CN218447889U - New forms of energy refrigeration cooling chip based on water evaporation condenses - Google Patents
New forms of energy refrigeration cooling chip based on water evaporation condenses Download PDFInfo
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- CN218447889U CN218447889U CN202221887405.8U CN202221887405U CN218447889U CN 218447889 U CN218447889 U CN 218447889U CN 202221887405 U CN202221887405 U CN 202221887405U CN 218447889 U CN218447889 U CN 218447889U
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Abstract
The utility model provides a new energy refrigeration cooling chip based on water evaporation and condensation, which comprises a chip main body, a heat dissipation cover, cooling liquid and a circulating heat dissipation assembly; one surface of the chip main body is hermetically connected with the heat dissipation cover, the heat dissipation cover and the chip main body form a cavity, two ends of the circulating heat dissipation assembly are hermetically connected with the heat dissipation cover, and the cooling liquid is located in the cavity; the cooling liquid absorbs heat generated by the chip main body to evaporate and gasify, and the circulating heat dissipation assembly circularly cools the gasified cooling liquid to ensure that the gasified cooling liquid is changed into liquid cooling liquid and then flows back into the cavity; the circulating heat dissipation assembly sucks air and gasified cooling liquid in a cavity formed by the chip main body and the heat dissipation cover, the air and the gasified cooling liquid quickly dissipate heat in the circulating heat dissipation assembly, the cooled gasified cooling liquid is condensed to be liquid and flows into the cavity again, the cooling liquid and the air flowing back into the cavity can absorb heat generated by the chip main body again, and therefore the heat of the chip main body is dissipated quickly continuously in a circulating mode, and the efficiency of the chip is improved.
Description
Technical Field
The utility model relates to a chip heat dissipation technical field especially relates to a new forms of energy refrigeration cooling chip based on water evaporation condenses.
Background
Along with the promotion of electronic chip performance, electronic chip demonstrates higher and higher heat flux density, long-time in-process electronic chip's average heat flux density reaches 500W/cm, local focus heat flux density exceeds 1000W/cm, current chip radiating mode, it dispels the heat to load the fin to the chip at the surface of chip usually, it has reached the limit (less than 1W/cm) just to dispel the heat through traditional forced air cooling, this kind of radiating efficiency is lower, when the power density of chip reached certain degree, the radiating requirement of high-power consumption chip can not be satisfied to this kind of radiating mode, can influence the life-span, the effect, the practicality of chip.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a new forms of energy refrigeration cooling chip based on water evaporation condenses to solve the aforesaid more definitely problem in the background art.
The utility model provides a new energy refrigeration cooling chip based on water evaporation and condensation, which comprises a chip main body, a heat dissipation cover, cooling liquid and a circulating heat dissipation assembly; one side of the chip main body is hermetically connected with a heat dissipation cover, the heat dissipation cover and the chip main body form a cavity, two ends of the circulating heat dissipation assembly are hermetically connected with the heat dissipation cover, and the cooling liquid is located in the cavity; the cooling liquid absorbs heat generated by the chip main body to evaporate and gasify, and the circulating heat dissipation assembly circularly cools the gasified cooling liquid to ensure that the gasified cooling liquid is changed into liquid cooling liquid and then flows back into the cavity.
Furthermore, a new forms of energy refrigeration cooling chip based on water evaporation condenses, the face that the chip main part is located the cavity is equipped with the bump of a plurality of array arrangements.
Further, a new forms of energy refrigeration cooling chip based on water evaporation condenses, the radiator guard is located the terminal surface of chip main part is equipped with a plurality of muscle pieces, the muscle piece is separated the cavity in proper order into S-shaped range space, the muscle piece is close to the face of chip main part pastes with the chip main part mutually.
Further, a new forms of energy refrigeration cooling chip based on water evaporation condenses, the radiator cover last quilt head end and the tail end position department that the cavity is separated into S-shaped arrangement space with the muscle piece in proper order are equipped with first opening and second opening respectively, first opening and second opening be sealing connection respectively circulation radiator unit both ends.
