CN117119843B

CN117119843B - Electronic device and method for manufacturing the same

Info

Publication number: CN117119843B
Application number: CN202310437711.4A
Authority: CN
Inventors: 丁才华; 郭学平; 王雅楠
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2023-04-14
Filing date: 2023-04-14
Publication date: 2024-05-17
Anticipated expiration: 2043-04-14
Also published as: CN117119843A

Abstract

The application provides an electronic device and a manufacturing method thereof, wherein the electronic device comprises a screen module, a supporting component and a plurality of electronic devices, the supporting component comprises a supporting plate and a functional layer, the screen module is adhered and fixed with the supporting plate, and the functional layer is arranged on at least one side of the supporting plate; and part of the electronic devices or part of the electronic devices are electrically connected with the screen module through the functional layer. According to the electronic equipment provided by the application, the supporting component comprises the functional layer and the supporting plate, so that the supporting component has a link transmission function, and part of functions of the electronic equipment can be integrated near or on the supporting component, so that the arrangement of electronic devices is more flexible, and meanwhile, the space of the main circuit board is released, thereby being beneficial to further compressing the whole space in the electronic equipment and realizing the thin design of the electronic equipment.

Description

Electronic device and method for manufacturing the same

Technical Field

The present disclosure relates to electronic devices, and particularly to an electronic device and a method for manufacturing the same.

Background

The development of the form of end products such as mobile phones is driven by Flexible Organic LIGHT EMITTING Diode (OLED). In order to ensure that the OLED display module has good overall flatness, the bottom layer of the display module is considered to be provided with a supporting plate. However, the supporting plate only has supporting function, has no other functions, and can cause the thickness increase of the whole machine after the supporting plate is added, thereby being unfavorable for the thinning design of the whole machine.

Disclosure of Invention

The application aims to provide an electronic device and a manufacturing method thereof, which are used for solving the problem that the thickness of the whole machine is increased due to the fact that a supporting plate is added at the bottom of a display module in the prior art.

The first aspect of the application provides an electronic device, which comprises a screen module, a support assembly and a plurality of electronic components, wherein the support assembly comprises a support plate and a functional layer, the screen module is fixedly bonded with the support plate, and the functional layer is arranged on at least one side of the support plate; and part of the electronic devices or part of the electronic devices are electrically connected with the screen module through the functional layer.

According to the electronic equipment provided by the application, the supporting component comprises the functional layer and the supporting plate, so that the supporting component has a link transmission function, and part of functions of the electronic equipment can be integrated near or on the supporting component, so that the arrangement of electronic devices is more flexible, and meanwhile, the space of the main circuit board is released, thereby being beneficial to further compressing the whole space in the electronic equipment and realizing the thin design of the electronic equipment.

In one possible implementation, a metallized via is provided on the support plate, one end of the metallized via is electrically connected to the functional layer, and the other end of the metallized via is electrically connected to the electronic device.

Through the cooperation of the metallized via hole and the functional layer, the electrical interconnection between external electronic devices can be realized, and transmission lines or circuit boards and the like are not required to be independently arranged in the area outside the supporting component to be connected with the electronic devices, so that the electronic devices can be favorably arranged closer to one side of the screen module, the internal space of the electronic equipment can be saved, and the thin design of the electronic equipment can be favorably realized.

In one possible implementation, a first groove is provided on the support plate, and the functional layer is disposed in the first groove.

The functional layer is arranged in the first groove by arranging the first groove, so that the supporting plate is compatible with the thickness of the functional layer, the functional layer can be prevented from occupying the space beyond the supporting plate, and the thin design of the electronic equipment is facilitated.

In one possible implementation, the thickness of the support plate is 120-150 μm, and the depth of the first groove is 30-60 μm.

The thickness of the supporting plate is in the range of 120-150 mu m, so that the supporting plate can not only ensure the effective supporting of the screen module, but also avoid the excessive space occupied by the supporting plate in the electronic equipment, thereby being beneficial to realizing the light and thin design of the electronic equipment. Further, by making the depth of the first groove 30 to 60 μm, it is possible to realize the arrangement of the transmission line in the functional layer without affecting the supporting function of the supporting plate.

In one possible implementation manner, the functional layers are arranged in a plurality in a direction perpendicular to the thickness direction of the electronic device, and two adjacent functional layers have a space therebetween.

For the folding mobile phone, the interval area between two adjacent functional layers can correspond to the part of the folding mobile phone, which needs to be bent, so that the functional layers of the folding mobile phone are not bent when the folding mobile phone is bent, and the problems that lines in the functional layers are broken or the functional layers are folded and the like are avoided. The spacer region may also correspond to a location where avoidance is desired. In addition, the position of the functional layer can be designed according to the position of the electronic device to be connected so as to realize the electric connection with the electronic device.

In one possible implementation, the support plate is provided with a flexible texture. Through setting up reticulate pattern structure, can reduce the backup pad and buckle regional rigidity, make the backup pad trend unanimous with the atress deformation condition of other retes, promote the foldability.

In one possible implementation manner, the supporting plate is provided with a bendable reticulation structure, and the interval is aligned with the reticulation structure along the thickness direction of the electronic equipment, so that the functional layer of the folding mobile phone is not bent when the folding mobile phone is bent, and the problems that lines in the functional layer are broken or the functional layer is wrinkled and the like are avoided.

In one possible implementation, the support plate is provided with a flexible texture, and the functional layer is aligned with the texture in a thickness direction of the electronic device. The functional layer can be a complete film layer, can cover a set area on the supporting plate, and can also cover the reticulate pattern structure, so that the functional layer can be conveniently processed and molded on the supporting plate.

In one possible implementation, the functional layer is disposed on both sides of the support plate in a thickness direction of the electronic device. That is, according to the actual connection requirement of the electronic devices, the functional layers on any side of the support plate in the first direction Z can be selectively connected, and of course, the electric connection between the electronic devices can be realized through the cooperation of the functional layers on both sides of the support plate, so that the flexibility of the electric connection of the electronic devices is improved.

In one possible implementation, a portion of the electronics is connected to the support plate.

The support plate can be used as a substrate for fixing part of electronic devices, namely, part of electronic devices can be mounted on the support plate in a gluing mode and the like, and the electronic devices mounted on the support plate or the electronic devices mounted on the support plate and other electronic devices can be electrically connected through the functional layer, so that part of electronic devices in the electronic equipment can be transferred to the support plate, the layout of the electronic devices is more flexible, the internal space of the electronic equipment is further compressed, and the thinned design of the electronic equipment is realized.

In one possible implementation, a portion of the electronic device is disposed between the support plate and the functional layer, so that the electronic device can be electrically connected to the functional layer while ensuring reliability of fixing the electronic device.

In one possible implementation manner, a part of the electronic device protrudes from the surface of the supporting plate, and the functional layer is coated on the outer surface of the part of the electronic device, so that the supporting component can absorb the thickness of the electronic device, the electronic device mounted on the supporting plate cannot occupy the space in the electronic device additionally, the layout of the electronic device can be more flexible, the reliability of fixing the electronic device can be ensured, more space in the electronic device can be released, and the thin design of the electronic device can be realized.

