CN117038515B - Synchronous rotation lifting vacuum spindle system for wafer scrubbing - Google Patents
Synchronous rotation lifting vacuum spindle system for wafer scrubbing Download PDFInfo
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- CN117038515B CN117038515B CN202311016784.2A CN202311016784A CN117038515B CN 117038515 B CN117038515 B CN 117038515B CN 202311016784 A CN202311016784 A CN 202311016784A CN 117038515 B CN117038515 B CN 117038515B
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- 230000001360 synchronised effect Effects 0.000 title claims abstract description 33
- 238000005201 scrubbing Methods 0.000 title claims description 4
- 230000007246 mechanism Effects 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 18
- 230000008569 process Effects 0.000 claims abstract description 17
- 230000001680 brushing effect Effects 0.000 claims abstract description 14
- 238000007789 sealing Methods 0.000 claims description 118
- 230000033001 locomotion Effects 0.000 claims description 17
- 230000003068 static effect Effects 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 10
- 235000012431 wafers Nutrition 0.000 description 129
- 230000009471 action Effects 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
The invention relates to a synchronous rotation lifting vacuum spindle system for wafer brushing, which comprises a large-caliber brush tray, a vacuum rotation air passage, a wafer lifting mechanism and a tray rotation spindle, wherein the vacuum rotation air passage is arranged on the large-caliber brush tray; the tray rotating main shaft drives the vacuum rotating air passage shaft to synchronously rotate, and the vacuum rotating air passage shaft drives the wafer lifting thimble arranged at the top of the vacuum rotating air passage shaft to synchronously rotate along with the large-caliber brush tray; the wafer lifting thimble is driven by the wafer lifting mechanism to extend or retract from the lifting thimble opening of the large-caliber brush tray, and receives the cleaned wafer when extending outwards; the vacuum airflow entering from the bottom of the vacuum rotary air passage reaches a vacuum pressure maintaining air chamber connected with the large-caliber brush tray, and vacuum negative pressure is formed between the surface of the large-caliber brush tray and the cleaned wafer; the invention can realize the full-surface support of the wafer rotating at high speed, no shielding exists above the wafer in the rotating state, and the wafer can be taken and put after stopping rotating, thereby better realizing the process of physically removing the photoresist on a single chip.
Description
Technical Field
The invention relates to the technical field of semiconductor cleaning, in particular to a synchronous rotation lifting vacuum spindle system for wafer brushing.
Background
The core of the single-wafer physical photoresist removing technology is that a wafer rotating at a high speed is directly contacted with a brush rotating at a high speed, and a remarkable surface attachment removing effect is obtained by controlling the rotating torque and the surface contact force. With the rapid development of this technology, spindle devices for this technology are also continuously developed to meet various necessary process requirements. The design is mainly around how the wafer is taken and put and kept stationary during the subsequent high-speed rotation. According to the property of the acting force, common methods are vacuum adsorption and clamping force.
Wherein the diameter of the holder of the vacuum adsorption type spindle system is generally smaller than the diameter of the wafer, and the rotating wafer is fixed at the contact position of the surface of the holder and the wafer by using vacuum force; the wafer is placed on the surface of the wafer other than the contact surface between the holder and the wafer. The clamping force is typically applied to the edge of the wafer from the side along the diameter of the wafer by centripetal contraction. And the wafer is opened along the diameter direction when the wafer is required to be fetched and placed, so that the necessary fetching and placing space is obtained.
Because physical photoresist removal requires a pressing action from above on the entire wafer surface, conventional vacuum spindles cannot provide support to the entire wafer at the bottom; when the wafer is clamped by the clamping force from the side, a small number of positions on the front face are blocked by the clamp, and the pressing action on the whole wafer surface cannot be completed from above. Therefore, no matter which wafer clamping mode is used, the spindle needs a certain auxiliary device to meet the requirement of the process.
In addition, in the image lithography (Photolithography) commonly used in the semiconductor microelectronic fabrication field, the Wafer is used as the main carrier to be processed and the necessary Photolithography/photoresist/developing processes are required, and the contact with the photoresist medium is inevitably required in these processes. For photoresist removal, there are generally two general categories, chemical/physical. With the development of the semiconductor industry, the wafer diameter has increased to 12 inches 300mm and even larger, and the conventional basket/groove process has begun to emerge for short plates for large-size wafer processing, mainly in that huge cleaning tanks and handling mechanisms are difficult to arrange in clean rooms where the gold is on the spot, and the simultaneous control of product yield and crushing risk by the groove process for multicrystalline wafers.
Because single wafer processing equipment is easier to achieve direct contact with the wafer surface, and single wafer chemical removal is less efficient than slot chemical removal, single wafer physical photoresist or other processing photoresist species removal processes develop more rapidly in this context. Under the background that the current clamping/picking and placing device for the single wafer has certain use limitation, if a synchronous rotation lifting vacuum spindle for wafer brushing can be provided, so that the full-surface support of the wafer rotating at high speed can be simultaneously met at the same operation position, the upper part of the wafer is not shielded in the rotating state, and the wafer can be picked and placed after stopping rotating, thereby better realizing the process of physically removing photoresist on a single wafer, and having very important significance.
Disclosure of Invention
The invention aims to solve the defects and provide a synchronous rotation lifting vacuum spindle system for wafer scrubbing, which can realize the full-surface support of a wafer rotating at a high speed, is free from shielding above the wafer in a rotating state, and can be taken and placed after the wafer stops rotating, so that the process of removing photoresist by a single chip physically is better realized, and meanwhile, the problems of dynamic balance and reliability in high-speed rotation caused by axial asymmetry of the installation position between a lifting system and a vacuum system are avoided.
