CN101857188B - MEMS stereoscopic packaging-assembling oriented solder ball bump bonding method - Google Patents
MEMS stereoscopic packaging-assembling oriented solder ball bump bonding method Download PDFInfo
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- CN101857188B CN101857188B CN2010102224969A CN201010222496A CN101857188B CN 101857188 B CN101857188 B CN 101857188B CN 2010102224969 A CN2010102224969 A CN 2010102224969A CN 201010222496 A CN201010222496 A CN 201010222496A CN 101857188 B CN101857188 B CN 101857188B
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Abstract
The invention provides an MEMS stereoscopic packaging-assembling oriented solder ball bump bonding method, belonging to the field of packaging interaction and assembly of MEMS devices and solving the problems that the existing MEMS device package bonding technology dose not realize standardization, and the existing MEMS device automatic bonding technology is only suitable for manufacture laser bumps of specific bonding pad surfaces, can not realize integration of bump manufacture and interaction, and is not suitable for MEMS device stereoscopic packaging. The method comprises the following steps: transporting a chip to be bound to the visual system work area of an image acquiring device, acquiring image information, calculating to obtain the positions of all the bonding pad centers to be bound of the chip to be bound, storing all position information, planning bumping bonding paths based on the position information, and bonding each bonding pad based on the bumping bonding paths, wherein the bonding step is composed of sucking micro solder balls by utilizing a suction nozzle, releasing the micro solder balls into the bonding center and finishing bonding. The invention is applicable to the stereoscopic packaging of the MEMS devices.
Description
Technical field
The present invention relates to a kind of solder ball bump bonding and quality determining method, belong to the encapsulation interconnection and the assembling field of MEMS device towards three-dimensional encapsulation of MEMS and assembling.
Background technology
Micro-electromechanical system (MEMS) (Micro Electromechanical System) is to adopt fast-developing at present high-tech technology; Silicon Micrometer-Nanometer Processing Technology in IC (Integrated Circuit) manufacturing process and the micromachining technology in the mechanical industry are combined; The mechanical, electrical one that produces even the new unit or the system of light, mechanical, electrical one, it has, and cost is low, volume is little, low-power consumption, integrated height, characteristics such as can produce in batches.The 26S Proteasome Structure and Function of different MEMS devices is widely different, and its applied environment is also different, causes the packaging cost of MEMS device to be almost 50%～80% of manufacturing cost.Therefore, setting up a kind of packaging technology of standardized MEMS device, is the key that the MEMS device is realized in enormous quantities, low-cost, highly reliable suitability for industrialized production.
Existing MEMS packaging technology is by the packaging technology development differentiation of integrated circuit and next.Wherein can not only realize the electric interconnection of chip or lead-in wire, more can assist the three-dimensional assembling and the assembling of micro-structural as the bonding interconnection technique of core process.Little solder ball bonding techniques is through the heating remelting to the small solder ball; Can not only realize the interconnection bonding of MEMS device high reliability; The autoregistration or the self assembling process of micro-structural can also be realized through the surface tension of molten solder, a kind of standardized reliable MEMS packaging technology can be developed into.In recent years, little solder ball bonding techniques has obtained very fast development.Developed a kind of solder bump spraying equipment like German Pac Tech company, can the tin ball that import be ejected on the pad, and, accomplished bonding rapidly through the LASER HEATING remelting based on laser.American National patent " CONTINUOUS MODE SOLDER JET APPARATUS "; The patent No.: US 2007/0068996 A1; Trigger the deposite metal drop that forms uniformity continuously through piezoelectric transducer drives and mechanical oscillation, realize bonding through path control.Above-mentioned two kinds of methods all can realize the making of solder ball bump and accomplish bonding process.Yet all there is the bad unsettled shortcoming that is connected with pad that is shaped in these two kinds of methods, and need remelting shaping once more.
