CN203774360U - Glue coating and die bonding system - Google Patents
Glue coating and die bonding system Download PDFInfo
- Publication number
- CN203774360U CN203774360U CN201420116355.2U CN201420116355U CN203774360U CN 203774360 U CN203774360 U CN 203774360U CN 201420116355 U CN201420116355 U CN 201420116355U CN 203774360 U CN203774360 U CN 203774360U
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- China
- Prior art keywords
- die bond
- glue
- arm
- crystal grain
- crystalline grains
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Abstract
The utility model discloses a glue coating and die bonding system which includes a wafer disc used for placing crystalline grains; a glue disc used for carrying out glue bonding processing on the bottom parts of the crystalline grains; a carrier used for providing to-be-bonded crystalline stations for the crystalline grains; and die bonding arms used for picking crystalline grains on the wafer disc and transporting the crystalline grains to glue disc stations through the die bonding arms for gluing processing and then welding the crystalline grains which undergo the gluing processing in a bonding manner on the to-be-bonded crystalline stations on the carrier through the die bonding arms. The die bonding arms reach preset stations in a linear, swinging or rotating moving manner. The wafer disc, the glue disc and the carrier are sequentially arranged on corresponding stations of motion trails of the die bonding arms. Because the same mechanical and control structure is used to pick up the crystalline grains and the glue is taken through the wafer, poor phenomena in traditional methods, that blind points exist in bonding positions of the crystalline grains and glue points, bonding faces are unevenly distributed, comparatively large deviation of the crystalline grains and glue drop resetting points is likely to happen, the glue shape is not full and the absorption firmness is poor and the like are prevented.
Description
Technical field
The utility model relates to the accurate manufacture of semiconductor and equipment field, in particular a kind of glue die bond system of covering for IC and LED semiconductor packages.
Background technology
The object of die bond is for crystal grain (or chip) is bonded on carrier, makes to realize between crystal grain (or chip) and carrier the input of thermal signal or the signal of telecommunication.Whether what crystal grain (or chip) was put into carrier package position accurately directly affects the luminous and conductive effectiveness of device, if crystal grain (or chip) is in carrier package position deviation to some extent, thereby aspect illuminating device, can cause light to fail to emit completely the brightness that affects finished product, can cause the signal of telecommunication to fail to connect completely and affect effect of finished product at integrated circuit connection.Therefore the die bond point required precision of crystal grain (or chip) on carrier is very high, could effectively ensure like this end product quality.
The course of work of traditional die bond technique that the manufacturer of encapsulation both at home and abroad at present is generally used is, first get after silver slurry at lacquer disk(-sc) mid point by a glue arm, by glue point point to treating die bond position on carrier, utilize one by one vacuum to pick up the crystal grain having separated on wafer (or chip) by die bond arm again, and transmit and be placed on the target's center point that carrier scribbles silver slurry and go up, chip is fixed by weldbonding on carrier.The problem that this packaging technology causes has:
1) glue point and crystal grain (or chip) respectively by two independently mechanical mechanism structure place, and two groups of mechanical mechanisms reset and can have deviation between point, can there is deviation with the position that overlaps of glue point in crystal grain (or chip) therefore.
2) when Glue dripping head is got glue, be vulnerable to the impact of the factor such as syringe needle shape, syringe needle descending depth difference, add that crystal grain contacts the impact of the time that is subject to now, speed, active force with glue point, be difficult to make all the time glue point shape, size, thickness keep consistency.
3) glue point is the order of successively placing with crystal grain, and affected by syringe needle shape, glue drips lower time and is drops (being that thick middle periphery is thin), glue drips surface can become large gradually at time internal tension to be binded, so the encapsulate height of crystal grain (or chip) is wayward, and the general height that all cannot exceed 35um.
4) some glue arm and die bond arm is by two mechanism controls independently, because two arms act on same station, under continuous firing state, avoid the collision of two arms between same station, so Machine Design, motion and software control, integrated control aspect all require very high.
Therefore, prior art has yet to be improved and developed.
Utility model content
In view of above-mentioned the deficiencies in the prior art, the purpose of this utility model is to provide one to cover glue die bond system, is intended to solve the factors such as crystal grain (or chip) does not overlap with glue point position, chip encapsulate height is wayward, glue point size identical property is poor and causes the problems such as poor product quality, production capacity be low.
