JPH11221745A - Chamfer polishing device for semiconductor wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To polish all the chamfers of a semiconductor wafer including a notched one efficiently in a chamfer polishing device for semiconductor wafers. SOLUTION: The semiconductor-wafer chamfer polishing device for polishing a chamfer on the circumference of a semiconductor wafer comprises a notch polishing mechanism for polishing a notched chamfer, a front-side polishing mechanism 8 for polishing a chamfer on the front side, a rear-side polishing mechanism 11 for polishing a chamfer on the rear side, a wafer washing mechanism 12 for washing the semiconductor wafer, an unpolished wafer transfer mechanism for transferring an unpolished semiconductor wafer to any one of the notch, front-side and rear-side polishing mechanisms, mechanism-to- mechanism transfer mechanisms 7, 10,..., for transferring semiconductor wafers polished in one polishing mechanism successively to either of the other two polishing mechanisms, and a polished wafer transfer mechanism 55 for transferring a semiconductor wafer with all its chamfers polished to the wafer washing mechanism and further to a storage part after washing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for polishing a chamfered surface formed on a peripheral edge of a semiconductor wafer.

[0002]

2. Description of the Related Art As a technique of etching (etching) a chamfered surface formed on a peripheral edge of a semiconductor wafer such as a silicon wafer, a CCR (Chemical Corne) is used.
r Rounding) processing is known.
When CR processing is performed, projections are formed at the boundary between the chamfered surface and the front and back surfaces of the semiconductor wafer. These projections are minute, but when the semiconductor wafer is housed in a resin cassette, the semiconductor wafer comes into contact with the cassette and scrapes the cassette, resulting in minute shavings. It goes without saying that the shavings cause the performance of the semiconductor wafer to deteriorate.

Therefore, apart from the CCR processing, the chamfered surface of the semiconductor wafer is subjected to CMP (Chemical Mecha).
It is known to perform a process such as a mechanical polishing process. This CMP processing is a technique of polishing with a polishing cloth while supplying a polishing liquid toward a chamfered surface of a semiconductor wafer. Conventionally, as an apparatus for performing this CMP processing, as shown in FIG. The polishing is performed by pressing the polishing drum D around which is wound on the chamfered surface M of the semiconductor wafer W and rotating it.

[0004]

However, the above C
The following problems remain in the MP processing apparatus.
Conventionally, semiconductor wafers in which an orientation flat (orientation flat) is formed for positioning in a crystal direction are often used. However, in recent years, as shown in FIG. , V notches V and the like, semiconductor wafers W having notches formed thereon have come to be widely used. For this reason, it was necessary to grind the chamfered surface at the notch portion. However, in the CMP processing apparatus, only the chamfered surface of the front and back surfaces at the periphery of the semiconductor wafer could be polished, and the chamfered surface could not be polished to the depth of the notch portion. The inconvenience has occurred.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problem, and provides a semiconductor wafer chamfering surface polishing apparatus capable of efficiently polishing all chamfered surfaces including notch portions of a semiconductor wafer. With the goal.

[0006]

The present invention has the following features to attain the object mentioned above. That is, in the semiconductor wafer chamfering polishing device according to claim 1, the semiconductor wafer chamfering surface polishing device for polishing a chamfered surface formed on the periphery of the semiconductor wafer, the notch portion of the semiconductor wafer chamfering surface. A notch polishing mechanism for polishing, a front side polishing mechanism for polishing a chamfered surface on the front side of the semiconductor wafer, a back side polishing mechanism for polishing a chamfered surface on the back side of the semiconductor wafer, and a wafer for cleaning the semiconductor wafer A cleaning mechanism, an unpolished wafer transport mechanism that transports the unpolished semiconductor wafer to any one of the notch polishing mechanism, the front side polishing mechanism or the back side polishing mechanism, and the one polishing mechanism. A transport mechanism between the polishing mechanisms for sequentially transporting the polished semiconductor wafer to the other two polishing mechanisms, and all chamfers There techniques and a polished wafer transfer mechanism for accommodating and transporting a semiconductor wafer that has been cleaned by the polished said transports the semiconductor wafer to the wafer cleaning mechanism further the mechanism housing portion is employed.

In this apparatus for polishing a chamfered surface of a semiconductor wafer, an unpolished semiconductor wafer is transported to a notch polishing mechanism by an unpolished wafer transport mechanism, and the notch portion is polished. The semiconductor wafer is transported to one polishing mechanism of the mechanism, one of the chamfered surfaces on the front side or the back side is polished, and then conveyed again to the other polishing mechanism by the inter-polishing mechanism transport mechanism, and the other chamfered surface is polished. After the polishing of all the chamfered surfaces is completed, the polished semiconductor wafer is transported to the wafer cleaning mechanism and cleaned by the polished wafer transport mechanism, and then the semiconductor wafer is again moved to the storage section by the polished wafer transport mechanism. Transport and store.
Therefore, since the semiconductor wafer is sequentially transported to each polishing mechanism by each transport mechanism, each chamfered surface of the semiconductor wafer is sequentially polished, further cleaned after polishing, and finally stored in the storage section, so that the notch portion is formed. Polishing, cleaning, and storing of all chamfered surfaces including are efficiently performed.

According to a second aspect of the present invention, there is provided the apparatus for polishing a chamfered surface of a semiconductor wafer according to the first aspect, further comprising a notch positioning mechanism for directing a notch portion of the semiconductor wafer in a predetermined direction. The polishing wafer transport mechanism employs a technique that is configured to transport the unpolished semiconductor wafer to the notch positioning mechanism, position the semiconductor wafer, and then transport the semiconductor wafer to the notch polishing mechanism.

In the apparatus for polishing a chamfered surface of a semiconductor wafer, the unpolished semiconductor wafer is transported to a notch positioning mechanism by an unpolished wafer transport mechanism, and the notch portion is positioned in a predetermined direction by rotating the semiconductor wafer.
Thereafter, the semiconductor wafer positioned by the unpolished wafer transport mechanism is transported to the notch polishing mechanism again. Therefore, just before the semiconductor wafer is conveyed to the notch polishing mechanism, the notch positioning mechanism accurately determines the orientation of the notch portion, so that the notch polishing mechanism can accurately and favorably polish the notch portion. Further, since the notch portion is positioned before the polishing liquid or the like during polishing adheres to the semiconductor wafer, the polishing liquid or the like does not adhere to the notch positioning mechanism.

In this case, a notch positioning mechanism, a notch polishing mechanism, a front surface polishing mechanism, a back surface polishing mechanism,
It is preferable to arrange the wafer cleaning mechanism and the storage section sequentially in a U-shape in plan view. In this case, the entire apparatus can be made compact, and the part for introducing the unpolished semiconductor wafer and the part for taking out the semiconductor wafer stored in the storage part can be arranged on the same side surface. It will be easier.

According to a third aspect of the present invention, there is provided a semiconductor wafer chamfer polishing apparatus, wherein the notch polishing mechanism comprises:
A disk-shaped or annular notch polishing cloth, and the notch polishing cloth having an axis in a direction orthogonal to the axis of the semiconductor wafer, rotatably supported and supplying a polishing liquid to the notch portion for the notch; A technique including a notch polishing cloth drive mechanism that makes the peripheral edge portion of the polishing cloth abut, rotates, and slides is adopted.

