CN117285758A - 高导热高介电橡胶树脂材料及应用其的金属基板 - Google Patents
高导热高介电橡胶树脂材料及应用其的金属基板 Download PDFInfo
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- CN117285758A CN117285758A CN202210867837.0A CN202210867837A CN117285758A CN 117285758 A CN117285758 A CN 117285758A CN 202210867837 A CN202210867837 A CN 202210867837A CN 117285758 A CN117285758 A CN 117285758A
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- rubber resin
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- 229920005989 resin Polymers 0.000 title claims abstract description 68
- 239000011347 resin Substances 0.000 title claims abstract description 68
- 239000000463 material Substances 0.000 title claims abstract description 65
- 239000000758 substrate Substances 0.000 title claims abstract description 54
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 39
- 239000002184 metal Substances 0.000 title claims abstract description 39
- 229920002595 Dielectric elastomer Polymers 0.000 title claims abstract description 26
- 229920001971 elastomer Polymers 0.000 claims abstract description 114
- 239000005060 rubber Substances 0.000 claims abstract description 114
- 239000011256 inorganic filler Substances 0.000 claims abstract description 84
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 84
- 239000007788 liquid Substances 0.000 claims abstract description 50
- 239000011342 resin composition Substances 0.000 claims abstract description 42
- 229920001955 polyphenylene ether Polymers 0.000 claims abstract description 36
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 33
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 15
- 229910052582 BN Inorganic materials 0.000 claims abstract description 13
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 13
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 12
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 claims abstract description 10
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims abstract description 10
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000004408 titanium dioxide Substances 0.000 claims abstract description 9
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 8
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 6
- 239000000395 magnesium oxide Substances 0.000 claims abstract description 6
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract description 6
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims abstract description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 6
- 239000011787 zinc oxide Substances 0.000 claims abstract description 6
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 34
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 33
- 239000000178 monomer Substances 0.000 claims description 28
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims description 20
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 19
- -1 acryl group Chemical group 0.000 claims description 15
- 239000007822 coupling agent Substances 0.000 claims description 15
- 229920001296 polysiloxane Polymers 0.000 claims description 14
- 229920002554 vinyl polymer Polymers 0.000 claims description 9
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims description 4
- 239000000470 constituent Substances 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 13
- 239000003063 flame retardant Substances 0.000 description 13
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 8
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 229910000077 silane Inorganic materials 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 229920003244 diene elastomer Polymers 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 4
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 4
- 239000005062 Polybutadiene Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 229910052740 iodine Inorganic materials 0.000 description 4
- 239000011630 iodine Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 229920002857 polybutadiene Polymers 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 125000005504 styryl group Chemical group 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 229920003193 cis-1,4-polybutadiene polymer Polymers 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- 229920003194 trans-1,4-polybutadiene polymer Polymers 0.000 description 3
- GBZVNKQWXLVYNG-UHFFFAOYSA-N (3-phosphonooxyphenyl) dihydrogen phosphate Chemical compound OP(O)(=O)OC1=CC=CC(OP(O)(O)=O)=C1 GBZVNKQWXLVYNG-UHFFFAOYSA-N 0.000 description 2
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- DYIZJUDNMOIZQO-UHFFFAOYSA-N 4,5,6,7-tetrabromo-2-[2-(4,5,6,7-tetrabromo-1,3-dioxoisoindol-2-yl)ethyl]isoindole-1,3-dione Chemical compound O=C1C(C(=C(Br)C(Br)=C2Br)Br)=C2C(=O)N1CCN1C(=O)C2=C(Br)C(Br)=C(Br)C(Br)=C2C1=O DYIZJUDNMOIZQO-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 239000004641 Diallyl-phthalate Substances 0.000 description 2
- QZRGKCOWNLSUDK-UHFFFAOYSA-N Iodochlorine Chemical compound ICl QZRGKCOWNLSUDK-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229920005603 alternating copolymer Polymers 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 2
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 2
- PJPJSHUNZMHBRI-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2,3,4,5-tetrabromo-6-(2,3,4,5,6-pentabromophenoxy)phenoxy]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br PJPJSHUNZMHBRI-UHFFFAOYSA-N 0.000 description 1
- YMIUHIAWWDYGGU-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2,3,5,6-tetrabromo-4-(2,3,4,5,6-pentabromophenoxy)phenoxy]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC(C(=C1Br)Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br YMIUHIAWWDYGGU-UHFFFAOYSA-N 0.000 description 1
- 238000011925 1,2-addition Methods 0.000 description 1
- LLGQASFNQPXBKT-UHFFFAOYSA-N 2,4,5,6-tetraphenylbenzene-1,3-diol Chemical compound C=1C=CC=CC=1C1=C(C=2C=CC=CC=2)C(O)=C(C=2C=CC=CC=2)C(O)=C1C1=CC=CC=C1 LLGQASFNQPXBKT-UHFFFAOYSA-N 0.000 description 1
- 239000004114 Ammonium polyphosphate Substances 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- KKUKTXOBAWVSHC-UHFFFAOYSA-N Dimethylphosphate Chemical compound COP(O)(=O)OC KKUKTXOBAWVSHC-UHFFFAOYSA-N 0.000 description 1
- ASMQGLCHMVWBQR-UHFFFAOYSA-N Diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)(O)OC1=CC=CC=C1 ASMQGLCHMVWBQR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229920000388 Polyphosphate Polymers 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 1
- 229920001276 ammonium polyphosphate Polymers 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- ASMQGLCHMVWBQR-UHFFFAOYSA-M diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)([O-])OC1=CC=CC=C1 ASMQGLCHMVWBQR-UHFFFAOYSA-M 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical compound CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 1
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000001205 polyphosphate Substances 0.000 description 1
- 235000011176 polyphosphates Nutrition 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 1
- 235000019345 sodium thiosulphate Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- GRPURDFRFHUDSP-UHFFFAOYSA-N tris(prop-2-enyl) benzene-1,2,4-tricarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C(C(=O)OCC=C)=C1 GRPURDFRFHUDSP-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical group [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
- C08L9/06—Copolymers with styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F236/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds
- C08F236/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds
- C08F236/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds conjugated
- C08F236/06—Butadiene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/14—Layered products comprising a layer of natural or synthetic rubber comprising synthetic rubber copolymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/06—Hydrocarbons
- C08F212/08—Styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/34—Monomers containing two or more unsaturated aliphatic radicals
- C08F212/36—Divinylbenzene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/04—Anhydrides, e.g. cyclic anhydrides
- C08F222/06—Maleic anhydride
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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Abstract
本发明公开一种高导热高介电橡胶树脂材料及应用其的金属基板,橡胶树脂材料包括一橡胶树脂组合物、一第一无机填料及一第二无机填料。其中橡胶树脂组合物包括30重量百分比至60重量百分比的液态橡胶、10重量百分比至30重量百分比的聚苯醚树脂及20重量百分比至40重量百分比的交联剂,液态橡胶的分子量为2500g/mol至6000g/mol。第一无机填料是选自于氧化铝、氮化硼、氧化镁、氧化锌、氮化铝、碳化硅及硅酸铝所组成的群组,第二无机填料是选自于二氧化硅、钛酸锶、钛酸钙及二氧化钛所组成的群组。借此,可以让金属基板具有所欲的热导率和介电常数。
Description
技术领域
本发明涉及一种橡胶树脂材料及其应用,特别是涉及一种高导热高介电橡胶树脂材料及应用其的金属基板。
背景技术
随着第五代行动通信技术(5th generation wireless system,5G)的发展,为了符合5G无线通信的标准,高频传输无疑是目前发展的主流趋势。据此,业界致力于发展适用于高频传输(例如:6GHz至77GHz的频率范围)的高频基板材料,以使高频基板可应用于基站天线、卫星雷达、汽车用雷达、无线通信天线或是功率放大器。
为了具备高频传输的功能,高频基板通常具有高介电常数(dielectricconstant,Dk)和高介电损耗(dielectric dissipation factor,Df)的特性。以下将高频基板的介电常数和介电损耗,合称为高频基板的介电特性。
目前市面上的橡胶树脂材料通常会添加一定比例的液态橡胶,液态橡胶具有溶解度高以及具有反应性官能基的特点,可使橡胶树脂材料适用于作为高频基板材料。然而,液态橡胶无法无上限的添加,当液态橡胶的含量过高(大于25重量百分比),会使得橡胶树脂材料的玻璃转移温度(glass transition temperature,Tg)偏低,且容易导致基板的剥离强度不佳的问题。
另外,橡胶树脂材料也会添加一定比例的导热填料,以提升橡胶树脂材料的导热性;相对于100重量份的树脂,导热填料的添加量至少需大于45重量份至60重量份。然而,过多的导热填料会负面影响橡胶树脂材料与导热填料的界面兼容性,进而影响基板的耐热性,而不利应用于高频基板材料。
发明内容
本发明所要解决的技术问题在于,针对现有技术的不足提供一种高导热高介电橡胶树脂材料及应用其的金属基板。
为了解决上述的技术问题,本发明所采用的其中一技术方案是提供一种高导热高介电橡胶树脂材料,其包括一橡胶树脂组合物、一第一无机填料及一第二无机填料。所述橡胶树脂组合物包括30重量百分比至60重量百分比的液态橡胶、10重量百分比至30重量百分比的聚苯醚树脂及20重量百分比至40重量百分比的交联剂,其中液态橡胶的分子量为2500g/mol至6000g/mol。所述第一无机填料是选自于氧化铝、氮化硼、氧化镁、氧化锌、氮化铝、碳化硅及硅酸铝所组成的群组。所述第二无机填料是选自于二氧化硅、钛酸锶、钛酸钙及二氧化钛所组成的群组。
在本发明的一实施例中,所述液态橡胶的组成单体选自于苯乙烯单体、丁二烯单体、二乙烯基苯单体及马来酸酐单体所组成的群组。
在本发明的一实施例中,在所述液态橡胶的全部末端基中,乙烯基的占比为30摩尔百分比至90摩尔百分比,苯乙烯基的占比为10摩尔百分比至50摩尔百分比。
在本发明的一实施例中,以所述丁二烯单体的总重为基础计,30重量百分比至90重量百分比的所述丁二烯单体具有含乙烯基的侧链。
在本发明的一实施例中,所述第一无机填料经表面处理以具有压克力基及/或乙烯基。
在本发明的一实施例中,相对于100重量份的所述橡胶树脂组合物,所述第一无机填料的添加量为100重量份至150重量份,且所述第二无机填料的添加量为20重量份至250重量份。
在本发明的一实施例中,相对于100重量份的所述橡胶树脂组合物,所述第一无机填料包括5重量份至120重量份的氧化铝、10重量份至100重量份的氮化硼及30重量份至80重量份的硅酸铝,且所述第二无机填料包括20重量份至50重量份的二氧化钛、钛酸锶、钛酸钙或其组合物及10重量份至40重量份的二氧化硅。
在本发明的一实施例中,所述高导热高介电橡胶树脂材料还包括一硅氧烷偶合剂,且所述硅氧烷偶合剂具有压克力基及/或乙烯基。
在本发明的一实施例中,相对于100重量份的所述橡胶树脂组合物,所述硅氧烷偶合剂的含量为0.1重量份至5重量份。
为了解决上述的技术问题,本发明所采用的另外一技术方案是提供一种金属基板,其包括一基材层及设置于所述基材层上的一金属层,其中所述基材层的材料包括具有上述组成的高导热高介电橡胶树脂材料。
在本发明的一实施例中,所述金属基板的热导率为大于或等于1.2W/m·K。
在本发明的一实施例中,所述金属基板的介电常数为6至12。
在本发明的一实施例中,所述金属基板的剥离强度为4.5lb/in至7lb/in。
本发明的其中一有益效果在于,本发明所提供的高导热高介电橡胶树脂材料及金属基板,其能通过“橡胶树脂组合物包括30重量百分比至60重量百分比的液态橡胶,其分子量为2500g/mol至6000g/mol”以及“第一无机填料是选自于氧化铝、氮化硼、氧化镁、氧化锌、氮化铝、碳化硅及硅酸铝所组成的群组,第二无机填料是选自于二氧化硅、钛酸锶、钛酸钙及二氧化钛所组成的群组”的技术方案,以达到实际应用所需的物性要求如热导率、介电特性、剥离强度、耐热性等。
为使能更进一步了解本发明的特征及技术内容,请参阅以下有关本发明的详细说明与附图,然而所提供的附图仅用于提供参考与说明,并非用来对本发明加以限制。
附图说明
图1为应用本发明的高导热高介电橡胶树脂材料的金属基板的其中一结构示意图。
图2为应用本发明的高导热高介电橡胶树脂材料的金属基板的另外一结构示意图。
具体实施方式
以下是通过特定的具体实施例来说明本发明所公开有关“高导热高介电橡胶树脂材料及应用其的金属基板”的实施方式,本领域技术人员可由本说明书所公开的内容了解本发明的优点与效果。本发明可通过其他不同的具体实施例加以施行或应用,本说明书中的各项细节也可基于不同观点与应用,在不背离本发明的构思下进行各种修改与变更。另外,本发明的附图仅为简单示意说明,并非依实际尺寸的描绘,事先声明。以下的实施方式将进一步详细说明本发明的相关技术内容,但所公开的内容并非用以限制本发明的保护范围。另外,本文中所使用的术语“或”,应视实际情况可能包括相关联的列出项目中的任一个或者多个的组合。
高导热高介电橡胶树脂材料
本发明提供一种高导热高介电橡胶树脂材料,其是于橡胶树脂系统中同时导入两种不同的无机填料而形成。如此一来,橡胶树脂系统的物性,包括热导率和介电特性,可以满足高频高速的应用需求,与现有的材料相比更适合作为高频高速基板材料。
具体来说,本发明的橡胶树脂材料包括一橡胶树脂组合物、一第一无机填料(即高导热无机填料)及一第二无机填料(即高介电无机填料),且第一和第二无机填料均匀分散于橡胶树脂组合物中。以下将叙述橡胶树脂组合物、第一无机填料与第二无机填料的具体细节。
橡胶树脂组合物
本发明的橡胶树脂组合物包括:30重量百分比(wt%)至60重量百分比的液态橡胶、10重量百分比至30重量百分比的聚苯醚树脂及20重量百分比至40重量百分比的交联剂。
值得一提的是,当液态橡胶的分子量为2500g/mol至6000g/mol时,橡胶树脂组合物的流动性可以获得提升,从而达到优化橡胶树脂材料的填胶性的效果。液态橡胶的分子量较佳为3000g/mol至5500g/mol,且更佳为3000g/mol至5000g/mol。液态橡胶具有溶解度高的特点,可提升各成分之间的兼容性。并且,液态橡胶具有反应性官能基的特点,可提升橡胶树脂材料固化后的交联度。
此外,液态橡胶具有特定的分子量,并具有特定的结构和单体单元,因此可以被更大量地添加到橡胶树脂组合物中,即液态橡胶在橡胶树脂组合物中的占比可以大幅增加。具体来说,以橡胶树脂组合物的总重为100重量百分比计,液态橡胶在橡胶树脂组合物中的含量可大于40重量百分比,明显高于现有的液态橡胶材料中液态橡胶的含量(25重量百分比)。较佳地,液态橡胶在橡胶树脂组合物中的含量为30重量百分比至60重量百分比。
于一些实施例中,液态橡胶包括液态二烯系橡胶。具体来说,液态二烯系橡胶包括聚丁二烯树脂,聚丁二烯树脂是指使用丁二烯单体所合成的聚合物,例如:丁二烯均聚物或丁二烯与其他单体的共聚物。
于一些实施例中,液态二烯系橡胶是丁二烯与苯乙烯形成的共聚物。也就是说,构成液态橡胶的单体中包括苯乙烯以及丁二烯。苯乙烯单体以及丁二烯单体可随机排列而形成随机共聚合物(random copolymer),或者,苯乙烯单体以及丁二烯单体也可以规则排列形成交替共聚合物(alternating copolymer)或嵌段共聚合物(block copolymer)。
以液态橡胶的总重为100重量百分比,苯乙烯单体在液态橡胶中的含量为10重量百分比至50重量百分比。当苯乙烯单体在液态橡胶中的含量为10重量百分比至50重量百分比时,液态橡胶可具有类似液晶分子排列方式的分子几何结构,以提升耐热性及体系兼容性。较佳的,苯乙烯单体在液态橡胶中的含量为15重量百分比至50重量百分比。若苯乙烯单体的含量高于50重量百分比,则橡胶树脂材料的黏度会偏高,而不利于制造高导热金属基板。
更进一步来说,丁二烯单体本身具有两个双键,因此,在聚合时,会因为聚合的方式不同,而导致不同的结构。也就是说,聚丁二烯可以是由顺式-1,4-聚丁二烯、反式-1,4-聚丁二烯、1,2-聚丁二烯之中任意一种或多种结构所组成。具体来说,当丁二烯进行1,4加成聚合反应时,会产生顺式-1,4-聚丁二烯或反式-1,4-聚丁二烯的结构,在顺式-1,4-聚丁二烯或反式-1,4-聚丁二烯的结构中,聚丁二烯不具有不饱和侧链。当丁二烯进行1,2加成聚合反应时,会产生1,2-聚丁二烯的结构,在1,2-聚丁二烯的结构中,聚丁二烯具有不饱和侧链(乙烯基)。
较佳地,以丁二烯单体的总重为基础计,30重量百分比至90重量百分比的丁二烯单体(于聚合后)具有含乙烯基的侧链。较佳的,以丁二烯单体的总重为基础计,30重量百分比至80重量百分比的丁二烯单体(于聚合后)具有含乙烯基的侧链;或是,30重量百分比至80重量百分比的丁二烯单体(于聚合后)具有乙烯基侧链。
当液态橡胶具有至少一个含乙烯基的不饱和侧链(或乙烯基),橡胶树脂组合物于交联后的架桥密度以及耐热特性皆可获得提升。并且,于本发明中,液态橡胶中含乙烯基的不饱和侧链(或乙烯基)可通过化学分析中的碘价来定量。
当液态橡胶中含乙烯基的不饱和侧链(或乙烯基)的含量越高时,液态橡胶的碘价越高。含乙烯基的不饱和侧链(或乙烯基)可提升橡胶树脂组合物于交联后的物理特性。本发明中液态橡胶的碘价为30g/100g至60g/100g。
碘价的测定方式是先取样0.3至1毫克的液态橡胶,并添加氯仿以完全溶解,加入韦氏溶液(Wijs solution)后,于暗处静置30分钟。接着,加入20毫升的碘化钾溶液(100g/L)以及100毫升的水后,以0.1mol/L的硫代硫酸钠溶液滴定,待溶液变成淡黄色时,加入数滴淀粉溶液(10g/L),滴定至蓝色消失。
于一些实施例中,液态二烯系橡胶是丁二烯单体、苯乙烯单体、二乙烯基苯单体与马来酸酐单体所形成的共聚物。也就是说,液态橡胶的组成单体包括苯乙烯单体、丁二烯单体、二乙烯基苯单体以及马来酸酐单体。苯乙烯单体、丁二烯单体、二乙烯基苯单体与马来酸酐单体可以呈规则排列或随机排列。若以丁二烯单体、苯乙烯单体、二乙烯基苯单体与马来酸酐单体的总量为100摩尔百分比,丁二烯单体的含量可为30至90摩尔百分比,苯乙烯单体的含量为10至50摩尔百分比,二乙烯基苯单体的含量可为10至40摩尔百分比,且马来酸酐单体的含量可为2至20摩尔百分比。液态二烯系橡胶中,二乙烯基苯单体和马来酸酐单体能起到提高剥离强度(peeling)和耐热性的作用。
聚苯醚树脂的分子量为1000g/mol至20000g/mol;较佳的,聚苯醚树脂的分子量为2000g/mol至10000g/mol;更佳的,聚苯醚树脂的分子量为2000g/mol至2200g/mol。值得说明的是,当聚苯醚树脂的分子量小于20000g/mol时有更好的溶剂溶解性,而这样的特性有利于橡胶树脂组合物的制备。
较佳地,聚苯醚树脂可具有至少一改性基,改性基可以是选自于由下列分子团所组成的群组:羟基、胺基、乙烯基、苯乙烯基、甲基丙烯酸酯基和环氧基。聚苯醚树脂的改性基可提供不饱和键,以利交联反应进行,而可形成具有高玻璃转移温度且耐热性良好的材料。于本实施例中,聚苯醚树脂的分子结构中相对的二末端各具有一改性基,且上述两个改性基相同。
较佳地,聚苯醚树脂中可以包括单一种类的聚苯醚或是同时包含多种聚苯醚。
举例来说,聚苯醚可以是沙特基础工业公司(SABIC)生产的SA90(二末端的改性基为羟基)或SA9000(二末端的改性基为甲基丙烯酸酯基),或是三菱瓦斯化学株式会社(MGC)生产的OPE-2St(二末端的改性基为苯乙烯基)、OPE-2EA(二末端的改性基为甲基丙烯酸酯基)或OPE-2Gly(二末端的改性基为环氧基)。然而,本发明不以上述所举的例子为限。
举例来说,聚苯醚可以是二末端的改性基为羟基的聚苯醚、二末端的改性基为甲基丙烯酸酯基的聚苯醚、二末端的改性基为苯乙烯基的聚苯醚或是二末端的改性基为环氧基的聚苯醚。然而,本发明不以此为限。
于一些实施例中,聚苯醚树脂可包括一第一聚苯醚和一第二聚苯醚,第一聚苯醚和第二聚苯醚的分子末端分别具有至少一改性基,改性基是选自于由下列分子团所组成的群组:羟基、胺基、乙烯基、苯乙烯基、甲基丙烯酸酯基和环氧基;且第一聚苯醚的改性基不同于第二聚苯醚的改性基。具体来说,第一聚苯醚和第二聚苯醚的重量比例为0.5至1.5,较佳的,第一聚苯醚和第二聚苯醚的重量比例为0.75至1.25,更佳的,第一聚苯醚和第二聚苯醚的重量比例为1。
举例来说,第一聚苯醚和第二聚苯醚可以各自独立是二末端的改性基为羟基的聚苯醚、二末端的改性基为甲基丙烯酸酯基的聚苯醚、二末端的改性基为苯乙烯基的聚苯醚或是二末端的改性基为环氧基的聚苯醚。然而,本发明不以此为限。
第一聚苯醚和第二聚苯醚可以各自独立是沙特基础工业公司(SABIC)生产的SA90(二末端的改性基为羟基)或SA9000(二末端的改性基为甲基丙烯酸酯基),或是三菱瓦斯化学株式会社(MGC)生产的OPE-2St(二末端的改性基为苯乙烯基)、OPE-2EA(二末端的改性基为甲基丙烯酸酯基)或OPE-2Gly(二末端的改性基为环氧基)。然而,本发明不以上述所举的例子为限。
本发明的交联剂,可提升聚苯醚树脂和液态橡胶的交联程度。于本实施例中,交联剂可包含烯苯基(allyl group)。举例来说,交联剂可以是三烯丙基氰脲酸酯(triallylcyanurate,TAC)、三烯丙基异氰脲酸酯(triallyl isocyanurate,TAIC)、邻苯二甲酸二烯丙酯(diallyl phthalate)、二乙烯苯(divinylbenzene)、苯三甲酸三烯丙酯(triallyltrimellitate)或其任意组合。较佳的,交联剂是三烯丙基异氰脲酸酯。然而,本发明不以上述所举的例子为限。
第一无机填料
第一无机填料的添加可帮助降低橡胶树脂材料的黏度,也可帮助提升高橡胶树脂材料的导热性。以上仅是对第一无机填料的作用的概述,并不是为了限制本发明。实际应用时,第一无机填料也可能提升橡胶树脂材料的介电特性。
于本发明中,第一无机填料可以是选自于由下列所构成的群组:氧化铝、氮化硼、氧化镁、氧化锌、氮化铝、碳化硅、硅酸铝及其任意组合。然而,本发明不以上述所举的例子为限。于一较佳实施例中,第一无机填料包括氧化铝及氮化硼中的至少一种。
于一较佳实施例中,第一无机填料可经过表面处理,使得第一无机填料的表面具有压克力基及/或乙烯基,即具有压克力基及乙烯基中的至少一种。如此一来,第一无机填料可与液态橡胶发生反应,使得橡胶树脂组合物具有良好的兼容性,而不会负面影响金属基板的耐热性。并且,橡胶树脂材料中第一无机填料的添加量,可高于现有技术中无机填料的添加上限值。因此,本发明的橡胶树脂材料更适合作为高频基板材料。
值得注意的是,第一无机填料可以是单一无机物的粉料或是由多种无机物的粉料混合而成。并且,第一无机填料可以全部经过表面处理,或是只有部分经过表面处理。在第一无机填料包括氧化铝及氮化硼的具体例中,氧化铝经过表面改性而具有压克力基及/或乙烯基,而氮化硼未经过表面改性。以上所述只是可行的实施方式,而并非用以限制本发明。
于一较佳实施例中,第一无机填料同时包括氧化铝、氮化硼及硅酸铝。相对于100重量份的橡胶树脂组合物,氧化铝的添加量为50重量份至120重量份,氮化硼的添加量为10重量份至100重量份,硅酸铝的添加量为30重量份至80重量份。
具体来说,第一无机填料进行表面处理的方式为含浸于具有特定官能基的硅烷中(例如:具有乙烯基的硅烷或具有压克力基的硅烷),以使第一无机填料可具有压克力基及/或乙烯基。
第一无机填料的添加量可依产品规格需求进行调整,于一些实施例中,相对于100重量份的橡胶树脂组合物的总重,第一无机填料的添加量为100重量份至150重量份。较佳的,相对于100重量份的橡胶树脂组合物,第一无机填料的添加量为110重量份至140重量份。更佳的,相对于100重量份的橡胶树脂组合物,第一无机填料的添加量为120重量份至130重量份。以上所述只是可行的实施方式,而并非用以限制本发明。
第一无机填料的外型可以呈颗粒状或片状,较佳的,第一无机填料的外型是片状。第一无机填料的平均粒径为0.3微米至30微米,并且,第一无机填料的粒径分布范围介于0.3微米至30微米之间,以利于使第一无机填料均匀的分散于橡胶树脂组合物之中。
第二无机填料
第二无机填料的添加可帮助降低橡胶树脂材料的黏度,也可帮助降低橡胶树脂材料的介电常数。以上仅是对第二无机填料的作用的概述,并不是为了限制本发明。实际应用时,第二无机填料也可能提升橡胶树脂材料的导热性。
于本发明中,第二无机填料是选自于二氧化硅、钛酸锶、钛酸钙及二氧化钛所组成的群组。然而,本发明不以上述所举的例子为限。于一较佳实施例中,第二无机填料同时包括二氧化硅以及二氧化钛,其中二氧化钛可替换为钛酸锶、钛酸钙或其组合物。二氧化硅可以为熔融型或是结晶型的二氧化硅。较佳的,二氧化硅是熔融型二氧化硅。
于一较佳实施例中,第二无机填料经表面处理,使得其表面具有压克力基及/或乙烯基,即具有压克力基及乙烯基中的至少一种。如此一来,第二无机填料可与液态橡胶发生反应,使得橡胶树脂组合物具有良好的兼容性,而不会负面影响金属基板的耐热性。并且,橡胶树脂材料中第二无机填料的添加量,可高于现有技术中无机填料的添加上限值。因此,本发明的橡胶树脂材料更适合作为高频基板材料。
值得注意的是,第二无机填料可以是单一无机物的粉料或是由多种无机物的粉料混合而成。并且,第二无机填料可以全部经过表面处理,或是只有部分经过表面处理。在第二无机填料包括二氧化硅的具体例中,其中一部分的二氧化硅经过表面改性而具有压克力基及/或乙烯基,而另外一部分的二氧化硅未经过表面改性。以上所述只是可行的实施方式,而并非用以限制本发明。
具体来说,第二无机填料进行表面处理的方式为含浸于具有特定官能基的硅烷中(例如:具有乙烯基的硅烷或具有压克力基的硅烷),以使第二无机填料可具有压克力基及/或乙烯基。
第二无机填料的添加量可依产品规格需求进行调整,于一些实施例中,相对于100重量份的橡胶树脂组合物,第二无机填料的添加量为20重量份至250重量份。较佳的,相对于100重量份的橡胶树脂组合物,第二无机填料的添加量为30重量份至200重量份。更佳的,相对于100重量份的橡胶树脂组合物,第二无机填料的添加量为40重量份至160重量份。以上所述只是可行的实施方式,而并非用以限制本发明。
于一较佳实施例中,相对于100重量份的橡胶树脂组合物,第二无机填料包括:20重量份至50重量份的二氧化钛、钛酸锶、钛酸钙或其组合物,以及10重量份至40重量份的二氧化硅。
第二无机填料的外型可以呈球型。第二无机填料的平均粒径为0.3微米至3微米,并且,第二无机填料的粒径的分布范围介于0.3微米至3微米之间,以利于使第二无机填料均匀的分散于橡胶树脂组合物之中。
硅氧烷偶合剂
本发明的橡胶树脂材料可进一步包括一硅氧烷偶合剂。硅氧烷偶合剂的添加可提升纤维布、高导热橡胶树脂与填料(包括第一无机填料及第二无机填料)之间的反应性以及兼容性,进而提升金属基板的剥离强度与耐热性。
于一较佳实施例中,硅氧烷偶合剂具有压克力基和或乙烯基中的至少一种。硅氧烷偶合剂的分子量为100g/mol至500g/mol。较佳的,硅氧烷偶合剂的分子量为110g/mol至250g/mol。更佳的,硅氧烷偶合剂的分子量为120g/mol至200g/mol。
相对于100重量份的橡胶树脂组合物,硅氧烷偶合剂的含量为0.1重量份至5重量份。较佳的,相对于100重量份的橡胶树脂组合物,硅氧烷偶合剂的含量为0.5重量份至3重量份。
阻燃剂
本发明的橡胶树脂材料可进一步包括一阻燃剂。阻燃剂的添加,可提升高频基板的阻燃特性。举例来说,阻燃剂可以是磷系阻燃剂或溴系阻燃剂。较佳的,阻燃剂是无卤阻燃剂,即阻燃剂不含有卤素。
溴系阻燃剂可以是乙撑双四溴邻苯二甲酰亚胺(ethylenebistetrabromophthalimide)、双(五溴苯氧基)四溴苯(tetradecabromodiphenoxybenzene)、十溴联苯氧化物(decabromo diphenoxy oxide)或其任意组合,但不限于此。
磷系阻燃剂可以是磷酸脂类(sulphosuccinic acid ester)、磷腈类(phosphazene)、聚磷酸铵类、磷酸三聚氰胺类(melamine polyphosphate)或氰尿酸三聚氰胺类(melamine cyanurate)。磷酸脂类包括三苯基磷酸脂(triphenyl phosphate,TPP)、间苯二酚双磷酸脂(tetraphenyl resorcinol bis(diphenylphosphate),RDP)、双酚A二(二苯基)磷酸脂(bisphenol A bis(diphenyl phosphate),BPAPP)、双酚A二(二甲基)磷酸脂(BBC)、二磷酸间苯二酚酯(例如DAIHACHI生产的CR-733S)、间苯二酚-双(二-2,6-二甲基苯基磷酸酯)(例如大八化学株式会社生产的PX-200)。然而,本发明不以此为限。
