CN117063623A - 用于电气结构组和/或电子结构组的冷却体 - Google Patents
用于电气结构组和/或电子结构组的冷却体 Download PDFInfo
- Publication number
- CN117063623A CN117063623A CN202280024064.8A CN202280024064A CN117063623A CN 117063623 A CN117063623 A CN 117063623A CN 202280024064 A CN202280024064 A CN 202280024064A CN 117063623 A CN117063623 A CN 117063623A
- Authority
- CN
- China
- Prior art keywords
- plate
- cooling body
- cooling
- intermediate plate
- stack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 139
- 239000012809 cooling fluid Substances 0.000 claims abstract description 22
- 238000007373 indentation Methods 0.000 claims description 29
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000002826 coolant Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102021202817.9A DE102021202817A1 (de) | 2021-03-23 | 2021-03-23 | Kühlkörper für eine elektrische und/oder elektronische Baugruppe |
DE102021202817.9 | 2021-03-23 | ||
PCT/EP2022/055157 WO2022199993A1 (de) | 2021-03-23 | 2022-03-01 | Kühlkörper für eine elektrische und/oder elektronische baugruppe |
Publications (1)
Publication Number | Publication Date |
---|---|
CN117063623A true CN117063623A (zh) | 2023-11-14 |
Family
ID=80953535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202280024064.8A Pending CN117063623A (zh) | 2021-03-23 | 2022-03-01 | 用于电气结构组和/或电子结构组的冷却体 |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN117063623A (de) |
DE (1) | DE102021202817A1 (de) |
WO (1) | WO2022199993A1 (de) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7017655B2 (en) * | 2003-12-18 | 2006-03-28 | Modine Manufacturing Co. | Forced fluid heat sink |
DE112019005206T5 (de) * | 2018-10-19 | 2021-07-08 | T.Rad Co., Ltd. | ldentifikationsstruktur von Platten einer Kühlvorrichtung vom Stapeltyp |
-
2021
- 2021-03-23 DE DE102021202817.9A patent/DE102021202817A1/de active Pending
-
2022
- 2022-03-01 WO PCT/EP2022/055157 patent/WO2022199993A1/de active Application Filing
- 2022-03-01 CN CN202280024064.8A patent/CN117063623A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
DE102021202817A1 (de) | 2022-09-29 |
WO2022199993A1 (de) | 2022-09-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |