CN105665244A - Sealing glue method for printed circuit board assembly (PCBA) plate - Google Patents
Sealing glue method for printed circuit board assembly (PCBA) plate Download PDFInfo
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- CN105665244A CN105665244A CN201610061036.XA CN201610061036A CN105665244A CN 105665244 A CN105665244 A CN 105665244A CN 201610061036 A CN201610061036 A CN 201610061036A CN 105665244 A CN105665244 A CN 105665244A
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- Prior art keywords
- pcba board
- shower nozzle
- glue spraying
- glue
- region
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
Abstract
The invention discloses a sealing glue method for a printed circuit board assembly (PCBA) plate. The sealing glue method for the PCBA plate comprises the steps that the PCBA plate is provided to a preset area of a sealing glue equipment workbench; a spray head is moved to a preset glue spraying starting position of the PCBA plate; and the spray head sprays glue to the PCBA plate according to preset principles. The sealing glue method for the PCBA plate further comprises the steps that a three-dimensional coordinate system with mapping coordinates of the spray head and a three dimensional model of the PCBA plate is constructed. The three-dimensional coordinate system and a coordinate system where the PCBA plate is located have a corresponding relation. Correspondingly, the step that the spray head sprays the glue to the PCBA plate according to the preset principles comprises that on the basis of the position relation between the mapping coordinate of the spray head and the three dimensional model as well as the corresponding relation, the spray head sprays the glue to the PCBA plate according to the preset principles. According to the sealing glue method for the PCBA plate, a circuit board can be packed conveniently and quickly, and the ever-increasing packing requirements can be met.
Description
Technical field
The present invention relates to electronic package field, particularly relate to the glue sealing method of a kind of PCBA board.
Background technology
The method for packing of PCBA (PrintedCircuitBoard+Assembly) plate is a lot, as being coated with the method for packing such as three anti-paints, embedding and low-pressure injection molding on circuit card top layer. Above-mentioned often kind of method has respective relative merits: directly spraying three anti-paints, although simple, convenient, easily realize, but circuit card can not be carried out real protection, waterproof, shockproof can not be realized, the time is of a specified duration, and encapsulation may be lost efficacy; Embedding, operate loaded down with trivial details, efficiency is low, cost height and poor reliability; Low-pressure injection molding, utilizes low-pressure injection molding equipment, by special mould, adjust corresponding injection pressure and the time complete to circuit card encapsulation, the method die design and cost of manufacture are higher, the characteristic of glue itself on encapsulation affect bigger.
In prior art, generally adopt low-pressure injection molding method dimensional packaged circuit board to reach the effect of anti-water-lute, flame-resistant insulation. But due to improving constantly of scientific and technological level, the circuit card specification of required encapsulating is increasing, and the thickness of product is more and more thinner. Low-pressure injection molding method can not meet the encapsulation requirement of this type of circuit card.
Summary of the invention
In view of the deficiencies in the prior art, the application provides the glue sealing method of a kind of new PCBA board, with can conveniently dimensional packaged circuit board, meet growing encapsulation requirement.
For achieving the above object, the application provides the glue sealing method of a kind of PCBA board, comprising:
PCBA board is provided to the predeterminable area of sealing equipment work platform;
Shower nozzle moves to the default beginning glue spraying position of described PCBA board;
According to shower nozzle described in pre-defined rule to described PCBA board glue spraying.
As one preferred embodiment, also comprise:
Build and there is the mapping point of described shower nozzle and the three-dimensional system of coordinate of the 3D model of described PCBA board; The system of coordinates at described three-dimensional system of coordinate and described PCBA board place has corresponding relation;
Accordingly, described comprise to described PCBA board glue spraying according to shower nozzle described in pre-defined rule: based on the mapping point of described shower nozzle and the position relation of described 3D model and described corresponding relation according to shower nozzle described in pre-defined rule to described PCBA board glue spraying.
As one preferred embodiment, the three-dimensional system of coordinate that described structure has the mapping point of described shower nozzle and a 3D model of described PCBA board comprises:
Build three-dimensional system of coordinate, described three-dimensional system of coordinate has the mapping point of described shower nozzle;
Obtain the system of coordinates at described PCBA board place and the corresponding relation of described three-dimensional system of coordinate;
The 3D model of described PCBA board is inputted in described three-dimensional system of coordinate.
As one preferred embodiment, described PCBA board has the height apart from described PCBA board bottom surface and is less than the first area of preset height and the height apart from described PCBA board bottom surface is greater than the 2nd region of preset height;
Described method also comprises:
When described shower nozzle is moved to described 2nd region by described first area or moves to described first area glue spraying by described 2nd region, mobile and/or rotate described shower nozzle and/or described PCBA board so that described shower nozzle according to pre-defined rule to described first area or described 2nd region glue spraying.
As one preferred embodiment, described pre-defined rule comprises:
Shower nozzle described in glue spraying process is positioned at the predeterminable range place of described PCBA board.
As one preferred embodiment, described pre-defined rule comprises:
Described in glue spraying process, the glue spraying direction of shower nozzle and the sprayed surface of described PCBA board are vertical all the time.
As one preferred embodiment, described pre-defined rule comprises:
Shower nozzle described in glue spraying process be positioned at all the time the glue spraying surface of described PCBA board above gravity direction.
As one preferred embodiment, described pre-defined rule comprises:
When spraying described first area, described shower nozzle performs to described first area to fill and lead up coated glue spraying.
As one preferred embodiment, described pre-defined rule comprises:
When spraying described 2nd region, described shower nozzle performs coated glue spraying to described 2nd region.
As one preferred embodiment, described pre-defined rule comprises:
When spraying described first area, between the bottom surface of described shower nozzle and described PCBA board, keep predeterminable range.
As one preferred embodiment, described pre-defined rule comprises:
When spraying described 2nd region, between the sprayed surface of described shower nozzle and described PCBA board, keep predeterminable range.
As one preferred embodiment, described shower nozzle and described PCBA board all have six-freedom degree.
As one preferred embodiment, also comprise:
Obtain the sealing region of described PCBA board;
Accordingly, the default beginning glue spraying position that described shower nozzle moves to described PCBA board comprises: shower nozzle moves to the default beginning glue spraying position of described sealing region.
As one preferred embodiment, described default beginning glue spraying position is positioned at the position, border of described sealing region.
As one preferred embodiment, also comprise:
Obtain the adhesive liquid quantity of encapsulation needed for described PCBA board;
When molten glue produces the glue liquid mated mutually with described adhesive liquid quantity, described shower nozzle starts glue spraying.
By describing above and can find out, the application provides the glue sealing method of a kind of new PCBA board, by providing PCBA board to the predeterminable area of sealing equipment work platform, shower nozzle is moved to the default beginning glue spraying position of described PCBA board again, finally control described shower nozzle to described PCBA board glue spraying according to pre-defined rule, mould need not be provided, thus the glue sealing method of the PCBA board of the application can conveniently dimensional packaged circuit board, meet growing encapsulation requirement.
With reference to explanation hereinafter and accompanying drawing, disclose in detail the particular implementation of the present invention, specify the mode that the principle of the present invention can be used.It is to be understood that thus embodiments of the present invention are not restricted in scope. In the spirit of claims and the scope of clause, embodiments of the present invention comprise many changes, amendment and are equal to.
Describe and/or the feature that illustrates can use in same or similar mode in one or more other enforcement mode for a kind of mode of implementing, combine mutually with the feature in other enforcement mode, or the feature substituted in other enforcement mode.
It is emphasized that refer to the existence of feature, one integral piece, step or assembly herein when term " comprise/comprise " uses, but do not get rid of the existence or additional of one or more further feature, one integral piece, step or assembly.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, it is briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those skilled in the art, under the prerequisite not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the schema of a kind of glue sealing method implementing the PCBA board that mode provides of the application;
Fig. 2 is the schematic flow sheet that a kind of structure implemented mode and provide of the application has the three-dimensional system of coordinate of the mapping point of described shower nozzle and the 3D model of described PCBA board.
Embodiment
In order to make those skilled in the art understand the technical scheme in the application better, below in conjunction with the accompanying drawing in the embodiment of the present application, technical scheme in the embodiment of the present application is clearly and completely described, obviously, described embodiment is only some embodiments of the present application, instead of whole embodiments. Based on the embodiment in the application, other embodiments all that those of ordinary skill in the art obtain under the prerequisite not making creative work, all should belong to the scope of protection of the invention.
It should be noted that, when element is called as " being arranged at " another element, it can directly on another element or can also there is element placed in the middle. When an element is considered as " connection " another element, it can be directly connected to another element or may there is element placed in the middle simultaneously. Term as used herein " vertical ", " level ", "left", "right" and similar statement just for illustrative purposes, do not represent it is mode of uniquely implementing.
Unless otherwise defined, all technology used herein are identical with the implication that the those skilled in the art belonging to the present invention understand usually with scientific terminology. The term used in the description of the invention herein is the object in order to describe concrete enforcement mode, is not intended to be restriction the present invention. Term as used herein "and/or" comprises arbitrary and all combinations of one or more relevant Listed Items.
Please refer to Fig. 1, the application is a kind of implements the glue sealing method that mode provides a kind of PCBA board, and the method is applied to PCBA board glue spraying sealing operation. In the present embodiment, the glue sealing method of described PCBA board comprises the following steps:
S10, to sealing equipment work platform predeterminable area provide PCBA board.
In this step, the worktable of sealing equipment is used for accepting or placing PCBA board, just can carry out sealing operation when PCBA board is positioned at predeterminable area.Predeterminable area can be undertaking surface or the space of worktable, it is possible to thinking the part surface of worktable, its shape can be rectangular area, square region or other regular shapes, and certain irregular shape can also be suitable for, and the application is not restricted. The shape of predeterminable area can also with the mating shapes of PCBA board, and then just snap-fit when PCBA board is positioned over predeterminable area, is convenient to shower nozzle glue spraying operation. Single PCBA board can be once placed in same glue spraying region, it is also possible to place multiple PCBA board. When multiple PCBA board is placed simultaneously, it is possible to place at predeterminable area with the form tiled.
In this step, mechanical manipulator, the travelling belt of sealing equipment can be adopted to transmit PCBA board, such as, according to the form of production line, PCBA board is sent on worktable by travelling belt, now, or travelling belt carrying PCBA board moves to predetermined position and carries out glue spraying (travelling belt is simultaneously also as worktable). Certainly, the form of artificial placement can also be adopted in this step to place PCBA board in predeterminable area.
In present embodiment, there is no too much requirement for sealing environment, worktable can be arranged in actual environment, and then directly carries out glue spraying sealing operation at normal temperatures and pressures; Worktable can also be arranged in enclosed environment, and then completes the sealing operation of high sealing high quality sealing requirement.
S20, shower nozzle move to the default beginning glue spraying position of described PCBA board.
In this step, shower nozzle can move to the default beginning glue spraying position of described PCBA board by predetermined way. Predetermined way can start glue spraying position for manually moving to preset, it is possible to thinks that sealing equipment self differentiates and chooses. When shower nozzle is positioned at default beginning glue spraying position, starts to carry out conveying glue liquid shower nozzle to shower nozzle and start glue spraying.
Presetting beginning glue spraying position can for being positioned at any position of the glue spraying surface certain distance of PCBA board, and the application does not impose any restrictions. As preferably, in PCBA board, there is the height apart from described PCBA board bottom surface and it is less than the first area of preset height and when the height apart from described PCBA board bottom surface is greater than the 2nd region of preset height, it is possible to default starting position is arranged at first area as preferably scheme.
In the present embodiment, the movement of shower nozzle can for translation, rotate, shower nozzle can with regulating mechanism, such as telescopic boom, universal joint. Concrete, sealing equipment self can have virtual three-dimensional system of coordinate, this three-dimensional system of coordinate is corresponding with the real system of coordinates at shower nozzle place, shower nozzle has corresponding mapping point in described three-dimensional system of coordinate, is namely adjusted the position (degree of freedom) of shower nozzle by mobile and/or rotation by the corresponding relation of described mapping point and three-dimensional system of coordinate and reality system of coordinates.
S30, according to shower nozzle described in pre-defined rule to described PCBA board glue spraying.
When shower nozzle is to PCBA board glue spraying, shower nozzle self needs to keep the temperature equal or close with glue temperature, and then avoids glue liquid to solidify or carbonization at shower nozzle, prevents blocking shower nozzle.
In the present embodiment, pre-defined rule can be the predetermined glue spraying route of shower nozzle, PCBA board is carried out glue spraying according to predetermined glue spraying route by shower nozzle, predetermined glue spraying route can be " S " or " N " shape route, can also be carry out glue spraying at the center of PCBA board with circular track route and progressively increase the radius of circular track, certainly, it is also possible to carry out glue spraying according to broken line form.It may be seen that described predetermined glue spraying route can have various ways, only need to complete sealing in the present embodiment.
In addition, in the present embodiment, described pre-defined rule can comprise: shower nozzle described in glue spraying process is positioned at the predeterminable range place of described PCBA board. Wherein, predeterminable range can be the distance of the gum outlet distance PCBA board of shower nozzle, and then avoids the gum outlet of PCBA board blocking shower nozzle, cannot smooth and easy plastic emitting. This predeterminable range can be the distance of shower nozzle distance sprayed surface, it is possible to think the distance of the bottom surface (surface of pcb board) of shower nozzle distance PCBA board. By being provided with this predeterminable range, it is ensured that the smooth plastic emitting of shower nozzle.
Consider the electronic component that PCBA board includes pcb board and is arranged on pcb board, and it is higher to remove height on pcb board of some electronic component outside patch electronics element, fills and leads up coated glue spraying if all adopted, then make the thickness of glued membrane excessive, make glue consumption too much, cause cost excessive. For avoiding this kind of situation, PCBA board can be divided into the height apart from described PCBA board bottom surface (surface of pcb board) to be less than the first area of preset height and the height apart from described PCBA board bottom surface is greater than the 2nd region of preset height.
On the first region, mostly distribution is patch electronics element, such as paster resistance, patch capacitor, and the gap between electronic component. When spraying first area, predeterminable range between the bottom surface of described shower nozzle and described PCBA board, can be kept. Certainly, shower nozzle still needs higher than the highest electronic component on the first region.
Electronic component volume height on the second region is relatively big, mostly is the electronic component that some cannot carry out paster, now, for avoiding wall attachment effect, it is necessary to the 2nd region is carried out separately glue spraying, cannot carry out glue spraying according to the mode of filling and leading up again. During to the 2nd independent glue spraying in region, can also be interpreted as that the electronic component to the 2nd region carries out independent glue spraying, the object of glue spraying is the surface of electronic component, now, the surface of the electronic component that the sprayed surface of described PCBA board is on the 2nd region in the second area, therefore, when spraying described 2nd region, predeterminable range between the sprayed surface of described shower nozzle and described PCBA board, can be kept.
It should be noted that, predeterminable range between described shower nozzle and described PCBA board can be a value range can also be a concrete numerical value, such as: when predeterminable range can be a value range, shower nozzle can rise and fall along with the height on PCBA board surface changes when spraying first area; When predeterminable range is concrete numerical value, shower nozzle can move in spraying process in a horizontal plane.
Certainly, the setting of predeterminable range also needs the parameters such as speed that the kind according to glue liquid, temperature, shower nozzle advance, the kind pattern of PCBA board, the thickness of sealing to arrange, and specifically can set according to practical situation in actual, and the application is also not construed as limiting.
Feasible, described pre-defined rule can comprise: described in glue spraying process, the glue spraying direction of shower nozzle and the sprayed surface of described PCBA board are vertical all the time. Arranged by this kind, it is ensured that sealing effect preferably. In practice, it is possible to the sprayed surface of the gum outlet of shower nozzle and described PCBA board is faced setting. Continuing from the preceding paragraph description, when having first area and the 2nd region in PCBA board, shower nozzle is vertical glue spraying when spraying first area, still keeps vertical glue spraying when being transferred to the 2nd region glue spraying.
Preferably, described pre-defined rule can comprise: shower nozzle described in glue spraying process be positioned at all the time the glue spraying surface of described PCBA board above gravity direction. Arranged by this kind, it is possible to reduce the influence of gravity that the glue spraying direction of glue liquid during glue spraying is subject to greatest extent. Continuing from the preceding paragraph description, when having first area and the 2nd region in PCBA board, shower nozzle is positioned at above first area when spraying first area, and when being transferred to the 2nd region glue spraying, shower nozzle is positioned at the top in the 2nd region.
By describing above and can find out, present embodiment provides the glue sealing method of a kind of new PCBA board, by providing PCBA board to the predeterminable area of sealing equipment work platform, shower nozzle is moved to the default beginning glue spraying position of described PCBA board again, finally control described shower nozzle to described PCBA board glue spraying according to pre-defined rule, mould need not be provided, so, the glue sealing method of the PCBA board of present embodiment can conveniently dimensional packaged circuit board, meet growing encapsulation requirement.
In one embodiment, the glue sealing method of described PCBA board can also comprise the following steps:
S12, structure have the mapping point of described shower nozzle and the three-dimensional system of coordinate of the 3D model of described PCBA board; The system of coordinates at described three-dimensional system of coordinate and described PCBA board place has corresponding relation;
Accordingly, described comprising to described PCBA board glue spraying (described step 320) according to shower nozzle described in pre-defined rule: S300, based on the mapping point of described shower nozzle and the position relation of described 3D model and described corresponding relation according to shower nozzle described in pre-defined rule to described PCBA board glue spraying.
In the present embodiment, the execution order of step S12 and step S10 is not fixed, it is possible to first performing step S10 and can also first perform step S12, the application is also not construed as limiting. Certainly, it is possible to first to perform step S10 as preferred scheme.
Please refer to Fig. 2, in the present embodiment, the three-dimensional system of coordinate (described step S12) that described structure has the mapping point of described shower nozzle and the 3D model of described PCBA board can comprise the following steps:
S121, structure three-dimensional system of coordinate, have the mapping point of described shower nozzle in described three-dimensional system of coordinate;
S122, obtain the system of coordinates at described PCBA board place and the corresponding relation of described three-dimensional system of coordinate;
S123, the 3D model inputting described PCBA board in described three-dimensional system of coordinate.
Wherein, described three-dimensional system of coordinate shower nozzle and PCBA board are arranged in reality system of coordinates, the system of coordinates that the system of coordinates at described PCBA board place can be set up for the above-mentioned predeterminable area of worktable, the predetermined position point of predeterminable area is corresponding with the initial point of described three-dimensional system of coordinate and then builds reality system of coordinates, and this reality system of coordinates and described three-dimensional system of coordinate have default corresponding relation. When PCBA board is positioned at predeterminable area, it is possible to obtain the 3D model of PCBA board by scanning and obtain PCBA board in the position of predeterminable area, and then in described three-dimensional system of coordinate, PCBA board is reflected.
Certainly, can also be non-default corresponding relation between the system of coordinates at described PCBA board place and described three-dimensional system of coordinate. When PCBA board is positioned over the predeterminable area of worktable, obtained the corner location of PCBA board by scanning, set up reality system of coordinates by initial point of this corner location, now obtain the corresponding relation between itself and described three-dimensional system of coordinate again.
By described corresponding relation, a certain coordinate point in described three-dimensional system of coordinate can find corresponding mapping point in the system of coordinates at described PCBA board place, namely corresponding real position.Based on the mapping point of this corresponding relation and described shower nozzle, it is possible to the position of mobile shower nozzle in reality. Meanwhile, it is 3D model that described PCBA board is reflected in three-dimensional system of coordinate, and the position relation of the mapping point of 3D model and shower nozzle in three-dimensional system of coordinate is the position relation of PCBA board and shower nozzle in reality, and corresponding by described corresponding relation.
In step S123, the 3D model of described PCBA board can be inputted in described three-dimensional system of coordinate by inputting the mode of drawing, the 3D model that the mode built inputs described PCBA board in described three-dimensional system of coordinate can also be directly drawn in three-dimensional system of coordinate, certainly, it is also possible in described three-dimensional system of coordinate, inputted the 3D model of described PCBA board by the mode of scanning.
In one embodiment, consider the electronic component that PCBA board includes pcb board and is arranged on pcb board, and the height of some electronic component on pcb board is higher outside removing patch electronics element, if all adopting and filling and leading up coated glue spraying, then make the thickness of glued membrane excessive, make glue consumption too much, cause cost excessive. For avoiding this kind of situation, PCBA board can be divided into the height apart from described PCBA board bottom surface (surface of pcb board) to be less than the first area of preset height and the height apart from described PCBA board bottom surface is greater than the 2nd region of preset height. Considering based on this, described method can also comprise the following steps:
S30, when described shower nozzle is moved to described 2nd region by described first area or moves to described first area glue spraying by described 2nd region, mobile and/or rotate described shower nozzle and/or described PCBA board so that described shower nozzle according to pre-defined rule to described first area or described 2nd region glue spraying.
On the first region, mostly distribution is patch electronics element, such as paster resistance, patch capacitor, and the gap between electronic component. When spraying first area, predeterminable range between the bottom surface of described shower nozzle and described PCBA board, can be kept. Certainly, shower nozzle still needs higher than the highest electronic component on the first region. In addition, when spraying described first area, described shower nozzle performs to described first area to fill and lead up coated glue spraying. When filling and leading up coated glue spraying, it is possible to gap between electronic component in first area is filled and led up until by coated for electronic component (covering can also be interpreted as), and then complete sealing.
Electronic component volume height on the second region is relatively big, mostly is the electronic component that some cannot carry out paster, now, for avoiding wall attachment effect, it is necessary to the 2nd region is carried out separately glue spraying, cannot carry out glue spraying according to the mode of filling and leading up again. During to the 2nd independent glue spraying in region, can also be interpreted as that the electronic component to the 2nd region carries out independent glue spraying, the object of glue spraying is the surface of electronic component, now, the surface of the electronic component that the sprayed surface of described PCBA board is on the 2nd region in the second area, therefore, when spraying described 2nd region, predeterminable range between the sprayed surface of described shower nozzle and described PCBA board, can be kept. In addition, when spraying described 2nd region, described shower nozzle performs coated glue spraying to described 2nd region. During coated glue spraying, institute's glue spraying liquid only need to by the surface coverage of the 2nd regional Electronic element.
Concrete, on the basis being built with above-mentioned three-dimensional system of coordinate, it is possible to move according to position relation and the described corresponding relation of the mapping point of described shower nozzle and described 3D model and/or rotate described shower nozzle and/or described PCBA board, it is achieved automatically controlling.Described shower nozzle and described PCBA board all can have six-freedom degree.
In one embodiment, the glue sealing method of described PCBA board can also comprise the following steps:
S15, the sealing region obtaining described PCBA board.
Accordingly, the default beginning glue spraying position (described step 20) that described shower nozzle moves to described PCBA board comprising: shower nozzle moves to the default beginning glue spraying position of described sealing region.
In this application, when PCBA board is positioned in predeterminable area, it is possible to acquiescence all surfaces carries out sealing or upper surface carries out sealing. And in the present embodiment, for meeting growing sealing band of position demand, it is possible to specify sealing region by step S15, after PCBA board divides out sealing region, sealing region is only carried out glue spraying operation by shower nozzle.
Accept a upper enforcement mode to describe, can be undertaken choosing sealing region by selected mode in the three-dimensional system of coordinate with 3D model, the information that sealing equipment is chosen by receiving and then acquisition sealing region, very convenient. Concrete, described default beginning glue spraying position can be positioned at the position, border of described sealing region.
In one embodiment, the glue sealing method of described PCBA board can also comprise the following steps:
S40, the acquisition encapsulation adhesive liquid quantity needed for described PCBA board;
S50, molten glue produce mate mutually with described adhesive liquid quantity glue liquid time, described shower nozzle starts glue spraying.
In the present embodiment, step S40, S50 and other steps there is no and significantly perform sequencing, for ease of pipelining, it is possible to performs step S40 before sealing, and the PCBA board for same type, the adhesive liquid quantity needed for it is substantially identical.
Described adhesive liquid quantity can set according to single note glue institute requirement, and such as once noting glue roughly needs 10g, then melt glue 10g or be a bit larger tham the glue liquid of 10g. In the present embodiment, it is possible to carry out the amount of controlled melting glue liquid according to the demand of note glue product, the adhesive liquid quantity that molten glue once produces, it is substantially equal to the amount once noting glue or the amount of an encapsulation PCBA board, reaches i.e. molten i.e. use, meet the continuous production requirement of production line.
Any numeral value quoted herein all comprises between lower value to higher limit all values with the lower value of an incremented and upper value, there is the interval of at least two units between any lower value and any much higher value. For example, if having set forth the quantity of parts or the value of process variable (such as temperature, pressure, time etc.) is from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70, then object also lists such as 15 to 85,22 to 68,43 to 51,30 to 32 equivalence in this specification sheets clearly to illustrate. For the value being less than 1, suitably think that a unit is 0.0001,0.001,0.01,0.1. These are only the examples wanting clearly to express, it is possible to think that likely combining of the numerical value enumerated between Schwellenwert and maximum is all set forth clearly at this specification sheets in a similar manner.
Unless otherwise explanation, all scopes all comprise all numerals between end points and end points. " approximately " or " being similar to " used together with scope is suitable for two end points of this scope. Thus, " about 20 to 30 " are intended to cover " about 20 to about 30 ", at least comprise the end points indicated.
The all articles disclosed and bibliography, comprise patent application and publication, be incorporated into this by quoting for various purposes. Describe combination term " substantially by ... form " determined element, composition, parts or step should be comprised and substantially not affect other elements of the basic novel feature of this combination, composition, parts or step. Term " comprising " or the combination that describes " comprising " element here, composition, parts or step is used also to contemplate the enforcement mode being substantially made up of these elements, composition, parts or step. Here with the use of term " can ", it is intended to illustrate " can " described any attribute of comprising is all optional.
Multiple element, composition, parts or step can be provided by single integrated element, composition, parts or step.Alternatively, single integrated element, composition, parts or step can be divided into multiple elements of separation, composition, parts or step. The open "a" or "an" being used for describing element, composition, parts or step does not say the element in order to get rid of other, composition, parts or step.
Describe it is to be understood that above is to carry out illustrating instead of in order to limit. By reading foregoing description, many enforcement modes and many application outside the example provided will be all apparent for a person skilled in the art. Therefore, the scope of this instruction should do not determined with reference to foregoing description, but should determine with reference to whole scopes of the Equivalent that claims and these claims have. For comprehensive object, all articles and with reference to comprising the open all by reference to being combined in herein of patent application and bulletin. Aforementioned claim is omitted theme disclosed herein any in be not to abandon this body matter, also should not be considered as the part that this theme is not thought of as disclosed subject matter by contriver.
Claims (15)
1. the glue sealing method of a PCBA board, it is characterised in that, comprising:
PCBA board is provided to the predeterminable area of sealing equipment work platform;
Shower nozzle moves to the default beginning glue spraying position of described PCBA board;
According to shower nozzle described in pre-defined rule to described PCBA board glue spraying.
2. the method for claim 1, it is characterised in that, also comprise:
Build and there is the mapping point of described shower nozzle and the three-dimensional system of coordinate of the 3D model of described PCBA board; The system of coordinates at described three-dimensional system of coordinate and described PCBA board place has corresponding relation;
Accordingly, described comprise to described PCBA board glue spraying according to shower nozzle described in pre-defined rule: based on the mapping point of described shower nozzle and the position relation of described 3D model and described corresponding relation according to shower nozzle described in pre-defined rule to described PCBA board glue spraying.
3. method as claimed in claim 2, it is characterised in that, the three-dimensional system of coordinate that described structure has the mapping point of described shower nozzle and the 3D model of described PCBA board comprises:
Build three-dimensional system of coordinate, described three-dimensional system of coordinate has the mapping point of described shower nozzle;
Obtain the system of coordinates at described PCBA board place and the corresponding relation of described three-dimensional system of coordinate;
The 3D model of described PCBA board is inputted in described three-dimensional system of coordinate.
4. the method for claim 1, it is characterised in that: described PCBA board has the height apart from described PCBA board bottom surface and is less than the first area of preset height and the height apart from described PCBA board bottom surface is greater than the 2nd region of preset height;
Described method also comprises:
When described shower nozzle is moved to described 2nd region by described first area or moves to described first area glue spraying by described 2nd region, mobile and/or rotate described shower nozzle and/or described PCBA board so that described shower nozzle according to pre-defined rule to described first area or described 2nd region glue spraying.
5. the method as described in as arbitrary in Claims 1-4, it is characterised in that, described pre-defined rule comprises:
Shower nozzle described in glue spraying process is positioned at the predeterminable range place of described PCBA board.
6. the method as described in as arbitrary in Claims 1-4, it is characterised in that, described pre-defined rule comprises:
Described in glue spraying process, the glue spraying direction of shower nozzle and the sprayed surface of described PCBA board are vertical all the time.
7. the method as described in as arbitrary in Claims 1-4, it is characterised in that, described pre-defined rule comprises:
Shower nozzle described in glue spraying process be positioned at all the time the glue spraying surface of described PCBA board above gravity direction.
8. method as claimed in claim 4, it is characterised in that, described pre-defined rule comprises:
When spraying described first area, described shower nozzle performs to described first area to fill and lead up coated glue spraying.
9. method as claimed in claim 4, it is characterised in that, described pre-defined rule comprises:
When spraying described 2nd region, described shower nozzle performs coated glue spraying to described 2nd region.
10. method as claimed in claim 4, it is characterised in that, described pre-defined rule comprises:
When spraying described first area, between the bottom surface of described shower nozzle and described PCBA board, keep predeterminable range.
11. methods as claimed in claim 4, it is characterised in that, described pre-defined rule comprises:
When spraying described 2nd region, between the sprayed surface of described shower nozzle and described PCBA board, keep predeterminable range.
12. methods as claimed in claim 4, it is characterised in that, described shower nozzle and described PCBA board all have six-freedom degree.
13. the method for claim 1, it is characterised in that, also comprise:
Obtain the sealing region of described PCBA board;
Accordingly, the default beginning glue spraying position that described shower nozzle moves to described PCBA board comprises: shower nozzle moves to the default beginning glue spraying position of described sealing region.
14. methods as claimed in claim 13, it is characterised in that, described default beginning glue spraying position is positioned at the position, border of described sealing region.
15. the method for claim 1, it is characterised in that, also comprise:
Obtain the adhesive liquid quantity of encapsulation needed for described PCBA board;
When molten glue produces the glue liquid mated mutually with described adhesive liquid quantity, described shower nozzle starts glue spraying.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610061036.XA CN105665244A (en) | 2016-01-28 | 2016-01-28 | Sealing glue method for printed circuit board assembly (PCBA) plate |
| PCT/CN2016/107192 WO2017128822A1 (en) | 2016-01-28 | 2016-11-25 | Sealant application method for pcba |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610061036.XA CN105665244A (en) | 2016-01-28 | 2016-01-28 | Sealing glue method for printed circuit board assembly (PCBA) plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105665244A true CN105665244A (en) | 2016-06-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610061036.XA Pending CN105665244A (en) | 2016-01-28 | 2016-01-28 | Sealing glue method for printed circuit board assembly (PCBA) plate |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105665244A (en) |
| WO (1) | WO2017128822A1 (en) |
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| WO2017128822A1 (en) * | 2016-01-28 | 2017-08-03 | 苏州康尼格电子科技股份有限公司 | Sealant application method for pcba |
| CN108391386A (en) * | 2018-04-04 | 2018-08-10 | 苏州康尼格电子科技股份有限公司 | PCBA board sealed in unit and PCBA board packaging method |
| CN113993295A (en) * | 2021-10-13 | 2022-01-28 | 苏州康尼格电子科技股份有限公司 | PCBA board encapsulation UV glue solution and shower nozzle suitable for piezoelectric array shower nozzle |
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| CN111589670B (en) * | 2020-06-29 | 2022-05-24 | 深圳至峰精密制造有限公司 | Glue spraying method for assembling ion generator |
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| WO2017128822A1 (en) * | 2016-01-28 | 2017-08-03 | 苏州康尼格电子科技股份有限公司 | Sealant application method for pcba |
| CN108391386A (en) * | 2018-04-04 | 2018-08-10 | 苏州康尼格电子科技股份有限公司 | PCBA board sealed in unit and PCBA board packaging method |
| CN108391386B (en) * | 2018-04-04 | 2024-02-06 | 苏州康尼格电子科技股份有限公司 | PCBA (printed circuit board assembly) board packaging equipment and PCBA board packaging method |
| CN117062334A (en) * | 2018-04-04 | 2023-11-14 | 苏州康尼格电子科技股份有限公司 | PCBA (printed circuit board assembly) board packaging equipment and PCBA board packaging method |
| CN113993295B (en) * | 2021-10-13 | 2023-04-25 | 苏州康尼格电子科技股份有限公司 | PCBA board packaging equipment |
| WO2023060691A1 (en) * | 2021-10-13 | 2023-04-20 | 苏州康尼格电子科技股份有限公司 | Pcba board packaging method and packaging device therefor |
| CN114025505A (en) * | 2021-10-13 | 2022-02-08 | 苏州康尼格电子科技股份有限公司 | Packaging method and packaging equipment for PCBA (printed circuit board assembly) |
| CN116321788A (en) * | 2021-10-13 | 2023-06-23 | 苏州康尼格电子科技股份有限公司 | PCBA (printed circuit board assembly) board packaging equipment and PCBA board packaging method |
| CN116390372A (en) * | 2021-10-13 | 2023-07-04 | 苏州康尼格电子科技股份有限公司 | PCBA (printed circuit board assembly) board packaging method and packaging equipment |
| CN116390371A (en) * | 2021-10-13 | 2023-07-04 | 苏州康尼格电子科技股份有限公司 | PCBA (printed circuit board assembly) packaging equipment and packaging method thereof |
| CN114007339A (en) * | 2021-10-13 | 2022-02-01 | 苏州康尼格电子科技股份有限公司 | Packaging method and packaging equipment for PCBA (printed circuit board assembly) |
| CN116390371B (en) * | 2021-10-13 | 2024-01-09 | 苏州康尼格电子科技股份有限公司 | PCBA (printed circuit board assembly) packaging equipment and packaging method thereof |
| CN113993295A (en) * | 2021-10-13 | 2022-01-28 | 苏州康尼格电子科技股份有限公司 | PCBA board encapsulation UV glue solution and shower nozzle suitable for piezoelectric array shower nozzle |
| CN116321788B (en) * | 2021-10-13 | 2024-02-06 | 苏州康尼格电子科技股份有限公司 | PCBA (printed circuit board assembly) board packaging equipment and PCBA board packaging method |
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| WO2017128822A1 (en) | 2017-08-03 |
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