The technical solution of the utility model is as follows:
One is covered glue die bond system, comprising:
Wafer disks, for placing crystal grain;
Lacquer disk(-sc), for carrying out viscose processing to the bottom of this crystal grain;
Carrier, treats die bond position for what this crystal grain was provided;
Die bond arm, for picking up the crystal grain in wafer disks, and delivers to lacquer disk(-sc) station by this die bond arm by described crystal grain and carries out viscose processing, then by this die bond arm, crystal grain weldbonding after treatment viscose is treated to die bond position on carrier;
Described die bond arm arrives predetermined station with the motion mode of straight line, swing or rotation, and described wafer disks, lacquer disk(-sc), carrier are successively set on the corresponding station of described die bond arm movement locus.
The described glue die bond system of covering, wherein, described die bond arm end is provided with pick device, and described pick device is caught the crystal grain of jack-up in wafer disks by the mode of clamping, electromagnetism absorption or vacuum suction.
The described glue die bond system of covering, wherein, also comprises:
Drive motors, the drive end of described drive motors is socketed with rotary mounting seat, and described die bond arm can move up and down and be arranged on described rotary mounting seat.
The described glue die bond system of covering, wherein, is arranged at intervals with several die bond arms on described rotary mounting seat.
The described glue die bond system of covering, wherein, also comprises:
Cleaning disc, for carrying out clean to the crawl thing surface on the pick device of die bond arm end after die bond.
The utility model beneficial effect:
1) adopt single armed (single die bond arm) to carry out continuously and pick up crystalline substance, some glue, the whole technical process of die bond, simplified the complex steps that two arms (two groups of die bond arms) die bond machine is carried out, eliminated the stand-by period of two arms with station simultaneously.
2) adopt single armed to carry out viscose glue and die bond simultaneously, avoided the problem of two arms with the station position deviation that successively work brings completely.
3) adopt single armed mechanical structure to carry out viscose glue and die bond, the problem that can avoid two arms to bump against, has simplified equipment labyrinth, has reduced layout and difficulty in computation, the difficulty of motion control difficulty and Installation and Debugging.
4) carry out die bond after getting glue by chip self, guarantee the consistency of chip and glue position, solved glue point situation about causing not of uniform size, and effectively strengthened the fastness of glue and die bonding.
5) get glue by the chip self of surfacing, make glue easily form and be full state, the encapsulate height of easier control chip simultaneously, more than having reached 40um at present, the Limiting Level that can reach far beyond traditional handicraft, can meet the specific demand of high-end customer completely.In addition, the encapsulate height of chip is higher, and fastness is better, and is easy to finished product heat radiation, extends and uses the life-span.
6) extensibility is strong, can adopt the multiple working cells of increase mode to increase substantially equipment capacity.As multiple unit die bond arms is fixedly arranged on motor surrounding at a certain angle, single armed can complete the action of picking up crystalline substance, being stained with glue and die bond simultaneously, makes each unit arm remain operating state at each station.
Brief description of the drawings
Fig. 1 is the structural representation that the utility model covers glue die bond system.
Embodiment
The utility model provides one to cover glue die bond system, for making the purpose of this utility model, technical scheme and effect clearer, clear and definite, referring to accompanying drawing examples, the utility model is further described.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Refer to Fig. 1, Fig. 1 is the structural representation that the utility model covers glue die bond system.
As shown in Figure 1, described in cover glue die bond system, it comprises:
Wafer disks 10, for placing crystal grain.
Lacquer disk(-sc) 20, for carrying out viscose processing to the bottom of this crystal grain.
Carrier 30 as one kind, treats die bond position for what this crystal grain was provided.
Die bond arm 40, for picking up the crystal grain in wafer disks 10, and delivers to lacquer disk(-sc) 20 stations by this die bond arm 40 by described crystal grain and carries out viscose processing, then by this die bond arm 40, crystal grain weldbonding after treatment viscose is treated to die bond position on carrier 30 as one kind.
Particularly, die bond arm 40 is to arrive predetermined station in the mode of straight line, swing or rotation, be preferably, the center of die bond arm 40 in whole system, as the core component of this system, and this fixed arm 40 arrives predetermined station (picking up brilliant position, viscose position, die bond position) with the working method of rotating.
Correspondingly, can adopt drive motors 60 to drive, thereby drive its rotation to arrive predetermined station, concrete structure is that the drive end of drive motors 60 is socketed a rotary mounting seat 61, and described die bond arm 40 can move up and down and is arranged on described rotary mounting seat 61, this fixed arm 40 is arranged on this rotary mounting seat 61, not only can realize the rotation of fixed arm, but also the action that can transfer or rise with respect to this rotary mounting seat 61.
In addition, for the consideration of die bond efficiency, this die bond arm 40 can arrange several, and interval is assemblied in all sides of rotary mounting seat 61 uniformly.Wherein, be not restricted for the number of die bond arm, can have 3,6 etc., determine according to the power of set drive motors.
