CN203750775U - Dispensing device - Google Patents
Dispensing device Download PDFInfo
- Publication number
- CN203750775U CN203750775U CN201420022283.5U CN201420022283U CN203750775U CN 203750775 U CN203750775 U CN 203750775U CN 201420022283 U CN201420022283 U CN 201420022283U CN 203750775 U CN203750775 U CN 203750775U
- Authority
- CN
- China
- Prior art keywords
- glue
- dripping head
- module
- sets
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003292 glue Substances 0.000 claims abstract description 152
- 235000012431 wafers Nutrition 0.000 claims description 40
- 238000002347 injection Methods 0.000 claims description 36
- 239000007924 injection Substances 0.000 claims description 36
- 239000007921 spray Substances 0.000 claims description 23
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 13
- 238000012795 verification Methods 0.000 claims description 9
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract 3
- 229920005989 resin Polymers 0.000 abstract 3
- 238000005507 spraying Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000084 colloidal system Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000000994 depressogenic effect Effects 0.000 description 4
- 230000001174 ascending effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Abstract
The utility model discloses a dispensing device for dispensing a machined part with a plurality of to-be-glued parts, wherein the dispensing device comprises a bearing platform, a camera module, a jet dispensing head, and a mobile module, wherein the bearing platform is used for bearing a machined part; the jet dispensing head jets a plurality of resin droplets towards the plurality of to-be-glued parts of the machined part along the horizontal direction; the camera module comprises an overlook lens which is arranged above the machined part and retrieves horizontal position information of the plurality of to-be-glued parts, and a side-looking lens arranged at the side of the machined part for retrieving the vertical position information of these glued parts; the mobile module moves according to these position information at the to-be-glued parts and lifts the jet dispensing head; these resin droplets are jet to the to-be-glued parts of the jet dispensing head. The dispensing device disclosed by the utility model horizontally jets the resin droplets and is matched with the mobile module, the to-be-glued part applicable to the machined part is arranged at the side of the machined part, and the gluing quality, including the droplet position accuracy and the glue accuracy still can be ensured.
Description
Technical field
The utility model is to provide a kind of point glue equipment, refer to especially a kind of device that sprays Glue dripping head that has, in order to treat that for having the workpiece at gummed place provides the glue of adhesive to drip, the program of gluing together for workpiece, what be particularly applicable to horizontal shape treats gummed place.
Background technology
The normally vertical mode of the Glue dripping head of existing point glue equipment is furnished, the course of work is first to drive Glue dripping head vertically to move by power set, in the time that Glue dripping head moves to the height of processing work point glue position, power set stop driving described Glue dripping head vertically to move.Then, drive unit drives Glue dripping head to move along horizontal direction again, in the time that Glue dripping head moves to contact workpiece, and Glue dripping head plastic emitting, thus complete a glue process.
Owing to controlling the lowering or hoisting gear that moves of Glue dripping head and can only raise from vertical direction the position of whole Glue dripping head, the control of Glue dripping head position is restricted, can not be to a glue position Accurate Points glue, also affect the quality of some glue.Thereby make existing point gum machine inconvenient operation and inefficiency.Therefore some existing point glue equipment tilts to put by Glue dripping head, for improving the quality of some glue.
But for the state of forward side point glue, above-mentioned two kinds of point glue equipments remain inapplicable.The solid that is particularly directed to manufacture of semiconductor is repeatedly piled encapsulation technology, gummed between some parallel substrate or wafers of repeatedly putting, not only the point glue equipment of vertical mode is inapplicable, and skewed point glue equipment also can only drip by oblique ejection glue, still undesirable in the quality of gummed.Moreover, existing semiconductor technology has utilized wafer (substrate) sub-assembly of three-dimensional joint two wafer of integrating structure dress, it treats that gummed place is horizontal completely, the point glue equipment of vertical mode is inapplicable, skewed point glue equipment slightly deviation just may make adhesive drop on wafer, and impact point glue quality is even damaged sets of wafers component.