The synchronous rotation lifting vacuum spindle system for wafer brushing comprises a large-caliber brush tray 1, a vacuum rotation air passage 2, a wafer lifting mechanism 3 and a tray rotation spindle 4, wherein the large-caliber brush tray 1 is positioned at the top of the spindle system, the innermost vacuum rotation air passage 2, the middle synchronous rotation wafer lifting mechanism 3 and the outermost tray rotation spindle 4 are arranged below the large-caliber brush tray 1 and are coaxially arranged from inside to outside; the tray rotating main shaft 4 provides a rotating driving force, the top of the tray rotating main shaft 4 is connected with the large-caliber brush tray 1, the tray rotating main shaft 4 drives the vacuum rotating air passage shaft 2.3 of the vacuum rotating air passage 2 to synchronously rotate, and the vacuum rotating air passage shaft 2.3 drives the wafer lifting thimble 3.1 arranged at the top of the vacuum rotating air passage shaft to synchronously rotate along with the large-caliber brush tray 1 driven by the tray rotating main shaft 4; the wafer lifting mechanism 3 provides lifting driving force and drives the vacuum rotary air flue 2 and the wafer lifting thimble 3.1 to do axial reciprocating motion, and the wafer lifting thimble 3.1 stretches out or retracts in the lifting thimble opening 1.3 of the large-caliber brush tray 1 under the driving of the wafer lifting mechanism 3 and receives the cleaned wafer 1.2 when stretching out; the vacuum airflow entering from the bottom of the vacuum rotary air passage 2 reaches a vacuum pressure maintaining air chamber 2.1 connected with the large-caliber brush tray 1, and provides vacuum airflow to the surface of the large-caliber brush tray 1 through a lifting thimble opening 1.3, so that vacuum negative pressure is formed between the surface of the large-caliber brush tray 1 and the cleaned wafer 1.2, the cleaned wafer 1.2 is fixed on the surface of the large-caliber brush tray 1 through the vacuum negative pressure, and the fixed relation between the cleaned wafer and the large-caliber brush tray 1 is released when the vacuum airflow is cut off.
Further, the large-caliber hairbrush tray 1 comprises a tray body, a vacuum air passage 1.4 is arranged on the upper surface of the tray body, the vacuum air passage 1.4 is used for vacuum negative pressure transmission, a lifting thimble opening 1.3 is formed in the middle of the tray body, the lifting thimble opening 1.3 is communicated with the vacuum air passage 1.4, a tray datum plane 1.5 is formed by inwards sinking the middle of the lower surface of the tray body, the tray datum plane 1.5 is communicated with the lifting thimble opening 1.3, and the lifting thimble opening 1.3 is used for providing vacuum for the large-caliber hairbrush tray 1 and extending out of the wafer lifting thimble 3.1.
Further, the vacuum rotary air flue 2 comprises a vacuum rotary air flue shaft 2.3, a main shaft top rotary sealing ring 2.2 and a main shaft bottom rotary sealing ring 2.4 are respectively arranged at the top and the bottom of the vacuum rotary air flue shaft 2.3, a vacuum pressure maintaining air chamber 2.1 is arranged above the main shaft top rotary sealing ring 2.2, a vacuum air inlet 2.5 is formed in the tray rotary main shaft 4, and the vacuum air inlet 2.5 is positioned below the main shaft bottom rotary sealing ring 2.4.
Further, the vacuum pressure maintaining air chamber 2.1 is located below the large-caliber brush tray 1, the vacuum pressure maintaining air chamber 2.1 is formed by assembling the top of the tray rotating main shaft 4 and the tray reference surface 1.5 and then closing, and the vacuum pressure maintaining air chamber 2.1 is used for providing a buffer area of a vacuum flow channel and is used as a storage space for the wafer lifting thimble 3.1 to be lowered below the tray vacuum suction surface.
Further, the rotary sealing ring 2.2 at the top of the main shaft is provided with two sealing points, one is a rotary sealing point which is in contact with the vacuum rotary air passage shaft 2.3, the rotary sealing point adopts a high-hardness contact surface and an oil seal for sealing, the other is a static sealing point which is in contact with the vacuum pressure maintaining air chamber 2.1, the static sealing point adopts an O-shaped ring for sealing, and the rotary sealing ring 2.2 at the top of the main shaft is used for sealing at the contact position of the vacuum rotary air passage shaft 2.3 and the outer side of the vacuum pressure maintaining air chamber 2.1 so as to prevent the vacuum air flow from leaking along the axial direction.
Further, a spacing cavity 2.6 is formed between the inner side surface of the rotary sealing ring 2.2 at the top of the main shaft and the top of the vacuum rotary air passage shaft 2.3, and the spacing cavity 2.6 is used for avoiding the track of the vacuum rotary air passage shaft 2.3 at the upper using point, so that the dynamic sealing position is not influenced by the vacuum rotary air passage shaft 2.3 moving axially.
Further, the rotary sealing ring 2.4 at the bottom of the main shaft is provided with two sealing points, the two sealing points are rotary sealing points, the rotary sealing ring 2.4 provides rotary sealing at two sides of the vacuum rotary air passage shaft 2.3, and the outer surface of the rotary sealing ring 2.4 is connected with the linear driver 3.3 to obtain driving force from the wafer lifting mechanism 3.
Further, a vacuum hollow channel is axially arranged inside the vacuum rotary air channel shaft 2.3, the top of the vacuum hollow channel is communicated with the vacuum pressure maintaining air chamber 2.1, the bottom of the vacuum hollow channel is communicated with the vacuum air inlet 2.5, and the vacuum air inlet 2.5 at the bottom of the vacuum rotary air channel shaft 2.3 obtains the vacuum flow transmitted by the vacuum air chamber formed by the rotary sealing ring 2.4 at the bottom of the main shaft in the continuous rotary process.
Further, the wafer lifting mechanism 3 is arranged along the vacuum rotating air channel 2, the wafer lifting mechanism 3 comprises a wafer lifting thimble 3.1, a spline guide shaft sleeve 3.2 and a linear driver 3.3 which are sequentially arranged from top to bottom, the wafer lifting thimble 3.1 is installed at the top of the vacuum rotating air channel shaft 2.3, the wafer lifting thimble 3.1 is used for extending outwards to receive the cleaned wafer 1.2, the spline guide shaft sleeve 3.2 is installed below the sealing position of the top rotating sealing ring 2.2, the spline guide shaft sleeve 3.2 is connected with the vacuum rotating air channel shaft 2.3 and the tray rotating main shaft 4 through splines, the spline guide shaft sleeve 3.2 transfers the rotating motion of the tray rotating main shaft 4 to the vacuum rotating air channel shaft 2.3, the linear driver 3.3 is arranged at the bottom and is connected with the main shaft bottom rotating sealing ring 2.4, and the linear driver 3.3 adopts but is not limited to an air cylinder or an electric cylinder and the linear driver 3.3 provides an axial moving pushing force for the main shaft bottom rotating sealing ring 2.4.
Further, the tray rotating main shaft 4 comprises a driving motor 4.1, a main shaft driving wheel 4.2 and a main shaft outer shaft 4.3, wherein a synchronous pulley is arranged at the output end of the driving motor 4.1, the driving motor 4.1 is connected with the main shaft driving wheel 4.2 through the synchronous pulley and the synchronous belt and drives the main shaft driving wheel 4.2 to rotate, the main shaft driving wheel 4.2 is arranged at the bottom of the main shaft outer shaft 4.3, the top of the main shaft outer shaft 4.3 is connected with the large-caliber brush tray 1, the middle part of the main shaft outer shaft 4.3 is connected with a spline guide shaft sleeve 3.2, the main shaft outer shaft 4.3 drives a vacuum rotating air passage shaft 2.3 to synchronously rotate through the spline guide shaft sleeve 3.2, and the vacuum rotating air passage shaft 2.3 drives a wafer lifting thimble 3.1 arranged at the top of the main shaft to synchronously rotate along with the large-caliber brush tray 1 driven by the main shaft outer shaft 4.3.
Compared with the prior art, the invention has the following advantages:
(1) The large-caliber brush tray at the top of the main shaft has a stable vacuum sucking function on a wafer and a complete bottom support, and can implement the brush pressing action with larger pressure on the surface of the wafer.
(2) The bottom of the brush tray of the invention has a larger vacuum airtight area. As a buffer zone of the vacuum flow, the phenomenon of unstable negative pressure caused by slight leakage can be prevented; meanwhile, the area is taken as a storage space for the wafer lifting thimble to be lowered below the suction surface of the tray; the larger diameter of the area increases the connection rigidity between the main shaft and the rotary table, and simultaneously gives consideration to the design of negative pressure buffering and mechanical action storage space, so that the effect of three functions is achieved.
(3) The vacuum transmission of the brush tray is realized by the non-contact air cavities at the two sides of the inner shaft respectively, and in the high-speed rotation, the air inlet holes and the air outlet holes at the two sides of the rotating shaft rotate along with the shaft, and no mechanical contact exists in the process of outputting air flow; the vacuum sealing of the high-speed rotating body is realized by combining a high-hardness contact surface (the hardness is HRC55 or more) on the rotating shaft with an oil seal.
(4) Because the inner shaft of the main shaft system is the driven shaft of the outer shaft and the inner shaft needs to perform axial linear motion, a rotating bearing can be arranged on one side of the shaft only, and in order to realize that the positions of the vacuum air hole and the lifting thimble on the tray always synchronously rotate, the invention combines a zero-clearance pre-pressing spline nut with a high-precision mounting surface (the axial total runout is lower than 0.02 mm) customized on the shaft on the linear motion side where the bearing cannot be mounted, so that the cantilever structure can realize the required rotation precision.
(5) The invention realizes the uniform structure of the wafer lifting thimble channel and the vacuum air channel in the central axis direction of the same rotating system by the synchronous rotation of the vacuum inner shaft and the tray outer shaft provided by the single motor, and avoids the axial asymmetry of the mounting position between the lifting system and the vacuum system and a series of dynamic balance and reliability problems in high-speed rotation caused by the axial asymmetry.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view of the structure of the large caliber brush tray of the present invention;
FIG. 3 is a schematic diagram of a second embodiment of the present invention at a large caliber brush tray;
FIG. 4 is a schematic view of a third embodiment of the present invention at a large caliber brush tray;
FIG. 5 is a schematic view of a large caliber brush tray of the present invention;
FIG. 6 is a schematic view of the structure of the vacuum rotary air passage of the present invention;
FIG. 7 is an enlarged view of a portion of FIG. 6;
FIG. 8 is a schematic view of the vacuum rotary airway of the present invention in a retracted state;
FIG. 9 is a schematic view of the vacuum rotary airway of the present invention in an extended state;
FIG. 10 is a schematic view of the structure of the wafer lift mechanism of the present invention;
FIG. 11 is a schematic view of the structure of the tray of the present invention at the main rotation shaft;
FIG. 12 is a schematic view of a portion of the structure of FIG. 11;
FIG. 13 is a partial schematic diagram II of FIG. 11;
in the figure: 1. the large-caliber brush tray 2, a vacuum rotary air passage 3, a wafer lifting mechanism 4, a tray rotary main shaft 1.1, a cleaning brush 1.2, a cleaned wafer 1.3, a lifting thimble opening 1.4, a vacuum air passage 1.5, a tray datum plane 2.1, a vacuum pressure maintaining air chamber 2.2, a main shaft top rotary sealing ring 2.3, a vacuum rotary air passage shaft 2.4, a main shaft bottom rotary sealing ring 2.5, a vacuum air inlet 2.6, a spacing cavity 3.1, a wafer lifting thimble 3.2, a spline guide shaft sleeve 3.3, a linear driver 4.1, a driving motor 4.2, a main shaft driving wheel 4.3 and a main shaft outer shaft.
Detailed Description
The vacuum description belongs to the application range of vacuum suction, and the approximate interval is 70-95 kpa; the inner shaft is the vacuum rotating air passage, and the outer shaft is the tray rotating main shaft.
The invention provides a synchronous rotation lifting vacuum spindle system for wafer brushing, which comprises a large-caliber brush tray 1, a vacuum rotation air passage 2, a wafer lifting mechanism 3 and a tray rotation spindle 4, wherein the large-caliber brush tray 1 is positioned at the top of the spindle system, the innermost vacuum rotation air passage 2, the middle synchronous rotation wafer lifting mechanism 3 and the outermost tray rotation spindle 4 are arranged below the large-caliber brush tray 1 and are coaxially arranged from inside to outside; the tray rotating main shaft 4 provides a rotating driving force, the top of the tray rotating main shaft 4 is connected with the large-caliber brush tray 1, the tray rotating main shaft 4 drives the vacuum rotating air passage shaft 2.3 of the vacuum rotating air passage 2 to synchronously rotate, and the vacuum rotating air passage shaft 2.3 drives the wafer lifting thimble 3.1 arranged at the top of the tray rotating main shaft to synchronously rotate along with the large-caliber brush tray 1 driven by the tray rotating main shaft 4; the wafer lifting mechanism 3 provides lifting driving force and drives the vacuum rotary air flue 2 and the wafer lifting thimble 3.1 to do axial reciprocating motion, and the wafer lifting thimble 3.1 stretches out or retracts in the lifting thimble opening 1.3 of the large-caliber brush tray 1 under the driving of the wafer lifting mechanism 3 and receives the cleaned wafer 1.2 when stretching out; the vacuum air flow entering from the bottom of the vacuum rotary air passage 2 reaches a vacuum pressure maintaining air chamber 2.1 connected with the large-caliber brush tray 1, and provides vacuum air flow to the surface of the large-caliber brush tray 1 through a lifting thimble opening 1.3, so that vacuum negative pressure is formed between the surface of the large-caliber brush tray 1 and the cleaned wafer 1.2, the cleaned wafer 1.2 is fixed on the surface of the large-caliber brush tray 1 through the vacuum negative pressure, and the fixed relation between the cleaned wafer and the large-caliber brush tray 1 is released when the vacuum air flow is cut off.
The large-caliber hairbrush tray 1 comprises a tray body, wherein a vacuum air passage 1.4 is formed in the upper surface of the tray body, the vacuum air passage 1.4 is used for vacuum negative pressure transmission, a lifting thimble opening 1.3 is formed in the middle of the tray body, the lifting thimble opening 1.3 is communicated with the vacuum air passage 1.4, a tray datum plane 1.5 is formed by inwards sinking the middle of the lower surface of the tray body, the tray datum plane 1.5 is communicated with the lifting thimble opening 1.3, and the lifting thimble opening 1.3 is used for providing vacuum for the large-caliber hairbrush tray 1 and for extending out a wafer lifting thimble 3.1.
The vacuum rotary air flue 2 comprises a vacuum rotary air flue shaft 2.3, a main shaft top rotary sealing ring 2.2 and a main shaft bottom rotary sealing ring 2.4 are respectively arranged at the top and the bottom of the vacuum rotary air flue shaft 2.3, a vacuum pressure maintaining air chamber 2.1 is arranged above the main shaft top rotary sealing ring 2.2, a vacuum air inlet 2.5 is formed in the tray rotary main shaft 4, and the vacuum air inlet 2.5 is positioned below the main shaft bottom rotary sealing ring 2.4. The vacuum pressure maintaining air chamber 2.1 is positioned below the large-caliber hairbrush tray 1, the vacuum pressure maintaining air chamber 2.1 is formed by closing the top of the tray rotating main shaft 4 and the tray reference surface 1.5 after being assembled, and the vacuum pressure maintaining air chamber 2.1 is used for providing a buffer area of a vacuum flow channel and is used as a storage space for the wafer lifting thimble 3.1 to be lowered below the tray vacuum suction surface. The rotary sealing ring 2.2 at the top of the main shaft is provided with two sealing points, one is a rotary sealing point contacted with the vacuum rotary air passage shaft 2.3, the rotary sealing point adopts a high-hardness contact surface and an oil seal for sealing, the other is a static sealing point contacted with the vacuum pressure maintaining air chamber 2.1, the static sealing point adopts an O-shaped ring for sealing, and the rotary sealing ring 2.2 at the top of the main shaft is used for sealing at the contact position of the vacuum rotary air passage shaft 2.3 and the outer side of the vacuum pressure maintaining air chamber 2.1 so as to prevent vacuum air flow from leaking along the axial direction; an interval cavity 2.6 is formed between the inner side surface of the rotary sealing ring 2.2 at the top of the main shaft and the top of the vacuum rotary air passage shaft 2.3, and the interval cavity 2.6 is used for avoiding the track of the vacuum rotary air passage shaft 2.3 at the upper using point, so that the dynamic sealing position is not influenced by the vacuum rotary air passage shaft 2.3 moving axially. The rotary sealing ring 2.4 at the bottom of the main shaft is provided with two sealing points, the two sealing points are rotary sealing points, the rotary sealing ring 2.4 provides rotary sealing on two sides of the vacuum rotary air passage shaft 2.3, and the outer surface of the rotary sealing ring 2.4 is connected with the linear driver 3.3 to obtain driving force from the wafer lifting mechanism 3. The inside of the vacuum rotary air passage shaft 2.3 is provided with a vacuum hollow passage along the axial direction, the top of the vacuum hollow passage is communicated with the vacuum pressure maintaining air chamber 2.1, the bottom of the vacuum hollow passage is communicated with the vacuum air inlet 2.5, and the vacuum air inlet 2.5 at the bottom of the vacuum rotary air passage shaft 2.3 obtains the vacuum flow transmitted by the vacuum air chamber formed by the rotary sealing ring 2.4 at the bottom of the main shaft in the continuous rotary process.
