WO2011043471A1

WO2011043471A1 - Releasant composition, release film, and pressure-sensitive adhesive film

Info

Publication number: WO2011043471A1
Application number: PCT/JP2010/067784
Authority: WO
Inventors: 稔長島; 勉加藤; 育巳佐藤
Original assignee: ソニーケミカル＆インフォメーションデバイス株式会社
Priority date: 2009-10-08
Filing date: 2010-10-08
Publication date: 2011-04-14
Also published as: JP2011099097A; TWI502028B; KR101732753B1; JP5742161B2; TW201122059A; KR20120082420A

Abstract

Provided are a releasant composition which causes no jerky release phenomenon and a release film formed using the composition. The releasant composition comprises an addition reaction type silicone, a curing catalyst for curing the addition reaction type silicone, and a thermoplastic saturated polyester resin. This composition gives a film in which polyester resin particles are dispersed in the cured silicone.

Description

Release agent composition, release film and adhesive film

The present invention relates to a release agent composition, a release film and an adhesive film, and more particularly to a release film useful as a protective film for an anisotropic conductive film and a release agent composition for forming the release layer.

A release film with a release agent coating (release layer) on one side of a release base material such as a polyester film is an adhesive for electronic devices such as an anisotropic conductive film (ACF). It is widely used as a protective film for various adhesive coatings including adhesive coatings. That is, the pressure-sensitive adhesive film for electronic devices is usually formed by applying a coating liquid containing a pressure-sensitive adhesive and a solvent on the surface of the base film and then heating to remove the solvent. The release film is laminated on the surface of this pressure-sensitive adhesive film and used as a protective film.

In order to form a release layer of a release film, a silicone release agent is generally used to reduce the surface energy, and in particular, an addition reaction type silicone release agent that cures at a relatively low temperature in a short time. A mold is used (Patent Documents 1 and 2). The addition reaction type silicone release agent is cured (crosslinking reaction) with a metal catalyst such as platinum, and is prepared to have a desired release function (for example, the surface tension (γS) of the silicone release layer is 19). ~ About 21 dyne / cm).

However, if the affinity between the release layer with a small surface energy and the pressure-sensitive adhesive film is poor, the adhesive force between the release layer and the pressure-sensitive adhesive film is weak as a whole, but the release film is removed from the pressure-sensitive adhesive film. A so-called jerky phenomenon that the peeling force is not stable between the start of peeling and the end of peeling appears at the portion that becomes the starting point when peeling.

When the jerky phenomenon appears, a part of the pressure-sensitive adhesive film that is an anisotropic conductive film is peeled off from the base film side to the release film side at a portion where a large peeling force is required, and a so-called blocking phenomenon occurs, There was a problem that the performance as an anisotropic conductive film was greatly impaired.

Therefore, recently, it has been demanded that the release layer of the release film has a certain degree of affinity for the adhesive film.

JP 2001-115111 A JP 2004-91754 A

The present invention was created in order to solve the above-described disadvantages of the prior art, and an object thereof is to provide a release film and an adhesive film in which the jerky phenomenon does not appear, and such a release film and an adhesive film. An object of the present invention is to provide a release agent composition for forming a release layer.

In order to solve this problem, the inventors of the present invention add a thermoplastic saturated polyester resin other than silicone to the coating liquid of the release agent composition, and form a mixture of silicone and thermoplastic saturated polyester resin. A sea-island structure (non-uniform structure) is obtained in which a large number of regions of thermoplastic saturated polyester resin are dispersed unevenly in the sea where silicone is a continuous phase, resulting in a jerky phenomenon where the peel force is not stable It was found that can be improved.

The present invention was created based on the above discovery, and is a release agent composition containing an addition reaction type silicone, a curing catalyst for curing the addition reaction type silicone, and a thermoplastic saturated polyester resin. is there.

Further, in a preferred embodiment of the release agent composition of the present invention, when the release agent composition is formed into a film, a sea-island structure in which the polyester resin regions are dispersed non-uniformly in a continuous phase of silicone is formed. Is.

