CN117352474A - Efficient radiating fin and radiator - Google Patents

Efficient radiating fin and radiator Download PDF

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Publication number
CN117352474A
CN117352474A CN202311363042.7A CN202311363042A CN117352474A CN 117352474 A CN117352474 A CN 117352474A CN 202311363042 A CN202311363042 A CN 202311363042A CN 117352474 A CN117352474 A CN 117352474A
Authority
CN
China
Prior art keywords
fin
refrigerant
cavity
fins
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311363042.7A
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Chinese (zh)
Inventor
牟兴文
周华军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chuyue Huizhou Heat Transfer Technology Co ltd
Original Assignee
Chuyue Huizhou Heat Transfer Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chuyue Huizhou Heat Transfer Technology Co ltd filed Critical Chuyue Huizhou Heat Transfer Technology Co ltd
Priority to CN202311363042.7A priority Critical patent/CN117352474A/en
Publication of CN117352474A publication Critical patent/CN117352474A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Abstract

The invention discloses a high-efficiency radiating fin and a radiator, which comprise a temperature equalizing plate, wherein a plurality of fins are integrally formed on the surface of the temperature equalizing plate, refrigerant cavities are inserted on the fins, the refrigerant cavities are of an enclosed hollow structure, a gap is formed between one end of each refrigerant cavity, which is close to the temperature equalizing plate, and the end of each refrigerant cavity, which is far away from the temperature equalizing plate, is flush with the end of each fin; the radiator comprises the radiating fins and further comprises an evaporation cavity, and the evaporation cavity is in heat conduction connection with the fins. By inserting the refrigerant cavities on the fins, the heat of the fins can be quickly absorbed through the refrigerant cavities, so that the heat dissipation efficiency is improved; the fan is added, so that external air can be sucked into the inner side of the refrigerant cavity, the air is cooled, and cold air can absorb heat of the fins, so that the heat dissipation efficiency is improved; through adding the wind-guiding side that wind-guiding chamber and wind-guiding chamber tip set up in the inside of refrigerant chamber, avoided the unable problem that loses of heat of the samming board department that the fan center corresponds.

