CN117352447B - 一种硅片插片机的防隐裂上料设备 - Google Patents

一种硅片插片机的防隐裂上料设备 Download PDF

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CN117352447B
CN117352447B CN202311628462.3A CN202311628462A CN117352447B CN 117352447 B CN117352447 B CN 117352447B CN 202311628462 A CN202311628462 A CN 202311628462A CN 117352447 B CN117352447 B CN 117352447B
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姚禄华
李成
郑油根
颜亮亮
赵燕飞
张双锋
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Dongguan Dingli Automation Technology Co Ltd
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Abstract

本发明公开了一种硅片插片机的防隐裂上料设备,包括水床滑台本体和设于水床滑台本体上的硅片夹具;硅片夹具包括具有凸台的载板,凸台转动设有定位元件;定位元件包括T型杆和连接在T型杆上的定位接触部,T型杆一端连接有齿杆;凸台内滑动设有与齿杆啮合的直齿板,凸台还转动设有与直齿板螺纹连接的丝杆,通过转动丝杆,使丝杆驱动直齿板滑动,直齿板通过齿杆,使T型杆带动定位接触部旋转。本发明能够有效解决晶体硅片上料时,晶体硅片会受外力作用或操作不当造成隐裂的问题。

Description

一种硅片插片机的防隐裂上料设备
技术领域
本发明涉及硅片上料技术领域,具体涉及一种硅片插片机的防隐裂上料设备。
背景技术
隐裂是晶体硅光伏组件的一种较为常见的缺陷,通俗的讲,就是一些肉眼不可见的细微破裂。晶硅组件由于其自身晶体结构的特性,十分容易发生破裂,在晶体硅组件生产的工艺流程中,许多环节都有可能造成电池片隐裂,隐裂产生的根本原因,可归纳为硅片上产生了机械应力或热应力,现在为了降低成本,晶体硅片向越来越薄的方向发展,降低了电池片防止机械破坏的能力,更容易产生隐裂。
晶体硅片越来越薄,在复杂的生产过程以及各工序间的互相传送中极易产生碎片和隐裂,尤其晶体硅片插片这一工序中,工人先将挑选好的晶体硅片统一放置在硅片夹具中,然后硅片水床滑台带动硅片夹具进行转运,最后利用吸盘一一抓取配合输送带进行插片,现有的硅片夹具一般采用固定式设计,为保证晶体硅片的放置精度,晶体硅片与硅片夹具之间基本相贴合,进而晶体硅片上料时,晶体硅片会受外力作用或操作不当造成隐裂。
发明内容
为解决上述技术问题,本发明通过以下技术方案予以实现:
本发明提供了一种硅片插片机的防隐裂上料设备,包括水床滑台本体和设于水床滑台本体上的硅片夹具;硅片夹具包括具有凸台的载板,凸台转动设有定位元件;
定位元件包括T型杆和连接在T型杆上的定位接触部,T型杆一端连接有齿杆;凸台内滑动设有与齿杆啮合的直齿板,凸台还转动设有与直齿板螺纹连接的丝杆,通过转动丝杆,使丝杆驱动直齿板滑动,直齿板通过齿杆,使T型杆带动定位接触部旋转。
优选地,所述定位接触部包括固定设于T型杆的圆块,圆块连接有直杆,直杆圆周外表面转动连接有空心杆,空心杆外壁设有相对设置的光滑钢板和硅胶材质制成的防护板,空心杆远离圆块的一端设有环形齿板,直杆远离圆块的一端转动设有与环形齿板啮合的齿轮,通过转动齿轮,使环形齿板带动空心杆转动,空心杆带动光滑钢板和防护板转动。
优选地,所述载板上表面设置有硅胶板。
优选地,所述载板包括定板和与定板转动连接的动板,动板能够相对定板转动,硅胶板下表面与定板上表面固定,硅胶板下表面与动板上表面紧密贴合。
优选地,所述定板上表面设有能够与动板上表面相贴合的限位块,以对动板的转动进行限位。
优选地,所述定板下表面设有卡槽管,卡槽管内滑动连接有光滑杆,动板下表面设有卡套,光滑杆远离卡槽管的一端设有与卡套相卡合的卡杆。
优选地,所述光滑杆外壁开设有半圆槽,半圆槽内阻尼转动设有调节杆,调节杆一端贯穿卡杆并转动连接有握杆,通过旋转握杆带动调节杆绕卡杆进行阻尼旋转,调节杆外壁套设有能够与动板下表面紧密贴合的橡胶杆,调节杆与橡胶杆的非中心处相连接。
优选地,凸台底部开设有滑槽,直齿板滑动连接在滑槽内。
优选地,所述载板下表面固定连接有垫块。
优选地,定位元件共设有四组,四组定位元件等距分布在载板的四个方位上。
本发明提供的技术方案,与现有技术相比,具有如下有益效果:
