CN117177476A - Gold plating process of contact leadless printed circuit board - Google Patents
Gold plating process of contact leadless printed circuit board Download PDFInfo
- Publication number
- CN117177476A CN117177476A CN202311053221.0A CN202311053221A CN117177476A CN 117177476 A CN117177476 A CN 117177476A CN 202311053221 A CN202311053221 A CN 202311053221A CN 117177476 A CN117177476 A CN 117177476A
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- Prior art keywords
- gold plating
- circuit board
- printed circuit
- gold
- probe
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 143
- 239000010931 gold Substances 0.000 title claims abstract description 143
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 143
- 238000007747 plating Methods 0.000 title claims abstract description 127
- 238000000034 method Methods 0.000 title claims abstract description 55
- 239000000523 sample Substances 0.000 claims abstract description 102
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 12
- 241000416536 Euproctis pseudoconspersa Species 0.000 claims abstract description 3
- 239000003973 paint Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052802 copper Inorganic materials 0.000 abstract description 8
- 239000010949 copper Substances 0.000 abstract description 8
- 230000007797 corrosion Effects 0.000 abstract description 7
- 238000005260 corrosion Methods 0.000 abstract description 7
- 238000012360 testing method Methods 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract description 2
- 238000003908 quality control method Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 244000060701 Kaempferia pandurata Species 0.000 description 2
- 235000016390 Uvaria chamae Nutrition 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The application relates to a gold plating process of a contact type leadless printed circuit board, which comprises the following steps: and (3) dry film: exposing the region of the printed circuit board which needs gold plating, and covering the bonding pad which does not need gold plating by adopting a photosensitive dry film; gold plating: the printed circuit board to be plated with gold after the dry film treatment is conveyed to a gold plating groove, and after the printed circuit board to be plated with gold is aligned with a gold plating jig, a conductive spring probe on the gold plating jig is contacted with the position of a gold plating finger of the printed circuit board, and a gold plating procedure is started to plate gold for the gold finger in a gold plating area; removing the film: removing a dry film attached to the printed circuit board through a film removing wire; and (3) forming: and performing bevel edge machining forming on the printed circuit board after gold plating. In the gold plating process, the conductive spring probe is adopted to finish gold plating operation, so that the golden finger after chamfering the bevel edge has no exposed nickel layer and copper layer, and the testing requirement of corrosion resistance can be met.
Description
Technical Field
The application relates to a gold plating technology of a printed circuit board, in particular to a gold plating technology of a contact leadless printed circuit board.
Background
The existing gold plating process of the printed circuit board leads adopts a mode of paving gold-plated wires at the tail ends of golden fingers of the printed circuit board, gold-plating current is provided for the gold-plating process of the golden fingers, the current is in contact conduction with a conductive brush on a gold-plated wire through a copper sheet reserved on a printed circuit board frame, the gold-plated wires are conventionally designed in a trapezoid mode, forming chamfering is needed after gold plating is completed, the conventional chamfering is at an angle of 45 degrees, and finished products can be conveniently plugged into a clamping groove. However, the chamfering process needs to chamfer the gold-plated lead, and the gold finger lead after the chamfering process can expose the nickel layer and the copper layer, so that the requirements of gas corrosion experiments cannot be met.
Disclosure of Invention
In order to overcome the defects, the application provides a gold plating process of a contact leadless printed circuit board, wherein a conductive spring probe is adopted in the gold plating process to complete gold plating operation, so that a golden finger has no exposed nickel layer and copper layer after chamfering of a bevel edge, and the requirement of corrosion resistance test can be met.