The release agent composition of the present invention preferably contains a blocked isocyanate crosslinking agent that crosslinks the polyester resin. The blocked isocyanate crosslinking agent is a crosslinking agent in which an isocyanate group is blocked with a protecting group, and the protecting group is dissociated when heated to a temperature higher than the curing temperature of the addition reaction type silicone.

In the release agent composition of the present invention, the solid component of the polyester resin is preferably 5 parts by weight or more and 100 parts by weight or less, more preferably 7 parts by weight or more, with respect to 100 parts by weight of the solid component of the silicone. It is preferably contained in an amount of 50 parts by weight or less, particularly preferably in the range of 10 parts by weight to 30 parts by weight.

The present invention also provides a release film in which a release layer formed of the above release agent composition is laminated on a film substrate, and the release film and the release layer of the release film An adhesive film having an adhesive layer laminated thereon is provided. In particular, as the pressure-sensitive adhesive film, an aspect in which the pressure-sensitive adhesive layer contains conductive particles and is used as an anisotropic conductive film is provided.

The release agent composition of the present invention contains a silicone resin which is an addition reaction type resin and a thermoplastic saturated polyester resin. In the release layer formed by forming a film of this release agent composition, silicone is used. A sea-island structure is formed in which the thermoplastic saturated polyester resin is dispersed non-uniformly in an irregular shape in the sea with the resin as a continuous phase. The polyester resin, which is an island of sea-island structure, improves the affinity between the release layer and the adhesive layer in contact with the release layer. Therefore, in the adhesive film in which the release layer and the adhesive layer are laminated, The jerky phenomenon is remarkably suppressed and the peeling force is stabilized. Therefore, at the time of peeling between the release layer and the adhesive layer, the polyester resin contained in the release layer is transferred from the release layer to the adhesive layer, dropped off, or the adhesive layer is peeled off to the release layer. There is no inconvenience such as, and a decrease in the residual adhesion rate can be prevented in the pressure-sensitive adhesive layer after the release layer is peeled from the pressure-sensitive adhesive film.

In particular, if a blocked isocyanate cross-linking agent that cross-links the polyester resin is added, the polyester resin can be cross-linked during film formation of the release agent composition. Thus, the residual adhesive force is not reduced in the pressure-sensitive adhesive layer after peeling the release layer, and the solvent-resistant residual adhesive rate of the release layer is improved.

Such characteristics of the release layer are also effective when the adhesive layer is an anisotropic conductive film containing conductive particles. Therefore, a release film using the release agent composition of the present invention for the release layer is suitable as a protective film for the anisotropic conductive film, and an adhesive film in which the anisotropic conductive film is laminated on the release film of the present invention. Is useful as an anisotropic conductive film.

In addition, an adhesive layer that does not contain conductive particles is also disposed between the electrical component and the substrate to fix the electrical component to the substrate and bring the connection terminal of the electrical component and the connection terminal of the substrate into contact for electrical conduction. Can be used for applications. Therefore, the pressure-sensitive adhesive film of the present invention is useful as a pressure-sensitive adhesive film (adhesive tape) having no jerky phenomenon for electric component arrangement regardless of the presence or absence of conductive particles in the pressure-sensitive adhesive layer.

It is a relationship figure of the elapsed time at the time of peeling with the peeling layer of an Example, and an anisotropic electrically conductive film, and initial stage peeling force for demonstrating jerky property. It is a relationship figure of the elapsed time at the time of peeling with the peeling layer and anisotropic conductive film of a comparative example, and initial stage peeling force for demonstrating jerky property. It is a related figure of the peeling force of a peeling layer and an anisotropic electrically conductive film, and the kind of polyester added to this mold release layer. It is a relationship figure of the peeling force of a peeling layer and an anisotropic electrically conductive film, a solvent-resistant residual adhesive rate, and the polyester addition amount in this peeling layer.

The mold release agent composition of the present invention contains an addition reaction type silicone, a curing catalyst for curing the addition reaction type silicone, and a thermoplastic saturated polyester resin.

By using an addition reaction type silicone as the silicone, the release layer can be cured at a low temperature in a short time as compared with the condensation type silicone. As the addition reaction type silicone, for example, a known polydimethylsiloxane having an alkenyl group (for example, vinyl group, hexenyl group, etc.) in the molecule can be used. Specific examples of the addition reaction type silicone include materials such as trade names X52-9201B, KS847, and KS830 manufactured by Shin-Etsu Chemical Co., Ltd.

As a curing catalyst for the addition reaction type silicone, for example, a known platinum-based curing catalyst can be preferably exemplified. Examples of platinum-based curing catalysts include chloroplatinic acid, complex salts of chloroplatinic acid and olefins, and compounds of chloroplatinic acid and alcohols.

If the addition amount of the curing catalyst for the addition reaction type silicone in the release agent composition is too small, the curing reaction does not proceed sufficiently, and if it is too much, an effect commensurate with the addition amount cannot be obtained. The amount is preferably 0.5 to 5 parts by weight, more preferably 0.5 to 2 parts by weight (including the solvent) with respect to 100 parts by weight (including the solvent) of the solution.

On the other hand, the thermoplastic saturated polyester resin has a number average molecular weight of 1,000 to 50,000, more preferably 5,000 to 30,000, a softening point of 50 ° C. to 250 ° C., more preferably 130 ° C. to 200 ° C., and a glass transition point of 40 ° C. to 90 ° C. Are preferred. Specific examples of preferred thermoplastic saturated polyester resins include Elitel UE-3200 (number average molecular weight 16000, softening point 165 ° C., glass transition point 65 ° C.), Elitel UE-3201 (number average molecular weight 20000, softening point 165) manufactured by Unitika Ltd. ° C, glass transition point 65 ° C), Elitel UE-3210 (number average molecular weight 20000, softening point 155 ° C, glass transition point 45 ° C), Elitel UE-3400 (number average molecular weight 25000, softening point 105 ° C, glass transition point- 20 ° C), Elitel UE-9200 (number average molecular weight 15000, glass transition point 65 ° C), and the like.

The content of the thermoplastic saturated polyester resin in the release agent composition of the present invention is preferably 5 to 100 parts by weight, more preferably 7 parts by weight of the solid component of the thermoplastic saturated polyester resin with respect to 100 parts by weight of the solid component of silicone. -50 parts by weight, more preferably 10-30 parts by weight.
When the polyester content is excessively small, the sea-island structure cannot be effectively formed in the release layer formed from the release agent composition, and the affinity between the release layer and the adhesive layer cannot be improved. On the other hand, if the polyester content is excessively large, the coating film performance is adversely affected, and repellency, unevenness, and streaks are likely to occur, and the release performance is also adversely affected.

Further, in the release agent composition of the present invention, the thermoplastic saturated polyester resin may be crosslinked or not crosslinked. In the release layer formed from this release agent composition, the polyester is contained in the silicone cured product. The release force can be adjusted by dispersing the lump of resin in the form of islands, but the thermoplastic saturated polyester resin is preferably crosslinked, and the release agent composition of the present invention is thermoplastic saturated. It is preferable to contain a crosslinking agent for crosslinking the polyester resin.

That is, even if a platinum-based curing catalyst for curing the addition reaction type silicone is contained in the mixture of the thermoplastic saturation polyester resin and the addition reaction type silicone, the thermoplastic saturation polyester resin itself does not proceed with the crosslinking reaction. Therefore, if a solvent that is soluble in polyester resin or a solvent that is highly compatible with polyester resin is used as the solvent for the adhesive layer to be laminated with the release layer, it is included in the release layer when the release layer and the adhesive layer are peeled off. The polyester resin that has been transferred causes transfer or dropping to the pressure-sensitive adhesive layer, resulting in an increase in peeling force and a decrease in peelability, or a decrease in the residual adhesion rate in the pressure-sensitive adhesive layer after peeling.

For this reason, it is conceivable to add an isocyanate-based crosslinking agent that crosslinks the polyester resin to the release agent composition. However, the isocyanate-based crosslinking agent is a catalyst poison of the platinum-based curing catalyst for curing the silicone. A system crosslinking agent cannot be blended.