Furthermore, the new energy refrigeration cooling chip based on water evaporation and condensation is characterized in that the circulating heat dissipation assembly comprises a heat dissipation pipe and a heat dissipation driving assembly; the opposite side of one end of the heat dissipation driving assembly is hermetically connected with one end of a heat dissipation pipe, the other end of the heat dissipation pipe, far away from the driving assembly, is hermetically connected with the heat dissipation cover, and the cavity is communicated with the inner space of the heat dissipation pipe.
Further, a new forms of energy refrigeration cooling chip based on water evaporation condenses, the cooling tube is the crooked shape of S-shaped.
Furthermore, the new energy refrigeration cooling chip based on water evaporation and condensation comprises a heat dissipation driving assembly, a cooling fan blade and a motor, wherein the heat dissipation driving assembly comprises a circulating piece for driving gas or liquid to flow, the cooling fan blade and the motor for providing power for the circulating piece and the fan blade; circulation spare opposite flank difference closed connection cooling tube one end, circulation spare one side fixed connection in the heat exchanger surface that looses, circulation spare upper surface fixed connection the one end transmission shaft of motor, motor other end transmission shaft fixed connection fan blade.
Furthermore, a new forms of energy refrigeration cooling chip based on water evaporation condenses, the surface that the heat exchanger that looses is connected to the chip main part still is equipped with the anticorrosive dampproof course of one deck.
The utility model has the advantages that: air and gasified coolant in the cavity formed by the chip main body and the heat dissipation cover are sucked into the heat dissipation pipe through the heat dissipation driving assembly, the air and the gasified coolant quickly dissipate heat under the action of the heat dissipation pipe and the heat dissipation driving assembly, the gasified coolant after being cooled is condensed into liquid and flows back into the cavity again, the coolant and the air flowing back into the cavity can absorb heat generated by the chip main body again, the air and the coolant continuously dissipate heat of the chip main body from the heat dissipation cover and further dissipate heat of the chip main body by entering the circulating heat dissipation assembly through circulation, and the chip efficiency is improved.
Drawings
Fig. 1 is an overall structure diagram of a new energy refrigeration and cooling chip based on water evaporation and condensation of the utility model;
FIG. 2 is a diagram of the structure of the chip main body of the present invention;
FIG. 3 is an assembly view of the circulating heat dissipating module and the heat dissipating plate of the present invention;
FIG. 4 is a structural diagram of the heat dissipation cover of the present invention;
fig. 5 is an explosion diagram of a new energy refrigeration cooling chip based on water evaporation and condensation according to the present invention;
fig. 6 is an exploded view of the heat dissipation driving assembly of the present invention;
in the figure: the heat dissipation device comprises a chip body 1, a heat dissipation cover 2, a circulating heat dissipation assembly 3, bumps 11, ribs 21, a first opening 22, a second opening 23, a heat dissipation pipe 31, a heat dissipation driving assembly 32, a circulating piece 321, fan blades 322 and a motor 323.
Detailed Description
In order to more clearly and completely explain the technical scheme of the present invention, the present invention is further explained with reference to the attached drawings.
Referring to fig. 1-6, the present invention provides a new energy refrigeration cooling chip based on water evaporation condensation, which includes a chip main body 1, a heat dissipation cover 2, a cooling liquid and a circulating heat dissipation assembly 3; one side of the chip main body 1 is hermetically connected with the heat dissipation cover 2, the heat dissipation cover 2 and the chip main body 1 form a cavity, two ends of the circulating heat dissipation assembly 3 are hermetically connected with the heat dissipation cover 2, the internal space of the circulating heat dissipation assembly 3 is communicated with the cavity, and cooling liquid is located inside the cavity; the cooling liquid can be pure water, distilled water or other liquid which can be used for cooling, the cooling liquid absorbs heat generated by the chip main body 1 to evaporate and gasify, the circulating heat dissipation assembly 3 circularly cools the gasified cooling liquid to enable the gasified cooling liquid to return to the liquid cooling liquid and then flow back to the cavity, the heat of the chip main body 1 is taken away by the gasified cooling liquid in a gasification mode, the gasified cooling liquid circularly flows under the action of the circulating heat dissipation assembly 3, and the heat in the gasified cooling liquid is dissipated to the outside air in the flowing process, so that the gasified cooling liquid is condensed back to the liquid cooling liquid.
