KR101732753B1 - Releasant composition, release film, and pressure-sensitive adhesive film - Google Patents
Releasant composition, release film, and pressure-sensitive adhesive film Download PDFInfo
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- KR101732753B1 KR101732753B1 KR1020127009006A KR20127009006A KR101732753B1 KR 101732753 B1 KR101732753 B1 KR 101732753B1 KR 1020127009006 A KR1020127009006 A KR 1020127009006A KR 20127009006 A KR20127009006 A KR 20127009006A KR 101732753 B1 KR101732753 B1 KR 101732753B1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/68—Release sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2067/00—Use of polyesters or derivatives thereof, as moulding material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
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Abstract
A release agent composition which does not cause a jerky phenomenon and a release film formed using the same. The present invention relates to a release agent composition containing an addition reaction type silicone, a curing catalyst for curing the addition reaction type silicone, and a thermoplastic saturated polyester resin. When the film is formed, lumps of the polyester resin are scattered in the cured silicone.
Description
The present invention relates to a release agent composition, a release film and an adhesive film, and more particularly to a release film useful as a protective film of an anisotropic conductive film and a release agent composition for forming the release layer.
A releasing film provided with a releasing agent coating film (releasing layer) on one side of a peeling base substrate such as a polyester film can be used as an adhesive film for electronic devices typified by an anisotropic conductive film (ACF) And is widely used as a protective film of the film. That is, the pressure-sensitive adhesive film for electronic devices is usually formed by coating a coating liquid containing a pressure-sensitive adhesive and a solvent on the surface of a base film, and then heating to remove the solvent. The release film is laminated on the surface of the pressure-sensitive adhesive film and used as a protective film.
Generally, silicone-based release agents are used to reduce the surface energy of the release film, and addition reaction-type silicone-based release agents that cure at a relatively low temperature in a short time have been used (see
However, if the affinity between the release layer having a small surface energy and the pressure-sensitive adhesive coating film is poor, the adhesive force between the releasing layer and the pressure-sensitive adhesive coating film is weak in the whole but strong in the portion where the release film is peeled from the pressure- A so-called jerky phenomenon occurs in which the peeling force is not stabilized until the peeling is completed.
A phenomenon called " blocking " in which a portion of the adhesive film, which is an anisotropic conductive film, is peeled from the base film side to the release film side occurs at a portion where a large peeling force is required, .
Therefore, in recent years, it has been required to provide some degree of affinity to the pressure-sensitive adhesive film on the release layer of the release film.
The present invention was made in order to solve the above problems of the prior art, and an object of the present invention is to provide a releasing film or a pressure-sensitive adhesive film which does not show a jazzie phenomenon, and a releasing agent composition for forming a releasing layer of such releasing film or adhesive film In order to solve the problem.
In order to solve this problem, the inventors of the present invention have found that when a thermoplastic saturated polyester resin other than silicone is added to the coating liquid of the releasing agent composition and a mixture of silicone and thermoplastic saturated polyester resin is formed, (Nonuniform structure) in which many regions of the thermoplastic saturated polyester resin are dispersed nonuniformly in the sea is obtained, and thereby the jitter phenomenon in which the peeling force is not stabilized can be improved.
The present invention is based on the above finding, and is a release agent composition containing addition reaction type silicone, a curing catalyst for curing the addition reaction type silicone, and a thermoplastic saturated polyester resin.
Further, in a preferred embodiment of the release agent composition of the present invention, when the release agent composition is formed, a sea water structure in which the region of the polyester resin is unevenly dispersed in the continuous phase of silicon is formed.
The release agent composition of the present invention preferably contains a block isocyanate crosslinking agent for crosslinking the polyester resin. The block isocyanate crosslinking agent is a crosslinking agent in which an isocyanate group is blocked with a protecting group, and the protecting group is dissociated when heated to a temperature above the curing temperature of the addition reaction type silicone.
In the release agent composition of the present invention, the solid component of the polyester resin is preferably 5 parts by weight or more and 100 parts by weight or less, more preferably 7 parts by weight or more and 50 parts by weight or less, Particularly preferably 10 parts by weight or more and 30 parts by weight or less.