In the apparatus for polishing a chamfered surface of a semiconductor wafer, the notch polishing mechanism includes a disc-shaped or annular notch polishing cloth and a notch polishing cloth drive mechanism for rotating and sliding the notch polishing cloth to the notch portion. Since it is provided, the polishing cloth can be brought into contact with the back of the notch portion and slid, so that the entire chamfered surface at the notch portion is polished well. Further, the polishing characteristics can be adjusted by controlling the rotation speed of the notch polishing cloth.

According to a fourth aspect of the present invention, in the apparatus for polishing a chamfered surface of a semiconductor wafer according to any one of the first to third aspects, the front-side polishing mechanism and the rear-side polishing mechanism include: A wafer rotating mechanism for rotatably holding the semiconductor wafer in a circumferential direction thereof, and a polishing cloth for chamfering while contacting a polishing cloth for chamfering while supplying a polishing liquid to the chamfering surface of the semiconductor wafer held by the wafer rotating mechanism. A chamfered surface polishing mechanism movably supported, and an outer surface polishing slidably supported by contacting an outer surface polishing cloth while supplying a polishing liquid to the outer surface of the semiconductor wafer held by the wafer rotating mechanism. And a mechanism having a mechanism.

In this apparatus for polishing a chamfered surface of a semiconductor wafer, the front-side polishing mechanism and the back-side polishing mechanism each include a chamfered-surface polishing mechanism and an outer-side polishing mechanism. When the polishing cloth abuts and slides on the chamfered surface and the chamfered surface is polished, at the same time, the outer surface polishing mechanism abuts and slides the outer surface polishing cloth on the outer surface, so that the outer surface is also polished. Polished.

[0015] The chamfering surface polishing mechanism may be configured such that an outer peripheral surface is covered with the chamfering surface polishing cloth and is rotatably supported with an axis inclined with respect to the axis of the semiconductor wafer. A drum, a chamfered surface drum driving means for rotating the chamfered surface polishing drum, wherein the outer surface polishing mechanism has an outer peripheral surface covered with the outer surface polishing cloth and parallel to an axis of the semiconductor wafer. It is preferable to include an outer surface polishing drum rotatably supported with an axis, and an outer surface drum driving means for rotating the outer surface polishing drum.

In this case, the chamfering surface polishing mechanism includes a chamfering surface polishing drum and chamfering surface drum driving means, and the outer surface polishing mechanism includes an outer surface polishing drum, and an outer surface drum driving means. The outer peripheral surface of the rotating polishing drum for the chamfered surface and the outer peripheral surface of the polishing drum for the outer surface respectively come into contact with the chamfered surface and the outer surface of the semiconductor wafer and rotate and slide. The chamfered surface and the outer surface are polished stably and favorably with the side surface polishing cloth. Further, the speed of the polishing cloth sliding on the chamfered surface and the outer surface can be easily and individually adjusted by the rotational speed of the polishing drum for the chamfered surface and the polishing drum for the outer surface.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a chamfered surface polishing apparatus for a semiconductor wafer according to the present invention will be described below with reference to FIGS. In these figures, reference numeral 1 denotes a wafer unloading mechanism (unpolished wafer transport mechanism), 2
Is a wafer positioning unit, 3 is a wafer transport mechanism (transport mechanism between polishing mechanisms), 4 is a notch polishing chamber, 5 is a notch polishing mechanism, 6 is a surface polishing chamber, and 7 is a transport mechanism between surface polishing chambers (transport mechanism between polishing mechanisms). , 8 is a front side polishing mechanism, 9 is a back side polishing chamber, 10 is a back side polishing chamber transfer mechanism (transport mechanism between polishing mechanisms), 11 is a back side polishing mechanism, 12 is a wafer cleaning mechanism,
Reference numeral 13 denotes a wafer storage mechanism.

As shown in FIG. 1, the apparatus for polishing a chamfered surface of a semiconductor wafer according to the present embodiment includes a wafer removal mechanism 1 for removing a semiconductor wafer W from a removal cassette C1, and a semiconductor wafer removed from the wafer removal mechanism 1. A wafer positioning unit 2 for positioning W, a wafer transfer mechanism 3 for transferring the semiconductor wafer W positioned by the wafer positioning unit 2 and sending the semiconductor wafer W to each of the V-notch, front side and back side polishing processes of the semiconductor wafer W; And a notch polishing mechanism 5 for polishing a V notch of the semiconductor wafer W in the notch polishing chamber 4.

Further, the apparatus for polishing a chamfered surface of a semiconductor wafer according to the present embodiment employs a wafer transfer mechanism 3 after V-notch polishing.
A surface polishing chamber transfer mechanism 7 for transferring the semiconductor wafer W conveyed to the surface polishing chamber 6 where the front side polishing is performed and returning the semiconductor wafer W to the wafer transfer mechanism 3 after polishing, and the front side of the semiconductor wafer W in the surface polishing chamber 6 Polishing mechanism 8 for polishing the surface
A backside polishing chamber transfer mechanism 10 for transferring the semiconductor wafer W whose front side is polished and transferred again by the wafer transfer mechanism 3 to the backside polishing chamber 9 where the backside polishing is performed, and returning to the wafer transfer mechanism 3 after polishing; A backside polishing mechanism 11 is provided for polishing the backside of the semiconductor wafer W in the backside polishing chamber 9.

Further, the apparatus for polishing a chamfered surface of a semiconductor wafer according to the present embodiment includes a wafer cleaning mechanism 12 for cleaning a semiconductor wafer W whose back side is polished and conveyed again by the wafer conveyance mechanism 3, and a cleaning by the wafer cleaning mechanism 12. A wafer storage mechanism 13 for storing the semiconductor wafers W stored in a storage cassette (storage unit) C2, and an operation control unit 14 electrically connected to each of the above mechanisms and controlling them. Note that the take-out cassette C1, the wafer positioning unit 2, the notch polishing mechanism 5, the front surface polishing mechanism 8, the back surface polishing mechanism 11, the wafer cleaning mechanism 12, and the storage cassette C2 are sequentially arranged in a U-shape in plan view. .

As shown in FIGS. 1 and 2, the wafer take-out mechanism 1 includes a take-out cassette C1 mounted on the upper surface of the base 20, and a semiconductor wafer W from the take-out cassette C1 provided on the base 20. And a loader unit 22 for picking up the wafers one by one, taking them out one by one, and transferring them to the wafer positioning unit 2.

The unloading cassette C1 is placed so that a plurality of stored semiconductor wafers W are placed in a horizontal state, and the unloading cassette C1 is installed so that the unloading direction of each semiconductor wafer W is directed to the loader unit 22. Further, the loader unit 22 arranges the picking hand 21 in a horizontal state, and the picking hand 21 is rotatable in a horizontal direction and movable in a radial direction, and is supported so as to be able to move up and down. ing.

The wafer positioning unit 2 is shown in FIG.
As shown in FIG. 5 to FIG. 5, the semiconductor wafer W taken out of the take-out cassette C1 is provided on the base 20 adjacent to the take-out cassette C1.
And centering (centering) on the mounting table 23
And the direction of the V notch V is determined.