Wherein, described die bond arm 40 ends are provided with pick device, by the mode of clamping, electromagnetism absorption or vacuum suction, the crystal grain of jack-up in wafer disks are caught, and this pick device is preferably suction nozzle seat 41, on described suction nozzle seat 41, is provided with suction nozzle.
Further, described wafer disks 10, lacquer disk(-sc) 20, carrier 30 as one kind are successively set on the corresponding station of these die bond arm 40 movement locus the position of suction nozzle below (corresponding to).
This system can also comprise:
Cleaning disc 50, for carrying out clean to the suction nozzle on the suction nozzle seat of die bond arm end after die bond.
Below by a specific embodiment, the utility model is done to detailed elaboration:
As shown in Figure 1, this system comprises:
Be positioned at the drive motors 60 that this system centre arranges, be socketed in the rotary mounting seat 61 on these drive motors 60 drive ends, be provided with four installation positions in all sides of this rotary mounting seat 61, correspondingly, on these four installation positions, be equipped with four die bond arm 40(and be respectively die bond arm 401, die bond arm 402, die bond arm 403, die bond arm 404, wherein, the structure of each die bond arm is just the same, and job step is also identical), these four die bond arms 40 can rotate by accompanying rotation mount pad 61, also can move up and down with respect to this rotary mounting seat 61 simultaneously.
Be provided with suction nozzle seat 41 in the end of die bond arm 40, on suction nozzle seat, be provided with suction nozzle, on the station of die bond arm 40 circus movement tracks, (being the lower position that suction nozzle is corresponding) is disposed with wafer disks 10, lacquer disk(-sc) 20, carrier 30 as one kind, cleaning disc 50, die bond arm 40 circus movement tracks are divided into the station of four direction, and wafer disks 10, lacquer disk(-sc) 20, carrier 30 as one kind, cleaning disc 50 are placed on the station of corresponding four direction in proper order successively according to die bond.
After treating said system assembling, next concrete die bond step is as follows:
Step 1, starts drive motors, enter first 90 degree rotation (each operation, drive motors is all 90-degree rotation, and whole system is a circulatory system, and the direction of rotation of drive motors do not limit, clockwise or be rotated counterclockwise all can);
Step 2, die bond arm 401 enters and picks up brilliant position, transfers die bond arm 401 pick-up chips, and suction nozzle is adsorbed onto after chip, rises die bond arm 401, and drive motors enters second 90 degree rotation;
Step 3, die bond arm 401 enters viscose position, die bond arm 402 enters and picks up brilliant position, transfer die bond arm 401 and die bond arm 402 simultaneously, die bond arm 401 carries out viscose operation, die bond arm 402 picks up brilliant operation, rises die bond arm 401 and die bond arm 402 after completing simultaneously again, and drive motors enters the 3rd 90 degree rotation;
Step 4, die bond arm 401 enters die bond position, die bond arm 402 enters viscose position, die bond arm 403 enters and picks up brilliant position, transfers die bond arm 401, die bond arm 402 and die bond arm 403 simultaneously, and die bond arm 401 carries out die bond operation, die bond arm 402 carries out viscose operation, die bond arm 403 picks up brilliant operation, rises die bond arm 401, die bond arm 402 and die bond arm 403 after completing simultaneously again, and drive motors enters the 4th 90 degree rotation;
Step 5, die bond arm 401 enters cleaning position (station that cleaning disc is corresponding), die bond arm 402 enters die bond position, die bond arm 403 enters viscose position, die bond arm 404 enters and picks up brilliant position, transfer die bond arm 401, die bond arm 402, die bond arm 403 and die bond arm 404 simultaneously, die bond arm 401 carries out cleaning operation, die bond arm 402 carries out die bond operation, die bond arm 403 carries out viscose operation, die bond arm 404 picks up brilliant operation, rises die bond arm 401, die bond arm 402, die bond arm 403 and die bond arm 404 after completing simultaneously again, and drive motors enters the 5th 90 degree rotation.
Be that whole system is initially complete, in the stage backward, die bond arm 401, die bond arm 402, die bond arm 403 and die bond arm 404 all synchronously move up and down, and whole system will circulate with this.
It should be noted that in the time that whole system is initial, while only having each die bond arm to enter for the first time to pick up brilliant position, just transfer the operation of die bond arm, enter while picking up brilliant until last die bond arm 404, four die bond arms just carry out simultaneous operation.
