CN117077609A - 一种改进的集成无源器件(ipd)仿真建模方法 - Google Patents
一种改进的集成无源器件(ipd)仿真建模方法 Download PDFInfo
- Publication number
- CN117077609A CN117077609A CN202311113530.2A CN202311113530A CN117077609A CN 117077609 A CN117077609 A CN 117077609A CN 202311113530 A CN202311113530 A CN 202311113530A CN 117077609 A CN117077609 A CN 117077609A
- Authority
- CN
- China
- Prior art keywords
- passive device
- integrated passive
- simulation
- ipd
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 87
- 238000005094 computer simulation Methods 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 30
- 238000004364 calculation method Methods 0.000 claims abstract description 19
- 238000005516 engineering process Methods 0.000 claims abstract description 17
- 238000005530 etching Methods 0.000 claims abstract description 11
- 230000009467 reduction Effects 0.000 claims abstract description 7
- 230000004044 response Effects 0.000 claims abstract description 7
- 239000007787 solid Substances 0.000 claims abstract description 5
- 238000004088 simulation Methods 0.000 claims description 31
- 238000010586 diagram Methods 0.000 claims description 12
- 238000003475 lamination Methods 0.000 claims description 12
- 238000004140 cleaning Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 230000005284 excitation Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 230000008569 process Effects 0.000 description 13
- 230000006872 improvement Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000004422 calculation algorithm Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005288 electromagnetic effect Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
- G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Architecture (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202311113530.2A CN117077609A (zh) | 2023-08-31 | 2023-08-31 | 一种改进的集成无源器件(ipd)仿真建模方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202311113530.2A CN117077609A (zh) | 2023-08-31 | 2023-08-31 | 一种改进的集成无源器件(ipd)仿真建模方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN117077609A true CN117077609A (zh) | 2023-11-17 |
Family
ID=88716946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202311113530.2A Pending CN117077609A (zh) | 2023-08-31 | 2023-08-31 | 一种改进的集成无源器件(ipd)仿真建模方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN117077609A (zh) |
-
2023
- 2023-08-31 CN CN202311113530.2A patent/CN117077609A/zh active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8355258B2 (en) | Support method and apparatus for printed circuit board | |
US7350175B2 (en) | Circuit board design system, design data analysis method and recording medium with analysis program recorded thereon | |
TWI497329B (zh) | 模型化系統、電腦模型化方法以及非暫時性電腦可讀儲存媒體 | |
KR20060088005A (ko) | 유한 요소법을 이용한 구조 분석 방법 | |
CN111931457B (zh) | 基于混合阶有限元的多层集成电路电磁场计算方法及装置 | |
CN111737943A (zh) | 一种基于等效电路模型的集成电路ibis模型提取方法及系统 | |
US10083266B2 (en) | Simulation method of CMP process | |
CN111931458B (zh) | 基于混合阶有限元的三维集成电路电磁场计算方法及装置 | |
US7788076B2 (en) | Interference analysis method, interference analysis device, interference analysis program and recording medium with interference analysis program recorded thereon | |
CN100535672C (zh) | 内藏电容组件的测试方法及其测试系统 | |
US20170017744A1 (en) | Modeling of Power Distribution Networks for Path Finding | |
US6031986A (en) | Thin-film passive circuit simulation on basis of reduced equivalent circuits | |
KR101495986B1 (ko) | 더블 패터닝 기술을 위한 rc 코너해 | |
US8185864B2 (en) | Circuit board analyzer and analysis method | |
JP2006293726A (ja) | 電子部品の設計方法 | |
US20090249264A1 (en) | Analyzing device for circuit device, circuit device analyzing method, analyzing program, and electronic medium | |
CN117077609A (zh) | 一种改进的集成无源器件(ipd)仿真建模方法 | |
TWI397087B (zh) | Inductance / transformer and its making method | |
Kapur et al. | Modeling of integrated RF passive devices | |
CN106650014A (zh) | 一种微波集成lc滤波器模型的设计方法 | |
US7434190B2 (en) | Analysis method and analysis apparatus of designing transmission lines of an integrated circuit packaging board | |
De Paulis et al. | A methodical approach for PCB PDN decoupling minimizing overdesign with genetic algorithm optimization | |
EP1394702A1 (en) | High-frequency electronic component and its designing method | |
Dunn et al. | EMX: Overcoming silicon chip EM simulation challenges for passive circuit analysis and model development | |
CN114118004A (zh) | 定制化芯片的制造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20240204 Address after: Room 4-1, Building 12, No. 888 Tongxin Road, Zhuangshi Street, Zhenhai District, Ningbo City, Zhejiang Province, 315000 (9th floor) Applicant after: Tangshan Technology (Ningbo) Co.,Ltd. Country or region after: China Applicant after: XIAMEN University Address before: Room 4-1, Building 12, No. 888 Tongxin Road, Zhuangshi Street, Zhenhai District, Ningbo City, Zhejiang Province, 315000 (9th floor) Applicant before: Tangshan Technology (Ningbo) Co.,Ltd. Country or region before: China |