CN112680131A - PVC (polyvinyl chloride) substrate UV (ultraviolet) viscosity-reducing adhesive film for semiconductor chip film inversion and preparation method thereof - Google Patents
PVC (polyvinyl chloride) substrate UV (ultraviolet) viscosity-reducing adhesive film for semiconductor chip film inversion and preparation method thereof Download PDFInfo
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Abstract
The invention discloses a PVC (polyvinyl chloride) substrate UV (ultraviolet) viscosity-reducing adhesive film for semiconductor chip film inversion, which comprises a substrate layer, an adhesive layer and a release film layer, wherein the adhesive layer is positioned between the substrate layer and the release film layer, the adhesive layer is prepared by coating UV viscosity-reducing adhesive on the substrate layer and drying the coating, and the UV viscosity-reducing adhesive comprises the following components in parts by weight: the acrylic glue comprises the following components in parts by weight: butyl acrylate, vinyl acetate, acrylic acid, hydroxyethyl methacrylate, azobisisobutyronitrile. According to the invention, through the formula design of the acrylic polymer, the selection of the oligomer and the increase and decrease of the plasticizer content, the hardness of the adhesive is effectively controlled, the cross-linking density of the designed formula is high, the concentration of the plasticizer of the adhesive layer and the concentration of the plasticizer of the PVC layer are balanced by controlling the amount of the plasticizer, and the adhesive layer is not influenced by the plasticizer in the base material layer after being attached to the base material layer, so that the adhesive layer achieves the effects of stable viscosity and no residual adhesive.
Description
Technical Field
The invention belongs to the technical field of UV (ultraviolet) viscosity-reducing adhesive films, and particularly relates to a PVC (polyvinyl chloride) substrate UV viscosity-reducing adhesive film for semiconductor chip film inversion and a preparation method thereof.
Background
Semiconductor and LED chip production can go through links such as cutting, falling membrane, turnover, expanding membrane. The cutting protective film is mostly a PVC blue film, the viscosity is about 80g/25mm, and after the chips of a part of packaging plants are cut, the cut chips are turned over to another blue film to form a composite grid, and the composite grid is discharged from the blue film. Particularly, for a large-size chip, the film is difficult to smoothly reverse by using a common blue film, and the viscosity difference of the blue film is not large. If the peeling force of the blue film is increased, the chips are difficult to separate during picking. Therefore, the problem that the large-size chip is difficult to invert can be effectively solved by developing the high-peeling-force PVC base material UV anti-adhesive film.
In the prior art, the PVC anti-sticking film structure is a PVC substrate coated with UV anti-sticking agent, and is compounded with a release film. However, most products have unstable viscosity and residual glue after peeling of the UV film because the stability of the UV glue is affected by the high plasticizer content in the PVC.
Disclosure of Invention
The invention aims to provide a PVC (polyvinyl chloride) substrate UV (ultraviolet) visbreaking adhesive film for semiconductor chip film inversion and a preparation method thereof.
In order to achieve the purpose, the invention adopts the technical scheme that: the utility model provides a PVC substrate UV visbreaking glued membrane for semiconductor chip falls membrane, includes substrate layer, glue film and leaves the type rete, the glue film is located the substrate layer and leaves between the type layer, the glue film is coated on the substrate layer for UV visbreaking glue and is dried and make, UV visbreaking glue includes following parts by weight component:
the function of the UV monomer mainly plays a role in diluting and controlling the viscosity of the finished product, and the function of the oligomer is used as a main body of the UV resin, so that the viscosity is rapidly reduced through the reaction of the UV resin and an initiator.
Wherein, the solubility of the plasticizer in the glue and the PVC is controlled by the amount of the plasticizer, and a certain balance is achieved to ensure the stability of viscosity. Dual cure is designed to achieve high peel force at the initial stage and low tack after UV.
