-based release agent, an ionizing radiation-curable silicone-based release agent, and the like. The silicone release agent may be any of a solvent-free solvent type that does not contain a solvent, and a solvent type that is dissolved or dispersed in an organic solvent. The silicone-based release agent may be used alone or in combination of two or more.

The thermosetting silicone release agent is not particularly limited, and a release agent containing an organohydrogen polysiloxane and an organopolysiloxane having an aliphatic unsaturated group is preferable. The silicone release agent is preferably a thermal addition reaction curable silicone release agent that cures by crosslinking by a thermal addition reaction.

The heat-addition-reaction-curable silicone-based release agent is not particularly limited, and examples thereof include: a release agent comprising a polysiloxane having a hydrogen atom (H) bonded to a silicon atom (Si) in the molecule (Si-H group-containing polysiloxane) and a polysiloxane having a functional group reactive to Si-H bond (covalent bond of Si and H) in the molecule (Si-H group-reactive functional group) (Si-H group-reactive polysiloxane). The release agent is cured by crosslinking by an addition reaction between Si-H groups and Si-H groups reactive functional groups.

In the above-mentioned Si-H group-containing polysiloxane, si to which H is bonded may be any of Si in the main chain and Si in the side chain. The above-mentioned polysiloxane containing Si-H groups is preferably a polysiloxane containing two or more Si-H groups in the molecule. As the polysiloxane containing two or more Si-H groups, preferable examples are: dimethylhydrosiloxane-based polymers such as poly (dimethylsiloxane-methylsiloxane).

The si—h group-reactive polysiloxane is preferably: a polysiloxane in which a si—h group reactive functional group or a side chain containing the functional group is bonded to Si (for example, si at the end of the main chain or Si inside the main chain) forming the main chain (skeleton) of the siloxane-based polymer. Among them, a polysiloxane in which Si-H group reactive functional groups are directly bonded to Si in the main chain is preferable. The Si-H-based reactive polysiloxane is preferably: polysiloxanes containing more than two Si-H group reactive functionalities in the molecule.

Examples of the si—h group reactive functional group in the si—h group reactive polysiloxane include: alkenyl groups such as vinyl and hexenyl. Examples of the siloxane-based polymer forming the main chain portion of the si—h group-reactive polysiloxane include: polydialkylsiloxanes such as polydimethylsiloxane, polydiethylsiloxane, and polymethylethylsiloxane (the two alkyl groups may be the same or different); polyalkylarylsiloxanes, poly (dimethylsiloxane-methylsiloxanes), polymers formed by polymerizing a plurality of Si-containing monomers, and the like. Among them, as the siloxane-based polymer forming the main chain portion, polydimethylsiloxane is preferable.

In particular, the above-mentioned heat-addition-curable silicone-based release agent is preferably a heat-addition-curable silicone-based release agent containing a polysiloxane having two or more si—h groups in the molecule and a polysiloxane having two or more si—h group-reactive functional groups in the molecule.

The ionizing radiation-curable silicone-based release agent is not particularly limited, and examples thereof include: a UV-curable silicone release agent which undergoes a crosslinking reaction by Ultraviolet (UV) irradiation to be cured.

The UV-curable silicone release agent is a release agent cured by a chemical reaction such as cationic polymerization, radical addition polymerization, or hydrosilylation reaction by UV irradiation. The UV-curable silicone-based release agent is particularly preferably a UV-curable silicone-based release agent cured by cationic polymerization.

The cationic polymerization type UV curable silicone-based release agent is not particularly limited, and examples thereof include: a release agent comprising an epoxy-containing polysiloxane wherein at least two epoxy groups are bonded directly or via divalent groups (alkylene groups such as methylene, ethylene, etc., alkyleneoxy groups such as ethyleneoxy groups, propyleneoxy groups, etc.), respectively, to Si (for example, si at the end of the main chain, si at the interior of the main chain, etc.) forming the main chain (skeleton) of a siloxane-based polymer and/or Si contained in side chains. The bonding manner of these at least two epoxy groups to Si may be the same or different. Namely, preferable examples include: a release agent comprising a polysiloxane, said polysiloxane comprising two or more epoxy-containing side chains. Examples of the epoxy group-containing side chain include: glycidyl, glycidoxy (glycidoxy), 3, 4-epoxycyclohexyl, 2, 3-epoxycyclopentyl, and the like. The epoxy-containing polysiloxane may be any of linear, branched, or a mixture thereof.

In particular, in the transfer double-sided adhesive film of the present invention, the silicone adhesive preferably contains a thermosetting silicone release agent, and more preferably contains a thermal addition reaction curable silicone release agent, from the viewpoint of easy control of the first adhesive layer to low adhesion.

In the case where the first adhesive layer in the transfer double-sided adhesive film of the present invention contains a silicone-based adhesive, the content of the silicone-based release agent is not particularly limited, and the content of the silicone-based release agent is preferably 0.5 parts by weight or more and 100 parts by weight or less relative to 100 parts by weight of the silicone-based polymer as the base polymer. When the content is 0.5 parts by weight or more, the effect of easily controlling the first adhesive layer to have low adhesion is easily obtained, and more preferably 1 part by weight or more, still more preferably 3 parts by weight or more. When the content is 100 parts by weight or less, the disadvantage that sufficient adhesiveness cannot be obtained and it is difficult to receive electronic components is easily suppressed, and it is more preferably 30 parts by weight or less, and still more preferably 25 parts by weight or less.

By using the above-mentioned fluorine-containing surfactant as the light stripping agent, a light stripping effect due to the low surface free energy of the fluorine site can be exerted.

The fluorinated surfactant is not particularly limited, and examples thereof include: fluorine-containing oligomers, perfluorobutane sulfonates, perfluoroalkyl-containing carboxylates, hexafluoropentane trimer derivative-containing sulfonates, hexafluoropentane trimer derivative-containing carboxylates, hexafluoropentane trimer derivative-containing quaternary ammonium salts, hexafluoropentane trimer derivative-containing betaines, hexafluoropentane trimer derivative-containing polyoxyethylene ethers, and the like, with fluorine-containing oligomers being preferred. The fluorine-containing surfactant may be used alone or in combination of two or more.

Specific examples of the above-mentioned fluorosurfactant include, for example, commercially available products: trade names "Megaface F (1) 14", "Megaface F-410" (above is manufactured by DIC Co., ltd.); trade names "Surflon S-211", "Surflon S-221", "Surflon S-231", "Surflon S-232", "Surflon S-233", "Surflon S-241", "Surflon S-242", "Surflon S-243", "Surflon S-420" (manufactured by AGC cleaning and beautification Co., ltd.); trade names "Ftergent 100", "Ftergent 100C", "Ftergent 110", "Ftergent 150CH", "Ftergent 300", "Ftergent 310", "Ftergent 320", "Ftergent 400SW", "Ftergent 251", "Ftergent 212M", "Ftergent 215M", "Ftergent 250", "Ftergent 209F", "Ftergent 222F", "Ftergent 245F", "Ftergent 208G", "Ftergent 218GL", "Ftergent 240G", "Ftergent212P", "Ftergent 220P", "Ftergent 228P", "Ftergent FTX-218", "Ftergent DFX-18" (manufactured by NEOS Co., ltd.) and the like. These compounds can be used singly or in combination of two or more.

The weight average molecular weight (Mw) of the fluorine-containing oligomer is preferably 3500 or more, more preferably 5000 or more, further preferably 10000 or more, particularly preferably 20000 or more. When the weight average molecular weight of the fluorine-containing oligomer is 3500 or more, the low adhesion can be easily controlled. When the weight average molecular weight is 20000 or more, foaming at the time of compounding of the adhesive (composition) can be suppressed, and the appearance after the adhesive coating is excellent, so that it is preferable. The upper limit of the weight average molecular weight (Mw) of the fluorine-containing oligomer is preferably 20 ten thousand, more preferably 10 ten thousand. By setting the upper limit of the weight average molecular weight (Mw) of the above-mentioned fluorine-containing oligomer to 20 ten thousand, the fluorine-containing oligomer is easily enriched on the surface, and a light peeling effect is more easily exhibited, which is preferable.

The fluorine-containing oligomer is, for example, commercially available: trade names "Megaface F (2) 51", "Megaface F (2) 53", "Megaface F (2) 81", "Megaface F-410", "Megaface F-430", "Megaface F-444", "Megaface F-477", "Megaface F-510", "Megaface F-511", "Megaface F-551", "Megaface F-552", "Megaface F-553", "Megaface F-554", "Megaface F-555", "Megaface F-556", "Megaface F-557", "Megaface F-558", "Megaface F-559", "Megaface F-560", "Megaface F-561", "Megaface F-562"; "Megaface F-563", "Megaface F-565", "Megaface F-568", "Megaface F-569", "Megaface F-570", "Megaface F-571", "Megaface F-572" (manufactured above by DIC Co., ltd.), trade names "Surflon S-611", "Surflon S-651", "Surflon S-386" (manufactured above by AGC beautification Co., ltd.), trade names "Ftergent 610FM", "Ftergent 710FL", "Ftergent 710FM", "Ftergent 710FS", "Ftergent 730FL", "Ftergent 730LM" (manufactured above by NEOS Co., ltd.), and the like. These compounds can be used singly or in combination of two or more.

In the case where the first adhesive layer in the transfer double-sided adhesive film of the present invention contains a fluorine-containing surfactant, the content of the fluorine-containing surfactant is not particularly limited, and the content of the fluorine-containing surfactant is preferably 0.01 parts by weight or more and 5 parts by weight or less with respect to 100 parts by weight of the silicone polymer as the base polymer. When the content is 0.01 parts by weight or more, the effect of easily controlling the first adhesive layer to have low adhesion is easily obtained, and more preferably 0.05 parts by weight or more, still more preferably 0.1 parts by weight or more. When the content is 5 parts by weight or less, the disadvantage that sufficient adhesiveness cannot be obtained and it is difficult to receive an electronic component is easily suppressed, and from the viewpoint of suppressing a decrease in transparency, 3 parts by weight or less is more preferable, and 2 parts by weight or less is even more preferable.

The adhesive composition constituting the first adhesive layer contains a fatty acid ester, so that low adhesion to electronic components and wettability of the first adhesive layer body can be expected.

Examples of the fatty acid ester include: polyoxyethylene bisphenol A laurate, butyl stearate, 2-ethylhexyl palmitate, 2-ethylhexyl stearate, glyceryl monobehenate, cetyl 2-ethylhexanoate, isopropyl myristate, isopropyl palmitate, cholesterol isostearate, lauryl methacrylate, methyl cocoate, methyl laurate, methyl oleate, methyl stearate, myristyl myristate, octyl dodecyl myristate, pentaerythritol monooleate, pentaerythritol monostearate, pentaerythritol tetrapalmitate, stearyl stearate, isotridecyl stearate, tris (2-ethylhexanoate), butyl laurate, octyl oleate, tridecyl isononanoate, and the like. The fatty acid esters can be used singly or in combination of two or more.

The content of the fatty acid ester contained in the urethane-based adhesive composition is preferably 1 to 50 parts by weight, more preferably 2 to 40 parts by weight, and even more preferably 3 to 30 parts by weight, relative to 100 parts by weight of the polyol, for example, from the viewpoints of low adhesion to electronic parts, wettability, and contamination to an adherend of the first adhesive layer body.

In the case where the adhesive composition constituting the first adhesive layer contains a light-weight release agent, the content (total amount) of the light-weight release agent is preferably 0.1 parts by weight or more, more preferably 1 part by weight or more, and even more preferably 3 parts by weight or more, based on 100 parts by weight of the base polymer, from the viewpoints of low adhesion to electronic parts, wettability, and contamination to electronic parts of the first adhesive layer body. The content (total amount) of the light release agent is preferably 50 parts by weight or less, more preferably 30 parts by weight or less, and still more preferably 10 parts by weight or less, from the viewpoint of preventing coloration of the first adhesive layer.

The pressure-sensitive adhesive composition constituting the first pressure-sensitive adhesive layer preferably contains an antioxidant, an ultraviolet absorber, or other deterioration inhibitor. By including the deterioration inhibitor, deterioration such as discoloration during storage of the transfer double-sided adhesive film of the present invention can be suppressed, and workability such as easy cutting of the transfer double-sided adhesive film can be improved.

The ultraviolet absorber is not particularly limited, and examples thereof include: triazine-based ultraviolet absorbers, benzotriazole-based ultraviolet absorbers, benzophenone-based ultraviolet absorbers, hydroxybenzophenone-based ultraviolet absorbers, salicylate-based ultraviolet absorbers, cyanoacrylate-based ultraviolet absorbers, and the like, which can be used singly or in combination. Among them, a triazine-based ultraviolet light absorber and a benzotriazole-based ultraviolet light absorber are preferable, and at least one ultraviolet light absorber selected from the group consisting of a triazine-based ultraviolet light absorber having 2 or less hydroxyl groups in one molecule and a benzotriazole-based ultraviolet light absorber having 1 benzotriazole skeleton in one molecule is preferable because it has good solubility in a monomer for forming an acrylic adhesive composition and has high ultraviolet light absorbing ability in the vicinity of 380 nm.

Specific examples of the triazine ultraviolet light absorber having 2 or less hydroxyl groups in one molecule include: 2, 4-bis [ {4- (4-ethylhexyl oxy) -4-hydroxy } phenyl }]-6- (4-methoxyphenyl) -1,3, 5-triazine (trade name "Tinosorb S", manufactured by BASF corporation), 2, 4-bis [ 2-hydroxy-4-butoxyphenyl ] ]-6- (2, 4-Dibutoxyphenyl) -1,3, 5-triazine (trade name "TINUVIN 460", manufactured by BASF Co., ltd.), 2- (4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazin-2-yl) -5-hydroxyphenyl and [ (C) ₁₀ -C ₁₆ (mainly C ₁₂ -C ₁₃ ) Alkoxy) methyl]Reaction product of ethylene oxide (trade name "TINUVIN 400", manufactured by BASF corporation), 2- [4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazin-2-yl]-5- [3- (dodecyloxy) -2-hydroxypropoxy group]Phenol), the reaction product of 2- (2, 4-dihydroxyphenyl) -4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazine with (2-ethylhexyl) glycidic acid (trade name "TINUVIN 405", manufactured by BASF company), 2- (4, 6-diphenyl-1, 3, 5-triazin-2-yl) -5- [ (hexyl) oxy]Phenol (trade name "TINUVIN 1577", manufactured by BASF corporation), 2- (4, 6-diphenyl-1, 3, 5-triazin-2-yl) -5- [2- (2-ethylhexanoyloxy) ethoxy]Phenol (trade name "ADK STAB LA46", manufactured by ADEKA), 2- (2-hydroxy-4- [ 1-octyloxycarbonyl ] ethoxy)]Phenyl) -4, 6-bis (4-phenylphenyl) -1,3, 5-triazine (trade name "TINUVIN 479", manufactured by BASF corporation) and the like.

As the benzotriazole-based ultraviolet absorber having 1 benzotriazole skeleton in one molecule, there can be mentioned: 2- (2H-benzotriazol-2-yl) -6- (1-methyl-1-phenylethyl) -4- (1, 3-tetramethylbutyl) phenol (commercial product Brand name "TINUVIN 928", manufactured by BASF corporation), 2- (2-hydroxy-5-tert-butylphenyl) -2H-benzotriazole (trade name "TINUVIN PS", manufactured by BASF corporation), phenylpropionic acid and 3- (2H-benzotriazole-2-yl) -5- (1, 1-dimethylethyl) -4-hydroxy (C) _7-9 Ester compounds of side chains and linear alkyl groups (trade name "TINUVIN 384-2", manufactured by BASF company), 2- (2H-benzotriazol-2-yl) -4, 6-bis (1-methyl-1-phenylethyl) phenol (trade name "TINUVIN 900", manufactured by BASF company), 2- (2H-benzotriazol-2-yl) -6- (1-methyl-1-phenylethyl) -4- (1, 3-tetramethylbutyl) phenol (trade name "TINUVIN 928", manufactured by BASF company), reaction products of methyl 3- (3- (2H-benzotriazol-2-yl) -5-tert-butyl-4-hydroxyphenyl) propionate/polyethylene glycol 300 (trade name "TINUVIN 1130", manufactured by BASF company), 2- (2H-benzotriazol-2-yl) P-cresol (trade name "tinuvip", manufactured by BASF company), 2- (2H-benzotriazol-2-yl) -4, 6-bis (1-methyl-1-phenylethyl) phenol (trade name "TINUVIN 234", manufactured by BASF company), and 5-benzotriazol-2-yl-4-hydroxyphenyl) propionate/polyethylene glycol 300 (trade name "TINUVIN 1130", manufactured by BASF company)]-4-methyl-6- (tert-butyl) phenol (trade name "TINUVIN 326", manufactured by BASF), 2- (2H-benzotriazol-2-yl) -4, 6-di-tert-pentylphenol (trade name "TINUVIN 328", manufactured by BASF), 2- (2H-benzotriazol-2-yl) -4- (1, 3-tetramethylbutyl) phenol (trade name "TINUVIN 329", manufactured by BASF), the reaction product of methyl 3- (3- (2H-benzotriazol-2-yl) -5-tert-butyl-4-hydroxyphenyl) propionate with polyethylene glycol 300 (trade name "TINUVIN 213", manufactured by BASF), 2- (2H-benzotriazol-2-yl) -6-dodecyl-4-methylphenol (trade name "TINUVIN571", manufactured by BASF), 2- [ 2-hydroxy-3- (3, 4,5, 6-tetrahydrophthalimidomethyl) -5-methylphenyl ]Benzotriazole (trade name "sumisurb 250", manufactured by sumitomo chemical industries, ltd.) and the like.

