CN117264573A - UV (ultraviolet) glue reducing adhesive, preparation method and application thereof - Google Patents
UV (ultraviolet) glue reducing adhesive, preparation method and application thereof Download PDFInfo
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- CN117264573A CN117264573A CN202311405387.4A CN202311405387A CN117264573A CN 117264573 A CN117264573 A CN 117264573A CN 202311405387 A CN202311405387 A CN 202311405387A CN 117264573 A CN117264573 A CN 117264573A
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- component
- acrylate
- acrylic ester
- adhesive
- polymer
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- 230000001070 adhesive effect Effects 0.000 title claims abstract description 65
- 239000000853 adhesive Substances 0.000 title claims abstract description 64
- 239000003292 glue Substances 0.000 title claims abstract description 39
- 238000002360 preparation method Methods 0.000 title abstract description 27
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 41
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 38
- 239000002994 raw material Substances 0.000 claims abstract description 29
- -1 acrylic ester Chemical group 0.000 claims abstract description 25
- 239000003999 initiator Substances 0.000 claims abstract description 25
- 239000012948 isocyanate Substances 0.000 claims abstract description 23
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 23
- 239000004814 polyurethane Substances 0.000 claims abstract description 23
- 229920002635 polyurethane Polymers 0.000 claims abstract description 23
- 229920006222 acrylic ester polymer Polymers 0.000 claims abstract description 19
- 239000000126 substance Substances 0.000 claims abstract description 18
- 230000009477 glass transition Effects 0.000 claims abstract description 15
- 239000002904 solvent Substances 0.000 claims abstract description 13
- 239000005056 polyisocyanate Substances 0.000 claims description 30
- 229920001228 polyisocyanate Polymers 0.000 claims description 30
- 239000005057 Hexamethylene diisocyanate Substances 0.000 claims description 16
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 16
- 125000003118 aryl group Chemical group 0.000 claims description 15
- 238000002156 mixing Methods 0.000 claims description 15
- 238000009826 distribution Methods 0.000 claims description 12
- 238000007599 discharging Methods 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 10
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 229920000728 polyester Polymers 0.000 claims description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 2
- 238000001723 curing Methods 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 6
- 239000003795 chemical substances by application Substances 0.000 abstract description 4
- 238000000016 photochemical curing Methods 0.000 abstract description 4
- 239000003638 chemical reducing agent Substances 0.000 abstract description 3
- 238000006073 displacement reaction Methods 0.000 abstract description 2
- 230000002265 prevention Effects 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 39
- 239000000178 monomer Substances 0.000 description 23
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 20
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 16
- 239000000084 colloidal system Substances 0.000 description 15
- 230000008569 process Effects 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 238000004132 cross linking Methods 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 11
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 10
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 10
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 10
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 10
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 10
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 10
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 10
- 238000005520 cutting process Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 8
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 8
- 235000019400 benzoyl peroxide Nutrition 0.000 description 8
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 8
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 7
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 230000003796 beauty Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- 238000005979 thermal decomposition reaction Methods 0.000 description 3
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- UXLHXKNDSMMKDL-UHFFFAOYSA-N [phenoxy-(2,4,6-trimethylbenzoyl)oxyphosphoryl] 2,4,6-trimethylbenzoate Chemical compound P(=O)(OC1=CC=CC=C1)(OC(C1=C(C=C(C=C1C)C)C)=O)OC(C1=C(C=C(C=C1C)C)C)=O UXLHXKNDSMMKDL-UHFFFAOYSA-N 0.000 description 2
- 125000005396 acrylic acid ester group Chemical group 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- XNGJNGFXWWYBJS-UHFFFAOYSA-N phosphoroso-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=C(C(=O)P=O)C(C)=C1 XNGJNGFXWWYBJS-UHFFFAOYSA-N 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- YEQBHMVRNHTCPJ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;3-oxobutanoic acid Chemical compound CC(=C)C(O)=O.CC(=O)CC(O)=O YEQBHMVRNHTCPJ-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- KXBFLNPZHXDQLV-UHFFFAOYSA-N [cyclohexyl(diisocyanato)methyl]cyclohexane Chemical compound C1CCCCC1C(N=C=O)(N=C=O)C1CCCCC1 KXBFLNPZHXDQLV-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229940095102 methyl benzoate Drugs 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/24—Homopolymers or copolymers of amides or imides
- C09J133/26—Homopolymers or copolymers of acrylamide or methacrylamide
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to the field of photo-curing adhesives, in particular to a UV (ultraviolet) adhesive reducing agent, a preparation method and application thereof. The UV glue reducing raw materials comprise: and (3) a component A: 45-75% of acrylic ester polymer, 22-55% of terminal acrylic ester oligomer containing unsaturated double bonds and 0.5-5% of initiator according to the total mass of the component A; and the component B comprises the following components: 10-40% of isocyanate substances and the balance of solvent according to the total mass of the component B; the amount of the component B accounts for 3-18% of the mass of the component A. The acrylate polymer with specific glass transition temperature and weight average molecular weight is matched with polyurethane acrylate, and is crosslinked into a network structure through the isocyanate curing agent, so that the relative dosage of raw materials is regulated, the contradiction between adhesive strength and peeling strength is balanced, the fixation and displacement prevention of an adhered object can be realized, the peeling strength can be reduced to the minimum after photocuring, the effect of complete peeling is achieved, and meanwhile, no glue overflow and residual glue are generated.
