CN117062334A - PCBA (printed circuit board assembly) board packaging equipment and PCBA board packaging method - Google Patents
PCBA (printed circuit board assembly) board packaging equipment and PCBA board packaging method Download PDFInfo
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- CN117062334A CN117062334A CN202311197171.3A CN202311197171A CN117062334A CN 117062334 A CN117062334 A CN 117062334A CN 202311197171 A CN202311197171 A CN 202311197171A CN 117062334 A CN117062334 A CN 117062334A
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- pcba board
- spraying device
- pcba
- packaging
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 135
- 238000000034 method Methods 0.000 title claims abstract description 53
- 238000005507 spraying Methods 0.000 claims abstract description 298
- 238000007599 discharging Methods 0.000 claims abstract description 58
- 230000008569 process Effects 0.000 claims abstract description 19
- 238000013507 mapping Methods 0.000 claims abstract description 14
- 239000002994 raw material Substances 0.000 claims abstract description 9
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims abstract 35
- 239000003292 glue Substances 0.000 claims description 67
- 239000000463 material Substances 0.000 claims description 47
- 239000007921 spray Substances 0.000 claims description 31
- 238000005538 encapsulation Methods 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
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- 238000001723 curing Methods 0.000 description 40
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- XNMARPWJSQWVGC-UHFFFAOYSA-N 2-[3-[11-[[5-(dimethylamino)naphthalen-1-yl]sulfonylamino]undecanoylamino]propoxy]-4-[(5,5,8,8-tetramethyl-6,7-dihydronaphthalene-2-carbonyl)amino]benzoic acid Chemical compound CC1(C)CCC(C)(C)C=2C1=CC(C(=O)NC=1C=C(C(=CC=1)C(O)=O)OCCCNC(=O)CCCCCCCCCCNS(=O)(=O)C1=C3C=CC=C(C3=CC=C1)N(C)C)=CC=2 XNMARPWJSQWVGC-UHFFFAOYSA-N 0.000 description 28
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- 230000000694 effects Effects 0.000 description 11
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- 238000002347 injection Methods 0.000 description 4
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/075—Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
Abstract
The application discloses a PCBA board packaging device, which comprises: an operation table for placing the PCBA board; the spraying device is used for spraying the PCBA board; the spraying device is provided with a plurality of discharging units which move together; each discharging unit can be independently sprayed; the plurality of discharging units are arranged in an array manner; the feeding device is communicated with the spraying device and can convey raw materials to the spraying device; the driving device is connected with the spraying device and can drive the spraying device to move; the control device is connected with the spraying device and the driving device; the control device can control the distance between the spraying device and the spraying surface of the PCBA board to be kept constant through the driving device, or can control the relative position or mapping coordinate of the spraying device in the process of multiple spraying to be unchanged. The PCBA board packaging equipment and the PCBA board packaging method disclosed by the application can realize accurate spraying packaging of the PCBA board.
Description
The application relates to a divisional application with the application number of 201810301516.8, the application date of 2018, 4 months and 4 days, and the name of PCBA packaging equipment and PCBA packaging method.
Technical Field
The invention relates to the field of circuit board packaging, in particular to PCBA board packaging equipment and a PCBA board packaging method.
Background
Many packaging methods of PCBA (Printed Circuit Board +assembly) boards, such as three-proofing paint coating, filling and sealing, low-pressure injection molding and the like are adopted on the surface layer of the circuit board. Each of the above methods has respective advantages and disadvantages: the three-proofing paint is directly sprayed, and although the operation is simple, convenient and easy to realize, the circuit board cannot be truly protected, the waterproof and shockproof effects cannot be realized, the packaging time is long, and the packaging can be invalid; the encapsulation is complex in operation, low in efficiency, high in cost and poor in reliability; the method has the advantages that the mold design and manufacturing cost are high, and the influence of the characteristics of the glue on the packaging is large.
In the prior art, a low-pressure injection molding method is generally adopted to package a circuit board so as to achieve the effects of waterproof sealing, insulation and flame retardance. However, as the technology level is continuously improved, the specification and the size of the circuit board required to be encapsulated are larger and larger, and the thickness of the product is thinner and thinner. The existing injection molding method can not meet the packaging requirements of the circuit board.
Meanwhile, the existing PCBA board adopts a spray head to carry out spray packaging repeatedly, so that the precision control is poor, unnecessary packaging is brought to adjacent modules or components without packaging requirements, material waste is brought, and the packaging speed is reduced. And the lower ends of the pins cannot be effectively filled and packaged because the lower parts of the components are not covered easily due to low selectivity.
In addition, in the packaging process of the electronic circuit board, the chip module is different from other components and has a certain height and relatively more exposed pins, and if the packaging problem of the chip module can be effectively solved, the packaging requirements of other components and components can be more fully met. Therefore, in the packaging of the electronic circuit board, the chip module needs to be subjected to important packaging, a large amount of glue is applied to the chip part in the packaging process, and the glue can flow irregularly due to the physical property of the glue, so that the packaging effect is poor.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present invention provides a PCBA board packaging apparatus and a PCBA board packaging method, which can solve at least one of the above problems.
The technical scheme adopted by the invention is as follows:
a PCBA board packaging apparatus, comprising:
An operation table for placing the PCBA board;
the spraying device is used for spraying the PCBA board; the spraying device is provided with a plurality of discharging units which move together; at least one of the discharge units is capable of independent spraying;
the feeding device is communicated with the spraying device and can convey raw materials to the spraying device;
the driving device is connected with the spraying device and can drive the spraying device to move;
the control device is connected with the spraying device and the driving device; the control device can control the spraying device to move the spraying according to a preset track.
Preferably, the device further comprises a curing device which moves together with the spraying device; the solidifying device can solidify the sizing material sprayed on the PCBA board by the spraying device.
Preferably, the curing device is used for curing at the same time of spraying by the spraying device.
Preferably, the curing device is arranged at one side of the spraying device, which is opposite to the advancing direction.
Preferably, the curing device comprises a light irradiation source fixedly connected to the spraying device; the feeding device can supply the photo-curing resin to the spraying device.
Preferably, the irradiation direction of the curing device is deviated from the spraying direction of the spraying device.
Preferably, the operation table is further provided with an anti-reflection part, and the anti-reflection part can prevent the light emitted by the light irradiation source from forming reflection.
Preferably, the anti-reflection portion comprises a light absorbing coating applied to the surface of the console.
Preferably, each discharging unit can be independently sprayed; at least two of the discharge units are capable of discharging different sizes.
Preferably, a plurality of the discharging units are arranged in an array mode.
Preferably, an electromagnetic one-way valve for controlling discharging is arranged in the discharging unit; and each electromagnetic one-way valve of the discharging unit is connected with the control device.
Preferably, the driving device comprises a first movement mechanism for driving the material spraying device to move along a first shaft and a second movement mechanism for driving the material spraying device to move along a second shaft; the first shaft and the second shaft are perpendicular and are parallel to the operation table.
Preferably, the driving device further comprises a third movement mechanism for driving the spraying device and/or the operating platform to move along a third shaft; the third shaft is perpendicular to the first shaft and the second shaft; the control device can control the distance between the spraying device and the spraying surface of the PCBA board to be kept constant through the driving device.
Preferably, the control device can determine the position of the material spraying device according to the packaging surface coordinates of the packaging three-dimensional model of the PCBA board.
Preferably, the device also comprises a dispensing nozzle; the control device can control the material spraying device to form a dam around the PCBA board preset element; the dam encloses the predetermined element and the pins thereof; the dispensing nozzle can fill up the dam.
Preferably, the feeding device comprises an adhesive feeding box and a pressure feeding box; one end of the glue supply ink box is connected with a glue supply pump through a first glue supply pipe, and the other end of the glue supply ink box is connected with a spraying device through a second glue supply pipe; one end of the pressure supply ink box is connected with the pneumatic pump through a first pressure supply pipe, and the other end of the pressure supply ink box is connected with the glue supply ink box through a second pressure supply pipe.
A PCBA board packaging method adopting the PCBA board packaging equipment comprises the following steps:
placing the PCBA board on an operation table;
establishing a packaging three-dimensional model of the PCBA in a three-dimensional coordinate system;
and controlling the spraying device to spray the PCBA according to the packaging three-dimensional model of the PCBA.
Preferably, the establishing the package stereoscopic model of the PCBA board in the three-dimensional coordinate system includes:
And establishing a packaging stereoscopic model of the PCBA board in a three-dimensional coordinate system through scanning the PCBA board of the operation table.
Preferably, the controlling the spraying device to spray the PCBA board according to the encapsulation stereoscopic model of the PCBA board includes:
and determining the position of the spraying device according to the packaging surface coordinates of the packaging three-dimensional model of the PCBA.
Preferably, the controlling the spraying device to spray the PCBA board according to the encapsulation stereoscopic model of the PCBA board includes:
during the spraying process, the distance between the spraying device and the sprayed surface of the PCBA board remains constant.
Preferably, the controlling the spraying device to spray the PCBA board according to the encapsulation stereoscopic model of the PCBA board includes:
and carrying out multilayer spraying on the packaging area of the PCBA board, and curing layer by layer.
Preferably, the controlling the spraying device to spray the PCBA board according to the encapsulation stereoscopic model of the PCBA board includes:
for the same position, the relative position of the spraying device is unchanged in the process of spraying for a plurality of times.
Preferably, the controlling the spraying device to spray the PCBA board according to the encapsulation stereoscopic model of the PCBA board includes:
Spraying around the PCBA preset element for multiple times by using a spraying device and a curing device to form a dam; curing the coating formed by spraying while spraying;
and spraying glue into the dam to fill up.
The beneficial effects are that:
according to the spraying device of the PCBA packaging equipment, the plurality of discharging units are arranged, at least one discharging unit can be independently sprayed, so that the discharging unit can be provided with the plurality of mutually independent discharging holes, a larger spraying range can be provided, the spraying efficiency can be improved, the spraying requirement of the PCBA with larger size can be met, meanwhile, as the at least one discharging unit can be independently sprayed, only the discharging unit corresponding to the packaging area required by the spraying device is required to be opened when the region corresponding to the PCBA is sprayed, and only the discharging unit corresponding to the region requiring no spraying is closed, so that the PCBA is accurately sprayed and packaged.
In addition, even though the spraying range of the spraying device of the PCBA board packaging equipment is the same as that of the existing spraying head, as the spraying device is provided with a plurality of discharging units, the spraying range corresponding to each discharging unit is very small, and at least one discharging unit can be independently sprayed, so that the spraying precision is relatively high, the problem that the adjacent modules or components without packaging requirements possibly bring about spraying can be effectively avoided, the spraying of the discharging units which are required to be sprayed can be controlled according to the expected control in the packaging area corresponding to the spraying device, and further, the spraying device can further realize further controllable spraying under the area covered by the spraying device by being provided with two or more discharging units capable of being independently sprayed, and the purpose of fine spraying is achieved.
Specific embodiments of the invention are disclosed in detail below with reference to the following description and drawings, indicating the manner in which the principles of the invention may be employed. It should be understood that the embodiments of the invention are not limited in scope thereby. The embodiments of the invention include many variations, modifications and equivalents within the spirit and scope of the appended claims.
Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments in combination with or instead of the features of the other embodiments.