The wafer lifting mechanism 3 is arranged along the vacuum rotary air channel 2, the wafer lifting mechanism 3 comprises a wafer lifting thimble 3.1, a spline guide shaft sleeve 3.2 and a linear driver 3.3 which are sequentially arranged from top to bottom, the wafer lifting thimble 3.1 is arranged at the top of the vacuum rotary air channel shaft 2.3, the wafer lifting thimble 3.1 is used for extending outwards to receive the cleaned wafer 1.2, the spline guide shaft sleeve 3.2 is arranged below the sealing position of the top rotary sealing ring 2.2, the spline guide shaft sleeve 3.2 is connected with the vacuum rotary air channel shaft 2.3 and the tray rotary main shaft 4 through splines, the spline guide shaft sleeve 3.2 transfers the rotary motion of the tray rotary main shaft 4 to the vacuum rotary air channel shaft 2.3, the linear driver 3.3 is arranged at the bottom and is connected with the rotary sealing ring 2.4 at the bottom of the main shaft, and the linear driver 3.3 adopts but not limited to be an air cylinder or an electric cylinder, and the linear driver 3.3 provides an axial moving pushing force for the rotary sealing ring 2.4 at the bottom of the main shaft.
The tray rotating main shaft 4 comprises a driving motor 4.1, a main shaft driving wheel 4.2 and a main shaft outer shaft 4.3, wherein a synchronous pulley is arranged at the output end of the driving motor 4.1, the driving motor 4.1 is connected with the main shaft driving wheel 4.2 through the synchronous pulley and the synchronous belt and drives the main shaft driving wheel 4.2 to rotate, the main shaft driving wheel 4.2 is arranged at the bottom of the main shaft outer shaft 4.3, the top of the main shaft outer shaft 4.3 is connected with the large-caliber brush tray 1, the middle part of the main shaft outer shaft 4.3 is connected with a spline guide shaft sleeve 3.2, the main shaft outer shaft 4.3 drives a vacuum rotating air passage shaft 2.3 to synchronously rotate through the spline guide shaft sleeve 3.2, and the vacuum rotating air passage shaft 2.3 drives a wafer lifting thimble 3.1 arranged at the top of the main shaft to synchronously rotate along with the large-caliber brush tray 1 driven by the main shaft outer shaft 4.3.
The main action principle of the invention is as follows:
(1) Before the wafer loading starts, the synchronously rotating wafer lifting mechanism reaches the upper use point, and the wafer is transmitted to the thimble of the wafer lifting mechanism by the mechanical arm.
(2) After the wafer is placed on the thimble, the wafer lifting mechanism reaches a lower using point, so that the wafer falls on the surface of the large-caliber brush tray.
(3) The external vacuum system is started, vacuum negative pressure enters from a vacuum air inlet at the bottom of the vacuum rotary air passage, reaches a vacuum pressure maintaining air chamber connected with the brush tray, provides vacuum air flow for the surface of the brush tray through the lifting thimble opening, and after enough vacuum negative pressure is formed between the vacuum air passage and the wafer, the wafer completes the fixing action on the surface of the brush tray.
(4) The tray rotating main shaft is provided with a designated rotating torque and rotating speed by a driving motor which is coaxially arranged with the main shaft outer shaft, the top of the main shaft outer shaft is connected with the large-caliber brush tray, and the rotating torque and rotating speed of the motor are finally transmitted to the cleaned wafer because the wafer is fixed on the surface of the brush tray in vacuum at the moment.
(5) The wafer positioned on the surface of the brush tray is directly contacted with the brush for cleaning which rotates at high speed above in the high-speed rotation process, and the brush continuously moves transversely on the surface of the wafer according to specific cleaning requirements until the adhesive film on the surface of the wafer is cleaned.
(6) After the brush operation is completed, the brush tray is stopped rotating along with the driving motor, the vacuum flow is cut off from the outside, the vacuum air passage on the surface of the tray loses vacuum, and the mutual fixing relation between the wafer and the brush tray is released.
(7) Because the outer spindle shaft and the vacuum inner shaft transmit synchronous rotation motions through the spline guide sleeve, the wafer lifting thimble is always positioned below the lifting thimble opening; after the rotation is stopped, the lifting mechanism reaches the upper use point, the wafer reaches the unloading position, and the spindle operation is completed.
The invention is further described below with reference to the accompanying drawings and specific examples:
the invention mainly comprises four parts, namely a large-caliber brush tray positioned at the top of the whole system, and three shaft systems which are coaxially distributed from inside to outside: an innermost vacuum rotating air passage, a synchronous rotating wafer lifting mechanism positioned in the middle and an outermost tray rotating main shaft.
The large-caliber brush tray 1 is a single high-precision ceramic work piece, except for the need to satisfy the complete support of 300mm or more wafers, and the need to have an outer shape with a diameter of at least 300mm or more. The part structure needs to contain the following three important characteristics: the vacuum air passage 1.4 positioned on the surface of the tray, the lifting thimble opening 1.3 communicated with the vacuum air passage, the tray reference surface 1.5 communicated with the lifting thimble opening and with processing precision meeting the airtight and high-speed shaft rotation precision are formed, and the characteristics of the vacuum chuck positioned on the surface of the tray belong to the standard requirements of the vacuum chuck, so that the surface precision characteristics are not repeated.
The vacuum rotary air channel 2 (inner shaft) is composed of a vacuum pressure maintaining air chamber side 2.1 at the top, a rotary sealing ring 2.2 at the top of the main shaft, a vacuum rotary air channel shaft 2.3, a rotary sealing ring 2.4 at the bottom of the main shaft and a vacuum air inlet 2.5 at the bottom from top to bottom. The vacuum sealing of the whole shaft system is completed by a pressure maintaining air chamber and a sealing ring at two sides of the shaft. The pressure maintaining air chamber is closed after being assembled by the outer shaft top structure and the tray datum plane, a vacuum airtight area is formed, the vacuum airtight area is used as a buffer area of vacuum flow to prevent the phenomenon of unstable negative pressure caused by slight leakage, and meanwhile, the vacuum airtight area is used as a storage space for the wafer lifting thimble in the lifting system to be lowered below the vacuum suction surface of the tray. The vacuum air inlet is a part of the structure on the shaft of the vacuum rotary air passage, and in high-speed rotation, the vacuum air inlet position is a non-contact air cavity, and the vacuum air cavity formed by the sealing ring at the bottom of the shaft provides vacuum flow. The rotary sealing ring at the top of the main shaft and the rotary sealing ring at the bottom of the main shaft are respectively composed of corresponding structural parts, oil seals and other sealing rings. The rotary seal ring provides only rotary seals on both sides of the shaft, requiring a linear drive to be attached to the outer surface of the structural member and obtaining the drive force from the lifting system. The top rotary sealing ring is used for sealing at the shaft contact position and the outer side of the pressure maintaining air chamber respectively, so that the vacuum air flow is prevented from leaking along the shaft direction.