In specific implementation, when the chip main body 1 operates, the circulating heat dissipation assembly 3 also operates, a large amount of heat is generated in the operation process of the chip main body 1, at this time, the heat on the chip main body 1 can be quickly absorbed by the cooling liquid in the cavity, the temperature of the cooling liquid in the cavity rises, the cooling liquid in the cavity can be evaporated into gasified cooling liquid after being heated to a certain temperature, a large amount of heat of the chip main body can be taken away in the gasification process of the cooling liquid, part of heat of the cooling liquid in the cavity is transferred to the heat dissipation cover 2 and then dissipated to the outside, a thrust force can be generated at the outlet of the circulating heat dissipation assembly 3 along with the operation of the circulating heat dissipation assembly 3, a suction force can be generated at the inlet of the circulating heat dissipation assembly 3, a specific outlet is a second opening 23, the inlet is a first opening 22, air in the cavity flows in a circulating manner, and is quickly cooled in the circulating heat dissipation assembly 3 in the circulating flow process of the circulating heat dissipation assembly 3, the condensed cooling liquid in the cavity and gasified cooling liquid flow into the cavity from one end of the circulating heat dissipation assembly 3, and the cooling liquid can further absorb heat dissipation assembly 1, and the heat dissipation liquid and the gasified cooling liquid can be further, so that the chip can be quickly cooled and the chip main body and the chip.
In an embodiment, a new forms of energy refrigeration cooling chip based on water evaporation condenses, the face that chip main part 1 is located the cavity is equipped with the bump 11 that a plurality of arrays were arranged, every two adjacent bumps 11 distance is less than 0.5 millimeter, bump 11 can accelerate heat conduction on chip main part 1 for the coolant liquid, bump 11 can accelerate the diffusion rate of coolant liquid on chip main part 1 surface simultaneously, when the coolant liquid that condenses into liquid through circulation radiator unit 3 flows into chip main part 1 on, the coolant liquid is contacting bump 11, can be guided by bump 11 fast through the tension of coolant liquid, prolong the space between bump 11 and disperse to whole chip fast, still effectively prevented in the cavity that the liquid coolant liquid appears under the not many circumstances of chip main part 1 position not have the coolant liquid when accelerating heat conduction, thereby lead to the cooling effect variation, the effectual temperature nature of guaranteeing the cooling.
In one embodiment, a new energy refrigeration cooling chip based on water evaporation condensation, a plurality of rib blocks 21 are arranged on the end face of a heat dissipation cover 2 positioned on a chip main body 1, the rib blocks 21 sequentially divide a cavity into S-shaped arrangement spaces, one end face of each two adjacent rib blocks 21 is respectively connected with the opposite side faces of the heat dissipation cover 2, so that the space between the two adjacent rib blocks 21 is opened from head to tail, specifically, gas and cooling liquid must flow out from the other end after entering from one end, and the air and the cooling liquid in the cavity flow more uniformly; the face of the rib block 21 close to the chip main body 1 is attached to the chip main body 1, so that the situation that cooling liquid in the space between two adjacent rib blocks 21 directly flows below the rib block 21, and the retention time of partial air and gaseous cooling liquid above the rib block 21 is long, and the heat dissipation effect of the cooling liquid is influenced can be avoided.
When the circulating heat dissipation assembly 3 is in operation, a thrust force can be generated at the outlet of the circulating heat dissipation assembly 3, a suction force can be generated at the inlet of the circulating heat dissipation assembly 3, gas and gasified cooling liquid in the cavity flow through one end of the space between the adjacent ribs 21 and then flow into the space adjacent to the other rib 21 from the other end of the space, the air flow in the cavity can reach a stable circulation in the flowing process, the air flow and the gaseous cooling liquid cannot generate vortex in the cavity, and part of the air and the gaseous cooling liquid stay at one corner for a long time, so that the radiating effect of the air and the gaseous cooling liquid on the chip main body 1 is uneven, the radiating effect of the air and the gaseous cooling liquid is not good, the use efficiency of the chip is influenced, and the heat exchange rate of the cooling liquid is effectively improved.
In another embodiment, when the circulating heat dissipation assembly 3 operates, the channel formed between the cooling fluid ribs 21 is pushed to flow at the outlet of the circulating heat dissipation assembly 3, so that the cooling fluid can accurately flow from one end to the other end, the cooling fluid finally reaches the inlet of the circulating heat dissipation assembly 3, the liquid level of the cooling fluid at the inlet of the circulating heat dissipation assembly 3 is raised, part of the cooling fluid is sucked into the circulating heat dissipation assembly 3, the cooling fluid dissipates heat to the outside in the circulating heat dissipation assembly 3, and the cooled cooling fluid flows back to the cavity from the outlet of the circulating heat dissipation assembly 3, so that the overall heat dissipation effect can be increased, and the use efficiency of the chip is improved.
In one embodiment, a new energy refrigeration cooling chip based on water evaporation condensation is provided, wherein a first opening 22 and a second opening 23 are respectively arranged at the head end position and the tail end position of a heat dissipation cover 2, which are sequentially divided into an S-shaped arrangement space by a rib 21, and the first opening 22 and the second opening 23 are respectively connected with two ends of a circulating heat dissipation assembly 3 in a sealing manner; after entering from the first opening 22, the air flow and the cooling liquid must flow out from the second opening 23, so that the air flow and the cooling liquid in the cavity flow more uniformly, and the first opening 22 and the second opening 23 are respectively connected with two ends of the circulating heat radiation assembly 3 in a sealing manner.
When the circulating heat dissipation assembly 3 drives the air flow and the cooling liquid in the cavity to flow, the air flow and the cooling liquid in the cavity flow into the circulating heat dissipation assembly 3 from the first opening 22, the air flow and the cooling liquid flow into the cavity from the second opening 23 after passing through the circulating heat dissipation assembly 3, the cooling liquid reserved by the second opening 23 flows through one end of the space between the two adjacent ribs 21, then flows into the space between the other rib 21 and the adjacent rib 21 from the other end of the space, and then reaches the first opening 22, the stable circulation of the air flow and the cooling liquid in the cavity can be kept in the flowing process, the heat dissipation effect of the circulating heat dissipation assembly is better, and the heat exchange rate of the air flow and the cooling liquid is effectively improved.
In one embodiment, a new energy refrigeration cooling chip based on water evaporation and condensation, the circulating heat dissipation assembly 3 includes a heat dissipation pipe 31 and a heat dissipation driving assembly 32; the opposite side of one end of the heat dissipation driving assembly 32 is hermetically connected with one end of a heat dissipation pipe 31, the heat dissipation driving assembly 32 provides the effect of gas and cooling liquid flowing in the cavity and the heat dissipation pipe 31 in an internal circulation manner, one ends of the two heat dissipation pipes 31 far away from the heat dissipation driving assembly 32 are hermetically connected with the heat dissipation cover 2, the cavity is communicated with the internal space of the heat dissipation pipe 31, the heat dissipation pipe 31 enables the gas and the cooling liquid in the cavity to be driven to flow by the heat dissipation driving assembly 32, and meanwhile, the heat dissipation pipe 31 also has the effect of changing the flowing form of the gas and the liquid in the cavity.