Chinese invention patent " method of producing leadless brazing alloy salient point by laser "; Publication number: CN 101556925A; Open day is on October 14th, 2009, and through the solder position that the computer typing is preset in advance, the gated sweep galvanometer cooperates laser works to realize stud bump making.But solder can't accurately be controlled the solder amount for presetting in advance in this method, can't carry out the automatic identification of bonding position through computer simultaneously, is not suitable for the solid encapsulation bonding of MEMS device; Chinese invention patent " the pad visual identity and the navigation system of flexible laser ball implanting machine "; Publication number: CN1719591A; Open day is on January 11st, 2006; Gather the pad image through ccd video camera, and obtain pad locations, accomplish with the auxiliary laser ball attachment machine and plant the ball action through image processing software.This method can realize that pad discerns automatically, is beneficial to the laser stud bump making process of automation.Yet this system is only applicable to the laser stud bump making on specific pads plane, does not possess the integrated technique of stud bump making and interconnection, is not suitable for the 3 D stereo bonding of MEMS device.
Summary of the invention
The present invention is that the bad needs of the shaping of solder ball bump are the problem of remelting shaping once more for the encapsulation bonding technology that solves existing MEMS device does not realize standardization, and a kind of solder ball bump bonding and quality determining method towards three-dimensional encapsulation of MEMS and assembling is provided.
The present invention is based on following equipment accomplishes: chip clamping device, image collecting device, suction nozzle, laser head, laser is to fiber coupler, optical fiber and laser self-focusing lens, laser self-focusing lens and the coaxial clamping of suction nozzle,
Its bonding method may further comprise the steps:
Step 1: will treat that by the chip clamping device bonding chip is transported to the vision system working region of image collecting device, and gather image information by image collecting device;
Step 2: calculate the position of the centers of bond pads that remains of treating bonding chip according to the image information of gathering, store the positional information of the centers of bond pads that remains simultaneously;
Step 3:, plant ball bonding path by the routine plan that presets according to the positional information of remaining centers of bond pads;
Step 4: according to planting ball bonding path each pad is carried out bonding, be specially:
It is further comprising the steps of:
Step 5: move to the vision system working region of image collecting device with accomplishing the chip plant the ball bonding in the step 4, that carries out all pads on the chip plants ball bonding salient point IMAQ;
Step 6: according to the underproof ball bonding salient point of gathering of planting of image search quality;
Step 7: write down all defective positional informations of planting the pad center of ball bonding salient point;
Step 8:, absorb the path by the routine plan salient point that presets according to all defective positional informations of planting the pad center of ball bonding salient point;
Step 9: absorb the path according to salient point each defective ball bonding salient point of planting is absorbed, again salient point is absorbed the path and return step 4 as planting ball bonding path.
In the said step 9 be with a defective method of planting the absorption of ball bonding salient point:
The chip that the ball bonding is planted in completion moves to plants the ball district; With suction nozzle corresponding to a defective ball bonding salient point of planting; The control laser head sends laser; This laser through laser to fiber coupler coupling after optical fiber is transferred to it on laser self-focusing lens assemble after, this defective ball bonding salient point of planting is carried out remelting, adopt suction nozzle that the defective ball bonding salient point of planting is absorbed simultaneously.
In the process that said step 4 and step 9 are carried out, all adopt nitrogen that chip is protected.
The method of from the feed bottle, drawing little solder ball in the said step 2 is: make in the vacuum storehouse of suction nozzle and produce negative pressure, the pressure in the hole capital after selling all securities of taking seriously reaches preset threshold value, and it is successful to judge that suction nozzle is drawn little solder ball from the feed bottle; Suction nozzle with the method that little solder ball discharges is in the said step 3: nitrogen injection in the vacuum storehouse of suction nozzle falls little solder ball.
Image collecting device in the said step 1 is made up of with the compound lens with 1 to 6 times of adjustable multiplication factor CCD, and said image collecting device can move along the Zv axle.
Said chip clamping device can be done the two dimensional surface motion in the two dimensional surface of Xc axle and Yc axle composition.
Said laser self-focusing lens and suction nozzle can be done the two dimensional surface motion in the two dimensional surface of Zt axle and Yt axle composition.
The diameter range of said little solder ball is 40 μ m to 300 μ m; Little solder ball remelting time range is 20ms to 50ms in the step 4.
