CN117153631A - Preparation method of fuse element of fuse link current - Google Patents
Preparation method of fuse element of fuse link current Download PDFInfo
- Publication number
- CN117153631A CN117153631A CN202311432418.5A CN202311432418A CN117153631A CN 117153631 A CN117153631 A CN 117153631A CN 202311432418 A CN202311432418 A CN 202311432418A CN 117153631 A CN117153631 A CN 117153631A
- Authority
- CN
- China
- Prior art keywords
- fuse
- printing
- solder paste
- fuse element
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 229910000679 solder Inorganic materials 0.000 claims abstract description 58
- 238000007639 printing Methods 0.000 claims abstract description 33
- 238000003466 welding Methods 0.000 claims abstract description 22
- 229920002799 BoPET Polymers 0.000 claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052802 copper Inorganic materials 0.000 claims abstract description 20
- 239000010949 copper Substances 0.000 claims abstract description 20
- 238000009713 electroplating Methods 0.000 claims abstract description 14
- 239000002253 acid Substances 0.000 claims abstract description 13
- 238000005406 washing Methods 0.000 claims abstract description 13
- 238000005553 drilling Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 10
- 238000003825 pressing Methods 0.000 claims abstract description 9
- 238000004381 surface treatment Methods 0.000 claims abstract description 9
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 8
- 239000000956 alloy Substances 0.000 claims abstract description 8
- 238000002844 melting Methods 0.000 claims abstract description 8
- 238000012360 testing method Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 19
- 238000011161 development Methods 0.000 claims description 16
- 238000012545 processing Methods 0.000 claims description 10
- 230000002265 prevention Effects 0.000 claims description 8
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- 238000005111 flow chemistry technique Methods 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 6
- 230000008018 melting Effects 0.000 abstract description 2
- 239000003292 glue Substances 0.000 abstract 1
- 238000007650 screen-printing Methods 0.000 abstract 1
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
- H01H69/022—Manufacture of fuses of printed circuit fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
- H01H2069/025—Manufacture of fuses using lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2229/00—Manufacturing
- H01H2229/002—Screen printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2229/00—Manufacturing
- H01H2229/014—Electro deposition
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Fuses (AREA)
Abstract
The invention discloses a preparation method of a fuse element of a fuse body current, which comprises the following steps: s1: performing PIN surrounding operation on the base material, drilling an alignment hole for inner layer exposure on the base material, and performing edge-dragging and inner layer pretreatment, wherein the edge-dragging size is 225 mm or 250mm; s2: performing film pressing operation; s3: performing film removing operation, then performing acid washing, and performing resistance test on the processed product; s4: anti-welding wire mark; s5: anti-welding exposure; s6: developing solder resist; s7: pasting a PET film; s8: laser drilling; s9: removing the glue by plasma; s10: printing solder paste; s11: solidifying the solder paste; s12: silk screen printing; s13: repeating the steps of S4 to S6 and S9 once, and then carrying out acid washing operation; s14: hole filling electroplating; s15: and (5) surface treatment. According to the preparation method of the fuse element of the fuse body current, an alloy layer is generated on a copper surface, and the fuse effect is achieved by utilizing the melting point characteristic of the alloy after the power is applied.
Description
Technical Field
The invention relates to the technical field of fuse link current fuse processing, in particular to a preparation method of a fuse link current fuse element.
Background
The operation and the use of electronic devices are mostly independent of the use of a PCB, wherein the fuse-link current fuse plays a role in current protection in the system, so that the smooth operation and the service life of the electronic devices can be ensured to a great extent, and along with the increasing maturity of a PCB process, the preparation method of the fuse-link current fuse tends to be stable, but the existing preparation method of the fuse-link current fuse has the following problems in use:
the existing preparation method of the fuse-link current fuse has the problems that the manufacturing technology can only be processed through an electroplating tinning process, an alloy layer is generated on a copper surface, the safety effect is achieved by utilizing the melting point characteristic of the alloy after electrifying, in the process, the process steps are 72 steps, the yield is low in the production process (the copper thickness is only 2-3um, the problems of insufficient copper thickness and surface treatment jump plating are easy to occur in the processing process), the process is long in time consumption, the manufacturing cost is high, the resistance is unstable and the like.
Aiming at the problems, innovative design is urgently needed on the basis of the original preparation method of the fuse-link current fuse.
Disclosure of Invention
The invention aims to provide a preparation method of a fuse element of a fuse-link current, which aims to solve the problems of low yield, long process time consumption, high manufacturing cost, unstable resistance and the like of the existing preparation method of the fuse-link current provided by the background art.
In order to achieve the above purpose, the present invention provides the following technical solutions: a method of manufacturing a fuse element for a fuse link current, the method comprising the steps of:
s1: performing PIN surrounding operation on the base material, drilling an alignment hole for inner layer exposure on the base material, and performing edge-dragging and inner layer pretreatment, wherein the edge-dragging size is 225 mm or 250mm;
s2: performing film pressing operation, pressing RD3025 dry film, and performing inner layer exposure, development and flash etching;
s3: performing film removing operation, then performing acid washing, performing resistance test on the processed product, and then performing inner layer AOI and anti-welding pretreatment;
s4: preventing welding wire from printing, and only printing TOP surfaces;
s5: performing solder resist exposure, and designing solder resist data according to the data graph requirement of the fusing circuit;
s6: performing anti-welding development, and performing pattern development according to the thickness of the printing ink;
s7: pasting a PET film, and pasting the PET film on the pattern with the welding prevention completed;
s8: laser drilling, and carrying out laser pattern processing on the basis of finishing the PET film processing;
s9: plasma photoresist removal is carried out on the basis of laser completion to ensure the cleanness of copper surfaces;
s10: printing solder paste, namely printing the solder paste on the basis of a laser pattern, wherein the thickness of the solder paste is not more than 10um thick of the ink;
s11: solidifying the solder paste, and solidifying the solder paste at a proper temperature according to the solidification condition of the solder paste to generate an alloy layer between the solder paste and the copper surface;
s12: printing by silk screen, namely tearing off the PET film, and then printing by whole-plate ink silk screen;
s13: repeating the steps of S4 to S6 and S9 once, and then carrying out acid washing operation;
s14: hole filling electroplating, namely electroplating copper filling manufacturing on the basis of welding and windowing prevention;
s15: and (3) carrying out surface treatment, and carrying out nickel-gold plate plating process flow processing after electroplating.
Preferably, the thickness of the solder mask layer for preventing solder mask printing in the step S4 is controlled to be less than or equal to 12um.
Preferably, the window precision of the solder mask development in the step S5 is 0.1mm by 0.1mm.
Preferably, the PET film in the step S7 has a thickness of 10um.
Preferably, the laser pattern size in the step S8 is 0.1mm by 0.1mm.
Preferably, the thickness of the ink in the step S12 is controlled to be 6-8 um.
Preferably, the copper thickness in the step S14 is controlled to be 16-18um.
Preferably, the surface treatment comprises nitrogen baking, acid washing, gold-melting pretreatment, electroless nickel gold, gold-melting post-treatment, molding, finished product cleaning, final inspection and packaging.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the copper-tin alloy layer is achieved through special process design, parameter setting is performed based on a pattern transfer after a pattern transfer by adopting a solder paste printing mode, the electroplated tin alloy layer is finally achieved, the safety effect is improved, the yield in the production process can be improved, meanwhile, the whole process is more simplified, the time consumption is lower, the manufacturing cost is lower, the resistance is stable, and the practical value is higher.
Drawings
FIG. 1 is a schematic diagram of the verification of the thickness of the solder mask ink in step S4 of the present invention;
FIG. 2 is a schematic diagram showing the effect of printing solder paste in step S10 of the present invention;
FIG. 3 is a schematic view showing the curing effect of the solder paste in step S11 according to the present invention;
FIG. 4 is a schematic view of the solder mask printing effect of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-4, the present invention provides a technical solution: a method for preparing a fuse element of a fuse body current,
example 1
The preparation method comprises the following steps:
s1: performing PIN surrounding operation on the base material, drilling an alignment hole for inner layer exposure on the base material, and performing edge-dragging and inner layer pretreatment, wherein the edge-dragging size is 225 mm or 250mm;
s2: performing film pressing operation, pressing RD3025 dry film, and performing inner layer exposure, development and flash etching;
s3: performing film removing operation, then performing acid washing, performing resistance test on the processed product, and then performing inner layer AOI and anti-welding pretreatment;
s4: preventing welding wire from printing, and only printing TOP surfaces;
s5: performing solder resist exposure, and designing solder resist data according to the data graph requirement of the fusing circuit;
s6: performing anti-welding development, and performing pattern development according to the thickness of the printing ink;
s7: pasting a PET film, and pasting the PET film on the pattern with the welding prevention completed;
s8: laser drilling, and carrying out laser pattern processing on the basis of finishing the PET film processing;
s9: plasma photoresist removal is carried out on the basis of laser completion to ensure the cleanness of copper surfaces;
s10: printing solder paste, namely printing the solder paste on the basis of a laser pattern, wherein the thickness of the solder paste is not more than 10um thick of the ink;
s11: solidifying the solder paste, and solidifying the solder paste at a proper temperature according to the solidification condition of the solder paste to generate an alloy layer between the solder paste and the copper surface;
s12: printing by silk screen, namely tearing off the PET film, and then printing by whole-plate ink silk screen;
s13: repeating the steps of S4 to S6 and S9 once, and then carrying out acid washing operation;
s14: hole filling electroplating, namely electroplating copper filling manufacturing on the basis of welding and windowing prevention;
s15: and (3) carrying out surface treatment, and carrying out nickel-gold plate plating process flow processing after electroplating.
And in the step S4, the thickness of the solder mask layer for preventing the solder mask mark is controlled to be less than or equal to 12um.
The window precision of the solder mask development in step S5 was 0.1mm by 0.1mm.
The PET film in step S7 had a thickness of 10um.
The laser pattern size in step S8 is 0.1mm by 0.1mm.
The ink thickness in step S12 is controlled to be 6-8um thick.
The copper thickness in step S14 is controlled to be 16-18um.
The surface treatment comprises nitrogen baking, acid washing, gold-melting pretreatment, electroless nickel-gold treatment, gold-melting post-treatment, molding, finished product cleaning, final inspection and packaging.
Example two
The preparation method comprises the following steps:
s1: performing PIN surrounding operation on the base material, drilling an alignment hole for inner layer exposure on the base material, and performing edge-dragging and inner layer pretreatment, wherein the edge-dragging size is 225 mm or 250mm;
s2: performing film pressing operation, pressing RD3025 dry film, and performing inner layer exposure, development and flash etching;
s3: performing film removing operation, then performing acid washing, performing resistance test on the processed product, and then performing inner layer AOI and anti-welding pretreatment;
s4: preventing welding wire from printing, and only printing TOP surfaces;
s5: performing solder resist exposure, and designing solder resist data according to the data graph requirement of the fusing circuit;
s6: performing anti-welding development, and performing pattern development according to the thickness of the printing ink;
s7: pasting a PET film, and pasting the PET film on the pattern with the welding prevention completed;
s8: laser drilling, and carrying out laser pattern processing on the basis of finishing the PET film processing;
s9: plasma photoresist removal is carried out on the basis of laser completion to ensure the cleanness of copper surfaces;
s10: printing solder paste, namely printing the solder paste on the basis of a laser pattern, wherein the thickness of the solder paste is not more than 10um thick of the ink;
s11: solidifying the solder paste, and solidifying the solder paste at a proper temperature according to the solidification condition of the solder paste to generate an alloy layer between the solder paste and the copper surface;
s12: printing by silk screen, namely tearing off the PET film, and then printing by whole-plate ink silk screen;
s13: repeating the steps of S4 to S6 and S9 once, and then carrying out acid washing operation;
s14: hole filling electroplating, namely electroplating copper filling manufacturing on the basis of welding and windowing prevention;
s15: and (3) carrying out surface treatment, and carrying out nickel-gold plate plating process flow processing after electroplating.
And in the step S4, the thickness of the solder mask layer for preventing the solder mask mark is controlled to be less than or equal to 10um.
The window precision of the solder mask development in step S5 was 0.1mm by 0.1mm.
The PET film in step S7 had a thickness of 9um.
The laser pattern size in step S8 is 0.1mm by 0.1mm.
The ink thickness in step S12 is controlled to be 6-8um thick.
The copper thickness in step S14 is controlled to be 14-17um.
Example III
The manufacturing method of the fuse element of the fuse body current is the same as that of the first embodiment, and the difference is that the thickness of the solder mask layer for preventing the solder mask mark in the step S4 is controlled to be less than or equal to 8um.
What has not been described in detail in this specification is prior art that is well known to those skilled in the art, and in the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front," "rear," "head," "tail," and the like are used as an orientation or positional relationship based on that shown in the drawings, merely to facilitate description of the invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "connected," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Although the present invention has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present invention.
Claims (8)
1. A preparation method of a fuse element of a fuse body current is characterized by comprising the following steps: the preparation method comprises the following steps:
s1: performing PIN surrounding operation on the base material, drilling an alignment hole for inner layer exposure on the base material, and performing edge-dragging and inner layer pretreatment, wherein the edge-dragging size is 225 mm or 250mm;
s2: performing film pressing operation, pressing RD3025 dry film, and performing inner layer exposure, development and flash etching;
s3: performing film removing operation, then performing acid washing, performing resistance test on the processed product, and then performing inner layer AOI and anti-welding pretreatment;
s4: preventing welding wire from printing, and only printing TOP surfaces;
s5: performing solder resist exposure, and designing solder resist data according to the data graph requirement of the fusing circuit;
s6: performing anti-welding development, and performing pattern development according to the thickness of the printing ink;
s7: pasting a PET film, and pasting the PET film on the pattern with the welding prevention completed;
s8: laser drilling, and carrying out laser pattern processing on the basis of finishing the PET film processing;
s9: plasma photoresist removal is carried out on the basis of laser completion to ensure the cleanness of copper surfaces;
s10: printing solder paste, namely printing the solder paste on the basis of a laser pattern, wherein the thickness of the solder paste is not more than 10um thick of the ink;
s11: solidifying the solder paste, and solidifying the solder paste at a proper temperature according to the solidification condition of the solder paste to generate an alloy layer between the solder paste and the copper surface;
s12: printing by silk screen, namely tearing off the PET film, and then printing by whole-plate ink silk screen;
s13: repeating the steps of S4 to S6 and S9 once, and then carrying out acid washing operation;
s14: hole filling electroplating, namely electroplating copper filling manufacturing on the basis of welding and windowing prevention;
s15: and (3) carrying out surface treatment, and carrying out nickel-gold plate plating process flow processing after electroplating.
2. The method for manufacturing a fuse element of a fuse of claim 1, wherein: and in the step S4, the thickness of the solder mask layer for preventing the solder mask from being printed is controlled to be less than or equal to 12um.
3. The method for manufacturing a fuse element of a fuse of claim 1, wherein: the window opening precision of the solder mask development in the step S5 is 0.1mm by 0.1mm.
4. The method for manufacturing a fuse element of a fuse of claim 1, wherein: the PET film in step S7 has a thickness of 10um.
5. The method for manufacturing a fuse element of a fuse of claim 1, wherein: the laser pattern size in the step S8 is 0.1mm by 0.1mm.
6. The method for manufacturing a fuse element of a fuse of claim 1, wherein: the thickness of the ink in the step S12 is controlled to be 6-8 um.
7. The method for manufacturing a fuse element of a fuse of claim 1, wherein: the copper thickness in the step S14 is controlled to be 16-18um.
8. The method for manufacturing a fuse element of a fuse of claim 1, wherein: the surface treatment comprises nitrogen baking, acid washing, gold-melting pretreatment, electroless nickel-gold treatment, gold-melting post-treatment, molding, finished product cleaning, final inspection and packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311432418.5A CN117153631B (en) | 2023-10-31 | 2023-10-31 | Preparation method of fuse element of fuse link current |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311432418.5A CN117153631B (en) | 2023-10-31 | 2023-10-31 | Preparation method of fuse element of fuse link current |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117153631A true CN117153631A (en) | 2023-12-01 |
| CN117153631B CN117153631B (en) | 2023-12-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311432418.5A Active CN117153631B (en) | 2023-10-31 | 2023-10-31 | Preparation method of fuse element of fuse link current |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117153631B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101944463A (en) * | 2010-08-31 | 2011-01-12 | 广东风华高新科技股份有限公司 | Film sheet fuse and preparation method thereof |
| CN112490134A (en) * | 2021-01-07 | 2021-03-12 | 深圳和美精艺半导体科技股份有限公司 | Packaging substrate processing method of double-sided OSP process |
| CN116581032A (en) * | 2023-05-30 | 2023-08-11 | 江苏普诺威电子股份有限公司 | Packaging loading plate with hollow structure and manufacturing process thereof |
-
2023
- 2023-10-31 CN CN202311432418.5A patent/CN117153631B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101944463A (en) * | 2010-08-31 | 2011-01-12 | 广东风华高新科技股份有限公司 | Film sheet fuse and preparation method thereof |
| CN112490134A (en) * | 2021-01-07 | 2021-03-12 | 深圳和美精艺半导体科技股份有限公司 | Packaging substrate processing method of double-sided OSP process |
| CN116581032A (en) * | 2023-05-30 | 2023-08-11 | 江苏普诺威电子股份有限公司 | Packaging loading plate with hollow structure and manufacturing process thereof |
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| Publication number | Publication date |
|---|---|
| CN117153631B (en) | 2023-12-29 |
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