In the specific implementation, the heat dissipation driving module 32 operates, the heat dissipation driving module 32 first drives the gas and gaseous coolant in the heat dissipation pipe 31 connected to the first opening 22 to flow into the heat dissipation pipe 31 connected to the second opening 23, and then flows into the chamber from the second opening 23, the gas and the coolant in the chamber flow downward from the first opening 22 under the push of the air flow flowing back from the heat dissipation pipe 31 and the coolant condensed after cooling, and continuously flow into the heat dissipation pipe 31 from the first opening 22, and in the process, part of the coolant flowing back flows into the heat dissipation pipe 31 from the first opening 22 along with the air flow under the suction of the first opening 22 and the push of the second opening 23, so as to cool the heat dissipation pipe 31.
In one embodiment, a new energy refrigeration cooling chip based on water evaporation condensation, the heat dissipation tube 31 is in an S-shaped bent shape to increase the retention time of the air flow and the coolant in the heat dissipation tube 31, and it can make the heat carried by the air flow and the coolant in the heat dissipation tube 31 dissipate more time and heat dissipation area in the outside, so as to increase the heat dissipation effect.
In one embodiment, a new energy refrigeration cooling chip based on water evaporation and condensation, the heat dissipation driving assembly 32 includes a circulating member 321 for driving gas or liquid to flow, a cooling fan 322, and a motor 323 for providing power for the circulating member 321 and the fan 322; the motor 323 can be electrically connected with the power output end connected to the chip main body 1, or can be the output end of a control module of the device using the chip main body 1; the opposite side surfaces of the circulating piece 321 are respectively connected with one end of a radiating pipe 31 in a sealing way, one surface of the circulating piece 321 is fixedly connected with the surface of the radiating cover 2, the upper surface of the circulating piece 321 is fixedly connected with a transmission shaft at one end of a motor 323, the circulating piece 321 is specially manufactured and is adapted to the circulating piece 321 used by the chip main body 1 and adapted to a pipeline, the structure of the circulating piece 321 is a structural component for current water flow or air flow, and the circulating piece can be a component which is formed by a water wheel driving liquid in the radiating pipe 31 to flow or a pump blade of a water pump and a shell structure part and is adapted to the pipeline on the radiating cover 2; the transmission shaft at the other end of the motor 323 is fixedly connected with a fan blade 322, the motor 323 is a specially-made adaptive double-head motor 323, the motor 323 provides power for the circulating piece 321, the motor 323 also drives the fan blade 322 to rotate in the process of providing power for the circulating piece 321, and the motor 323 and the fan blade 322 can accelerate the airflow around the chip to flow and take away the air around the chip and heat on the chip.
In a specific implementation, when the motor 323 operates, the motor 323 drives the circulating element 321, and the circulating element 321 sucks the gas and the gaseous cooling liquid in the cavity from the first opening 22 into the heat dissipation pipe 31, flows into the heat dissipation pipe 31 connected to the second opening 23, and then flows into the cavity from the second opening 23 to circulate the gas and the gaseous cooling liquid; in this process, motor 323 drives fan blade 322 and rotates, and motor 323 and fan blade 322 can make the air current flow around the chip accelerate, take away the heat of the air around the chip, take away the heat on the heat exchanger 2 and take away the heat on the cooling tube 31, make the air current cooling effect in the cooling tube 31 more, make the gas cooling liquid in the cooling tube 31 can be quick condensate back liquid more, the effectual holistic radiating effect that has increased it.
In one embodiment, a new energy refrigeration cooling chip based on water evaporation condensation, the surface of the chip main body 1 connected with the heat dissipation cover 2 is further provided with an anti-corrosion moisture-proof layer, which can prevent a cooling liquid from permeating and corroding a protective layer outside the chip main body 1, so that the service life of the chip is shortened.
Of course, the present invention can also have other various embodiments, and based on the embodiments, other embodiments obtained by those skilled in the art without any creative work all belong to the protection scope of the present invention.
