CN208079516U - PCBA board sealed in unit - Google Patents
PCBA board sealed in unit Download PDFInfo
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- CN208079516U CN208079516U CN201820476605.1U CN201820476605U CN208079516U CN 208079516 U CN208079516 U CN 208079516U CN 201820476605 U CN201820476605 U CN 201820476605U CN 208079516 U CN208079516 U CN 208079516U
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Abstract
The utility model discloses a kind of PCBA board sealed in unit：Operation console for placing PCBA board；Material-spraying device for being sprayed to the PCBA board；With one synkinematic solidification equipment of the material-spraying device；The material-spraying device can be injected in the solidification of the sizing material in the PCBA board by the solidification equipment；The feeding device being connected with the material-spraying device, the feeding device can be to the material-spraying device transferring raw materials；The driving device being connect with the material-spraying device can drive the material-spraying device to move.PCBA board sealed in unit disclosed by the utility model can reduce the irregular flowing of sizing material in spraying PCBA board, improve packaging effect.
Description
Technical field
The utility model is related to circuit board package field more particularly to a kind of PCBA board sealed in unit.
Background technology
There are many packaging method of PCBA (Printed Circuit Board+Assembly) plate, such as applied on circuit board surface layer
The packaging methods such as three-proofing coating, embedding and low-pressure injection molding.Each above-mentioned method has respective advantage and disadvantage：Direct spraying three-proofing coating,
Although simple, convenient, easy realization cannot really protect circuit board, waterproof, shockproof, time can not achieve
Long, encapsulation may fail；Embedding, it is cumbersome, efficiency is low, of high cost and poor reliability；Low-pressure injection molding utilizes low-pressure injection molding
Equipment is completed by dedicated mold, the corresponding injection pressure of adjustment and time to circuit board package, this method mold design and
Cost of manufacture is higher, and the characteristic of glue itself is affected to encapsulation.
In the prior art, generally use low-pressure injection molding method dimensional packaged circuit board to reach the effect of waterproof sealing, flame-resistant insulation
Fruit.But due to the continuous improvement of scientific and technological level, the circuit board specification of required encapsulating is increasing, and the thickness of product is more next
It is thinner.Existing injection moulding process has been unable to meet the encapsulation requirement of such circuit board.
Meanwhile existing PCBA board is all made of nozzle and carries out round-trip multiple spraying encapsulation, not only precision controlling compared with
Difference can give adjacent but module without encapsulation requirement or component to bring unnecessary encapsulation, not only bring waste of material, but also reduce
Package speed.Due also to selectivity is low, it is also easy to produce the unlapped phenomenon in component lower part, pin lower end cannot effectively fill envelope
Dress.
In addition, in electronic circuit board (PCBA board) encapsulation process, chip module, which is different from other components, to be existed centainly
Height and relatively large number of exposed pin, if it is possible to effectively solve the problems, such as the encapsulation of chip module, the encapsulation of other components
It is required that being just better able to fully meet.
Therefore, it needs to carry out emphasis encapsulation to chip module in electronic circuit board encapsulation, to chip portion in encapsulation process
Divide largely to glue, and since the physical attribute of colloid itself causes it that can irregularly flow, causes packaging effect poor.
Utility model content
In view of the above-mentioned deficiency of the prior art, a kind of PCBA board sealed in unit of the utility model offer and PCBA board encapsulation side
Method, can at least solve one of problem above.
The technical solution adopted in the utility model is as follows：
A kind of PCBA board sealed in unit, including：
Operation console for placing PCBA board；
Material-spraying device for being sprayed to the PCBA board；
With one synkinematic solidification equipment of the material-spraying device；The material-spraying device can be injected in institute by the solidification equipment
State the sizing material solidification in PCBA board；
The feeding device being connected with the material-spraying device, the feeding device can be to the material-spraying device transferring raw materials；
The driving device being connect with the material-spraying device can drive the material-spraying device to move.
Preferably, the solidification equipment is cured while the material-spraying device sprays.
Preferably, the solidification equipment is set to the material-spraying device back to the side of direction of advance.
Preferably, the solidification equipment includes the light irradiation source being fixedly connected on the material-spraying device；The feed dress
Light-cured resin can be supplied to the material-spraying device by setting.
Preferably, the direction of illumination of the solidification equipment deviates the injection direction of the material-spraying device.
Preferably, antireflection portion is additionally provided on the operation console, the antireflection portion can prevent the smooth irradiation source hair
The light penetrated forms reflection.
Preferably, the antireflection portion includes the light-absorbing coating of operation console surface coating.
Preferably, the material-spraying device has multiple one synkinematic discharging units；At least one discharging unit energy
Enough independent sprayings.
Preferably, each discharging unit can be sprayed independently.
Preferably, the feeding device includes for celluloid ink box and pressure supply print cartridge；It is described to be supplied by first for celluloid ink box one end
Sebific duct connects gumming pump, and the other end connects material-spraying device by second for sebific duct；Pressure supply print cartridge one end passes through the first pressure supply
Pipe connects pulsometer, and the other end is described for celluloid ink box for pressure pipe connection by second.
Advantageous effect：
PCBA board sealed in unit provided by the utility model is by being equipped with and one synkinematic solidification of the material-spraying device
Device so that the material-spraying device can be injected in the solidification of the sizing material in the PCBA board by the solidification equipment, realize side spraying
Side cures, and reduces sizing material and generates irregular flowing in PCBA board, improves packaging effect.