It should be emphasized that the term "comprises/comprising" when used herein is taken to specify the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps or components.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a PCBA board packaging apparatus provided in an embodiment of the present invention;
FIG. 2 is a side view of the injection device and curing device of FIG. 1;
FIG. 3 is a schematic view of the connection structure of the spraying device and the feeding device in FIG. 1;
FIG. 4 is a bottom view of the injection device of FIG. 3;
FIG. 5 is a top view of a chip module package;
FIG. 6 is a longitudinal cross-sectional view of a chip module package;
FIG. 7 is a schematic diagram of a packaging process for a chip module;
fig. 8 is a schematic diagram of a PCBA board packaging method according to an embodiment of the present invention.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, shall fall within the scope of the invention.
It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 4, in an embodiment of the present invention, a PCBA board packaging apparatus is provided, including: an operation table 6 for placing the PCBA board; a spraying device 1 for spraying the PCBA board; a feeding device communicated with the material spraying device 1, wherein the feeding device can convey raw materials to the material spraying device 1; the driving device is connected with the spraying device 1 and can drive the spraying device 1 to move; the control device is connected with the spraying device 1 and the driving device; the control device can control the spraying device 1 to move the spraying material according to a preset track.
The PCBA board packaging equipment can package the PCBA board, is not limited to spraying of three-proofing paint, and can also seal the PCBA board with glue, and has the functions of water resistance, heat conduction, insulation and the like. When the PCBA board is spray-packaged by the PCBA board packaging apparatus, the PCBA board is placed on the console 6. And then under the control of the control device, the driving device is used for driving the spraying device 1 to spray and pack the PCBA, and the control device controls the spraying device 1 to spray and pack the PCBA according to a preset path until the spraying and packing of the required packing area is completed.
In the present embodiment, the material spraying device 1 sprays packages onto the PCBA board. In a specific embodiment, the spraying device 1 may have a plurality of discharging units 18 that move together; at least one of the discharge units 18 is capable of independent spraying. Accordingly, each discharge unit 18 may have one or more discharge ports 19 through which 19 the PCBA board is sprayed. At least one discharge unit 18 may be individually discharge sprayed, the discharge spraying of the discharge unit 18 may be controlled by a control device, and correspondingly, the discharge of the other discharge units 18 may also be controlled by a control device.
Preferably, each of the discharge units 18 is capable of being independently sprayed. The opening and closing of each discharge unit 18 can be controlled by a control device. For better spraying range and fine spraying, a plurality of discharging units 18 are arranged in an array. Each discharge unit 18 arranged in an array can be controlled to discharge by the control device, so that spraying can be performed on the corresponding packaging area by controlling the discharge units 18 to be sprayed as desired. The spraying device 1 is provided with two or more discharging units 18 capable of being independently sprayed, so that further controllable spraying is realized under the coverage area of the spraying device 1, and the purpose of fine spraying is achieved.
In this embodiment, at least two of the discharge units are capable of discharging different compounds. The feeding device can simultaneously supply different sizing materials to the discharging unit. At least two discharging units can discharge different sizing materials, so that simultaneous spraying of multiple packaging materials is realized under a single spraying device.
Wherein the plurality of discharge units 18 are arranged in a plurality of columns and a plurality of rows arranged in parallel. As shown in fig. 4, a plurality of discharging units 18 on the spraying device 1 are arranged to form 6 rows and 5 columns. Specifically, the discharging unit 18 is provided with an electromagnetic one-way valve for controlling discharging. The electromagnetic one-way valve of each of the discharge units 18 may be connected to the control device. The control device controls the opening and closing of the electromagnetic one-way valve to realize the discharging control of the discharging unit 18.
The spraying device 1 of the PCBA board packaging equipment provided by the embodiment is provided with the plurality of discharging units 18, and at least one discharging unit 18 can be independently sprayed, so that the discharging unit 18 can be provided with a plurality of mutually independent discharging holes 19, and further a larger spraying range can be provided, the spraying efficiency is improved, and the spraying requirement of the PCBA board with a larger size can be met. Meanwhile, as at least one discharging unit 18 can be independently sprayed, when the spraying device 1 sprays the area of the corresponding PCBA board, only the discharging unit 18 corresponding to the required packaging area is required to be opened, and the discharging unit 18 corresponding to the area without the spraying requirement is closed, so that the accurate spraying packaging is realized.
In addition, even though the spraying device 1 of the PCBA board packaging equipment has the same spraying range as the existing spray head, as the spraying device 1 is provided with a plurality of discharging units 18, the spraying range corresponding to each discharging unit 18 is very small, and at least one discharging unit 18 can be independently sprayed, so that the spraying precision is higher, and the problem that adjacent modules or components without packaging requirements possibly cause spraying can be effectively avoided.
In the present embodiment, the console 6 is used for receiving and placing the PCBA board, and the console 6 has a placement area thereon, which may correspond to the three-dimensional coordinate system of the control device, and the spraying packaging operation is started when the PCBA board is located in the placement area. The placement area may be a receiving surface or space of the workbench, or may be a part of a surface of the workbench, and its shape may be a rectangular area, a square area or other regular shapes, and of course, irregular shapes may also be applicable, which is not limited by the present application. The shape of the placement area can be matched with the shape of the PCBA plate, so that the PCBA plate is placed in the placement area and is just matched and clamped, and the spray head is convenient to spray glue. The same glue spraying area can be used for placing a single PCBA board at a time, and also can be used for placing a plurality of PCBA boards. In the case where a plurality of PCBA boards are placed at the same time, the placement may be performed in a tiled manner in the placement area.
In this embodiment, the PCBA board may be transferred by a robot arm of the glue sealing apparatus or a conveyor belt, for example, the PCBA board is transferred onto a table by the conveyor belt according to a production line, or the conveyor belt carries the PCBA board and moves to a predetermined position to spray glue (at this time, the conveyor belt also serves as a table). Of course, the PCBA board may be placed in the placement area by manual placement in this step.