On the other hand, the cross-linking agent in which the NCO group of the polyisocyanate is blocked with a protecting group is called a blocked isocyanate cross-linking agent. When heated above the temperature at which the protecting group dissociates, the NCO group and the polyester resin from which the protecting group is dissociated It is possible to crosslink between the polyester resins by reacting with the hydroxy group.

Therefore, as a crosslinking agent for the polyester resin in the release agent composition, the temperature at which the addition reaction type silicone is cured does not become a catalyst poison of the curing catalyst and is heated to a temperature higher than the curing temperature of the addition reaction type silicone. Then, a blocked isocyanate cross-linking agent from which the protecting group is dissociated is contained. As a result, when the release layer is formed using the release agent composition, the crosslinking agent is activated when the temperature of the release agent composition is increased after completion of the curing reaction of the addition reaction type silicone, and the polyester resin is crosslinked. be able to. Therefore, when the pressure-sensitive adhesive layer laminated on the release layer is peeled from the release layer, the polyester resin can be prevented from being transferred from the release layer to the pressure-sensitive adhesive layer.

Specific examples of the block isocyanate-based crosslinking agent include trade name Coronate 2513 (dissociation condition: 120 ° C. × 30 minutes), Coronate 2507 (dissociation condition: 130 ° C. × 30 minutes) of Nippon Polyurethane Industry Co., Ltd.

As for the compounding quantity of a block isocyanate type crosslinking agent, the weight ratio of solid content of a thermoplastic saturated polyester resin and a block isocyanate type crosslinking agent has preferable 5: 5 to 9: 1.
If the amount of blocked isocyanate is more than 5: 5, it remains in the coating film and affects the release performance. If the amount of polyester resin is more than 9: 1, the reaction is not completed, which is not preferable.

The release agent composition of the present invention can contain a solvent such as toluene, methyl ethyl ketone (MEK), xylene, acetone, hexane, ethyl acetate, MIBK, a release control agent, and the like for improving the coating property. . Moreover, it can prepare by mixing the component mentioned above uniformly by a conventional method.

The release film of the present invention is obtained by laminating a release layer on a film substrate, and the release layer is formed by film formation of the release agent composition of the present invention.

Here, as the film substrate, a known film substrate such as a polyester film can be used. The film substrate can be subjected to a surface treatment such as a corona treatment in order to improve the adhesion with the release layer. There is no restriction | limiting in particular in the thickness of a film base material, It can determine suitably according to the intended purpose etc. of a release film.

Moreover, the film forming of the release composition can be performed as follows. That is, the release agent composition of the present invention is applied to a film substrate with a coil bar or the like to form a coating film of the release agent composition, and this is heated to cure the addition-reactive silicone, and the release agent When the composition contains a blocked isocyanate crosslinking agent, the release layer is formed by further raising the temperature until the dissociation temperature of the blocked isocyanate crosslinking agent is exceeded and crosslinking the polyester resin.

In this case, as specific curing conditions for the release agent composition, it is preferable to dry and heat-harden rapidly after coating the release agent composition in order to form a sea-island structure. Therefore, for example, after applying the release agent composition to the film substrate at room temperature (10 to 35 ° C.), it is preferably in a constant temperature heating chamber of 130 to 180 ° C., more preferably 150 to 170 ° C., preferably 10 to 300 ° C. Heat for 2 seconds, more preferably 40 to 120 seconds. When the heating temperature is lower than 130 ° C., the silicone is not sufficiently cured, and when it exceeds 180 ° C., it is not preferable from the viewpoint of the heat resistance and heat shrinkability of the substrate. Further, if the heating time is shorter than 10 seconds, curing of the silicone becomes insufficient, and if it exceeds 300 seconds, the curing reaction proceeds excessively, which is not preferable. By such a film forming method, a release film in which a release layer having a sea-island structure is disposed on a film substrate can be obtained.

The pressure-sensitive adhesive film of the present invention is obtained by laminating a pressure-sensitive adhesive layer on the release layer of the above-described release film.

Here, the pressure-sensitive adhesive layer is not limited to one that exhibits adhesiveness at room temperature. The main component of the adhesive layer may be formed of a thermoplastic resin, or may exhibit adhesiveness by heating.

The adhesive layer can be formed on the anisotropic conductive film by containing conductive particles. Therefore, the pressure-sensitive adhesive film of the present invention containing conductive particles in the pressure-sensitive adhesive layer is useful as an anisotropic conductive adhesive film.

Hereinafter, the present invention will be specifically described by way of examples.
<Example 1>
10 parts by weight of a 20% solution of polyester (trade name UE3200, manufactured by Unitika Ltd., number average molecular weight 16000, glass transition point 65 ° C.), 30% addition reaction type silicone solution (trade name KS-3703, manufactured by Shin-Etsu Chemical Co., Ltd.) 15 Parts by weight, 30% addition reaction type release control agent (trade name KS-3800, manufactured by Shin-Etsu Chemical Co., Ltd.), 0.3 parts by weight of a platinum curing catalyst (trade name PL-50T, manufactured by Shin-Etsu Chemical Co., Ltd.), A release agent composition was prepared by uniformly mixing 1 part by weight of a block isocyanate-based crosslinking agent (trade name Coronate 2513, manufactured by Nippon Polyurethane Industry Co., Ltd.), 30 parts by weight of toluene and 33 parts by weight of MEK.

The obtained release agent composition was applied to one side of a 50 μm-thick polyethylene terephthalate film as a film base with a coil bar so that the dry thickness was 0.3 μm, and placed in an oven at 160 ° C., and the temperature was set to 1. After holding for a minute, it was taken out from the oven, thereby obtaining a release film in which a release layer was provided on one side of the film substrate.

<Example 2>
A release agent composition was prepared in the same manner as in Example 1 except that 1 part by weight of a blocked isocyanate-based crosslinking agent (trade name Coronate 2513, manufactured by Nippon Polyurethane Industry Co., Ltd.) was not added to obtain a release film.

<Comparative Example 1>
A method similar to Example 1 except that 20 parts by weight of 10% ethylcellulose solution (trade name N100, manufactured by Hercules USA) was added instead of 10 parts by weight of 20% solution of polyester (trade name UE3200, manufactured by Unitika Ltd.). The release agent composition was adjusted to obtain a release film.

<Comparative Example 2>
Except for not adding polyester (trade name UE3200 manufactured by Unitika Ltd.), a release agent composition was prepared in the same manner as in Example 1 to obtain a release film.

<Evaluation>
About the release layer of the release film obtained in Examples 1 and 2, a scanning micrograph was taken and a silicon mapping image was obtained with an electron beam microanalyzer (EPMA). As a result, a sea-island structure in which a lump of polyester resin was scattered in the sea of silicone resin could be confirmed.
Further, for the release films obtained in Examples 1 and 2 and Comparative Examples 1 and 2, "(a) initial peel force""(b) initial residual adhesion rate""(c) solvent resistance residual adhesion rate" “(D) Anisotropic conductive film peeling force” and “(e) Jerky property” were tested and evaluated as described below.

(a) Initial peeling force An adhesive film (product name T4090 manufactured by Sony Chemical & Information Device Co., Ltd.) mainly composed of an acrylic resin is bonded to the surface of the release layer of the release film, and is 200 mm long and 50 mm wide. The sample was cut into strips and aged at 70 ° C. for 20 hours while a 2 kg load was placed on the obtained strip samples.
After completion of aging, a T-type peel test was performed at 25 ° C., and the initial peel force (g / 5 cm) was measured using a peel strength tester (trade name Tensilon manufactured by Orientec Co., Ltd.). The obtained results are shown in Table 1.

(b) Initial residual adhesion rate The acrylic adhesive film peeled off in the initial peel force test was applied to a flat stainless steel plate with a hand roller, and the peel force was measured in the same manner as described above to obtain the residual peel force.
Separately, an unused acrylic adhesive film was attached to a smooth stainless steel plate with a hand roller, and the peeling force was measured in the same manner as described above to obtain a reference peeling force.
And the ratio of the residual peeling force with respect to the reference | standard peeling force was computed, and it was set as the initial stage residual adhesive rate (%). The obtained results are shown in Table 1.

