CN220519488U

CN220519488U - Feeding device of wafer direct writing machine

Info

Publication number: CN220519488U
Application number: CN202322165809.7U
Authority: CN
Inventors: 张立
Original assignee: Shenzhen Guihua Intelligent Technology Co ltd
Current assignee: Shenzhen Guihua Intelligent Technology Co ltd
Priority date: 2023-08-11
Filing date: 2023-08-11
Publication date: 2024-02-23
Anticipated expiration: 2033-08-11

Abstract

The utility model relates to a feeding device of a wafer direct writing machine, which comprises a feeding module, wherein the feeding module comprises a feeding unit, a discharging unit and a feeding unit, a wafer is accommodated in a feeding bin of the feeding unit, a feeding lifting driver of the feeding unit drives the feeding bin to move up and down so as to enable the feeding bin to move to a preset height position, a discharging gripper of the discharging unit grips the wafer in the feeding bin and then enables the wafer to move to a preset position along a feeding guide rail of the feeding unit, and a feeding gripping module of the feeding unit grips the wafer and then conveys the wafer to the preset position and waits for the next procedure. The feeding device of the wafer direct writing machine provided by the utility model can realize continuous and stable feeding of the wafer by utilizing the parts such as the feeding unit, the discharging unit, the feeding unit and the like and the mutual coordination of the parts, thereby providing a guarantee for continuous wafer laser direct writing.

Description

Feeding device of wafer direct writing machine

Technical Field

The utility model relates to the field of wafer laser exposure, in particular to a feeding device of a wafer direct writing machine.

Background

The wafer direct writing machine is also called a wafer laser direct writing machine, and is a mechanical device for chip photoetching. When the conventional wafer photoetching machine performs wafer photoetching, photoresist is coated on the surface of a wafer, then a mask plate is manufactured, and then steps such as exposure, development, etching and the like are performed. Compared with the traditional wafer photoetching machine, the wafer direct-writing machine can omit the manufacturing process of the mask plate, and directly photoetches circuits, structural features and the like on the wafer. However, in the wafer direct writing machine in the prior art, the feeding link of the wafer is too single, and continuous and stable feeding cannot be realized. For example, chinese patent No. CN113031405B discloses a mass-produced double-sided laser direct-writing lithography machine, comprising: the system comprises a mobile platform, a plurality of carrying devices, an alignment camera, an optical engine and a transfer device, wherein the mobile platform comprises a plurality of areas; the plurality of object carrying devices are correspondingly arranged in the plurality of areas and are used for carrying wafers, a single optical engine or a plurality of optical engines are arranged on the upper side and the lower side of each object carrying device, the optical engines are used for exposing the wafers on the object carrying devices in the corresponding areas, the optical engines perform image data conversion processing on each lens according to Mark positions on the wafers, and the exposure is performed on the positions corresponding to the wafers according to the image position data obtained after conversion; the alignment camera is arranged at a coaxial or paraxial position of the optical engine and is used for aligning the wafer according to the Mark position on the wafer; the transfer device is used for transferring the wafer and moving the wafer into or out of the carrying device in the corresponding area. The patent can expose the double sides of a plurality of wafers in a plurality of areas simultaneously, reduces the time of turning over the plate, improves the exposure efficiency, avoids the condition of low alignment precision, but has no definite feeding device, can reduce the time of turning over the plate, but can not continuously and stably carry out direct-writing photoetching. As another example, WO2022116959A1 discloses a stepper comprising: the wafer workbench is used for bearing a wafer to be processed, the wafer comprises a plurality of wafer areas and an outer field area at the periphery of the wafer areas, a photosensitive layer is arranged on the surface of the wafer, a three-dimensional mark is arranged on the photosensitive layer, and the three-dimensional mark is provided with an area which is not in the same horizontal plane with the upper surface of the photosensitive layer; the nanometer needle point sensing device comprises a needle point sensing head which is positioned above the photosensitive layer and is used for moving scanning in a scanning area and determining coordinates of a three-dimensional mark in the scanning area; exposure beam generating means for providing an exposure beam required for exposing a wafer area and forming a projection exposure field on the photosensitive layer; and the displacement driving device is used for adjusting the relative positions of the exposure beam generating device and the wafer workbench according to the three-dimensional mark coordinates measured by the needle tip sensing head so that the projection exposure area is aligned with the wafer area to be exposed. The patent also lacks a well-defined loading device, so that a continuous, stable wafer feed is not possible.