阻燃剂的添加量可依产品规格需求进行调整。于一些实施例中,相对于100重量份的橡胶树脂组合物,阻燃剂的含量为0.1重量份至5重量份。
金属基板
请参阅图1及图2所示,本发明还提供一种金属基板Z,其包括一基材层1及设置于基材层1上的至少一金属层2,其中基材层1的材料包括具有上述组成的高导热高介电橡胶树脂材料。具体来说,金属基板Z可为一铜箔基板(Copper Clad Laminate,CCL),其中金属层2(铜箔层)的数量可以只有一个,其形成于基材层1的其中一表面(如上表面)上;或者,金属层2的数量可以有两个,其分别形成于基材层1的相对两表面(如上、下表面)上。
具体来说,金属基板Z的介电常数(10GHz)为6至12。金属基板Z的介电损耗为0.0040以下,较佳为0.0035以下,且更佳为0.0030以下。金属基板Z的热导率为大于或等于1.2W/m·K,较佳为1.3W/m·K,且更佳为1.4W/m·K。金属基板Z的剥离强度为4.5lb/in至7lb/in,且较佳为5lb/in至7lb/in。
评估金属基板Z特性的方式如下:
(1)介电常数(10GHz):使用介电分析仪(Dielectric Analyzer)(型号HP AgilentE5071C),测试在频率10G Hz时的介电常数。
(2)介电损耗(10GHz):使用介电分析仪(Dielectric Analyzer)(型号HP AgilentE5071C),测试在频率10G Hz时的介电损耗。
(3)剥离强度测试:根据IPC-TM-650-2.4.8测试方法,测试铜箔基板的剥离强度。
(4)热导率:根据ASTM D5470的测试方法,测试铜箔基板的热导值。
实施例的有益效果
本发明的其中一有益效果在于,本发明所提供的高导热高介电橡胶树脂材料及金属基板,其能通过“橡胶树脂组合物包括30重量百分比至60重量百分比的液态橡胶,其分子量为2500g/mol至6000g/mol”以及“第一无机填料是选自于氧化铝、氮化硼、氧化镁、氧化锌、氮化铝、碳化硅及硅酸铝所组成的群组,第二无机填料是选自于二氧化硅、钛酸锶、钛酸钙及二氧化钛所组成的群组”的技术方案,以达到实际应用所需的物性要求如热导率、介电特性、剥离强度、耐热性等。
以上所公开的内容仅为本发明的优选可行实施例,并非因此局限本发明的权利要求书的保护范围,所以凡是运用本发明说明书及附图内容所做的等效技术变化,均包含于本发明的权利要求书的保护范围内。
Claims (13)
1.一种高导热高介电橡胶树脂材料,其特征在于,所述高导热高介电橡胶树脂材料包括一橡胶树脂组合物、一第一无机填料及一第二无机填料;
其中,所述橡胶树脂组合物包括:
30重量百分比至60重量百分比的液态橡胶,所述液态橡胶的分子量为2500g/mol至6000g/mol;
10重量百分比至30重量百分比的聚苯醚树脂;以及
20重量百分比至40重量百分比的交联剂;
其中,所述第一无机填料是选自于氧化铝、氮化硼、氧化镁、氧化锌、氮化铝、碳化硅及硅酸铝所组成的群组;
其中,所述第二无机填料是选自于二氧化硅、钛酸锶、钛酸钙及二氧化钛所组成的群组。
2.根据权利要求1所述的高导热高介电橡胶树脂材料,其特征在于,所述液态橡胶的组成单体是选自于苯乙烯单体、丁二烯单体、二乙烯基苯单体及马来酸酐单体所组成的群组。
3.根据权利要求2所述的高导热高介电橡胶树脂材料,其特征在于,在所述液态橡胶的全部末端基中,乙烯基的占比为30摩尔百分比至90摩尔百分比,苯乙烯基的占比为10摩尔百分比至50摩尔百分比。
4.根据权利要求2所述的高导热高介电橡胶树脂材料,其特征在于,以所述丁二烯单体的总重为基础计,30重量百分比至90重量百分比的所述丁二烯单体具有含乙烯基的侧链。
5.根据权利要求1所述的高导热高介电橡胶树脂材料,其特征在于,所述第一无机填料经表面处理以具有压克力基及/或乙烯基。
6.根据权利要求1所述的高导热高介电橡胶树脂材料,其特征在于,相对于100重量份的所述橡胶树脂组合物,所述第一无机填料的添加量为100重量份至150重量份,且所述第二无机填料的添加量为20重量份至250重量份。
7.根据权利要求6所述的高导热高介电橡胶树脂材料,其特征在于,相对于100重量份的所述橡胶树脂组合物,所述第一无机填料包括5重量份至120重量份的氧化铝、10重量份至100重量份的氮化硼及30重量份至80重量份的硅酸铝,且所述第二无机填料包括20重量份至50重量份的二氧化钛、钛酸锶、钛酸钙或其组合物及10重量份至40重量份的二氧化硅。
8.根据权利要求1所述的高导热高介电橡胶树脂材料,其特征在于,所述高导热高介电橡胶树脂材料还包括一硅氧烷偶合剂,且所述硅氧烷偶合剂具有压克力基及/或乙烯基。
9.根据权利要求8所述的高导热高介电橡胶树脂材料,其特征在于,相对于100重量份的所述橡胶树脂组合物,所述硅氧烷偶合剂的含量为0.1重量份至5重量份。
10.一种金属基板,其特征在于,所述金属基板包括一基材层及设置于所述基材层上的一金属层,其中所述基材层的材料包括根据权利要求1所述的高导热高介电橡胶树脂材料。
11.根据权利要求10所述的金属基板,其特征在于,所述金属基板的热导率为大于或等于1.2W/m·K。
12.根据权利要求10所述的金属基板,其特征在于,所述金属基板的介电常数为6至12。
13.根据权利要求10所述的金属基板,其特征在于,所述金属基板的剥离强度为4.5lb/in至7lb/in。
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