Said laser instrument is semiconductor pumped Nd:YAG solid state laser; The diameter of optical fiber is 100 μ m; The spot diameter of said laser after the laser self-focusing lens focus on is 100 μ m.
Advantage of the present invention is: the present invention has overcome the deficiency of prior art, has realized the integrated of brazing filler metal alloy stud bump making and interconnection, has formed that a kind of low cost, high accuracy, adaptability are strong, the standard MEMS packaging technology of high reliability.Effect has the following advantages:
One, adopt little solder ball to carry out the bonding interconnection, can accurately control the solder amount, this self assembling process for some optical MEMS device is necessary;
Two, chip adopts nitrogen to protect in planting the ball bonding process, do not use brazing flux, has avoided polluting and to the corrosion of MEMS device;
Three, the remelting time to little solder ball is no more than 50ms, can reach positioning accuracy and be no more than 1 μ m, and pad automatic recognition system precision is ± 5 μ m, can realize the MEMS device encapsulation of high-efficiency high-accuracy;
Four, little solder ball is realized picking up and discharging through suction nozzle; Can be through the cooperation of two-dimension moving platform that carries suction nozzle and the two-dimension moving platform that carries different chip clamping devices; Realize any direction chip plant ball and interconnection, be particularly suitable for the stereoscopic three-dimensional encapsulation of MEMS device.
Five, the present invention can not only realize planting the integrated process of ball bonding stud bump making and interconnection automatically, can also realize online quality testing automatically simultaneously and reprocess wide adaptability, automaticity height.
Description of drawings
Fig. 1 is the flow chart of embodiment one described the inventive method; Fig. 2 is the flow chart of step 4 described in the embodiment one; Fig. 3 is the flow chart of embodiment two described the inventive method; Fig. 4 is for realizing the system construction drawing of the inventive method, and 12 for being equipped with the nitrogen cylinder of nitrogen among the figure.
The specific embodiment
The specific embodiment one: this embodiment is described below in conjunction with Fig. 1, Fig. 2 and Fig. 4; This embodiment is accomplished based on following equipment: chip clamping device 1, image collecting device 2, suction nozzle 3, laser head 4, laser are to fiber coupler 5, optical fiber 6 and laser self-focusing lens 7; Laser self-focusing lens 7 and suction nozzle 3 coaxial clampings
Its bonding method may further comprise the steps:
Step 1: will treat that by chip clamping device 1 bonding chip is transported to the vision system working region of image collecting device 2, and gather image information by image collecting device 2;
Step 2: calculate the position of the centers of bond pads that remains of treating bonding chip according to the image information of gathering, store the positional information of the centers of bond pads that remains simultaneously;
Step 3:, plant ball bonding path by the routine plan that presets according to the positional information of remaining centers of bond pads;
Step 4: according to planting ball bonding path each pad is carried out bonding, be specially:
The specific embodiment two: below in conjunction with Fig. 3 and Fig. 4 this embodiment is described, this embodiment is that with the difference of embodiment one it is further comprising the steps of:
Step 5: move to the vision system working region of image collecting device 2 with accomplishing the chip plant the ball bonding in the step 4, that carries out all pads on the chip plants ball bonding salient point IMAQ;
Step 6: according to the underproof ball bonding salient point of gathering of planting of image search quality;
Step 7: write down all defective positional informations of planting the pad center of ball bonding salient point;
Step 8:, absorb the path by the routine plan salient point that presets according to all defective positional informations of planting the pad center of ball bonding salient point;
Step 9: absorb the path according to salient point each defective ball bonding salient point of planting is absorbed, again salient point is absorbed the path and return step 4 as planting ball bonding path.
In the said step 9 be with a defective method of planting the absorption of ball bonding salient point:
The chip that the ball bonding is planted in completion moves to plants the ball district; With suction nozzle 3 corresponding to a defective ball bonding salient point of planting; Control laser head 4 sends laser; This laser through laser to fiber coupler 5 coupling after optical fiber 6 is transferred to it on laser self-focusing lens 7 assemble after, this defective ball bonding salient point of planting is carried out remelting, adopt 3 pairs of defective ball bonding salient points of planting of suction nozzle to absorb simultaneously.