By multiple unit die bond arm, (unit refers to an arm to the utility model, pick up crystalline substance because it can complete with arm, get glue and die bond, so claim a unit in the utility model) be fixedly arranged at a certain angle motor surrounding, the arm of each unit can independently do the action of lifting.The die bond arm of multiple unit is placed and arrives after corresponding station simultaneously with motor, and fall by the mode of setting and operate, rapid playback after completing, then be rotated further with motor by control command, while arriving next station, work on.The feature of this structure is that single armed can complete the action of picking up crystalline substance, being stained with glue and die bond simultaneously, makes each unit arm remain operating state at each station.
Emphasize at this, this system does not limit for direction of rotation, can do unidirectionally to turn clockwise, be rotated counterclockwise or along contrary crankmotion.
In sum, one provided by the utility model is covered glue die bond system, pick up crystalline substance owing to using same machinery and control structure, and get glue by wafer self, avoid the crystal grain (or chip) of traditional approach to have blind spot with glue spot gluing position, bonding plane skewness, is prone to crystal grain and glue and drips the bad phenomenon such as some deviation is large, glue type is not full, absorption fastness is poor of resetting.In addition, use crystal grain (or chip) to get glue and replace Glue dripping head point glue, glue point coated state is completely different, and the smooth rule of bonding coat is highly easily controlled, and more easily reaches higher encapsulate height.This die-bonding method adopts independently system to realize, and avoids two independent agencies to produce collision problem with station completely, simplifies mechanical structure, reduces and controls difficulty, improves again Product Precision simultaneously.
Should be understood that; application of the present utility model is not limited to above-mentioned giving an example; for those of ordinary skills, can be improved according to the above description or convert, all these improvement and conversion all should belong to the protection range of the utility model claims.
Claims (5)
1. cover a glue die bond system, it is characterized in that, comprising:
Wafer disks, for placing crystal grain;
Lacquer disk(-sc), for carrying out viscose processing to the bottom of this crystal grain;
Carrier, treats die bond position for what this crystal grain was provided;
Die bond arm, for picking up the crystal grain in wafer disks, and delivers to lacquer disk(-sc) station by this die bond arm by described crystal grain and carries out viscose processing, then by this die bond arm, crystal grain weldbonding after treatment viscose is treated to die bond position on carrier;
Described die bond arm arrives predetermined station with the motion mode of straight line, swing or rotation, and described wafer disks, lacquer disk(-sc), carrier are successively set on the corresponding station of described die bond arm movement locus.
2. the glue die bond system of covering according to claim 1, is characterized in that, described die bond arm end is provided with pick device, and described pick device is caught the crystal grain of jack-up in wafer disks by the mode of clamping, electromagnetism absorption or vacuum suction.
3. the glue die bond system of covering according to claim 1, is characterized in that, also comprises:
Drive motors, the drive end of described drive motors is socketed with rotary mounting seat, and described die bond arm can move up and down and be arranged on described rotary mounting seat.
4. the glue die bond system of covering according to claim 3, is characterized in that, is arranged at intervals with several die bond arms on described rotary mounting seat.
5. the glue die bond system of covering according to claim 2, is characterized in that, also comprises:
Cleaning disc, for carrying out clean to the crawl thing surface on the pick device of die bond arm end after die bond.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420116355.2U CN203774360U (en) | 2014-03-15 | 2014-03-15 | Glue coating and die bonding system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420116355.2U CN203774360U (en) | 2014-03-15 | 2014-03-15 | Glue coating and die bonding system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203774360U true CN203774360U (en) | 2014-08-13 |
Family
ID=51291515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420116355.2U Expired - Fee Related CN203774360U (en) | 2014-03-15 | 2014-03-15 | Glue coating and die bonding system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203774360U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111916375A (en) * | 2020-08-12 | 2020-11-10 | 深圳市诺泰芯装备有限公司 | Turret type chip glue-free die bonder |
| CN112838044A (en) * | 2021-02-09 | 2021-05-25 | 深圳市卓兴半导体科技有限公司 | Running device and wafer bonding device |
-
2014
- 2014-03-15 CN CN201420116355.2U patent/CN203774360U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111916375A (en) * | 2020-08-12 | 2020-11-10 | 深圳市诺泰芯装备有限公司 | Turret type chip glue-free die bonder |
| CN111916375B (en) * | 2020-08-12 | 2024-03-26 | 深圳市诺泰芯装备有限公司 | Rotary chip glue-free die bonder |
| CN112838044A (en) * | 2021-02-09 | 2021-05-25 | 深圳市卓兴半导体科技有限公司 | Running device and wafer bonding device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140813 Termination date: 20200315 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |