CN117075438A - Wafer laser direct writing machine - Google Patents

Abstract

The invention relates to a wafer laser direct writing machine which comprises a feeding module, a platform module and a processing module, wherein the feeding module is used for placing a wafer on the platform module, the platform module is used for adjusting and correcting the position and the angle of the wafer, and the processing module is used for carrying out laser direct writing on the wafer. The invention can realize continuous and stable feeding of the wafer, and improves the relative displacement precision, alignment precision and focusing precision in the laser direct writing process of the wafer, thereby improving the quality of the laser direct writing.

Description

Wafer laser direct writing machine

Technical Field

The invention relates to the field of wafer laser exposure, in particular to a wafer laser direct writing machine.

Background

The wafer direct writing machine is also called a wafer laser direct writing machine, and is a mechanical device for chip photoetching. When the conventional wafer photoetching machine performs wafer photoetching, photoresist is coated on the surface of a wafer, then a mask plate is manufactured, and then steps such as exposure, development, etching and the like are performed. Compared with the traditional wafer photoetching machine, the wafer direct-writing machine can omit the manufacturing process of the mask plate, and directly photoetches circuits, structural features and the like on the wafer. However, in the wafer direct writing machine in the prior art, the wafer material loading link is too single, and continuous and stable material feeding cannot be realized; the bearing platform is too single, and only can bear a single effect of a wafer, so that the laser lens of the processing module needs to perform X, Y-axis displacement scanning on the processing module when the wafer is directly written, and a corresponding X, Y-axis moving module is needed, so that the dead weight of the processing module is increased, and further the displacement precision of the laser lens is reduced, and the direct writing quality is reduced; meanwhile, the self weight of the processing module is large, so that the displacement precision of the laser lens on the Z axis is reduced, the quality precision of laser direct writing is greatly dependent on whether the focus of the laser lens is accurately focused on the thickness center of the wafer, namely, the displacement precision of the Z axis determines the focus position precision of the laser lens, and the displacement precision of the Z axis is reduced due to the large self weight of the laser processing module, so that the quality precision of laser direct writing is also reduced; in addition, since the carrying platform only has a single carrying function, the position of the wafer placed on the carrying platform needs to be accurate, namely the processing base point of the wafer needs to be overlapped with the processing base point of the laser lens, so that the wafer placing process becomes complicated and the phenomenon that the processing base point is not overlapped easily occurs, thereby also causing the reduction of the direct writing quality; in the processing process, the laser generator is directly used for processing the wafer, so that the stability and controllability of the processing process are reduced.

In view of the above, the invention provides a wafer laser direct-writing machine, which is provided with a feeding unit, a discharging unit, a feeding unit and other components to realize the purpose of continuously and stably feeding wafer laser direct-writing, and an X-axis unit and a Y-axis unit are arranged to enable a correction platform to have the function of X, Y axis displacement, so that the technical problems of low displacement precision and low direct-writing precision caused by the increase of dead weight of a processing module due to the fact that a carrying platform has no X, Y axis displacement function in the prior art are solved, an R-axis unit is arranged to enable the correction platform to have the function of horizontally rotating, so that the difficulty of aligning a wafer processing base point is reduced, and a Z-axis unit, a direct-writing unit and other components are arranged to enhance the control of the stability of the direct-writing unit and the control of the displacement precision of the direct-writing unit while the purpose of laser direct-writing is realized, and the alignment precision and the focusing precision of the direct-writing unit are improved by utilizing the cooperation of a positioning camera module and the Z-axis unit.

Disclosure of Invention

The invention aims to provide a wafer laser direct writing machine, which solves the defects in the prior art, and the technical problems to be solved by the invention are realized by the following technical scheme.

In a wafer laser direct write machine, the improvement comprising: the device comprises a feeding module, a platform module and a processing module, wherein the feeding module is used for placing a wafer on the platform module, the platform module is used for adjusting and correcting the position and angle of the wafer, and the processing module is used for performing laser direct writing on the wafer.

Preferably, the feeding module comprises a feeding unit, a discharging unit and a feeding unit, the wafer is accommodated in a feeding bin of the feeding unit, a feeding lifting driver of the feeding unit drives the feeding bin to move up and down so as to enable the feeding bin to move to a preset height position, a discharging gripper of the discharging unit grips the wafer in the feeding bin and then enables the wafer to move to a preset position along a feeding guide rail of the feeding unit, and a feeding gripping module of the feeding unit grips the wafer and then conveys the wafer to the preset position and then waits for the next procedure.

Preferably, the platform module comprises a Y-axis unit, an X-axis unit and an R-axis unit, wherein the X-axis unit is slidably arranged on the Y-axis unit and is orthogonally arranged with the Y-axis unit, the R-axis unit is slidably arranged on the X-axis unit and is perpendicular to the X-axis unit, and a negative pressure bearing table for adsorbing wafers is arranged on the R-axis unit; after the wafer is placed on the negative pressure bearing table by the feeding module and is adsorbed and fixed by the negative pressure bearing table, the X-axis unit moves to a preset position along the length direction of the Y-axis unit, the R-axis unit moves to a preset position along the length direction of the X-axis unit, and the R-axis unit rotates to a preset position around the axis of the R-axis unit, and the processing module carries out laser direct writing on the wafer.

Preferably, the processing module comprises a Z-axis unit and a direct-writing unit, the direct-writing unit is slidably arranged on the Z-axis unit, a braking mechanism is arranged on a Z-axis driver of the Z-axis unit, and the Z-axis driver drives the direct-writing unit to slide up and down relative to the Z-axis unit and enables the direct-writing unit and the Z-axis unit to keep fixed relative positions under the action of the braking mechanism; the positioning camera module of the direct writing unit is used for determining the position of the direct writing unit relative to the wafer by scanning the wafer, the Z-axis driver is used for driving the direct writing unit to move to a preset position, and the direct writing unit is connected with the laser generator to perform laser direct writing on the wafer.

Compared with the prior art, the continuous and stable feeding of the wafer can be realized by utilizing the parts such as the feeding unit, the discharging unit, the feeding unit and the like and the mutual coordination of the parts, so that the continuous wafer laser direct writing is ensured; according to the invention, the X-axis unit and the Y-axis unit are arranged, so that the correction platform has the functions of X-axis displacement and Y-axis displacement, thereby reducing the dead weight of the processing module, and further improving the relative displacement precision between the wafer and the laser lens and the quality of wafer laser direct writing in the laser direct writing process; meanwhile, the correction platform has the function of horizontal rotation by arranging the R-axis unit, so that the difficulty of aligning the wafer processing base point is reduced; according to the invention, by arranging the components such as the Z-axis unit and the direct writing unit, the purpose of laser direct writing is realized, the control of the stability of the direct writing unit and the control of the displacement precision of the direct writing unit are enhanced, and meanwhile, the alignment precision and the focusing precision of the direct writing unit are improved by utilizing the matching of the positioning camera module and the Z-axis unit, so that the quality of laser direct writing is improved.

Drawings

FIG. 1 is a schematic diagram of the structure of the present invention;

FIG. 2 is a schematic diagram of a loading module according to the present invention;

FIG. 3 is a schematic view of a feeding unit according to the present invention;

FIG. 4 is a schematic diagram of a feed rail adjustment module according to the present invention;

FIG. 5 is a schematic view of the structure of the discharging unit in the present invention;

FIG. 6 is a schematic diagram of a feeding unit according to the present invention;

FIG. 7 is a schematic diagram of a feeding lifting module and a feeding grabbing module according to the present invention;

FIG. 8 is a schematic view of a platform module according to the present invention;

FIG. 9 is a schematic diagram of a Y-axis unit according to the present invention;

FIG. 10 is a schematic view of the structure of an X-axis unit according to the present invention;

FIG. 11 is a schematic view of the structure of an R-axis unit according to the present invention;

FIG. 12 is a schematic view of the construction of a processing module according to the present invention;

FIG. 13 is a schematic view of the structure of the Z-axis unit according to the present invention;

FIG. 14 is a schematic diagram of a write-through unit according to the present invention;

FIG. 15 is a schematic diagram of a positioning camera module according to the present invention;

the reference numerals in the drawings are in turn:

10. the feeding module, 11, the feeding unit, 111, the feeding lifting support frame, 112, the feeding lifting guide rail, 113, the feeding lifting driver, 114, the feeding support bracket, 115, the feeding bin, 116, the feeding guide rail, 117, the feeding guide rail support frame, 118, the feeding guide rail adjusting module, 1181, the feeding adjusting driver, 1182, the feeding adjusting driving wheel, 1183, the feeding adjusting driven wheel, 1184, the feeding adjusting driving belt, 1185, the feeding adjusting support plate, 1186, the feeding adjusting guide rail, 1187, the feeding adjusting sliding block, 1188, the feeding adjusting tooth block, 1189, the feeding guide rail mounting plate, 12, the discharging unit, 121, the discharging driver, 122, the discharging driving wheel, 123, the discharging driven wheel, 124, the discharging driving belt, 125, the discharging guide rail, 126, the discharging sliding block, 127, the discharging gripper mounting bracket, 128, the discharging gripper, 129, the discharging gripper driver, 13, the feeding unit, 131, feed drivers 132, feed driving wheels 133, feed driven wheels 134, feed driving belts 135, feed guide rails 136, feed sliders 137, feed lifting modules 1371, feed lifting mounting plates 1372, feed lifting drivers 1373, feed lifting sliding plates 138, feed grabbing modules 1381, feed grabbing mounting plates 1382, feed grabbing support plates 1383, feed grabbing transverse adjusting plates 1384, feed grabbing longitudinal adjusting plates 1385, feed grabbing suction cups 14, feed guide rail mounting plates 20, platform modules 21, Y-axis units 211, Y-axis slide rails 212, Y-axis slide blocks 213, Y-axis drivers 214, Y-axis driver movers 215, Y-axis grating rules 216, Y-axis readers 217, Y-axis dust covers 22, X-axis units 221, X-axis slide rails 222, X-axis slide blocks 223, X-axis drivers, 224. an X-axis driver mover, 225, an X-axis grating ruler, 226, an X-axis reader, 23, an R-axis unit, 231, an R-axis mounting plate, 232, an R-axis driver, 233, a negative pressure bearing table, 234, a negative pressure suction port, 235, a frame positioner, 30, a processing module, 31, a Z-axis unit, 311, a Z-axis slide rail, 312, a Z-axis slider, 313, a Z-axis driver, 314, a Z-axis driver mover, 315, a Z-axis mounting plate, 32, a write-through unit, 321, a write-through mounting plate, 322, a write-through mirror, 323, a write-through lens group, 324, a write-through mounting block, 325, a write-through laser interface, 326, a write-through grating ruler, 327, a write-through reader, 328, a write-through stopper, 329, a positioning camera module, 3291, a camera mounting plate, 3292, a camera fixing plate, 3293, a camera sliding plate, 3294, a camera adjusting plate, 3295, a camera fixing block, 3297, a camera adjusting screw, 3298, and a positioning camera.

Detailed Description

It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The application will be described in detail below with reference to the drawings in connection with embodiments.

Example 1:

referring to fig. 1 to 15, in a wafer laser direct writing machine, the improvement is that: the device comprises a feeding module 10, a platform module 20 and a processing module 30, wherein the feeding module 10 is used for placing a wafer on the platform module 20, the platform module 20 is used for adjusting and correcting the position and angle of the wafer, and the processing module 30 is used for performing laser direct writing on the wafer.

Further, referring to fig. 2 to 7, the loading module 10 includes a feeding unit 11, a discharging unit 12, and a feeding unit 13, the wafer is accommodated in a feeding bin 115 of the feeding unit 11, a feeding lifting driver 113 of the feeding unit 11 drives the feeding bin 115 to move up and down so as to enable the feeding bin 115 to move to a predetermined height position, a discharging handle 128 of the discharging unit 12 grabs the wafer in the feeding bin 115 and then moves the wafer to a predetermined position along a feeding guide rail 116 of the feeding unit 11, and a feeding grabbing module 138 of the feeding unit 13 grabs the wafer and then conveys the wafer to the predetermined position and waits for the next process.

In this embodiment, the feeding unit 11 is used for feeding wafers, wherein the feeding bin 115 can be replaced with different specifications so as to adapt to wafers with different sizes, and the feeding lifting driver 113 is used for driving the feeding bin 115 to move up and down to a predetermined height position so as to facilitate the grabbing of the subsequent discharging unit 12; the discharging unit 12 is configured to take out a wafer from the supply bin 115 and drive the wafer to move to a predetermined position along the supply rail 116 to wait for the gripping of the feeding unit 13, where the discharging grip 128 is configured to grip the wafer in the supply bin 115; the feeding unit 13 is configured to transfer the wafer to a predetermined position, and after the wafer is driven by the discharging unit 12 to be located at the predetermined position on the feeding rail 116, the feeding grabbing module 138 grabs the wafer and moves the wafer to the predetermined position to wait for the next process.

When the embodiment is specifically used, the feeding unit 11 performs feeding of the wafer, the feeding lifting driver 113 drives the feeding bin 115 to move to a predetermined height position, the discharging grip 128 of the discharging unit 12 grips the wafer in the feeding bin 115, then makes the wafer move along the feeding guide rail 116 and move to the predetermined position, the feeding gripping module 138 of the feeding unit 13 grips the wafer on the feeding guide rail 116, then transfers the wafer to the platform module 20, the platform module 20 grips the wafer and then corrects the wafer to a proper position, and the processing module 30 performs laser direct writing on the wafer.

Further, referring to fig. 5, the discharging unit 12 includes a discharging driver 121 and a discharging guide rail 125 disposed on the loading guide rail mounting plate 14, a discharging driving wheel 122 of the discharging driver 121 drives a discharging driven wheel 123 to rotate through a discharging driving belt 124, a discharging sliding block 126 is slidably disposed on the discharging guide rail 125, a discharging gripper mounting frame 127 is disposed on the discharging sliding block 126, the discharging gripper mounting frame 127 is fixedly connected with the discharging driving belt 124, the discharging gripper 128 is disposed on the discharging gripper mounting frame 127, and a discharging gripper driver 129 for driving the discharging gripper 128 to clamp and release is disposed on the discharging gripper mounting frame 127.

In this embodiment, the discharging driver 121 is utilized to drive the discharging gripper 128 to move along the discharging guide rail 125, so that the discharging gripper 128 can smoothly grasp the wafer located in the supply bin 115 and transfer the wafer to a predetermined position on the discharging guide rail 116, thereby preparing for the subsequent feeding unit 13 to grasp the wafer.

Compared with the prior art, the feeding device of the wafer direct writing machine provided by the embodiment can realize continuous and stable feeding of the wafer by utilizing the parts such as the feeding unit, the discharging unit, the feeding unit and the like and the mutual matching of the parts, thereby providing a guarantee for continuous wafer laser direct writing.

Example 2:

on the basis of embodiment 1, referring to fig. 3 and 4, the feeding unit 11 includes a feeding lifting support 111, a feeding lifting rail 112 is provided on the feeding lifting support 111, a feeding support bracket 114 is slidably provided on the feeding lifting rail 112, a stopping mechanism is provided on the feeding lifting driver 113, the feeding lifting driver 113 is provided on the feeding lifting support 111, the feeding support bracket 114 is driven by the feeding lifting driver 113 to move up and down, and the feeding bin 115 is provided on the feeding support bracket 114.

Further, the feeding guide rail 116 is disposed at a side of the feeding bin 115 and is disposed on the feeding guide rail supporting frame 117.

Further, the feeding rail supporting frame 117 is provided with a feeding rail adjusting module 118, the feeding rail 116 is disposed on the feeding rail adjusting module 118, and the feeding rail adjusting module 118 is used for adjusting the width of the feeding rail 116 to match the size of the wafer.

Further, the feeding guide rail adjusting module 118 includes feeding adjustment support board 1185, locates feeding adjustment driver 1181 and feeding adjustment guide rail 1186 on the feeding adjustment support board 1185, be equipped with stop mechanism on the feeding adjustment driver 1181, feeding adjustment action wheel 1182 of feeding adjustment driver 1181 drives feeding adjustment driven wheel 1183 through feeding adjustment drive belt 1184 and rotates, all be equipped with feeding adjustment tooth piece 1188 on feeding adjustment drive belt 1184's opposite side, feeding adjustment guide rail 1186 is last to slide and is equipped with feeding adjustment slider 1187, is used for the installation feeding guide rail mounting panel 1189 of feeding guide rail 116 with feeding adjustment slider 7 feeding adjustment tooth piece 1188 fixed connection.

In this embodiment, the material lifting support 111, the material lifting guide 112, and the material lifting driver 113 with the stopping mechanism are provided to ensure that the wafer in the material bin 115 can be smoothly gripped by the material gripping hand 128 of the material discharging unit 12. The feeding lifting driver 113 provided with the stopping mechanism drives the feeding bin 115 to move up and down, so that the wafers in the feeding bin 115 are always at a proper height position, namely, after the wafers in the feeding bin 115 are at the proper height position, the feeding lifting driver 113 stops, so that the wafers to be grabbed in the feeding bin 115 and the discharging grippers 128 of the discharging unit 12 are at the same horizontal height, and the grabbing of the wafers by the discharging grippers 128 is ensured; the feed lifting support 111 and the feed lifting guide rail 112 are necessary components for achieving the purpose.

In this embodiment, a material supply support bracket 114 for supporting the material supply bin 115 is provided, instead of directly sliding the material supply bin 115 on the material supply lifting rail 112, so as to adapt to different sizes of wafers, that is, to adapt to the material supply of different sizes of wafers by replacing the material supply bin 115 with different specifications.

In this embodiment, the supply rail adjusting module 118 is configured to cooperate with the replacement of the supply bin 115 with different specifications, that is, the size of the wafer to be supplied is changed after the replacement of the supply bin 115, and the width of the supply rail 116 can be adjusted by setting the supply rail adjusting module 118, so as to adapt to wafers with different sizes. The feeding adjustment driver 1181 drives the feeding adjustment driving belt 1184 to move, and the feeding adjustment toothed blocks 1188 disposed on opposite sides of the feeding adjustment driving belt 1184 move in opposite directions or in opposite directions, so as to drive the feeding guide rail mounting plate 1189 to move along the feeding adjustment guide rail 1186 in opposite directions or in opposite directions, and further drive the feeding guide rail 116 disposed on the feeding guide rail mounting plate 1189 to move in opposite directions or in opposite directions, so as to achieve the purpose of width adjustment of the feeding guide rail 116.