Further, the material-spraying device of PCBA board sealed in unit provided by the utility model by be equipped with it is multiple go out material list
Member, and at least one discharging unit can be sprayed independently so that and the discharging unit can independently of each other go out with multiple
The discharge port of material not only promotes spray efficiency so as to the spray range with bigger, additionally it is possible to adapt to larger size PCBA
The spraying requirement of plate, simultaneously as at least one discharging unit can be sprayed independently, to corresponding to material-spraying device spraying
Required packaging area corresponding discharging unit need to be only opened when the region of PCBA board, for without spraying desired region pair
The discharging unit answered is closed, to realize the accurate spraying encapsulation of PCBA board.
In addition, even if the material-spraying device of PCBA board sealed in unit is identical as existing nozzle spray regime, but due to material spray
Device is configured with multiple discharging units, the spray range very little corresponding to each discharging unit, and at least one discharging unit
It can independently spray, to which deposition accuracies are higher, it is possible to prevente effectively from can to module or component adjacent but without encapsulation requirement
Spraying problem can be brought, and the required discharging unit sprayed can be desirably controlled in the corresponding packaging area of material-spraying device
It is sprayed, and then material-spraying device passes through the discharging unit that can independently be sprayed equipped with two or more so that in material-spraying device
Further controllable spraying is realized under institute overlay area, achievees the purpose that fining spraying.
With reference to following description and accompanying drawings, the particular implementation of the utility model is disclosed in detail, specifies this practicality
Novel principle can be in a manner of adopted.It should be understood that the embodiment of the utility model in range not thus by
Limitation.In the range of the spirit and terms of appended claims, the embodiment of the utility model includes many changes, modifications
With it is equivalent.
The feature for describing and/or showing for a kind of embodiment can be in a manner of same or similar one or more
It is used in a other embodiment, it is combined with the feature in other embodiment, or substitute the feature in other embodiment.
It should be emphasized that term "comprises/comprising" refers to the presence of feature, one integral piece, step or component when being used herein, but simultaneously
It is not excluded for the presence or additional of one or more other features, one integral piece, step or component.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those skilled in the art, without having to pay creative labor,
Other drawings may also be obtained based on these drawings.
Fig. 1 is a kind of PCBA board sealed in unit structural schematic diagram provided in the utility model embodiment；
Fig. 2 is material-spraying device and solidification equipment lateral location structure chart in Fig. 1；
Fig. 3 is material-spraying device and feeding device attachment structure schematic diagram in Fig. 1；
Fig. 4 is the material-spraying device upward view of Fig. 3；
Fig. 5 is chip module encapsulation plan view；
Fig. 6 is the vertical section sectional view of chip module encapsulation；
Fig. 7 is the encapsulation process schematic diagram of chip module.
Specific implementation mode
In order to make those skilled in the art more fully understand the technical solution in the utility model, below in conjunction with this reality
With the attached drawing in new embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that
The described embodiments are only a part of the embodiments of the utility model, instead of all the embodiments.Based on the utility model
In embodiment, the every other implementation that those of ordinary skill in the art are obtained without making creative work
Example should all belong to the range of the utility model protection.
It should be noted that when element is referred to as " being set to " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not offered as being unique embodiment.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with the technology for belonging to the utility model
The normally understood meaning of technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term as used herein "and/or" packet
Include any and all combinations of one or more relevant Listed Items.
It please refers to Fig.1 to Fig.4, a kind of PCBA board sealed in unit is provided in the utility model embodiment, including：For putting
Set the operation console 6 of PCBA board；Material-spraying device 1 for being sprayed to the PCBA board；The feed being connected with the material-spraying device 1
Device, the feeding device can be to 1 transferring raw materials of the material-spraying device；The driving device being connect with the material-spraying device 1, energy
The material-spraying device 1 is driven to move；The control device being connected with the material-spraying device 1, the driving device；The control dress
The material-spraying device 1 can be controlled by setting moves material spray according to desired trajectory.
The PCBA board sealed in unit can be packaged PCBA board, it is not limited to the spraying of three-proofing coating, it can also be to
PCBA board carries out sealing, the effects that PCBA board is played waterproof, heat conduction or insulated.Utilizing the PCBA board sealed in unit pair
When PCBA board carries out spraying encapsulation, PCBA board is put on operation console 6.Then under control of the control means, filled using driving
It sets driving material-spraying device 1 and spraying encapsulation is carried out to PCBA board, control device controls material-spraying device 1 according to preset path to PCBA board
It is sprayed, until the spraying encapsulation of packaging area needed for completing.
In the present embodiment, material-spraying device 1 is sprayed to PCBA board and is encapsulated.In specific embodiment, the material-spraying device 1
There can be multiple one synkinematic discharging units 18；At least one discharging unit 18 can be sprayed independently.Correspondingly, every
A discharging unit 18 can have one or more discharge ports 19, be sprayed to PCBA board by discharge port 19.It is at least one go out
Material unit 18 can individually discharge spraying, and the discharging spraying of the discharging unit 18 can be controlled by control device, correspondingly, its
The discharging of his discharging unit 18 can also be controlled by control device.