The technical scheme of further improvement in the technical scheme is as follows:
1. in the scheme, the acrylic acid glue comprises the following components in parts by weight:
the acrylic acid in the formula has slightly higher Tg, the glue is harder and has large molecular weight, and the effects of blocking the plasticizer and improving the temperature resistance of the glue are achieved to a certain extent
2. In the above embodiment, the UV monomer or oligomer is an aliphatic urethane acrylate oligomer, an aromatic urethane acrylate oligomer, an epoxy acrylate oligomer, a polyester acrylate oligomer, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, 2-hydroxyethyl methacrylate, acrylamide, 1, 6-hexanediol dimethacrylate, 1, 6-hexanediol diacrylate, ethylene glycol diacrylate, triethylene glycol diacrylate, tripropylene glycol diacrylate, p-neopentyl glycol diacrylate, trimethylolpropane triacrylate, a polyol, a, Two or more of trimethylolpropane trimethacrylate, trimethylolpropane pentaerythritol triacrylate, propoxylated neopentyl glycol diacrylate, ethoxylated 1, 6-hexanediol diacrylate, tris (2-acryloxyethyl) isocyanurate, and the polyfunctional oligomer or polyfunctional monomer or composition thereof is one or two of aliphatic urethane acrylate oligomer, epoxy acrylate oligomer, pentaerythritol tetraacrylate dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and trimethylolpropane triacrylate.
3. In the scheme, the curing agent is one or a combination of more of triphenylmethane triisocyanate, hexamethylene diisocyanate trimer, toluene diisocyanate trimer, isophorone diisocyanate trimer and thiophosphoric acid tris (4-phenyl isocyanate);
4. in the above scheme, the photoinitiator is one or more of 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-methylphenyl propane-1-one, 2-methyl-1- (4-methylthiophenyl) -2-morpholinyl-1-acetone, benzoin dimethyl ether, benzophenone, 2-isopropyl thioxanthone and 2,4,6- (trimethylbenzoyl) -diphenyl phosphine oxide;
5. in the above scheme, the plasticizer is one or more of dioctyl phthalate, dibutyl phthalate and dioctyl terephthalate.
6. In the scheme, the base material layer is made of PVC material and has the thickness of 50-100 microns.
7. In the scheme, the release film layer is a PET single-silicon release film, the thickness of the release film layer is 12-75 mu m, and the release force is 10-30 g/25 mm.
The invention adopts another technical scheme that: a preparation method of a PVC substrate UV visbreaking adhesive film for semiconductor chip film inversion comprises the following steps:
s1, blending acrylic acid glue, UV monomer or oligomer, curing agent, photoinitiator and plasticizer according to a proportion, stirring at a high speed for 40min under a yellow light condition, and simultaneously supplementing a proper amount of ethyl acetate to prepare UV viscosity-reducing glue with a solid content of 25%;
s2, coating a UV (ultraviolet) adhesive reducing layer on the surface of the release film layer, and baking at 100 ℃ for 3min to obtain a UV adhesive reducing layer;
s3, compounding the rubber surface with a PVC film to obtain a finished product;
s4, curing the finished product at 45 ℃ for 3 days to finish the preparation.
The technical scheme of further improvement in the technical scheme is as follows:
1. in the scheme, the thickness of the dry glue of the UV anti-sticking layer in the S2 is 5-30 mu m.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
according to the PVC substrate UV viscosity-reducing adhesive film for semiconductor chip film inversion and the preparation method thereof, the hardness of the adhesive is effectively controlled through the formula design of the acrylic polymer, the selection of the oligomer and the increase and decrease of the plasticizer content, the more the plasticizing agent is, the softer the adhesive is, the designed formula has high crosslinking density, the concentration of the plasticizer of the adhesive layer and the concentration of the plasticizer of the PVC layer are balanced by controlling the amount of the plasticizer, and the adhesive layer is not influenced by the plasticizer in the substrate layer after being attached to the substrate layer, so that the adhesive layer achieves the effects of stable viscosity and no residual adhesive.