Example 3:

on the basis of embodiment 1 or 2, referring to fig. 6 and 7, the feeding unit 13 includes a feeding driver 131 and a feeding guide rail 135 that are disposed on the feeding guide rail mounting plate 14, a feeding driving wheel 132 of the feeding driver 131 drives a feeding driven wheel 133 to rotate through a feeding driving belt 134, a feeding sliding block 136 is slidably disposed on the feeding guide rail 135, and a feeding grabbing module 138 for grabbing a wafer is driven by the feeding driving belt 134 to move along the feeding guide rail 135 through the feeding sliding block 136.

In this embodiment, the feeding driver 131 drives the feeding grabbing module 138 to move along the discharging guide rail 135, so that the feeding grabbing module 138 grabs and transfers the wafer on the feeding guide rail 116 onto the platform module 20 smoothly.

Further, the feeding unit 13 further includes a feeding lifting module 137, the feeding lifting module 137 is fixedly connected with the feeding slider 136 and the feeding driving belt 134, and the feeding grabbing module 138 is disposed on the feeding lifting module 137.

Further, the feeding lifting module 137 includes a feeding lifting mounting plate 1371 fixedly connected with the feeding driving belt 134 and the feeding sliding block 136, a feeding lifting driver 1372 disposed on the feeding lifting mounting plate 1371, and a feeding lifting sliding plate 1373 pushed by the feeding lifting driver 1372 and capable of sliding up and down relative to the feeding lifting driver 1372, and the feeding grabbing module 138 is disposed on the feeding lifting sliding plate 1373.

In this embodiment, the feeding lifting module 137 is disposed to ensure that the feeding grabbing module 138 grabs and transfers the wafer onto the platform module 20 smoothly. That is, first, the feeding lifting module 137 drives the feeding grabbing module 138 to lift, which is the initial state of the feeding lifting module 137 and the feeding grabbing module 138, and the feeding driver 131 drives the feeding grabbing module 138 to move above the wafer located on the feeding guide rail 116; secondly, the feeding lifting module 137 drives the feeding grabbing module 138 to descend, and after the feeding grabbing module 138 grabs the wafer, the feeding lifting module 137 drives the feeding grabbing module 138 to ascend, and the feeding driver 131 drives the feeding grabbing module 138 to move above the platform module 20; thirdly, the feeding lifting module 137 drives the feeding grabbing module 138 to descend, and the feeding grabbing module 138 loosens the wafer so that the wafer is placed on the platform module 20; finally, the stage module 20 clamps the wafer and then corrects the wafer to a proper position, and the processing module 30 performs laser direct writing on the wafer.

Further, the feeding grabbing module 138 includes a feeding grabbing mounting plate 1381 disposed on the feeding lifting sliding plate 1373, a feeding grabbing support plate 1382 disposed on the feeding grabbing mounting plate 1381, a feeding grabbing transverse adjusting plate 1383 disposed on the feeding grabbing support plate 1382, a feeding grabbing longitudinal adjusting plate 1384 disposed on the feeding grabbing transverse adjusting plate 1383, and a feeding grabbing suction cup 1385 disposed on the feeding grabbing longitudinal adjusting plate 1384 for grabbing wafers.

In this embodiment, the arrangement of the feeding grabbing transverse adjusting plate 1383 and the feeding grabbing longitudinal adjusting plate 1384 can grab wafers of different sizes.

Further, the feeding grabbing transverse adjusting plate 1383 and the feeding grabbing longitudinal adjusting plate 1384 are provided with a plurality of adjusting holes for adjusting the positions of the feeding grabbing longitudinal adjusting plate 1384 and the feeding grabbing sucker 1385 relative to the feeding grabbing transverse adjusting plate 1383 and the feeding grabbing longitudinal adjusting plate 1384, so that wafers with different sizes can be grabbed.

Example 4:

on the basis of any one of the foregoing embodiments, referring to fig. 8 to 11, the stage module 20 includes a Y-axis unit 21, an X-axis unit 22, and an R-axis unit 23, where the X-axis unit 22 is slidably disposed on the Y-axis unit 21 and is disposed orthogonal to the Y-axis unit 21, the R-axis unit 23 is slidably disposed on the X-axis unit 22 and is perpendicular to the X-axis unit 22, and a negative pressure carrier 233 for adsorbing a wafer is disposed on the R-axis unit 23; after the wafer is placed on the negative pressure bearing table 233 by the feeding module 10 and is adsorbed and fixed by the negative pressure bearing table 233, the X-axis unit 22 moves to a predetermined position along the length direction of the Y-axis unit 21, the R-axis unit 23 moves to a predetermined position along the length direction of the X-axis unit 22, and the R-axis unit 23 rotates to a predetermined position around the axis thereof, and the processing module 30 performs laser direct writing on the wafer.

In the present embodiment, during the wafer laser direct writing operation, the Y-axis unit 21 provides displacement in the Y-axis direction, the X-axis unit 22 provides displacement in the X-axis direction, and the R-axis unit 23 provides rotation in the axis direction. When the embodiment is specifically used, firstly, the wafer is placed on the negative pressure bearing table 233 by the feeding module 10, and negative pressure is formed on the surface of the negative pressure bearing table 233 so as to fix the wafer; then, the X-axis unit 22 moves to a predetermined position along the length direction of the Y-axis unit 21, the R-axis unit 23 moves to a predetermined position along the length direction of the X-axis unit 22, the R-axis unit 23 rotates to a predetermined position around the axis thereof, and the movement of the X-axis unit 22, the Y-axis unit 21, and the R-axis unit 23 may be performed stepwise or simultaneously; finally, the processing module 30 performs laser direct writing on the wafer.

Compared with the prior art, the correction platform has the functions of X-axis displacement and Y-axis displacement by arranging the X-axis unit 22 and the Y-axis unit 21, so that the dead weight of the processing module is reduced, and the relative displacement precision between the wafer and the laser lens and the quality of wafer laser direct writing in the laser direct writing process are improved; meanwhile, the correction platform has the function of horizontal rotation by arranging the R-axis unit, so that the difficulty of aligning the wafer processing base point is reduced.

Further, referring to fig. 11, the R-axis unit 23 includes an R-axis driver 232, the negative pressure bearing table 233 is disposed on the R-axis driver 232, and the R-axis driver 232 is configured to drive the negative pressure bearing table 233 to rotate.

Further, a frame positioner 235 for positioning and limiting the wafer is disposed on the periphery of the negative pressure bearing table 233. In this embodiment, the frame positioner 235 can prevent the wafer from being shifted relative to the negative pressure stage 233 during the laser direct writing of the wafer.

Further, a negative pressure suction port 234 is provided on the periphery of the negative pressure bearing table 233, and the negative pressure suction port 234 is used for being connected with an external suction device so as to form a negative pressure on the surface of the negative pressure bearing table 233.

Further, the R-axis unit 23 further includes an R-axis mounting plate 231, the R-axis driver 232 is disposed on the R-axis mounting plate 231, and the R-axis mounting plate 231 is slidably disposed on the X-axis unit 22.

Example 5:

on the basis of any of the foregoing embodiments, referring to fig. 9, the Y-axis unit 21 includes a Y-axis sliding rail 211 and a Y-axis driver 213, a Y-axis slider 212 is slidably disposed on the Y-axis sliding rail 211, a Y-axis driver mover 214 of the Y-axis driver 213 is fixedly connected with the Y-axis slider 212 and drives the Y-axis slider 212 to move along the Y-axis sliding rail 211, and the X-axis unit 22 is fixedly disposed on the Y-axis slider 212.

In this embodiment, the Y-axis slider 212 is driven by the Y-axis driver mover 214, and the X-axis unit 22 moves along the length direction of the Y-axis unit 21 under the driving of the Y-axis slider 212.

Further, the Y-axis driver 213 is a linear motor. The displacement accuracy of the linear motor is high, and the displacement error can be reduced by adopting the linear motor as the Y-axis driver 213.

Further, the Y-axis unit 21 further includes a Y-axis grating ruler 215 and a Y-axis reader 216 that is matched with the Y-axis grating ruler 215, and the Y-axis reader 216 is disposed on the X-axis unit 22 and moves relative to the Y-axis grating ruler 215.

In this embodiment, the moving distance and position of the Y-axis actuator mover 214 can be accurately measured and positioned by setting the Y-axis grating ruler 215 and the Y-axis reader 216, and when the moving distance and position of the Y-axis actuator mover 214 do not conform to the preset values, the moving distance and position are corrected and compensated by the feedback of the Y-axis grating ruler 215 and the Y-axis reader 216.

Further, the Y-axis unit 21 further includes a Y-axis dust cover 217, and the Y-axis dust cover 217 expands or contracts with the movement of the X-axis unit 22 relative to the Y-axis unit 21.

The present embodiment seals the Y-axis unit 21 by providing the Y-axis dust cap 217, thereby extending the service life and maintenance period of the Y-axis unit 21.

Further, referring to fig. 10, the X-axis unit 22 includes an X-axis sliding rail 221 and an X-axis driver 223, an X-axis sliding block 222 is slidably disposed on the X-axis sliding rail 221, an X-axis driver mover 224 of the X-axis driver 223 is fixedly connected with the X-axis sliding block 222 and drives the X-axis sliding block 222 to move along the X-axis sliding rail 221, and the R-axis unit 23 is fixedly disposed on the X-axis sliding block 222.

In this embodiment, the X-axis slider 222 is driven by the X-axis driver mover 224, and the R-axis unit 23 is driven by the X-axis slider 222 to move along the length direction of the X-axis unit 22.

Further, the X-axis driver 223 is a linear motor. The displacement accuracy of the linear motor is high, and the displacement error can be reduced by adopting the linear motor as the X-axis driver 223.

Further, the X-axis unit 22 further includes an X-axis grating ruler 225, and an X-axis reader 226 associated with the X-axis grating ruler 225, wherein the X-axis reader 226 is disposed on the R-axis unit 23 and moves relative to the X-axis grating ruler 225.

In this embodiment, the moving distance and position of the X-axis actuator mover 224 can be accurately measured and positioned by setting the X-axis grating ruler 225 and the X-axis reader 226, and when the moving distance and position of the X-axis actuator mover 224 do not conform to the preset values, the moving distance and position are corrected and compensated by the feedback of the X-axis grating ruler 225 and the X-axis reader 226.

Example 6:

on the basis of any one of the foregoing embodiments, referring to fig. 12 to 15, the processing module 30 includes a Z-axis unit 31 and a write-through unit 32, the write-through unit 32 is slidably disposed on the Z-axis unit 31, a braking mechanism is disposed on a Z-axis driver 313 of the Z-axis unit 31, and the Z-axis driver 313 drives the write-through unit 32 to slide up and down relative to the Z-axis unit 31 and keeps the write-through unit 32 and the Z-axis unit 31 fixed in relative position under the action of the braking mechanism; the positioning camera module 329 of the write-through unit 32 scans the wafer to determine the position of the write-through unit 32 relative to the wafer, the Z-axis driver 313 drives the write-through unit 32 to move to a predetermined position, and the write-through unit 32 is connected to a laser generator to perform laser write-through on the wafer.

In this embodiment, the positioning camera module 329 scans a wafer to determine a position of the direct writing unit 32 relative to the wafer, and the Z-axis unit 31 is configured to drive the direct writing unit 32 to move so that a laser focal point of the direct writing unit 32 is located at a thickness center of the wafer as much as possible, the direct writing unit 32 is connected to a laser generator, and laser generated by the laser generator performs laser direct writing on the wafer after passing through the direct writing mirror 322 and the direct writing lens group 323 of the direct writing unit 32. When the embodiment specifically works, the loading module 10 places the wafer on the platform module 20, the platform module 20 corrects the position and angle of the wafer, and the processing module 30 performs laser direct writing on the wafer.

Compared with the prior art, the laser direct writing device has the advantages that by means of the Z-axis unit, the direct writing unit and other components, the laser direct writing purpose is achieved, meanwhile, the stability of the direct writing unit and the displacement precision of the direct writing unit are controlled, meanwhile, the alignment precision and the focusing precision of the direct writing unit are improved by means of the cooperation of the positioning camera module and the Z-axis unit, and therefore the quality of laser direct writing is improved.

Further, referring to fig. 13, the Z-axis unit 31 includes a Z-axis mounting plate 315, a Z-axis sliding rail 311 disposed on the Z-axis mounting plate 315, and a Z-axis sliding block 312 slidably disposed on the Z-axis sliding rail 311, the Z-axis driver 313 is disposed on the Z-axis mounting plate 315, a Z-axis driver rotor 314 of the Z-axis driver 313 and the Z-axis sliding block 312 are fixedly connected with the write-through unit 32, and the write-through unit 32 is driven by the Z-axis driver rotor 314 to move along the Z-axis sliding rail 311 through the Z-axis sliding block 312.

In this embodiment, the Z-axis actuator mover 314 drives the write-through unit 32 to move, and the write-through unit 32 moves along the Z-axis sliding rail 311 through the Z-axis slider 312. The motion stability and the motion precision of the direct writing unit 32 are improved through the Z-axis unit 31; the write through unit 32 can be fixed at a certain height position by the brake mechanism of the Z-axis driver 313, thereby securing the stationary stability of the write through unit 32.

Example 7:

on the basis of any of the foregoing embodiments, referring to fig. 14, the write-through unit 32 includes a write-through mounting plate 321 slidably disposed on the Z-axis unit 31, a write-through module disposed on the write-through mounting plate 321, the positioning camera module 329 is disposed on the write-through mounting plate 321, and a write-through laser interface 325 of the write-through module is connected to a laser generator.

In this embodiment, the purpose of sliding the direct-writing module and the positioning camera module 329 on the Z-axis unit 31 is achieved by the direct-writing mounting plate 321.

Further, the write-through module includes a write-through mounting block 324 disposed on the write-through mounting plate 321, a write-through lens group 323 disposed on the write-through mounting block 324, and a write-through mirror 322 connected to the write-through lens group 323, where the write-through laser interface 325 is connected to the write-through mirror 322.

Further, the direct-write lens group 323 includes a plurality of aspherical lenses coaxially arranged; still further, the number of the aspherical lenses is 18 to 25.

In this embodiment, the direct writing lens group 323 can expand and contract the laser beam, so as to obtain ideal spot diameter, focal length, focal depth, and the like.

Further, the write-through unit 32 further includes a write-through grating ruler 326 and a write-through reader 327 cooperating with the write-through grating ruler 326, where the write-through grating ruler 326 and the write-through reader 327 are used to measure and correct the displacement of the write-through unit 32.

In this embodiment, the movement distance and position of the Z-axis actuator mover 314 can be accurately measured and positioned by setting the write-through grating ruler 326 and the write-through reader 327, and when the movement distance and position of the Z-axis actuator mover 314 do not conform to the preset values, the movement distance and position are corrected and compensated by the feedback of the write-through grating ruler 326 and the write-through reader 327.

Further, the write-through unit 32 further includes a write-through limiter 328, and the write-through limiter 328 is configured to limit a displacement stroke of the write-through unit 32.

Further, referring to fig. 15, the positioning camera module 329 includes a camera mounting plate 3291 provided on the direct-writing mounting plate 321, a camera adjusting plate 3294 slidably provided on the camera mounting plate 3291, and a camera mounting block 3295 provided on the camera adjusting plate 3294, wherein a positioning camera 3298 is provided on the camera mounting block 3295.

Further, a camera fixing plate 3292 is provided on the camera mounting plate 3291, a camera sliding plate 3293 is provided on the camera fixing plate 3292 in a sliding manner, a camera adjusting screw 3297 for pushing the camera sliding plate 3293 so that the camera sliding plate 3293 slides relative to the camera fixing plate 3292 is provided on the camera mounting plate 3291, and the camera adjusting plate 3294 is fixedly connected with the camera sliding plate 3293.

Further, a camera fixing block 3296 is fixedly arranged on one side of the camera adjusting plate 3294, an elongated hole is formed in the camera fixing block 3296, and the camera fixing block 3296 is used for fixing the position of the camera adjusting plate 3294 relative to the camera mounting plate 3291 through the elongated hole and a bolt.

In this embodiment, the height of the positioning camera 3298 with respect to the wafer can be adjusted by providing a camera fixing plate 3292, a camera sliding plate 3293, a camera adjusting plate 3294, a camera fixing block 3296, a camera adjusting screw 3297, and the like.

It should be noted that the foregoing detailed description is exemplary and is intended to provide further explanation of the application. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular is intended to include the plural unless the context clearly indicates otherwise. Furthermore, it will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, steps, operations, devices, components, and/or groups thereof.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or otherwise described herein.

Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those elements but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways, such as rotated 90 degrees or at other orientations, and the spatially relative descriptors used herein interpreted accordingly.

In the above detailed description, reference is made to the accompanying drawings, which form a part hereof. In the drawings, like numerals typically identify like components unless context indicates otherwise. The illustrated embodiments described in the detailed description, drawings, and claims are not meant to be limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented herein.

The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. The utility model provides a wafer laser write through machine which characterized in that: the device comprises a feeding module (10), a platform module (20) and a processing module (30), wherein the feeding module (10) is used for placing a wafer on the platform module (20), the platform module (20) is used for adjusting and correcting the position and the angle of the wafer, and the processing module (30) is used for performing laser direct writing on the wafer.

2. A wafer laser direct write machine according to claim 1, characterized in that: the feeding module (10) comprises a feeding unit (11), a discharging unit (12) and a feeding unit (13), wherein the wafer is accommodated in a feeding bin (115) of the feeding unit (11), a feeding lifting driver (113) of the feeding unit (11) drives the feeding bin (115) to move up and down so that the feeding bin (115) moves to a preset height position, a discharging gripper (128) of the discharging unit (12) grips the wafer in the feeding bin (115) and then moves the wafer to a preset position along a feeding guide rail (116) of the feeding unit (11), and a feeding gripping module (138) of the feeding unit (13) conveys the wafer to the preset position and then waits for the next procedure.

3. A wafer laser direct write machine according to claim 2, characterized in that: the feeding unit (11) comprises a feeding lifting support frame (111), a feeding lifting guide rail (112) is arranged on the feeding lifting support frame (111), a feeding support bracket (114) is arranged on the feeding lifting guide rail (112) in a sliding mode, a braking mechanism is arranged on the feeding lifting driver (113), the feeding lifting driver (113) is arranged on the feeding lifting support frame (111), the feeding support bracket (114) is driven by the feeding lifting driver (113) to move up and down, and the feeding bin (115) is arranged on the feeding support bracket (114).

4. A wafer laser direct write machine according to claim 2, characterized in that: the feed guide rail (116) is arranged at the side of the feed bin (115) and is arranged on the feed guide rail supporting frame (117).

5. The wafer laser direct write machine of claim 4, wherein: the wafer feeder is characterized in that a feeding guide rail adjusting module (118) is arranged on the feeding guide rail supporting frame (117), the feeding guide rail (116) is arranged on the feeding guide rail adjusting module (118), and the feeding guide rail adjusting module (118) is used for adjusting the width of the feeding guide rail (116) to be matched with the size of the wafer.

6. The wafer laser direct write machine of claim 5, wherein: the utility model provides a feeding guide rail adjustment module (118) is including feeding regulation spandrel plate (1185), locate feeding regulation driver (1181) and feeding regulation guide rail (1186) on feeding regulation spandrel plate (1185), be equipped with stop mechanism on feeding regulation driver (1181), feeding regulation action wheel (1182) of feeding regulation driver (1181) drives feeding regulation driven wheel (1183) through feeding regulation drive belt (1184) and rotates, all be equipped with feeding regulation tooth piece (1188) on the opposite side of feeding regulation drive belt (1184), the last slip of feeding regulation guide rail (1186) is equipped with feeding regulation slider (1187) for the installation feeding guide rail mounting panel (1189) of feeding guide rail (116) with feeding regulation slider (1187) feeding regulation tooth piece (1188) fixed connection.

7. A wafer laser direct write machine according to claim 2, characterized in that: the utility model discloses a feeding device, including feeding guide mounting panel (14), discharging unit (12) are including locating ejection of compact driver (121) and ejection of compact guide (125) on feeding guide mounting panel (14), ejection of compact action wheel (122) of ejection of compact driver (121) drive ejection of compact from driving wheel (123) rotation through ejection of compact drive belt (124), it is equipped with ejection of compact slider (126) to slide on ejection of compact guide (125), be equipped with ejection of compact tongs mounting bracket (127) on ejection of compact slider (126), ejection of compact tongs mounting bracket (127) with ejection of compact drive belt (124) fixed connection, ejection of compact tongs (128) are located on ejection of compact tongs mounting bracket (127), be equipped with on ejection of compact tongs mounting bracket (127) are used for the drive ejection of compact tongs driver (129) that ejection of compact tongs (128) clamp and loosen.

8. A wafer laser direct write machine according to claim 2, characterized in that: the feeding unit (13) comprises a feeding driver (131) and a feeding guide rail (135) which are arranged on a feeding guide rail mounting plate (14), a feeding driving wheel (132) of the feeding driver (131) drives a feeding driven wheel (133) to rotate through a feeding transmission belt (134), a feeding sliding block (136) is arranged on the feeding guide rail (135) in a sliding mode, and a feeding grabbing module (138) for grabbing a wafer moves along the feeding guide rail (135) through the feeding sliding block (136) under the driving of the feeding transmission belt (134).

9. The wafer laser direct write machine of claim 8, wherein: the feeding unit (13) further comprises a feeding lifting module (137), the feeding lifting module (137) is fixedly connected with the feeding sliding block (136) and the feeding transmission belt (134), and the feeding grabbing module (138) is arranged on the feeding lifting module (137).

10. The wafer laser direct write machine of claim 9, wherein: the feeding lifting module (137) comprises a feeding lifting mounting plate (1371) fixedly connected with the feeding transmission belt (134) and the feeding sliding block (136), a feeding lifting driver (1372) arranged on the feeding lifting mounting plate (1371), and a feeding lifting sliding plate (1373) pushed by the feeding lifting driver (1372) and capable of sliding up and down relative to the feeding lifting driver (1372), wherein the feeding grabbing module (138) is arranged on the feeding lifting sliding plate (1373);

preferably, the feeding grabbing module (138) comprises a feeding grabbing mounting plate (1381) arranged on the feeding lifting sliding plate (1373), a feeding grabbing supporting plate (1382) arranged on the feeding grabbing mounting plate (1381), a feeding grabbing transverse adjusting plate (1383) arranged on the feeding grabbing supporting plate (1382), and a feeding grabbing longitudinal adjusting plate (1384) arranged on the feeding grabbing transverse adjusting plate (1383), wherein a feeding grabbing sucker (1385) for grabbing a wafer is arranged on the feeding grabbing longitudinal adjusting plate (1384);

Preferably, the platform module (20) comprises a Y-axis unit (21), an X-axis unit (22) and an R-axis unit (23), wherein the X-axis unit (22) is slidably arranged on the Y-axis unit (21) and is orthogonally arranged with the Y-axis unit (21), the R-axis unit (23) is slidably arranged on the X-axis unit (22) and is perpendicular to the X-axis unit (22), and a negative pressure bearing table (233) for adsorbing a wafer is arranged on the R-axis unit (23); after a wafer is placed on the negative pressure bearing table (233) by the feeding module (10) and is adsorbed and fixed by the negative pressure bearing table (233), the X-axis unit (22) moves to a preset position along the length direction of the Y-axis unit (21), the R-axis unit (23) moves to a preset position along the length direction of the X-axis unit (22), and the R-axis unit (23) rotates to a preset position around the axis of the R-axis unit, and then the processing module (30) carries out laser direct writing on the wafer;

preferably, the Y-axis unit (21) comprises a Y-axis sliding rail (211) and a Y-axis driver (213), a Y-axis sliding block (212) is slidably arranged on the Y-axis sliding rail (211), a Y-axis driver rotor (214) of the Y-axis driver (213) is fixedly connected with the Y-axis sliding block (212) and drives the Y-axis sliding block (212) to move along the Y-axis sliding rail (211), and the X-axis unit (22) is fixedly arranged on the Y-axis sliding block (212);

Preferably, the Y-axis unit (21) further comprises a Y-axis grating ruler (215) and a Y-axis reader (216) matched with the Y-axis grating ruler (215), wherein the Y-axis reader (216) is arranged on the X-axis unit (22) and moves relative to the Y-axis grating ruler (215);

preferably, the Y-axis unit (21) further comprises a Y-axis dust cover (217), the Y-axis dust cover (217) extending or retracting with movement of the X-axis unit (22) relative to the Y-axis unit (21);

preferably, the X-axis unit (22) comprises an X-axis sliding rail (221) and an X-axis driver (223), an X-axis sliding block (222) is slidably arranged on the X-axis sliding rail (221), an X-axis driver rotor (224) of the X-axis driver (223) is fixedly connected with the X-axis sliding block (222) and drives the X-axis sliding block (222) to move along the X-axis sliding rail (221), and the R-axis unit (23) is fixedly arranged on the X-axis sliding block (222);

preferably, the X-axis unit (22) further comprises an X-axis grating ruler (225) and an X-axis reader (226) matched with the X-axis grating ruler (225), wherein the X-axis reader (226) is arranged on the R-axis unit (23) and moves relative to the X-axis grating ruler (225);

preferably, the R-axis unit (23) includes an R-axis driver (232), the negative pressure bearing table (233) is disposed on the R-axis driver (232), and the R-axis driver (232) is used for driving the negative pressure bearing table (233) to rotate;

Preferably, a frame positioner (235) for positioning and limiting the wafer is arranged on the periphery of the negative pressure bearing table (233);

preferably, a negative pressure air suction port (234) is arranged on the periphery of the negative pressure bearing table (233), and the negative pressure air suction port (234) is used for being connected with an external air suction device so as to enable the surface of the negative pressure bearing table (233) to form negative pressure;

preferably, the R-axis unit (23) further comprises an R-axis mounting plate (231), the R-axis driver (232) is disposed on the R-axis mounting plate (231), and the R-axis mounting plate (231) is slidably disposed on the X-axis unit (22);

preferably, the processing module (30) comprises a Z-axis unit (31) and a direct-writing unit (32), the direct-writing unit (32) is slidably arranged on the Z-axis unit (31), a Z-axis driver (313) of the Z-axis unit (31) is provided with a braking mechanism, and the Z-axis driver (313) drives the direct-writing unit (32) to slide up and down relative to the Z-axis unit (31) and enables the direct-writing unit (32) to keep fixed relative positions with the Z-axis unit (31) under the action of the braking mechanism; the positioning camera module (329) of the direct writing unit (32) is used for determining the position of the direct writing unit (32) relative to the wafer by scanning the wafer, the Z-axis driver (313) is used for driving the direct writing unit (32) to move to a preset position, and the direct writing unit (32) is connected with the laser generator to perform laser direct writing on the wafer;

Preferably, the Z-axis unit (31) comprises a Z-axis mounting plate (315), a Z-axis sliding rail (311) arranged on the Z-axis mounting plate (315), and a Z-axis sliding block (312) slidably arranged on the Z-axis sliding rail (311), the Z-axis driver (313) is arranged on the Z-axis mounting plate (315), a Z-axis driver rotor (314) of the Z-axis driver (313) and the Z-axis sliding block (312) are fixedly connected with the write-through unit (32), and the write-through unit (32) moves along the Z-axis sliding rail (311) through the Z-axis sliding block (312) under the driving of the Z-axis driver rotor (314);

preferably, the direct writing unit (32) comprises a direct writing mounting plate (321) arranged on the Z-axis unit (31) in a sliding manner, and a direct writing module arranged on the direct writing mounting plate (321), the positioning camera module (329) is arranged on the direct writing mounting plate (321), and a direct writing laser interface (325) of the direct writing module is connected with a laser generator;

preferably, the direct-writing module comprises a direct-writing mounting block (324) arranged on the direct-writing mounting plate (321), a direct-writing lens group (323) arranged on the direct-writing mounting block (324), and a direct-writing reflecting mirror (322) connected with the direct-writing lens group (323), wherein the direct-writing laser interface (325) is connected with the direct-writing reflecting mirror (322);

Preferably, the direct-writing lens group (323) includes a plurality of aspherical lenses coaxially arranged;

preferably, the write-through unit (32) further comprises a write-through grating ruler (326) and a write-through reader (327) matched with the write-through grating ruler (326), wherein the write-through grating ruler (326) and the write-through reader (327) are used for measuring and correcting the displacement of the write-through unit (32);

preferably, the write-through unit (32) further comprises a write-through limiter (328), the write-through limiter (328) being configured to limit a displacement stroke of the write-through unit (32);

preferably, the positioning camera module (329) comprises a camera mounting plate (3291) arranged on the direct-writing mounting plate (321), a camera adjusting plate (3294) arranged on the camera mounting plate (3291) in a sliding manner, and a camera mounting block (3295) arranged on the camera adjusting plate (3294), wherein a positioning camera (3298) is arranged on the camera mounting block (3295);

preferably, a camera fixing plate (3292) is arranged on the camera mounting plate (3291), a camera sliding plate (3293) is arranged on the camera fixing plate (3292) in a sliding manner, a camera adjusting screw (3297) for pushing the camera sliding plate (3293) to enable the camera sliding plate (3293) to slide relative to the camera fixing plate (3292) is arranged on the camera mounting plate (3291), and the camera adjusting plate (3294) is fixedly connected with the camera sliding plate (3293);

Preferably, a camera fixing block (3296) is fixedly arranged on one side of the camera adjusting plate (3294), a strip-shaped hole is formed in the camera fixing block (3296), and the camera fixing block (3296) is used for fixing the position of the camera adjusting plate (3294) relative to the camera mounting plate (3291) through the strip-shaped hole and a bolt.