Utility model content
The purpose of this utility model is to solve the shortcoming of above-mentioned traditional point gum machine, for having the workpiece for the treatment of gummed place that is positioned at side, no matter treat whether gummed place is positioned on same level line, or whether has depression or outstanding situation, still can guarantee a glue quality.
The utility model is applicable to integrating with solid wafer (substrate) sub-assembly of the wafer joining technique of structure dress, and it treats that gummed place is horizontal completely, comprises groove or flat limit, still can keep its gummed quality.
Described above for reaching, the utility model provides a kind of point glue equipment, has multiple workpieces for the treatment of gummed place carry out a glue towards one, and this point glue equipment comprises that a carrying platform is in order to carry above-mentioned workpiece; One camera module comprises being located at this workpiece top and capturing those camera lenses and one of overlooking for the treatment of gummed place horizontal level information and is placed in the side of this workpiece and the side-looking camera lens of contiguous this injection Glue dripping head, this side-looking camera lens capture those this treat gummed place upright position information; One sprays Glue dripping head treats that towards those of this workpiece gummed place along continuous straight runs sprays multiple glue and drips; And one move module, according to above-mentioned those location informations for the treatment of gummed place, mobile and this injection Glue dripping head of lifting, drips by those glue those that be injected into this injection Glue dripping head and treats gummed place.
The utility model at least has advantages of following: point glue equipment of the present utility model drips by horizontal-jet glue, and coordinate mobile module, the gummed place that treats that is applicable to workpiece is the side that is positioned at workpiece, still guarantees the quality of gummed, comprises the accuracy of droplet positions precision and glue amount.
Above about the explanation of the utility model content and the explanation of following embodiment in order to give an example and to explain principle of the present utility model, and provide patent claim of the present utility model further to explain.
Brief description of the drawings
Fig. 1 is the three-dimensional exploded view of point glue equipment of the present utility model.
The partial enlarged drawing that Fig. 2, Fig. 2 A and Fig. 3 are point glue equipment of the present utility model.
The side view that Fig. 4, Fig. 5, Fig. 6 are point glue equipment of the present utility model.
Fig. 4 A is the partial perspective view that point glue equipment of the present utility model removes workpiece.
Fig. 5 A is the enlarged drawing of the 5A part of Fig. 5.
Wherein, description of reference numerals is as follows:
Point glue equipment 100
Workpiece 9
Treat gummed place 90
Groove 92
Base 10
Man-machine interface module 12
Display 121
Keyboard 122
Slide-mouse 123
Carrying platform 20
Rotary support seat 21
Guide posts 22
Optical alignment unit 23
Camera module 30
Overlook camera lens 31
Side-looking camera lens 32
Spray Glue dripping head 40
Nozzle 42
Colloid ascending pipe 44
By-pass valve control 45
Main cavity 46
Stroke adjusting knob 48
Set up pedestal 49
Mobile module 50
Track 51
Sliding seat 52
The first motor 53
Adapter 54
The second motor 56
Solidify module 60
Solidify energy element 61
Support body 62
Shielding cell 63
Weight verification module 70
Clean module 80
Examination spray plate 82
Path G
Detailed description of the invention
Described embodiment mentions quantity or its fellow below, and unless otherwise mentioned, otherwise the application category of this creation should not be subject to its quantity or its fellow's restriction.The direction term that the utility model is mentioned, for example: left and right, front or rear etc., be only the direction with reference to accompanying drawing, be to be not used for limiting the utility model for explanation.
Please refer to Fig. 1 to Fig. 3, is stereogram and the partial enlarged drawing thereof of point glue equipment of the present utility model.The utility model provides a kind of point glue equipment 100, have multiple workpieces 9 for the treatment of gummed place 90 towards one and carry out a glue, this point glue equipment 100 comprises that a base 10, a carrying platform 20, a camera module 30, spray Glue dripping head 40, and move module 50, and solidify module 60, a weight verification module 70 and a clean module 80.