Drawings
FIG. 1 is a schematic view of the structure of the present invention.
In the figure: 1-a substrate layer; 2-glue layer; 3-a release layer.
Detailed Description
The invention is further described below with reference to the following examples:
example 1: as shown in figure 1, a PVC substrate UV visbreaking glue membrane for semiconductor chip falls membrane, includes substrate layer 1, glue film 2 and leaves type rete 3, glue film 2 is located substrate layer 1 and leaves between type layer 3, the preferred 70 μm PVC film of substrate layer 1, it is PET monosilicon type membrane to leave type rete 3, thickness 36 μm, from type force 15g/25mm, glue film 2 is that UV visbreaking glue coats and dries on substrate layer 1 and make, UV visbreaking glue includes following parts by weight component:
70 parts of acrylic glue, 30 parts of UV monomer or oligomer, 1.5 parts of curing agent, 1.2 parts of photoinitiator and plasticizer: 5 parts of a mixture;
the acrylic acid glue comprises the following components in parts by weight:
80 parts of butyl acrylate, 10 parts of vinyl acetate, 6 parts of acrylic acid, 0.2 part of hydroxyethyl methacrylate and 0.5 part of a reaction initiator (azobisisobutyronitrile);
the acrylic acid glue with the solid content of 40% is obtained by polymerizing according to the proportion by a conventional acrylic acid polymerization method and supplementing a certain mixed solvent of toluene, ethyl acetate and butanone according to the proportion of 1:8: 1.
The UV monomer or oligomer is preferably an aliphatic urethane acrylate oligomer and a dipentaerythritol hexaacrylate mixture in a ratio of 5: 5; the curing agent is toluene diisocyanate trimer; the photoinitiator is preferably a mixture of 1-hydroxycyclohexyl phenyl ketone and 2,4,6- (trimethylbenzoyl) -diphenyl phosphine oxide in a ratio of 1: 0.3; the plasticizer is dioctyl phthalate.
The invention also provides a preparation method of the PVC substrate UV visbreaking adhesive film for semiconductor chip film inversion, which comprises the following steps:
(1) mixing the acrylic acid glue with UV monomer or oligomer, curing agent, photoinitiator and plasticizer, stirring at a high speed of 500RPM for 40min under the condition of yellow light, and supplementing a certain amount of ethyl acetate to obtain UV viscosity-reducing glue with a solid content of 25% and a viscosity of 1500 CPS;
(2) coating UV (ultraviolet) adhesive reducing layers on the surfaces of the release film layers 3, and baking at 100 ℃ for 3min to obtain UV adhesive reducing layers with 10 mu m of dry adhesives;
(3) compounding the rubber surface with a PVC film to obtain a finished product;
(4) the finished product is cured for 3 days at the temperature of 45 ℃ to finish the preparation.
Example 2
As shown in fig. 1, a PVC substrate UV visbreaking glue membrane for semiconductor chip falls membrane, includes substrate layer 1, glue film 2 and leaves type rete 3, glue film 2 is located substrate layer 1 and leaves between type layer 3, the preferred 70 μm PVC film of substrate layer 1, it is PET monosilicon type membrane to leave type rete 3, thickness 36 μm, from type power 20g/25mm, glue film 2 is that UV visbreaking glue coats and dries on substrate layer 1 and make, UV visbreaking glue includes following parts by weight component:
60 parts of acrylic acid glue, 25 parts of UV monomer or oligomer, 0.9 part of curing agent, 1.4 parts of photoinitiator and 2 parts of plasticizer;
the acrylic acid glue comprises the following components in parts by weight:
70 parts of butyl acrylate, 5 parts of vinyl acetate, 3 parts of acrylic acid, 1 part of hydroxyethyl methacrylate and 1.5 parts of a reaction initiator (azobisisobutyronitrile);
the acrylic acid glue with the solid content of 40% is obtained by polymerizing according to the proportion by a conventional acrylic acid polymerization method and supplementing a certain mixed solvent of toluene, ethyl acetate and butanone according to the proportion of 1:8: 1.