Examples of the benzophenone-based ultraviolet absorber (benzophenone-based compound) and the hydroxybenzophenone-based ultraviolet absorber (hydroxybenzophenone-based compound) include: 2, 4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone-5-sulfonic acid (anhydrous and trihydrate), 2-hydroxy-4-octoxybenzophenone, 4-dodecoxy-2-hydroxybenzophenone, 4-benzyloxy-2-hydroxybenzophenone, 2', 4' -tetrahydroxybenzophenone, 2' -dihydroxy-4, 4-dimethoxybenzophenone, and the like.

Examples of the salicylate-based ultraviolet absorbers (salicylate-based compounds) include: phenyl 2-acryloyloxy benzoate, phenyl 2-acryloyloxy-3-methylbenzoate, phenyl 2-acryloyloxy-4-methylbenzoate, phenyl 2-acryloyloxy-5-methylbenzoate, phenyl 2-acryloyloxy-3-methoxybenzoate, phenyl 2-hydroxybenzoate, phenyl 2-hydroxy-3-methylbenzoate, phenyl 2-hydroxy-4-methylbenzoate, phenyl 2-hydroxy-5-methylbenzoate, phenyl 2-hydroxy-3-methoxybenzoate, 2, 4-di-t-butylphenyl 3, 5-di-t-butyl-4-hydroxybenzoate (trade name "TINUVIN 120", manufactured by BASF corporation), and the like.

Examples of the cyanoacrylate ultraviolet absorber (cyanoacrylate compound) include: alkyl 2-cyanoacrylates, cycloalkyl 2-cyanoacrylates, alkoxyalkyl 2-cyanoacrylates, alkenyl 2-cyanoacrylates, alkynyl 2-cyanoacrylates, and the like.

The maximum absorption wavelength of the absorption spectrum of the ultraviolet absorber is preferably in the wavelength range of 300nm to 400nm, more preferably in the wavelength range of 320nm to 380 nm.

Examples of the antioxidant include: phenolic antioxidants, phosphorus-containing antioxidants, sulfur-containing antioxidants and amine antioxidants are used, and at least one selected from them is used. Among them, a phenolic antioxidant is preferable, and a hindered phenolic antioxidant is particularly preferable.

Specific examples of the above phenolic antioxidants include monocyclic phenolic compounds: 2, 6-di-tert-butyl-p-cresol, 2, 6-di-tert-butyl-4-ethylphenol, 2, 6-dicyclohexyl-4-methylphenol, 2, 6-diisopropyl-4-ethylphenol, 2, 6-di-tert-amyl-4-methylphenol, 2, 6-di-tert-octyl-4-n-propylphenol, 2, 6-dicyclohexyl-4-n-octylphenol, 2-isopropyl-4-methyl-6-tert-butylphenol, 2-tert-butyl-4-ethyl-6-tert-octylphenol, 2-isobutyl-4-ethyl-6-tert-hexylphenol, 2-cyclohexyl-4-n-butyl-6-isopropylphenol, styrenated mixed cresols, DL-. Alpha. -tocopherol, [ beta. - (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid stearyl ester and the like; examples of the bicyclic phenol compound include: 2,2' -methylenebis (4-methyl-6-tert-butylphenol), 4' -butylidenebis (3-methyl-6-tert-butylphenol), 4' -thiobis (3-methyl-6-tert-butylphenol), 2' -thiobis (4-methyl-6-tert-butylphenol) 4,4' -methylenebis (2, 6-di-tert-butylphenol), 2' -methylenebis [6- (1-methylcyclohexyl) p-cresol ], 2' -ethylidenebis (4, 6-di-tert-butylphenol) 2,2' -butylidenebis (2-tert-butyl-4-methylphenol), 3, 6-dioxaoctamethylenebis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionate ], triethylene glycol bis [3- (3-tert-butyl-5-methyl-4-hydroxyphenyl) propionate ], 1, 6-hexanediol bis [3- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate ], 2' -thiodiethylene bis [3- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate ], and the like; as the tricyclic phenol compound, there may be mentioned: 1, 3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane, 1,3, 5-tris (2, 6-dimethyl-3-hydroxy-4-tert-butylbenzyl) isocyanurate, 1,3, 5-tris [ (3, 5-di-tert-butyl-4-hydroxyphenyl) propionyloxyethyl ] isocyanurate, tris (4-tert-butyl-2, 6-dimethyl-3-hydroxybenzyl) isocyanurate, 1,3, 5-trimethyl-2, 4, 6-tris (3, 5-di-tert-butyl-4-hydroxybenzyl) benzene, and the like; examples of the tetracyclic phenol compound include: tetrakis [ methylene-3- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate ] methane, and the like; as the phosphorus-containing phenol compound, there can be mentioned: bis (3, 5-di-tert-butyl-4-hydroxybenzylphosphonate ethyl) calcium, bis (3, 5-di-tert-butyl-4-hydroxybenzylphosphonate ethyl) nickel, and the like.

The above deterioration preventing agents may be used singly or in combination of two or more. From the viewpoint of suppressing deterioration such as discoloration during storage and workability of the transfer double-sided adhesive film, for example, the content of the deterioration inhibitor contained in the adhesive composition is preferably 0.01 to 10 parts by weight, more preferably 0.03 to 5 parts by weight, and even more preferably 0.1 to 3 parts by weight, relative to 100 parts by weight of the first adhesive composition.

Any suitable other component may be contained in the adhesive composition constituting the first adhesive layer within a range that does not impair the effects of the present invention. Examples of such other components include: adhesion promoters, inorganic fillers, organic fillers, metal powders, pigments, foils, softeners, plasticizers, conductive agents, surface lubricants, leveling agents, heat stabilizers, polymerization inhibitors, lubricants, solvents, and the like.

< second adhesive layer >

In the transfer double-sided adhesive film of the present invention, the second adhesive layer is an adhesive layer for temporary fixation to a carrier substrate, and preferably includes a releasable adhesive layer. The configuration in which the second adhesive layer includes a releasable adhesive layer is preferable in that the second adhesive layer can be released from the carrier substrate without contamination such as a tacky paste residue and reworkability can be improved.

The second adhesive layer described above can be made into a releasable adhesive layer by: the adhesiveness is adjusted by the kind or composition of the adhesive, the degree of crosslinking, and the like; the adhesive force is lowered by physical stimulation of electromagnetic waves such as heat and ultraviolet rays.

The adhesive force of the second adhesive layer can be controlled by adjusting the type or composition of the adhesive to be formed, the degree of crosslinking, and the like; the WBL (weak interface layer) is formed by blending a light release agent and a plasticizer.

In the transfer double-sided adhesive film of the present invention, the thickness of the second adhesive layer is not particularly limited, and is preferably 1 μm or more, more preferably 3 μm or more. When the thickness is a certain value or more, the second adhesive layer is preferably easily and stably fixed to the carrier substrate. The upper limit of the thickness of the second adhesive layer is not particularly limited, but is preferably 30 μm, and more preferably 20 μm. When the thickness is equal to or less than a predetermined value, the second adhesive layer is easily peeled from the carrier substrate, and reworkability is preferably improved.

The pressure-sensitive adhesive constituting the second pressure-sensitive adhesive layer is not particularly limited, and examples thereof include: the silicone-based adhesive, urethane-based adhesive, acrylic-based adhesive, rubber-based adhesive, polyester-based adhesive, polyamide-based adhesive, epoxy-based adhesive, vinyl alkyl ether-based adhesive, fluorine-containing adhesive, and the like used in the first adhesive layer. Among them, silicone adhesives, urethane adhesives, and acrylic adhesives are preferable, urethane adhesives and acrylic adhesives are more preferable, and acrylic adhesives are still more preferable, from the viewpoint of being able to be peeled from a carrier substrate without contamination such as adhesive residue and improving reworkability.

The second adhesive layer in the transfer double-sided adhesive film of the present invention may be an adhesive layer (adhesive force-reducible adhesive layer) which can intentionally reduce adhesive force by an action from the outside during use of the transfer double-sided adhesive film, or an adhesive layer (adhesive force-nondegradable adhesive layer) which hardly or completely reduces adhesive force by an action from the outside during use of the transfer double-sided adhesive film, and may be appropriately selected according to a method, conditions, and the like of transferring an electronic component using the transfer double-sided adhesive film of the present invention.

In the case where the second adhesive layer is an adhesive force-reducible adhesive layer, in the manufacturing process, the use process of the transfer double-sided adhesive film of the present invention, a state in which the second adhesive layer exhibits a relatively high adhesive force and a state in which it exhibits a relatively low adhesive force can be flexibly used. For example, in the use of the double-sided adhesive film for transfer of the present invention, in the step of receiving an electronic component by the first adhesive layer, a state in which the second adhesive layer exhibits a relatively high adhesive force can be suppressed and prevented from lifting off the carrier substrate. On the other hand, in the process of peeling the transfer double-sided adhesive film of the present invention from the carrier substrate, reworkability can be improved by reducing the adhesive force of the second adhesive layer.

Examples of the adhesive agent for forming such an adhesive agent layer with reduced adhesive force include: radiation curable adhesives, heat foamable adhesives, and the like. The adhesive forming the adhesive force-reducible adhesive layer can be used singly or in combination of two or more.

As the radiation curable adhesive, for example, an adhesive of a type curable by irradiation with electron rays, ultraviolet rays, α rays, β rays, γ rays, or X rays can be used, and particularly, an adhesive of a type curable by ultraviolet rays irradiation (ultraviolet curable adhesive) can be preferably used.

Examples of the radiation curable adhesive include: an additive type radiation curable adhesive comprising a base polymer such as an acrylic polymer and a radiation polymerizable monomer component or oligomer component having a functional group such as a radiation polymerizable carbon-carbon double bond.

As the base polymer, the same acrylic polymer as the first adhesive layer can be used. The ratio of the hydrocarbon group-containing (meth) acrylate is preferably 40 mass% or more, more preferably 60 mass% or more, of all the monomer components for forming the acrylic polymer, from the viewpoint of properly exhibiting basic properties such as adhesiveness derived from the hydrocarbon group-containing (meth) acrylate, and easy control of adhesiveness and releasability.

The acrylic polymer may contain a hydroxyl group-containing monomer. In the case where the acrylic polymer in the second adhesive layer contains a hydroxyl group-containing monomer, the second adhesive layer is easy to obtain a moderate cohesive force. The ratio of the hydroxyl group-containing monomer in the acrylic polymer is, for example, 0.1 to 30% by mass, preferably 0.5 to 20% by mass, from the viewpoint of achieving moderate tackiness and cohesive force of the second pressure-sensitive adhesive layer.

The acrylic polymer may contain a carboxyl group-containing monomer. In the case where the acrylic polymer in the second adhesive layer contains a carboxyl group-containing monomer, the second adhesive layer is easy to obtain moderate adhesive reliability. The ratio of the carboxyl group-containing monomer in the acrylic polymer is, for example, 0.1 to 30% by mass, preferably 0.5 to 20% by mass, from the viewpoint of achieving a suitable adhesive reliability of the second adhesive layer.

The acrylic polymer may contain a vinyl ester monomer. In the case where the acrylic polymer in the second adhesive layer contains a vinyl ester monomer, the second adhesive layer is easy to obtain a moderate cohesive force. The ratio of the vinyl ester monomer in the acrylic polymer is, for example, 0.1 to 60% by mass, preferably 0.5 to 50% by mass, from the viewpoint of achieving a suitable cohesive force of the second pressure-sensitive adhesive layer.

The acrylic adhesive composition forming the second adhesive layer may contain a crosslinking agent. For example, the acrylic polymer can be crosslinked to further reduce low molecular weight species in the second adhesive layer. In addition, the mass average molecular weight of the acrylic polymer can be improved to control low adhesion and peelability. Examples of the crosslinking agent include: the polyisocyanate compound, the epoxy compound, the polyol compound (polyhydric phenol compound, etc.), the aziridine compound, the melamine compound, etc., preferably an isocyanate-based crosslinking agent and/or an epoxy-based crosslinking agent. When the crosslinking agent is used, the amount of the crosslinking agent to be used is preferably about 10 parts by mass or less, more preferably 0.1 to 10 parts by mass, based on 100 parts by mass of the acrylic polymer.

The acrylic adhesive composition forming the second adhesive layer may use a crosslinking accelerator. The kind of the crosslinking accelerator can be appropriately selected according to the kind of the crosslinking agent used. In the present specification, the crosslinking accelerator means a catalyst that increases the rate of a crosslinking reaction using a crosslinking agent. Examples of such a crosslinking accelerator include: tin (Sn) -containing compounds such as dioctyltin dilaurate, dibutyltin diacetate, dibutyltin diacetylacetonate, tetra-n-butyltin, and trimethyltin hydroxide; n-containing compounds such as amines including N, N, N ', N' -tetramethylhexamethylenediamine and triethylamine, and imidazoles; etc. Among them, sn-containing compounds are preferable. The use of these crosslinking accelerators is particularly effective in the case where a hydroxyl group-containing monomer is used as the above-mentioned secondary monomer and an isocyanate-based crosslinking agent is used as the crosslinking agent. The amount of the crosslinking accelerator contained in the adhesive composition can be set to, for example, about 0.001 to about 0.5 parts by mass (preferably about 0.001 to about 0.1 parts by mass) per 100 parts by mass of the acrylic polymer.

Examples of the radiation polymerizable monomer component include: urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1, 4-butanediol di (meth) acrylate, and the like. Examples of the radiation-polymerizable oligomer component include: various oligomers such as polyurethanes, polyethers, polyesters, polycarbonates, and polybutadienes, and preferably have a molecular weight of about 100 to about 30000. The content of the radiation-curable monomer component and the oligomer component in the radiation-curable adhesive forming the second adhesive layer is, for example, about 5 parts by mass to about 500 parts by mass, and preferably about 40 parts by mass to about 150 parts by mass, with respect to 100 parts by mass of the base polymer. Further, as the additive type radiation curable adhesive, for example, the radiation curable adhesive disclosed in Japanese patent application laid-open No. 60-196956 can be used.

The radiation curable adhesive may be: an internal radiation curable adhesive comprising a base polymer having functional groups such as radiation-polymerizable carbon-carbon double bonds in the polymer side chains, in the polymer main chain, and at the polymer main chain terminals. When such an internal type radiation curable adhesive is used, unexpected changes in adhesive properties over time due to migration of low molecular weight components in the formed second adhesive layer tend to be suppressed.

The base polymer contained in the internal type radiation curable adhesive is preferably an acrylic polymer. Examples of the method for introducing a radiation polymerizable carbon-carbon double bond into an acrylic polymer include the following methods: an acrylic polymer is obtained by polymerizing (copolymerizing) a raw material monomer containing a monomer component having a first functional group, and then a compound having a second functional group capable of reacting with the first functional group and a radiation polymerizable carbon-carbon double bond is subjected to a condensation reaction or an addition reaction with the acrylic polymer in a state where the radiation polymerizability of the carbon-carbon double bond is maintained.

Examples of the combination of the first functional group and the second functional group include: carboxyl and epoxy, epoxy and carboxyl, carboxyl and aziridinyl, aziridinyl and carboxyl, hydroxyl and isocyanate, isocyanate and hydroxyl groups, and the like. Among them, a combination of a hydroxyl group and an isocyanate group and a combination of an isocyanate group and a hydroxyl group are preferable from the viewpoint of easy follow-up of the reaction. Among them, from the viewpoint of high technical difficulty in producing a polymer having an isocyanate group with high reactivity, but easiness in producing and obtaining an acrylic polymer having a hydroxyl group, a combination in which the first functional group is a hydroxyl group and the second functional group is an isocyanate group is preferable. Examples of the compound having an isocyanate group and a radiation-polymerizable carbon-carbon double bond, that is, the isocyanate compound having a radiation-polymerizable unsaturated functional group include: methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl- α, α -dimethylbenzyl isocyanate, and the like. The acrylic polymer having a hydroxyl group includes: a polymer comprising structural units derived from ether compounds such as the above-mentioned hydroxyl group-containing monomers, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether and the like.

The radiation curable adhesive preferably contains a photopolymerization initiator. Examples of the photopolymerization initiator include: alpha-ketol compounds, acetophenone compounds, benzoin ether compounds, ketal compounds, aromatic sulfonyl chloride compounds, photoactive oxime compounds, benzophenone compounds, thioxanthone compounds, camphorquinone, halogenated ketone, acyl phosphine oxide, acyl phosphonate and the like. Examples of the α -ketol compound include: 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) methanone, alpha-hydroxy-alpha, alpha' -dimethyl acetophenone, 2-methyl-2-hydroxy propiophenone, 1-hydroxycyclohexyl phenyl methanone, and the like. Examples of the acetophenone compound include: methoxyacetophenone, 2-dimethoxy-2-phenylacetophenone, 2-diethoxyacetophenone, 2-methyl-1- [4- (methylthio) phenyl ] -2-morpholinopropane-1, and the like. Examples of the benzoin ether compound include: benzoin diethyl ether, benzoin isopropyl ether, anisoin methyl ether, and the like. Examples of the ketal compounds include: benzil dimethyl ketal, and the like. Examples of the aromatic sulfonyl chloride compound include: 2-naphthalenesulfonyl chloride, and the like. Examples of the photoactive oxime compound include: 1-phenyl-1, 2-propanedione-2- (O-ethoxycarbonyl) oxime and the like. Examples of the benzophenone compound include: benzophenone, benzoyl benzoic acid, 3' -dimethyl-4-methoxybenzophenone, and the like. Examples of the thioxanthone compound include: thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2, 4-dimethylthioxanthone, isopropylthioxanthone, 2, 4-dichlorothioxanthone, 2, 4-diethylthioxanthone, 2, 4-diisopropylthioxanthone, and the like. The content of the photopolymerization initiator in the radiation curable adhesive is, for example, 0.05 to 20 parts by mass relative to 100 parts by mass of the base polymer.