In view of the above, the utility model provides a feeding device of a wafer direct-writing machine, which is provided with a feeding unit, a discharging unit, a feeding unit and other components to realize the purpose of continuous and stable feeding of wafer laser direct-writing, and simultaneously can realize continuous laser direct-writing of wafers by matching with a platform module and a processing module.

Disclosure of Invention

The utility model aims to provide a feeding device of a wafer direct writing machine, which solves the defects in the prior art, and the technical problem to be solved by the utility model is realized by the following technical scheme.

The utility model provides a wafer write-through machine loading attachment, includes the material loading module, its improvement lies in: the feeding module comprises a feeding unit, a discharging unit and a feeding unit, the wafer is accommodated in a feeding bin of the feeding unit, a feeding lifting driver of the feeding unit drives the feeding bin to move up and down so that the feeding bin moves to a preset height position, a discharging gripper of the discharging unit grips the wafer in the feeding bin and then moves the wafer to the preset position along a feeding guide rail of the feeding unit, and a feeding gripping module of the feeding unit grips the wafer and then conveys the wafer to the preset position and then waits for the next procedure.

Preferably, the feeding unit comprises a feeding lifting support frame, a feeding lifting guide rail is arranged on the feeding lifting support frame, a feeding support bracket is slidably arranged on the feeding lifting guide rail, a stopping mechanism is arranged on a feeding lifting driver, the feeding lifting driver is arranged on the feeding lifting support frame, the feeding support bracket is driven by the feeding lifting driver to move up and down, and the feeding bin is arranged on the feeding support bracket.

Preferably, the feeding guide rail is arranged at the side of the feeding bin and on the feeding guide rail supporting frame.

Preferably, the feeding guide rail support frame is provided with a feeding guide rail adjusting module, the feeding guide rail is arranged on the feeding guide rail adjusting module, and the feeding guide rail adjusting module is used for adjusting the width of the feeding guide rail to match the size of the wafer.

Preferably, the feeding guide rail adjusting module comprises a feeding adjusting bearing plate, a feeding adjusting driver and a feeding adjusting guide rail, wherein the feeding adjusting driver and the feeding adjusting guide rail are arranged on the feeding adjusting bearing plate, a stopping mechanism is arranged on the feeding adjusting driver, a feeding adjusting driving wheel of the feeding adjusting driver drives a feeding adjusting driven wheel to rotate through a feeding adjusting driving belt, feeding adjusting tooth blocks are arranged on opposite sides of the feeding adjusting driving belt, and a feeding adjusting sliding block is arranged on the feeding adjusting guide rail in a sliding mode and used for installing a feeding guide rail mounting plate of the feeding guide rail, and the feeding adjusting sliding block is fixedly connected with the feeding adjusting tooth blocks.

Preferably, the discharging unit comprises a discharging driver and a discharging guide rail arranged on a feeding guide rail mounting plate, a discharging driving wheel of the discharging driver drives a discharging driven wheel to rotate through a discharging driving belt, a discharging sliding block is arranged on the discharging guide rail in a sliding mode, a discharging gripper mounting frame is arranged on the discharging sliding block, the discharging gripper mounting frame is fixedly connected with the discharging driving belt, a discharging gripper is arranged on the discharging gripper mounting frame, and a discharging gripper driver used for driving the discharging gripper to clamp and loosen is arranged on the discharging gripper mounting frame.