The wafer positioning unit 2 includes a mounting table 2
A centering mechanism 25 for centering the semiconductor wafer W on the mounting table 3 and a mounting table rotating mechanism 26 for rotating the mounting table 23
Notch positioning mechanism 2 for determining the direction of V notch V
7 is provided. The mounting table rotation mechanism 26 is supported by a plurality of support columns 24, and can be moved up and down together with the support columns 24 by a driving source (not shown) connected to these support columns 24.

The centering mechanism 25 is connected to a plurality of pressing mechanisms 29 which are arranged at equal intervals in the circumferential direction on the periphery of the flat plate portion 28 in a horizontal state, and these pressing mechanisms 29 are connected to the pressing connecting members 30. And a rotatable ring member 31. The pressing mechanism 29 includes a support shaft member 32 fixed on the flat plate portion 28, and a slide member 33 supported by the support shaft member 32 movably in a radial direction with respect to the center of the flat plate portion 28. The slide member 33 has a rotatable cylindrical pressing member 34 attached to the upper portion thereof with a vertical axis.

The ring member 31 has a flat plate portion 28.
One end of a plurality of pressing connection members 30 is provided on the upper side so as to be rotatable coaxially with the center of the flat plate portion 28, and at equal intervals in the circumferential direction. The other end of each of the pressing connecting members 30 is connected to a corresponding pressing mechanism 29. The ring member 31 is fixed to a ring gear 35 coaxially arranged on the lower surface, and the ring gear 35 is engaged with a driving gear 36. A rotating shaft of a ring rotating motor 37 attached to the lower surface of the flat plate portion 28 is fixed to the driving gear 36. The driving gear 36, the ring gear 35 and the ring gear 35 are driven by the driving of the ring rotating motor 37. The member 31 is rotated.

That is, as the ring member 31 rotates, the cylindrical pressing members 34 of the plurality of pressing mechanisms 29 connected to the respective pressing connecting members 30 similarly move radially inward.

The table rotating mechanism 26 includes a cylindrical support member 39 fixed to a support plate 38 fixed to the lower surface of the flat plate portion 28 in a hanging state, and a cylindrical member fixed to the cylindrical support member 39 in a vertical state. A mounting table rotating motor 41 fixed to a lower portion of the cylindrical section 40; and a rotating shaft member 42 connected to the rotating shaft of the mounting table rotating motor 41 and inserted into the cylindrical section 40. ing. The mounting table 23 is coaxially attached to the tip of the rotating shaft member 42, and is rotatable via the rotating shaft member 42 by the rotation of the mounting table rotating motor 41.

The mounting table rotating mechanism 26 includes the mounting table 2.
The mounting table suction means 43 for sucking the semiconductor wafer W placed on the mounting table 3 is also provided. The mounting table suction means 43 includes:
A connection pipe 44 having one end connected to the side of the cylindrical portion 40 is provided, and the other end of the connection pipe 44 is connected to a vacuum pump or the like (not shown). One end of the connection pipe 44 is further connected to the cylindrical portion 4.
The mounting table 23 is connected to a plurality of mounting table suction holes 23a having open ends on the upper surface of the mounting table 23 through connection holes (not shown). That is, the semiconductor wafer W on the mounting table 23
It is sucked and fixed to the mounting table suction hole 23a by a vacuum pump or the like.

The notch positioning mechanism 27 includes a flat plate portion 2
Press cylinder 4 for notch provided on a part of the outer edge portion 8
5 and a notch detection sensor 46. The notch pressing cylinder 45 has a notch piston 45a that can move in the radial direction of the mounting table 23, and a positioning protrusion 45b is attached to the upper end of the notch piston 45a. The positioning projection 45b is disposed with its tip directed radially inward of the mounting table 23, and has a V-shaped cross section at the tip similar to the V notch V. That is, by inserting the positioning projection 45b into the V notch V, the positioning of the V notch V is confirmed and the direction is determined.

The notch detection sensor 46 includes a light-emitting side optical fiber 47 and a light-receiving side optical fiber (not shown) disposed above and below a position spaced apart from the positioning projection 45b by a predetermined angle in the circumferential direction. I have. The light-emitting side optical fiber 47 projects laser light or the like guided therein to the lower light-receiving side optical fiber from its tip, and the light-receiving side optical fiber receives light from the light-emitting side optical fiber 47 inside. The light is guided and detected by a light receiving element (not shown).

That is, the tips of the light-emitting side optical fiber 47 and the light-receiving side optical fiber are disposed so as to coincide with and just above the outer peripheral edge of the semiconductor wafer W centered on the mounting table 23, respectively. Only when the V notch V moves directly below the light emitting side optical fiber 47, light from the light emitting side optical fiber 47 is guided into the light receiving side optical fiber and detected, and the V notch V passes through this position. Is detected.

As shown in FIGS. 1, 6, and 10, the wafer transfer mechanism 3
The first transfer part 49 for transferring the semiconductor wafer W positioned by the first transfer part 48 to the notch polishing mechanism 5 and the surface polishing chamber transfer mechanism 7 at the first transfer part 48, and the V of the semiconductor wafer W
After the polishing of the notch V and the front side, the semiconductor wafer W is received by the first transfer unit 48 from the surface polishing chamber transfer mechanism 7 and transferred to the second transfer unit 50, and the semiconductor wafer W is transferred by the second transfer unit 50. A reversing unit 52 for reversing W, a third transfer unit 54 for receiving the semiconductor wafer W inverted by the reversing unit 52 and transferring the semiconductor wafer W to the back surface polishing chamber transfer mechanism 10 at a third transfer unit 53;
An unloader unit (polished wafer transfer mechanism) 5 that receives the semiconductor wafer W whose back side has been polished by the back side polishing mechanism 11 from the back side polishing chamber transfer mechanism 10 and transfers it to the wafer cleaning mechanism 12 and the wafer storage mechanism 13.
And 5. The first to third transport units 49,
51, 54 and the unloader unit 55
It is sequentially arranged in a U-shape on 0.

As shown in FIGS. 1, 6 and 7, the first transfer section 49 is provided with a first hand 56 for sucking and supporting the semiconductor wafer W by a suction groove 56a formed at the tip end.
A first rodless cylinder 57 that supports the first hand 56 so as to be able to move horizontally between the wafer positioning unit 2 and the first transfer unit 48; A first cylinder in which a suction cylinder and a suction air supply pipe connected individually to the suction groove 56a of the first hand 56, the first rodless cylinder 57, and the first vertical movement cylinder 58 are bundled; Part 5
9 is provided.

The first rodless cylinder 57 is supported by a first beam member 61 fixed to a column member 60 erected on the base 20 in a horizontal state. It is arranged up to the upper part of the one transfer part 48. First movable part 6 of first rodless cylinder 57
2 is supported in a hanging state, and a lower part thereof is supported by a first vertically movable part 63 so as to be vertically movable. In addition, a base end of the first hand 56 is fixed to a lower end of the first vertically moving unit 63.

That is, the first vertically moving section 63 is moved up and down together with the first hand 56 by the first vertically moving cylinder 58 installed in the first movable section 62. Further, the first movable portion 62 is supported by a first guide portion 64 provided in parallel with the first rodless cylinder 57 so as to be horizontally movable. The first hand 56 has a distal end portion formed in a substantially arc shape, and is installed so as to extend horizontally in a direction oblique to the extending direction of the first rodless cylinder 57.

The second transfer section 51 includes a second hand 65 that suctions and supports the semiconductor wafer W by a plurality of suction holes 65a formed at the tip end, and a second transfer section 48 that transfers the second hand 65 to the first transfer section 48. A second rodless cylinder 66 that supports the second hand 65 so as to be able to move horizontally with the second transfer unit 50; a second vertical movement cylinder (not shown) that supports the second hand 65 so that the second hand 65 can move up and down; , A second rodless cylinder 66, and a second pipe section 68 which bundles respective pipes for suction and compressed air supply which are individually connected to the second vertically moving cylinder.

The second rodless cylinder 66 includes a first beam member 61 and two column members 60 erected on the base 20.
It is supported by a second beam member 69 fixed in a higher and horizontal state, and extends from above the first transfer portion 48 to above the second transfer portion 50, that is, the first rodless cylinder 5.
7 are arranged in a direction orthogonal to the plane view. The second movable portion 70 of the second rodless cylinder 66 is supported in a hanging state, and a second vertically moving portion 71 is supported below the second movable portion 70 so as to be vertically movable. Further, a base end of the second hand 65 is fixed to a lower end of the second vertical moving unit 71.

That is, the second vertically moving section 71 is moved up and down together with the second hand 65 by the second vertically moving cylinder installed on the second movable section 70. Also, the second movable part 7
Numeral 0 is horizontally supported by a second guide portion 72 provided in parallel with the second rodless cylinder 66.
The second hand 65 is formed in a T shape, and is installed so as to extend in a horizontal state in a direction orthogonal to the extending direction of the second rodless cylinder 66 in a plan view.

As shown in FIG. 1, the reversing unit 52 includes a reversing actuator 73 disposed at a position facing the second rodless cylinder 66 with the second transfer portion 50 interposed therebetween. A rotatable reversing hand 74 having a base end fixed to the rotating shaft and extending horizontally on the second transfer section 50 is provided.

The third transfer section 54 includes a third hand 75 that suctions and supports the semiconductor wafer W by a plurality of suction holes 75 a formed at the tip end, and a third hand 75 that transfers the third hand 75 to the second transfer section 50. A third rodless cylinder 76 which supports the third hand 75 so as to be able to move horizontally with the third transfer portion 53, a third vertical movement cylinder (not shown) which supports the third hand 75 so as to be vertically movable, and a third hand 75 , A third rodless cylinder 76, and a third pipe section 78 which bundles respective pipes for suction and compressed air supply which are individually connected to the third vertical cylinder.

The third rodless cylinder 76 is
It is supported by the beam member 69 and is arranged from above the second transfer portion 50 to above the third transfer portion 53, that is, in parallel with the second rodless cylinder 66. The third movable part 79 of the third rodless cylinder 76 is supported in a hanging state, and a third vertically moving part 80 is supported below the third movable part 79 so as to be vertically movable. Further, a base end of a third hand 75 is fixed to a lower end of the third vertically moving unit 80.

That is, the third vertically moving section 80 is moved up and down together with the third hand 75 by the third vertically moving cylinder installed in the third movable section 79. Also, the third movable part 7
9 is supported by a second guide portion 72 provided in parallel with the third rodless cylinder 76 so as to be horizontally movable.
The third hand 75 is formed in a T shape, and is installed so as to extend in a horizontal state in a direction perpendicular to the extending direction of the third rodless cylinder 76 in a plan view.

The unloader unit 55 includes the base 2
0 is supported in a hanging state by an unloader beam member 81 fixed horizontally to the column member 60 erected on
The horizontal moving device 82 attached to the unloader beam member 81 moves the unloader beam member 81 along the extending direction of the unloader beam member 81, that is, in the direction orthogonal to the extending direction of the third rodless cylinder 76 in plan view. 3 delivery part 53,
It is movable between the wafer cleaning mechanism 12 and the wafer storage mechanism 13.

An unloader guide 83 is supported on a side surface of the horizontal moving device 82 in a hanging state, and a hand swinging rotating portion 84 is supported on the unloader guide 83 so as to be vertically movable. The hand swing rotation unit 84 has
A base end of a U-shaped unloader hand 85 is attached, and the unloader hand 85 is supported swingably about a horizontal axis parallel to the extending direction of the third rodless cylinder 76.

The hand swing rotation section 84 includes a swing rotary actuator for swinging the unloading hand 85 and a vertical movement rotary actuator for vertically moving the hand swing rotation section 84 itself.

The unloader hand 85 has a plurality of suction holes 85a connected to suction means (not shown) at its tip.
Are formed to suck and support the semiconductor wafer W transferred to the third transfer section 53 by the suction holes 85a. The unloader hand 85 can be swung by a swing rotary actuator so that the tip end thereof is in a horizontal state and a vertical state.

The first transfer section 48, the second transfer section 50 and the third transfer section 53 are arranged in one direction as shown in FIGS. 1 and 6. First
The transfer section 48 is provided adjacent to the first transport section 49 and is located opposite the surface polishing chamber 6 with the surface polishing chamber transfer mechanism 7 interposed therebetween. The notch polishing chamber 4 is provided below the first transfer section 48.

The third transfer section 53 is provided adjacent to the unloader unit 55 and is located opposite the back polishing chamber 9 with the back polishing chamber transfer mechanism 10 interposed therebetween. The second transfer unit 50 is connected to the first transfer unit 48 and the third transfer unit 48.
It is provided between the transfer parts 53 and is set to a depth at which the semiconductor wafer W can be inverted at least.

As shown in FIGS. 2 and 11, the surface polishing chamber transfer mechanism 7 supports the semiconductor wafer W from above in the first transfer section 48, the notch polishing chamber 4, and the surface polishing chamber 6 in a suction state. A pair of wafer suction disks 90, a pair of suction disk support portions (wafer rotating mechanisms) 91 for vertically supporting and rotating the wafer suction disks 90, respectively; It is supported by a rotatable pivot member 92 erected between the surface polishing chamber 6 and the pivot member 92.
And a turning mechanism 93 for turning around the center. That is, the pair of wafer suction disks 90 are arranged at symmetrical positions about the pivot shaft member 92.

On the other hand, the back surface polishing chamber transfer mechanism 10 comprises a pair of wafer suction disks 90 for supporting the semiconductor wafers W from above in the third transfer section 53 and the back surface polishing chamber 9, respectively, and a pair of the wafer suction disks 90. And a pair of suction-disc supporting portions 91 for vertically and rotatably supporting the suction-disc supporting portions 91, respectively.
A turning mechanism 93 for turning around a rotatable turning shaft member 92 erected between the rear surface polishing chamber 9 and the rear polishing chamber 9 is provided.

The turning mechanism 93 includes a turning rotary actuator 94 for turning the turning shaft member 92 and a cylindrical support member 95 for rotatably supporting the turning shaft member 92 in an inserted state. The turning rotary actuator 94 is provided below the front-side polishing chamber 6 or the back-side polishing chamber 9, and a lower gear 98 in which a connecting gear 97 fixed to a rotation drive shaft 96 is fixed to a lower portion of the turning shaft member 92. Are engaged. The cylindrical support member 95 is supported by the base 20 in a penetrating state.