In one specific embodiment, to avoid the effects of irregular movement caused by the glue spray onto the PCBA board, the PCBA board packaging apparatus comprises: an operation table 6 for placing the PCBA board; a spraying device 1 for spraying the PCBA board; a feeding device communicated with the material spraying device 1, wherein the feeding device can convey raw materials to the material spraying device 1; the driving device is connected with the spraying device 1 and can drive the spraying device 1 to move; and a solidifying device 3 moving together with the spraying device 1. The solidifying device 3 can solidify the sizing material sprayed on the PCBA board by the spraying device 1.
The curing device 3 may be fixed to the spraying device 1 so as to move together with the spraying device 1. Specifically, the curing device 3 may be fixed with the spraying device 1 by the connecting shaft 2. Wherein the curing device 3 performs curing at the same time of spraying by the spraying device 1. When the spraying device 1 moves to pass through the spraying surface of the PCBA board, a spraying thin layer is formed on the spraying surface, and meanwhile, the curing device 3 cures the spraying thin layer, so that the influence caused by the flowing of the spraying thin layer is avoided.
In order to enable the curing device 3 to cure the sizing material (or the three-proofing lacquer) sprayed by the spraying device 1, the curing device 3 is arranged on one side of the spraying device 1 opposite to the advancing direction. That is, the solidification device 3 is fixed on the rear side of the material spraying device 1, and accordingly, the material spraying device 1 discharges and sprays materials in front, and the solidification device 3 in the rear follows and solidifies the sizing material on the PCBA board, so that the influence of irregular flow on the packaging quality is avoided.
In this embodiment, the curing device 3 may include a light irradiation source fixedly connected to the material spraying device 1. The feeding device can supply the photo-curable resin to the spraying device 1. Wherein, the photo-curing resin can be UV glue. The light irradiation source may be an ultraviolet light irradiation source, an infrared light irradiation source, etc., and the present invention is not limited thereto, and a corresponding light irradiation source may be selected according to the UV glue used in the use case.
Further, the irradiation direction of the solidifying means 3 is deviated from the ejection direction of the ejection means 1. As shown in fig. 1 and fig. 2, the spraying device 1 and the curing device 3 connected at two ends of the connecting shaft 2 have a certain inclination angle, and the curing device 3 (may slightly) inclines in the vertical direction, so that ultraviolet light (or other curing light) cannot irradiate the spraying device 1, and the glue stock is prevented from being cured at the discharge port 19 of the spraying device 1. In this embodiment, the curing device 3 may be (slightly) lower than the material spraying device 1, so that the curing light is reduced from spreading near the material spraying device 1, and the smooth discharge of the material spraying device 1 is also protected.
In this embodiment, in order to avoid that the reflected light solidifies the glue material of the spraying device 1, and solve the problem that the reflected light makes the spraying device 1 incapable of discharging smoothly, the operation table 6 may further be provided with an anti-reflection portion, where the anti-reflection portion can prevent the light emitted by the light irradiation source from forming reflection. Wherein the anti-reflection part comprises a light absorption coating coated on the surface of the operating table 6. The quantity of reflected light is reduced to the minimum through the light absorption coating, so that the spraying device 1 is prevented from being blocked by the solidification of the sizing material to the maximum extent, and smooth discharging and spraying are ensured.
With continued reference to fig. 1, in the embodiment, the driving device drives the spraying device 1 to operate according to the control of the control device. Specifically, the driving device comprises a first motion mechanism 5 for driving the material spraying device 1 to move along a first axis and a second motion mechanism 4 for driving the material spraying device 1 to move along a second axis; the first axis and the second axis are perpendicular and both parallel to the console 6. The first axis may be considered as X-axis and the second axis as Y-axis, i.e. the first movement mechanism 5 and the second movement mechanism 4 may move the ejection device 1 in a direction parallel to the horizontal plane (the operation table 6 is generally parallel to the horizontal plane).
Specifically, the first movement mechanism 5 can be arranged on the second movement mechanism 4, the first movement mechanism 5 can drive the spraying device 1 and the curing device 3, and the second movement mechanism 4 can complete free movement in the second axial direction according to the spraying requirement. The first movement mechanism 5 and the second movement mechanism 4 may be provided with corresponding X-axis guide rails and Y-axis guide rails, enabling corresponding axial movements.
Further, the driving device further comprises a third movement mechanism (not shown) for driving the spraying device 1 and/or the operating platform 6 to move along a third axis; the third shaft is perpendicular to the first shaft and the second shaft. The control device can control the distance between the spraying device 1 and the spraying surface of the PCBA board to be kept constant through the driving device.
In this embodiment, the third shaft may be moved in the vertical direction by the third movement mechanism to effect movement of the ejection device 1 in the vertical direction. The third movement mechanism can be provided with a guide rail mechanism, and the guide rail mechanism can drive the operation table 6 to move up and down so as to enable the PCBA board to move up and down relative to the spraying device 1, and can also directly act on the spraying device 1 so as to enable the spraying device 1 to move up and down relative to the PCBA board.
In the present embodiment, the control device (not shown) may control the moving path of the ejection device 1 by the driving device, so as to perform the spray packaging for the desired packaging area in the PCBA board. The control device may have hardware, such as a CPU, a controller, a single chip microcomputer, a PLC, a programmable circuit board, etc., or may be a combination of software and hardware, which is not limited in any way. The control device can control the moving speed of the spraying device 1 when moving. In order to improve the injection efficiency, the movement speeds of the injection device in the working mode and the non-working mode are different. Specifically, the control device may control the moving speed of the spraying device 1 when spraying is performed to be smaller than the moving speed of the spraying device 1 when spraying is not performed. For example, when the spraying device resets the spraying device 1 after the spraying is finished, the spraying device is reset and retracted at a higher speed.