Description
Technical Field
The invention relates to the technical field of photo-curing adhesives, in particular to a UV (ultraviolet) glue reducing adhesive, a preparation method and application thereof, and discloses a C09J133/08 adhesive.
Background
In the process of high-precision device processing (such as grinding and cutting processes of wafers, packaging parts and the like in the semiconductor industry, slotting and cutting of glass substrates and the like in the photoelectric industry, cutting of camera modules, pickling processes and the like), an adhesive tape or an adhesive is generally required to be used for fixing, so that damage caused by position movement of components in the cutting process is avoided. However, the adhesive tape for fixing needs to meet the requirements of high adhesive strength and low peeling strength after use, and the problems of component damage or surface pollution caused by too large peeling force when the adhesive tape or adhesive is removed are avoided.
The UV adhesive reducing tape, also called as a UV protective film, has higher initial adhesive strength, and the adhesive force is drastically reduced after UV illumination, so that the requirements of the high-precision device processing process can be met. However, the phenomenon of glue overflow occurs in the use process of the UV protective film at present, and the problems of glue residue, inapplicability to losing adhesion after illumination and the like exist, so that the yield in the processing process is greatly reduced.
Chinese patent CN107573875a discloses a textured UV-reduced adhesive and a preparation method thereof, and the raw materials of the textured UV-reduced adhesive comprise hydroxyl-containing resin or carboxyl-containing resin, a photoinitiator, polyacrylamide, a crosslinking agent and a solvent, but the initial viscosity is low, the peel strength after illumination is not high, and the problem of glue overflow of the UV-reduced adhesive is not solved. Chinese patent CN105086730B discloses a two-component cured UV-curable adhesive, which uses an acrylate macromolecular resin or a polyurethane macromolecular resin (i.e. a hydroxypropyl resin or a carboxylic acid modified polyurethane acrylate) with a hydroxyl/carboxyl group at one end, a hydroxyl/carboxyl group photosensitive monomer, a photopolymerization initiator, and a normal temperature curing agent containing-NCO/-SH groups, wherein the obtained two-component cured UV-curable adhesive contains both an active acrylic pressure-sensitive resin and an active acrylate monomer and a curing agent, and the addition crosslinking reaction is performed before UV irradiation, so that the initial viscosity of the adhesive can be improved to a great extent; however, the adhesive has high peel strength after UV light curing, and the adhesive reducing performance is not ideal.
Therefore, it is necessary to prepare a UV-curable adhesive which is high in viscosity, free of adhesive residue and adhesive overflow before irradiation and can be rapidly lost after irradiation, and the UV-curable adhesive is used in the processing process of high-precision devices.
Disclosure of Invention
In order to solve the technical problems, the invention firstly provides a UV (ultraviolet) glue reducing adhesive, which comprises the following raw materials:
and (3) a component A: 45-75% of acrylic ester polymer, 22-55% of terminal acrylic ester oligomer containing unsaturated double bonds and 0.5-5% of initiator according to the total mass of the component A;
and the component B comprises the following components: 10-40% of isocyanate substance and the balance of solvent according to the total mass of the component B.
Further, the dosage of the component B accounts for 3-18% of the mass of the component A; preferably 4-12%, more preferably 5-9%.
Further, the weight average molecular weight of the acrylic polymer is 49-65 ten thousand, and the molecular weight distribution is 1.5-4. When the proper polyacrylate molecular weight is used for controlling the crosslinking curing reaction with polyurethane acrylate oligomer and isocyanate, the colloid has proper crosslinking strength to realize the balance of cohesion and wettability to the adherend. When the weight average molecular weight of the polypropylene is too low, the crosslinking degree of the colloid is low, the cohesion is poor, the intermolecular action between the colloid and an object to be adhered is stronger, and the peeling strength of the colloid and the object to be adhered is increased, but the phenomenon of residual colloid is caused, so that the object to be adhered is polluted; when the molecular weight of the polyacrylate is too high, a dense crosslinked network structure is formed in the adhesive body, and although no glue overflow and no glue residue are generated, the cohesive force is high, so that the peeling strength between the polyacrylate and an adhered object is reduced. The weight average molecular weight and molecular weight distribution of polyacrylate are required to be strictly controlled, so that the bonding strength of UV (ultraviolet) glue reducing adhesive is improved, and the phenomena of glue overflow and glue residue are avoided.