The wafer lifting mechanism 3 which rotates synchronously belongs to the sum of a series of devices arranged along a vacuum rotating air passage, the top is a wafer lifting thimble 3.1 arranged at the top of a vacuum rotating air passage shaft and used for extending outwards to receive a wafer, and a spline guide shaft sleeve 3.2 arranged below the sealing position of a top rotating sealing ring is used for transferring the rotating motion of an outer shaft to the air passage shaft; and a linear actuator 3.3 mounted at the bottom and connected to the bottom sealing ring; the whole set of mechanism is mainly responsible for providing axial reciprocating motion and rotation of the spindle so as to simultaneously realize rotation and picking and placing operation of the spindle system on wafers.
The tray rotating main shaft 4 (outer shaft) is driven by a coaxially arranged driving motor 4.1 to transmit rotation motion to a main shaft driving wheel 4.2 through a synchronous pulley on the motor, the driving wheel is arranged at the bottom of the main shaft outer shaft 4.3, the top of the outer shaft is connected with the brush tray, and the middle of the outer shaft is connected with a spline guide shaft sleeve. In the rotating process of the whole set of outer shaft system, the outer shaft drives the inner shaft to synchronously rotate through the spline, and the inner shaft rotates to drive the wafer lifting thimble arranged at the top to synchronously rotate along with the large-caliber brush tray driven by the outer shaft. Thereby realizing that the position of the lifting mechanism is always consistent with the position of the lifting jack hole on the rotating brush tray.
As shown in fig. 2 to 5, the wafer lifting mechanism starts the loading of the wafer at a point; the wafer lifting mechanism is provided with a using point, and the wafer is completely loaded; the large diameter brush tray vacuum fixes the wafer (the tray provides a vacuum force application surface). The large-caliber brush tray is positioned at the top of the main shaft system, and the tray rotates the main shaft to provide rotary driving force; when the wafer lifting thimble extends out, the wafer is in a goods taking state; the lifting thimble opening can be used for vacuum supply of the brush tray firstly and the stretching position of the lifting thimble which synchronously rotates secondly; the vacuum air passage is connected with the thimble opening and used for transmitting vacuum negative pressure. As can be seen from fig. 5, the wafer is smaller than the brush tray in size, and can provide a supporting force to the entire surface of the wafer, which is shown in an adsorbed state, and the wafer starts to be cleaned by the brush.
As shown in fig. 6 to 9, the large-caliber brush tray wafer is vacuum-fixed, and the vacuum air channel provides vacuum air flow; the main shaft starts to rotate, the inner shaft synchronously rotates, and the hairbrush starts to work; stopping the rotation of the spindle, enabling the wafer lifting mechanism to reach an upper enabling point, and discharging the wafer; and (5) finishing the operation. The vacuum rotating air channel is positioned at the top of the main shaft system, and the tray rotates the main shaft to provide rotating driving force. The vacuum pressure maintaining air chamber is positioned below the large-caliber brush tray, and provides a buffer area of a vacuum flow channel, so that the vacuum is cut off accidentally, short-term vacuum flow supplement is obtained, a certain stall time is given to the rotating main shaft, and the possibility of wafer flying on the brush tray at the moment of losing vacuum is avoided. The rotary sealing ring at the top of the main shaft is positioned at the top of the vacuum rotating shaft and is provided with two sealing points which are respectively rotary sealing points in contact with the shaft of the vacuum rotating air passage, the position is sealed by adopting a high-hardness contact surface HRC55 or more plus oil seal, the roughness of the dynamic sealing surface is required to be improved to achieve Ra0.1um for ensuring the durability, and the other is a static sealing point in contact with the vacuum pressure maintaining air chamber, and the position is sealed by adopting an O-shaped ring. The vacuum rotating air passage shaft, because the top sealing ring only provides radial sealing and needs rotation and axial linear motion, the bearing of the air passage shaft is arranged at the bottom of the air passage shaft, and although the axial load is not involved in the invention, the axial runout of the shaft needs to be controlled below at least 0.02mm because the axial load is not involved in the invention (the diameter-length ratio exceeds 1:25), and the axial runout of the shaft needs to be synchronously rotated with the brush tray. The rotary sealing ring at the bottom of the main shaft is positioned at the bottom of the vacuum rotating shaft and is also provided with two sealing points, and the two sealing points are dynamically sealed, so that the two sealing points are sealed in 2 dynamic sealing modes which are the same as those of the rotary sealing ring at the top. The vacuum air inlet is arranged on the rotary table, the vacuum air inlet position is a non-contact air cavity, and the vacuum air hole at the bottom of the shaft of the vacuum rotary air channel is used for obtaining the vacuum flow transmitted by the vacuum air cavity formed by the sealing ring at the bottom of the shaft in the continuous rotary process. The rotary sealing ring at the top of the main shaft comprises a spacing cavity, a gap is formed between the spline shaft and the top of the rotary sealing ring, sealing is not affected, and the spacing cavity is used for avoiding a spline shaft track at an upper using point, so that the dynamic sealing position is not affected by a spline groove moving axially.