Claims (8)
1. A new energy refrigeration cooling chip based on water evaporation and condensation is characterized by comprising a chip main body, a heat dissipation cover, cooling liquid and a circulating heat dissipation assembly; one side of the chip main body is hermetically connected with a heat dissipation cover, the heat dissipation cover and the chip main body form a cavity, two ends of the circulating heat dissipation assembly are hermetically connected with the heat dissipation cover, and the cooling liquid is located in the cavity; the cooling liquid absorbs heat generated by the chip main body to evaporate and gasify, and the circulating heat dissipation assembly circularly cools the gasified cooling liquid to ensure that the gasified cooling liquid is changed into liquid cooling liquid and then flows back into the cavity.
2. The new energy refrigeration cooling chip based on water evaporation and condensation as claimed in claim 1, wherein a plurality of salient points are arranged in an array on the surface of the chip body located in the cavity.
3. The new energy refrigeration and cooling chip based on water evaporation and condensation as claimed in claim 1, wherein a plurality of ribs are arranged on the end face of the heat dissipation cover on the chip main body, the ribs sequentially divide the cavity into S-shaped arrangement spaces, and the faces of the ribs close to the chip main body are attached to the chip main body.
4. The new energy refrigeration cooling chip based on water evaporation and condensation as claimed in claim 3, wherein a first opening and a second opening are respectively arranged at the head end and the tail end of the heat dissipation cover, which are sequentially divided into S-shaped arrangement spaces by the ribs, and the first opening and the second opening are respectively connected with two ends of the circulating heat dissipation assembly in a sealing manner.
5. The new energy refrigeration cooling chip based on water evaporation and condensation as claimed in claim 1, wherein the circulating heat dissipation assembly comprises a heat dissipation pipe and a heat dissipation driving assembly; the opposite side of one end of the heat dissipation driving assembly is hermetically connected with one end of a heat dissipation pipe, the other end of the heat dissipation pipe, far away from the driving assembly, is hermetically connected with the heat dissipation cover, and the cavity is communicated with the inner space of the heat dissipation pipe.
6. The new energy refrigeration cooling chip based on water evaporation and condensation as claimed in claim 5, wherein the heat dissipation tube is S-shaped and curved.
7. The new energy refrigeration cooling chip based on water evaporation and condensation as claimed in claim 5, wherein the heat dissipation driving assembly comprises a circulating member for driving gas or liquid to flow, a cooling fan blade, and a motor for providing power for the circulating member and the fan blade; circulation spare opposite flank difference closed connection cooling tube one end, circulation spare one side fixed connection in the heat exchanger surface that looses, circulation spare upper surface fixed connection the one end transmission shaft of motor, motor other end transmission shaft fixed connection fan blade.
8. The new energy refrigeration cooling chip based on water evaporation and condensation as claimed in claim 1, wherein a corrosion-resistant and moisture-proof layer is further arranged on the surface of the chip main body connected with the heat dissipation cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221887405.8U CN218447889U (en) | 2022-07-21 | 2022-07-21 | New forms of energy refrigeration cooling chip based on water evaporation condenses |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221887405.8U CN218447889U (en) | 2022-07-21 | 2022-07-21 | New forms of energy refrigeration cooling chip based on water evaporation condenses |
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| CN218447889U true CN218447889U (en) | 2023-02-03 |
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| CN202221887405.8U Active CN218447889U (en) | 2022-07-21 | 2022-07-21 | New forms of energy refrigeration cooling chip based on water evaporation condenses |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117793567A (en) * | 2024-02-23 | 2024-03-29 | 浪潮计算机科技有限公司 | Phase-change cooling system, control method and switch |
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2022
- 2022-07-21 CN CN202221887405.8U patent/CN218447889U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117793567A (en) * | 2024-02-23 | 2024-03-29 | 浪潮计算机科技有限公司 | Phase-change cooling system, control method and switch |
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