The present invention also provides a pressure-sensitive adhesive film comprising a release film on which a release layer formed by the above-described release agent composition is laminated on a film base, and an adhesive layer laminated on the release film of the release film . Particularly, as this adhesive film, the adhesive layer contains conductive particles and provides an aspect to be used as an anisotropic conductive film.
The release agent composition of the present invention contains a silicone resin as an addition reaction type resin and a thermoplastic saturated polyester resin. In the release layer formed by forming the release agent composition, a thermoplastic saturated polyester A sea structure in which the resin is irregularly dispersed in an irregular island shape is formed. The affinity between the releasing layer and the adhesive layer in contact with the releasing layer is improved by the polyester resin as the island of sea-island structure. Therefore, in the adhesive film in which the releasing layer and the adhesive layer are laminated, Is remarkably suppressed, and the peeling force is stabilized. Accordingly, there is no problem such that the polyester resin contained in the release layer is electrodeposited from the release layer to the pressure-sensitive adhesive layer or dropped off or the pressure-sensitive adhesive layer is peeled off to the release layer when the release layer and the pressure- It is possible to prevent the residual adhesive ratio from lowering in the adhesive layer after releasing the release layer from the film.
Particularly, when a block isocyanate crosslinking agent for crosslinking the polyester resin is added, the polyester resin can be crosslinked at the time of film forming of the releasing agent composition, so that the polyester resin is not removed from the releasing layer, The residual adhesive strength of the adhesive layer after the releasing layer is peeled is not reduced, and the solvent resistance residual adhesive ratio of the releasing layer is also improved.
The property of such a release layer is also effective when the adhesive layer is an anisotropic conductive film containing conductive particles. Therefore, the release film using the release agent composition of the present invention as a release layer is preferable as a protective film for an anisotropic conductive film, and the adhesive film obtained by laminating an anisotropic conductive film on the release film of the present invention is useful as an anisotropic conductive film.
The adhesive layer not containing the conductive particles can also be used for the purpose of being placed between the electric component and the substrate to fix the electric component to the substrate and bringing the connection terminal of the electric component into contact with the connection terminal of the substrate to electrically make it conductive have. Therefore, the pressure-sensitive adhesive film of the present invention is useful as an adhesive film (adhesive tape) free from jerky phenomenon for the placement of electric components, regardless of the presence or absence of the conductive particles in the pressure-sensitive adhesive layer.
1A is a diagram showing the relationship between the elapsed time and the initial peeling force at the time of peeling of the peeling layer and the anisotropic conductive film in the embodiment for explaining the low-k characteristics.
Fig. 1B is a diagram showing the relationship between the elapsed time and the initial peeling force at the time of peeling the peeling layer and the anisotropic conductive film in the comparative example for explaining the low-k characteristics.
2 is a diagram showing the relationship between the peeling force of the release layer and the anisotropic conductive film and the kind of polyester added to the release layer.
3 is a diagram showing the relationship between the peel strength of the release layer and the anisotropic conductive film, the residual content of the contents, and the addition amount of the polyester in the release layer.
The release agent composition of the present invention contains addition reaction type silicone, a curing catalyst for curing addition reaction type silicone, and a thermoplastic saturated polyester resin.
By using the addition reaction type silicone as the silicone, the release layer can be cured in a short time at a lower temperature than the condensation type silicone. As the addition reaction type silicone, for example, a known polydimethylsiloxane having an alkenyl group (e.g., a vinyl group, a hexenyl group, etc.) in a molecule can be used. Specific examples of the addition reaction-type silicon include materials such as trade names X52-9201B, KS847, KS830 from Shin-Etsu Chemical Co.,
As the curing catalyst for the addition reaction type silicone, for example, a known platinum-based curing catalyst is preferably used. Examples of platinum-based curing catalysts include chloroplatinic acid, complexes of chloroplatinic acid and olefins, compounds of chloroplatinic acid and alcohols, and the like.
If the amount of the addition reaction-type silicon curing catalyst contained in the release agent composition is too small, the curing reaction does not sufficiently proceed. If the addition amount is excessively large, an effect suitable for the addition amount can not be obtained. Therefore, 100 parts by weight of the addition reaction type silicone solution ) Is preferably 0.5 to 5 parts by weight, more preferably 0.5 to 2 parts by weight (including a solvent).
On the other hand, the thermoplastic saturated polyester resin preferably has a number average molecular weight of 1,000 to 50,000, more preferably 5,000 to 30,000, a softening point of 50 占 폚 to 250 占 폚, more preferably 130 占 폚 to 200 占 폚, and a glass transition point of 40 占 폚 to 90 占 폚 . Specific examples of preferred thermoplastic saturated polyester resins include Elitel UE-3200 (number average molecular weight 16,000, softening point 165 ° C, glass transition point 65 ° C), Elitel UE-3201 (number average molecular weight 20,000, softening point 165 ° C, glass (Number average molecular weight: 25,000, softening point: 105 占 폚, glass transition point: -20 占 폚), Elitel UE-3210 having a number average molecular weight of 20000, a softening point of 155 占 폚 and a glass transition point of 45 占 폚) UE-9200 (number average molecular weight 15000, glass transition point 65 占 폚).
The content of the thermoplastic saturated polyester resin in the releasing agent composition of the present invention is preferably 5 to 100 parts by weight, more preferably 7 to 50 parts by weight, based on 100 parts by weight of the solid component of silicon, of a solid component of the thermoplastic saturated polyester resin By weight, more preferably 10 to 30 parts by weight.
If the content of the polyester is excessively small, it is impossible to effectively form a sea water structure in the release layer formed of the release agent composition, and the affinity between the release layer and the adhesive layer can not be improved. On the other hand, if the content of the polyester is excessively large, the coating film performance is adversely affected, and thus the film is liable to cause cratering, unevenness, streaks and the like, and adversely affect the release performance.
In the release agent composition of the present invention, the thermoplastic saturated polyester resin may be crosslinked or may not be crosslinked. In the release layer formed from the release agent composition, the mass of the polyester resin in the silicone cured product may be an island shape It is preferable that the thermoplastic saturated polyester resin is crosslinked, and the releasing agent composition of the present invention preferably contains a crosslinking agent for crosslinking the thermoplastic saturated polyester resin.
That is, even when a mixture of the thermoplastic saturated polyester resin and the addition reaction-type silicone described above contains a platinum-based curing catalyst for curing the addition reaction-type silicone, the thermoplastic saturated polyester resin itself does not undergo a crosslinking reaction. As a result, when a solvent having high solubility to polyester resin or high compatibility with polyester resin is used as a solvent for the release layer and the adhesive layer to be laminated, when the release layer and the pressure-sensitive adhesive layer are peeled from each other, Or the like to the adhesive layer. As a result, the peeling force is increased to deteriorate the releasability and the residual adhesive ratio in the adhesive layer after peeling is lowered.
For this reason, it is conceivable to incorporate an isocyanate-based crosslinking agent for crosslinking the polyester resin into the releasing agent composition. However, since the isocyanate-based crosslinking agent is a catalyst poison for the platinum-based curing catalyst for curing the silicone, mixing the isocyanate- impossible.
On the other hand, the crosslinking agent in which the NCO group of the polyisocyanate is blocked by a protecting group is called a block isocyanate crosslinking agent. When the protecting group is heated to a temperature at which the protecting group is dissociated, the hydroxyl group of the polyester resin reacts with the NCO group, .
Therefore, as a crosslinking agent for the polyester resin in the releasing agent composition, when the adduct is heated at a temperature higher than the curing temperature of the addition reaction-type silicone and does not become the catalyst poison of the curing catalyst at the temperature for curing the addition reaction- Isocyanate crosslinking agent. Thus, when the release agent composition is used to form the release layer, when the temperature of the release agent composition is raised after completion of the curing reaction of the addition reaction type silicone, the above-mentioned crosslinking agent can be activated and the polyester resin can be crosslinked. Therefore, when the adhesive layer laminated on the release layer is peeled from the release layer, it is possible to prevent the polyester resin from being electrodeposited from the release layer to the adhesive layer.
Specific examples of the block isocyanate-based cross-linking agent include Coronate 2513 (dissociation condition: 120 ° C x 30 minutes) and Coronate 2507 (dissociation condition: 130 ° C x 30 minutes) manufactured by Nippon Polyurethane Industry Co.,
The blending amount of the block isocyanate type crosslinking agent is preferably 5: 5 to 9: 1 by weight ratio of the solid content of the thermoplastic saturated polyester resin and the block isocyanate type crosslinking agent.
If the amount of the block isocyanate is larger than 5: 5, the polyester resin remains in the coating film and affects the mold releasing performance. If the amount of the polyester resin is larger than 9: 1, the reaction is not completed.
The release agent composition of the present invention may contain a solvent such as toluene, methyl ethyl ketone (MEK), xylene, acetone, hexane, ethyl acetate, MIBK, a release control agent and the like in order to improve the coating property. Further, the above-mentioned components can be produced by uniformly mixing them by a conventional method.
The release film of the present invention is obtained by laminating a release layer on a film base, and the release layer is formed by film formation of the release agent composition of the present invention.
As the film substrate, a known film substrate such as a polyester film can be used. The film substrate may be subjected to surface treatment such as corona treatment in order to improve adhesion with the release layer. The thickness of the film substrate is not particularly limited and may be appropriately determined depending on the intended use of the release film and the like.
In addition, the film formation of the releasing composition can be carried out as follows. That is, when the release agent composition of the present invention is applied to a film base by a coil bar or the like to form a coating film of the release agent composition, and the reaction product is heated to cure the addition reaction type silicone. When the release agent composition contains a block isocyanate type crosslinking agent, The temperature is further increased until the dissociation temperature of the isocyanate-based cross-linking agent is exceeded and the polyester resin is crosslinked to form a release layer.
As specific curing conditions for the release agent composition in this case, it is preferable that the release agent composition is coated so as to form a sea water structure, followed by rapid thermal curing by drying. Therefore, the release agent composition is applied to the film substrate at room temperature (10 to 35 ° C), for example, in a constant temperature heating chamber preferably at 130 to 180 ° C, more preferably at 150 to 170 ° C, 300 seconds, more preferably 40 to 120 seconds. If the heating temperature is lower than 130 캜, the curing of the silicone becomes insufficient, and if it exceeds 180 캜, the heat resistance and heat shrinkability of the substrate are not preferable. If the heating time is shorter than 10 seconds, the curing of the silicon becomes insufficient, and if it exceeds 300 seconds, the curing reaction proceeds excessively, which is not preferable. By such a film-forming method, a release film in which a release layer having a sea-island structure is disposed on a film substrate can be obtained.
Further, the pressure-sensitive adhesive film of the present invention is a pressure-sensitive adhesive layer laminated on the release layer of the above-mentioned release film.
Here, the adhesive layer is not limited to one that exhibits adhesiveness at room temperature. The main component of the adhesive layer may be formed of a thermoplastic resin or may exhibit stickiness by heating.
The adhesive layer can be formed of an anisotropic conductive film by containing conductive particles. Therefore, the pressure-sensitive adhesive film of the present invention containing conductive particles in the pressure-sensitive adhesive layer is useful as an anisotropically conductive adhesive film.
<Examples>
Hereinafter, the present invention will be described in detail with reference to examples.
≪ Example 1 >
10 parts by weight of a 20% solution of a polyester (UE3200, number average molecular weight 16000, glass transition point 65 占 폚, manufactured by Unitika K.K.), 30 parts of an addition reaction type silicone solution (trade name: KS (Manufactured by Shin-Etsu Chemical Co., Ltd.), 20 parts by weight of a 30% addition reaction type release control agent (trade name: KS-3800, manufactured by Shin-Etsu Chemical Co., 50T), 1 part by weight of a block isocyanate crosslinking agent (Coronate 2513, trade name, manufactured by Nippon Polyurethane Industry Co., Ltd.), 30 parts by weight of toluene and 33 parts by weight of MEK were uniformly mixed to prepare a release agent composition.
The resulting release agent composition was coated on one side of a polyethylene terephthalate film having a thickness of 50 mu m as a film base so that the thickness of the film became 0.3 mu m and put in an oven at 160 DEG C for 1 minute and then taken out of the oven Thus, a release film having a release layer formed on one side of the film substrate was obtained.
≪ Example 2 >
Except that 1 part by weight of a block isocyanate-based cross-linking agent (Coronate 2513, trade name, manufactured by Nippon Polyurethane Industry Co., Ltd.) was not added, and the releasing agent composition was adjusted in the same manner as in Example 1 to obtain a release film.
≪ Comparative Example 1 &
Except that 20 parts by weight of a 10% ethyl cellulose solution (N100, trade name, manufactured by Hercules Inc., USA) was added instead of 10 parts by weight of a 20% solution of polyester (product name UE3200, manufactured by Unitika K.K.) The release agent composition was adjusted to obtain a release film.
≪ Comparative Example 2 &
The releasing agent composition was adjusted in the same manner as in Example 1 except that polyester (UE3200, manufactured by Unitika K.K.) was not added to obtain a release film.
<Evaluation>
For the release layer of the release film obtained in Examples 1 and 2, a scanning type micrograph was taken and a mapping image of silicon was obtained with an electron beam microanalyzer (EPMA). As a result, it was possible to confirm the sea structure in which the mass of the polyester resin was scattered in the sea of the silicone resin.
(A) initial peel strength, (b) initial residual adhesion ratio, (c) solvent-resisting residual adhesion ratio, and (d) residual adhesive strength of the release films obtained in Examples 1 and 2 and Comparative Examples 1 and 2, Anisotropic conductive film peeling force " and " (e) low resistance " were tested and evaluated as described below.
(a) Initial peel force
An adhesive film (trade name: T4090, manufactured by Sony Chemical & Information Device Co., Ltd.) having an acrylic resin as a main component was bonded to the surface of the release layer of the release film and cut into a rectangle having a length of 200 mm and a width of 50 mm. And aged for 20 hours at 70 캜 under load.
After completion of the aging, a T-type peel test was conducted at 25 캜, and the initial peel force (g / 5 cm) was measured using a peel strength tester (Tencylon, trade name, manufactured by Orientec Co., Ltd.). The obtained results are shown in Table 1.
(b) Initial residual adhesion rate
In the test of the initial peel force, the peeled acrylic adhesive film was attached to a flat stainless steel plate with a hand roller, and the peel force was measured in the same manner as described above to obtain the residual peel force.
Separately, an unused acrylic adhesive film was attached to a smooth stainless steel plate with a hand roller, and the peel force was measured in the same manner as described above to obtain a reference peel force.
Then, the ratio of the residual peeling force to the reference peeling force was calculated to obtain the initial residual bonding ratio (%). The obtained results are shown in Table 1.
(c) Solvent Resistance Residual Adhesion Ratio
A liquid reactive epoxy (trade name: PF-55TA, manufactured by PTI Japan K.K.) serving as a constituent material of the anisotropic conductive film was coated on the release layer of the release film and dried in an oven at 80 DEG C for 5 minutes to disperse the solvent, For 5 hours and dried to prepare an epoxy resin film on the release film, and then the epoxy resin film was peeled off.
An adhesive film (trade name: T4090, manufactured by Sony Chemical & Information Device Co., Ltd.) having an acrylic resin as a main component was bonded to the releasing face of the releasing film and residual peeling force was measured in the same manner as described above to determine the residual adhesive force (%)) Was calculated, and the obtained value was regarded as the solvent resistance residual adhesive ratio. The obtained results are shown in Table 1.
Further, a value of 80% or more is required for a general adhesive agent and a value of 95% or more for an anisotropic conductive film is required for a residual adhesive ratio and a solvent resistance residual adhesive ratio.
(d) Anisotropic conductive film peeling force
First, 50 parts by weight of a phenoxy resin (trade name: YP50, manufactured by TOTO KASEI KABUSHIKI KAISHA), 60 parts by weight of an epoxy resin (Epicoat 828, a product of Japan Epoxy Resin Co., Ltd.), 60 parts by weight of an imidazole series curing agent HX3941HP), 3.2 parts by weight of a silane coupling agent (trade name A187, manufactured by Nippon Unicar Co., Ltd.), and 123.2 parts by weight of SiO 2 particles having an average particle diameter of 1 탆 (silicon dioxide produced by Tatsumori Kabushiki Kaisha) as inorganic particles % By weight) was dissolved in toluene to prepare an insulating adhesive resin having a solid content of 50%, that is, a binder solution.
Seven parts by weight (12.3 wt.%) Of nickel-gold plated divinylbenzene particles having an average particle size of 5.0 mu m as conductive particles was added to 100 parts by weight of this binder solution to obtain a binder paste.
This binder paste was coated on the release layer of the release film so that the thickness after drying was 40 占 퐉 and maintained in an oven at 80 占 폚 for 1 minute to remove the solvent to form an anisotropic conductive film to obtain an adhesive film.
On this anisotropic conductive film of the adhesive film, an adhesive film (PP tape manufactured by Nitto Denko K.K.) having an acrylic pressure-sensitive adhesive layer formed thereon was bonded on a polypropylene substrate, cut into a rectangle having a length of 200 mm and a width of 50 mm, (G / 5 cm) was measured by using a peel strength tester (trade name: Tensilon available from ORIENTECH CO., LTD.). The peel strength of the anisotropic conductive film was measured by a T-type peel test. The obtained results are shown in Table 1.
(e) jockey castle
Therefore, a maximum value (Max), a minimum value (Min), and an average value (Ave) for one minute from the start of measurement for 30 minutes from the start of measurement on the peelability chart are obtained and the average peel force of the difference between the maximum value and the minimum value The ratio R (R = (maximum value-minimum value) / average value 占 100) was calculated and judged to be the next evaluation criterion. The obtained results are shown in Table 1.
[Evaluation standard]
A: The value of R is less than 20%
B: The value of R is 20% or more and less than 50%
C: R value is more than 50%
As can be seen from Example 1 in Table 1, by using a block isocyanate-based cross-linking agent as a cross-linking agent for the polyester resin, the initial peel strength, the initial residual adhesion rate, the solvent- Are all improved, which is preferable as a release film for an anisotropic conductive film.
In the case of Example 2, since the block isocyanate-based crosslinking agent is not used, the polyester resin does not undergo a crosslinking reaction, and the anisotropic conductive film peeling force and the solvent resistance residual adhesion ratio are smaller than those in Example 1, And that the release film of the pressure-sensitive adhesive for general use is sufficiently preferable.
In the case of Comparative Example 1, by using a cellulose resin instead of a polyester resin, the initial residual bonding ratio and the solvent resistance residual bonding ratio were significantly lowered compared with Example 1 using a polyester resin, Which was lower than that of Example 2 which did not react.
In the case of Comparative Example 2, since no polyester resin was used, the affinity with the pressure-sensitive adhesive deteriorated and a jerky phenomenon occurred.
≪ Example 3 >
In order to investigate the influence of the type of polyester on the kneading property, a release agent composition in which only the kind of polyester was changed in the same amount as in Example 1 was adjusted and the obtained release agent composition was treated in the same manner as in Example 1 to prepare a plurality of release films And the above-mentioned (d) anisotropic conductive film peeling force (adhesive strength) was tested.
The name of the used polyester resin and the values of the measured adhesive strength are shown in Fig. Each trade name is a polyester resin manufactured by UniCasa. The polyester having a small variation in the measurement value of the peeling force means that the jazz key phenomenon does not occur.
From the measurement results of Fig. 2, the polyester to be added is preferably UE3200 or UE9200. The
<Example 4>
The addition amount of the polyester resin has little effect on the jerky phenomenon, but if the addition amount is large, the coating performance of the release layer after application of ACF, that is, the solvent resistance is lowered.
Using the polyester (UE3200) of the same kind as in Example 1, the amount of the components other than polyester was the same as in Example 1, and the amount of polyester added to 100 parts by weight of the solid component of silicon was 0 to 200 % To adjust the release agent composition, and the obtained release agent composition was treated in the same manner as in Example 1 to prepare a plurality of kinds of release films.
The obtained release film was subjected to the measurement of the above-mentioned (d) anisotropic conductive film peeling strength (adhesive strength) and (c) residual solvent resistance (residual ratio). The measurement results are shown in the graph of Fig.
From the graph of FIG. 3, it can be seen that the addition amount of the polyester has little influence on the Zicky effect, but when the addition amount is large, the solvent resistance of the release layer after application of the anisotropic conductive film decreases.
Therefore, the preferable amount of the polyester to be added to 100 parts by weight of the solid component of silicon is 5 to 100 parts by weight (that is, 5 to 100% in FIG. 3), more preferably 10 to 30 parts by
When the addition amount of the polyester exceeds 150% of the silicone resin in Fig. 3, it is found that the residual adhesion rate is lowered, which is not preferable.
Claims (11)
A curing catalyst for curing the addition reaction type silicone;
A thermoplastic saturated polyester resin,
The block isocyanate crosslinking agent for crosslinking the polyester resin
≪ / RTI >
The release agent composition contains at least one of toluene, methyl ethyl ketone (MEK), xylene, acetone, hexane, ethyl acetate, and methyl isobutyl ketone (MIBK)
The block isocyanate crosslinking agent is dissociated when the isocyanate group is blocked with a protecting group and the protecting group is heated to a temperature above the curing temperature of the addition reaction type silicone,
And the coating film is heated at 130 to 180 캜 for 10 to 300 seconds to form a sea water structure in which the mass of the thermoplastic saturated polyester resin is dispersed in the continuous phase of the addition reaction type silicone.
A curing catalyst for curing the addition reaction type silicone;
A thermoplastic saturated polyester resin,
A block isocyanate crosslinking agent for crosslinking the polyester resin,
solvent
≪ / RTI >
The release agent composition contains at least one of toluene, methyl ethyl ketone (MEK), xylene, acetone, hexane, ethyl acetate, and methyl isobutyl ketone (MIBK)
Wherein the addition reaction type silicone and the thermoplastic saturated polyester resin are dissolved in the solvent,
The block isocyanate crosslinking agent is dissociated when the isocyanate group is blocked with a protecting group and the protecting group is heated to a temperature above the curing temperature of the addition reaction type silicone,
And the coating film is heated at 130 to 180 캜 for 10 to 300 seconds to form a sea water structure in which the mass of the thermoplastic saturated polyester resin is dispersed in the continuous phase of the addition reaction type silicone.
A curing catalyst for curing the addition reaction type silicone;
A thermoplastic saturated polyester resin,
The block isocyanate crosslinking agent for crosslinking the polyester resin
≪ / RTI >
The releasing agent composition contains at least one of toluene, methyl ethyl ketone (MEK), xylene, acetone, hexane, ethyl acetate and methyl isobutyl ketone (MIBK)
Wherein the thermoplastic saturated polyester resin has a softening point of 50 캜 to 250 캜 and a glass transition point of 40 캜 to 90 캜,
The block isocyanate crosslinking agent is dissociated when the isocyanate group is blocked with a protecting group and the protecting group is heated to a temperature above the curing temperature of the addition reaction type silicone,
And the coating film is heated at 130 to 180 캜 for 10 to 300 seconds to form a sea water structure in which the mass of the thermoplastic saturated polyester resin is dispersed in the continuous phase of the addition reaction type silicone.
A curing catalyst for curing the addition reaction type silicone;
A thermoplastic saturated polyester resin,
A block isocyanate crosslinking agent for crosslinking the polyester resin,
solvent
≪ / RTI >
The release agent composition contains at least one of toluene, methyl ethyl ketone (MEK), xylene, acetone, hexane, ethyl acetate, and methyl isobutyl ketone (MIBK)
Wherein the addition reaction type silicone and the thermoplastic saturated polyester resin are dissolved in the solvent,
Wherein the thermoplastic saturated polyester resin has a softening point of 50 캜 to 250 캜 and a glass transition point of 40 캜 to 90 캜,
The block isocyanate crosslinking agent is dissociated when the isocyanate group is blocked with a protecting group and the protecting group is heated to a temperature above the curing temperature of the addition reaction type silicone,
And the coating film is heated at 130 to 180 캜 for 10 to 300 seconds to form a sea water structure in which the mass of the thermoplastic saturated polyester resin is dispersed in the continuous phase of the addition reaction type silicone.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2009-234011 | 2009-10-08 | ||
| JP2009234011 | 2009-10-08 | ||
| PCT/JP2010/067784 WO2011043471A1 (en) | 2009-10-08 | 2010-10-08 | Releasant composition, release film, and pressure-sensitive adhesive film |
Publications (2)
| Publication Number | Publication Date |
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| KR20120082420A KR20120082420A (en) | 2012-07-23 |
| KR101732753B1 true KR101732753B1 (en) | 2017-05-04 |
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| KR1020127009006A KR101732753B1 (en) | 2009-10-08 | 2010-10-08 | Releasant composition, release film, and pressure-sensitive adhesive film |
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| JP (1) | JP5742161B2 (en) |
| KR (1) | KR101732753B1 (en) |
| TW (1) | TWI502028B (en) |
| WO (1) | WO2011043471A1 (en) |
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| JP5730922B2 (en) * | 2013-02-06 | 2015-06-10 | 三菱樹脂株式会社 | Laminated polyester film |
| JP5956483B2 (en) * | 2014-02-28 | 2016-07-27 | 三菱樹脂株式会社 | Laminated polyester film |
| WO2015141551A1 (en) * | 2014-03-19 | 2015-09-24 | リンテック株式会社 | Release agent composition, release film, release film roll, and process for producing said roll |
| JP5948000B2 (en) * | 2014-07-28 | 2016-07-06 | 三菱樹脂株式会社 | Laminated polyester film |
| JP6406145B2 (en) * | 2015-07-18 | 2018-10-17 | 三菱ケミカル株式会社 | Laminated polyester film |
| WO2019131449A1 (en) * | 2017-12-27 | 2019-07-04 | 東洋紡株式会社 | Mold release film for production of ceramic green sheet |
| JP6974215B2 (en) * | 2018-02-28 | 2021-12-01 | 旭化成ワッカーシリコーン株式会社 | A curable silicone composition or a silicone composition kit containing a block polyisocyanate composition, a production method for obtaining an integrally molded product with a substrate, and an integrally molded product obtained. |
| JP2020070357A (en) * | 2018-10-31 | 2020-05-07 | 旭化成ワッカーシリコーン株式会社 | Fire retardant or self-extinguishing curable silicone composition containing heat dissociable block polyisocyanate composition |
| BR112021008471B1 (en) * | 2018-11-23 | 2023-04-04 | Basf Coatings Gmbh | PIGMENTATED COMPOSITION AND PROCESS FOR PRODUCING A COATED Impression |
| JP2022183682A (en) * | 2021-05-31 | 2022-12-13 | 日東電工株式会社 | laminated film |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004091754A (en) * | 2002-09-04 | 2004-03-25 | Sony Chem Corp | Release agent composition, release film, and its manufacturing method |
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| JPS4947155B1 (en) * | 1968-05-09 | 1974-12-13 | ||
| JPS61136572A (en) * | 1984-12-06 | 1986-06-24 | Nitto Electric Ind Co Ltd | Peelable treatment layer |
| JP2001115111A (en) * | 1999-08-11 | 2001-04-24 | Oji Paper Co Ltd | Releasable sheet and pressure-sensitive adheive tape |
| JP2003020347A (en) * | 2001-07-10 | 2003-01-24 | Mitsubishi Polyester Film Copp | Silicon-containing polyester film |
| JP5029372B2 (en) * | 2007-09-14 | 2012-09-19 | 日立化成工業株式会社 | Anisotropic conductive adhesive, anisotropic conductive film, and method for manufacturing circuit connection structure |
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- 2010-10-08 KR KR1020127009006A patent/KR101732753B1/en active IP Right Grant
- 2010-10-08 JP JP2010228798A patent/JP5742161B2/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2004091754A (en) * | 2002-09-04 | 2004-03-25 | Sony Chem Corp | Release agent composition, release film, and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI502028B (en) | 2015-10-01 |
| JP5742161B2 (en) | 2015-07-01 |
| KR20120082420A (en) | 2012-07-23 |
| JP2011099097A (en) | 2011-05-19 |
| TW201122059A (en) | 2011-07-01 |
| WO2011043471A1 (en) | 2011-04-14 |
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