Preferably, each discharging unit 18 can be sprayed independently.The opening and closing of each discharging unit 18 can be by
Control device controls.For there is preferable spray range and sprayed conducive to fining, multiple 18 arrays of the discharging unit
Arrangement.Array arrangement each discharging unit 18 can with controlled device control discharge, to corresponding packaging area can
It is sprayed with desirably controlling the required discharging unit 18 sprayed.Material-spraying device 1 can be only by being equipped with two or more
The discharging unit 18 of vertical spraying so that realize further controllable spraying under 1 overlay area of material-spraying device, reach fining
The purpose of spraying.
In this embodiment, different sizing materials can be discharged at least two discharging units.Feeding device can be to described
Discharging unit supplies different sizing materials simultaneously.Different sizing materials can be discharged at least two discharging units, single to realize
It is sprayed while realizing a variety of encapsulating materials under material-spraying device.
Wherein, multiple discharging units 18 are arranged into the multiple row of parallel arrangement and multiple rows of.As shown in figure 4, the material spray dress
The arrangement of multiple discharging units 18 set on 1 forms 6 row, 5 row.Specifically, being equipped with the electromagnetism of control discharging in the discharging unit 18
Check valve.The electromagnetism check valve of each discharging unit 18 can be connected with the control device.Control device passes through
The discharging control of discharging unit 18 is realized in the opening and closing for controlling electromagnetism check valve.
The material-spraying device 1 for the PCBA board sealed in unit that present embodiment is provided by being equipped with multiple discharging units 18, and
And at least one discharging unit 18 can be sprayed independently so that the discharging unit 18 can have multiple mutual indepedent dischargings
Discharge port 19 not only promote spray efficiency so as to the spray range with bigger, additionally it is possible to adapt to larger size PCBA
The spraying requirement of plate.Simultaneously as at least one discharging unit 18 can be sprayed independently, to right in the spraying of material-spraying device 1 institute
Required packaging area corresponding discharging unit 18 need to be only opened when answering the region of PCBA board, for without spraying desired area
The corresponding discharging unit 18 in domain is closed, to realize accurate spraying encapsulation.
In addition, even if the material-spraying device 1 of PCBA board sealed in unit is identical as existing nozzle spray regime, but due to material spray
Device 1 is configured with multiple discharging units 18, the spray range very little corresponding to each discharging unit 18, and at least one discharging
Unit 18 can be sprayed independently, to which deposition accuracies are higher, it is possible to prevente effectively to module or member adjacent but required without encapsulation
Device may bring spraying problem.
In the present embodiment, operation console 6 places PCBA board for accepting, and has placement region, the placement on operation console 6
Region can be corresponding with the three-dimensional system of coordinate of control device, starts to spray packaging operation when PCBA board is located at placement region.
Placement region can be wear surface or the space of workbench, or the part surface of workbench, shape can be square
Shape region, square region or other regular shapes, certain irregular shape can also be applied, and the application is not restricted.It places
The shape in region can also match with the shape of PCBA board, and then when PCBA board is positioned over placement region just matches card
It closes, is convenient for nozzle glue spraying operation.Same glue spraying region can once place single PCBA board, can also place multiple PCBA boards.
In the case where multiple PCBA boards are placed simultaneously, can be placed in placement region in the form of tiling.
In the present embodiment, manipulator, the conveyer belt transmission PCBA board that sealing equipment may be used, for example, passing through biography
Send band according to production line form by PCBA board be sent on workbench or conveyer belt carrying PCBA board be moved to precalculated position
Carry out glue spraying (at this point, conveyer belt is also used as workbench simultaneously).Certainly, the form manually placed can also be used in this step
PCBA board is placed into placement region.
In a specific embodiment, to avoid colloid from spraying to the shadow of caused irregular movement in PCBA board
It rings, the PCBA board sealed in unit includes：Operation console 6 for placing PCBA board；Material spray for being sprayed to the PCBA board
Device 1；The feeding device being connected with the material-spraying device 1, the feeding device can be to 1 transferring raw materials of the material-spraying device；
The driving device being connect with the material-spraying device 1 can drive the material-spraying device 1 to move；And with the material-spraying device 1 one
Synkinematic solidification equipment 3.The material-spraying device 1 can be injected in the solidification of the sizing material in the PCBA board by the solidification equipment 3.
Solidification equipment 3 can be fixed on material-spraying device 1, to be moved together with material-spraying device 1.Specifically, solidification dress
Setting 3 can be fixed together by connecting shaft 2 and material-spraying device 1.Wherein, the solidification equipment 3 is sprayed in the material-spraying device 1
While cured.When material-spraying device 1 moves through the sprayed surface of PCBA board, spray layers are formed in sprayed surface, with
This simultaneously, solidification equipment 3 cures the spray layers, avoid spray layers flowing caused by influence.
Cure for the sizing material (or three-proofing coating) after making solidification equipment 3 spray material-spraying device 1, the solidification dress
It sets 3 and is set to the material-spraying device 1 back to the side of direction of advance.That is, solidification equipment 3 is fixed on the rear side of material-spraying device 1,
It is sprayed correspondingly, material-spraying device 1 discharges in front, the solidification equipment 3 at rear is servo-actuated and cures the sizing material in PCBA board, avoids
Irregular flow effect package quality.
In the present embodiment, the solidification equipment 3 may include the light irradiation being fixedly connected on the material-spraying device 1
Source.The feeding device can supply light-cured resin to the material-spraying device 1.Wherein, light-cured resin can be UV glue.Illumination
The source of penetrating can be ultraviolet light source, Infrared irradiation source etc., and the utility model is not restricted, can be in service condition
Corresponding light irradiation source is selected according to used UV glue.
Further, the direction of illumination of the solidification equipment 3 deviates the injection direction of the material-spraying device 1.As shown in Figure 1, Figure 2
Shown, for the material-spraying device 1 of 2 both ends of connecting shaft connection with solidification equipment 3 there are certain angle of inclination, solidification fills 3 (can be slightly)
Vertical direction is favoured, makes ultraviolet light (or other solidification light) that material-spraying device 1 can not be irradiated to, avoids sizing material in material-spraying device 1
Discharge port 19 be cured.In this embodiment, solidification equipment 3 can also (can be slightly) be less than material-spraying device 1, reduce solid
Change light to spread near material-spraying device 1, equally plays the role of that material-spraying device 1 is protected smoothly to discharge.
In this embodiment, to avoid reflected light from curing the sizing material of material-spraying device 1, solving reflected light makes material-spraying device
1 the problem of can not be successfully discharging, was also provided with antireflection portion on the operation console 6, and the antireflection portion can prevent described
The light of light irradiation source transmitting forms reflection.Wherein, the antireflection portion includes the light-absorbing coating of 6 surface of operation console coating.Pass through
The light quantity of reflection is preferably minimized by light-absorbing coating, is blocked with preventing material-spraying device 1 from being cured by sizing material to the maximum extent, is ensured smooth
Discharging spraying.
Please continue to refer to Fig. 1, in embodiments, driving device drive material-spraying device 1 according to control device control into
Action is made.Specifically, the driving device includes the first motion 5, the drive that the driving material-spraying device 1 is moved along first axle
The second motion 4 that the dynamic material-spraying device 1 is moved along the second axis；The first axle and second axis are perpendicular, and
It is parallel with the operation console 6.Wherein, first axle can be considered as X-axis, and the second axis is considered as Y-axis, that is, 5 He of the first motion
Second motion 4 can make material-spraying device 1 be transported along the direction parallel with horizontal plane (operation console 6 is generally parallel with horizontal plane)
It is dynamic.
Specifically, the first motion 5 can be placed on the second motion 4, can be driven by the first motion 5
Material-spraying device 1 and solidification equipment 3 need moving freely for the second axis direction of completion on the second motion 4 according to spraying.The
One motion 5 and the second motion 4 can be equipped with corresponding X-axis guide rail and Y-axis guide rail, realize corresponding axial movement.
Further, the driving device further includes the driving material-spraying device 1 and/or the operation console 6 along third axis
The third motion (not shown) of movement；The third axis and the first axle, second axis are perpendicular.The control dress
It sets the distance between sprayed surface that can control the material-spraying device 1 and the PCBA board by the driving device and keeps permanent
It is fixed.
In this embodiment, third axis vertically can realize material-spraying device 1 along perpendicular by third motion
Histogram to movement.For third motion by that can have guide rail mechanism, which can be by driving about 6 operation console
It is mobile, so that PCBA board is moved up and down relative to material-spraying device 1, material-spraying device 1 can also be directly acted on so that material spray
Device 1 is moved up and down relative to PCBA board.
In the present embodiment, control device (not shown) can control the mobile road of material-spraying device 1 by driving device
Diameter carries out spraying encapsulation hence for desired packaging area in PCBA board.Wherein, control device can have hardware, such as
CPU, controller, microcontroller, PLC, programmable circuit plate etc., or the combination of software and hardware, the application do not make
Any restrictions.Control device can control movement speed when material-spraying device 1 moves.Wherein, to improve ejection efficiency, material spray fills
It sets different with the movement speed under non-operating mode in the operational mode.Specifically, control device can control the material spray dress
Set 1 movement speed when executing movement speed when spraying and not executing spraying less than material-spraying device 1.For example, material-spraying device exists
When resetting material-spraying device 1 after spraying, so that material-spraying device is resetted with faster speed and withdraw.
In the present embodiment, which can be imported by the geometric & physical property mould of material spray object (PCBA board)
Type (is specifically as follows encapsulation three-dimensional model), and can join according to predetermined spraying to object control material-spraying device 1 according to the model
Number spraying.Wherein, spray parameters may include spraying rate, spraying direction, at least one of glue laminated power, movement speed.
Control device is built with the three-dimensional system of coordinate for having mapping relations with operation console 6, and is established in three-dimensional system of coordinate
The encapsulation three-dimensional model of PCBA board.Wherein, the control device can be according to the encapsulation of the encapsulation three-dimensional model of the PCBA board
Surface coordinate determines the position of the material-spraying device 1.
In this embodiment, it can choose or specify packaging area or encapsulating sheet according to the encapsulation three-dimensional model of PCBA board
Face, and it is located at the true packaging area of PCBA board in true coordinate system on respective operations platform 6.Material-spraying device 1 is according to above-mentioned mapping
Relationship the three-dimensional system of coordinate have mapping point, according to the mapping point with encapsulation three-dimensional model package surface coordinate it
Between position relationship determine the position of material-spraying device 1.Further, to realize that fining sprays, each discharging unit 18 also may be used
To have corresponding mapping point in three-dimensional system of coordinate, to control each discharging according to the spraying situation of corresponding coordinate points
The discharging of unit 18.
As shown in Fig. 5, Fig. 6, Fig. 7, the equal surface mount elements with larger area of chip module 13 in PCBA board 14, and should
A large amount of exposed pin 13b are distributed with there are certain difference in height and around with other components for surface mount elements.For for the core
The equal predetermined elements of piece module 13 carry out effective packaging protection, are surrounded by establishing box dam 15, then fill and lead up completion effectively
Encapsulation.The box dam 15 all encloses the predetermined element and its pin 13b into wherein.
More in view of encapsulating the glue amount that the equal predetermined elements of the chip module 13 need, it is extra to avoid once generating to glue
Irregular flowing, to by the way of first constructing box dam 15 and filling and leading up again, the physical attribute of colloid itself be avoided to cause it that can not advise
Then flow.Box dam 15 is adapted to the shape of component.
Wherein, construct and fill and lead up can be with above-mentioned material-spraying device 1 for the box dam 15 of the predetermined elements such as chip module 13.Another
In embodiment, which can also include dispensing nozzle (not shown).The control device can control described
Material-spraying device 1 forms box dam 15 around 14 predetermined element of the PCBA board.The dispensing nozzle can be by the box dam 15
It fills and leads up.Dispensing nozzle can have single discharge port 19, be carried out to glue after being directed at the interior zone 17 of box dam 15 until filling and leading up i.e.
Can, shown in the packaging effect Fig. 6 for filling and leading up the formation of rear sizing material 16.
Please continue to refer to Fig. 1, in present embodiment, feeding device uninterruptedly can supply sizing material to material-spraying device in real time
(three proofings raw materials for varnish, ink can also be supplied).The feeding device includes for celluloid ink box 8 and pressure supply print cartridge 11.It is described for celluloid ink box 8
One end connects gumming pump 7 by first for sebific duct, and the other end is by second for sebific duct 9b connections material-spraying device 1.The pressure supply ink
For 11 one end of box by first for pressure pipe 12a connections pulsometer 10, the other end is described for celluloid ink box for pressure pipe 12b connections by second
8。
Wherein, by providing raw material (UV glue, three-proofing coating etc.) to for celluloid ink box 8 for sebific duct, pulsometer 10 passes through gumming pump 7
Atmospheric pressure is provided to pressure supply print cartridge 11 for pressure pipe, atmospheric pressure again by being conducted to for celluloid ink box by pressure supply print cartridge 11 for pressure pipe
8, by squeezing into the discharging unit 18 of material-spraying device 1 for sebific duct, material list will be gone out to material-spraying device 1 for the raw material in celluloid ink box 8
Member 18 provides the raw material needed for spraying.
Multiple discharging units 18 can share same discharge port 19 in material-spraying device 1, pass through above-mentioned electromagnetism check valve
Open and close control realizes the independent discharging of single discharging unit 18.In addition, multiple discharging units 18 can also be each by for sebific duct
It is connected to described for celluloid ink box 8, feeding device realizes the independent discharging of each discharging unit 18 by controlling the break-make for sebific duct.
The feeding device can connect the control device, to realize that the feed to feeding device controls.
Refering to Fig. 5, Fig. 6, Fig. 7.A kind of PCBA board packaging method is also provided in the application embodiment, this can use but
The PCBA board sealed in unit being not limited in the above embodiment.Specifically, the PCBA board packaging method includes the following steps：
S1, PCBA board 14 is positioned on operation console 6；
In step S1, operation console 6 places PCBA board 14 for accepting, and has placement region, the placement on operation console 6
Region can be corresponding with the three-dimensional system of coordinate of control device, starts spraying encapsulation when PCBA board 14 is located at placement region and makees
Industry.Placement region can be wear surface or the space of workbench, or the part surface of workbench, shape can be
Rectangular area, square region or other regular shapes, certain irregular shape can also be applied, and the application is not restricted.It puts
Setting the shape in region can also match with the shape of PCBA board 14, and then when PCBA board 14 is positioned over placement region just
With engaging, it is convenient for nozzle glue spraying operation.Same glue spraying region can once place single PCBA board 14, can also place multiple
PCBA board 14.In the case where multiple PCBA boards 14 are placed simultaneously, can be placed in placement region in the form of tiling.
In the present embodiment, manipulator, the conveyer belt transmission PCBA board 14 that sealing equipment may be used, for example, passing through
Conveyer belt according to production line form by PCBA board 14 be sent on workbench or conveyer belt carrying PCBA board 14 be moved to it is pre-
Positioning, which is set, carries out glue spraying (at this point, conveyer belt is simultaneously also as workbench).Certainly, artificial place can also be used in this step
Form PCBA board 14 is placed into placement region.
S2, the encapsulation three-dimensional model that the PCBA board 14 is established in three-dimensional system of coordinate；
Sealing equipment itself can have virtual three-dimensional system of coordinate, the three-dimensional system of coordinate and showing where material-spraying device 1
Real coordinate system (being referred to as true coordinate system) is corresponding, and material-spraying device 1 has corresponding reflect in the three-dimensional system of coordinate
Coordinate is penetrated, material spray can be adjusted by mobile by the correspondence of the mapping point and three-dimensional system of coordinate and real coordinate system
The position of device 1, and then PCBA board 14 is sprayed according to desired guiding trajectory.
Material-spraying device 1 carries out glue spraying according to predetermined glue spraying route (desired guiding trajectory) to PCBA board 14, and predetermined glue spraying route can
Think " S " or " N " shape route or glue spraying is carried out with circular trace route at the center of PCBA board 14 and incrementally increases circle
The radius of shape track, it is, of course, also possible to carry out glue spraying according to broken line form.As can be seen that the predetermined glue spraying route can have
There are many forms, only need that sealing can be completed in the present embodiment.Certainly, to improve packaging efficiency, material-spraying device 1 can
To select optimal spraying path according to time most short principle.
In step S2, by establishing the PCBA board in three-dimensional system of coordinate to the scanning of PCBA board 14 of operation console 6
14 encapsulation three-dimensional model.
PCBA board sealed in unit may be fitted with scan camera shooting head or other scanning devices, by being scanned to PCBA board 14
Obtain the 3D packaging models of PCBA board 14.The package surface (packaging area) of the encapsulation three-dimensional model has in three-dimensional system of coordinate
Respective coordinate, and there is corresponding true mapping point in true coordinate system.In step S2, three-dimensional model is encapsulated
The forms such as input can also be drawn by three-dimensional software by establishing.
It is 3D packaging models that the PCBA board packaging method, which encapsulates the object referenced by PCBA board 14, rather than areal model journey
Sequence.By the encapsulation three-dimensional model of PCBA board 14, with the electronics member device for possessing stereochemical structure in corresponding three-dimensional PCBA board 14
Part, and then complete coating encapsulation.
S3, the material-spraying device 1 is controlled according to the encapsulation three-dimensional model of the PCBA board 14 to the spraying of the PCBA board 14.
It continues from the preceding paragraph description, material-spraying device 1 has corresponding mapping point in the three-dimensional system of coordinate, is reflected by described
The correspondence for penetrating coordinate and three-dimensional system of coordinate and real coordinate system can be by the mobile position for adjusting material-spraying device 1, in turn
PCBA board 14 is sprayed according to desired guiding trajectory.
In step S3, the material spray is determined according to the package surface coordinate of the encapsulation three-dimensional model of the PCBA board 14
The position of device 1.Wherein, in spraying process, the distance between the sprayed surface of the material-spraying device 1 and the PCBA board 14
It keeps constant.Schematic quality is exemplified as：The height of two neighboring surface mount elements in PCBA board 14 is different, is pasted to this two
When piece element is sprayed, material-spraying device 1 is remained unchanged relative to the distance of the top surface of two surface mount elements, to obtain compared with
Good spraying packaging effect.
In step S3, spraying encapsulation every time has identical starting point to be resetted, and then positions coordinates of targets point
Position.Wherein, reduction point can by importing encapsulate three-dimensional model origin, reduction point equally can be starting point.Meanwhile
For encapsulating the component of different electronics, the position of material-spraying device 1 and angle also change correspondingly.In view of encapsulating material needs one
Fixed thickness to obtain preferable packaging effect, and easy tos produce irregular when if disposably reaching the glue amount of required thickness
Flowing, cause packaging effect very poor.To avoid the problem, in step S3, the material-spraying device 1 holds same position
Row repeatedly spraying；Cured while spraying every time.
Material-spraying device 1 to make executes repeatedly spraying to same position, and material-spraying device 1 can be according to pre- in packaging area
If path walking is multiple, often walk according to preset path primary, material-spraying device 1 then completes the primary spraying of packaging area, accordingly
One layer of encapsulation performed to packaging area, and the solidification of this layer encapsulation；Then, material-spraying device 1 is according still further to preset path row
It walks once, material-spraying device 1 then completes the secondary spraying of packaging area, completes two layers of encapsulation to packaging area accordingly, and should
The solidification of layer encapsulation, until obtaining the encapsulation of target thickness.It so not only may be implemented to prevent the irregular flowing of sizing material from causing
The problem of packaging effect difference, additionally it is possible to realize precise controlling coating thickness, ensure target envelope effect.It is right in step S3
The packaging area of the PCBA board 14 carries out multilayer spraying, and successively cures.
In view of the general thickness of encapsulation is smaller, required package thickness only need to be reached, and then in step S3, it is right
In same position, relative position of the material-spraying device 1 in multiple spraying process is constant.That is, for same position, material spray
Mapping point of the device 1 in multiple spraying process does not change.Material-spraying device 1 is right during multi-injection coating
It can change in the height of the package surface of same position.For example, after material-spraying device 1 often executes one layer of spraying coating, hold
Row raises the height of material-spraying device 1 when spraying next time, the height raised can be the height of one layer of coating.
In a feasible embodiment, the PCBA board packaging method provided in the application embodiment includes following step
Suddenly：It is sprayed around 14 predetermined element of the PCBA board using material-spraying device 1 and solidification equipment 3 and repeatedly forms box dam 15；
The curing of coatings for forming this time spraying while each spraying；Then, it is filled and led up to 15 inside glue spraying of box dam.
In this embodiment it is possible to be filled and led up to 17 glue spraying of inside of box dam 15 by material-spraying device 1, dispensing can also be passed through
Nozzle carries out dispensing filling.In addition, when execution is filled and led up, multilayer can also be sprayed to the inside 17 of box dam 15 and filled and led up, and
Cured using above-mentioned solidification equipment 3 while spraying.
Below by box dam 15 is described in detail for 13 packaging method of chip module in a specific embodiment and fills out
Flat operation, and then more fully understand the application：
(1) electronic circuit board 14 ((namely PCBA board 14)) is placed under room temperature, is led by control device (such as host computer)
Enter and encapsulate three-dimensional model, control device needs to control material-spraying device 1 in the second shaft movement mechanism and first axle movement according to spraying
The movement of spraying route is completed under the co-operating of mechanism.