(c) Solvent-resistant residual adhesion rate Liquid reactive epoxy (trade name PF-55TA, manufactured by PI i Japan Co., Ltd.), which is a constituent material of the anisotropic conductive film, is applied on the release layer of the release film. And then dried in an 80 ° C. oven for 5 minutes to drive off the solvent, and then further dried by aging in an 80 ° C. oven for 5 hours to form an epoxy resin film on the release film, and then the epoxy resin film was peeled off. .

Adhesive film (Sony Chemical & Information Device Co., Ltd., trade name: T4090) with acrylic resin as the main component was bonded to the release surface of the release film, and the residual peel strength was measured in the same manner as described above to determine the residual adhesion rate (standard The ratio to the peel force (%)) was calculated, and the obtained value was defined as the solvent-resistant residual adhesion rate. The obtained results are shown in Table 1.

In addition, about a residual adhesive rate and a solvent-resistant residual adhesive rate, the value of 80% or more is calculated | required with a general adhesive, and the value of 95% or more is calculated | required with an anisotropic conductive film.

(d) Anisotropic conductive film peeling force First, 50 parts by weight of a phenoxy resin (trade name YP50, manufactured by Toto Kasei Co., Ltd.), 60 parts by weight of an epoxy resin (trade name Epicoat 828, manufactured by Japan Epoxy Resin Co., Ltd.), an imidazole curing agent (Trade name HX3941HP manufactured by Asahi Kasei Co., Ltd.) 70 parts by weight, 3.2 parts by weight of silane coupling agent (trade name A187 manufactured by Nihon Unicar Co., Ltd.), SiO ₂ particles having an average particle size of 1 μm as inorganic particles (manufactured by Tatsumori Co., Ltd.) Insulating adhesive resin having a solid content of 50%, that is, a binder solution, was prepared by dissolving 123.2 parts by weight (40% by weight of silicon dioxide) in a solvent toluene.

Then, 7 parts by weight (12.3 wt%) of conductive vinyl particles having a mean particle diameter of 5.0 μm and subjected to nickel-gold plating was added to 100 parts by weight of the binder solution, did.
The binder paste was coated on the release layer of the release film so that the thickness after drying was 40 μm, and the solvent was removed by holding in an oven at 80 ° C. for 1 minute to form an anisotropic conductive film. An adhesive film was obtained.

An adhesive film (PP tape manufactured by Nitto Denko Corporation) with an acrylic adhesive layer provided on a polypropylene base material is bonded to the anisotropic conductive film of this adhesive film, and is a strip shape having a length of 200 mm and a width of 50 mm. A T-type peel test is performed to peel the anisotropic conductive film from the release film at 25 ° C., and the initial peel force (g / 5 cm) is measured using a peel strength tester (trade name Tensilon manufactured by Orientec Co., Ltd.) And measured. The obtained results are shown in Table 1.

(e) Jerky properties Therefore, the maximum value (Max), the minimum value (Min), and the average value (Ave) for one minute from the 30-minute measurement start point in these peeling force charts are obtained, and Max is used as an index of jerky properties. A ratio R (R = (Max−Min) / Ave × 100) with respect to the ave peel force of the difference between Min and Min was calculated and judged according to the following evaluation criteria. The obtained results are shown in Table 1.
[Evaluation criteria]
A: R value is 20% or less B: R value is 20% or more and less than 50% C: R value is 50% or more

As can be seen from Example 1 in Table 1, by using a blocked isocyanate-based crosslinking agent as a crosslinking agent for the polyester resin, initial peeling force, initial residual adhesion rate, solvent resistance residual adhesion rate, anisotropic conductive film peeling Both force and jerky properties are improved, and it can be seen that it is suitable as a release film for an anisotropic conductive film.
In the case of Example 2, since the blocked isocyanate crosslinking agent is not used, the polyester resin does not undergo a crosslinking reaction. Compared to Example 1, the anisotropic conductive film peeling force and the solvent-resistant residual adhesion Although the rate is small, the jerky property is good, and it can be seen that it is sufficiently suitable as a release film for a general adhesive.

In the case of Comparative Example 1, by using a cellulosic resin instead of the polyester resin, the initial residual adhesive rate and the solvent resistance residual adhesive rate are greatly inferior compared to Example 1 using the polyester resin. It is inferior to Example 2 which does not carry out the polyester crosslinking reaction.
In the case of Comparative Example 2, since no polyester resin was used, the affinity with the adhesive was poor and a jerky phenomenon occurred.

<Example 3>
In order to investigate the influence on the jerky properties due to the type of polyester, a release agent composition in which only the type of polyester was changed in the same amount as in Example 1 was prepared, and the obtained release agent composition was prepared in the same manner as in Example 1. A plurality of release films were obtained by processing, and the above-mentioned (d) anisotropic conductive film peeling force (adhesive strength) test was conducted.

The name of the polyester resin used and the value of the measured adhesive strength are shown in FIG. Each product name is a polyester resin manufactured by Unitika. Polyester having a small variation in measured peel force means that no jerky phenomenon occurred.
From the measurement result of FIG. 2, the polyester to be added is preferably UE3200 or UE9200. More preferred is UE3200.

<Example 4>
The addition amount of the polyester resin has little influence on the jerky phenomenon. However, when the addition amount is increased, the film performance of the release layer after applying the ACF, that is, the solvent resistance is lowered.
The same type of polyester (UE3200) as in Example 1 was used, and the amount of components other than polyester was the same as in Example 1. The amount of polyester added was 0 to 200% of solid component relative to 100 parts by weight of the solid component of silicone. The release agent composition was adjusted within the range described above, and the obtained release agent composition was treated in the same manner as in Example 1 to prepare a plurality of types of release films.

The obtained release film was measured for the aforementioned (d) anisotropic conductive film peeling force (adhesion strength) and (c) solvent resistance residual adhesion rate (residual adhesion rate). The measurement results are shown in the graph of FIG.
From the graph of FIG. 3, it can be seen that the amount of polyester added has little effect on the jerky phenomenon, but as the amount added increases, the solvent resistance of the release layer after applying the anisotropic conductive film decreases. .

Accordingly, the polyester is preferably added in an amount of 5 to 100 parts by weight (ie, 5 to 100% in FIG. 3), more preferably 10 to 30 parts by weight (ie, 100 parts by weight of the solid component of silicone). 10 to 30% in FIG.
Moreover, when the addition amount of polyester exceeds 150% of FIG. 3 with respect to a silicone resin, it turns out that a residual adhesive rate falls and it is not preferable.

Claims

Addition reaction type silicone,
A curing catalyst for curing the addition reaction type silicone;
A mold release agent composition comprising a thermoplastic saturated polyester resin.
2. The release agent composition according to claim 1, wherein the coating film is heated at 130 to 180 ° C. for 10 to 30 seconds to form a sea-island structure in which a lump of polyester resin is dispersed in a continuous phase of silicone.
A blocked isocyanate crosslinking agent that crosslinks the polyester resin is contained. In the blocked isocyanate crosslinking agent, an isocyanate group is blocked with a protecting group, and the protecting group is heated to a temperature equal to or higher than the curing temperature of the addition reaction type silicone. The release agent composition according to claim 1, which dissociates.
The mold release agent composition according to claim 1, wherein the solid component of the polyester resin is contained in the range of 5 to 100 parts by weight with respect to 100 parts by weight of the solid component of the silicone.
The mold release agent composition according to claim 4, wherein the solid component of the polyester resin is contained in the range of 10 to 50 parts by weight with respect to 100 parts by weight of the solid component of the silicone.
A release film in which a release layer formed of the release agent composition according to any one of claims 1 to 5 is laminated on a film substrate.
An adhesive film comprising the release film according to claim 6 and an adhesive layer laminated on the release layer of the release film.
The pressure-sensitive adhesive film according to claim 7, wherein the pressure-sensitive adhesive layer contains conductive particles and is used as an anisotropic conductive film.