Base 10 main bodys are in order to holding electronic control device and power-equipment (figure slightly) and carry said elements.One side of base 10 is provided with a man-machine interface module 12.Man-machine interface module 12 comprises display 121, keyboard 122 and slide-mouse 123, but is not restricted to this.It can be also for example touch-control screen.
Carrying platform 20 is in order to carry above-mentioned workpiece 9, and preferably can rotate above-mentioned workpiece 9 to coordinate above-mentioned injection Glue dripping head 40.The application of the point glue equipment of the present embodiment is the sets of wafers component that contains two chip bonding wafers using as workpiece 9, and coordinates the needs of sets of wafers component, describes the various element arrangements of the present embodiment.But the utility model is not restricted to sets of wafers component, also can be applied to the workpiece that other need to glue together.
Above-mentioned wafer (substrate) engages optics structure dress or three-dimensional IC (3D IC) technology of can be applicable to.Comprise that about wafer joint technology melting engages (Fusion Bonding), metal heat pressing joint (MetalThermal Compression Bonding), polymer sticks together joint (Polymer AdhesiveBonding) and special eutectic joint etc.Owing to being not technical essential of the present utility model, do not repeated.After joint, the gap of wafer periphery need to be glued together, and comprises groove (notch) or flat limit (Flat) of wafer.
Coordinate sets of wafers component, this carrying platform 20 of the present embodiment is a prealigner (pre-aligner), prealigner is in order to proofread and to locate this sets of wafers component in correct Working position, by the non-contact measurement of the eccentricity of substrate placement and the accuracy of direction, the position error causing to overcome the vibration in transmitting procedure are provided.The operation of prealigner, comprises the measurement of wafer displacement, the orientation of the calculating of necessary repair and groove (or flat limit) and required angle.The upstream of prealigner can coordinate a wafer conveyer (wafer handler delivers) to transmit sets of wafers component to be processed, and can coordinate suitable communications protocol, and being connected in series different boards becomes production line mutually to obtain information.
Refer to Fig. 4 and Fig. 4 A, the side view that Fig. 4 is point glue equipment of the present utility model; Fig. 4 A is the partial perspective view that point glue equipment of the present utility model removes workpiece.The prealigner (carrying platform 20) of the present embodiment comprises a support and rotates the rotary support seat 21 of above-mentioned sets of wafers component (workpiece 9), bottom surface and that several guide posts 22 is connected to above-mentioned sets of wafers component the optical alignment unit 23 that is placed in above-mentioned sets of wafers component edge.
Above-mentioned camera module 30, in order to capture and to record the above-mentioned profile for the treatment of gummed place 90, then reaches this profile the reference of electronic processing unit for subsequent control injection Glue dripping head 40.Wherein this camera module 30 comprises and overlooks camera lens 31 and a side-looking camera lens 32, this overlooks camera lens 31 and is located at the top of this workpiece 9, treat gummed place horizontal level information in order to capture those, this side-looking camera lens 32 is placed in side and contiguous this injection Glue dripping head 40 of this workpiece 9, in order to capture those this treat gummed place upright position information.
Refer to Fig. 2 A, spray Glue dripping head 40 and treat that towards those of this workpiece 9 gummed place 90 along continuous straight runs spray multiple glue and drip.Spraying Glue dripping head 40 is a kind of contactless injector head, and for adhesive liquid, such as fluid sealant, underfill, ultraviolet glue, surperficial coating material etc., provide at a high speed and controlled the glue in large capacity ground.Spray Glue dripping head 40 and comprise that a nozzle that contains thermal control parts 42, is connected in the colloid ascending pipe 44 at nozzle 42 rears, and is positioned at main cavity 46, one-stroke adjusting knob 48 and a by-pass valve control 45 at nozzle 42 rears.The accommodating element in order to regulate of main cavity 46.Be connected to colloid ascending pipe 44 so that the packing element (figure slightly) of adhesive to be provided about spraying Glue dripping head 40, can be vertically or inclination mode furnish.