In the process that said step 4 and step 9 are carried out, all adopt nitrogen that chip is protected.
The method of from the feed bottle, drawing little solder ball in the said step 2 is: the vacuum storehouse 8 interior negative pressure that produce that make suction nozzle 3; Pressure in the vacuum storehouse 8 can change before and after little solder ball; The hole capital after selling all securities 8 interior pressure of taking seriously reach preset threshold value, and it is successful to judge that suction nozzle 3 is drawn little solder ball from the feed bottle; Suction nozzle 3 with the method that little solder ball discharges is in the said step 3: nitrogen injection in the vacuum storehouse 8 of suction nozzle 3 falls little solder ball.
Image collecting device 2 in the said step 1 is made up of with the compound lens with 1 to 6 times of adjustable multiplication factor CCD, and said image collecting device 2 can move along the Zv axle.
Said chip clamping device 1 can be done the two dimensional surface motion in the two dimensional surface of Xc axle and Yc axle composition.
Said laser self-focusing lens 7 can be done the two dimensional surface motion with suction nozzle 3 in the two dimensional surface of Zt axle and Yt axle composition.
The diameter range of said little solder ball is 40 μ m to 300 μ m; Little solder ball remelting time range is 20ms to 50ms in the step 4.
Said laser instrument is semiconductor pumped Nd:YAG solid state laser; The diameter of optical fiber 6 is 100 μ m; The spot diameter of said laser after laser self-focusing lens 7 focus on is 100 μ m.
The said vacuum storehouse 8 interior negative pressure that produce of suction nozzle 3 that make can adopt vavuum pump 9 to realize, the pressure in the vacuum storehouse 8 can be monitored acquisition by adopts pressure sensor 10; Said laser self-focusing lens 7 can be fixed on the fixed support 11 with suction nozzle 3 simultaneously.
This embodiment can realize stud bump making, the MEMS device of automatic identification and location, the little solder ball of high speed of high speed location, the pad of equipment the interconnection bonding, plant salient point quality testing of ball bonding and online reprocessing, realized the integrated process of little brazing filler metal alloy stud bump making and interconnection.Be applicable to the MEMS device is carried out the solid encapsulation.
Its realization equipment comprises following several sections:
Laser thermal source part: the present invention adopts laser to do the making that thermal source is realized the little solder ball salient point of high speed.Laser instrument adopts semiconductor pumped Nd:YAG solid state laser, and its peak power is 60w.Laser is coupled to fiber coupler 5 through laser and carries out the flexibility transmission in the optical fiber 6, and focuses on once more through GRIN Lens 7, and little solder ball is carried out laser remolten.GRIN Lens 7 is clamped on the high speed positioning and fixing support 11, and the operating distance of laser self-focusing lens 7 is 75mm, and GRIN Lens 7 focal beam spot diameters are 100 μ m.
At a high speed location and pad identification division: mainly realized chip clamping, transport and the location and the pad recognition function of little solder ball.
Implement device among the present invention comprises 5 frees degree, and Xc axle and Yc axle can be realized the two dimensional surface motion of chip clamping device 1; Zt axle and Yt axle can be realized the two dimensional surface motion of fixed support 11, and then realize the two dimensional surface motion of little solder ball vacuum slot 3 and laser self-focusing lens 7; The Zv axle is used to carry image collecting device 2, realizes the focusing of image collecting device 2.Above-mentioned each highest movement speed is 0.3m/s, stabilization time＜20ms.Under the maximum speed situation, test, positioning accuracy can reach 0.5 μ m, considers the processing and manufacturing precision of grating chi, the factors such as linearity of platform rail, and final single shaft absolute fix precision is no more than 1 μ m.The precision of pad automatic recognition system is ± 5 μ m.