Preferably, the acrylate polymer has a weight average molecular weight of 50 to 55 ten thousand and a molecular weight distribution of 3 to 4.
In a preferred embodiment, the acrylate polymer has a weight average molecular weight of 50.7 ten thousand and a molecular weight distribution of 3.6.
Further, the glass transition temperature of the acrylate polymer is-25 to-33 ℃, preferably-28 to-30 ℃, more preferably-29.5 ℃. The molecular weight of the polyacrylate determines the magnitude of the glass transition temperature, both of which affect its adhesive strength. When the Tg value of the polyacrylate is increased, the proportion of hard monomers in the structure is relatively increased, the adhesive film is hardened, and the phenomenon of glue overflow can be effectively inhibited, but when the Tg value is too high, the wettability of the colloid to an adhered object is reduced, so that the peeling strength between the two is reduced, and the fixing effect of the colloid is not facilitated. When the Tg value of the polyacrylate is too low, the proportion of soft monomers in the structure is relatively increased, and the interaction force between raw materials in the colloid is too weak, so that the adhesive overflow is caused, and the adhesive residue and the adhesive failure are caused by the too strong wettability between the adhesive and an adhered object. Therefore, it is necessary to control the glass transition temperature of the polyacrylate within a reasonable range while improving the adhesive strength of the UV-reduced adhesive and avoiding the phenomena of overflow and residual adhesive.
Further, the acrylate polymer is obtained by polymerizing a hard monomer, a soft monomer and a functional monomer.
Further, the hard monomer includes, but is not limited to, at least one of methyl acrylate, methyl methacrylate, vinyl acetate, n-butyl methacrylate, styrene, and styrene.
Preferably, the hard monomer comprises methyl acrylate, methyl methacrylate.
Further, the soft monomers include, but are not limited to, at least one of ethyl acrylate, butyl acrylate, isooctyl acrylate.
Preferably, the soft monomer comprises isooctyl acrylate, butyl acrylate.
Further, the functional monomer includes, but is not limited to, at least one of hydroxyl group-containing acrylate, methacrylate, acrylic acid, methacrylic acid, acrylamide, hydroxyethyl methacrylate, methylolacrylamide, diacetone acrylamide, acetoacetate methacrylate, glycidyl methacrylate, dimethylaminoethyl methacrylate, vinyl siloxane monomers.
Further, the functional monomers include acrylic acid, acrylamide and hydroxyethyl methacrylate.
Further, the preparation raw materials of the acrylic ester polymer comprise, by the total mass of the raw materials, 1-5% of hard monomers, 28-45% of soft monomers, 5-15% of functional monomers, 0.05-1% of thermal decomposition initiator and the balance of solvent.
Preferably, the preparation raw materials of the acrylic ester polymer comprise 2-4% of hard monomer, 32-40% of soft monomer, 8-12% of functional monomer, 0.1-0.5% of thermal decomposition initiator and the balance of solvent according to the total mass of the raw materials.
Preferably, the hard monomers include 1 to 3% methyl acrylate, 0.5 to 2% methyl methacrylate, based on the total mass of the feedstock.
Preferably, the soft monomer comprises 10-15% isooctyl acrylate, 9-14% butyl acrylate, based on the total mass of the feedstock.
Preferably, the functional monomers include 0.3 to 2.5% acrylic acid, 4 to 9% acrylamide and 1 to 4.5% hydroxyethyl methacrylate, based on the total mass of the raw materials.
Further, the thermal decomposition initiator includes, but is not limited to, at least one of azobisisobutyronitrile, dibenzoyl peroxide.
Further, the solvent includes, but is not limited to, at least one of ethyl acetate, butyl acetate, acetone, toluene.
Further, the preparation method of the acrylic ester polymer adopts a semi-continuous dripping process.
Further, the preparation method of the acrylic ester polymer refers to China patent CN 115975552A disclosed in 18 days 4 and 4 of 2023.
Further, the unsaturated double bond containing end acrylate oligomer includes, but is not limited to, at least one of polyester acrylate, epoxy acrylate, polyurethane acrylate.
Preferably, the terminal acrylate oligomer containing unsaturated double bonds comprises urethane acrylate.
Further, the polyurethane acrylate is at least one of monofunctional polyurethane acrylate, difunctional polyurethane acrylate and polyfunctional polyurethane acrylate.
Further, the polyfunctional urethane acrylate has a functionality of 4 to 8, preferably 6.
Further, the mass ratio of the acrylate polymer to the terminal acrylate oligomer containing an unsaturated double bond is (6-7): (2.5-5), preferably (6-7): (3-4.5). The polyurethane acrylate oligomer, polyacrylate and isocyanate undergo crosslinking curing reaction to realize the basic performance of UV (ultraviolet) glue reduction, the molecular structure of the polyurethane acrylate oligomer, the polyacrylate and the isocyanate and the polar bond on the surface of the polyurethane acrylate oligomer, the polyacrylate and the isocyanate not only promote the adhesion of the UV glue reduction agent to a substrate, but also increase the internal crosslinking strength, and avoid glue overflow and glue residue; the number of double bonds contained in the polyurethane acrylic resin has obvious influence on the performance of the UV-reduced adhesive after illumination, when the functionality of the polyurethane acrylic resin is too high, the molecular weight of polyurethane acrylic acid ester oligomer is too high, the compatibility of the system is also worse, and when the functionality of the polyurethane acrylic acid ester oligomer is too low, the cohesive force generated in the system after absorbing UV is insufficient, so that the colloid cannot be supported to be completely peeled off on the surface of an adhered object; compared with polyacrylate, the molecular weight of the polyurethane acrylate is low, when the usage amount of the polyurethane acrylate oligomer in a system is too high, the crosslinking strength in the colloid is insufficient, and glue overflow is easy to occur; therefore, for the whole colloid system, the relative dosage and physical properties of the raw materials need to be controlled so as to achieve the best technical effect, and the crosslinking strength is controlled to balance the glue overflow and the peeling strength in the best state.
In a preferred embodiment, the mass ratio of the acrylate polymer to the terminal acrylate oligomer containing unsaturated double bonds is 6.5:3.5.
further, the initiator includes, but is not limited to, at least one of an arylalkyl ketone compound, a benzophenone compound, a heterocyclic aryl ketone compound.
Further, the initiator includes an arylalkyl ketone compound.
Further, the initiator includes, but is not limited to, at least one of 1-hydroxycyclohexylphenyl ketone (UV-184), 2,4, 6-Trimethylbenzoyl Phosphorus Oxide (TPO), phenyl bis (2, 4, 6-trimethylbenzoyl) phosphorus oxide (UV-819), 2-hydroxy-2-methyl-1- [4- (2-hydroxyethoxy) phenyl ] -1-propanone (UV-2959), benzoin diethyl ether (UV-651), 2-methyl-2- (4-morpholinyl) -1- [4- (methylthio) phenyl ] -1-propanone (UV-907), 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone (UV-369), phenyl bis (2, 4, 6-trimethylbenzoyl) phosphine oxide (UV-819), and Methyl Benzoate (MBF).
Further, the initiator includes 1-hydroxycyclohexyl phenyl ketone, 2,4, 6-trimethylbenzoyl diphenyloxide and phenyl bis (2, 4, 6-trimethylbenzoyl) phosphorus oxide.
Preferably, the mass ratio of the 1-hydroxycyclohexyl phenyl ketone, the 2,4, 6-trimethylbenzoyl diphenyloxide and the phenyl bis (2, 4, 6-trimethylbenzoyl) phosphate is (0.5-2): (0.2-1): (0.05-0.6), preferably (1-1.5): (0.4-0.8): (0.1-0.3). The effective UV absorption wavelength of the 1-hydroxycyclohexyl phenyl ketone is 240-250nm and 320-335nm, belonging to short-wave photoinitiators; the effective UV absorption wavelength of 2,4, 6-trimethylbenzoyl phosphorus oxide is 350-400nm, the effective absorption wavelength of phenyl bis (2, 4, 6-trimethylbenzoyl) phosphorus oxide is 360-365nm and 405nm, and the two are long-wave photoinitiators, and only three components are compounded and the mass ratio is 1.2:0.6: when the ultraviolet light is 0.2, the matching degree with the LED light source wavelength is higher under the condition, the initiation efficiency is high, the double bond conversion rate is high, the components of the surface layer and the deep layer of the colloid can absorb the ultraviolet light effectively to achieve the deep layer curing effect during the ultraviolet curing, all the peripheral double bonds are initiated to carry out polymerization reaction, so that the overall cohesive force and double bond shrinkage force of the system are improved, and complete UV stripping is better realized.
In a preferred embodiment, the mass ratio of 1-hydroxycyclohexyl phenyl ketone, 2,4, 6-trimethylbenzoyl diphenyloxide and phenyl bis (2, 4, 6-trimethylbenzoyl) phosphate is 1.2:0.6:0.2.
further, the isocyanate-based material includes, but is not limited to, at least one of toluene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, dicyclohexylmethane diisocyanate, isophorone diisocyanate, xylylene diisocyanate, hexamethylene diisocyanate-based polyisocyanate, TDI-type aromatic polyisocyanate.