Preferably, the feeding unit comprises a feeding driver and a feeding guide rail, wherein the feeding driver and the feeding guide rail are arranged on the feeding guide rail mounting plate, a feeding driving wheel of the feeding driver drives a feeding driven wheel to rotate through a feeding transmission belt, a feeding sliding block is arranged on the feeding guide rail in a sliding manner, and a feeding grabbing module for grabbing wafers moves along the feeding guide rail through the feeding sliding block under the driving of the feeding transmission belt.

Preferably, the feeding unit further comprises a feeding lifting module, the feeding lifting module is fixedly connected with the feeding sliding block and the feeding transmission belt, and the feeding grabbing module is arranged on the feeding lifting module.

Preferably, the feeding lifting module comprises a feeding lifting mounting plate fixedly connected with the feeding transmission belt and the feeding sliding block, a feeding lifting driver arranged on the feeding lifting mounting plate, and a feeding lifting sliding plate which is pushed by the feeding lifting driver and can slide up and down relative to the feeding lifting driver, and the feeding grabbing module is arranged on the feeding lifting sliding plate.

Preferably, the feeding grabbing module comprises a feeding grabbing mounting plate arranged on the feeding lifting sliding plate, a feeding grabbing supporting plate arranged on the feeding grabbing mounting plate, a feeding grabbing transverse adjusting plate arranged on the feeding grabbing supporting plate and a feeding grabbing longitudinal adjusting plate arranged on the feeding grabbing transverse adjusting plate, and a feeding grabbing sucker used for grabbing wafers is arranged on the feeding grabbing longitudinal adjusting plate.

In the utility model, the feeding unit is used for feeding the wafer, the feeding lifting driver drives the feeding bin to move to a preset height position, the discharging gripper of the discharging unit is used for gripping the wafer positioned in the feeding bin, so that the wafer moves along the feeding guide rail and moves to the preset position, the feeding gripping module of the feeding unit is used for gripping the wafer positioned on the feeding guide rail, then transferring the wafer to the platform module, and the platform module is used for correcting the wafer to a proper position after clamping the wafer, and the processing module is used for performing laser direct writing on the wafer.

According to the utility model, the feeding lifting support frame, the feeding lifting guide rail and the feeding lifting driver with the stopping mechanism are arranged, so that the wafer in the feeding bin can be smoothly grasped by the discharging grippers of the discharging unit; the feeding support bracket for supporting the feeding bin is arranged, and the feeding bin is not directly arranged on the feeding lifting guide rail in a sliding manner, so that the adaptation to wafers with different sizes is realized, namely, the feeding of the wafers with different sizes is realized by replacing the feeding bins with different specifications; the supply guide rail adjusting module is arranged, so that the replacement of the supply bins with different specifications is matched, namely, after the replacement of the supply bins, the sizes of wafers to be supplied are changed, and the width of the supply guide rail can be adjusted by arranging the supply guide rail adjusting module, so that the wafers with different sizes are adapted; through setting up the pay-off lift module, guaranteed that the pay-off snatchs the module and snatchs smoothly and transport the wafer to the platform module on.

Compared with the prior art, the feeding device of the wafer direct writing machine provided by the utility model can realize continuous and stable feeding of the wafer by utilizing the parts such as the feeding unit, the discharging unit, the feeding unit and the like and the mutual coordination of the parts, thereby providing a guarantee for continuous wafer laser direct writing.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic diagram of a feed unit according to the present utility model;

FIG. 3 is a schematic view of a feed rail adjustment module according to the present utility model;

FIG. 4 is a schematic diagram of a discharging unit according to the present utility model;

FIG. 5 is a schematic diagram of a feeding unit according to the present utility model;

FIG. 6 is a schematic diagram of a feeding lifting module and a feeding grabbing module according to the present utility model;

FIG. 7 is a schematic view of the structure of the present utility model in use;

the reference numerals in the drawings are in turn:

10. the feeding module, 11, the feeding unit, 111, the feeding lifting support frame, 112, the feeding lifting guide rail, 113, the feeding lifting driver, 114, the feeding support bracket, 115, the feeding bin, 116, the feeding guide rail, 117, the feeding guide rail support frame, 118, the feeding guide rail adjusting module, 1181, the feeding adjusting driver, 1182, the feeding adjusting driving wheel, 1183, the feeding adjusting driven wheel, 1184, the feeding adjusting driving belt, 1185, the feeding adjusting support plate, 1186, the feeding adjusting guide rail, 1187, the feeding adjusting sliding block, 1188, the feeding adjusting tooth block, 1189, the feeding guide rail mounting plate, 12, the discharging unit, 121, the discharging driver, 122, the discharging driving wheel, 123, the discharging driven wheel, 124, the discharging driving belt, 125 and the discharging guide rail, 126, discharge slide block, 127, discharge gripper mounting frame, 128, discharge gripper, 129, discharge gripper driver, 13, feeding unit, 131, feeding driver, 132, feeding driving wheel, 133, feeding driven wheel, 134, feeding driving belt, 135, feeding guide rail, 136, feeding slide block, 137, feeding lifting module, 1371, feeding lifting mounting plate, 1372, feeding lifting driver, 1373, feeding lifting sliding plate, 138, feeding grabbing module, 1381, feeding grabbing mounting plate, 1382, feeding grabbing support plate, 1383, feeding grabbing transverse adjusting plate, 1384, feeding grabbing longitudinal adjusting plate, 1385, feeding grabbing sucker, 14, feeding guide rail mounting plate, 20, platform module, 30 and processing module.

Detailed Description

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The utility model will be described in detail below with reference to the drawings in connection with embodiments.

Example 1:

referring to fig. 1 to 7, a loading device of a wafer direct writing machine includes a loading module 10, the improvement is that: the feeding module 10 includes a feeding unit 11, a discharging unit 12, and a feeding unit 13, where the wafer is accommodated in a feeding bin 115 of the feeding unit 11, a feeding lifting driver 113 of the feeding unit 11 drives the feeding bin 115 to move up and down so that the feeding bin 115 moves to a predetermined height position, a discharging handle 128 of the discharging unit 12 grabs the wafer in the feeding bin 115 and then moves the wafer to a predetermined position along a feeding guide rail 116 of the feeding unit 11, and a feeding grabbing module 138 of the feeding unit 13 grabs the wafer and then conveys the wafer to the predetermined position and waits for the next process.

In this embodiment, the feeding unit 11 is used for feeding wafers, wherein the feeding bin 115 can be replaced with different specifications so as to adapt to wafers with different sizes, and the feeding lifting driver 113 is used for driving the feeding bin 115 to move up and down to a predetermined height position so as to facilitate the grabbing of the subsequent discharging unit 12; the discharging unit 12 is configured to take out a wafer from the supply bin 115 and drive the wafer to move to a predetermined position along the supply rail 116 to wait for the gripping of the feeding unit 13, where the discharging grip 128 is configured to grip the wafer in the supply bin 115; the feeding unit 13 is configured to transfer the wafer to a predetermined position, and after the wafer is driven by the discharging unit 12 to be located at the predetermined position on the feeding rail 116, the feeding grabbing module 138 grabs the wafer and moves the wafer to the predetermined position to wait for the next process.

When the embodiment is specifically used, the feeding unit 11 performs feeding of the wafer, the feeding lifting driver 113 drives the feeding bin 115 to move to a predetermined height position, the discharging grip 128 of the discharging unit 12 grips the wafer in the feeding bin 115, then makes the wafer move along the feeding guide rail 116 and move to the predetermined position, the feeding gripping module 138 of the feeding unit 13 grips the wafer on the feeding guide rail 116, then transfers the wafer to the platform module 20, the platform module 20 grips the wafer and then corrects the wafer to a proper position, and the processing module 30 performs laser direct writing on the wafer.