The pick process of little solder ball: above the motion on Zt axle and the Yt axle moves to suction nozzle 3 discharging opening of feeding device,, realize picking up of little solder ball through in vacuum storehouse 8, forming certain negative pressure through fixed support 11; Through nitrogen injection in vacuum storehouse 8, little solder ball is fallen, accomplish the fixing of bead through the ad hoc structure of suction nozzle 3 front ends simultaneously.Laser penetrates through the bottom aperture from the vacuum storehouse 8 top optical windows of suction nozzle 3, and little solder ball is carried out remelting, accomplishes and plants the making of bonding salient point and the integrated operation that interconnects.
Operational process of the present invention is following:
Through chip clamping device 1 chip is transported to the vision system working region and carries out pad identification, stored position information; Suction nozzle 3 is moved to feed zone, accomplish little solder ball and draw; The pressure sensing in the vacuum storehouse 8 that is communicated with through suction nozzle 3 is judged the spherical attitude of suction of suction nozzle 3; Chip and suction nozzle 3 moved to respectively plant the ball point, discharge little solder ball, call the technical papers that presets, plant ball and bonding according to the order of sequence; Chip is moved to the vision workspace carry out the salient point quality testing; If defective salient point is arranged, then reprocess.
The picking up of little solder ball in this embodiment, discharge, fix, bonding, reprocess all and accomplish, have height integration and adaptability through a suction nozzle 3.In the rework process to the defective ball bonding salient point of planting when absorbing; Need this salient point to be carried out remelting through emission laser, and open vacuum pump 9, negative pressure in vacuum storehouse 8, produced; When pressure reaches certain value, suction nozzle 3 can be absorbed the defective ball bonding salient point of planting when the molten state.
In the said step 6 be according to the underproof method of planting ball bonding salient point of image search quality of gathering: by the image collecting device in the step 12 in gathering the image information process; The template of bonding welding pad is treated in the image conduct of bonding welding pad that intercepting remains, and puts it in the ATL; When planting the quality testing of ball bonding salient point,, one by one each is planted the template of treating bonding welding pad of storing in image and the ATL of ball bonding salient point and carry out images match, obtain matching value NC according to the path of the routine plan that presets.As NC during greater than the pad matched value PadN that presets, assert that this moment, this pad was not accomplished bonding, promptly there is not salient point yet, judge that then this quality of planting ball bonding salient point is defective; Afterwards; The gray-scale map that NC is less than or equal to the image of planting ball bonding salient point of the pad matched value PadN that presets is handled; And each gray scale of planting the image of ball bonding salient point compared with the gray threshold that presets; If it is serious that its gray scale, judges then that this plants in the ball bonding bump bonding process oxidation less than the gray threshold that presets, the salient point quality is defective; Gray scale is judged more than or equal to the eccentric threshold value of planting ball bonding salient point of the gray threshold that presets: the center of calculating the bonding salient point; To plant the center of ball bonding salient point and deposit all centers of treating bonding welding pad and compare; Compare its centre coordinate; If the deviation of its centre coordinate not in the eccentric threshold range of setting, then decidable this plant the off quality of ball bonding salient point.
The specific embodiment three: the practical implementation step of this embodiment is following:
One, chip is placed on the chip clamping device 1, the motion through Xc axle and Yc axle moves to the below of image collecting device 2 with chip, and image collecting device 2 carries out IMAQ after the focusing of Zv axle;
Two, in industrial computer, identify the said pad center of treating bonding according to IMAQ information, simultaneously the positional information of the storage centers of bond pads that remains through special algorithm;
Three, according to the positional information of remaining centers of bond pads, plant ball bonding path by the routine plan that presets;
Four, according to planting ball bonding path each pad is carried out bonding, is specially:
41: suction nozzle 3 moves to the inlet top through in Zt axle and the axial motion of Yt, and then vacuum storehouse 8 obtains certain negative pressure through vavuum pump 9, and suction nozzle 3 is drawn little solder ball; Monitor vacuum storehouse 8 internal negative pressures in real time through pressure sensor 10, thereby judge that whether the little solder ball of absorption is successful, then repeats if get nowhere;
Four or two, chip and suction nozzle 3 are all moved to plant ball position, through to vacuum storehouse 8 nitrogen injections, discharge little solder ball, and accomplish the fixing of little solder ball by the ad hoc structure of suction nozzle 3 the pad center of bonding not;
Four or three, the laser that sends of control laser head 4, is coupled in the optical fiber 6 and transmits to fiber coupler 5 via laser, is focused on by laser self-focusing lens 7 again, and little solder ball is carried out remelting, accomplishes and plants the ball bonding; The aperture centering of said laser self-focusing lens 7 and suction nozzle 3 is fixed on the fixed support 11;
Five: the chip of planting the completion of ball bonding is moved to image collecting device 2 belows, carries out IMAQ;
Six: the appearance quality detection that realizes planting ball bonding salient point according to the image of gathering through algorithm automatically;
Seven: to the underproof bonding salient point of quality testing, record position is accomplished the online of defective bonding salient point automatically and is reprocessed, and is specially:
The July 1st: handle through image, discern and write down the defective position of planting ball bonding salient point of chip automatically, and, absorb the path by the routine plan salient point that presets according to defective position of planting ball bonding salient point; Plant when ball bonding salient point carries out laser remolten in that 3 pairs of suction nozzles are defective, open vacuum pump 9 is absorbed the defective ball bonding salient point of planting one by one;
72: again chip is moved to image collecting device 2 belows, carry out IMAQ, plant ball bonding salient point through the image processing and identification then and whether successfully absorb;
Seven or three: the bonding salient point is absorbed unsuccessful then repeating step July 1st, absorbs successfully then salient point to be absorbed the path and return step 4 as planting ball bonding path;
This embodiment has guaranteed the quality testing of salient point once more of planting ball bonding salient point of having reprocessed, plants ball bonding salient point qualified whole bonding process of just accomplishing to be detected until all.Defective salient point is carried out online reprocessing and quality testing once more, guaranteed that the higher ball of planting is bonded to power.
Planting in the ball bonding process of this embodiment, chip receive on the plane four direction and directly over the nitrogen protection of totally five directions, need not brazing flux, avoided pollution and damage to the MEMS device.
In this embodiment, the diameter of used little solder ball is 200 μ m, pad diameter 170 μ m, and the alloying component of little solder ball and bonding technology parameter are decided according to actual conditions.
In the present embodiment, the highest movement speed of motion platform single shaft is 0.3m/s, stabilization time＜20ms, and the absolute fix precision is no more than 1 μ m, and pad automatic recognition system precision is ± 5 μ m.
Said image collecting device 2 can be realized focusing and IMAQ automatically to different focal planes, obtains the three-dimensional information of pad image on the chip.Cooperate the location of chip clamping device 1 and fixed support 11, the release of little solder ball and fixation procedure are applicable to any pad on the three-dimensional.Suction nozzle 3 and laser self-focusing lens 7 coaxial clampings, the laser flexible transmission is suitable for the chip optional position planted ball bonding and interconnection remelting.
The present invention can realize three-dimensional go up the optional position plant ball bonding and interconnection, be particularly suitable for the solid encapsulation and the assembling of MEMS device.
The present invention is not limited to above-mentioned embodiment, can also be the reasonable combination of technical characterictic described in above-mentioned each embodiment.