The UV monomer or oligomer is preferably dipentaerythritol pentaacrylate; the curing agent is thiophosphoric acid tri (4-phenyl isocyanate); the photoinitiator is preferably 2-methyl-1- (4-methylthiophenyl) -2-morpholinyl-1-acetone; the plasticizer is dioctyl terephthalate.
The invention also provides a preparation method of the PVC substrate UV visbreaking adhesive film for semiconductor chip film inversion, which comprises the following steps:
(1) mixing the acrylic acid glue with UV oligomer, curing agent, photoinitiator and plasticizer, stirring at 500RPM for 40min under yellow light condition, supplementing ethyl acetate to obtain UV viscosity-reducing glue with solid content of 25%, and obtaining UV viscosity-reducing glue with viscosity of 1500 CPS;
(2) coating UV (ultraviolet) adhesive reducing layers on the surfaces of the release films, and baking at 100 ℃ for 3min to obtain UV adhesive reducing layers with 10 mu m of dry adhesives;
(3) compounding the rubber surface with a PVC film to obtain a finished product;
(4) the finished product is cured for 3 days at the temperature of 45 ℃ to finish the preparation.
Example 3
As shown in figure 1, a PVC substrate UV visbreaking glue membrane for semiconductor chip falls membrane, includes substrate layer 1, glue film 2 and leaves type rete 3, glue film 2 is located substrate layer 1 and leaves between type layer 3, the preferred 70 μm PVC film of substrate layer 1, it is PET monosilicon type membrane to leave type rete 3, thickness 36 μm, from type power 10g/25mm, glue film 2 is that UV visbreaking glue coats and dries on substrate layer 1 and make, UV visbreaking glue includes following parts by weight component:
70 parts of acrylic acid glue, 20 parts of UV monomer or oligomer, 2 parts of curing agent, 0.5 part of photoinitiator and 10 parts of plasticizer;
the acrylic acid glue comprises the following components in parts by weight:
60 parts of butyl acrylate, 2 parts of vinyl acetate, 1 part of acrylic acid, 2 parts of hydroxyethyl methacrylate and 2.5 parts of a reaction initiator (azobisisobutyronitrile);
the acrylic acid glue with the solid content of 40% is obtained by polymerizing according to the proportion by a conventional acrylic acid polymerization method and supplementing a certain mixed solvent of toluene, ethyl acetate and butanone according to the proportion of 1:8: 1.
The UV monomer or oligomer is preferably an epoxy acrylate oligomer; the curing agent is hexamethylene diisocyanate trimer; the initiator is preferably 2-hydroxy-methylphenylpropane-1-one; the plasticizer is dibutyl phthalate.
The invention also provides a preparation method of the PVC substrate UV visbreaking adhesive film for semiconductor chip film inversion, which comprises the following steps:
(1) mixing the acrylic acid glue with the UV oligomer, the curing agent, the photoinitiator and the plasticizer, stirring at a high speed of 500RPM for 40min under the condition of yellow light, and supplementing a certain amount of ethyl acetate to prepare UV visbreaking glue with the solid content of 25% and the viscosity of 1500 CPS;
(2) coating UV (ultraviolet) adhesive reducing layers on the surfaces of the release films, and baking at 100 ℃ for 3min to obtain UV adhesive reducing layers with 10 mu m of dry adhesives;
(3) compounding the rubber surface with a PVC film to obtain a finished product;
(4) the finished product is cured for 3 days at the temperature of 45 ℃ to finish the preparation.