The heat-expandable adhesive is an adhesive containing a component (a foaming agent, thermally expandable microspheres, etc.) that expands when heated. Examples of the foaming agent include various inorganic foaming agents and organic foaming agents. Examples of the inorganic foaming agent include: ammonium carbonate, ammonium bicarbonate, sodium bicarbonate, ammonium nitrite, sodium borohydride, azide compounds, and the like. Examples of the organic foaming agent include: chlorofluoroalkanes such as trichlorofluoromethane and dichlorofluoromethane; azo compounds such as azobisisobutyronitrile, azodicarbonamide and barium azodicarbonate; hydrazine compounds such as p-toluenesulfonyl hydrazide, diphenyl sulfone-3, 3 '-disulfonyl hydrazide, 4' -oxo-bis (benzenesulfonyl hydrazide) and allylbis (sulfonyl hydrazide); semicarbazide compounds such as p-toluenesulfonyl semicarbazide and 4,4' -oxo-bis (benzenesulfonyl semicarbazide); triazole compounds such as 5-morpholino-1, 2,3, 4-thiatriazole; n-nitroso compounds such as N, N ' -dinitroso pentamethylene tetramine and N, N ' -dimethyl-N, N ' -dinitroso terephthalamide. Examples of the thermally expandable microspheres include: microspheres of a substance that is easily vaporized by heating and expands are enclosed in a shell. Examples of the substance that is easily gasified by heating and expands include: isobutane, propane, pentane, and the like. Thermally expandable microspheres can be produced by encapsulating a substance that is easily vaporized by heating and expands in a shell-forming substance by a coagulation method, an interfacial polymerization method, or the like. As the shell-forming substance, use can be made of: a substance exhibiting thermal melting property, and a substance which can be broken by the effect of thermal expansion of the enclosed substance. Examples of such substances include: vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, polysulfone, and the like.

Examples of the pressure-sensitive adhesive layer that does not reduce the adhesive force include a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer includes an adhesive layer having a form in which the adhesive layer formed of the radiation-curable adhesive described above with respect to the adhesive force-reducible adhesive layer is cured by irradiation with radiation in advance, but has a constant adhesive force. The adhesive forming the adhesive layer whose adhesive force is not reduced can be used singly or in combination of two or more. The second adhesive layer may be an adhesive strength-reducing adhesive layer as a whole, or a part of the second adhesive layer may be an adhesive strength-reducing adhesive layer. For example, in the case where the second adhesive layer has a single-layer structure, the second adhesive layer may be an adhesive force-non-decreasing adhesive layer as a whole, or a specific portion of the second adhesive layer may be an adhesive force-non-decreasing adhesive layer and the other portion may be an adhesive force-decreasing adhesive layer. In the case where the second adhesive layer has a laminated structure, all of the adhesive layers in the laminated structure may be adhesive layers having no reduced adhesive strength, or some of the adhesive layers in the laminated structure may be adhesive layers having no reduced adhesive strength.

The adhesive layer (radiation-curable adhesive layer after radiation irradiation) in the form of an adhesive layer formed by a radiation-curable adhesive in advance (radiation-curable adhesive layer after non-radiation irradiation) exhibits adhesion due to the polymer component contained even if the adhesion is reduced by radiation irradiation, and can exhibit the adhesion required at a minimum for the transfer double-sided adhesive film of the present invention. In the case of using the radiation-curable adhesive layer after radiation irradiation, the second adhesive layer may be the radiation-curable adhesive layer after radiation irradiation as a whole in the direction of surface expansion of the second adhesive layer, or a part of the second adhesive layer may be the radiation-curable adhesive layer after radiation irradiation and the other part may be the radiation-curable adhesive layer without radiation irradiation. In the present specification, the term "radiation curable adhesive layer" means an adhesive layer formed of a radiation curable adhesive, and includes both a radiation curable adhesive layer having radiation curability and not irradiated with radiation and a radiation curable adhesive layer after the adhesive layer is cured by irradiation with radiation.

As the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer, a known or conventional pressure-sensitive adhesive can be used, and an acrylic adhesive using an acrylic polymer as a base polymer can be preferably used. In the case where the second adhesive layer contains an acrylic polymer as the pressure-sensitive adhesive, the acrylic polymer is preferably a polymer containing a structural unit derived from (meth) acrylate as the most structural unit in terms of mass ratio. As the acrylic polymer, for example, the acrylic polymer described as the acrylic polymer that can be contained in the additive type radiation curable adhesive can be used.

< substrate >

The base material in the transfer double-sided adhesive film of the present invention is a component that functions as a support in the first adhesive layer and the second adhesive layer. Examples of the substrate include plastic substrates (particularly plastic films). The substrate may be a single layer, or may be a laminate of substrates of the same kind or different kinds.

Examples of the resin constituting the plastic base material include: polyolefin resins such as low density polyethylene, linear low density polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, random copolymer polypropylene, block copolymer polypropylene, homo-polypropylene, polybutene, polymethylpentene, ethylene-vinyl acetate copolymer (EVA), ionomer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester (random, alternating) copolymer, ethylene-butene copolymer, ethylene-hexene copolymer, and the like; polyurethane; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate, polybutylene terephthalate (PBT), and the like; a polycarbonate; polyimide; polyether ether ketone; a polyetherimide; polyamides such as aromatic polyamides and wholly aromatic polyamides; polyphenylene sulfide; fluorine-containing resin; polyvinyl chloride; polyvinylidene chloride; a cellulose resin; silicone resins, and the like. The base material preferably contains a heat-resistant resin such as Polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyamide (PA), polyether ether ketone (PEEK) or the like as a main component, and more preferably contains polyimide as a main component, from the viewpoint of exhibiting good heat resistance that is less likely to cause expansion or shrinkage due to heat when an electronic component received by the transfer double-sided adhesive film of the present invention is transferred onto a mounting substrate by thermocompression bonding (e.g., 150 ℃) and mounted with high accuracy. The main component of the base material is a component that occupies the largest mass ratio among the constituent components. The above resins can be used singly or in combination of two or more. In the case where the second adhesive layer is a radiation curable adhesive layer as described above, the substrate preferably has radiation transmittance.

In the case where the base material is a plastic film, the plastic film may be unoriented or may be oriented in at least one direction (uniaxial direction, biaxial direction, or the like), but is not likely to exhibit heat shrinkability when unoriented, and is therefore preferable.

For improving the adhesion to the adhesive layer, the retention property, and the like, physical treatments such as corona discharge treatment, plasma treatment, sanding treatment, ozone exposure treatment, flame exposure treatment, high-voltage shock exposure treatment, and ionizing radiation treatment may be performed on the surface of the substrate on the first adhesive layer and/or the second adhesive layer side; chemical treatments such as chromic acid treatment; a coating agent (primer); surface treatment such as easy adhesion treatment by silicone primer treatment. In addition, in order to impart antistatic ability, a conductive vapor deposition layer containing a metal, an alloy, an oxide thereof, or the like may be provided on the surface of the substrate, and a conductive polymer such as PEDOT-PSS may be applied. The entire surface of the adhesive layer side of the substrate is preferably subjected to a surface treatment for improving adhesion.

From the viewpoint of ensuring the strength with which the substrate functions as a support in the transfer double-sided adhesive film of the present invention, the thickness of the substrate is preferably 5 μm or more, more preferably 10 μm or more, still more preferably 15 μm or more, and particularly preferably 20 μm or more. In addition, from the viewpoint of achieving moderate flexibility of the transfer double-sided adhesive film of the present invention, the thickness of the base material is preferably 200 μm or less, more preferably 180 μm or less, and still more preferably 150 μm or less.

< spacer >

The adhesive layer surface (the adhesive surface of the first adhesive layer and the second adhesive layer) of the transfer double-sided adhesive film of the present invention is protected by a release liner (separator) until the time of use. The separator is used as a protective material for the adhesive layer and is peeled off when the adhesive film is attached to an adherend.

As the separator, a conventional release paper or the like can be used, and specifically, for example, a separator of the type described above can be used: a substrate having a release layer obtained by using a release treatment agent on at least one surface; and a low-tackiness substrate comprising a fluorine-containing polymer (for example, polytetrafluoroethylene, chlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, chlorofluoroethylene-vinylidene fluoride copolymer, etc.), a low-tackiness substrate comprising a nonpolar polymer (for example, an olefin resin such as polyethylene, polypropylene, etc.), etc.

As the separator, for example, a separator having a release layer formed on at least one surface of a separator base material can be preferably used. Examples of such a separator substrate include: plastic base material films (synthetic resin films) such as polyester films (polyethylene terephthalate films and the like), olefin resin films (polyethylene films, polypropylene films and the like), polyvinyl chloride films, polyimide films, polyamide films (nylon films), rayon films and the like; papers (fine papers, japanese papers, kraft papers, cellophane, synthetic papers, surface-coated papers, etc.); and a substrate (2-layer to 3-layer composite) obtained by laminating, coextruding, or the like.