Further, referring to fig. 4, the discharging unit 12 includes a discharging driver 121 and a discharging guide rail 125 disposed on the loading guide rail mounting plate 14, a discharging driving wheel 122 of the discharging driver 121 drives a discharging driven wheel 123 to rotate through a discharging driving belt 124, a discharging sliding block 126 is slidably disposed on the discharging guide rail 125, a discharging gripper mounting frame 127 is disposed on the discharging sliding block 126, the discharging gripper mounting frame 127 is fixedly connected with the discharging driving belt 124, the discharging gripper 128 is disposed on the discharging gripper mounting frame 127, and a discharging gripper driver 129 for driving the discharging gripper 128 to clamp and release is disposed on the discharging gripper mounting frame 127.

In this embodiment, the discharging driver 121 is utilized to drive the discharging gripper 128 to move along the discharging guide rail 125, so that the discharging gripper 128 can smoothly grasp the wafer located in the supply bin 115 and transfer the wafer to a predetermined position on the discharging guide rail 116, thereby preparing for the subsequent feeding unit 13 to grasp the wafer.

Compared with the prior art, the feeding device of the wafer direct writing machine provided by the embodiment can realize continuous and stable feeding of the wafer by utilizing the parts such as the feeding unit, the discharging unit, the feeding unit and the like and the mutual matching of the parts, thereby providing a guarantee for continuous wafer laser direct writing.

Example 2:

on the basis of embodiment 1, referring to fig. 2 and 3, the feeding unit 11 includes a feeding lifting support 111, a feeding lifting rail 112 is provided on the feeding lifting support 111, a feeding support bracket 114 is slidably provided on the feeding lifting rail 112, a stopping mechanism is provided on the feeding lifting driver 113, the feeding lifting driver 113 is provided on the feeding lifting support 111, the feeding support bracket 114 is driven by the feeding lifting driver 113 to move up and down, and the feeding bin 115 is provided on the feeding support bracket 114.

Further, the feeding guide rail 116 is disposed at a side of the feeding bin 115 and is disposed on the feeding guide rail supporting frame 117.

Further, the feeding rail supporting frame 117 is provided with a feeding rail adjusting module 118, the feeding rail 116 is disposed on the feeding rail adjusting module 118, and the feeding rail adjusting module 118 is used for adjusting the width of the feeding rail 116 to match the size of the wafer.

Further, the feeding guide rail adjusting module 118 includes feeding adjustment support board 1185, locates feeding adjustment driver 1181 and feeding adjustment guide rail 1186 on the feeding adjustment support board 1185, be equipped with stop mechanism on the feeding adjustment driver 1181, feeding adjustment action wheel 1182 of feeding adjustment driver 1181 drives feeding adjustment driven wheel 1183 through feeding adjustment drive belt 1184 and rotates, all be equipped with feeding adjustment tooth piece 1188 on feeding adjustment drive belt 1184's opposite side, feeding adjustment guide rail 1186 is last to slide and is equipped with feeding adjustment slider 1187, is used for the installation feeding guide rail mounting panel 1189 of feeding guide rail 116 with feeding adjustment slider 7 feeding adjustment tooth piece 1188 fixed connection.

In this embodiment, the material lifting support 111, the material lifting guide 112, and the material lifting driver 113 with the stopping mechanism are provided to ensure that the wafer in the material bin 115 can be smoothly gripped by the material gripping hand 128 of the material discharging unit 12. The feeding lifting driver 113 provided with the stopping mechanism drives the feeding bin 115 to move up and down, so that the wafers in the feeding bin 115 are always at a proper height position, namely, after the wafers in the feeding bin 115 are at the proper height position, the feeding lifting driver 113 stops, so that the wafers to be grabbed in the feeding bin 115 and the discharging grippers 128 of the discharging unit 12 are at the same horizontal height, and the grabbing of the wafers by the discharging grippers 128 is ensured; the feed lifting support 111 and the feed lifting guide rail 112 are necessary components for achieving the purpose.

In this embodiment, a material supply support bracket 114 for supporting the material supply bin 115 is provided, instead of directly sliding the material supply bin 115 on the material supply lifting rail 112, so as to adapt to different sizes of wafers, that is, to adapt to the material supply of different sizes of wafers by replacing the material supply bin 115 with different specifications.

In this embodiment, the supply rail adjusting module 118 is configured to cooperate with the replacement of the supply bin 115 with different specifications, that is, the size of the wafer to be supplied is changed after the replacement of the supply bin 115, and the width of the supply rail 116 can be adjusted by setting the supply rail adjusting module 118, so as to adapt to wafers with different sizes. The feeding adjustment driver 1181 drives the feeding adjustment driving belt 1184 to move, and the feeding adjustment toothed blocks 1188 disposed on opposite sides of the feeding adjustment driving belt 1184 move in opposite directions or in opposite directions, so as to drive the feeding guide rail mounting plate 1189 to move along the feeding adjustment guide rail 1186 in opposite directions or in opposite directions, and further drive the feeding guide rail 116 disposed on the feeding guide rail mounting plate 1189 to move in opposite directions or in opposite directions, so as to achieve the purpose of width adjustment of the feeding guide rail 116.

Example 3:

on the basis of embodiment 1 or 2, referring to fig. 5 and 6, the feeding unit 13 includes a feeding driver 131 and a feeding guide rail 135 that are disposed on the feeding guide rail mounting plate 14, a feeding driving wheel 132 of the feeding driver 131 drives a feeding driven wheel 133 to rotate through a feeding driving belt 134, a feeding sliding block 136 is slidably disposed on the feeding guide rail 135, and a feeding grabbing module 138 for grabbing a wafer is driven by the feeding driving belt 134 to move along the feeding guide rail 135 through the feeding sliding block 136.

In this embodiment, the feeding driver 131 drives the feeding grabbing module 138 to move along the discharging guide rail 135, so that the feeding grabbing module 138 grabs and transfers the wafer on the feeding guide rail 116 onto the platform module 20 smoothly.

Further, the feeding unit 13 further includes a feeding lifting module 137, the feeding lifting module 137 is fixedly connected with the feeding slider 136 and the feeding driving belt 134, and the feeding grabbing module 138 is disposed on the feeding lifting module 137.

Further, the feeding lifting module 137 includes a feeding lifting mounting plate 1371 fixedly connected with the feeding driving belt 134 and the feeding sliding block 136, a feeding lifting driver 1372 disposed on the feeding lifting mounting plate 1371, and a feeding lifting sliding plate 1373 pushed by the feeding lifting driver 1372 and capable of sliding up and down relative to the feeding lifting driver 1372, and the feeding grabbing module 138 is disposed on the feeding lifting sliding plate 1373.

In this embodiment, the feeding lifting module 137 is disposed to ensure that the feeding grabbing module 138 grabs and transfers the wafer onto the platform module 20 smoothly. That is, first, the feeding lifting module 137 drives the feeding grabbing module 138 to lift, which is the initial state of the feeding lifting module 137 and the feeding grabbing module 138, and the feeding driver 131 drives the feeding grabbing module 138 to move above the wafer located on the feeding guide rail 116; secondly, the feeding lifting module 137 drives the feeding grabbing module 138 to descend, and after the feeding grabbing module 138 grabs the wafer, the feeding lifting module 137 drives the feeding grabbing module 138 to ascend, and the feeding driver 131 drives the feeding grabbing module 138 to move above the platform module 20; thirdly, the feeding lifting module 137 drives the feeding grabbing module 138 to descend, and the feeding grabbing module 138 loosens the wafer so that the wafer is placed on the platform module 20; finally, the stage module 20 clamps the wafer and then corrects the wafer to a proper position, and the processing module 30 performs laser direct writing on the wafer.

Further, the feeding grabbing module 138 includes a feeding grabbing mounting plate 1381 disposed on the feeding lifting sliding plate 1373, a feeding grabbing support plate 1382 disposed on the feeding grabbing mounting plate 1381, a feeding grabbing transverse adjusting plate 1383 disposed on the feeding grabbing support plate 1382, a feeding grabbing longitudinal adjusting plate 1384 disposed on the feeding grabbing transverse adjusting plate 1383, and a feeding grabbing suction cup 1385 disposed on the feeding grabbing longitudinal adjusting plate 1384 for grabbing wafers.

In this embodiment, the arrangement of the feeding grabbing transverse adjusting plate 1383 and the feeding grabbing longitudinal adjusting plate 1384 can grab wafers of different sizes.

Further, the feeding grabbing transverse adjusting plate 1383 and the feeding grabbing longitudinal adjusting plate 1384 are provided with a plurality of adjusting holes for adjusting the positions of the feeding grabbing longitudinal adjusting plate 1384 and the feeding grabbing sucker 1385 relative to the feeding grabbing transverse adjusting plate 1383 and the feeding grabbing longitudinal adjusting plate 1384, so that wafers with different sizes can be grabbed.

It should be noted that the foregoing detailed description is exemplary and is intended to provide further explanation of the utility model. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular is intended to include the plural unless the context clearly indicates otherwise. Furthermore, it will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, steps, operations, devices, components, and/or groups thereof.

It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or otherwise described herein.

Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those elements but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways, such as rotated 90 degrees or at other orientations, and the spatially relative descriptors used herein interpreted accordingly.

In the above detailed description, reference is made to the accompanying drawings, which form a part hereof. In the drawings, like numerals typically identify like components unless context indicates otherwise. The illustrated embodiments described in the detailed description, drawings, and claims are not meant to be limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented herein.

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. The utility model provides a wafer write-through machine loading attachment, includes material loading module (10), its characterized in that: the feeding module (10) comprises a feeding unit (11), a discharging unit (12) and a feeding unit (13), wherein the wafer is accommodated in a feeding bin (115) of the feeding unit (11), a feeding lifting driver (113) of the feeding unit (11) drives the feeding bin (115) to move up and down so that the feeding bin (115) moves to a preset height position, a discharging gripper (128) of the discharging unit (12) grips the wafer in the feeding bin (115) and then moves the wafer to a preset position along a feeding guide rail (116) of the feeding unit (11), and a feeding gripping module (138) of the feeding unit (13) conveys the wafer to the preset position and then waits for the next procedure.

2. The wafer writer loading apparatus of claim 1, wherein: the feeding unit (11) comprises a feeding lifting support frame (111), a feeding lifting guide rail (112) is arranged on the feeding lifting support frame (111), a feeding support bracket (114) is arranged on the feeding lifting guide rail (112) in a sliding mode, a braking mechanism is arranged on the feeding lifting driver (113), the feeding lifting driver (113) is arranged on the feeding lifting support frame (111), the feeding support bracket (114) is driven by the feeding lifting driver (113) to move up and down, and the feeding bin (115) is arranged on the feeding support bracket (114).

3. The wafer writer loading apparatus of claim 1, wherein: the feed guide rail (116) is arranged at the side of the feed bin (115) and is arranged on the feed guide rail supporting frame (117).

4. A wafer direct-write machine loading attachment according to claim 3, wherein: the wafer feeder is characterized in that a feeding guide rail adjusting module (118) is arranged on the feeding guide rail supporting frame (117), the feeding guide rail (116) is arranged on the feeding guide rail adjusting module (118), and the feeding guide rail adjusting module (118) is used for adjusting the width of the feeding guide rail (116) to be matched with the size of the wafer.

5. The wafer writer loading apparatus of claim 4, wherein: the utility model provides a feeding guide rail adjustment module (118) is including feeding regulation spandrel plate (1185), locate feeding regulation driver (1181) and feeding regulation guide rail (1186) on feeding regulation spandrel plate (1185), be equipped with stop mechanism on feeding regulation driver (1181), feeding regulation action wheel (1182) of feeding regulation driver (1181) drives feeding regulation driven wheel (1183) through feeding regulation drive belt (1184) and rotates, all be equipped with feeding regulation tooth piece (1188) on the opposite side of feeding regulation drive belt (1184), the last slip of feeding regulation guide rail (1186) is equipped with feeding regulation slider (1187) for the installation feeding guide rail mounting panel (1189) of feeding guide rail (116) with feeding regulation slider (1187) feeding regulation tooth piece (1188) fixed connection.

6. The wafer writer loading apparatus of claim 1, wherein: the utility model discloses a feeding device, including feeding guide mounting panel (14), discharging unit (12) are including locating ejection of compact driver (121) and ejection of compact guide (125) on feeding guide mounting panel (14), ejection of compact action wheel (122) of ejection of compact driver (121) drive ejection of compact from driving wheel (123) rotation through ejection of compact drive belt (124), it is equipped with ejection of compact slider (126) to slide on ejection of compact guide (125), be equipped with ejection of compact tongs mounting bracket (127) on ejection of compact slider (126), ejection of compact tongs mounting bracket (127) with ejection of compact drive belt (124) fixed connection, ejection of compact tongs (128) are located on ejection of compact tongs mounting bracket (127), be equipped with on ejection of compact tongs mounting bracket (127) are used for the drive ejection of compact tongs driver (129) that ejection of compact tongs (128) clamp and loosen.

7. The wafer writer loading apparatus of claim 1, wherein: the feeding unit (13) comprises a feeding driver (131) and a feeding guide rail (135) which are arranged on a feeding guide rail mounting plate (14), a feeding driving wheel (132) of the feeding driver (131) drives a feeding driven wheel (133) to rotate through a feeding transmission belt (134), a feeding sliding block (136) is arranged on the feeding guide rail (135) in a sliding mode, and a feeding grabbing module (138) for grabbing a wafer moves along the feeding guide rail (135) through the feeding sliding block (136) under the driving of the feeding transmission belt (134).

8. The wafer writer loading apparatus of claim 7, wherein: the feeding unit (13) further comprises a feeding lifting module (137), the feeding lifting module (137) is fixedly connected with the feeding sliding block (136) and the feeding transmission belt (134), and the feeding grabbing module (138) is arranged on the feeding lifting module (137).

9. The wafer writer loading apparatus of claim 8, wherein: the feeding lifting module (137) comprises a feeding lifting mounting plate (1371) fixedly connected with the feeding transmission belt (134) and the feeding sliding block (136), a feeding lifting driver (1372) arranged on the feeding lifting mounting plate (1371), and a feeding lifting sliding plate (1373) pushed by the feeding lifting driver (1372) and capable of sliding up and down relative to the feeding lifting driver (1372), wherein the feeding grabbing module (138) is arranged on the feeding lifting sliding plate (1373).

10. The wafer writer loading apparatus of claim 9, wherein: the feeding grabbing module (138) is including locating feeding on feeding lift sliding plate (1373) snatchs mounting panel (1381), locates feeding on snatchs mounting panel (1381) snatchs backup pad (1382), locates feeding on snatchs backup pad (1382) snatchs transverse adjustment board (1383), locates feeding snatchs longitudinal adjustment board (1384) snatch on transverse adjustment board (1383), feeding snatchs longitudinal adjustment board (1384) and is equipped with feeding that is used for snatching the wafer snatch sucking disc (1385).