Example 4
As shown in fig. 1, a PVC substrate UV visbreaking glue membrane for semiconductor chip falls membrane, includes substrate layer 1, glue film 2 and leaves type rete 3, glue film 2 is located substrate layer 1 and leaves between type layer 3, the preferred 70 μm PVC film of substrate layer 1, it is PET monosilicon type membrane to leave type rete 3, thickness 36 μm, from type force 30g/25mm, glue film 2 is that UV visbreaking glue coats and dries on substrate layer 1 and make, UV visbreaking glue includes following parts by weight component:
70 parts of acrylic acid glue, 40 parts of UV monomer or oligomer, 1.1 parts of curing agent, 2.2 parts of photo-initiation and 15 parts of plasticizer;
the acrylic acid glue comprises the following components in parts by weight:
86 parts of butyl acrylate, 8 parts of vinyl acetate, 5 parts of acrylic acid, 1.5 parts of hydroxyethyl methacrylate and 0.2 part of a reaction initiator (azobisisobutyronitrile);
the acrylic acid glue with the solid content of 40% is obtained by polymerizing according to the proportion by a conventional acrylic acid polymerization method and supplementing a certain mixed solvent of toluene, ethyl acetate and butanone according to the proportion of 1:8: 1.
The UV monomer or oligomer is preferably an aliphatic urethane acrylate oligomer and a dipentaerythritol hexaacrylate mixture in a ratio of 5: 5; the curing agent is toluene diisocyanate trimer; the photoinitiator is preferably a mixture of 1-hydroxycyclohexyl phenyl ketone and 2,4,6- (trimethylbenzoyl) -diphenyl phosphine oxide in a ratio of 1: 0.3; the plasticizer is dioctyl phthalate.
The invention also provides a preparation method of the PVC substrate UV visbreaking adhesive film for semiconductor chip film inversion, which comprises the following steps:
(1) mixing the acrylic acid glue with UV oligomer, curing agent, initiator and plasticizer, stirring at 500RPM for 40min in yellow light at high speed, and supplementing ethyl acetate to obtain UV visbreaking glue with solid content of 25% and viscosity of 1500 CPS;
(2) coating UV (ultraviolet) adhesive reducing layers on the surfaces of the release films, and baking at 100 ℃ for 3min to obtain UV adhesive reducing layers with 10 mu m of dry adhesives;
(3) compounding the rubber surface with a PVC film to obtain a finished product;
(4) the finished product is cured for 3 days at the temperature of 45 ℃ to finish the preparation. .
The adhesive films prepared in the above examples 1 to 4 were tested, and the experimental data are as follows:
1) detection method
The initial adhesion is tested according to the regulations of the national standard GB/T4852;
the retention was tested according to the regulations of the national standard GB/T4851;
the 180-degree peel strength is tested according to the specification of the national standard GB/T2792;
the 180 DEG peel strength after ultraviolet irradiation is tested by adopting an LED UV lamp tube (the wavelength is 365nm) according to the specification of the national standard GB/T2792.
2) Results of the experiment
TABLE 1 Performance results for UV visbreaking adhesive films
According to the detection results, the hardness and softness of the adhesive are effectively controlled through the formula design of the acrylic polymer, the selection of the oligomer and the increase and decrease of the plasticizer content, the hardness and softness can be laterally characterized through the S-S curve modulus, the cross-linking density of the designed formula is high, the concentration balance of the plasticizer of the adhesive layer and the plasticizer of the PVC layer can be controlled through the amount of the plasticizer, and the effects of stable viscosity and no residual adhesive are achieved.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (10)
1. The utility model provides a PVC substrate UV visbreaking glued membrane for semiconductor chip falls membrane which characterized in that: include substrate layer (1), glue film (2) and leave type rete (3), glue film (2) are located substrate layer (1) and leave between type layer (3), glue film (2) are that UV visbreaking glue coats and dry on substrate layer (1) and make, UV visbreaking glue includes following parts by weight component:
2. the PVC substrate UV viscosity-reducing adhesive film for semiconductor chip film inversion according to claim 1, characterized in that: the acrylic acid glue comprises the following components in parts by weight:
3. the PVC substrate UV viscosity-reducing adhesive film for semiconductor chip film inversion according to claim 1, characterized in that: the UV monomer or oligomer is aliphatic urethane acrylate oligomer, aromatic urethane acrylate oligomer, epoxy acrylate oligomer, polyester acrylate oligomer, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, 2-hydroxyethyl methacrylate, acrylamide, 1, 6-hexanediol dimethacrylate, 1, 6-hexanediol diacrylate, ethylene glycol diacrylate, triethylene glycol diacrylate, tripropylene glycol diacrylate, p-neopentyl glycol diacrylate, trimethylolpropane triacrylate, trimethylolpentane trimethacrylate, poly (ethylene glycol) acrylate, poly (propylene glycol) acrylate, poly (ethylene glycol) acrylate, poly, Two or more of trimethylolpropane pentaerythritol triacrylate, propoxylated neopentyl glycol diacrylate, ethoxylated 1, 6-hexanediol diacrylate, tris (2-acryloxyethyl) isocyanurate, and the polyfunctional oligomer or polyfunctional monomer or composition thereof is one or two of aliphatic urethane acrylate oligomer, epoxy acrylate oligomer, pentaerythritol tetraacrylate dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and trimethylolpropane triacrylate.
4. The PVC substrate UV viscosity-reducing adhesive film for semiconductor chip film inversion according to claim 1, characterized in that: the curing agent is one or a combination of more of triphenylmethane triisocyanate, hexamethylene diisocyanate tripolymer, toluene diisocyanate tripolymer, isophorone diisocyanate tripolymer and thiophosphoric acid tri (4-phenyl isocyanate).
5. The PVC substrate UV viscosity-reducing adhesive film for semiconductor chip film inversion according to claim 1, characterized in that: the photoinitiator is one or more of 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-methyl phenyl propane-1-ketone, 2-methyl-1- (4-methylthiophenyl) -2-morpholinyl-1-acetone, benzoin dimethyl ether, benzophenone, 2-isopropyl thioxanthone and 2,4,6- (trimethylbenzoyl) -diphenyl phosphine oxide.
6. The PVC substrate UV viscosity-reducing adhesive film for semiconductor chip film inversion according to claim 1, characterized in that: the plasticizer is one or more of dioctyl phthalate, dibutyl phthalate and dioctyl terephthalate.
7. The PVC substrate UV viscosity-reducing adhesive film for semiconductor chip film inversion according to claim 1, characterized in that: the substrate layer (1) is made of PVC material and has a thickness of 50-100 microns.
8. The PVC substrate UV viscosity-reducing adhesive film for semiconductor chip film inversion according to claim 1, characterized in that: the release film layer (3) is a PET single-silicon release film, the thickness of the release film layer is 12-75 mu m, and the release force is 10-30 g/25 mm.
9. The preparation method of the PVC base material UV visbreaking adhesive film for semiconductor chip film inversion according to any one of claims 1 to 8, characterized by comprising the following steps: the method comprises the following steps:
s1, blending acrylic acid glue, UV monomer or oligomer, curing agent, photoinitiator and plasticizer according to a proportion, stirring at a high speed for 40min under a yellow light condition, and simultaneously supplementing a proper amount of ethyl acetate to prepare UV viscosity-reducing glue with a solid content of 25%;
s2, coating a UV (ultraviolet) adhesive reducing layer on the surface of the release film layer (3), and baking at 100 ℃ for 3min to obtain a UV adhesive reducing layer;
s3, compounding the rubber surface with a PVC film to obtain a finished product;
s4, curing the finished product at 45 ℃ for 3 days to finish the preparation.
10. The preparation method of the PVC base material UV viscosity-reducing adhesive film for semiconductor chip film inversion according to claim 9, characterized in that: and the dry glue thickness of the UV anti-sticking layer in the S2 is 5-30 mu m.
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Application publication date: 20210420 |