本发明设置有定位元件和硅胶板,任意选取相邻的两组定位元件进行调节,通过旋转定位元件上的丝杆绕凸台内部旋转,同时,丝杆螺纹带动直齿板沿着滑槽内壁向中央运动,直齿板带动齿杆逆时针旋转,带动T型杆绕旋转孔逆时针旋转,带动直杆、空心杆、光滑钢板、防护板、环形齿板以及齿轮同步逆时针旋转,直至旋转至水平状态。此时载板上方与四组定位元件组成的空间一侧为开口状态,接着将晶体硅片从开口位置直接装载即可,不用考虑晶体硅片发生摩擦造成隐裂的问题。复位过程,防护板外表面与晶体硅片外侧渐渐贴合,可对晶体硅片的位置进行校正,最后,四组竖直的定位元件配合硅胶板实现晶体硅片的零隐裂上料。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍。显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为本发明实施例立体的结构示意图;
图2为本发明实施例硅片夹具立体的结构示意图;
图3为本发明实施例图2中A处局部放大的结构示意图;
图4为本发明实施例动板、定位元件立体翻转的结构示意图;
图5为本发明实施例图4中B处局部放大的结构示意图;
图6为本发明实施例定位元件立体旋转的结构示意图;
图7为本发明实施例定位元件立体分离的结构示意图;
图8为本发明实施例光滑杆和橡胶杆立体分离的结构示意图。
图中的标号分别代表:1、水床滑台本体;2、硅片夹具;21、载板;211、定板;2111、卡槽管;2112、光滑杆;2113、卡杆;2114、半圆槽;2115、调节杆;2116、握杆;2117、橡胶杆;212、动板;2121、卡套;213、限位块;22、凸台;221、旋转孔;222、滑槽;23、定位元件;231、T型杆;2311、圆块;232、直齿板;233、齿杆;234、丝杆;235、直杆;236、空心杆;2361、光滑钢板;2362、防护板;2363、环形齿板;2364、齿轮;3、硅胶板;4、垫块。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
下面结合实施例对本发明作进一步的描述。
请参阅图1-图8,本发明提供一种技术方案:一种硅片插片机的防隐裂上料设备,包括水床滑台本体1和硅片夹具2;
硅片夹具2包括载板21,载板21侧面固定连接有凸台22,凸台22通过开设在其内部的旋转孔221转动连接有与外部硅片相贴合的定位元件23;
其中,定位元件23包括T型杆231,T型杆231外端与旋转孔221内壁转动连接,凸台22底部开设有滑槽222,且该滑槽222的内壁滑动连接有直齿板232,T型杆231一端延伸至滑槽222内并固定连接有与直齿板232上表面相啮合的齿杆233,凸台22内部转动安装有与直齿板232上表面螺纹连接的丝杆234。
载板21上表面设置有硅胶板3,载板21下表面固定连接垫块4。
载板21采用可翻转式设计,载板21包括定板211和动板212,定板211和动板212之间转动连接,定板211上表面固定连接有能够与动板212上表面相贴合的限位块213,从而利用限位块213对动板212向上摆动时进行限位;硅胶板3下表面与定板211上表面固定连接,硅胶板3下表面与动板212上表面紧密贴合。
定板211下表面固定连接有卡槽管2111,卡槽管2111内壁滑动连接有光滑杆2112,动板212下表面固定连接有卡套2121,光滑杆2112远离卡槽管2111一端固定连接有与卡套2121内壁相卡合的卡杆2113。
光滑杆2112圆周外表面开设有半圆槽2114,半圆槽2114内部阻尼转动连接有调节杆2115,调节杆2115一端贯穿卡杆2113并转动连接有握杆2116,调节杆2115圆周外表面套设有能够与动板212下表面紧密贴合的橡胶杆2117,调节杆2115的外端与橡胶杆2117的非中心处相连接,即,调节杆2115的轴线和橡胶杆2117的轴线不重合,通过旋转握杆2116带动调节杆2115绕卡杆2113内部进行阻尼旋转,带动橡胶杆2117旋转抵紧动板212下表面,使定板211和动板212结合成一个整体。
T型杆231远离凸台22一端固定连接有与动板212上表面相贴合的圆块2311,圆块2311远离T型杆231的一侧固定连接有直杆235,直杆235圆周外表面转动连接有空心杆236。
空心杆236圆周外表面分别固定连接有光滑钢板2361和防护板2362,空心杆236远离圆块2311一端固定连接有环形齿板2363,直杆235远离圆块2311一端转动连接有与环形齿板2363内侧相啮合的齿轮2364。圆块2311、直杆235、空心杆236、光滑钢板2361、防护板2362、环形齿板2363、齿轮2364共同构成定位接触部,以对晶体硅片进行夹持和松开;通过转动齿轮2364,使环形齿板2363带动空心杆236转动,空心杆236带动光滑钢板2361和防护板2362转动,以使光滑钢板2361和防护板2362来回切换。
实际应用时,晶体硅片上料方式:
本发明中,硅片夹具2包括载板21、凸台22以及定位元件23,凸台22通过开设在其内部的旋转孔221转动连接有与外部硅片相贴合的定位元件23,定位元件23共设有四组分别等距分布在载板21四个方位。传统的硅片夹具多为一体式结构,晶体硅片与硅片夹具之间基本相贴合(避免后续转运过程中,晶体硅片发生偏移,影响吸盘的抓取精度),所以晶体硅片很难上料,极易操作不当,使得晶体硅片与硅片夹具之间发生摩擦,造成晶体硅片隐裂。
本发明需要强调的是,定位元件23采用可调节式结构,对晶体硅片进行保护,同时方便晶体硅片快速定位上料:
具体的,任意选取相邻的两组定位元件23进行调节,另外两组定位元件23位置保持不变(垂直状态),通过旋转定位元件23上的丝杆234绕凸台22内部旋转,同时,丝杆234螺纹带动直齿板232沿着滑槽222内壁向中央运动,直齿板232带动齿杆233逆时针旋转,带动T型杆231绕旋转孔221逆时针旋转,带动直杆235、空心杆236、光滑钢板2361、防护板2362、环形齿板2363以及齿轮2364同步逆时针旋转,直至旋转至水平状态。综上所述,此时载板21上方与四组定位元件23组成的空间一侧为开口状态,接着将晶体硅片从开口位置直接装载即可,不用考虑晶体硅片发生摩擦造成隐裂的问题,直至晶体硅片的相邻两侧与另外两组垂直的定位元件23外表面相贴合(若存在个别晶体硅片贴合不到位,可将两组垂直的定位元件23向下小角度倾斜,利用晶体硅片的自身重力实现短距位移对齐),装载完毕后,反向旋转定位元件23上的丝杆234绕凸台22内部旋转,带动直齿板232沿着滑槽222内壁向外运动,直齿板232带动齿杆233顺时针旋转,带动T型杆231绕旋转孔221顺时针旋转,带动直杆235、空心杆236、光滑钢板2361、防护板2362、环形齿板2363以及齿轮2364同步顺时针旋转,直至旋转至竖直状态,复位过程,防护板2362外表面与晶体硅片外侧渐渐贴合,可对晶体硅片的位置进行二次校正(校正距离短,精度高)。最后,四组竖直的定位元件23配合硅胶板3实现晶体硅片的零隐裂上料。
本发明另一方面,定位元件23与晶体硅片的外侧接触面积非常小,装载晶体硅片的硅片夹具2转运过程中,难免存在晶体硅片的外侧与定位元件23外表面之间发生作用力,单边受力极易引起晶体硅片隐裂,同时不能干涉后续吸盘抓取装载在硅片夹具2内的晶体硅片,对此空心杆236圆周外表面分别固定连接有光滑钢板2361和防护板2362(硅胶材质),光滑钢板2361和防护板2362各占二分之一。
装载和转运过程中,选取防护板2362一侧朝晶体硅片,装载时,防护板2362复位二次校正晶体硅片,硅胶材质可避免晶体硅片接触点发生隐裂,转运时,晶体硅片四周被硅胶材质的防护板2362包裹,进而可抵消晶体硅片与防护板2362之间的作用力;
吸盘抓取过程中,选取光滑钢板2361一侧朝晶体硅片,光滑钢板2361和晶体硅片之间接近零摩擦力,同时硅片夹具2和晶体硅片的位置保持不变,吸盘直接抓取晶体硅片沿着光滑钢板2361外表面向上运动即可;
具体调节方式,手动旋转齿轮2364,齿轮2364绕直杆235内部进行旋转,齿轮2364啮合传动环形齿板2363,带动空心杆236绕直杆235圆周外表面进行旋转,进而实现光滑钢板2361、防护板2362的来回切换,操作简单便捷。
本发明再次强调的是,晶体硅片装载在硅片夹具2内部后,需要工人再次检测叠加的晶体硅片四周,观测是否存在外力作用或操作不当造成破损的情况,若叠加的晶体硅片中部存在个别晶体硅片破损的情况,此时只能将上方的晶体硅片一一取出,挑出破损的晶体硅片,再次装载,由于现有的硅片夹具2采用一体式设计,无论是一一取出,还是二次装载难度都特别大,极易造成晶体硅片破损、隐裂,且浪费大量时间。
本发明中载板21采用可翻转式设计,载板21包括定板211和动板212,同时定板211和动板212之间转动连接。首先,旋转握杆2116带动调节杆2115绕卡杆2113内部进行旋转,带动橡胶杆2117旋转脱离动板212下表面(减小滑动阻力),接着,推动两组光滑杆2112之间的连接杆,带动光滑杆2112沿着卡槽管2111内部滑动,带动卡杆2113脱离卡套2121,直至光滑杆2112完全滑动卡槽管2111内,此时光滑杆2112、橡胶杆2117对动板212的限位消失,进而动板212可自由向下旋转(包含其上方的定位元件23同步旋转),晶体硅片叠加在硅胶板3上,从动板212一侧可直接将破损的晶体硅片之间挑选出,无需将所有晶体硅片一一取出重新装载。
以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不会使相应技术方案的本质脱离本发明各实施例技术方案的保护范围。