Description

Efficient radiating fin and radiator
Technical Field
The invention relates to the field of radiators, in particular to a radiating fin capable of greatly improving radiating effect and a radiator using the same.
Background
The radiator is a device widely applied to the field of chip heat dissipation, and the radiator is used for radiating heat through the phase inversion of a coolant so as to finish the heat dissipation of a target element, the traditional radiator generally comprises an evaporation cavity and a passive heat dissipation element, the evaporation cavity is used for the phase inversion of the coolant, the passive heat dissipation element is used for accelerating the phase inversion speed of the coolant through the heat transfer so as to realize the heat dissipation, on the basis, the passive heat dissipation element is generally replaced by an active heat dissipation element so as to accelerate the heat dissipation efficiency, the common active heat dissipation element is generally provided with a liquid cooling element and a fan, the liquid cooling element is used for accelerating the heat transfer through manufacturing a low-temperature contact surface, the heat dissipation effect is poor when the radiator encounters a high-temperature area, and the fan is used for absorbing the heat of a heat source through the low-temperature air at the periphery of the heat source so as to achieve the heat dissipation effect, but the fast and uniform heat dissipation can not be realized when the radiator encounters the high-temperature heat source.
Disclosure of Invention
Aiming at the problems, the invention aims to provide a high-efficiency radiating fin and a radiator, which can achieve the purpose of fast and uniform heat radiation.
In order to achieve the above purpose, the invention provides a high-efficiency radiating fin, which comprises a temperature equalizing plate, wherein a plurality of fins are integrally formed on the surface of the temperature equalizing plate, a plurality of cooling medium cavities are inserted on the fins, the cooling medium cavities are of an enclosed hollow structure, a gap is formed between one end, close to the temperature equalizing plate, of each cooling medium cavity and the temperature equalizing plate, and one end, far away from the temperature equalizing plate, of each cooling medium cavity is flush with the end of each fin.
Further, a fan is arranged at the end part of the fin, and the outer edge of the fan is flush with the edge of the refrigerant cavity.
Further, the fin is located the inner periphery side grafting in refrigerant chamber has the wind-guiding chamber, the wind-guiding chamber is close to be formed with the clearance between temperature equalizing plate and the one end of temperature equalizing plate, the wind-guiding chamber with the refrigerant chamber is through pipeline conduction connection.
Further, one end of the air guide cavity, which is close to the temperature equalizing plate, is provided with an air guide edge, and the air guide edge bends towards the inner side wall of the air guide cavity.
Further, the refrigerant cavity is communicated with a water inlet pipe and a water outlet pipe, and the water inlet pipe and the water outlet pipe are connected with a refrigerator.
Further, all or part of the fin bodies are located in the inner peripheral side region of the refrigerant chamber.
The embodiment further discloses a radiator, which comprises the radiating fins and further comprises an evaporation cavity, wherein the evaporation cavity is in heat conduction connection with the fins.
Further, the upper surface of the evaporation cavity is coated with an interface agent, and the upper surface of the evaporation cavity is connected with the temperature equalization plate in a heat conduction manner through the interface agent.
Further, the side edge of the upper surface of the evaporation cavity is welded with the side edge of the temperature equalization plate.
Further, the upper surface of the evaporation cavity and the temperature equalizing plate are integrally formed.
The beneficial effects of the invention are as follows:
1. by inserting the refrigerant cavities on the fins, the heat of the fins can be quickly absorbed through the refrigerant cavities, so that the heat dissipation efficiency is improved;
2. by adding a fan at one end of the refrigerant cavity, external air can be sucked into the inner side of the refrigerant cavity, so that the air is cooled, and cold air can absorb heat of the fins, thereby improving the heat dissipation efficiency;
3. through the inside at the refrigerant chamber adds the wind-guiding chamber and the wind-guiding limit that wind-guiding chamber tip set up, can realize the air inlet evenly distributed of fan, avoid the unable problem that loses of heat of the samming board department that the fan center corresponds.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.
FIG. 1 is a schematic diagram of a heat dissipating fin according to the present embodiment;
fig. 2 is a schematic diagram of a heat sink according to the present embodiment.
Reference numerals:
1. a temperature equalizing plate; 2. a fin; 3. a refrigerant chamber; 4. a water inlet pipe; 5. a water outlet pipe; 6. a gap; 7. a connecting piece; 8. an air guide cavity; 9. a wind guiding edge; 10. a pipeline; 11. an evaporation chamber; 12. a fan.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the substances, and not restrictive of the invention. It should be further noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other. The invention will be described in detail below with reference to the drawings in connection with embodiments.
Referring to fig. 1, a high-efficiency heat dissipation fin includes a temperature equalization plate 1, wherein the temperature equalization plate 1 is made of oxygen-free copper, a plurality of fins 2 are integrally formed on the surface of the temperature equalization plate 1, in this embodiment, the fins 2 are of a strip-shaped structure, and in one or more embodiments, the fins 2 can be manufactured into a special-shaped structure according to actual needs. The plurality of fins 2 are arranged in parallel array. The different positions of a plurality of fins 2 are provided with the grafting groove, and the fin 2 has the refrigerant chamber 3 through the grafting groove grafting, and refrigerant chamber 3 is surrounding type hollow structure for all bodies or part bodies of a plurality of fins 2 are located the interior circumference side region in refrigerant chamber 3. In this embodiment, the refrigerant cavity 3 is annular as a whole, the outer side wall of the refrigerant cavity 3 is provided with a water inlet pipe 4 and a water outlet pipe 5 in a conducting manner, the water inlet pipe 4 is connected to the water outlet of the external refrigerator, and the water outlet pipe 5 is connected to the water inlet of the external refrigerator. A gap 6 is formed between one end of the refrigerant cavity 3, which is close to the temperature equalizing plate 1, and the temperature equalizing plate 1, the gap 6 is used for passing air, so that the air reaches an inner peripheral side area of the refrigerant cavity 3 from the gap 6, and meanwhile, one end of the refrigerant cavity 3, which is far away from the temperature equalizing plate 1, is flush with the end of the fin 2.
Referring to fig. 1, the end of the fin 2 is provided with a connecting piece 7, the connecting piece 7 can be a buckle or a screwing fixing piece, the fin 2 is connected with a fan 12 through the connecting piece 7, under the installation state, the outer edge of the fan 12 is flush with the edge of the refrigerant cavity 3, the air suction end of the fan 12 faces the inner circumference side of the refrigerant cavity 3, the setting position of the refrigerant cavity 3 is combined, when the fan 12 is started, air is sucked into the inner circumference side of the refrigerant cavity 3 from a gap between the refrigerant cavity 3 and the temperature equalizing plate 1, when passing through the refrigerant cavity 3, the air is cooled, when passing through the fin 2, the cold air absorbs heat to the fin 2, the temperature equalizing plate 1 is cooled, as a part of the fin 2 is connected with the refrigerant cavity 3, and the two ways of cooling of the fin 2 can be realized, and the heat dissipation efficiency of the fin 2 is improved.
Referring to fig. 1, due to the structure of the fan 12, the wind receiving surface located in the peripheral side area of the fan blade is larger, so that a stronger airflow can be brought, a better heat dissipation effect can be brought under the condition of larger airflow flow, and the airflow flow in the middle area of the fan 12 is smaller, so that the heat dissipation effect is also worse, in order to improve the situation, the fins 2 are located on the inner peripheral side of the refrigerant cavity 3 and are inserted with the air guide cavities 8, in this embodiment, the air guide cavities 8 are annular surrounding type hollow structures, and in one or more embodiments, the air guide cavities 8 can also be in an irregular structural shape. The mounted position of wind-guiding chamber 8 is located under fan 12 middle part, is formed with clearance 6 between wind-guiding chamber 8 and the one end that is close to samming board 1 and samming board 1, and the other end of wind-guiding chamber 8 does not surpass the tip in refrigerant chamber 3, and the one end that is close to samming board 1 of wind-guiding chamber 8 is provided with wind-guiding limit 9, and wind-guiding limit 9 is buckled towards the inside wall of wind-guiding chamber 8 to realize that fan 12 flabellum week side region when the air of drawing, when partial air impacted wind-guiding limit 9, there is partial air current along wind-guiding limit 9 inflow wind-guiding chamber 8's inner periphery side, so has compensatied the problem that fan 12 flabellum central region amount of wind is not enough. Simultaneously, wind-guiding chamber 8 and refrigerant chamber 3 pass through pipeline 10 and switch on to realize that the filling has the coolant liquid in the wind-guiding chamber 8, the coolant liquid can cool down wind-guiding chamber 8, can realize the cooling when the air of wind-guiding chamber 8 inner periphery side passes through wind-guiding chamber 8, and then carries out the heat exchange with fin 2, reduces the temperature of fin 2, improves radiating efficiency.
Referring to fig. 2, this embodiment further discloses a radiator, including the above-mentioned heat dissipation fin, specifically, further including an evaporation cavity 11, where the evaporation cavity 11 is used for contacting with a heat source, and a working fluid for implementing phase inversion and heat absorption is injected into the evaporation cavity 11, and the working fluid may be water or propanol, and may be a cooling liquid capable of fast performing gas-liquid phase inversion. In order to realize the heat conduction connection between the evaporation cavity 11 and the fins 2, the evaporation cavity 11 needs to realize heat transfer with the temperature equalization plate 1, specifically, the upper surface of the evaporation cavity 11 is coated with an interfacial agent, the upper surface of the evaporation cavity 11 is connected with the temperature equalization plate 1 through the interfacial agent in a heat conduction manner, and meanwhile, the side edge of the upper surface of the evaporation cavity 11 is welded with the side edge of the temperature equalization plate 1, so that the stability of work and installation is ensured. Further, more direct heat transfer can be achieved by integrally forming the upper surface of the evaporation chamber 11 with the temperature equalization plate 1.
It will be appreciated by persons skilled in the art that the above embodiments are provided for clarity of illustration only and are not intended to limit the scope of the invention. Other variations or modifications of the above-described invention will be apparent to those of skill in the art, and are still within the scope of the invention.

Claims (10)

1. The utility model provides a high-efficient radiating fin, its characterized in that, includes the samming board, samming board's surface integrated into one piece has a plurality of fins, and is a plurality of peg graft on the fin has the refrigerant chamber, the refrigerant chamber is enclosure type hollow structure, the refrigerant chamber is close to be formed with the clearance between samming board's one end and the samming board, the refrigerant chamber is kept away from samming board's one end with the tip of fin flushes.
2. The fin according to claim 1, wherein an end of the fin is provided with a fan, an outer edge of the fan being flush with an edge of the refrigerant cavity.
3. The heat dissipation fin according to claim 2, wherein the fin is located at an inner peripheral side of the refrigerant cavity, an air guide cavity is inserted in the fin, a gap is formed between one end, close to the temperature equalization plate, of the air guide cavity and the temperature equalization plate, and the air guide cavity is connected with the refrigerant cavity in a conducting manner through a pipeline.
4. A fin according to claim 3, wherein an end of the air guiding cavity adjacent to the temperature equalizing plate is provided with an air guiding edge, and the air guiding edge is bent toward an inner side wall of the air guiding cavity.
5. A fin according to claim 3, wherein the coolant cavity is provided with a water inlet pipe and a water outlet pipe in communication, the water inlet pipe and the water outlet pipe being connected to a refrigerator.
6. The fin according to claim 1, wherein all or part of the fin bodies are mounted at positions on an inner peripheral side region of the refrigerant chamber.
7. A heat sink comprising a heat dissipating fin as recited in any one of claims 1-6, comprising an evaporation chamber, said evaporation chamber being in thermally conductive connection with said fin.
8. The heat sink of claim 7 wherein the upper surface of the evaporation chamber is coated with an interface agent, the upper surface of the evaporation chamber being thermally conductively coupled to the temperature equalization plate by the interface agent.
9. The heat sink of claim 8 wherein the upper surface side of the evaporation chamber is welded to the side of the temperature equalization plate.
10. The heat sink of claim 7 wherein the upper surface of the evaporation chamber is integrally formed with the temperature equalization plate.
CN202311363042.7A 2023-10-20 2023-10-20 Efficient radiating fin and radiator Pending CN117352474A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311363042.7A CN117352474A (en) 2023-10-20 2023-10-20 Efficient radiating fin and radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311363042.7A CN117352474A (en) 2023-10-20 2023-10-20 Efficient radiating fin and radiator

Publications (1)

Publication Number Publication Date
CN117352474A true CN117352474A (en) 2024-01-05

Family

ID=89362740

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311363042.7A Pending CN117352474A (en) 2023-10-20 2023-10-20 Efficient radiating fin and radiator

Country Status (1)

Country Link
CN (1) CN117352474A (en)

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