Claims (9)
1. solder ball bump bonding and quality determining method towards a three-dimensional encapsulation of MEMS and an assembling; It is characterized in that: it is accomplished based on following equipment: chip clamping device (1), image collecting device (2), suction nozzle (3), laser head (4), laser are to fiber coupler (5), optical fiber (6) and laser self-focusing lens (7); Laser self-focusing lens (7) and the coaxial clamping of suction nozzle (3)
Its bonding and quality determining method may further comprise the steps:
Step 1: will treat that by chip clamping device (1) bonding chip is transported to the vision system working region of image collecting device (2), and gather image information by image collecting device (2);
Step 2: calculate the position of the centers of bond pads that remains of treating bonding chip according to the image information of gathering, store the positional information of the centers of bond pads that remains simultaneously;
Step 3:, plant ball bonding path by the routine plan that presets according to the positional information of remaining centers of bond pads;
Step 4: according to planting ball bonding path each pad is carried out bonding, be specially:
Step 4 one: suction nozzle (3) is moved to feed zone, from the feed bottle, draw little solder ball;
Step 4 two: will treat that bonding chip and suction nozzle (3) all move to and plant the ball district, and the little solder ball in the suction nozzle (3) discharged and is fixed on one treat centers of bond pads;
Step 4 three: the laser head (4) of control laser instrument sends laser; This laser through laser to fiber coupler (5) coupling after optical fiber (6) is transferred to it on laser self-focusing lens (7) assemble after; Little solder ball is carried out remelting, and that accomplishes a pad plants the ball bonding;
Step 4 four: judge whether to accomplish to all pads plant the ball bonding, if not, return step 4 one; If the ball bonding of planting of chip is accomplished;
Step 5: move to the vision system working region of image collecting device (2) with accomplishing the chip plant the ball bonding in the step 4, that carries out all pads on the chip plants ball bonding salient point IMAQ;
Step 6: according to the underproof ball bonding salient point of gathering of planting of image search quality:
In gathering the image information process, the template of bonding welding pad is treated in the conduct of the image of bonding welding pad that intercepting remains, and puts it in the ATL by the image collecting device in the step 1 (2);
When planting the quality testing of ball bonding salient point,, one by one each is planted the template of treating bonding welding pad of storing in image and the ATL of ball bonding salient point and carry out images match, obtain matching value NC according to the path of the routine plan that presets;
As NC during greater than the pad matched value PadN that presets, assert that this moment, this pad was not accomplished bonding, promptly there is not salient point yet, judge that then this quality of planting ball bonding salient point is defective;
Afterwards; The gray-scale map that NC is less than or equal to the image of planting ball bonding salient point of the pad matched value PadN that presets is handled; And each gray scale of planting the image of ball bonding salient point compared with the gray threshold that presets; If it is serious that its gray scale, judges then that this plants in the ball bonding bump bonding process oxidation less than the gray threshold that presets, the salient point quality is defective;
Gray scale is judged more than or equal to the eccentric threshold value of planting ball bonding salient point of the gray threshold that presets: the center of calculating the bonding salient point; To plant the center of ball bonding salient point and deposit all centers of treating bonding welding pad and compare; Compare its centre coordinate; If the deviation of its centre coordinate not in the eccentric threshold range of setting, then decidable this plant the off quality of ball bonding salient point;
Step 7: write down all defective positional informations of planting the pad center of ball bonding salient point;
Step 8:, absorb the path by the routine plan salient point that presets according to all defective positional informations of planting the pad center of ball bonding salient point;
Step 9: absorb the path according to salient point each defective ball bonding salient point of planting is absorbed, again salient point is absorbed the path and return step 4 as planting ball bonding path.
2. solder ball bump bonding and quality determining method towards three-dimensional encapsulation of MEMS and assembling according to claim 1 is characterized in that: in the said step 9 with a defective method of planting the absorption of ball bonding salient point be:
The chip that the ball bonding is planted in completion moves to plants the ball district; With suction nozzle (3) corresponding to a defective ball bonding salient point of planting; Control laser head (4) sends laser; This laser through laser to fiber coupler (5) coupling after optical fiber (6) is transferred to it on laser self-focusing lens (7) assemble after, this defective ball bonding salient point of planting is carried out remelting, adopt suction nozzle (3) that the defective ball bonding salient point of planting is absorbed simultaneously.
3. solder ball bump bonding and quality determining method towards three-dimensional encapsulation of MEMS and assembling according to claim 2 is characterized in that: in the process that said step 4 and step 9 are carried out, all adopt nitrogen that chip is protected.
4. solder ball bump bonding and quality determining method towards three-dimensional encapsulation of MEMS and assembling according to claim 1; It is characterized in that: the method for from the feed bottle, drawing little solder ball in the said step 4 one is: the interior negative pressure that produces in vacuum storehouse (8) that makes suction nozzle (3); The interior pressure of hole capital after selling all securities (8) of taking seriously reaches preset threshold value, and it is successful to judge that suction nozzle (3) is drawn little solder ball from the feed bottle; Suction nozzle (3) with the method that little solder ball discharges is in the said step 4 two: nitrogen injection in the vacuum storehouse (8) of suction nozzle (3) falls little solder ball.
5. solder ball bump bonding and quality determining method towards three-dimensional encapsulation of MEMS and assembling according to claim 1; It is characterized in that: the image collecting device in the said step 1 (2) is made up of with the compound lens with 1 to 6 times of adjustable multiplication factor CCD; Said image collecting device (2) can move along the Zv axle; Said Zv axle is used to carry image collecting device (2), realizes the focusing of image collecting device (2).
6. solder ball bump bonding and quality determining method towards three-dimensional encapsulation of MEMS and assembling according to claim 1; It is characterized in that: said chip clamping device (1) can be done the two dimensional surface motion in the two dimensional surface of Xc axle and Yc axle composition, Xc axle and Yc axle are used to realize the two dimensional surface motion of chip clamping device (1).
7. solder ball bump bonding and quality determining method towards three-dimensional encapsulation of MEMS and assembling according to claim 4; It is characterized in that: said laser self-focusing lens (7) can be done the two dimensional surface motion with suction nozzle (3) in the two dimensional surface of Zt axle and Yt axle composition, Zt axle and Yt axle are used to realize the two dimensional surface motion of little solder ball vacuum slot (3) and laser self-focusing lens (7).
8. solder ball bump bonding and quality determining method towards three-dimensional encapsulation of MEMS and assembling according to claim 1, it is characterized in that: the diameter range of said little solder ball is 40 μ m to 300 μ m; Little solder ball remelting time range is 20ms to 50ms in the step 4.
9. solder ball bump bonding and quality determining method towards three-dimensional encapsulation of MEMS and assembling according to claim 1, it is characterized in that: said laser instrument is semiconductor pumped Nd:YAG solid state laser; The diameter of optical fiber (6) is 100 μ m; The spot diameter of said laser after laser self-focusing lens (7) focus on is 100 μ m.
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|---|---|---|---|---|
| CN103151275A (en) * | 2011-12-06 | 2013-06-12 | 北京大学深圳研究生院 | Manufacturing method for flip chip gold bumps |
| CN103429006B (en) * | 2013-08-20 | 2016-12-07 | 中国电子科技集团公司第十四研究所 | A kind of SMT of utilization chip mounter carries out the method that BGA plants ball |
| CN109551069B (en) * | 2018-12-26 | 2020-11-10 | 武汉凌云光电科技有限责任公司 | Automatic laser multichannel tin ball welding device and welding method |
| CN110961739B (en) * | 2019-12-28 | 2021-07-30 | 武汉比天科技有限责任公司 | Tin ball welding device with coaxial vision system |
| CN111014868B (en) * | 2019-12-28 | 2021-04-27 | 武汉比天科技有限责任公司 | Welding method of tin ball welding device |
| CN113314451B (en) * | 2021-06-10 | 2022-08-02 | 哈尔滨工业大学 | Wafer bonding alignment system and method based on moire fringes |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE50112936D1 (en) * | 2000-10-06 | 2007-10-11 | Pac Tech Gmbh | DEVICE FOR REMOVING LOT MATERIAL FROM A SOLDERING SPACE |
| JP5167278B2 (en) * | 2007-01-24 | 2013-03-21 | ピーエーシー ティーイーシーエイチ − パッケージング テクノロジーズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Method and apparatus for joining solder balls arranged at predetermined intervals |
-
2010
- 2010-07-09 CN CN2010102224969A patent/CN101857188B/en not_active Expired - Fee Related
Non-Patent Citations (1)
| Title |
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| 田艳红等.激光重熔在钎料凸点成形中的应用.《电子工艺技术》.2002,第23卷(第4期),第139-142页. * |
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| CN101857188A (en) | 2010-10-13 |
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