Claims (4)

1.一种硅片插片机的防隐裂上料设备,其特征在于,包括水床滑台本体和设于水床滑台本体上的硅片夹具;硅片夹具包括具有凸台的载板,凸台转动设有定位元件;
定位元件包括T型杆和连接在T型杆上的定位接触部,T型杆一端连接有齿杆;凸台内滑动设有与齿杆啮合的直齿板,凸台还转动设有与直齿板螺纹连接的丝杆,通过转动丝杆,使丝杆驱动直齿板滑动,直齿板通过齿杆,使T型杆带动定位接触部旋转;
其中,所述定位接触部包括固定设于T型杆的圆块,圆块连接有直杆,直杆圆周外表面转动连接有空心杆,空心杆外壁设有相对设置的光滑钢板和硅胶材质制成的防护板,空心杆远离圆块的一端设有环形齿板,直杆远离圆块的一端转动设有与环形齿板啮合的齿轮,通过转动齿轮,使环形齿板带动空心杆转动,空心杆带动光滑钢板和防护板转动,所述载板包括定板和与定板转动连接的动板,动板能够相对定板转动,硅胶板下表面与定板上表面固定,硅胶板下表面与动板上表面紧密贴合,所述定板下表面设有卡槽管,卡槽管内滑动连接有光滑杆,动板下表面设有卡套,光滑杆远离卡槽管的一端设有与卡套相卡合的卡杆,所述光滑杆外壁开设有半圆槽,半圆槽内阻尼转动设有调节杆,调节杆一端贯穿卡杆并转动连接有握杆,通过旋转握杆带动调节杆绕卡杆进行阻尼旋转,调节杆外壁套设有能够与动板下表面紧密贴合的橡胶杆,调节杆与橡胶杆的非中心处相连接,凸台底部开设有滑槽,直齿板滑动连接在滑槽内,定位元件共设有四组,四组定位元件等距分布在载板的四个方位上。
2.根据权利要求1所述的一种硅片插片机的防隐裂上料设备,其特征在于,所述载板上表面设置有硅胶板。
3.根据权利要求1所述的一种硅片插片机的防隐裂上料设备,其特征在于,所述定板上表面设有能够与动板上表面相贴合的限位块,以对动板的转动进行限位。
4.根据权利要求1所述的一种硅片插片机的防隐裂上料设备,其特征在于,所述载板下表面固定连接有垫块。
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202585507U (zh) * 2012-04-20 2012-12-05 中国电子科技集团公司第四十八研究所 一种花篮盒自动插片机用上料盒
CN210006711U (zh) * 2019-07-30 2020-01-31 天津创昱达光伏科技有限公司 双工位硅片插片机
CN210325731U (zh) * 2019-09-09 2020-04-14 苏州阿特斯阳光电力科技有限公司 一种电池片承载盒
CN217933743U (zh) * 2022-07-14 2022-11-29 无锡京运通科技有限公司 一种用于插片机的自动上料机构
CN116845026A (zh) * 2023-08-11 2023-10-03 芜湖义柏载具精密技术有限公司 晶圆载具及用于操作该晶圆载具的夹持调整装置及方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202585507U (zh) * 2012-04-20 2012-12-05 中国电子科技集团公司第四十八研究所 一种花篮盒自动插片机用上料盒
CN210006711U (zh) * 2019-07-30 2020-01-31 天津创昱达光伏科技有限公司 双工位硅片插片机
CN210325731U (zh) * 2019-09-09 2020-04-14 苏州阿特斯阳光电力科技有限公司 一种电池片承载盒
CN217933743U (zh) * 2022-07-14 2022-11-29 无锡京运通科技有限公司 一种用于插片机的自动上料机构
CN116845026A (zh) * 2023-08-11 2023-10-03 芜湖义柏载具精密技术有限公司 晶圆载具及用于操作该晶圆载具的夹持调整装置及方法

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