Solidify module 60 and drip to solidify (curing) above-mentioned glue, this curing module 60 comprises that one solidifies support body 62 and the contiguous above-mentioned curing energy element 61 of a shielding cell 63 of energy element 61, a fixing above-mentioned curing energy element 61.Solidifying energy element 61 can be light source or the heating of ultraviolet lamp or other curable colloids.The curing energy element 61 of the present embodiment is the circular-arc top that is arranged at base 10 by support body 62, near this carrying platform 20, and be adjacent to workpiece 9 treat gummed place.The present embodiment is arranged at the below of the part periphery of sets of wafers component.A kind of better arrangement of solidifying energy element 61 is to spray the contiguous one end of solidifying energy element 61 of Glue dripping head 40.After sets of wafers component (workpiece 9) gluing, rotated towards the other end by the one end of solidifying energy element 61, make to be solidified through overcuring energy element 61 by the position of a glue adhesive.
Treat gummed place for the circular-arc periphery of sets of wafers component, the above-mentioned injection Glue dripping head 40 of distance is identical distances substantially, can pass through the rotation sets of wafers component (workpiece 9) of carrying platform 20 rules, fixing above-mentioned injection Glue dripping head 40 drips in same position and with same frequency and speed ejection glue.Frequency refers to that, within a set time, the glue of ejaculation drips quantity.Speed refers to that glue drips the initial velocity that leaves injection Glue dripping head 40.These can be controlled by the stroke adjusting knob 48 of above-mentioned injection Glue dripping head 40 and by-pass valve control 45.
Refer to Fig. 5 and Fig. 5 A, for the groove 92 (notch) of sets of wafers component or flat limit (Flat) treat gummed place, be a little away from above-mentioned injection Glue dripping head 40.If glue drips the injection conditions that still remains above-mentioned, will make glue drip and fail in place; Because the outline line of groove is longer than general circular-arc periphery, the density of gummed may not be inconsistent requirement yet in addition.The present embodiment is in response to this kind of situation, further utilize above-mentioned mobile module 50 to move above-mentioned injection Glue dripping head 40 and drip the position of initial ejection to adjust glue, even comprise the injection frequency of adjusting above-mentioned injection Glue dripping head 40, so that on the outline line to be glued together of growing, in the distance being equal to, provide the glue of equal number to drip, make the quality (comprising that glue drips position accuracy and glue metric density) of gummed be same as other circular-arc peripheries.
One of feature of the present utility model is, above-mentioned mobile module 50 is according to the above-mentioned location information for the treatment of gummed place 90 being captured by camera module 30, mobile and this injection Glue dripping head 40 of lifting, drips by those glue those that be injected into this injection Glue dripping head 40 and treats gummed place 90.Thus, can treat gummed place in response to those that coordinate groove slightly far away or standing shape, still drop on correct position so that glue drips.
For example, when gummed place 90 forms when spraying the situation of depressed part of Glue dripping head 40, the utility model is by this injection Glue dripping head 40 that raises, glue is dripped drop in Throwing thing line mode farther so that glue drips the depressed part that still can drop on accurately gummed place 90.Another side, for the depressed part at gummed place 90, spraying Glue dripping head 40 can suitably increase plastic emitting speed, to make still have identical glue amount in the unit length of depressed part.When gummed place 90 along horizontal direction towards spraying Glue dripping head 40 while forming standing shape, spray Glue dripping head 40 and can maintain original position, but there is longer outline line because of the gummed place 90 of standing shape, spraying Glue dripping head 40 can suitably increase plastic emitting speed, to make still have identical glue amount in the unit length at standing shape gummed place 90.