The technical scheme adopted by the application for solving the technical problems is as follows:
a gold plating process of a contact leadless printed circuit board comprises the following steps:
and (3) dry film: exposing the region of the printed circuit board which needs gold plating, covering the bonding pad which does not need gold plating by adopting a photosensitive dry film, and curing after polymerization of the photosensitive dry film by exposure treatment to avoid adhesion of Jin Nian nickel to the non-gold-plated region;
gold plating: the method comprises the steps of conveying a printed circuit board to be plated after dry film treatment to a plating tank, aligning the printed circuit board to be plated with the dry film treatment with a plating jig, enabling a conductive spring probe on the plating jig to contact with the position of a gold-plated finger of the printed circuit board, starting a gold plating procedure to plate the gold finger in a gold-plated area, and conveying the plated printed circuit board out of the plating tank after the plating is completed;
removing the film: removing a dry film attached to the printed circuit board through a film removing wire;
and (3) forming: and performing bevel edge machining forming on the printed circuit board after gold plating.
Optionally, the gold plating jig comprises a probe conductive plate, wherein a positioning spring probe and the conductive spring probe are arranged on the probe conductive plate, the positioning spring probe is used for fixing a printed circuit board, and the conductive spring probe is used for electroplating a gold finger on the printed circuit board.
Optionally, the probe card is connected to a drive mechanism capable of controlling the probe card to travel in a direction toward or away from the printed circuit board.
Optionally, the probe conducting plate is made of FR-4 material with the thickness of 2.0mm plus or minus 0.2mm, a conductive PTH through hole is processed on the probe conducting plate, the conductive spring probe is welded in the through hole, and the conductive spring probe is connected with an external power supply.
Optionally, the surface of the conductive spring probe is coated with three-proofing paint, and the conductive spring probe is contacted with a non-main area of the root of the golden finger of the printed circuit board.
Optionally, in the gold plating process, the printed circuit board to be gold plated is transferred to a gold plating tank by a conveyor belt, and after the printed circuit board is transferred to a preset position, the probe conductive plate is moved towards the printed circuit board by the driving mechanism until the conductive spring probe contacts with the finger root to be gold plated of the printed circuit board, and the positioning spring probe fixes the printed circuit board.
Optionally, in the gold plating process, after the gold plating is completed, the probe conductive plate moves 50mm±5mm towards a direction away from the printed circuit board under the action of the driving mechanism, and the conveyer belt sends the printed circuit board after gold plating out of the gold plating groove.
Optionally, the probe conductive plate and the printed circuit board are equal in size, and all positions of fingers requiring gold plating are respectively contacted with one conductive spring probe, and the conductive spring probes are connected with the conductive negative electrode.
The beneficial effects of the application are as follows:
1) The four sides of the golden finger processed by the leadless gold plating process are plated with gold and coated, namely, bare copper and nickel are avoided, so that the requirement of corrosion resistance test can be met;
2) In the leadless gold plating process, the plated area of the tidy gold finger is reduced by about 6% compared with that of the gold finger with the lead, so that the gold plating and nickel plating noble metal cost can be saved;
3) The leadless process can reduce the hypotenuse scrapping cost in the hypotenuse chamfering process, and cancel the online quality control in the hypotenuse chamfering process, thus reducing the labor cost of quality control; the leadless process reduces the two rubberizing processes in the traditional gold plating process, reduces the manual operations of gold plating rubberizing and manual rubberizing to open the conductive skylight, and reduces the cost of labor and adhesive tape;
4) The traditional inscription type of the gold-plated wire is changed into the external contact type of the conductive spring probe, so that the normal conductive gold-plating function is realized. The probe conducting plate is utilized to output current, and the output current is uniform, so that the uniformity of gold plating is improved, the traditional dummy finger current sharing design can be canceled, and the gold plating cost is reduced by about 3%. The spring in the conductive spring probe can ensure that the probe and the PCB golden finger have proper contact force, and the golden finger is prevented from being crushed. Accurate positioning of the PCB can be ensured by the positioning spring probes.
Drawings
FIG. 1 is a schematic diagram of a gold plating jig according to the present application;
in the figure: 10-printed circuit board, 11-golden finger, 20-probe conducting plate, 21-conductive spring probe, 22-positioning spring probe, 23-driving mechanism.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below in connection with the embodiments of the present application. It should be apparent that the described embodiments of the application are only some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It should be noted that the terms "first," "second," and the like in the description and claims of the present application and in the following figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the objects so used may be interchanged where appropriate to enable the embodiments of the application described herein to be practiced otherwise than as illustrated or described. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Examples: a gold plating process of a contact leadless printed circuit board comprises the following steps:
and (3) dry film: exposing the region of the printed circuit board 10 which needs gold plating, covering a bonding pad which does not need gold plating by adopting a photosensitive dry film, and curing after polymerization of the photosensitive dry film by exposure treatment to avoid adhesion of Jin Nian nickel to the non-gold-plated region; namely, the non-gold-plated area is protected by covering the dry film on the area which does not need gold plating;
gold plating: the printed circuit board 10 to be plated with gold after the dry film treatment is conveyed to a gold plating groove, after aligning with a gold plating jig, a conductive spring probe 21 on the gold plating jig is contacted with the position of a gold plating finger of the printed circuit board, a gold plating procedure is started to plate gold for the gold finger 11 in a gold plating area, and after the gold plating is finished, the gold plating printed circuit board is conveyed out of the gold plating groove; namely, the conductive gold plating function is realized by using the external conductive spring probe 21 without the need of a conventional gold-plated wire; the gold plating tank is deepened in the process, so that one-time full-plate gold plating operation can be realized, and the gold plating efficiency can be improved by 100% compared with the existing gold plating mode;
removing the film: removing a dry film attached to the printed circuit board through a film removing wire; optionally, removing the gold-plated dry film attached to the PCB by using a stripping liquid medicine containing sodium hydroxide through a stripping line;
and (3) forming: the printed circuit board 10 after gold plating is subjected to beveling. The printed circuit board finished product is conveniently inserted into and pulled out of the clamping groove through bevel edge processing. Because no gold-plated lead is arranged in the process, the lead is not required to be cut off when the bevel edge is formed, and only the bevel edge is required to be chamfered, so that the gold-plated coated gold finger area on the whole four sides cannot be exposed with copper and nickel.
In order to adapt to partial severe environments, such as high temperature and high humidity, high acid and alkali, and electronic performance tolerance and stable quality in acidic and humid air environments. The customer puts forward the corrosion resistance requirement on the gold-plated finger, and after the bevel chamfer cutting processing, the tail end of the gold finger is exposed with copper and nickel, so that the conventional PCB lead gold-plating process cannot meet the corrosion resistance requirement. The four sides of the golden finger processed by the leadless gold plating process are plated with gold, namely, bare copper and nickel are not generated, so that the requirement of corrosion resistance can be met.
In the leadless gold plating process, the plated area of the tidy gold finger is reduced by about 6% compared with that of the gold finger with the lead, so that the gold plating and nickel plating noble metal cost can be saved; the leadless process can reduce the reworked bevel edge scrapping cost caused by the manual rubbing reworking of the bevel edge wire drawing in the bevel edge chamfering process, and cancel the online quality control in the bevel edge chamfering process, thereby reducing the labor cost of quality control; the leadless process reduces the two rubberizing processes in the traditional gold plating process, reduces the manual operations of gold plating rubberizing and manual rubberizing to open the conductive skylight, and reduces the cost of labor and adhesive tape.
As shown in fig. 1, the gold plating jig includes a probe conductive plate 20, on which a positioning spring probe 22 and the conductive spring probe 21 are disposed, the positioning spring probe 22 is used for fixing the printed circuit board 10, and the conductive spring probe 21 is used for electroplating the golden finger 11 on the printed circuit board. The traditional inscription type of the gold-plated wire is changed into the external contact type of the conductive spring probe, and the normal conductive gold-plating function is realized. The probe conducting plate is utilized to output current, and the output current is uniform, so that the uniformity of gold plating is improved, the traditional dummy finger current sharing design can be canceled, and the gold plating cost is reduced by about 3%. The spring in the conductive spring probe can ensure that the probe and the PCB golden finger have proper contact force, and the golden finger is prevented from being crushed. Accurate positioning of the PCB can be ensured by the positioning spring probes.
As shown in fig. 1, the probe card 20 is connected to a driving mechanism 23, and the driving mechanism 23 can control the probe card 20 to move toward the printed circuit board 10 or away from the printed circuit board 10. When gold plating is needed, the driving mechanism 23 drives the probe conducting plates 20 to run towards the direction of the PCB, namely, the driving mechanism 23 in FIG. 1 drives the probe conducting plates 20 on two sides to approach towards the middle PCB until the positioning spring probes 22 press the PCB, and the conductive spring probes 21 are contacted with the finger area to be gold plated on the PCB; after gold plating of the gold finger 11 is completed, the driving mechanism 23 drives the probe conducting plates 20 on two sides to move towards the direction away from the middle PCB, and the positioning spring probes 22 and the conducting spring probes 21 are separated from the PCB.
The probe conducting plate 20 is made of FR-4 material with the thickness of 2.0mm plus or minus 0.2mm, a conducting PTH through hole is processed on the probe conducting plate 20, the conducting spring probe 21 is welded in the through hole, and the conducting spring probe 21 is connected with an external power supply. FR-4 is glass fiber epoxy resin copper-clad plate.
The surface of the conductive spring probe 21 is coated with three-proofing paint, and the conductive spring probe 21 is contacted with a non-main area of the root of the golden finger of the printed circuit board. The three-proofing paint is a special formula paint used for protecting circuit boards and related equipment from being corroded by environment. The three-proofing paint has good high and low temperature resistance; the cured transparent protective film has excellent insulating, dampproof, anticreep, shockproof, dustproof, anticorrosive, ageing-proof, corona-proof and other performances.
In the gold plating process, the printed circuit board 10 to be gold plated is transferred to a gold plating bath by a transfer belt, and after the printed circuit board 10 is transferred to a predetermined position, the probe conductive plate 20 is moved toward the printed circuit board by the driving mechanism 23 until the conductive spring probe 21 contacts the finger root of the printed circuit board 10 to be gold plated while the positioning spring probe 22 fixes the printed circuit board 10.
In the gold plating process, after the gold plating is completed, the probe conductive plate 20 is moved by 50mm + -5 mm toward a direction away from the printed circuit board 10 under the action of the driving mechanism 23, and the conveyor belt sends the printed circuit board 10 after gold plating out of the gold plating tank.
The probe conductive plate 20 is equal to the printed circuit board 10 in size, all finger positions requiring gold plating are respectively contacted with one conductive spring probe 21, and the conductive spring probes 21 are connected with a conductive negative electrode. Therefore, the difference of high and low currents is avoided, the output currents of the probe conducting plates are uniform, and the design of current sharing of the fake finger can be canceled.
The probe conducting plate is as large as a PCB to be plated with gold, contact type conductive spring probes 21 are arranged on the probe conducting plate, all the conductive spring probes 21 are connected with conductive cathodes, the probe conducting plate is made of FR-4 material with the thickness of 2mm, conductive PTH through holes are processed at positions, corresponding to the PCB, of fingers to be plated with gold, the conductive spring probes 21 are welded in the through holes, and after the probes are installed, three-proofing paint is coated on the probes. When the PCB is operated, after the PCB is conveyed to a gold plating area of a gold plating groove along with the conveyor belt, the conveyor belt stops operating, the driving mechanism 23 drives the probe conducting plates 20 on two sides to approach towards the middle PCB until the positioning spring probes 22 press the PCB, the conducting spring probes 21 are contacted with the position of a finger to be plated on the PCB, current is conveyed, and gold plating operation is started; when the gold plating is finished, the driving mechanism 23 drives the probe conducting plates 20 on both sides to retreat 50mm toward the direction away from the middle PCB, and the conveyor belt runs to send the PCB out of the gold plating tank.
It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.
Claims (8)
1. A gold plating process of a contact leadless printed circuit board is characterized in that: the method comprises the following steps:
and (3) dry film: exposing the region of the printed circuit board (10) which needs gold plating, covering a bonding pad which does not need gold plating by adopting a photosensitive dry film, and curing after polymerization of the photosensitive dry film by exposure treatment to avoid adhesion of Jin Nian nickel to the non-gold-plated region;
gold plating: conveying the printed circuit board (10) to be plated with gold after the dry film treatment to a gold plating groove, after aligning with a gold plating jig, enabling a conductive spring probe (21) on the gold plating jig to contact with the position of a gold plating finger of the printed circuit board, starting a gold plating procedure to plate gold for the gold finger (11) in a gold plating area, and after the gold plating is finished, conveying the gold plating printed circuit board out of the gold plating groove;
removing the film: removing a dry film attached to the printed circuit board through a film removing wire;
and (3) forming: and (3) performing bevel edge processing molding on the printed circuit board (10) subjected to gold plating.
2. The gold plating process of a contact leadless printed circuit board according to claim 1, wherein: the gold plating jig comprises a probe conducting plate (20), wherein a positioning spring probe (22) and a conducting spring probe (21) are arranged on the probe conducting plate, the positioning spring probe (22) is used for fixing a printed circuit board (10), and the conducting spring probe (21) is used for electroplating golden fingers (11) on the printed circuit board.
3. The gold plating process of a contact leadless printed circuit board according to claim 2, wherein: the probe conducting plate (20) is connected to a driving mechanism (23), and the driving mechanism (23) can control the probe conducting plate (20) to move towards the direction of the printed circuit board (10) or move away from the direction of the printed circuit board (10).
4. The gold plating process of a contact leadless printed circuit board according to claim 2, wherein: the probe conducting plate (20) is made of FR-4 material with the thickness of 2.0mm plus or minus 0.2mm, a conducting PTH through hole is processed on the probe conducting plate (20), the conducting spring probe (21) is welded in the through hole, and the conducting spring probe (21) is connected with an external power supply.
5. The gold plating process of a contact leadless printed circuit board according to claim 2, wherein: the surface of the conductive spring probe (21) is coated with three-proofing paint, and the conductive spring probe (21) is contacted with a non-main area of the root of the golden finger of the printed circuit board.
6. A gold plating process for a contact leadless printed circuit board according to claim 3, wherein: in the gold plating process, the printed circuit board (10) to be gold plated is conveyed to a gold plating tank by a conveyor belt, and after the printed circuit board (10) is conveyed to a preset position, the probe conductive plate (20) is operated towards the printed circuit board by the driving mechanism (23) until the conductive spring probe (21) contacts with the root of the finger to be gold plated of the printed circuit board (10), and the positioning spring probe (22) fixes the printed circuit board (10).
7. The gold plating process of a contact leadless printed circuit board according to claim 6, wherein: in the gold plating process, after the gold plating is completed, the probe conducting plate (20) moves 50mm plus or minus 5mm away from the printed circuit board (10) under the action of the driving mechanism (23), and then the conveyer belt sends the printed circuit board (10) after gold plating out of the gold plating groove.
8. The gold plating process of a contact leadless printed circuit board according to claim 1, wherein: the probe conducting plate (20) is equal to the printed circuit board (10) in size, all positions of fingers needing gold plating are respectively contacted with one conducting spring probe (21), and the conducting spring probes (21) are connected with a conducting negative electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311053221.0A CN117177476A (en) | 2023-08-21 | 2023-08-21 | Gold plating process of contact leadless printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311053221.0A CN117177476A (en) | 2023-08-21 | 2023-08-21 | Gold plating process of contact leadless printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117177476A true CN117177476A (en) | 2023-12-05 |
Family
ID=88942269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311053221.0A Pending CN117177476A (en) | 2023-08-21 | 2023-08-21 | Gold plating process of contact leadless printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117177476A (en) |
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2023
- 2023-08-21 CN CN202311053221.0A patent/CN117177476A/en active Pending
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