In this embodiment, the control device may be introduced into a geometric physical parameter model (specifically, may be a packaging three-dimensional model) of the object to be sprayed (PCBA board), and may control the spraying device 1 to spray the object according to a predetermined spraying parameter according to the model. Wherein the spraying parameters may include at least one of spraying speed, spraying direction, glue supply pressure, moving speed.
The control device is constructed with a three-dimensional coordinate system having a mapping relation with the console 6, and establishes a packaging three-dimensional model of the PCBA board in the three-dimensional coordinate system. The control device can determine the position of the material spraying device 1 according to the packaging surface coordinates of the packaging three-dimensional model of the PCBA board.
In this embodiment, the package area or surface may be selected or specified according to the package stereoscopic model of the PCBA board, and corresponds to the actual package area of the PCBA board located in the actual coordinate system on the console 6. The material spraying device 1 has mapping coordinates in the three-dimensional coordinate system according to the mapping relation, and the position of the material spraying device 1 is determined according to the position relation between the mapping coordinates and the packaging surface coordinates of the packaging three-dimensional model. Further, in order to achieve fine spraying, each discharging unit 18 may also have a corresponding mapping coordinate in the three-dimensional coordinate system, so as to control the discharging of each discharging unit 18 according to the spraying condition of the corresponding coordinate point.
As shown in fig. 5, 6 and 7, the chip module 13 and the like on the PCBA board 14 have a large area of chip elements, and the chip elements have a certain height difference from other components and a large number of exposed pins 13b are distributed around the chip elements. In order to effectively package and protect the predetermined components such as the chip module 13, the dam 15 is built to surround the predetermined components, and then the predetermined components are filled to complete the effective package. The dam 15 encloses the predetermined element and its leads 13b.
In consideration of the large amount of glue required for packaging the predetermined components such as the chip module 13, the excessive irregular flow generated by once glue feeding is avoided, and therefore, the irregular flow caused by the physical properties of the glue is avoided by adopting a mode of constructing the dam 15 and then filling. The dam 15 may be adapted to the shape of the component.
The dam 15 of the predetermined components such as the chip module 13 can be constructed and filled with the above-mentioned material spraying device 1. In another embodiment, the PCBA board packaging apparatus may further comprise a dispensing nozzle (not shown). The control device can control the material spraying device 1 to form a dam 15 around the scheduled elements of the PCBA board 14. The dispensing nozzle can fill up the dam 15. The dispensing nozzle may have a single outlet 19 and may be fed to fill the interior region 17 of the dam 15 after alignment, and the encapsulation resulting from the filled compound 16 is shown in fig. 6.
With continued reference to fig. 1, in this embodiment, the feeding device may continuously supply the sizing material (or may supply the three-proofing paint raw material and the ink) to the spraying device in real time. The feeding device comprises a glue supply box 8 and a pressure supply box 11. One end of the glue supply ink box 8 is connected with the glue supply pump 7 through a first glue supply pipe, and the other end is connected with the material spraying device 1 through a second glue supply pipe 9 b. One end of the pressure supply ink box 11 is connected with the pneumatic pump 10 through a first pressure supply pipe 12a, and the other end of the pressure supply ink box is connected with the glue supply ink box 8 through a second pressure supply pipe 12 b.
Wherein, the glue supply pump 7 provides raw materials (UV glue, three-proofing paint and the like) for the glue supply ink box 8 through a glue supply pipe, the pneumatic pump 10 provides pneumatic pressure for the glue supply box 11 through a pressure supply pipe, the glue supply box 11 transmits the pneumatic pressure to the glue supply ink box 8 through the pressure supply pipe, the raw materials in the glue supply ink box 8 are extruded into the discharge unit 18 of the spraying device 1 through the glue supply pipe, and raw materials required by spraying are provided for the discharge unit 18 of the spraying device 1.
In the material spraying device 1, a plurality of discharging units 18 can share the same discharging port 19, and independent discharging of the single discharging unit 18 is realized through the opening and closing control of the electromagnetic one-way valve. In addition, the plurality of discharging units 18 can be respectively communicated with the ink supply box 8 through a rubber supply pipe, and the feeding device can realize independent discharging of each discharging unit 18 by controlling the on-off of the rubber supply pipe. The feeding means may be connected to said control means for effecting feed control of the feeding means.
As shown in fig. 8, and referring to fig. 5, 6 and 7, a PCBA board packaging method is also provided in an embodiment of the present application, and the PCBA board packaging apparatus in the above embodiment may be used, but is not limited to. Specifically, the PCBA packaging method comprises the following steps:
S1, placing a PCBA 14 on an operation table 6;
in this step S1, the console 6 is used to receive and place the PCBA board 14, and the console 6 has a placement area thereon, which may correspond to the three-dimensional coordinate system of the control device, and the spraying packaging operation is started when the PCBA board 14 is located in the placement area. The placement area may be a receiving surface or space of the workbench, or may be a part of a surface of the workbench, and its shape may be a rectangular area, a square area or other regular shapes, and of course, irregular shapes may also be applicable, which is not limited by the present application. The shape of the placement area can also be matched with the shape of the PCBA board 14, so that the PCBA board 14 is exactly matched and clamped when placed in the placement area, and the spray head is convenient for glue spraying operation. The same glue spray area may be used to place a single PCBA board 14 at a time, or may be used to place multiple PCBA boards 14. In the case where a plurality of PCBA boards 14 are placed at the same time, the placement may be performed in a tiled form in the placement area.
In this embodiment, the PCBA board 14 may be transferred by a robot arm of the sealing apparatus, a conveyor belt, for example, the PCBA board 14 is transferred onto a table by the conveyor belt in a form of a production line, or the conveyor belt carries the PCBA board 14 to move to a predetermined position for glue spraying (in this case, the conveyor belt also serves as a table). Of course, the PCBA board 14 may be placed in the placement area by manual placement in this step.