As shown in figure 3, being sprayed around chip module 13 in PCBA board 14 (being referred to as electronic circuit board 14)
15 figure of first layer UV glue box dam, in spraying process, solidification equipment 3 is in the open state, that is, sprays the layer and cure the layer immediately,
Prevent the random flowing of UV glue.Every layer of spraying height is about 0.008m, and spraying width is according to encapsulation component size shape
It is adjustable to be not fixed, meet the arbitrariness of chip 13a.Because be while spraying while cure, every layer of spray time add hardening time according to
The complexity of required encapsulation image is controlled in 10s-50s.15 height of box dam is general slightly higher not less than chip 13a height itself
In chip 0.5mm-1mm.
(2) complete first layer injection spraying and solidification after, can accurately be declined by third motion one at
Type thickness height, about 0.008mm.
(3) according to step (1) method, on the basis of first layer UV glue 15 figures of box dam being cured, the second layer is sprayed
15 figure of UV glue box dam, in spraying process, solidification equipment 3 makes cured 15 figure of second layer UV glue box dam still in opening state
Shape, which is firmly attached, to be stacked in preceding layer.
(3) the step of repeating (1)~(3), so successively sprays and successively cures, it is equal often to form one layer of new 15 figure of box dam
Attachment is stacked to preceding layer, until spraying to form the envelope that height is slightly above chip 13a around the chip module 13 of required encapsulation
3D solid glue box dam 15 is filled, all chip 13a pins 13b and chip 13a are enclosed into solidification equipment 3 wherein, is turned off, are stopped
The formation of box dam 15.
(4) after box dam 15 is completed, UV solidification equipments 3 are closed, 15 inside of UV glue box dam are sprayed again, using not
Cured UV glue materials itself have the physical attribute of mobility, are effectively filled between chip module 13 and box dam 15,
Chip 13a and chip 13a pins 13b are completely submerged in uncured UV glue；
(5) after the completion of step (4), UV solidification equipments 3 are opened, by PCBA board 14 and filled chip module 13 thereon
Cured under solidification equipment 3 again, hardening time is about 0.5s-3s.
UV solidification equipments 3 are in normally open in above-mentioned steps (1)~(3)；Solidification equipment 3 may be in step (4)
Normally off；Above process chips module 13 and PCBA board 14 may be at normal temperature state.
In conclusion
1, the packaging method of box dam-filling in the PCBA board packaging method provided in the application embodiment, by chip
Effectively encapsulation is wrapped in inside UV glue 13a and pin 13b, and effectively solution three-proofing coating spraying hair is also easy to produce component lower part and does not cover
Lid, the lower ends pin 13b cannot effectively encapsulate exposed phenomenon；Close printing stacks molding together in layer simultaneously, overcomes
Easy air entrainment in three-proofing coating spraying encapsulation process, causes encapsulation is internal the defects of bubble, in uneven thickness occur.
Present embodiment has preferable encapsulation consistency, and encapsulation interface is clear, and encapsulation is well arranged, effectively solves three
Irregularly spraying causes selectivity and the relatively low waste of material brought of precision, packaging effect difference to ask to range in anti-paint spray coating method
Topic, reduces production cost, improves product quality.
2, the PCBA board packaging method provided in the application embodiment is packaged using UV glue, and curing rate is fast, gram
It has taken three-proofing coating material solidification tedious process, the characteristics of slow curing, has further increased packaging efficiency, shorten the encapsulation period.
3, in the PCBA board packaging method provided in the application embodiment, according to encapsulation in 15 step of box dam of encapsulation
The method that three-dimensional model successively sprays stacking, 15 interface of box dam is clear, and harmony of lines is good, and has and consolidate in printing
The advantages of change, bottom printing complete just cured, stronger is bonded on substrate, overcome 15 bottom of existing box dam with
Easy air entrainment causes the disadvantage for combining dynamics low in circuit board substrate adhesion process.
Using in spraying cured mode can effectively avoid the excessive glue occurred during dispensing box dam 15, dispensing is disconnected
Continuous, the shortcomings of wire drawing, and the solidification equipment 3 that nozzle connects after the completion of filler step is opened, and can be completed in package platforms
Final curing encapsulates, and solidifying need to be put into better than the chip module 13 after the completion of filler step in 15 method of existing box dam by having
The characteristics of solidification could be completed in stove, reduces equipment input cost, shortens the production cycle, improve the quality of production.
4, present embodiment packaging method is better than 13 packaging method of existing chip module, and encapsulation regulation is wanted without distinct temperature
It asks, is not necessarily to change temperature repeatedly in the process, have the advantages that, without refrigeration and heating device, to reduce equipment input cost, increase
Benefit is added.
Herein cited any digital value all include between lower limiting value to upper limit value with the lower value of an incremented and
The all values of upper value, there are the intervals of at least two units between any lower value and any much higher value.For example, such as
Fruit elaborates that the quantity of component or the value of process variable (such as temperature, pressure, time etc.) are from 1 to 90, preferably from 20
To 80, more preferably from 30 to 70, then purpose is arrived in order to illustrate also clearly listing such as 15 to 85,22 in the specification
68,43 to 51,30 to 32 is equivalent.For the value less than 1, suitably think that a unit is 0.0001,0.001,0.01,0.1.
These are only intended to the example clearly expressed, it is believed that the numerical value enumerated between minimum and peak is possible to
Combination is all expressly set forth in the specification in a similar manner.