The release agent constituting the release layer is not particularly limited, and for example, a silicone release agent, a fluorine-containing release agent, a long-chain alkyl release agent, a fatty acid amide release agent, or the like can be used, and among these, a silicone release agent is preferable. The peeling agent may be used singly or in combination of two or more. Since the first adhesive layer includes a low-adhesion adhesive layer, a substrate that is not treated with a release treatment agent can also be used as a separator.

From the viewpoint of adjusting F (1) and T (1) to the above numerical ranges, the thickness of the release layer of the first separator is preferably 10nm to 2000nm, more preferably 20nm to 500nm, still more preferably 30nnm to 150nnm, particularly preferably 40nm to 80nm.

From the viewpoint of adjusting F (2), P' (2) and T (2) to the above numerical ranges, the thickness of the release layer of the second separator is preferably 10nm to 2000nm, more preferably 30nm to 500nm, still more preferably 50nm to 250nm, particularly preferably 70nm to 150nm.

The thickness of the release layer of the first separator is preferably smaller than the thickness of the release layer of the second separator.

In order to prevent adverse effects on the electronic component, the separator may be provided with an antistatic layer on at least one surface of the separator substrate. The antistatic layer may be formed on one surface (the release treated surface or the untreated surface) of the separator, or may be formed on both surfaces (the release treated surface and the untreated surface) of the separator.

As the antistatic agent contained in the antistatic resin, there may be mentioned: quaternary ammonium salt and pyridineSalts with primaryCationic antistatic agents with cationic functional groups such as amino groups, secondary amino groups, tertiary amino groups and the like; anionic antistatic agents having anionic functional groups such as sulfonates, sulfate salts, phosphonates, and phosphate salts; amphoteric antistatic agents such as alkyl betaines and derivatives thereof, imidazolines and derivatives thereof, alanine and derivatives thereof; amino alcohol and its derivatives, glycerol and its derivatives, polyethylene glycol and its derivatives, and other nonionic antistatic agents; and an ion-conductive polymer obtained by polymerizing or copolymerizing a monomer having the above-mentioned cationic, anionic, or zwitterionic ion-conductive group. These compounds can be used singly or in combination of two or more.

From the viewpoint of adjusting F (1) and T (1) to the above numerical ranges, the thickness of the first separator is preferably 1 μm to 150 μm, more preferably 5 μm to 100 μm, still more preferably 10 μm to 80 μm.

From the viewpoint of adjusting F (2), P' (2) and T (2) to the above-mentioned numerical ranges, the thickness of the second spacer is preferably 10 μm to 150 μm, more preferably 15 μm to 100 μm, still more preferably 20 μm to 80 μm.

The method for producing the laminated film of the present invention is not particularly limited, and may be any known method, for example, the following methods (1) to (4) may be used.

(1) A method of producing an adhesive film by applying (coating) the adhesive composition described above onto a substrate to form a composition layer, and curing (for example, thermally curing, curing by irradiation with active energy rays such as ultraviolet rays) the composition layer to form an adhesive layer.

(2) A method of producing an adhesive film by applying (coating) the adhesive composition described above onto a separator to form a composition layer, curing the composition layer (for example, thermally curing, curing by irradiation of active energy rays such as ultraviolet rays) to form an adhesive layer, and then transferring the adhesive layer onto a substrate.

(3) And a method of producing an adhesive film by applying (coating) the adhesive composition to a substrate and drying the same to form an adhesive layer.

(4) A method of manufacturing an adhesive film by applying (coating) the above adhesive composition onto a separator and drying it to form an adhesive layer, and then transferring the adhesive layer onto a substrate.

The curing methods (1) to (4) are preferably heat curing from the viewpoint of excellent productivity and the ability to form a uniform and smooth-surfaced adhesive layer.

As a method of applying (coating) the adhesive composition on a predetermined surface, a known application method can be used, and examples thereof are not particularly limited: roll coating, roll licking coating, gravure coating, reverse coating, roll brushing, spray coating, dip roll coating, bar coating, doctor blade coating, air knife coating, curtain coating, lip die coating, extrusion coating using a die coater, and the like.

The thickness (total thickness) of the transfer double-sided adhesive film of the present invention is not particularly limited, and is preferably 10 μm or more, more preferably 15 μm or more. When the thickness is a certain value or more, the first adhesive layer is preferable in that it is easy to receive electronic components with high accuracy. The upper limit of the thickness (total thickness) of the transfer double-sided adhesive film of the present invention is not particularly limited, but is preferably 500 μm, more preferably 300 μm. When the thickness is equal to or less than a predetermined value, it is preferable that the electronic component be easily transferred to the mounting board with high accuracy.

The transfer double-sided adhesive film of the present invention can be suitably used for a method of mounting an electronic component on a mounting substrate. The method for mounting an electronic component on a mounting substrate using the transfer double-sided adhesive film of the present invention preferably includes the following steps.

And a step (first step) of receiving the cut electronic component by the first adhesive layer of the transfer double-sided adhesive film.

And a step (second step) of transferring the electronic component received by the first adhesive layer onto a mounting board.

Fig. 2 is a schematic cross-sectional view showing an embodiment of a first step in a method of mounting an electronic component on a mounting substrate using the transfer double-sided adhesive film of the present invention.

In fig. 2 (a), the transfer double-sided adhesive film 1 is attached to the carrier substrate 22 by the adhesive surface of the second adhesive layer 12. The carrier substrate 22 may have a marking pattern on a surface thereof to which the second adhesive layer 12 is attached, for disposing electronic components. Since the transfer double-sided adhesive film 1 has high transparency, the mark pattern provided on the carrier substrate 22 can be visually recognized.

The plurality of electronic components 21, which are cut into individual pieces, are disposed on the upper portion of the adhesive surface of the first adhesive layer 11 of the transfer double-sided adhesive film 1 so as to face and be separated from the adhesive surface of the first adhesive layer 11 in a state of being attached to the dicing tape 20.

In fig. 2 (b), the electronic component 21 is pressed by the ejector pin member 23 from the surface of the dicing tape 20 to which the electronic component 21 is not attached, so that the electronic component 21 approaches the adhesive surface of the first adhesive layer 11, and the adhesive surface of the first adhesive layer 11 receives the electronic component 21. The reception may be performed by bringing the electronic component 21 into contact with the first adhesive layer 11, or may be performed in a noncontact manner. In the case of receiving in a noncontact manner, the electronic component 21 is pushed until the electronic component 21 is peeled off from the dicing tape 20, and the electronic component 21 is dropped onto the adhesive surface. In the case of receiving by bringing them into contact, since the adhesive surface of the first adhesive layer 11 is low in adhesiveness, the stress at the time of receiving the electronic component 21 is weak, and therefore damage to the electronic component 21 can be suppressed. In the case of receiving in a noncontact manner, since the adhesive surface of the first adhesive layer 11 is low in adhesiveness, the dropped electronic component 21 can be captured with good positional accuracy. Instead of the ejector member 23, the electronic component 21 may be peeled from the dicing tape 20 by irradiation with ultraviolet rays, laser beams, or the like.

The electronic component 21 may be received onto the first adhesive layer 11 singly or in plural at one time. Fig. 2 (c) is a schematic sectional view showing a state in which all the electronic components 21 on the dicing tape 20 are received on the adhesive surface of the first adhesive layer 11 of the double-sided adhesive film 1 for transfer.

Fig. 3 is a schematic sectional view showing a second step in a method of mounting an electronic component on a mounting substrate using the transfer double-sided adhesive film of the present invention.

As shown in fig. 3 a, the electronic components 21 arranged on the adhesive surface of the first adhesive layer 11 of the transfer double-sided adhesive film 1 are arranged on the circuit surface 31 (circuit pattern is not shown) of the mounting substrate 30 so as to be opposed to each other and separated from each other. Next, as shown in fig. 4 (b), the circuit surface 31 of the mounting substrate 30 is brought into proximity with the electronic component 21 arranged on the adhesive surface of the first adhesive layer 11 of the transfer double-sided adhesive film 1, so that the electronic component 21 is brought into contact with the circuit surface 31 of the mounting substrate 30.

The transfer of the electronic component 21 onto the circuit surface 31 of the mounting substrate 30 may be performed by thermocompression bonding (e.g., 150 ℃ for 1 minute). The substrate 10, the first adhesive layer 11, and/or the second adhesive layer 12 constituting the transfer double-sided adhesive film 1 are excellent in heat resistance, and therefore are less likely to expand, shrink, or change in adhesive force due to thermocompression bonding, and therefore can transfer the electronic component 21 onto the circuit surface 31 of the mounting substrate 30 with high accuracy.

Next, as shown in fig. 3 (c), the transfer double-sided adhesive film 1 is separated from the mounting substrate 30, whereby the electronic component 21 is peeled off from the first adhesive layer 11 and transferred to the circuit surface 31 of the mounting substrate 30. Since the first adhesive layer 11 is composed of a low-adhesion adhesive layer, the electronic component 21 is easily peeled off, and the electronic component 21 can be efficiently mounted on the mounting substrate 30 without damaging the electronic component.

The transfer double-sided adhesive film 1 of fig. 3 (c) after the electronic component 21 is mounted on the mounting substrate 30 can be peeled off from the carrier substrate 22 (not shown). Since the second adhesive layer 12 is composed of a releasable adhesive layer, it can be released without leaving a paste, and the reworkability is excellent, so that the carrier substrate 22 can be easily recycled.

The electronic component to be mounted on the mounting substrate is not particularly limited, and a fine and thin semiconductor chip or LED chip can be suitably used.

Examples

The present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples.

Production example 1 > production of acrylic copolymer (1)

Into a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen inlet tube and a condenser, 95 parts by weight of butyl acrylate (manufactured by Nippon catalyst Co., ltd.), 5 parts by weight of acrylic acid (manufactured by Toyama Co., ltd.), 0.2 parts by weight of 2,2' -azobisisobutyronitrile (manufactured by Wako pure chemical industries, ltd.) as a polymerization initiator and 156 parts by weight of ethyl acetate were charged, and nitrogen was slowly introduced while maintaining the liquid temperature in the flask at around 63℃and polymerization was carried out for 10 hours, to thereby prepare a solution (solid content: 40% by weight) of the acrylic copolymer (1) having a weight average molecular weight.

Production example 2 > production of acrylic copolymer (2)

2.8 parts by weight of 80% Acrylic Acid (AA) (manufactured by Osaka organic chemical Co., ltd.), 44 parts by weight of 2-ethylhexyl acrylate (2 EHA) (manufactured by Japanese catalyst Co., ltd.), 35.2 parts by weight of vinyl acetate (manufactured by electric Co., ltd.) and 20 parts by weight of toluene were charged into a four-necked flask having a stirring blade, a thermometer, a nitrogen gas introduction tube and a condenser, and nitrogen gas was introduced while stirring slowly, and stirring was performed for 1 hour. Then, 0.2 parts by weight of Nyper BW (manufactured by daily oil corporation) as a polymerization initiator diluted with 96 parts by weight of toluene was added dropwise, and the liquid temperature in the flask was kept around 40 ℃. Then, the temperature of the liquid in the flask was raised to 60℃for 8 hours to carry out polymerization, and then, the temperature was raised to 95℃and stirred for 4 hours, whereby a solution (solid content: 35% by weight) of the acrylic copolymer (2) having a weight average molecular weight of 56 ten thousand was prepared.

PREPARATION EXAMPLE 3 preparation of spacer (1)

100 parts by weight of a silicone release agent (KS-847, manufactured by Xinyue chemical Co., ltd.) and 3.0 parts by weight of a catalyst (CAT-PL-50T, manufactured by Xinyue chemical Co., ltd.) were diluted to 1.0 parts by weight with toluene, whereby a silicone-based release treatment liquid was obtained. The obtained silicone-based release treatment liquid was applied to the surface of a base film (thickness: 50 μm, trade name: diafoil T100-50S ", manufactured by Mitsubishi chemical Co., ltd.) as a release layer by a wire bar so that the thickness after drying was 50nm, and cured and dried (release treatment A) at a drying temperature of 130℃for 3 minutes, thereby producing a separator (1) comprising a laminate of [ release layer (thickness: 50nm, release treatment A) ]/[ base layer ].

PREPARATION EXAMPLE 4 preparation of spacer (2)

A separator (2) comprising a laminate of [ release layer (thickness 100nm, release treatment B) ]/[ substrate layer ] was produced in the same manner as in production example 3, except that the release layer was obtained by coating with a substrate film (thickness 25 μm, trade name "Diafoil T100-25", manufactured by mitsubishi chemical co., ltd.) so that the thickness after drying was 100 nm. In addition, spacers used as the second spacers were produced by arbitrarily changing the thickness of the base film as described in table 1.

PREPARATION EXAMPLE 5 preparation of spacer (3)

A separator (3) comprising a laminate of [ release layer (thickness 50nm, release treatment C) ]/[ base layer ] was produced in the same manner as in production example 3, except that the catalyst (CAT-PL-50T manufactured by Xinyue chemical Co., ltd.) was changed to 1.0 part by weight.

Example 1 >

100 parts by weight of a silicone-based adhesive (addition reaction type silicone-based adhesive, trade name "X-40-3306", manufactured by Xinyue chemical Co., ltd.), 1.4 parts by weight of a platinum-based catalyst 1 (trade name "CAT-PL-50T", manufactured by Xinyue chemical Co., ltd.), and 5 parts by weight of a silicone-based release agent 1 (addition reaction type silicone-based release agent having dimethylpolysiloxane as a main component, trade name "KS-776A", manufactured by Xinyue chemical Co., ltd.) were added, diluted with toluene so that the entire solid content was 25% by weight, and mixed with a disperser, thereby preparing a silicone-based adhesive composition.

The silicone adhesive composition was applied to a substrate film (silicone primer-treated polyester film having a thickness of 75 μm, trade name "Diafoil MRF#75", manufactured by Mitsubishi resin Co., ltd.) so that the thickness of the paste after drying was 10. Mu.m, and the silicone primer-treated surface was cured and dried at a drying temperature of 120℃for 5 minutes. In this way, a film having a silicone-based adhesive layer on the silicone primer-treated layer of the substrate film was obtained.

The release layer side of the separator (1) produced in production example 3 as the first separator was bonded to the silicone-based adhesive layer to protect the silicone-based adhesive layer, thereby obtaining a laminate (1) having a laminate structure of [ first separator layer ]/[ silicone-based adhesive layer ]/[ substrate film layer ].

Next, 100 parts by weight of tetra d-C (manufactured by mitsubishi gas chemical company) as a crosslinking agent in terms of solid content was added to the solution of the acrylic copolymer (1) obtained in production example 1, and 6 parts by weight of tetra d-C was diluted with ethyl acetate so that the solid content of the whole was 25% by weight, and the acrylic adhesive composition (1) stirred by a disperser was applied to the release layer side of the second separator (2)) so that the thickness after drying was 5 μm by a dipping roll, and cured and dried at a drying temperature of 130 ℃ for 30 seconds. An acrylic adhesive layer (1) is formed on the second separator in this manner.

Next, the substrate film side (non-silicone primer treated surface) of the laminate (1) obtained above was bonded to the surface of the acrylic pressure-sensitive adhesive layer (1), thereby obtaining a laminated film having a laminated structure of [ first separator layer ]/[ silicone pressure-sensitive adhesive layer (first pressure-sensitive adhesive layer) ]/[ substrate film layer ]/[ acrylic pressure-sensitive adhesive (1) layer (second pressure-sensitive adhesive layer) ]/[ second separator layer ].

Example 2 >

A laminated film was obtained in the same manner as in example 1, except that the thickness of the paste after drying of the silicone-based adhesive agent of the first adhesive agent layer was adjusted to 25 μm, and a separator obtained by changing the base film in the separator (2) to a base film (thickness 38 μm, trade name "Diafoil T100C38", manufactured by mitsubishi chemical corporation) was used instead of the separator (2) for the second separator.

Example 3 >

A laminated film was obtained in the same manner as in example 1, except that the thickness of the paste after drying of the silicone-based adhesive of the first adhesive layer was adjusted to 50 μm, and a separator obtained by changing the base film in the separator (2) to a base film (thickness: 50 μm, trade name: diafoil T100-50S ", manufactured by mitsubishi chemical corporation) was used instead of the separator (2) for the second separator.

Example 4 >

A laminated film was obtained in the same manner as in example 1, except that the thickness of the paste after drying of the silicone-based adhesive agent of the first adhesive agent layer was adjusted to 75 μm, and a separator obtained by changing the base film in the separator (2) to a base film (thickness: 75 μm, trade name "Diafoil T100-75S", manufactured by mitsubishi chemical corporation) was used instead of the separator (2) for the second separator.

Example 5 >

A laminated film was obtained in the same manner as in example 1 except that the thickness of the paste after drying of the silicone-based adhesive of the first adhesive layer was adjusted to 50 μm, and the separator (2) was used for the first separator.

Example 6 >

A laminated film was obtained in the same manner as in example 5, except that the thickness of the paste after drying of the silicone-based adhesive of the first adhesive layer was adjusted to 75 μm.

Example 7 >

A laminated film was obtained in the same manner as in example 1, except that the thickness of the paste after drying of the silicone-based adhesive of the first adhesive layer was adjusted to 25 μm, the separator (3) was used as the first separator, and the acrylic adhesive (2) was used in place of the acrylic adhesive (1) for the first adhesive layer.

Example 8 >

A laminated film was obtained in the same manner as in example 7, except that the thickness of the paste after drying of the silicone-based adhesive of the first adhesive layer was adjusted to 50 μm.

Example 9 >

A laminated film was obtained in the same manner as in example 7, except that the thickness of the paste after drying of the silicone-based adhesive of the first adhesive layer was adjusted to 75 μm.

Comparative example 1 >

A laminated film was obtained in the same manner as in example 1, except that the separator (2) was used as the first separator.

Comparative example 2 >

A laminated film was obtained in the same manner as in example 2, except that the separator (2) was used as the first separator.

< evaluation >

The transfer double-sided adhesive films obtained in examples and comparative examples were evaluated as follows. The results are shown in table 2.