As shown in fig. 10, the axial movement guiding of the inner shaft is carried by the spline guide sleeve, and the spline for driving the inner shaft and the outer shaft to rotate synchronously needs to use a light pre-pressing level in order to ensure that enough precision is used. Unlike a standard spline shaft, this vacuum spline shaft needs to meet both the high hardness index at the ends mentioned above in addition to the grooves required for basic spline guiding to obtain a sufficient vacuum airtight effect, and to meet the vacuum hollow passage mentioned above. The bottom rotary seal is directly connected with a small linear driver, and the bottom rotary seal ring bearing is used for supporting the vacuum inner shaft, so that the seal ring body where the bearing is positioned is pushed from the outside, and the driving force for axially moving the vacuum inner shaft is provided.
As shown in fig. 11 to 13, the spline guide bush is provided with splines for connecting the inner shaft and the outer shaft, and the rotational movement is transmitted to the inner shaft through the main shaft driving wheel by the driving motor while the axial movement of the inner shaft is achieved. The rotating inner shaft rotates to drive the wafer lifting thimble arranged at the top, and the large-caliber brush tray driven by the outer shaft synchronously rotates, so that the position of the lifting mechanism is always consistent with the position of a lifting thimble hole on the rotating brush tray.
The details not described in detail in this specification belong to the prior art known to those skilled in the art, all standard parts used by the standard parts can be purchased from the market, the special-shaped parts can be customized according to the description of the specification and the drawings, the specific connection modes of all parts adopt conventional means such as mature bolts, rivets and welding in the prior art, the machinery, the parts and the equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection modes in the prior art, which are not described in detail.
The present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications that do not depart from the spirit and principles of the invention are intended to be equivalent substitutes and are included in the scope of the invention.
Claims (10)
1. A synchronous rotation lift vacuum spindle system for wafer scrubbing, its characterized in that:
the large-caliber brush comprises a large-caliber brush tray (1), a vacuum rotating air passage (2), a wafer lifting mechanism (3) and a tray rotating main shaft (4), wherein the large-caliber brush tray (1) is positioned at the top of a main shaft system, and the vacuum rotating air passage (2) positioned at the innermost side, the wafer lifting mechanism (3) positioned in the middle and synchronously rotating, and the tray rotating main shaft (4) positioned at the outermost side are arranged below the large-caliber brush tray (1) and coaxially arranged from inside to outside;
the tray rotating main shaft (4) provides a rotating driving force, the top of the tray rotating main shaft (4) is connected with the large-caliber brush tray (1), the tray rotating main shaft (4) drives a vacuum rotating air passage shaft (2.3) of the vacuum rotating air passage (2) to synchronously rotate, and the vacuum rotating air passage shaft (2.3) drives a wafer lifting thimble (3.1) arranged at the top of the vacuum rotating air passage shaft to synchronously rotate along with the large-caliber brush tray (1) driven by the tray rotating main shaft (4);
the wafer lifting mechanism (3) provides lifting driving force and drives the vacuum rotary air passage (2) and the wafer lifting thimble (3.1) to do axial reciprocating motion, and the wafer lifting thimble (3.1) stretches out or retracts from the lifting thimble opening (1.3) of the large-caliber brush tray (1) under the driving of the wafer lifting mechanism (3) and receives the cleaned wafer (1.2) when stretching out;
the vacuum airflow entering from the bottom of the vacuum rotary air passage (2) reaches a vacuum pressure maintaining air chamber (2.1) connected with the large-caliber brush tray (1), and the vacuum airflow is provided to the surface of the large-caliber brush tray (1) through a lifting thimble opening (1.3), so that vacuum negative pressure is formed between the surface of the large-caliber brush tray (1) and the cleaned wafer (1.2), and the cleaned wafer (1.2) is fixed on the surface of the large-caliber brush tray (1) through the vacuum negative pressure, and the fixed relation between the cleaned wafer and the large-caliber brush tray (1) is relieved when the vacuum airflow is cut off.
2. The synchronized rotating lift vacuum spindle system for wafer brushing of claim 1, wherein: the large-caliber hairbrush tray (1) comprises a tray body, a vacuum air passage (1.4) is formed in the upper surface of the tray body, the vacuum air passage (1.4) is used for vacuum negative pressure transmission, a lifting thimble opening (1.3) is formed in the middle of the tray body, the lifting thimble opening (1.3) is communicated with the vacuum air passage (1.4), a tray datum plane (1.5) is formed by inwards sinking the middle of the lower surface of the tray body, the tray datum plane (1.5) is communicated with the lifting thimble opening (1.3), and the lifting thimble opening (1.3) is used for providing vacuum for the large-caliber hairbrush tray (1) and for extending a wafer lifting thimble (3.1).
3. The synchronized rotating lift vacuum spindle system for wafer brushing of claim 2, wherein: the vacuum rotary air flue (2) comprises a vacuum rotary air flue shaft (2.3), a main shaft top rotary sealing ring (2.2) and a main shaft bottom rotary sealing ring (2.4) are respectively arranged at the top and the bottom of the vacuum rotary air flue shaft (2.3), a vacuum pressure maintaining air chamber (2.1) is arranged above the main shaft top rotary sealing ring (2.2), a vacuum air inlet (2.5) is formed in the tray rotary main shaft (4), and the vacuum air inlet (2.5) is located below the main shaft bottom rotary sealing ring (2.4).
4. A synchronous rotating lift vacuum spindle system for wafer brushing as recited in claim 3 wherein: the vacuum pressure maintaining air chamber (2.1) is positioned below the large-caliber hairbrush tray (1), the vacuum pressure maintaining air chamber (2.1) is formed by assembling the top of the tray rotating main shaft (4) and the tray datum plane (1.5) and then closing, and the vacuum pressure maintaining air chamber (2.1) is used for providing a buffer area of a vacuum flow channel and is used as a storage space for a wafer lifting thimble (3.1) to be lowered below a tray vacuum suction plane.
5. The synchronized rotating, lifting vacuum spindle system for wafer brushing as recited in claim 4, wherein: the rotary sealing ring (2.2) at the top of the main shaft is provided with two sealing points, one is a rotary sealing point which is contacted with the vacuum rotary air passage shaft (2.3), the rotary sealing point adopts a high-hardness contact surface and an oil seal for sealing, the other is a static sealing point which is contacted with the vacuum pressure maintaining air chamber (2.1), the static sealing point adopts an O-shaped ring for sealing, and the rotary sealing ring (2.2) at the top of the main shaft is used for sealing at the contact position of the vacuum rotary air passage shaft (2.3) and the outer side of the vacuum pressure maintaining air chamber (2.1) so as to prevent vacuum air flow from leaking along the axial direction.
6. The synchronized rotating, lifting vacuum spindle system for wafer brushing as recited in claim 5, wherein: an interval cavity (2.6) is formed between the inner side surface of the rotary sealing ring (2.2) at the top of the main shaft and the top of the vacuum rotary air passage shaft (2.3), and the interval cavity (2.6) is used for avoiding a vacuum rotary air passage shaft (2.3) track of an upper using point, so that the dynamic sealing position is not influenced by the vacuum rotary air passage shaft (2.3) which moves axially.
7. The synchronized rotating, lifting vacuum spindle system for wafer brushing as recited in claim 5, wherein: the rotary sealing ring (2.4) at the bottom of the main shaft is provided with two sealing points, the two sealing points are rotary sealing points, the rotary sealing ring (2.4) provides rotary sealing at two sides of the vacuum rotary air passage shaft (2.3), and the outer surface of the rotary sealing ring (2.4) is connected with the linear driver (3.3) to obtain driving force from the wafer lifting mechanism (3).
8. The synchronized rotating, lifting vacuum spindle system for wafer brushing as recited in claim 6, wherein: the vacuum rotary air passage shaft (2.3) is internally provided with a vacuum hollow passage along the axial direction, the top of the vacuum hollow passage is communicated with a vacuum pressure maintaining air chamber (2.1), the bottom of the vacuum hollow passage is communicated with a vacuum air inlet (2.5), and the vacuum air inlet (2.5) at the bottom of the vacuum rotary air passage shaft (2.3) is used for obtaining the vacuum flow transmitted by a vacuum air chamber formed by a rotary sealing ring (2.4) at the bottom of a main shaft in the continuous rotary process.
9. A synchronous rotating lift vacuum spindle system for wafer brushing as recited in claim 3 wherein: the wafer lifting mechanism (3) is arranged along the vacuum rotary air passage (2), the wafer lifting mechanism (3) comprises a wafer lifting thimble (3.1), a spline guide shaft sleeve (3.2) and a linear driver (3.3) which are sequentially arranged from top to bottom, the wafer lifting thimble (3.1) is arranged at the top of the vacuum rotary air passage shaft (2.3), the wafer lifting thimble (3.1) is used for extending outwards to bear a cleaned wafer (1.2), the spline guide shaft sleeve (3.2) is arranged below the sealing position of the top rotary sealing ring (2.2), the spline guide shaft sleeve (3.2) is connected with the vacuum rotary air passage shaft (2.3) and the tray rotary main shaft (4) through splines, the spline guide shaft sleeve (3.2) transfers the rotary motion of the tray rotary main shaft (4) to the vacuum rotary air passage shaft (2.3), the linear driver (3.3) is arranged at the bottom and is connected with the bottom rotary sealing ring (2.4), and the linear driver (3.3) is not limited by adopting an electric cylinder or an electric cylinder to provide an axial motion for the bottom rotary sealing ring (2.4).
10. The synchronized rotating, lifting vacuum spindle system for wafer brushing as recited in claim 9, wherein: the tray rotating main shaft (4) comprises a driving motor (4.1), a main shaft driving wheel (4.2) and a main shaft outer shaft (4.3), wherein a synchronous pulley is arranged at the output end of the driving motor (4.1), the driving motor (4.1) is connected with the main shaft driving wheel (4.2) through the synchronous pulley and a synchronous belt and drives the main shaft driving wheel (4.2) to rotate, the main shaft driving wheel (4.2) is arranged at the bottom of the main shaft outer shaft (4.3), the top of the main shaft outer shaft (4.3) is connected with the large-caliber brush tray (1), the middle part of the main shaft outer shaft (4.3) is connected with a spline guide shaft sleeve (3.2), the main shaft outer shaft (4.3) drives a vacuum rotating air passage shaft (2.3) to synchronously rotate through the spline guide shaft sleeve (3.2), and the vacuum rotating air passage shaft (2.3) drives a wafer lifting thimble (3.1) arranged at the top of the main shaft to synchronously rotate along with the large-caliber brush tray (1) driven by the main shaft outer shaft (4.3).
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| JP2000243739A (en) * | 1999-02-18 | 2000-09-08 | Oomiya Kogyo Kk | Chemical polishing treatment method of wafer and device |
| CN103094171A (en) * | 2011-10-27 | 2013-05-08 | 沈阳芯源微电子设备有限公司 | Magnetic levitation wafer rotary system |
| CN110246797A (en) * | 2018-03-08 | 2019-09-17 | 弘塑科技股份有限公司 | Wafer mounting apparatus, wafer fixed pedestal and wafer vacuum sucker |
| CN115106262A (en) * | 2022-07-05 | 2022-09-27 | 河南通用智能装备有限公司 | Rotary gluing vacuum carrying platform of wafer laser low-k equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000243739A (en) * | 1999-02-18 | 2000-09-08 | Oomiya Kogyo Kk | Chemical polishing treatment method of wafer and device |
| CN103094171A (en) * | 2011-10-27 | 2013-05-08 | 沈阳芯源微电子设备有限公司 | Magnetic levitation wafer rotary system |
| CN110246797A (en) * | 2018-03-08 | 2019-09-17 | 弘塑科技股份有限公司 | Wafer mounting apparatus, wafer fixed pedestal and wafer vacuum sucker |
| CN115106262A (en) * | 2022-07-05 | 2022-09-27 | 河南通用智能装备有限公司 | Rotary gluing vacuum carrying platform of wafer laser low-k equipment |
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