Further, the isocyanate substance comprises hexamethylene diisocyanate based polyisocyanate and TDI type aromatic polyisocyanate, and the mass ratio of the hexamethylene diisocyanate based polyisocyanate to the TDI type aromatic polyisocyanate is (9-16): (15-22), preferably (11-15): (16-20), more preferably 13:17.
further, the hexamethylene diisocyanate-based polyisocyanate has an NCO content of 18 to 30% by weight, preferably 20 to 25% by weight, more preferably 21.7 to 22.2% by weight.
Further, the TDI-type aromatic polyisocyanate has an NCO content of 10 to 16% by weight, preferably 12.5 to 15% by weight, more preferably 12.9 to 13.7% by weight.
Further, the solvent includes toluene and ethyl acetate.
Further, the mass ratio of toluene to ethyl acetate is (3-7): (1-3), preferably (4-5): (1-3).
Secondly, the application also provides a preparation method of the UV glue reducing adhesive, which comprises the following steps:
s1, completely mixing an acrylic ester polymer and an end acrylic ester oligomer containing unsaturated double bonds in the component A, adding an initiator, dissolving and discharging;
s2, taking a stirring kettle, mixing and stirring isocyanate substances and solvents in the component B, and discharging;
s3, uniformly mixing the S1 and S2 materials according to a specified mass ratio.
Finally, the application of the UV adhesion-reducing agent in the processing process of high-precision devices is provided, wherein the high-precision devices comprise, but are not limited to, grinding and cutting processes of wafers, packaging parts and the like in the semiconductor industry, slotting and cutting of glass substrates and the like in the photoelectric industry, cutting of camera modules, pickling processes and the like.
Further, the UV viscosity reducer is used in the process of cutting the PET protective film by the camera module.
Advantageous effects
1. The UV viscosity reducing adhesive is compounded by using the acrylate polymer and the terminal acrylate oligomer containing unsaturated double bonds, and the acrylate polymer is crosslinked into a network structure through isocyanate substances, so that the adhesive film is high in crosslinking density, compact in network structure and strong in acid and alkali resistance, the adhesive can be ensured to have strong adhesive force before being illuminated with the material of a stuck object, and the phenomena of displacement, glue overflow and the like between the adhesive and the stuck object are avoided in the process flow;
2. the molecular weight and the glass transition temperature of the acrylate polymer, the types and the functionalities of the acrylate oligomer containing unsaturated double bonds are optimized, the relative content of the acrylate oligomer and the acrylate oligomer is controlled, the balance of the adhesive strength and the peeling strength of the colloid can be well balanced by controlling the crosslinking structure of the system, so that the UV adhesive-reducing glue has better wettability and adhesive property on adhered substances, and meanwhile, the UV adhesive-reducing glue can be completely peeled off after photocuring, and phenomena such as glue overflow and residual glue are avoided;
3. the application optimizes the types and the dosage of the initiator, so that the surface layer and the deep layer structure of the adhesive film can realize light penetration and absorption, and the double bonds can be solidified and contracted through the sudden increase of molecular weight and the increase of modulus, thereby enhancing the cohesive force of the system and effectively reducing the peeling strength;
4. the UV glue reducing adhesive can be used for cutting and carving the glass cover plate in the PET protective film cut by the camera module, and can be rapidly subjected to tack-free stripping after the process is finished, so that the product yield can be improved.
Drawings
Fig. 1: example 1 infrared spectrum of acrylate polymer.
Detailed Description
Examples
Example 1
The embodiment provides a UV (ultraviolet) glue reducing adhesive, which comprises the following raw materials:
and (3) a component A: according to the total mass of the component A, 63% of acrylate polymer, 35% of terminal acrylate oligomer containing unsaturated double bonds and 2% of initiator;
and the component B comprises the following components: 30% of isocyanate substances, 50% of ethyl acetate and 20% of toluene according to the total mass of the component B;
the amount of the component B is 7% of the mass of the component A.
The weight average molecular weight of the acrylate polymer was 50.7 ten thousand, the molecular weight distribution was 3.6, and the glass transition temperature was-29.5 ℃. The preparation raw materials of the acrylic ester polymer comprise the following raw materials in percentage by weight: 2% of methyl acrylate, 1.5% of methyl methacrylate, 13.8% of isooctyl acrylate, 12.3% of butyl acrylate, 1.5% of acrylic acid, 6.28% of acrylamide, 2.5% of hydroxyethyl methacrylate, 0.1% of azobisisobutyronitrile, 0.2% of dibenzoyl peroxide and 59.82% of ethyl acetate. The preparation method refers to example 1 of Chinese patent CN 115975552A published in 2023, 4 and 18.
The unsaturated double bond-containing terminal acrylate oligomer is urethane acrylate, has a functionality of 6, and is purchased from Korean beauty source and has a model number of PU610.