< measurement of peel force F (1) of first separator to first adhesive layer peel >

The transfer double-sided adhesive films of examples and comparative examples were cut into a width of 50mm and a length of 100mm, and used as samples for evaluation.

The separator of the second adhesive layer was peeled off, and the surface of the second adhesive layer was bonded to a glass plate (trade name "S200423", manufactured by Song Nitro Co., ltd.) using a roll of 0.3 m/min at 23℃and 50% R.H., and then the first separator was peeled off from the first adhesive layer using a universal tensile tester (product name "TCM-1kNB", manufactured by Miibu Mitsui Co., ltd.) at a peeling angle of 180℃and a peeling speed of 0.3 m/min, whereby the peeling force F (1) was measured.

< measurement of peel force F (2) of second separator to peel off second adhesive layer >

The separator of the first adhesive layer was peeled off, and the surface of the first adhesive layer was bonded to a glass plate (trade name "S200423", manufactured by Song Nitro Co., ltd.) using a roll of 0.3 m/min at 23℃and 50% R.H., and then the second separator was peeled off from the second adhesive layer using a universal tensile tester (product name "TCM-1kNB", manufactured by Meibuya Co., ltd.) at a peeling angle of 180℃and a peeling speed of 0.3 m/min, whereby the peeling peel force F (2) was measured.

< measurement of the peeling adhesion force P (2) of the second adhesive layer to the Carrier substrate >

The transfer double-sided sheets of examples and comparative examples were cut into a width of 50mm and a length of 100mm, and used as samples for evaluation.

The second adhesive layer after peeling off the spacer of the sample for evaluation was adhered to a glass plate (trade name "S200423", manufactured by sonlang nitroindustry co.) at 23 ℃ under 50% r.h. with a roll of 0.25MPa and 0.3 m/min, aged for 30 minutes, and then peeled off from the glass plate by using a universal tensile tester (product name "TCM-1kNB", manufactured by mebenya co.) at a peeling angle of 180 degrees and a drawing speed of 0.3 m/min, whereby peeled adhesive force P (2) was measured.

< measurement of peel adhesion P' (2) of the second adhesive layer to glass plate at 160 ℃ after 5 minutes >

The second adhesive layer after separation of the separator of the sample for evaluation was adhered to a glass plate (trade name "S200423", manufactured by Song Nitro Corp Co., ltd.) at 23℃under 50% R.H. with a roll of 0.25MPa at 0.3 m/min, and aged for 30 minutes.

Then, the adhesive force P' (2) was measured by heating in an air circulation type constant temperature oven at 160℃for 5 minutes, then naturally cooling in an atmosphere of 23℃and 50% R.H. for 30 minutes, and then peeling the second adhesive layer from the glass plate using a universal tensile tester (product name "TCM-1kNB", manufactured by Meibuya Co., ltd.) under the conditions of a peeling angle of 180℃and a drawing speed of 0.3 m/min.

< measurement of first separator to first adhesive layer initial Release force T (1) >)

The transfer double-sided adhesive films of examples and comparative examples were cut into a width of 50mm and a length of 100mm by a press-cutting type paper cutter, and were used as evaluation samples.

The separator of the second adhesive layer was peeled off, and the surface of the second adhesive layer was bonded to a glass plate (trade name "S200423", manufactured by Song Nitro Co., ltd.) with a roll of 0.25MPa and 0.3 m/min at 23℃and 50%, and then a rubber-based adhesive tape (trade name "NO.315", width 19mm, manufactured by Nitro Co., ltd.) was pressed against the center portion of the rear surface of the surface protective film in the width direction with a manual roll at 23℃and 50% R.H. Under the same circumstances, the first separator was peeled from the first adhesive layer at a pulling speed of 0.3 m/min and a peeling angle of 90 degrees, and the maximum stress applied at the start of peeling was recorded as an initial peeling strength T (1) [ N/50mm ].

< determination of the initial Release force T (2) of the second separator on the second adhesive layer >

The separator of the second adhesive layer was peeled off, and the surface of the second adhesive layer was bonded to a glass plate (trade name "S200423", manufactured by Song Nitro Co., ltd.) with a roll of 0.25MPa and 0.3 m/min at 23℃and 50% R.H., and then a rubber-based adhesive tape (trade name "NO.315", width 19mm, manufactured by Nitro Co., ltd.) was pressure-bonded to the center portion of the back surface of the surface protective film in the width direction with a manual roll at 23℃and 50% R.H. Under the same circumstances, the second separator was peeled off from the second adhesive layer at a pulling speed of 0.3 m/min and a peeling angle of 90 degrees, and the maximum stress applied at the start of peeling was recorded as the initial peeling strength T (2) [ N/50mm ].

< evaluation of first separator peelability >

The transfer double-sided adhesive films of examples and comparative examples were cut into a width of 10mm and a length of 10mm, and used as samples for evaluation.

The separator of the second adhesive layer was peeled off, the surface of the second adhesive layer was bonded to a glass plate (trade name "S200423", manufactured by sonlanchongsu industrial Co., ltd.) with a roll of 0.3 m/min at 23℃and 50% R.H., then an acrylic adhesive tape (trade name "No.31B", manufactured by Nidong electric Co., ltd.) was used as a handle, and the first separator was peeled off from the first adhesive layer with a peeling angle of 180℃and a peeling speed of 0.3 m/min at 23℃and 50% R.H., and the peelability of the first separator was evaluated according to the following criteria.

(evaluation criteria)

(good): the first spacer is peeled off without causing a warpage at the interface of the second adhesive layer and the glass plate.

Delta (pass): the first spacer is peeled off, but a lift-off occurs at the interface of the second adhesive layer and the glass plate.

X (reject): the second adhesive layer is peeled from the glass sheet prior to peeling the first separator.

< evaluation of peelability of second separator >

The evaluation sample was placed on the adsorption table with the first spacer side down and fixed by suction. An acrylic adhesive tape (trade name "No.31b", manufactured by nito electric corporation) was used as a handle, which was rolled by a manual roller on a right-angle portion of a fixed sample for evaluation, and the second separator was peeled off from the second adhesive layer under conditions of a peeling angle of 180 degrees and a peeling speed of 0.3 m/min at 23 ℃ under conditions of 50% r.h., and peelability of the second separator was evaluated according to the following criteria.

(evaluation criteria)

(good): the second separator is peeled off without causing a warpage at the interface of the first adhesive layer and the first separator.

Delta (pass): although the second separator is peeled off, a lift-off is generated at the interface of the first adhesive layer and the first separator.

X (reject): the first adhesive layer and the first separator are peeled off before the second separator is peeled off.

< reworkability of glass >)

The samples after measuring the peel adhesion force P' (2) of the second adhesive layer to the glass plate at 160 ℃ for 5 minutes were visually observed, and reworkability was judged according to the following criteria.

(evaluation criteria)

Excellent: for the glass plate, no contamination such as breakage of glass, paste residue, etc. was observed at all.

(good): for the glass plate, almost no contamination such as breakage of glass, paste residue, etc. was observed.

X (reject): for the glass plate, breakage of the glass, remaining of paste, and the like were observed.

TABLE 1

/>

Description of the reference numerals

1. Laminated film

10. Substrate material

11. First adhesive layer

12. Second adhesive layer

110. First spacer

120. Second spacer

20. Dicing tape

21. Electronic component

22. Carrier substrate

23. Thimble component

30. Mounting substrate

31. Circuit board

Claims

1. A laminated film obtained by laminating a first separator, a first adhesive layer, a base material, a second adhesive layer and a second separator in this order, wherein the first adhesive layer comprises a low-adhesion adhesive layer, the second adhesive layer comprises a releasable adhesive layer,

f (1), F (2), P (2) and P' (2) satisfy the following relationship:

F(1)≤F(2)、

P(2)≥F(1)、

P’(2)/P(2)＜1.20、

P’(2)＜1.00，

p (2) is the adhesion (N/50 mm) of the second adhesive layer to 180℃peel of the glass plate measured at 23℃and 50% R.H. and a pulling speed of 0.3 m/min,

p' (2) is the adhesion (N/50 mm) of the second adhesive layer to 180 ° peel of the glass plate measured at 160 ℃ for 5 minutes and then at 23 ℃, 50% r.h. and a pull rate of 0.3 m/min.

2. The laminated film according to claim 1, wherein the laminated film further satisfies the following relationship,

F(2)/F(1)＜0.80、

P(2)/F(1)＞1.00。

3. the laminated film according to claim 1 or 2, wherein T (1), T (2) and the adhesive force P (2) satisfy the relationship of the following formula:

T(1)/T(2)＞1.05、

P(2)/T(1)＜1.00，

t (1) is the 90 DEG initial peel force (N/50 mm) of the first adhesive layer to the first separator measured at 23 ℃, 50% R.H. and a pull rate of 0.3 m/min,

t (2) is the 90℃initial peel force (N/50 mm) of the second adhesive layer to the second separator measured at 23℃at 50% R.H. and a pull rate of 0.3 m/min.