S2, establishing a packaging three-dimensional model of the PCBA 14 in a three-dimensional coordinate system;
the sealing device may have a virtual three-dimensional coordinate system, where the three-dimensional coordinate system corresponds to a real coordinate system (may also be referred to as a real coordinate system) where the spraying device 1 is located, the spraying device 1 has a corresponding mapping coordinate in the three-dimensional coordinate system, and the position of the spraying device 1 can be adjusted by moving through the mapping coordinate and the correspondence between the three-dimensional coordinate system and the real coordinate system, so that the PCBA 14 is sprayed according to a preset track.
The spraying device 1 sprays glue to the PCBA board 14 according to a preset glue spraying route (preset track), the preset glue spraying route can be an S-shaped route or an N-shaped route, or can spray glue in a circular track route at the center of the PCBA board 14 and gradually increase the radius of the circular track, and of course, the glue spraying can also be performed according to a fold line form. It can be seen that the predetermined glue spraying route can have various forms, and only the glue sealing can be completed in the embodiment. Of course, in order to improve the packaging efficiency, the spraying device 1 may select an optimal spraying path according to the time-shortest principle.
In this step S2, the PCBA board 14 of the console 6 is scanned to create a package stereoscopic model of the PCBA board 14 in a three-dimensional coordinate system.
The PCBA board packaging apparatus may also be equipped with a scanning camera or other scanning device to obtain a 3D packaging model of the PCBA board 14 by scanning the PCBA board 14. The encapsulation surface (encapsulation region) of the encapsulation stereomodel has respective coordinates in a three-dimensional coordinate system and corresponding true mapping coordinates in a true coordinate system. In this step S2, the build of the encapsulation stereoscopic model may also be in the form of a three-dimensional software drawing input or the like.
The PCBA board packaging method packages the object referenced by the PCBA board 14 into a 3D package model, rather than a flat model program. The coating encapsulation is completed by the encapsulation three-dimensional model of the PCBA 14 to correspond to the three-dimensional electronic components with the three-dimensional structure on the PCBA 14.
And S3, controlling the spraying device 1 to spray the PCBA 14 according to the packaging three-dimensional model of the PCBA 14.
In view of the above description, the spraying device 1 has corresponding mapping coordinates in the three-dimensional coordinate system, and the position of the spraying device 1 can be adjusted by moving according to the mapping coordinates and the corresponding relation between the three-dimensional coordinate system and the real coordinate system, so as to spray the PCBA 14 according to the preset track.
In this step S3, the position of the material spraying device 1 is determined according to the coordinates of the package surface of the package three-dimensional model of the PCBA board 14. Wherein the distance between the spraying device 1 and the sprayed surface of the PCBA board 14 remains constant during the spraying process. Illustrative examples are: the heights of two adjacent patch elements on the PCBA board 14 are different, and when the two patch elements are sprayed, the distance between the spraying device 1 and the top surfaces of the two patch elements is kept unchanged, so that a better spraying and packaging effect is obtained.
In this step S3, the same starting point is reset every time the package is sprayed, and then the position of the target coordinate point is located. The resetting point can be the origin of the imported packaging three-dimensional model, and the resetting point can also be the starting point. Meanwhile, for components for packaging different electrons, the position and the angle of the spraying device 1 are changed. Considering that the encapsulation material needs a certain thickness to obtain a good encapsulation effect, if the required thickness of the glue is reached at one time, irregular flow is easy to generate, resulting in poor encapsulation effect. To avoid this problem, in this step S3, the spraying device 1 performs spraying a plurality of times for the same position; curing is carried out simultaneously with each spraying.
In order to enable the spraying device 1 to spray for a plurality of times on the same position, the spraying device 1 can walk for a plurality of times according to a preset path in a packaging area, and each time the spraying device 1 walks according to the preset path, the spraying device 1 completes one-time spraying of the packaging area, correspondingly performs one-layer packaging on the packaging area, and solidifies the layer of packaging; then, the spraying device 1 walks once according to a preset path, the spraying device 1 completes secondary spraying of the packaging area, two layers of packaging are completed correspondingly to the packaging area, and the layers of packaging are solidified until the packaging with the target thickness is obtained. Therefore, the problem that the packaging effect is poor due to irregular flow of the sizing material can be solved, the spraying thickness can be finely controlled, and the target packaging effect is guaranteed. In this step S3, the encapsulated area of the PCBA board 14 is multilayer sprayed and cured layer by layer.
Considering that the overall thickness of the package is small, only the required thickness of the package needs to be achieved, and further in this step S3, for the same position, the relative position of the spraying device 1 in the multiple spraying processes is unchanged. That is, the mapping coordinates of the spraying device 1 do not change during the spraying process for the same position. The height of the encapsulation surface for the same location can be varied during the multiple spraying of the coating by the spraying device 1. For example, after each layer of spray coating is performed by the spraying device 1, the height of the spraying device 1 is raised when the next spraying is performed, and the raised height may be the height of one layer of coating.
In one possible embodiment, the PCBA board packaging method provided in the embodiment of the present application includes the following steps: forming a dam 15 by spraying around the PCBA 14 with the spraying device 1 and the solidifying device 3 for a plurality of times; curing the coating formed by spraying while spraying; then, glue is sprayed into the dam 15 to fill up.
In this embodiment, the glue may be sprayed to fill the interior 17 of the dam 15 by the spraying device 1, or may be dispensed by a dispensing nozzle. In addition, when filling is performed, it is also possible to spray-coat the inside 17 of the dam 15 with a plurality of layers to fill up and cure with the above-mentioned curing device 3 at the same time of spraying.
The dam 15 and the filling operation are described in detail below for a chip module 13 packaging method in one embodiment, so that the present application is better understood:
(1) The electronic circuit board 14 (i.e. the PCBA board 14) is placed at normal temperature, and the encapsulated three-dimensional model is led in by a control device (such as an upper computer), and the control device controls the spraying device 1 to complete the movement of the spraying route under the cooperative action of the second shaft movement mechanism and the first shaft movement mechanism according to the spraying requirement.