In a possible implementation, the support plate is provided with a second recess in which part of the electronic device is arranged.

The electronic device can be mounted in the second groove in a manner of, but not limited to, gluing and the like, so that the supporting plate can absorb the thickness of the electronic device, the electronic device is prevented from occupying the space outside the supporting assembly, and the thin design of the electronic device is facilitated.

In one possible implementation manner, the functional layer is provided with a transmission line and a bonding pad, the transmission line is connected with the bonding pad, and the bonding pad at least partially leaks out of the surface of the functional layer facing to one side of the supporting plate; the support plate is provided with a through groove aligned with the bonding pad in a thickness direction of the electronic device.

The through groove can be used for accommodating the whole or part of the electronic device, so that the electronic device can be welded with the bonding pad leaked from the functional layer through the through groove to realize electric connection. Therefore, the through groove can absorb the whole thickness or part of the thickness of the electronic device, which is beneficial to reducing the space occupied by the electronic device in the electronic equipment, and further is beneficial to realizing the thin design of the electronic equipment.

A second aspect of the present application provides a manufacturing method for manufacturing the electronic device provided in the first aspect of the present application, the method comprising the steps of:

laminating or coating a first medium on a support plate;

At least one transmission line layer is arranged in the first medium;

The supporting plate and the screen module are adhered and fixed;

and electrically connecting the transmission line layer with part of the electronic devices and/or the screen module.

In one possible implementation, before pressing or coating the first medium on the support plate, the method further comprises:

processing a first via hole on the supporting plate;

laminating or coating a second medium at the first via hole;

processing a second via hole on the medium in the first via hole;

And carrying out metallization treatment on the second via hole.

In one possible implementation manner, the pressing or coating the first medium on the supporting plate specifically includes:

machining a first groove in the support plate;

and pressing or coating a first medium in the first groove.

machining a second groove in the support plate;

Placing an electronic device in the second groove;

laminating or coating a second medium at the second groove to cover the electronic device;

Processing a blind hole on the second medium in the second groove so as to leak out an electric connection part on the electronic device;

And carrying out metallization treatment on the blind holes so that the electric connection parts of the electronic devices are electrically connected with the metallized inner walls of the blind holes.

In one possible implementation, after at least one transmission line layer is disposed in the first medium, the method further includes:

and machining a reticulate pattern structure on the supporting plate.

In a possible implementation manner, in the step of processing the first via hole on the support plate, the method further includes:

machining a reticulate pattern structure on the supporting plate;

before laminating or coating the second medium at the first via hole, the method further comprises:

and carrying out mask treatment on the reticulate pattern structure.

And processing a through groove on the supporting plate so that the bonding pad in the transmission line layer leaks out of the through groove.

In one possible implementation, the material of the first medium is polyimide or poly-p-phenylene benzobisoxazole.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application as claimed.

Drawings

Fig. 1 is a schematic structural diagram of an electronic product according to an embodiment of the present application;

Fig. 2 is a schematic structural diagram of an electronic product according to another embodiment of the application

Fig. 3 is a cross-sectional view of an electronic device according to the present embodiment;

FIG. 4 is a cross-sectional view of another electronic device according to an embodiment of the present application;

FIG. 5 is a cross-sectional view of another electronic device according to an embodiment of the present application;

FIG. 6 is a cross-sectional view of another electronic device according to an embodiment of the present application;

FIG. 7 is a schematic diagram of a functional layer connected to an electronic device through a metallized via according to an embodiment of the present application;

FIG. 8 is a schematic diagram of a functional layer connected to an electronic device through a metallized via according to another embodiment of the present application;

FIG. 9 is a cross-sectional view of an electronic device according to another embodiment of the present application;

FIG. 10 is a cross-sectional view of an electronic device according to another embodiment of the present application;

FIG. 11 is a cross-sectional view of an electronic device according to another embodiment of the present application;

FIG. 12 is a cross-sectional view of an electronic device according to another embodiment of the present application;

FIG. 13 is a cross-sectional view of an electronic device according to another embodiment of the present application;

FIG. 14 is a schematic view of a functional layer of another embodiment of the present application connected to an electronic device through a through via;

FIG. 15 is a schematic view of a functional layer of another embodiment of the present application connected to an electronic device through a through via;

FIG. 16 is a flow chart of a method of manufacturing an electronic device according to an embodiment of the present application;

FIG. 17 is a flow chart of a method of manufacturing an electronic device according to another embodiment of the present application;

FIG. 18 is a flowchart of a method of manufacturing an electronic device according to another embodiment of the present application;

FIG. 19 is a flow chart of a method of manufacturing a support assembly according to an embodiment of the present application;

FIG. 20a is a schematic view of the support plate after etching a second recess therein;

FIG. 20b is a schematic view of the placement of the electronic device in the second recess;

FIG. 20c is a schematic view of the support plate and the second recess after the second medium is disposed therein;

FIG. 20d is a schematic view of a second medium after blind via processing;

FIG. 20e is a schematic illustration of the blind via and a portion of the second medium on the surface of the support plate after metallization;

FIG. 20f is a schematic view of the functional layer after processing on the support plate;

FIG. 20g is a schematic view of the support plate after processing a first via hole therein;

FIG. 20h is a schematic illustration of the second dielectric after etching;

FIG. 20i is a schematic view of a second medium disposed in the first via hole and on a side surface of the support plate facing away from the functional layer;

FIG. 20j is a schematic diagram of the second dielectric after etching and stripping;

FIG. 20k is a schematic diagram of a second via after metallization;

FIG. 20l is a schematic view of the textured structure being machined into the support plate;

FIG. 20m is a schematic diagram of the protective dielectric layer laminated on the support plate;

FIG. 21 is a flowchart of a method of manufacturing a support assembly according to another embodiment of the present application;

FIG. 22a is a schematic illustration of the first via and the texture etched in the support plate;

FIG. 22b is a schematic view of the support plate after etching a second recess therein;

FIG. 22c is a schematic view of the placement of the electronic device in the second recess;

FIG. 22d is a schematic illustration of the masking of the texture;

FIG. 22e is a schematic view of the second medium disposed in the support plate and the second recess;

FIG. 22f is a schematic view of the second via and blind via processed in the second medium;

FIG. 22g is a schematic view of a second via, blind via, and portion of the second medium on the surface of the support plate after metallization;

FIG. 22h is a schematic view of the processing of a functional layer on a support plate;

FIG. 22i is a schematic diagram of the protective dielectric layer laminated on the support plate;

fig. 23 is a top view of the support plate.

Reference numerals:

1-a screen module;

2-a support assembly;

21-a support plate;

211-a first groove;

212-a second groove;

213-reticulate structure;

214-a through slot;

215-a first via;

216-a second via;

217-a second medium;

218-metallizing the via;

219-blind hole

2191-Metal layer;

22-functional layer;

221-a transmission line;

222-bonding pads;

223-a first medium;

224-interval;

225-metal blind holes;

3-electronic devices;

4-a spindle assembly;

5-a main circuit board;

6-wire harness;

61-FPC；

7-connectors;

8-protecting the dielectric layer;

81-windowing;

9-barrier film.

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.

Detailed Description

The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.

In the description of the present application, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance unless explicitly specified or limited otherwise; the term "plurality" means two or more, unless specified or indicated otherwise; the terms "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the description of the present specification, it should be understood that the terms "upper", "lower", and the like used in the embodiments of the present application are described in terms of the angles shown in the drawings, and should not be construed as limiting the embodiments of the present application. In the context of this document, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on the other element or be indirectly on the other element through intervening elements.

The development of the form of end products such as mobile phones is driven by Flexible Organic LIGHT EMITTING Diode (OLED). Particularly, the folding mobile phone and the folding computer have wide application in products such as folding mobile phones and folding computers.

In order to ensure that the OLED display module has good overall flatness, a support plate is generally considered to be disposed at the bottommost layer of the display module. However, the supporting plate only has supporting function, has no other functions, and can cause the thickness increase of the whole machine after the supporting plate is added, thereby being unfavorable for the thinning design of the whole machine. Taking a folding mobile phone as an example, a rotating shaft assembly is arranged at the middle part of the folding mobile phone, two main circuit boards are generally arranged at two sides of the rotating shaft assembly, the two main circuit boards are required to be electrically connected through flexible circuit boards (Flexible Printed Circuit, FPC), and at present, the FPC part is assembled inside the rotating shaft assembly and spans across two sides of the rotating shaft assembly, so that the FPC is also called a through-shaft FPC. The FPC can be bent along with bending of the screen module, and the requirement on the assembly redundancy design of the FPC is high. And FPC sets up inside the pivot subassembly, occupies the pivot space, influences pivot intensity, can also exist FPC in addition and pat the spare part in the pivot subassembly and cause the pivot abnormal sound, screen module receives FPC's extrusion and produces crease, shadow scheduling problem.

Therefore, if the FPC does not pass through the rotating shaft assembly, the redundant space required by bending of the FPC can be greatly reduced, the thickness of the whole machine is reduced, and meanwhile, the adverse effect of the FPC on the rotating shaft assembly and the screen module can be eliminated.

The embodiment of the application provides electronic equipment, which can be electronic equipment such as a mobile phone, a tablet personal computer, a handheld computer, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, an artificial intelligence (ARTIFICIAL INTELLIGENCE, AI) equipment, a wearable equipment, a vehicle-mounted equipment, an intelligent household equipment and/or a smart city equipment and the like, wherein a support component is needed to support a screen module. Fig. 1 is a schematic structural diagram of an electronic product according to an embodiment of the present application, and fig. 2 is a schematic structural diagram of an electronic product according to another embodiment of the present application, where fig. 1 schematically illustrates that the electronic product is a folding mobile phone, fig. 2 schematically illustrates that the electronic product is a straight mobile phone, and for convenience of explanation, the embodiment uses the electronic device as the folding mobile phone shown in fig. 1 and the straight mobile phone shown in fig. 2 as an example.

Fig. 3 is a cross-sectional view of an electronic device according to the present embodiment, where fig. 3 schematically shows a cross-sectional view of the electronic device when the electronic device is a folding mobile phone, and referring to fig. 3, the electronic device includes a screen module 1, a support assembly 2, and a plurality of electronic devices. The screen module 1 may be a Flexible organic light emitting transistor (OLED), an active-matrix organic light emitting diode (AMOLED) or an active-matrix organic LIGHT EMITTING diode, a Flexible Light Emitting Diode (FLED), a Mini LED, a Micro-OLED, a quantum dot LIGHT EMITTING diode (QLED), or the like. In some embodiments, the electronic device may include 1 or N screen modules, N being a positive integer greater than 1.

Referring to fig. 3, the support assembly 2 includes a support plate 21 and a functional layer 22, wherein the material of the support plate 21 may be copper foil, graphite, foam three-in-one composite material, or stainless steel plate, or titanium alloy plate, or carbon fiber or other composite film layer. The support plate 21 can be adhered to the back surface of the screen module 1 by glue. The functional layer 22 may be disposed on at least one side of the support plate 21, and the specific location may be determined according to the layout of the electronic device to be connected.

The electronic device includes a plurality of electronic devices, which may include a printed circuit board (Printed Circuit Board, PCB), a connector, an FPC, an antenna, a thin film sensor, etc., and the plurality of electronic devices may enable the electronic device to perform various functions. In this embodiment, for convenience of description, the electronic device does not include the screen module 1, that is, the screen module 1 may be a separate electronic device.

Wherein passive transmission lines may be provided in the functional layer 22, enabling electrical connection between the individual electronic devices. Referring to fig. 3, taking a folding mobile phone as an example, a rotating shaft assembly 4 and two main circuit boards 5 are disposed in the folding mobile phone, the two main circuit boards 5 are respectively located at two sides of the rotating shaft assembly 4, the functional layer 22 can be disposed in an area corresponding to the rotating shaft assembly 4, so that the two main circuit boards 5 can respectively adopt a wire harness 6 with an electric transmission function such as an FPC61 to connect with a passive transmission line in the functional layer 22, and the two main circuit boards 5 can be connected with the functional layer 22 at respective adjacent positions, so that the adopted wire harness 6 with the electric transmission function such as an FPC61 can be far away from the rotating shaft assembly 4, and therefore, the electric connection of the two main circuit boards 5 can be realized through the passive transmission line in the functional layer 22, and the adopted wire harness 6 with the electric transmission function such as an FPC61 can be prevented from penetrating through the rotating shaft assembly 4, thereby further compressing the space of the rotating shaft, reducing the thickness of the whole machine, simultaneously, avoiding the adverse effects of the FPCs on parts in the rotating shaft assembly, eliminating the strength of the rotating shaft assembly, eliminating abnormal noise, and avoiding the extrusion of the screen module when the FPCs penetrate the shaft, and avoiding the screen module.

Fig. 4 is a cross-sectional view of another electronic device according to an embodiment of the present application, and fig. 4 is an exemplary cross-sectional view illustrating a case where the electronic device is a bar phone, and referring to fig. 4, the bar phone is also provided with a main circuit board 5, and the main circuit board 5 may be connected to an adjacent functional layer 22 through a wire harness 6 having an electric transmission function such as an FPC61, and may be electrically connected to other electronic devices through the functional layer 22.

In addition, the functional layer 22 may also be disposed on the supporting board 21 near a position of the screen module 1 for connecting to the main circuit board 5, so that the screen module 1 may be connected to the corresponding main circuit board 5 through the functional layer 22, thereby facilitating routing and reducing the length of routing.

Of course, the functional layer 22 may also be provided on the support plate 21 at a position that facilitates connection of the respective electronic devices, so that electrical connection between the respective electronic devices or between the electronic devices and the screen module 1 may be achieved.

Therefore, the functional layer 22 can be beneficial to arranging the electronic devices close to the supporting component 2, and is not limited to being arranged on the traditional main circuit board 5, so that the electronic devices can be arranged more flexibly, the space of the main circuit board 5 is released, the whole space in the electronic equipment is further compressed, and the thin design of the electronic equipment is realized.

As a specific implementation manner, fig. 5 is a cross-sectional view of another electronic device provided in an embodiment of the present application, where fig. 5 exemplarily shows a cross-sectional view when the electronic device is a folding mobile phone, and the support plate 21 of the folding mobile phone is provided with a metallized via 218; fig. 6 is a cross-sectional view of another electronic device according to an embodiment of the present application, and fig. 6 is a cross-sectional view schematically illustrating a case where the electronic device is a bar phone, and the support plate 21 of the bar phone is provided with a metallized via 218. Referring to fig. 5 and 6, a metallized via 218 is provided on the support plate 21, one end of the metallized via 218 is electrically connected to the functional layer 22, and the other end of the metallized via 218 is electrically connected to the electronic device. The metallized via hole 218 is a hole structure penetrating the support plate 21, and the inner wall surface of the metallized via hole is provided with a metal layer 2191, the metal layer 2191 can extend to the surface of the support plate 21 near the hole, one end of the hole can be electrically connected with the transmission line 221 inside the functional layer 22 through the metal layer 2191, and the other end of the hole can be electrically connected with an external electronic device.

For example, fig. 7 is a schematic diagram of the functional layer 22 connected to the electronic device 3 through the metallized via 218 according to an embodiment of the present application, and referring to fig. 7, the metal layer 2191 near one end of the metallized via 218 is soldered to the FPC61 to be electrically connected, and the metal layer 2191 near the other end is electrically connected to the metal blind hole 225 at the end of the transmission line 221 in the functional layer 22. The metal blind via 225 may be formed by electroplating on the metal layer 2191.

Fig. 8 is a schematic diagram of the functional layer 22 connected to the electronic device 3 through the metallized via 218 according to another embodiment of the present application, and referring to fig. 8, the metal layer 2191 near one end of the metallized via 218 is soldered to the connector 7 to electrically connect, and the metal layer 2191 near the other end is electrically connected to the metal blind via 225 at the passive transmission line end of the functional layer 22.

Wherein, the number of the metallized via holes 218 may be plural, each metallized via hole 218 may be connected to one pin on the electronic device 3, and when the electronic device 3 has plural pins, the number of metallized via holes 218 may be correspondingly connected. In addition, the metallized via holes 218 may be distributed at different positions far away from each other for connecting pins of different electronic devices 3, and each metallized via hole 218 at different positions may be connected by a passive transmission line in the functional layer 22, so that by disposing the metallized via holes 218 at different positions of the supporting plate 21, interconnection of the electronic devices 3 at different positions may be realized, so as to improve flexibility of layout and electrical connection of the electronic devices 3.

Therefore, through the cooperation of the metallized via hole 218 and the functional layer 22, the electrical interconnection between the external electronic devices 3 can be realized, and the transmission line 221 or the circuit board and the like are not required to be arranged in the area outside the supporting component 2 to be connected with each electronic device 3, so that the electronic device 3 can be arranged closer to one side of the screen module 1, the internal space of the electronic equipment can be saved, and the thin design of the electronic equipment can be realized.

As a specific implementation manner, fig. 9 is a cross-sectional view of an electronic device according to another embodiment of the present application, and fig. 9 schematically shows a cross-sectional view of the electronic device when the electronic device is a folding mobile phone, where a support plate 21 of the folding mobile phone is provided with a first groove 211, and a functional layer 22 is disposed in the first groove 211. Fig. 10 is a cross-sectional view of an electronic device according to another embodiment of the present application, and fig. 10 is an exemplary cross-sectional view illustrating a case where the electronic device is a bar phone, and a support plate 21 of the bar phone is provided with a first groove 211, and a functional layer 22 is disposed in the first groove 211. Of course, the electronic device is not limited to the folding mobile phone and the straight mobile phone, but may be other electronic products, and the support plate 21 of the electronic product may be provided with the first groove 211, so that the functional layer 22 is disposed in the first groove 211, and the support plate 21 is compatible with the thickness of the functional layer 22, so that the functional layer 22 can be prevented from occupying a space other than the support plate 21, and the thin design of the electronic device is facilitated.

As a specific implementation, the thickness of the support plate 21 may be 120 to 150 μm.

If the thickness of the supporting plate 21 is too large, for example, greater than 150 μm, the supporting plate 21 occupies a larger internal space of the electronic device, which is not beneficial to the light and thin design of the electronic device; if the thickness of the support plate 21 is too small, for example, less than 120 μm, an effective support function for the screen module 1 cannot be achieved, or it is difficult to achieve in terms of processing. Therefore, in the present embodiment, the thickness of the supporting plate 21 is within the range of 120-150 μm, so that the supporting plate 21 can not only effectively support the screen module 1, but also avoid the supporting plate 21 occupying too large space in the electronic device, thereby being beneficial to realizing the light and thin design of the electronic device. Specifically, the thickness of the support plate 21 may be 120 μm, 130 μm, 140 μm or 150 μm.

Furthermore, in other embodiments, such as products where thickness requirements are not high, the thickness of the support plate 21 may be greater than 150 μm, and for folding cell phones or bar cell phones, the support plate 21 thickness is preferably 120-150 μm.

Further, the depth of the first grooves 211 may be 30 to 60 μm, and if the depth of the first grooves 211 is too large, for example, more than 60 μm, it may result in too small a thickness of the support plate 21 at the position of the first grooves 211 to exert an effective support function. If the depth of the first recess 211 is too small, for example less than 30 μm, it is inconvenient to arrange the transmission line 221-in the functional layer 22. For this reason, in the present embodiment, by making the depth of the first grooves 211 30 to 60 μm, it is possible to realize the arrangement of the transmission lines 221 in the functional layer 22 without affecting the supporting function of the supporting plate 21. Specifically, the depth of the first groove 211 may be 30 μm, 40 μm, 50 μm, or 60 μm.

As a specific implementation manner, the functional layers 22 are disposed in a plurality of directions perpendicular to the thickness direction of the electronic device, and a space 224 is provided between two adjacent functional layers 22, wherein, for convenience of explanation, the thickness direction of the electronic device is defined as a first direction Z, and the thickness direction perpendicular to the electronic device is defined as a second direction X. Fig. 11 is a cross-sectional view of an electronic device according to another embodiment of the present application, where fig. 11 schematically shows a cross-sectional view of the electronic device in a folded mobile phone, where two functional layers 22 are provided in the folded mobile phone, the two functional layers 22 have a certain interval 224 in a second direction, and an area of the interval 224 between the two functional layers 22 may correspond to a portion of the folded mobile phone that needs to be folded, so that the functional layers 22 may not be folded when the folded mobile phone is folded, and a problem that a circuit in the functional layers 22 is broken or the functional layers 22 are folded is avoided.

Of course, the number of the functional layers 22 is not limited to two, but may be more, and the space 224 between at least two functional layers 22 may not correspond to a portion of the folding mobile phone that needs to be bent, for example, the space 224 may correspond to a portion that needs to be avoided, and the position of the functional layers 22 may be designed according to the position of the electronic device 3 that needs to be connected, so as to achieve electrical connection with the electronic device 3. In addition, for an unfolded electronic product such as a bar phone, at least two functional layers 22 may be disposed in the second direction X, and a space 224 may be provided between two adjacent functional layers 22.

As a specific implementation, referring to fig. 5, a flexible reticulation structure 213 is provided on the support plate 21. The mesh structure 213 may be formed by providing a plurality of mesh holes in the region of the support plate 21 where bending is required. For an electronic product with a folding function, such as a folding mobile phone, if the supporting plate 21 is a flat plate without the reticulate pattern structure 213, the elastic modulus of the supporting plate 21 is obviously different from that of other film layers, such as an adhesive layer, so that the supporting plate 21 is relatively not easy to deform in the bending process, and the bending part is not consistent in stress deformation between the film layers in the bending process, so that the phenomena of debonding, fracture and the like between the supporting plate 21 and the film layers, such as the adhesive layer, are caused. Therefore, in this embodiment, by providing the reticulate pattern structure 213, the rigidity of the supporting plate 21 in the bending region can be reduced, so that the stress deformation condition of the supporting plate 21 and other film layers tends to be consistent, and the foldability is improved.

As a specific implementation manner, referring to fig. 11, when more than two functional layers 22 are provided on the supporting plate 21, a certain interval 224 is provided between two adjacent functional layers 22 in the second direction X, and along the first direction Z, the interval 224 may be aligned with the reticulate pattern structure 213, so that the functional layers 22 are not bent when the folding mobile phone is bent, and the problems of breakage of the lines in the functional layers 22 or wrinkling of the functional layers 22 are avoided.

As a specific implementation, referring to fig. 5, in the thickness direction (first direction Z) of the electronic device, the functional layer 22 is aligned with the texture 213. In this embodiment, the functional layer 22 may be a complete film layer, which can cover a set area on the support plate 21, or may cover the reticulate pattern 213, so as to facilitate the processing and shaping of the functional layer 22 on the support plate 21.

As a specific implementation, the functional layers 22 are disposed on both sides of the support plate 21 in the thickness direction (first direction Z) of the electronic device. That is, according to the actual connection requirement of the electronic devices 3, the functional layers 22 on any side of the support plate 21 in the first direction Z can be selectively connected, and of course, the electrical connection between the electronic devices 3 can be realized by the cooperation of the functional layers 22 on both sides of the support plate 21, so as to improve the flexibility of the electrical connection of the electronic devices 3.

Of course, in other embodiments, the functional layer 22 may be provided only on one side of the support plate 21 in the thickness direction to reduce the overall thickness of the support assembly 2.

As a specific implementation, fig. 12 is a cross-sectional view of an electronic device according to another embodiment of the present application, where fig. 12 is an exemplary cross-sectional view of the electronic device when the electronic device is a folding mobile phone, and referring to fig. 12, a part of the electronic device 3 is connected to the support plate 21. The supporting board 21 may be used as a substrate on which a part of the electronic devices 3 are fixed, that is, a part of the electronic devices 3 may be mounted on the supporting board 21 by means of gluing or the like, and the electronic devices 3 mounted on the supporting board 21 or the electronic devices 3 mounted on the supporting board 21 and other electronic devices 3 may be electrically connected by the functional layer 22, so that a part of the electronic devices 3 in the electronic device may be transferred to the supporting board 21, so that the layout of the electronic devices 3 is more flexible, which is beneficial to further compressing the internal space of the electronic device, and implementing the thin design of the electronic device.

As a specific implementation, referring to fig. 7, 8 and 12, a part of the electronic device 3 is disposed between the support plate 21 and the functional layer 22 so that the electronic device 3 is electrically connected with the functional layer 22 while securing reliability of fixing the electronic device 3.

For example, referring to fig. 12, the electronic device 3 may be disposed on the surface of the support plate 21 such that the electronic device 3 protrudes from the surface of the support plate 21, and after the electronic device 3 is disposed on the support plate 21, a functional layer 22 may be disposed on the side of the support plate 21 having the electronic device 3 thereon, the functional layer 22 being capable of wrapping the electronic device 3 therein, and capable of securing reliability of fixing the electronic device 3.

The electronic component 3 may also be arranged, for example, on the side of the support plate 21 facing away from the functional layer 22, depending on the actual arrangement requirements of the electronic component 3.

As a specific implementation, referring to fig. 7 and 8, the support plate 21 is provided with a second recess 212, and a part of the electronic device 3 is disposed in the second recess 212. Fig. 7 and 8 show only an example of a case where the second recess 212 is provided in the folding cellular phone, but of course, the electronic device 3 may be mounted on an electronic product such as a bar cellular phone by providing the second recess 212.

The electronic device 3 may be mounted in the second groove 212 by, but not limited to, gluing, etc., so that the supporting plate 21 may absorb the thickness of the electronic device 3, thereby avoiding the electronic device 3 from occupying the space outside the supporting assembly 2, and facilitating the slim design of the electronic device.

In addition, the functional layer 22 may be disposed on a side on which the electronic device 3 is mounted on the support plate 21, so that on one hand, the electronic device 3 and a passive transmission line in the functional layer 22 may be electrically connected, and on the other hand, the electronic device 3 may be wrapped or covered by the functional layer 22, so as to protect the electronic device 3, and meanwhile, the reliability of fixing the electronic device 3 in the second groove 212 may be ensured.

As a specific implementation manner, fig. 13 is a cross-sectional view of an electronic device according to another embodiment of the present application, where fig. 13 is an exemplary cross-sectional view of the electronic device when the electronic device is a folding mobile phone, and referring to fig. 13, a transmission line 221 and a pad 222 are disposed in a functional layer 22, the transmission line 221 is connected to the pad 222, and the pad 222 at least partially leaks out of a surface of the functional layer 22 facing a side of the support plate 21; the support plate 21 is provided with a through groove 214, and the through groove 214 is aligned with the pad 222 in the thickness direction (first direction Z) of the electronic device.

In this embodiment, the diameter range of the through slot 214 on the support plate may be determined according to the number of the bonding pads 222 and the soldering process, and the side length may be in millimeter level, without performing metallization treatment, the through slot 214 may be used to accommodate a part of or the whole part of an external electronic device, which is different from the electronic device 3 shown in fig. 13 and disposed on the support plate 21, and the external electronic device may be soldered with the bonding pad 222 leaked from the functional layer 22 through the through slot 214 to achieve electrical connection. Therefore, the through groove 214 can absorb the whole thickness or part of the thickness of the external electronic device, which is beneficial to reducing the space occupied by the external electronic device in the electronic device, and further is beneficial to realizing the thin design of the electronic device.

Fig. 14 is a schematic view of a functional layer 22 according to another embodiment of the present application, in which an electronic device 3 is connected through a through slot 214, and referring to fig. 14, fig. 14 schematically shows that the external electronic device is an FPC61, one end of the FPC61 is soldered to a pad 222 of a transmission line 221 through the through slot 214, and a part of the FPC61 can be accommodated in the through slot 214, so that the space occupied by the FPC61 in the electronic device is reduced.

As an example, fig. 15 is a schematic view of the functional layer 22 according to another embodiment of the present application, where the functional layer is connected to the electronic device 3 through the through slot 214, referring to fig. 15, fig. 15 shows that the external electronic device is the connector 7, one end of the connector 7 may be soldered with the pad 222 of the transmission line 221, and a portion of the connector 7 may be accommodated in the through slot 214, so that the connector 7 does not occupy too much space outside the supporting component 2, which is beneficial for implementing a slim design of the electronic device.

Fig. 16 is a flowchart of a method for manufacturing an electronic device according to an embodiment of the present application, and referring to fig. 16, an embodiment of the present application further provides a manufacturing method for manufacturing an electronic device according to any embodiment of the present application, the method including the steps of:

Step S1, pressing or coating the first medium 223 on the support plate 21.

In one embodiment, the first medium 223 may be a molded film-like material that may be secured to the surface of the support plate 21 by a lamination process. In another embodiment, the first medium 223 may be a liquid or other material having a certain fluidity, and the first medium 223 may be coated on the surface of the support plate 21 through a coating process and form a film-like structure after being cured.

The material of the first medium 223 may be, but is not limited to, polyimide, poly (p-phenylene benzobisoxazole), or the like.

Specifically, step S1 specifically includes:

step S11, machining a first groove 211 on the support plate 21.

Wherein, the first groove 211 may be formed by an etching process.

Step S12, pressing or coating the first medium 223 in the first groove 211.

When the first medium 223 is a molded film material, the first medium 223 may be embedded into the first groove 211 through a pressing process. When the first medium 223 is a liquid or the like having a certain fluidity, a film-like structure conforming to the first groove 211 can be gradually formed in the first groove 211 by a coating process.

Step S2, at least one transmission line layer is disposed in the first medium 223.

The transmission line layer may include a transmission line 221 of a metallic material having excellent conductivity, such as an aluminum line, a copper line, or the like. The transmission line 221 may be fixed to the first medium 223 in a predetermined routing manner, so that the functional layer 22 has an electrical connection function.

In addition, the first medium 223 may have one or more layers, and accordingly, the transmission line layer may also have one or more layers. When the first medium 223 and the transmission line layer each have a plurality of layers, different electronic devices 3 can be connected through the transmission line layers of different layers, so that the functional layer 22 can enable electrical connection of more electronic devices 3.

Illustratively, referring to fig. 5, the functional layer 22 includes three first dielectric layers 223 and three transmission line layers, where the transmission line layer located at the uppermost layer can serve as a reference ground and a shielding layer, and plays a role of backflow and isolation, so as to avoid interference of signal lines to a screen; the middle transmission line layer can be a signal line layer for realizing the electric connection property of the interconnection link; the bottommost transmission line layer may be electrically connected to the metallized via 218 or used for direct soldering with the electronic device 3.

Step S3, the supporting plate 21 and the screen module 1 are adhered and fixed. Wherein, if the functional layer 22 is located on the side of the support plate 21 facing the screen module 1, the functional layer 22 may be attached to the screen module 1 by gluing.

Step S4, electrically connecting the transmission line layer with a part of the electronic device 3 and/or the screen module 1. The portion of the transmission line layer leaking out of the first medium 223 may be electrically connected to at least one of the electronic device 3 and the screen module 1.

Therefore, the electronic equipment prepared by the manufacturing method provided by the embodiment of the application can enable the support component 2 to realize a link transmission function, so that the connection between the electronic devices 3 is more flexible, the internal space of the electronic equipment is released, and the thin design of the electronic equipment is realized.

Fig. 17 is a flowchart of a method for manufacturing an electronic device according to another embodiment of the present application, referring to fig. 17, before step S1, the method further includes:

Step S01a, processing the first via hole 215 on the support plate 21.

The first via hole 215 is a hole penetrating in the thickness direction of the support plate 21, and specifically may be formed by a laser processing process, an etching process, or a mechanical drilling process.

Step S01b, laminating or coating the second medium 217 at the first via hole 215.

The second medium 217 is an insulating material, and the second medium 217 may fill the first via hole 215 and may extend to cover a portion of the support plate 21 adjacent to both ends of the first via hole 215.

In step S01c, a second via hole 216 is processed for the medium in the first via hole 215.

Wherein the diameter of the second via hole 216 is smaller than that of the first via hole 215, so that an insulating layer composed of the second medium 217 can be formed on the inner wall of the first via hole 215 and on the partial region of the support plate 21 adjacent to both ends of the first via hole 215.

In step S01d, the second via hole 216 is metallized, so that a metal layer 2191 may be formed on the inner wall surface of the second via hole 216 and the partial area of the support plate 21 adjacent to the two ends of the first via hole 215, and electrical transmission may be achieved through the metal layer 2191, so as to electrically connect the electronic device 3 and the functional layer 22 located on the two sides of the support plate 21 in the thickness direction. Subsequent processing of the functional layer 22 may be performed after the formation of the metallized via 218.

Fig. 18 is a flowchart of a method for manufacturing an electronic device according to another embodiment of the present application, referring to fig. 18, before step S1, the method further includes:

step S02a, machining a second groove 212 in the support plate 21.

Wherein the second recess 212 may be formed by an etching process.

Step S02b, placing the electronic device 3 in the second recess 212.

Wherein the electronic device 3 may be fixed in the second recess 212 by means of gluing or the like, so as to ensure the reliability of the fixation of the electronic device 3 in the second recess 212.

Step S02c, laminating or coating the second medium 217 at the second recess 212 to encapsulate the electronic device 3.

After the electronic device 3 is placed in the second groove 212, a gap is formed between the electronic device 3 and the inner wall of the second groove 212, and the gap easily causes shaking of the electronic device 3, and when the inner wall of the second groove 212 is made of a conductive material, the contact short circuit of the electronic device 3 is also easily caused. For this reason, the second medium 217 is filled in the second groove 212, so that insulation between the electronic device 3 and the inside of the second groove 212 can be realized, and on the one hand, a gap between the electronic device 3 and the second groove 212 can be eliminated through the second medium 217, so that stability of the electronic device 3 can be ensured.

In step S02d, a blind hole 219 is formed in the second medium 217 in the second recess 212 to leak out the electrical connection portion on the electronic device 3.

After filling the second medium 217, in order to facilitate the electrical connection between the electronic device 3 and the functional layer 22, punching and removing may be performed on the second medium 217 corresponding to the electrical connection portion of the electronic device 3, so that the electrical connection portion of the electronic device 3 leaks out.

In step S02e, the blind via 219 is metallized, so that the electrical connection portion of the electronic device 3 is electrically connected to the metallized inner wall of the blind via 219. Thus, by the metallization process of the blind via 219, the electrical connection of the electronic device 3 located within the second medium 217 can be transferred to the end of the blind via 219, thereby facilitating electrical connection with the transmission line 221 in the functional layer 22. Subsequent processing of the functional layer 22 may be performed after the formation of the metallized blind via 219.

In addition, the first via hole 215 in the step S01a and the second groove 212 in the step S02a may be formed by processing in the same process, the step S01b may be performed in the same process by providing the second medium 217 in the first via hole 215 and the step S02c may be performed by providing the second medium 217 in the second groove 212 in the step S01b, the step S01c may be performed by processing the second via hole 216 and the step S02d may be performed by processing the blind hole 219 in the same process, the step S01d may be performed by performing the metallization process on the second via hole 216 and the step S02e may be performed by performing the metallization process on the blind hole 219 in the same process, thereby simplifying the process steps and improving the production efficiency.

As a specific implementation, after step S2, the method further includes:

Step S21, machining a reticulation structure 213 on the support plate 21. The reticulation structure 213 can make the bending performance of the supporting plate 21 at the reticulation structure 213 close to that of the adjacent film layers, and avoid the problem that the supporting plate 21 is separated from the adjacent film layers at the bending position, wherein the adjacent film layers refer to one or more film layers adjacent to the supporting plate 21 at the bending region.

Fig. 19 is a flowchart of a method for manufacturing a support assembly 2 according to an embodiment of the present application, and referring to fig. 19, in a specific embodiment, the support assembly 2 may be formed by the following method:

Step a1, etching a second groove 212 on the support plate 21. Fig. 20a is a schematic view of the support plate 21 after etching the second grooves 212, referring to fig. 20a, one or more second grooves 212 may be etched on the support plate 21, and two second grooves 212 are illustrated in fig. 20 a.

Step a2, placing the electronic device 3 in the second recess 212. Fig. 20b is a schematic view of the electronic devices 3 placed in the second grooves 212, and referring to fig. 20b, each of the second grooves 212 may be placed with one electronic device 3.

Step a3, disposing a second medium 217 in the second recess 212 on the surface of the support plate 21 having the second recess 212. Fig. 20c is a schematic diagram of the second medium 217 disposed in the support plate 21 and the second recess 212, and referring to fig. 20c, the second medium 217 can insulate the second recess 212 from the electronic device 3 therein, and insulate the surface of the support plate 21 from the functional layer 22.

Step a4, processing a blind hole 219 on the second medium 217 at the second groove 212 to leak out the electrical connection portion of the electronic device 3. Fig. 20d is a schematic view of the second medium 217 after processing the blind via 219, and referring to fig. 20d, the blind via 219 can realize leakage of the electrical connection portion on the electronic device 3, so as to electrically connect the electronic device 3 with the functional layer 22.

Step a5, metallizing the blind holes 219 and the portion of the second medium 217 located on the surface of the support plate 21. Fig. 20e is a schematic diagram of a metallization process performed on the blind via 219 and a portion of the second medium 217 located on the surface of the support plate 21, and referring to fig. 20e, a metal layer 2191 may be formed on the inner wall surface of the blind via 219 and a portion of the surface of the support plate 21 after the metallization process, and the metal layer 2191 may be electrically connected to the transmission line 221 in the functional layer 22.

Step a6, processing the functional layer 22 on the support plate 21. Fig. 20f is a schematic view of the functional layer 22 formed on the support plate 21, and referring to fig. 20f, part of the transmission lines 221 in the functional layer 22 may be connected to the blind holes 219 formed by metallization and/or the metallized portions of the surface of the support plate 21, and part of the transmission lines 221 in each layer may also be connected through the blind metal holes 225.

Step a7, processing a first via 215 on the support plate 21. Fig. 20g is a schematic view of the support plate 21 after the first via 215 is formed, and referring to fig. 20g, the first via 215 is aligned with the second medium 217, which is metallized in the portion of the surface of the support plate 21, in the first direction Z. The first via hole 215 may be formed by an etching process.

Step a8, etching and removing the second medium 217 aligned with the first via 215 in the first direction X to leak out the metallized metal layer 2191. Fig. 20h is a schematic view of the etched second medium 217, and referring to fig. 20h, after the second medium 217 opposite to the first via hole 215 is removed, the metal layer 2191 at the position may be exposed in the second via hole 216.

In step a9, a second medium 217 is disposed in the first via hole 215 and on a side surface of the support plate 21 facing away from the functional layer 22. Fig. 20i is a schematic view of the second medium 217 disposed in the first via hole 215 and on the surface of the support plate 21 facing away from the functional layer 22, and referring to fig. 20i, the second medium 217 may be used to form an insulating layer on the surface of the support plate 21 in the first via hole 215.

In step a10, the second medium 217 in the first via hole 215 is processed into the second via hole 216, and the metal layer 2191 in step a8 is leaked, and the second medium 217 on the support plate 21 in the bending region is etched and removed. Fig. 20j is a schematic diagram of the second medium 217 after being etched and removed, and referring to fig. 20j, the diameter of the second via hole 216 is smaller than that of the first via hole 215, so that the second medium 217 in the first via hole 215 can form an insulating layer on the inner wall surface of the first via hole 215 after being removed, and the metal layer 2191 formed by the metallization process in the step a8 can leak out of the second via hole; and the second medium 217 is removed from the support plate 21 at the portion to be bent to facilitate the subsequent processing of the texture structure 213.

Step a11, metalizing the second via hole 216 to form a metalized via hole 218 on the second via hole 216. Fig. 20k is a schematic diagram of the second via hole 216 after the metallization process, and referring to fig. 20k, one end of the second via hole 216 subjected to the metallization can be connected to the metal layer 2191 leaked in step a10, and the other end of the second via hole 216 subjected to the metallization can be used for electrical connection with the external electronic device 3. Wherein, during the process of metallizing the second via hole 216, a part of the surface of the support plate 21 facing away from the functional layer 22 may also be metallized, so that the electronic device 3 may be connected to the metallized part of the surface of the support plate 21, thereby facilitating the connection of the electronic device 3.

Step a12, machining a reticulation structure 213 on the bending area of the supporting plate 21. Fig. 20l is a schematic view of the support plate 21 after the texture 213 is formed, and referring to fig. 20l, the texture 213 may be formed by an etching process.

Step a13, laminating a protective medium layer 8 on the surface of one side of the supporting plate 21, which is away from the functional layer 22. Fig. 20m is a schematic diagram of the support plate 21 after the protective medium layer 8 is pressed, and referring to fig. 20m, the support plate 21 can be protected by the protective medium layer 8, so that the service life is prolonged. Also, to facilitate electrical connection of the metallized via 218 to the electronic device 3, a window 81 may be provided in the protective dielectric layer 8 at a location corresponding to the metal via.

As a specific implementation, the texture structure 213 does not need to be processed after the processing of the functional layer 22, but may be processed in the same process as the first via 215 in step S01a, and then, before the second medium 217 is pressed or coated at the first via 215, the texture structure 213 may be subjected to a masking process to avoid the second medium 217 from entering the texture structure 213.

Fig. 21 is a flowchart of a method for manufacturing a support assembly 2 according to another embodiment of the present application, and referring to fig. 21, in a specific embodiment, the support assembly 2 may be formed by the following method:

Step b1, etching the first via holes 215 and the reticulation structures 213 on the support plate 21. Fig. 22a is a schematic view of the support plate 21 after etching the first via holes 215 and the reticulation structure 213, and referring to fig. 22a, a plurality of first via holes 215 may be respectively disposed at both sides of the reticulation structure 213.

Step b2, etching a second groove 212 on the support plate 21. Fig. 22b is a schematic view of the support plate 21 after etching the second grooves 212, and referring to fig. 22b, at least one second groove 212 may be disposed on both sides of the texture 213, respectively.

Fig. 23 is a top view of the support plate 21, and referring to fig. 23, a bending region at a middle position of the support plate 21 is provided with a mesh structure 213, and the mesh structure 213 includes a plurality of mesh holes. Three first through holes 215 are provided on each side of the reticulation 213, while one second recess 212 is provided on each side of the reticulation 213. Of course, in other embodiments, the number of the first via holes 215 and the second grooves 212 may be other numbers, which is not limited in this embodiment.

Step b3, placing the electronic device 3 in the second recess 212. Fig. 22c is a schematic view of the electronic devices 3 placed in the second grooves 212, and referring to fig. 22c, each of the second grooves 212 may be placed with one electronic device 3.

Step b4, masking the reticulation structure 213. Fig. 22d is a schematic view of the masking of the reticulate pattern 213, and referring to fig. 22d, a barrier film 9 is attached to the end surface of the reticulate pattern 213 on both sides of the thickness direction of the support plate 21 to prevent the subsequent medium from entering the reticulate pattern 213.

Step b5, disposing a second medium 217 in a portion of the surface of the support plate 21 and the second recess 212. Fig. 22e is a schematic diagram of the second medium 217 disposed in the support plate 21 and the second recess 212, and referring to fig. 22e, the second medium 217 can insulate the second recess 212 from the electronic device 3 therein, and insulate the surface of the support plate 21 from the functional layer 22.

Step b6, processing a second via hole 216 on the second medium 217 in the first via hole 215, and processing a blind hole 219 on the medium in the second groove 212. Fig. 22f is a schematic diagram of the second via hole 216 and the blind hole 219 processed in the second medium 217, and referring to fig. 22f, the second via hole 216 and the blind hole 219 can be processed in the same process, so that the process can be simplified and the processing efficiency can be improved.

Step b7, metalizing the second via hole 216, the blind hole 219 and a portion of the second medium 217 located on the surface of the support plate 21. Fig. 22g is a schematic diagram of the second via hole 216, the blind via hole 219, and a portion of the second medium 217 on the surface of the support plate 21 after the metallization process, and referring to fig. 22g, the metallized portion on the surface of the support plate 21 may be connected to the metallized blind via hole 219 and the second via hole 216, respectively.

Step b8, processing the functional layer 22 on the support plate 21. Fig. 22h is a schematic view of processing the functional layer 22 on the support plate 21, and referring to fig. 22h, the transmission line 221 in the functional layer 22 may be connected to the blind holes 219 that are metallized and/or the portions that are metallized on the surface of the support plate 21.

Step b9, laminating a protective medium layer 8 on the surface of one side of the supporting plate 21, which is away from the functional layer 22. Fig. 22i is a schematic diagram of the support plate 21 after the protective dielectric layer 8 is pressed, and referring to fig. 22i, the support plate 21 can be protected by the protective dielectric layer 8, so that the service life is prolonged. Also, to facilitate electrical connection of the metallized via 218 to the electronic device 3, a window 81 may be provided in the protective dielectric layer 8 at a location corresponding to the metal via.

In addition, in the present embodiment, the supporting plate 21 shown in fig. 23 is formed by machining corresponding first through holes 215, second grooves 212 and a reticulate pattern 213 on the formed supporting plate 21. In other embodiments, the support plate 21 structure of fig. 23 may be grown on the substrate. Specifically, a metal seed layer may be sputtered on the substrate; then coating a photoresist on the metal seed layer, and exposing and developing; then the supporting plate 21 grows by electroplating; then removing the photoresist to form a first via 215 and a reticulate pattern 213; the second groove 212 is processed through an etching process; finally, the substrate may be removed to form the support plate 21 having the structure shown in fig. 23.

As a specific implementation manner, in step 21, while the reticulate pattern 213 is processed, the through groove 214 may also be processed on the supporting plate 21 in the same process, so that the bonding pad 222 in the transmission line layer leaks out at the through groove 214, thereby simplifying the process and improving the efficiency.

The above description is only of the preferred embodiments of the present application and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. An electronic device, comprising:

a screen module;

The screen module is fixedly adhered to the supporting plate, and the functional layer is arranged on at least one side of the supporting plate;

The electronic devices are partially connected or partially connected with the screen module through the functional layers;

A portion of the electronic device is connected to the support plate; a portion of the electronic device is disposed between the support plate and the functional layer; part of the electronic devices protrude out of the surface of the supporting plate, and the functional layers are coated on the outer surface of part of the electronic devices; the support plate is provided with a second recess in which a part of the electronic device is arranged.

2. The electronic device of claim 1, wherein a metallized via is provided on the support plate, one end of the metallized via is electrically connected to the functional layer, and the other end of the metallized via is electrically connected to the electronic component.

3. The electronic device according to claim 1 or 2, wherein a first groove is provided on the support plate, and the functional layer is provided in the first groove.

4. The electronic device of claim 3, wherein the thickness of the support plate is 120-150 μm, and the depth of the first groove is 30-60 μm.

5. The electronic device according to claim 1, wherein a plurality of the functional layers are provided in a direction perpendicular to a thickness direction of the electronic device with a space between adjacent two of the functional layers.

6. The electronic device of claim 1, wherein the support plate is provided with a flexible texture.

7. The electronic device of claim 5, wherein the support plate is provided with a flexible texture, and wherein the spaces are aligned with the texture in a thickness direction of the electronic device.

8. The electronic device of claim 5, wherein the support plate is provided with a flexible texture, and the functional layer is aligned with the texture in a thickness direction of the electronic device.

9. The electronic device according to claim 1, wherein the functional layers are provided on both sides of the support plate in a thickness direction of the electronic device.

10. The electronic device according to claim 1, wherein a transmission line and a pad are provided in the functional layer, the transmission line is connected to the pad, and the pad is at least partially leaked from a surface of the functional layer facing the support plate side;

the support plate is provided with a through groove aligned with the bonding pad in a thickness direction of the electronic device.

11. A method of manufacturing an electronic device according to any one of claims 1-10, the method comprising the steps of:

machining a second groove in the support plate;

Placing an electronic device in the second groove;

Carrying out metallization treatment on the blind hole to electrically connect the electric connection part of the electronic device with the metallized inner wall of the blind hole;

laminating or coating a first medium on a support plate;

At least one transmission line layer is arranged in the first medium;

The supporting plate and the screen module are adhered and fixed;

12. The method of manufacturing of claim 11, wherein prior to laminating or coating the first medium on the support plate, the method further comprises:

processing a first via hole on the supporting plate;

laminating or coating a second medium at the first via hole;

processing a second via hole on the medium in the first via hole;

And carrying out metallization treatment on the second via hole.

13. The manufacturing method according to claim 11 or 12, characterized in that said pressing or coating the first medium on the support plate comprises in particular:

machining a first groove in the support plate;

and pressing or coating a first medium in the first groove.

14. The method of manufacturing according to claim 11, wherein after disposing at least one transmission line layer in the first medium, the method further comprises:

and machining a reticulate pattern structure on the supporting plate.

15. The method of manufacturing according to claim 12, wherein in the step of processing the first via hole in the support plate, the method further comprises:

machining a reticulate pattern structure on the supporting plate;

and carrying out mask treatment on the reticulate pattern structure.

16. The method of manufacturing according to claim 11, wherein after disposing at least one transmission line layer in the first medium, the method further comprises:

17. The method of claim 12, wherein the first medium is polyimide or parylene benzodioxazole.