The initiator is 1-hydroxycyclohexyl phenyl ketone, 2,4, 6-trimethylbenzoyl diphenyl oxygen phosphorus and phenyl bis (2, 4, 6-trimethylbenzoyl) phosphorus oxide, and the mass ratio is 1.2:0.6:0.2.
the isocyanate substances are hexamethylene diisocyanate based polyisocyanate and TDI type aromatic polyisocyanate, and the mass ratio of the hexamethylene diisocyanate based polyisocyanate to the TDI type aromatic polyisocyanate is 13:17; the hexamethylene diisocyanate-based polyisocyanate having an NCO content of 21.7 to 22.2% by weight, obtainable from Wanhua HT-100; the TDI-type aromatic polyisocyanate has an NCO content of 12.9-13.7 wt.% and is available from Bayer L-75.
The preparation method of the UV glue reducing adhesive comprises the following steps:
s1, completely mixing an acrylic ester polymer and an end acrylic ester oligomer containing unsaturated double bonds in the component A, adding an initiator, dissolving and discharging;
s2, taking a stirring kettle, mixing and stirring isocyanate substances and solvents in the component B, and discharging;
s3, uniformly mixing the S1 and S2 materials according to a specified mass ratio.
Example 2
The embodiment provides a UV (ultraviolet) glue reducing adhesive, which comprises the following raw materials:
and (3) a component A: based on the total mass of the component A, the acrylate polymer is 52 percent, the terminal acrylate oligomer containing unsaturated double bonds is 45.5 percent, and the initiator is 2.5 percent;
and the component B comprises the following components: 10% of isocyanate substances, 15% of ethyl acetate and 75% of toluene according to the total mass of the component B;
the amount of the component B is 9% of the mass of the component A.
The weight average molecular weight of the acrylate polymer was 60.2 ten thousand, the molecular weight distribution was 3.4, and the glass transition temperature was-29.5 ℃. The preparation raw materials of the acrylic ester polymer comprise the following raw materials in percentage by weight: 2% of methyl acrylate, 1.5% of methyl methacrylate, 13.8% of isooctyl acrylate, 12.3% of butyl acrylate, 1.5% of acrylic acid, 6.28% of acrylamide, 2.5% of hydroxyethyl methacrylate, 0.1% of azobisisobutyronitrile, 0.15% of dibenzoyl peroxide and 59.87% of ethyl acetate. The preparation method refers to example 1 of Chinese patent CN 115975552A published in 2023, 4 and 18.
The unsaturated double bond-containing terminal acrylate oligomer is urethane acrylate, has a functionality of 6, and is purchased from Korean beauty source and has a model number of PU610.
The initiator is 1-hydroxycyclohexyl phenyl ketone, 2,4, 6-trimethylbenzoyl diphenyl oxygen phosphorus and phenyl bis (2, 4, 6-trimethylbenzoyl) phosphorus oxide, and the mass ratio is 1:0.8:0.1.
the isocyanate substances are hexamethylene diisocyanate based polyisocyanate and TDI type aromatic polyisocyanate, and the mass ratio of the hexamethylene diisocyanate based polyisocyanate to the TDI type aromatic polyisocyanate is 11:20, a step of; the hexamethylene diisocyanate-based polyisocyanate having an NCO content of 21.7 to 22.2% by weight, obtainable from Wanhua HT-100; the TDI-type aromatic polyisocyanate has an NCO content of 12.9-13.7 wt.% and is available from Bayer L-75.
The preparation method of the UV glue reducing adhesive comprises the following steps:
s1, completely mixing an acrylic ester polymer and an end acrylic ester oligomer containing unsaturated double bonds in the component A, adding an initiator, dissolving and discharging;
s2, taking a stirring kettle, mixing and stirring isocyanate substances and solvents in the component B, and discharging;
s3, uniformly mixing the S1 and S2 materials according to a specified mass ratio.
Example 3
The embodiment provides a UV (ultraviolet) glue reducing adhesive, which comprises the following raw materials:
and (3) a component A: 73.5% of acrylate polymer, 24% of terminal acrylate oligomer containing unsaturated double bonds and 2.5% of initiator according to the total mass of the component A;
and the component B comprises the following components: 40% of isocyanate substances, 25% of ethyl acetate and 35% of toluene according to the total mass of the component B;
the amount of the component B is 5% of the mass of the component A.
The weight average molecular weight of the acrylate polymer was 49.5 ten thousand, the molecular weight distribution was 2.8, and the glass transition temperature was-29.5 ℃. The preparation raw materials of the acrylic ester polymer comprise the following raw materials in percentage by weight: 2% of methyl acrylate, 1.5% of methyl methacrylate, 13.8% of isooctyl acrylate, 12.3% of butyl acrylate, 1.5% of acrylic acid, 6.28% of acrylamide, 2.5% of hydroxyethyl methacrylate, 0.08% of azobisisobutyronitrile, 0.22% of dibenzoyl peroxide and 59.82% of ethyl acetate. The preparation method refers to example 1 of Chinese patent CN 115975552A published in 2023, 4 and 18.
The unsaturated double bond-containing terminal acrylate oligomer is urethane acrylate, has a functionality of 6, and is purchased from Korean beauty source and has a model number of PU610.
The initiator is 1-hydroxycyclohexyl phenyl ketone, 2,4, 6-trimethylbenzoyl diphenyl oxygen phosphorus and phenyl bis (2, 4, 6-trimethylbenzoyl) phosphorus oxide, and the mass ratio is 1.5:0.4:0.3.
the isocyanate substances are hexamethylene diisocyanate based polyisocyanate and TDI type aromatic polyisocyanate, and the mass ratio of the hexamethylene diisocyanate based polyisocyanate to the TDI type aromatic polyisocyanate is 15:16; the hexamethylene diisocyanate-based polyisocyanate having an NCO content of 21.7 to 22.2% by weight, obtainable from Wanhua HT-100; the TDI-type aromatic polyisocyanate has an NCO content of 12.9-13.7 wt.% and is available from Bayer L-75.
The preparation method of the UV glue reducing adhesive comprises the following steps:
s1, completely mixing an acrylic ester polymer and an end acrylic ester oligomer containing unsaturated double bonds in the component A, adding an initiator, dissolving and discharging;
s2, taking a stirring kettle, mixing and stirring isocyanate substances and solvents in the component B, and discharging;
s3, uniformly mixing the S1 and S2 materials according to a specified mass ratio.
Comparative example 1
Substantially identical to example 1, except that: the weight average molecular weight of the acrylate polymer was 50.9 ten thousand, the molecular weight distribution was 3.6, and the glass transition temperature was-25 ℃. The preparation raw materials of the acrylic ester polymer comprise the following raw materials in percentage by weight: 2.06% of methyl acrylate, 1.61% of methyl methacrylate, 11.89% of isooctyl acrylate, 13.2% of butyl acrylate, 1.61% of acrylic acid, 6.63% of acrylamide, 2.7% of hydroxyethyl methacrylate, 0.1% of azobisisobutyronitrile, 0.23% of dibenzoyl peroxide and 59.97% of ethyl acetate. The preparation method refers to example 1 of Chinese patent CN 115975552A published in 2023, 4 and 18.
Comparative example 2
Substantially identical to example 1, except that: the weight average molecular weight of the acrylate polymer was 50.9 ten thousand, the molecular weight distribution was 3.6, and the glass transition temperature was-35.8 ℃. The preparation raw materials of the acrylic ester polymer comprise the following raw materials in percentage by weight: 1.49% of methyl acrylate, 1.26% of methyl methacrylate, 14.18% of isooctyl acrylate, 14.17% of butyl acrylate, 1.27% of acrylic acid, 5.23% of acrylamide, 2.1% of hydroxyethyl methacrylate, 0.1% of azobisisobutyronitrile, 0.18% of dibenzoyl peroxide and 60.02% of ethyl acetate. The preparation method refers to example 1 of Chinese patent CN 115975552A published in 2023, 4 and 18.
Comparative example 3
Substantially identical to example 1, except that: the glass transition temperature of the acrylic polymer is-29.5 ℃, the weight average molecular weight is 70.1 ten thousand, and the molecular weight distribution width is 4. The preparation raw materials of the acrylic ester polymer comprise the following raw materials in percentage by weight: 2% of methyl acrylate, 1.5% of methyl methacrylate, 13.8% of isooctyl acrylate, 12.3% of butyl acrylate, 1.5% of acrylic acid, 6.28% of acrylamide, 2.5% of hydroxyethyl methacrylate, 0.1% of azobisisobutyronitrile, 0.2% of dibenzoyl peroxide and 59.82% of ethyl acetate. The preparation method refers to example 1 of Chinese patent CN 115975552A published in 2023, 4 and 18.
Comparative example 4
Substantially identical to example 1, except that: the glass transition temperature of the acrylic polymer is-29.5 ℃, the weight average molecular weight is 47 ten thousand, and the molecular weight distribution width is 6.08. The preparation raw materials of the acrylic ester polymer comprise the following raw materials in percentage by weight: 2% of methyl acrylate, 1.5% of methyl methacrylate, 13.8% of isooctyl acrylate, 12.3% of butyl acrylate, 1.5% of acrylic acid, 6.28% of acrylamide, 2.5% of hydroxyethyl methacrylate, 0.2% of azobisisobutyronitrile, 0.2% of dibenzoyl peroxide and 59.72% of ethyl acetate. The preparation method refers to example 1 of Chinese patent CN 115975552A published in 2023, 4 and 18.
Comparative example 5
Substantially identical to example 1, except that: the photoinitiator is UV-659; the component A comprises the following components: 62% of acrylate polymer, 35% of terminal acrylate oligomer containing unsaturated double bonds and 3% of initiator according to the total mass of the component A.
Comparative example 6
Substantially identical to example 1, except that: the component A is as follows: 40% of acrylate polymer, 58% of terminal acrylate oligomer containing unsaturated double bonds and 2% of initiator according to the total mass of the component A.
The performance test method comprises the following steps:
the UV-cut adhesive prepared by the method is uniformly mixed according to the proportion of the component A and the component BCoating the surface of a 50um PET substrate by using a coater, placing the PET substrate in a baking oven at 120 ℃ for 90 seconds, drying the PET substrate, placing the PET substrate in the baking oven at 65 ℃ for 24 hours for post-curing, curing the PET substrate under a mercury lamp after curing is finished, and curing the PET substrate with a thickness of 10 mu m and a curing energy of 200mj/cm 2 And (5) performing relevant performance tests by attaching the adhesive to a stainless steel plate.
Performance test results:
the test results are shown in Table 1.
TABLE 1
Summarizing: comparative example 1 and comparative examples 1-2 show that: only with a suitable glass transition temperature, the acrylate polymer can have a suitable degree of softness and hardness, and the cross-linked structure formed by interaction with other components in the system can have excellent adhesive strength and lower peel strength.
Comparative example 1 and comparative examples 3 to 4 show that: only when the weight average molecular weight and the glass transition temperature of the acrylic polymer are within the specified ranges, the generated crosslinking effect can better balance the bonding strength and the peeling strength of the system and avoid the phenomena of glue overflow and glue residue.
Comparative examples 1 and 5 show that: the type of the photoinitiator can influence the adaptation degree of a colloid system to a light source and the light absorption curing process of the colloid, the curing crosslinking of the system can be improved, the cohesive force is suddenly increased and the peeling strength is reduced only under the photoinitiator system specified by the application, and the quality of the photoinitiator specified by the application also has higher economy.
Comparative examples 1 and 6 show that: when the content of the urethane acrylate oligomer is too high, the phenomenon of glue overflow is caused, and the binding force to the base material is poorer.
Claims (10)
1. The UV glue reducing adhesive is characterized by comprising the following raw materials:
and (3) a component A: 45-75% of acrylic ester polymer, 22-55% of terminal acrylic ester oligomer containing unsaturated double bonds and 0.5-5% of initiator according to the total mass of the component A;
and the component B comprises the following components: 10-40% of isocyanate substances and the balance of solvent according to the total mass of the component B;
the dosage of the component B accounts for 3-18% of the mass of the component A.
2. UV-reducing adhesive according to claim 1, wherein the acrylate polymer has a weight average molecular weight of 49-65 ten thousand and a molecular weight distribution of 1.5-4.
3. UV-reducing adhesive according to claim 1, wherein the glass transition temperature of the acrylate polymer is-25 to-33 ℃.
4. A UV reducing adhesive according to claim 3, wherein the unsaturated double bond containing end acrylate oligomer comprises at least one of polyester acrylate, epoxy acrylate, polyurethane acrylate.
5. The UV reducing adhesive according to claim 4, wherein the unsaturated double bond containing end acrylate oligomer comprises urethane acrylate; the polyurethane acrylic ester is at least one of monofunctional polyurethane acrylic ester, difunctional polyurethane acrylic ester and polyfunctional polyurethane acrylic ester.
6. The UV reducing adhesive according to claim 5, wherein the polyfunctional urethane acrylate has a functionality of 4 to 8.
7. UV-reducing adhesive according to claim 1, wherein the mass ratio of acrylate polymer to terminal acrylate oligomer containing unsaturated double bonds is (6-7): (2.5-5).
8. UV-reducing adhesive according to claim 1, wherein the isocyanate-based substances comprise hexamethylene diisocyanate-based polyisocyanate and TDI-based aromatic polyisocyanate in a mass ratio of (9-16): (15-22); the NCO content of the hexamethylene diisocyanate-based polyisocyanate is 18-30wt% and the NCO content of the TDI-type aromatic polyisocyanate is 10-16wt%.
9. The method for preparing a UV-reduced adhesive according to any one of claims 1 to 8, comprising the steps of:
s1, completely mixing an acrylic ester polymer and an end acrylic ester oligomer containing unsaturated double bonds in the component A, adding an initiator, dissolving and discharging;
s2, taking a stirring kettle, mixing and stirring isocyanate substances and solvents in the component B, and discharging;
s3, uniformly mixing the S1 and S2 materials according to a specified mass ratio.
10. Use of UV-reduced adhesive according to any of claims 1-8 in high precision device processing.
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