As shown in fig. 3, a first layer of UV glue dam 15 is sprayed around the chip module 13 on the PCBA board 14 (which may also be referred to as an electronic circuit board 14), and during spraying, the curing device 3 is in an open state, i.e. the layer is sprayed to cure the layer immediately, preventing irregular flow of UV glue. The spraying height of each layer is about 0.008m, and the spraying width is adjustable and not fixed according to the size and shape of the packaging components, so that the randomness of the chip 13a is met. Because the coating and the curing are performed simultaneously, the reinforcement time of each layer of coating time is controlled to be 10s-50s according to the complexity degree of the required packaging pattern. The height of the dam 15 is not lower than the height of the chip 13a itself, and is generally slightly higher than the chip by 0.5mm-1mm.
(2) After the spray coating and curing of the first layer was completed, the thickness of the formed layer was precisely lowered by about 0.008mm by the third movement mechanism.
(3) According to the method of step (1), on the basis of the cured first layer of UV glue dam 15 pattern, spraying a second layer of UV glue dam 15 pattern, wherein in the spraying process, the curing device 3 is still in an open state, so that the cured second layer of UV glue dam 15 pattern is firmly attached and stacked on the previous layer.
(3) Repeating the steps (1) - (3), spraying layer by layer, solidifying, attaching and stacking a new layer of the dam 15 pattern to the previous layer until the package three-dimensional solid glue dams 15 with the height slightly higher than that of the chip 13a are sprayed around the chip module 13 to be packaged, enclosing all the chip pins 13b and the chip 13a into the dam, turning off the solidifying device 3, and stopping forming the dam 15.
(4) After the dam 15 is completed, closing the UV curing device 3, spraying the interior of the UV glue dam 15 again, and effectively filling between the chip module 13 and the dam 15 by utilizing the physical property of the uncured UV glue material with fluidity, so that the chip 13a and the chip pins 13b are completely immersed in the uncured UV glue;
(5) After the step (4) is completed, the UV curing device 3 is turned on, and the PCBA board 14 and the filled chip module 13 thereon are cured again under the curing device 3 for about 0.5s-3s.
The UV curing device 3 in the steps (1) - (3) is in a normally open state; the curing device 3 in the step (4) can be in a normally closed state; in the above process, the chip module 13 and the PCBA board 14 may be in a normal temperature state.
In view of the above-mentioned, it is desirable,
1. according to the dam-filled packaging method in the PCBA board packaging method provided by the embodiment of the application, the chip 13a and the pins 13b are effectively packaged in the UV adhesive, so that the phenomenon that the lower parts of components are not covered easily due to the spraying of the three-proofing paint, and the lower ends of the pins 13b cannot be effectively packaged and exposed is effectively solved; meanwhile, the defects that air is easy to be mixed in the process of spraying and packaging the three-proofing paint, so that bubbles appear in the package and the thickness is uneven are overcome.
The embodiment has the advantages of better packaging consistency, clear packaging interface and clear packaging level, effectively solves the problems of material waste and poor packaging effect caused by lower selectivity and precision due to irregular spraying of the range in the three-proofing paint spraying method, reduces the production cost and improves the product quality.
2. The PCBA board packaging method provided by the embodiment of the application adopts UV glue for packaging, has high curing speed, overcomes the characteristics of complicated curing process and slow curing of the three-proofing paint material, further improves the packaging efficiency and shortens the packaging period.
3. In the PCBA board packaging method provided by the embodiment of the application, in the step of packaging the box dam 15, according to the method of spraying and stacking the box dam 15 layer by layer according to the packaging three-dimensional model, the interface of the box dam 15 is clear, the line consistency is good, the method has the advantages of printing and curing at the same time, the bottom layer is cured after printing, the bottom layer is firmly bonded on the substrate, and the defect of low bonding strength caused by air inclusion in the bonding process of the bottom layer of the existing box dam 15 and the substrate of the circuit board is overcome.
The defects of glue overflow, glue dispensing interruption, wire drawing and the like in the process of dispensing the box dam 15 can be effectively avoided by adopting a mode of spraying and curing at the same time, the curing device 3 connected with the spray head is opened after the filling step is finished, and final curing and packaging can be finished on a packaging platform.
4. The packaging method of the embodiment is superior to the existing packaging method of the chip module 13, the packaging procedure has no special temperature requirement, the temperature is not required to be repeatedly changed in the process, the refrigeration and heating devices are not required, the equipment investment cost is reduced, and the benefit is increased.
Any numerical value recited herein includes all values of the lower and upper values that increment by one unit from the lower value to the upper value, as long as there is a spacing of at least two units between any lower value and any higher value. For example, if it is stated that the number of components or the value of a process variable (e.g., temperature, pressure, time, etc.) is from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70, then the purpose is to explicitly list such values as 15 to 85, 22 to 68, 43 to 51, 30 to 32, etc. in this specification as well. For values less than 1, one unit is suitably considered to be 0.0001, 0.001, 0.01, 0.1. These are merely examples that are intended to be explicitly recited in this description, and all possible combinations of values recited between the lowest value and the highest value are believed to be explicitly stated in the description in a similar manner.
Unless otherwise indicated, all ranges include endpoints and all numbers between endpoints. "about" or "approximately" as used with a range is applicable to both endpoints of the range. Thus, "about 20 to 30" is intended to cover "about 20 to about 30," including at least the indicated endpoints.
All articles and references, including patent applications and publications, disclosed herein are incorporated by reference for all purposes. The term "consisting essentially of …" describing a combination shall include the identified element, ingredient, component or step as well as other elements, ingredients, components or steps that do not substantially affect the essential novel features of the combination. The use of the terms "comprises" or "comprising" to describe combinations of elements, components, or steps herein also contemplates embodiments consisting essentially of such elements, components, or steps. By using the term "may" herein, it is intended that any attribute described as "may" be included is optional.
Multiple elements, components, parts or steps can be provided by a single integrated element, component, part or step. Alternatively, a single integrated element, component, part or step may be divided into separate plural elements, components, parts or steps. The disclosure of "a" or "an" to describe an element, component, section or step is not intended to exclude other elements, components, sections or steps.
It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided will be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but instead should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are incorporated herein by reference for the purpose of completeness. The omission of any aspect of the subject matter disclosed herein in the preceding claims is not intended to forego such subject matter, nor should the inventors regard such subject matter as not be considered to be part of the disclosed subject matter.
Claims (10)
1. A PCBA board packaging apparatus, comprising:
an operation table for placing the PCBA board;
the spraying device is used for spraying the PCBA board; the spraying device is provided with a plurality of discharging units which move together; each discharging unit can be independently sprayed; the plurality of discharging units are arranged in an array manner;
the feeding device is communicated with the spraying device and can convey raw materials to the spraying device;
the driving device is connected with the spraying device and can drive the spraying device to move;
the control device is connected with the spraying device and the driving device; the control device can control the distance between the spraying device and the spraying surface of the PCBA board to be kept constant through the driving device, or can control the relative position or mapping coordinate of the spraying device in the process of multiple spraying to be unchanged.
2. The PCBA board packaging apparatus of claim 1, wherein the PCBA board packaging apparatus further comprises: a solidifying device moving together with the spraying device; the solidifying device can solidify the sizing material sprayed on the PCBA board by the spraying device.
3. A PCBA board packaging method using the PCBA board packaging apparatus of claim 1, comprising the steps of:
placing the PCBA board on an operation table;
controlling the spraying device to spray the PCBA; during the spraying process, the distance between the spraying device and the sprayed surface of the PCBA board remains constant.
4. The PCBA board packaging method of claim 2, wherein maintaining a constant distance between the dispensing device and a sprayed surface of the PCBA board comprises: the height of the encapsulation surface at the same position changes in the process of spraying the coating for multiple times by the material spraying device.
5. The PCBA board packaging method of claim 2, wherein maintaining a constant distance between the dispensing device and a sprayed surface of the PCBA board comprises: after each layer of spray coating is executed by the spraying device, the height of the spraying device is raised when the next spraying is executed, and the raised height is the height of one layer of coating.
6. The PCBA board packaging method of claim 2, wherein maintaining a constant distance between the dispensing device and a sprayed surface of the PCBA board comprises: the distance of the spraying device relative to the top surfaces of the two patch elements of different heights remains unchanged.
7. A PCBA board packaging method using the PCBA board packaging apparatus of claim 1, comprising the steps of:
placing the PCBA board on an operation table;
controlling the spraying device to spray the PCBA; for the same position, the relative position of the spraying device in the process of spraying for many times is unchanged, or for the same position, the mapping coordinate of the spraying device in the process of spraying for many times is unchanged.
8. The PCBA board packaging method of claim 2, wherein the material spraying device walks a plurality of times according to a preset path in a packaging area of the PCBA board, and each time the material spraying device walks according to the preset path, the material spraying device completes one spraying of the packaging area, and a layer of packaging and curing of the layer of packaging are performed correspondingly to the packaging area.
9. The PCBA board packaging method as recited in claim 2, further comprising:
controlling the spraying device to spray the PCBA; spraying around the PCBA preset element for multiple times by using a spraying device to form a dam;
and spraying glue into the dam to fill up.
10. The PCBA board packaging method of claim 9, wherein the coating formed by each spraying is cured while the dam is being sprayed; preferably, each new dam pattern is attached and stacked to the previous layer until a packaged three-dimensional solid glue dam with a height slightly higher than the predetermined element is sprayed around the predetermined element to be packaged.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311197171.3A CN117062334A (en) | 2018-04-04 | 2018-04-04 | PCBA (printed circuit board assembly) board packaging equipment and PCBA board packaging method |
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| CN202311197171.3A CN117062334A (en) | 2018-04-04 | 2018-04-04 | PCBA (printed circuit board assembly) board packaging equipment and PCBA board packaging method |
| CN201810301516.8A CN108391386B (en) | 2018-04-04 | 2018-04-04 | PCBA (printed circuit board assembly) board packaging equipment and PCBA board packaging method |
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| CN201810301516.8A Active CN108391386B (en) | 2018-04-04 | 2018-04-04 | PCBA (printed circuit board assembly) board packaging equipment and PCBA board packaging method |
| CN202311197171.3A Pending CN117062334A (en) | 2018-04-04 | 2018-04-04 | PCBA (printed circuit board assembly) board packaging equipment and PCBA board packaging method |
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| CN117500186A (en) * | 2018-04-04 | 2024-02-02 | 苏州康尼格电子科技股份有限公司 | PCBA (printed circuit board assembly) board packaging equipment and PCBA board packaging method |
| CN109740267B (en) * | 2019-01-07 | 2022-02-18 | 郑州云海信息技术有限公司 | Method and related device for editing design drawing of CPU (Central processing Unit) in PCB (printed Circuit Board) |
| CN218394541U (en) * | 2021-10-13 | 2023-01-31 | 苏州康尼格电子科技股份有限公司 | Solidification equipment and PCBA board packaging system thereof |
| CN113993295B (en) * | 2021-10-13 | 2023-04-25 | 苏州康尼格电子科技股份有限公司 | PCBA board packaging equipment |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN108391386B (en) | 2024-02-06 |
| CN108391386A (en) | 2018-08-10 |
| CN117500186A (en) | 2024-02-02 |
| CN116981182A (en) | 2023-10-31 |
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