Unless otherwise indicated, all ranges all include all numbers between endpoint and endpoint.It is used together with range
" about " or " approximation " be suitable for two endpoints of the range.Thus, " about 20 to 30 " are intended to covering " about 20 to about
30 ", including at least the endpoint indicated.
All articles and reference disclosed, including patent application and publication, for various purposes by quoting knot
Together in this.The term " substantially by ... constitute " for describing combination should include identified element, ingredient, component or step and reality
Other elements, ingredient, component or the step of the basic novel feature of the combination are not influenced in matter.Using term "comprising" or
" comprising " describes the combination of element here, ingredient, component or step it is also contemplated that substantially by these elements, ingredient, component
Or the embodiment that step is constituted.Here by using term " can with ", it is intended to illustrate that " can with " includes described any
Attribute is all optional.
Multiple element, ingredient, component or step can be provided by single integrated component, ingredient, component or step.Optionally
Ground, single integrated component, ingredient, component or step can be divided into multiple element, ingredient, component or the step of separation.It is used for
The open "a" or "an" for describing element, ingredient, component or step is not said to exclude other elements, ingredient, component
Or step.
It should be understood that above description is to illustrate rather than to be limited.By reading above-mentioned retouch
It states, many embodiments and many applications except the example provided all will be aobvious and easy for a person skilled in the art
See.Therefore, the range of this introduction should not be determined with reference to foregoing description, but should with reference to appended claims and this
The full scope of the equivalent that a little claims are possessed determines.For comprehensive purpose, all articles and with reference to including special
The disclosure of profit application and bulletin is all by reference to being incorporated herein.Theme disclosed herein is omitted in preceding claims
Any aspect is not intended to abandon the body matter, also should not be considered as inventor the theme is not thought of as it is disclosed
A part for utility model theme.
Claims (10)
1. a kind of PCBA board sealed in unit, which is characterized in that including：
Operation console for placing PCBA board；
Material-spraying device for being sprayed to the PCBA board；
With one synkinematic solidification equipment of the material-spraying device；The material-spraying device can be injected in described by the solidification equipment
Sizing material solidification in PCBA board；
The feeding device being connected with the material-spraying device, the feeding device can be to the material-spraying device transferring raw materials；
The driving device being connect with the material-spraying device can drive the material-spraying device to move.
2. PCBA board sealed in unit as described in claim 1, which is characterized in that the solidification equipment is sprayed in the material-spraying device
Cured while painting.
3. PCBA board sealed in unit as described in claim 1, which is characterized in that the solidification equipment is set to the material spray dress
Set the side back to direction of advance.
4. PCBA board sealed in unit as described in claim 1, which is characterized in that the solidification equipment includes being fixedly connected on institute
State the light irradiation source on material-spraying device；The feeding device can supply light-cured resin to the material-spraying device.
5. PCBA board sealed in unit as described in claim 1, which is characterized in that the direction of illumination of the solidification equipment deviates institute
State the injection direction of material-spraying device.
6. PCBA board sealed in unit as claimed in claim 4, which is characterized in that antireflection portion is additionally provided on the operation console,
The antireflection portion can prevent the light of the smooth irradiation source transmitting from forming reflection.
7. PCBA board sealed in unit as claimed in claim 6, which is characterized in that the antireflection portion includes that operation console surface applies
The light-absorbing coating covered.
8. PCBA board sealed in unit as described in claim 1, which is characterized in that the material-spraying device moves together with multiple
Discharging unit；At least one discharging unit can be sprayed independently.
9. PCBA board sealed in unit as claimed in claim 8, which is characterized in that each discharging unit can independently spray
It applies.
10. PCBA board sealed in unit as described in claim 1, which is characterized in that the feeding device include for celluloid ink box and
Pressure supply print cartridge；Described to connect gumming pump for sebific duct by first for celluloid ink box one end, the other end, which is connected by second for sebific duct, to be sprayed
Expect device；Pressure supply print cartridge one end connects pulsometer by first for pressure pipe, and the other end is by second for described in pressure pipe connection
For celluloid ink box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820476605.1U CN208079516U (en) | 2018-04-04 | 2018-04-04 | PCBA board sealed in unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820476605.1U CN208079516U (en) | 2018-04-04 | 2018-04-04 | PCBA board sealed in unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208079516U true CN208079516U (en) | 2018-11-09 |
Family
ID=64043284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820476605.1U Active CN208079516U (en) | 2018-04-04 | 2018-04-04 | PCBA board sealed in unit |
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| Country | Link |
|---|---|
| CN (1) | CN208079516U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113993295A (en) * | 2021-10-13 | 2022-01-28 | 苏州康尼格电子科技股份有限公司 | PCBA board encapsulation UV glue solution and shower nozzle suitable for piezoelectric array shower nozzle |
-
2018
- 2018-04-04 CN CN201820476605.1U patent/CN208079516U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113993295A (en) * | 2021-10-13 | 2022-01-28 | 苏州康尼格电子科技股份有限公司 | PCBA board encapsulation UV glue solution and shower nozzle suitable for piezoelectric array shower nozzle |
| CN114025505A (en) * | 2021-10-13 | 2022-02-08 | 苏州康尼格电子科技股份有限公司 | Packaging method and packaging equipment for PCBA (printed circuit board assembly) |
| CN113993295B (en) * | 2021-10-13 | 2023-04-25 | 苏州康尼格电子科技股份有限公司 | PCBA board packaging equipment |
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