In the present embodiment, be provided with one be connected in that this moves module 50 set up pedestal 49, this side-looking camera lens 32 and this injection Glue dripping head 40 are flatly arranged at this and set up on pedestal 49, this side-looking camera lens 32 is arranged at a side of this injection Glue dripping head 40.
Referring again to Fig. 2 A, the mobile module 50 of the present embodiment comprises that a track 51, is movably located at sliding seat on this track 51 52, and is fixed on the second motor 56 that the first motor 53, an adapter 54 and that is connected in this first motor 53 on this sliding seat 52 connects this adapter 54 and this and set up pedestal 49, wherein this first motor 53 drives these adapters 54 to move along horizontal direction and perpendicular to this track 51, and wherein this second motor 56 drives this to set up pedestal 49 to move along vertical direction.According to the present embodiment, be made as X-axis with the direction of spraying Glue dripping head 40, the direction of track 51 is made as Y-axis, and the vertical moving direction that sets up pedestal 49 is made as Z axis.Thus, the present embodiment can move this along X, Y and Z-direction and sets up pedestal 49 and spray Glue dripping head 40.By move above-mentioned injection Glue dripping head 40 in Z-direction, the injection initial point that the glue that sprays Glue dripping head 40 drips is raised, and with Throwing thing line towards above-mentioned sets of wafers component (workpiece 9).Setting under same jet velocity, glue drips and can fall within position far away, to make up the range difference causing because of groove.
A bit of supplementary notes, the utility model captures and records the above-mentioned location information for the treatment of gummed place 90 by above-mentioned camera module 30, then this location information is reached to the reference of electronic processing unit for subsequent control injection Glue dripping head 40.Even the therefore groove of sets of wafers component or flat limit some difference of shape, the present embodiment can be adjusted above-mentioned injection Glue dripping head 40 accordingly.
Refer to Fig. 6, the weight verification module 70 of the present embodiment is positioned on this mobile route that sets up pedestal 49, for spraying Glue dripping head 40 examination sprays thereon, with the weight that verification glue drips accurately.Clean module 80 is placed between this weight verification module 70 and this carrying platform 20, after using or the opportunity of needs, in order to clean above-mentioned injection Glue dripping head 40, in order to avoid residual colloid blocks injection runner.In the present embodiment, this clean module 80 comprises an examination spray plate 82, this examination is sprayed contiguous these carrying platforms 20 of plate 82 and is positioned on the mobile route of this injection Glue dripping head 40, sprays those glue drip on this examination spray plate 82 and show the path G (ginseng Fig. 2) that those glue drip for this injection Glue dripping head 40.
Be with, see through point glue equipment of the present utility model, have as following feature and function: the injection Glue dripping head 40 that point glue equipment of the present utility model is furnished by horizontal mode, be applicable to having the horizontal workpiece for the treatment of gummed place, particularly contain the sets of wafers component of two chip bonding wafers.In addition, the utility model moves above-mentioned injection Glue dripping head 40 by mobile module 50 and drips the position of initial ejection to adjust glue, can keep the groove of sets of wafers component or the gummed quality on flat limit, comprises position and glue metric density thereof that glue drips.
The above revealer of institute, is only the utility model preferred embodiment, and from the interest field that can not limit with this this case, the equalization of therefore doing according to this case application range changes or modifies, and still belongs to the scope that this case is contained.
Claims (9)
1. a point glue equipment, has multiple workpieces for the treatment of gummed place towards one and carries out a glue, it is characterized in that, described point glue equipment comprises:
One carrying platform, to carry described workpiece;
One sprays Glue dripping head, treats that towards the described multiple of described workpiece gummed place along continuous straight runs sprays multiple glue and drips;
One camera module, comprise being located at described workpiece top and capturing described multiple camera lens and of overlooking for the treatment of gummed place horizontal level information and be placed in the side of described workpiece and the side-looking camera lens of contiguous described injection Glue dripping head, the described multiple gummed place upright position information for the treatment of of described side-looking camera lens acquisition;
And
One moves module, according to described in treat the location information at gummed place, spray Glue dripping head described in mobile and lifting, described multiple glue is dripped to the described multiple gummed places that treat that are injected into described injection Glue dripping head.
2. according to the point glue equipment of claim 1, wherein said carrying platform is a prealigner, and described workpiece is a sets of wafers component that contains two chip bonding wafers, and described prealigner is proofreaded and located described sets of wafers component in correct Working position.
3. according to the point glue equipment of claim 2, wherein said prealigner comprises a support and rotates bottom surface and that the rotary support seat of described sets of wafers component, several guide posts be connected to described sets of wafers component the optical alignment unit that is placed in described sets of wafers component edge.
4. according to the point glue equipment of claim 3, also comprise that a curing module drips to solidify described glue, described curing module comprises that one is adjacent to the curing energy element of described workpiece, support body and the contiguous described curing energy element of a shielding cell of a fixing described curing energy element.
5. according to the point glue equipment of claim 1, also comprise that one is connected in the pedestal that sets up of described mobile module, described in described side-looking camera lens and described injection Glue dripping head are flatly arranged at, set up on pedestal, described side-looking camera lens is arranged at a side of described injection Glue dripping head.
6. according to the point glue equipment of claim 5, wherein said mobile module comprise a track, be movably located at sliding seat, on described track be fixed on adapter and that the first motor, on described sliding seat is connected in described the first motor connect described adapter and described in set up the second motor of pedestal, wherein said the first motor drives described adapter along horizontal direction and perpendicular to described rail moving, sets up pedestal and move along vertical direction described in wherein said the second motor drives.
7. according to the point glue equipment of claim 5, also comprise a weight verification module, described in described weight verification module is positioned at, set up on the mobile route of pedestal the weight of dripping with glue described in verification.
8. according to the point glue equipment of claim 7, also comprise a clean module, described clean module is placed between described weight verification module and described carrying platform.
9. point glue equipment according to Claim 8, wherein said clean module comprises an examination spray plate, described examination is sprayed the contiguous described carrying platform of plate and is positioned on the mobile route of described injection Glue dripping head, sprays multiple glue drip on described examination spray plate and show the path that described multiple glue drips for described injection Glue dripping head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420022283.5U CN203750775U (en) | 2014-01-14 | 2014-01-14 | Dispensing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420022283.5U CN203750775U (en) | 2014-01-14 | 2014-01-14 | Dispensing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203750775U true CN203750775U (en) | 2014-08-06 |
Family
ID=51246086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420022283.5U Expired - Lifetime CN203750775U (en) | 2014-01-14 | 2014-01-14 | Dispensing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203750775U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106269397A (en) * | 2015-05-26 | 2017-01-04 | 鸿骐新技股份有限公司 | The level point adhesive dispenser in automatic fine tuning point glue path and method thereof |
| CN106409706A (en) * | 2015-07-27 | 2017-02-15 | 鸿骐新技股份有限公司 | Dispensing status detection method and dispensing status detection mechanism |
| CN106807591A (en) * | 2015-12-01 | 2017-06-09 | 鸿骐新技股份有限公司 | The glue applying mechanism of adjustable dispensing angle |
| CN110355016A (en) * | 2018-04-09 | 2019-10-22 | 普罗科技有限公司 | Wafer scale distributor |
| CN110877002A (en) * | 2018-09-06 | 2020-03-13 | 深圳捷牛科技有限公司 | Integrative equipment of veneer lens |
| CN112427234A (en) * | 2020-11-11 | 2021-03-02 | 张斌 | Dispensing equipment with cleaning function |
| TWI826153B (en) * | 2022-11-30 | 2023-12-11 | 萬潤科技股份有限公司 | Liquid material application equipment |
| TWI826154B (en) * | 2022-11-30 | 2023-12-11 | 萬潤科技股份有限公司 | Liquid material application equipment |
-
2014
- 2014-01-14 CN CN201420022283.5U patent/CN203750775U/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106269397A (en) * | 2015-05-26 | 2017-01-04 | 鸿骐新技股份有限公司 | The level point adhesive dispenser in automatic fine tuning point glue path and method thereof |
| CN106269397B (en) * | 2015-05-26 | 2018-09-14 | 鸿骐新技股份有限公司 | The horizontal point glue equipment and its method in automatic fine tuning dispensing path |
| CN106409706A (en) * | 2015-07-27 | 2017-02-15 | 鸿骐新技股份有限公司 | Dispensing status detection method and dispensing status detection mechanism |
| CN106807591A (en) * | 2015-12-01 | 2017-06-09 | 鸿骐新技股份有限公司 | The glue applying mechanism of adjustable dispensing angle |
| CN106807591B (en) * | 2015-12-01 | 2018-11-02 | 鸿骐新技股份有限公司 | The glue applying mechanism of adjustable dispensing angle |
| CN110355016A (en) * | 2018-04-09 | 2019-10-22 | 普罗科技有限公司 | Wafer scale distributor |
| CN110877002A (en) * | 2018-09-06 | 2020-03-13 | 深圳捷牛科技有限公司 | Integrative equipment of veneer lens |
| CN112427234A (en) * | 2020-11-11 | 2021-03-02 | 张斌 | Dispensing equipment with cleaning function |
| TWI826153B (en) * | 2022-11-30 | 2023-12-11 | 萬潤科技股份有限公司 | Liquid material application equipment |
| TWI826154B (en) * | 2022-11-30 | 2023-12-11 | 萬潤科技股份有限公司 | Liquid material application equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203750775U (en) | Dispensing device | |
| US20210185824A1 (en) | Method and apparatus for automatically adjusting dispensing units of a dispenser | |
| CN106269397B (en) | The horizontal point glue equipment and its method in automatic fine tuning dispensing path | |
| CN107597504B (en) | In-situ automatic dispensing device and dispensing method for optical element | |
| US20180154573A1 (en) | A Circuit Board and Component Fabrication Apparatus | |
| US20140154037A1 (en) | Method and systems for semiconductor chip pick & transfer and bonding | |
| JP6846238B2 (en) | Droplet ejection device, droplet ejection method, program and computer storage medium | |
| KR100683443B1 (en) | Method of noncontact dispensing of material | |
| CN101952049A (en) | Ejection amount correction method and coating apparatus | |
| CN105750156A (en) | Precise and automated adhesive dispensing device and method | |
| JPWO2019088237A1 (en) | Liquid material coating device and coating method | |
| US10933578B2 (en) | Pattern forming sheet, pattern manufacturing apparatus, and pattern manufacturing method | |
| CN106807591B (en) | The glue applying mechanism of adjustable dispensing angle | |
| CN102830845B (en) | Production method of touch display screen | |
| CN101857188B (en) | MEMS stereoscopic packaging-assembling oriented solder ball bump bonding method | |
| US20100327014A1 (en) | Apparatus and method for fluid dispensing | |
| TWI558470B (en) | Horizontal glue dispensing device with automatic trimming dispensing-path and method thereof | |
| KR20090088390A (en) | Method and device for placing liquid material | |
| TWI500456B (en) | Method of horizontally glue dispensing | |
| CN105711097A (en) | Thermal cutting type 3D method and printer | |
| CN206330556U (en) | Connector pinout coplane degree detection means | |
| TWI558465B (en) | Gluing mechanism with adjustable gluing angle | |
| CN109513574A (en) | A kind of dispensing method of dispenser | |
| CN113488412A (en) | Chip welding control system and method | |
| TWM461500U (en) | Laser carving machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140806 |
|
| CX01 | Expiry of patent term |