A rod-shaped turning stopper 99 extending outward in the radial direction is fixed to the lower end of the turning shaft member 92, and a turning positioning portion 10 is provided on the back surface of the upper plate of the base 20.
0 is fixed at two predetermined positions (one position is not shown). The turning positioning unit 100 is provided at a position where the tip end of the turning stopper 99 turns and stops by a predetermined amount, that is, when the wafer suction disk 90 turns to the upper part of the first transfer part 48 or the upper part of the surface polishing chamber 6, and It is provided at a position corresponding to a case where the turning is performed to the upper portion of the third transfer portion 53 or the upper portion of the back surface polishing chamber 9.

A cylindrical member 101 is fixed to the upper end of the turning shaft member 92 so as to have the same axis. On the outer peripheral surface of the cylindrical member 101, a pair of suction-disc lifting / lowering air cylinders 102 arranged in the up-down direction is disposed on the cylindrical member 1 with each other.
It is provided at a position symmetrical with respect to the axis 01. Each of the suction-disc lifting and lowering air cylinders 102 includes a cylinder portion 102a fixed to an upper portion and a cylinder rod portion 102b that can move up and down in the cylinder portion 102a. At the tip of the cylinder rod portion 102b, a suction disk supporting portion 91 is fixed.

The suction disk support section 91 has a suction disk rotation motor 103 fixed on the upper portion thereof.
A speed reducer (not shown) connected to the rotary drive shaft 3 for reducing the number of rotations; a rotation angle detection sensor (not shown) for detecting the rotation angle of the wafer suction disk 90 decelerated by the speed reducer; And a support rod 104 connected to the rotation shaft of the speed reducer and rotatably supported about a vertical axis. The support rod 104 has a connection hole (not shown) formed therein which is connected to suction means (not shown) and penetrates vertically.

The wafer suction disk 90 is provided with a support rod 1
An upper surface is fixed to a lower end of the suction tube 04 and is rotatable by the rotation of the suction disk rotating motor 103 along the same axis. Further, the wafer suction disk 90 is formed in a disk shape having a diameter smaller than the semiconductor wafer W to be sucked by a predetermined amount, and has a substantially conical shape as shown in FIG. Further, a suction hole (not shown) connected to a vacuum pump or the like is formed on the lower surface of the wafer suction disk 90.

The notch polishing chamber 4 is shown in FIGS.
As shown in FIG. 3, the notch polishing chamber side plate 110, the notch polishing chamber top plate 111, the notch polishing chamber shutter 112, and the notch polishing chamber bottom plate 113 are disposed on the opposite side of the surface polishing chamber 6 with respect to the surface polishing chamber transfer mechanism 7. It is composed of The bottom plate 113 of the notch polishing chamber is set to be inclined toward the center, and a notch polishing liquid drain hole 110a for draining the polishing liquid used at the time of polishing is formed at the lowermost portion.

The notch polishing chamber top plate 111 is disposed so as to cover the upper portion of the notch polishing chamber 4, and has a circular notch top having an inner diameter set slightly larger than the outer diameter of the semiconductor wafer W at the center thereof. A plate opening 111a is formed. The notch polishing chamber top plate 111 includes a pair of shutter air cylinders 114 supported on the upper side of the notch polishing chamber side plate 110 so as to be able to expand and contract in the horizontal direction.
A pair of plate-shaped notch polishing chamber shutters 112 are fixed to the distal end portion via a shutter connecting member 115, respectively.

A through-hole is formed in the shutter connecting member 115, and a guide rod 116 provided on the top plate 111 of the notch polishing chamber is inserted into the through-hole. That is, it is supported by the shutter connecting member 115 and the guide bar 116 so as to be horizontally movable. These notch polishing chamber shutters 112 are arranged so as to cover the notch polishing chamber 4 along the notch polishing chamber top plate 111, and are supported by the notch polishing chamber top plate 111 so that they can be opened and closed by expansion and contraction of a shutter air cylinder 114. ing.

A pair of notch polishing chamber shutters 112
A semicircular notch 112a is formed at the inner edges facing each other, and a circular opening having an inner diameter slightly larger than the diameter of the support rod 104 is formed at the center at the time of closing. An intermediate top plate 117 is provided between the front polishing chamber 6 and the first transfer section 48 and between the back polishing chamber 9 and the third transfer section 53, respectively.

The notch polishing mechanism 5 is shown in FIGS.
As shown in FIG. 7, the wafer suction disk 9
0, a notch polishing wheel 120 that is disposed on the side of the semiconductor wafer W in a holding state and that is rotatably supported with an axis parallel to the front and back surfaces of the semiconductor wafer W, and rotationally drives the notch polishing wheel 120. Wheel rotation drive unit (notch polishing cloth drive mechanism) 121, a wheel swing drive unit 122 that swings the wheel rotation drive unit 121 up and down together with the notch polishing wheel 120, and a polishing liquid for polishing the notch during polishing. Notch polishing liquid supply means 123 is also provided for supplying to the wheel 120 and also supplying to the V notch V of the semiconductor wafer W.

The wheel swing drive unit 122 includes the base 2
0 by a swing portion support plate 124, and the swing portion support plate 1
A swinging motor 12 having a rotating shaft fixed to a horizontal state at 24;
5, a rotation drive unit support plate 126 fixed to the rotation shaft of the swing motor 125, a notch pressing cylinder 127 having one end connected to the rotation drive unit support plate 126, and a rotation drive unit support plate 126. A connection support member 128 that is supported movably in the radial direction and to which the tip of the notch pressing cylinder 127 is connected.

The wheel rotation drive section 121 includes a cylindrical body 129 fixed to the end of a connecting support member 128 in a state parallel to the rotation axis of the swing motor 125, and a cylindrical body 12.
9, a rotary motor 130 fixed to the rear end, and a cylindrical body 129 having a rear end connected to the rotation shaft of the rotary motor 130.
And a wheel shaft member 131 rotatably inserted therein. A notch polishing wheel 120 is attached to the tip of the wheel shaft member 131.

The wheel rotation drive section 121 has a drive section insertion hole 110 a formed in the notch polishing chamber side plate 110.
A cylindrical body cover 132 such as a bellows, which covers an outer peripheral portion of the cylindrical body 129, is attached between the periphery of the driving portion insertion hole 110 a and the cylindrical body 129 so as to protrude into the notch polishing chamber 4. Liquid wheel rotation drive unit 1
21 and scattering outside the notch polishing chamber 4 is prevented.

The notch polishing wheel 120 includes a fixing member 133 fixed to the tip of a wheel shaft member 131.
A wheel body 134 attached to the fixing member 133 and arranged coaxially with the wheel shaft member 131, and a wheel cover 135 arranged to cover the wheel body 134 except for a part of the wheel body 134. Have. A ring-shaped notch polishing cloth 136 is attached to an outer peripheral portion of the wheel body 134.
The diameter 36 is set to be larger than the outer diameter of the wheel body 134 so as to protrude from the outer edge of the wheel body 134 by a predetermined amount.

The notch polishing liquid supply means 123 is provided with a polishing liquid supply nozzle 123a connected to an external polishing liquid supply source (not shown) and arranged from the notch polishing chamber side plate 110 to the notch polishing cloth 136. . That is, at the time of polishing, the polishing liquid is ejected from the tip of the polishing liquid supply nozzle 123a toward the notch polishing cloth 136, and is supplied to the notch polishing cloth 136 and the V notch V.

In the lower part of the notch polishing chamber 4, a rotatable notch polishing cloth cover shaft member 137 parallel to the cylindrical body 129 is provided.
A notch polishing cloth cover 138 is fixed to a central portion of 37 at its end. That is, the receiving member 138 can be rotated by rotating the shaft member 137 for the notch polishing cloth cover.

The front polishing chamber 6 and the back polishing chamber 9
As shown in FIGS. 1, 18 and 20, are disposed on the opposite sides of the first transfer portion 48 and the third transfer portion 53 with respect to the pivot shaft member 92, respectively. The polishing chamber includes a top plate 141, a chamfered surface polishing chamber shutter 142, and the like.

The top plate 141 of the chamfered surface polishing chamber is disposed so as to cover the upper side of the front surface polishing chamber 6 and the rear surface polishing chamber 9, respectively. A chamfered top plate opening 141a is formed similarly to the circular notch polishing chamber top plate 111 having an inner diameter set slightly larger than the diameter. Further, the chamfered surface polishing chamber top plate 141 is formed such that the peripheral edge portion protrudes upward and surrounds the upper surface.

The chamfered surface polishing chamber shutter 142 is disposed along the chamfered surface polishing room top plate 141 so as to cover the front surface polishing room 6 and the back surface polishing room 9, respectively, and is opened and closed on the chamfered surface polishing room top plate 141. Supported. Similar to the notch polishing chamber shutter 112, these chamfered surface polishing chamber shutters 142 have semicircular notches (not shown) formed at inner edges facing each other, and support rods 10 when closed.
A circular opening having an inner diameter slightly larger than the diameter of 4 is formed in the center.

Incidentally, similarly to the notch polishing chamber 4, the chamfered polishing chamber shutter 142 is provided on the top plate 141 of the chamfered polishing chamber.
There is provided a mechanism for opening and closing. In addition, the surface polishing chamber 6
Between the first transfer section 48 and the back polishing chamber 9 and the third
An intermediate top plate is also provided between the transfer unit 53 and the transfer unit 53.

As shown in FIGS. 18 to 23, the front-side polishing mechanism 8 and the back-side polishing mechanism 11 serve as a chamfered-surface polishing mechanism 149A in the front-side polishing chamber 6 and the rear-side polishing chamber 9, respectively. The polishing drum 150A for the chamfered surface, which is disposed on the side of the semiconductor wafer W in the holding state, is rotatably supported with an axis inclined with respect to the axis of the semiconductor wafer W, and the polishing drum 150A for the chamfered surface is rotated. Driving means 151A for driving and moving the chamfering surface, and a polishing liquid supplying means for the chamfering surface which supplies the polishing liquid onto the polishing drum 150A for the chamfering and also supplies the polishing liquid to the chamfering surface M of the semiconductor wafer W during polishing (FIG. (Not shown).

The front-side polishing mechanism 8 and the back-side polishing mechanism 11 serve as an outer-side polishing mechanism 149B for holding the semiconductor wafer W held by the wafer suction disk 90 in the front-side polishing chamber 6 and the rear-side polishing chamber 9, respectively. An outer surface polishing drum 150B disposed at a position opposite to the chamfering surface polishing drum 150A and rotatably supported by an axis parallel to the axis of the semiconductor wafer W, that is, a vertical axis; An outer surface drum driving means 151B for rotating and moving the drum 150B, and a polishing liquid for polishing the outer surface during the polishing.
0B and the outer surface S of the semiconductor wafer W
And an outside surface polishing liquid supply means (not shown) for supplying the polishing liquid to the outside.

The drum driving means 151A for the chamfered surface
Is a linear motion unit 153A for the chamfered surface for moving the polishing drum 150A for the chamfered surface in the axial direction, and the polishing drum 150A for the chamfered surface is swingably supported by the linear motion unit 153A for the chamfered surface. And a drum support portion 154A for a chamfer surface rotatably supported by the portion.

The linear motion unit 153A for the chamfered surface
Are disposed between the first transfer part 48 and the front-side polishing chamber 6 and between the third transfer part 53 and the back-side polishing chamber 9, and are fixed on the base 20 and predetermined with respect to the axis of the semiconductor wafer W. Unit body 157 having guide 155 inclined at an angle and cam follower rotation motor 156 for rotating cam follower 200 attached to the tip of the rotating shaft.
And the guide 155 is attached to the unit body 157 by the guide 155.
And a linearly moving portion 158 movably connected along. That is, when the cam follower rotation motor 156 is driven to rotate the cam follower 200 around the rotation center C of the cam follower rotation motor 156 as shown in FIG. The rotation of the cam follower 200 causes the linear
8 is set to swing along the guide 155.

The drum support 154A for chamfered surface
The polishing drum 150 </ b> A for the chamfer surface is set so as to abut against the chamfer surface M on the lower surface side of the semiconductor wafer W in a pressed state and slidably supported in the circumferential direction of the chamfer surface M. That is, the drum support portion 154A for the chamfered surface is formed in a substantially T-shape, and is pivotally supported by a pivot shaft portion 159 provided in the linear portion 158, and the pivot arm 160 Drum rotation motor 1 installed at the base end of section 160
61.

The oscillating arm 160 is attached to the intermediate projection 16.
A through-hole 160b is formed in Oa, and a swing shaft portion 159 is inserted through the through-hole 160b and supported to be swingable. At the tip of the swing arm 160, an arm cylindrical part 160 that rotatably supports the drum support shaft 162 by interposing the drum support shaft 162.
c is provided with an axis in the direction of direct movement of the drum support portion 154A for a chamfered surface.

The drum support shaft portion 162 is disposed at a predetermined angle (an angle substantially parallel to the chamfered surface M) with respect to the axis of the semiconductor wafer W, and a drum-side pulley 163 is fixed to a base end. At the same time, a polishing drum 150A for a chamfered surface is coaxially mounted at the tip. And
A motor-side pulley 164 is fixed to a rotation shaft of the drum rotation motor 161, and an endless belt 165 is wound around the motor-side pulley 164 and the drum-side pulley 163.

The linear motion unit 153A for the chamfered surface and the base end of the swing arm 160 are connected to the support members 166a and 166a.
6b, they are connected by two swinging air cylinders 167 arranged obliquely in the vertical direction. That is, by expanding and contracting the swinging air cylinder 167, the chamfered drum support 154 </ b> A around the swinging shaft 159.
Can be swung diagonally up and down, and the polishing drum 150A for the chamfered surface can be brought into contact with the chamfered surface M from the lower surface side of the semiconductor wafer W with a predetermined pressing force.

The drum driving means 151B for the outer surface includes:
An outer-side linear motion unit 153B for moving the outer-surface polishing drum 150B in the axial direction, and an outer-surface polishing drum 150B pivotally supported by the outer-surface linear motion unit 153B. And an outer surface drum supporting portion 154B rotatably supported.

The drum driving means 151B for the outer surface includes:
The linear drive unit 153A for the chamfered surface of the drum drive means 151A for the chamfered surface is inclined in a direction inclined by a predetermined angle with respect to the axis of the semiconductor wafer W.
4A movably supports the outer surface linear drive unit 153 of the outer surface drum driving means 151B.
B is different in that it supports the outer surface drum support 154B movably in a direction parallel to the axis of the semiconductor wafer W, that is, in a vertical direction.

That is, the outer-side linear motion unit 153
B differs in that the direction of the guide 155 is arranged in the vertical direction with respect to the linear motion unit 153A for the chamfered surface, but the other components are the same. In addition, the outer surface polishing drum 150B and the outer surface drum support portion 154B
It has the same member configuration as the polishing drum 150A for chamfering surface and the drum support portion 154A for chamfering surface, and is installed movably in the vertical direction by a guide 155 arranged in the vertical direction.

Therefore, the outer-side linear motion unit 15
The two swinging air cylinders 167 connecting the 3B and the outer surface drum supporting portion 154B are arranged in a horizontal direction, and by expanding and contracting these swinging air cylinders 167, the outer surface around the swinging shaft portion 159 is centered. Drum support 1
The outer surface polishing drum 150B can be brought into contact with the outer surface S from the side of the semiconductor wafer W with a predetermined pressing force.

As shown in FIGS. 18 and 21, the grinding drum 150A for the chamfered surface and the grinding drum 150B for the outer surface have the same axis as the mounting flange 168 provided at the tip of the drum support shaft 162. Wheel body 134 of an aluminum alloy or the like to be fixed and fixed, a belt-shaped polishing cloth 169A for a chamfered surface and a polishing cloth 169B for an outer surface wound and fixed around the outer peripheral surface of the wheel body 134
And The polishing cloth 169A for the chamfered surface and the polishing cloth 169B for the outer surface are formed of a nonwoven fabric in which the directions of the fibers are not constant.

As shown in FIGS. 1, 9, 10 and 24, the wafer cleaning mechanism 12 is disposed adjacent to the second transfer section 50, and includes a cleaning tank 170 and the cleaning tank 1
A scrubber unit 172 for cleaning the semiconductor wafer W while rotating the semiconductor wafer W between two cylindrical scrubbers 171 in the 70, and a wafer rotation support mechanism 173 for rotatably supporting the semiconductor wafer W disposed in the cleaning tank 170.
And

The washing tank 170 is provided with a washing tank top plate 174 at an upper portion thereof, and the washing tank top plate 174 is provided with a washing tank opening / closing plate 175 so as to be openable and closable. An opening / closing plate air cylinder 176 is installed on the washing tank top plate 174 so as to be able to expand and contract in the horizontal direction, and the opening / closing of the washing tank opening / closing plate 175 is controlled by the opening / closing plate air cylinder 176.

The scrubber unit 172 includes the cleaning tank 1
A pair of cylindrical scrubbers 171 which are arranged in parallel in the horizontal direction within 70 and are rotatable and movable in the direction opposite to each other.
And a scrubber drive mechanism 177 for moving and rotating these cylindrical scrubbers 171. The cylindrical scrubber 171 is formed of a sponge-like porous material, and has such a flexibility that a cleaning liquid flowing inside can be exuded from an outer peripheral surface and does not damage the surface of the semiconductor wafer W to be sandwiched. I have. The tip of the cylindrical scrubber 171 is disposed so as to be located at the center of the semiconductor wafer W to be cleaned.

The scrubber driving mechanism 177 is provided in the cleaning tank 1
A scrubber drive motor 178 is provided on the outer surface of the 70 on the third transfer portion 53 side, and a scrubber motor side pulley 179 is attached to the rotation shaft of the scrubber drive motor 178 so as to protrude toward the unloader unit 55 side. ing. On the outer surface of the cleaning tank 170 on the unloader unit 55 side, a scrubber pressing air cylinder 180 that can expand and contract in the horizontal direction is provided. Above the scrubber pressing air cylinder 180, a pair of scrubber swinging Shaft 18
1 is rotatably supported on the outer surface with an axis in the horizontal direction.

The pair of scrubber swing shafts 181 have
A pair of gear members 182 that mesh with each other in a facing state are attached, and scrubber connecting members 183A and 183B that extend upward are fixed to the gear members 182, respectively. These scrubber connecting members 183A,
One of the 183B has its lower end protruding downward, and is attached to the lower end.
0 is connected to the front end.

Further, the scrubber connecting members 183A, 183
In the upper part of 3B, a scrubber shaft member 184 in which a flow hole 184a for washing water is formed and arranged with a horizontal axis.
Are protruded into the cleaning tank 170 and are rotatably supported. The circulation hole 184a is connected to a cleaning water supply source (not shown). Each of the scrubber shaft members 184 has an insertion hole 170 formed in the outer surface of the cleaning tank 170.
a, a scrubber mounting cylindrical portion 18 which protrudes from the inner portion to the inside and which extrapolates the cylindrical scrubber 171 on the distal end side.
5 is provided.

The scrubber mounting cylinder portion 185 has a plurality of through holes 185a penetrating inside and outside, and the inside of the through hole 1 is formed.
The washing water flowing through 84a is supplied from inside to a cylindrical scrubber 171.
Can be supplied. In addition, each insertion hole 170
A shaft member cover 186 such as a bellows is provided between the outer peripheral portion of FIG. 1A and the base end portion of each scrubber mounting cylindrical portion 185 so as to cover the scrubber shaft member 184. Scattering to the outside from the hole 170a is prevented.

The base ends of the pair of scrubber shaft members 184 project outward from the scrubber connecting members 183A and 183B, and a pair of scrubber side pulleys 187 are attached thereto. A belt roller 188 having a horizontal axis is rotatably attached to a roller support member 189 adjacent to one scrubber side pulley 187.

The motor side pulley 179 for the scrubber,
An endless belt 190 for a scrubber is wound around a pair of scrubber-side pulleys 187 and a belt roller 188, and is set so that the rotational driving force of a scrubber drive motor 178 is transmitted to a pair of cylindrical scrubbers 171. I have. Therefore, by expanding and contracting the scrubber pressing air cylinder 180, one scrubber connecting member 183A connected thereto is swung, and the other scrubber connecting member 183 is engaged by the meshed gear member 182.
B can be swung in the opposite direction. by this,
The pair of cylindrical scrubbers 171 can be moved toward and away from each other.

The wafer rotation support mechanism 173 includes a plurality of wafer rotation support members 191 which are horizontally disposed inside the cleaning tank 170 from the outer surface of the cleaning tank 170 opposite to the scrubber driving motor 178. I have. These wafer rotation support members 191 are inserted into through holes 170b formed in the outer surface, and are fixed and supported by standing support members 192 provided outside the outer surface.

At the tip of the wafer rotation support member 191,
A support roller 191a having an axis in the horizontal direction is rotatably supported, and a groove for supporting an outer edge portion of the semiconductor wafer W is formed on an outer peripheral edge of the support roller 191a. Each support roller 191a is arranged at intervals in the circumferential direction so that the outer edge portion of the semiconductor wafer W put into the cleaning tank 170 by the unloader unit 55 can be supported.

9 and FIG.
As shown in FIG. 5 and FIG. 26, a water tank section 193 provided adjacent to the wafer cleaning mechanism 12 for storing the storage cassette C2, and the storage cassette C2 adjacent to the water tank section 193 and in the water tank section 193 are raised and lowered. Cassette lifting device 19
4 is provided. The cassette lifting / lowering device 194 includes a lifting / lowering air cylinder 195 erected on the base 20 and a cassette supporting portion 196 fixed to the piston portion 195a of the lifting / lowering air cylinder 195 for mounting and supporting the storage cassette C2. And

The chamfering surface polishing apparatus of the present embodiment
As shown in FIG. 27, the periphery is covered with a detachable and openable panel or the like, and an operation control unit 14 is installed on the front.

Next, a method for polishing a chamfered surface of a semiconductor wafer in one embodiment of the apparatus for polishing a chamfered surface of a semiconductor wafer according to the present invention will be described.
[Wafer positioning step], [Surface polishing step], [Wafer inversion step], [Backside polishing step], [Wafer cleaning step], and [Wafer storage step] will be described separately.

[Wafer Take-Out Step] First, a take-out cassette C1 containing a semiconductor wafer W before polishing processing is placed.
Is set at a predetermined position on the base 20 such that the surface of the semiconductor wafer W faces downward.

The loader unit 22 is driven to move the pick-up hand 21 up and down, extend to the pick-up cassette C1 and move to the upper part of the predetermined semiconductor wafer W, and hold the semiconductor wafer W by suction. After the suction, the semiconductor wafer W is taken out from the take-out cassette C1, and the take-out hand 21 is moved,
The semiconductor wafer W is transferred onto the mounting table 23 of the wafer positioning unit 2.

[Wafer Positioning Step] The suction of the unloading hand 21 is released, and the semiconductor wafer W is placed on the mounting table 2.
Place on 3 Next, the wafer positioning unit 2 is driven to center the semiconductor wafer W on the mounting table 23 and determine the direction of the V notch V, thereby positioning the semiconductor wafer W in a predetermined direction.

That is, by driving the ring rotation motor 37 of the centering mechanism 25 and rotating the ring member 31, the cylindrical pressing members 34 of the connected pressing mechanisms 29 move radially inward. The outer edge portion of the semiconductor wafer W is pressed, and centering is performed such that the center of the semiconductor wafer W coincides with the center of the mounting table 23.

Further, after centering, the semiconductor wafer W is sucked by the mounting table suction hole 23 a by the mounting table suction means 43 and is held on the mounting table 23. Then, by driving the mounting table rotating motor 41 of the mounting table rotating mechanism 26,
By rotating the mounting table 23, the semiconductor wafer W
To rotate.

At this time, the V notch V of the semiconductor wafer W
Is just below the light emitting side optical fiber 47 of the notch detection sensor 46, the light of the light emitting side optical fiber 47 is guided into the light receiving side optical fiber, and the V notch V is detected. When the V notch V is detected, the mounting table 23 is rotated by a rotation angle corresponding to the angle between the light-emitting side optical fiber 47 and the positioning protrusion 45b in the circumferential direction from that point, so that the V notch V is just The rotation of the semiconductor wafer W is stopped at a position facing the positioning protrusion 45b.

In this state, the notch pressing cylinder 45 is operated to extend the notch piston 45a, and the tip of the positioning projection 45b is inserted into the V notch V to check whether positioning has been completed and to accurately determine the direction. Make a decision.

[V Notch Polishing Step] When the positioning and orientation of the semiconductor wafer W is completed, the semiconductor wafer W is raised while being suctioned by the mounting table suction means 43, and the first hand 56 is raised by the first vertically moving cylinder 58. At the same time, the semiconductor wafer W is sucked and held on the upper surface by the suction groove 56a, and then the suction by the mounting table suction means 46 is released. Then, the first hand 56 is horizontally moved by the first rodless cylinder 57 above the first transfer unit 48 to transfer the semiconductor wafer W to the first transfer unit 48.

In this state, the first transfer section 4
The wafer suction plate 90 positioned above the wafer 8 is lowered together with the suction plate supporting portion 91 by the suction disk lifting / lowering air cylinder 102 and is brought into contact with the semiconductor wafer W. At this time, the suction of the first hand 56 is released and the semiconductor wafer W is released.
Is released, and the semiconductor wafer W is suction-held by the wafer suction board 90 with the same axis.

Then, the notch polishing chamber shutter 112 of the notch polishing chamber 4 is slid by the operation of the shutter air cylinder 114 to open the notch top plate opening 111a of the notch polishing chamber top plate 111. With the notch top plate opening 111a opened, the wafer suction disk 90 is lowered by the suction disk lifting / lowering air cylinder 102, and is disposed at a predetermined position in the notch polishing chamber 4. At this time, the direction of the semiconductor wafer W held on the wafer suction disk 90 is
The V notch V is arranged to face the notch polishing wheel 120 of the notch polishing mechanism 5.

Further, in this state, the notch polishing chamber shutter 112 is slid again by the operation of the shutter air cylinder 114, and the notch top plate opening 111a of the notch polishing chamber top plate 111 is closed. At this time, the notch polishing chamber shutter 11
It is arranged in a circular opening formed by the two notches 112a.

Next, the notch polishing liquid supply means 123 is operated to supply the polishing liquid to the notch polishing cloth 136 from the polishing liquid supply nozzle 123a. The notch polishing wheel 120 is moved to the semiconductor wafer W side by shortening the notch pressing cylinder 127 while rotating the notch polishing wheel 120 by driving the rotation motor 130, and moving the notch polishing wheel 120. The 120 notch polishing cloth 136 is brought into contact with the V notch V with a predetermined pressing force. Thus, the notch polishing cloth 136 is
Is polished in a state where it is pressed.

Further, at this time, by driving the rocking motor 125, the wheel rotation drive unit 121 is rocked up and down, and the notch polishing cloth 136 is centered on the V notch V.
Rock up and down. Thereby, the corners on the front side and the back side inside the V notch V are also polished.

[Surface Polishing Step] After polishing the V notch V, the notch polishing chamber shutter 112 is slid to open the notch top plate opening 111a of the notch polishing chamber top plate 111. Then, the wafer suction disk 90 holding the semiconductor wafer W is raised to a position above the top plate 111 of the notch polishing chamber by the air cylinder 102 for lifting and lowering the suction disk.

In this state, the turning rotary actuator 94 is driven to rotate the turning shaft member 180 by 180 °, and the wafer suction disk 90 is turned by 180 °.
It is located above the surface polishing chamber 6. Then, the chamfered surface polishing chamber shutter 142 of the surface polishing chamber 6 is slid, and the chamfered surface polishing plate opening 141a of the chamfered surface polishing chamber top plate 141 is moved.
To open.

With the opening 141a of the chamfered top plate open, the wafer suction plate 90 is lowered by the suction plate lifting air cylinder 102, and is disposed at a predetermined position in the surface polishing chamber 6. Further, in this state, the chamfered surface polishing chamber shutter 142 is slid again, and the chamfered surface top plate opening 141 is moved.
Close a. At this time, the support rod 104 is disposed in a circular opening formed by a cutout portion of the chamfered surface polishing chamber shutter 142 that abuts on each other.

Next, in the chamfered surface polishing mechanism 149A, the swinging air cylinder 167 is shortened so that the swinging arm 1
60 is swung upward, and the polishing cloth 16 for the chamfered surface of the polishing drum 150A for the chamfered surface inclined at a predetermined angle.
As shown in FIG. 28, the 9A is brought into contact with the chamfered surface M on the front surface side of the semiconductor wafer W in a holding state from below with a predetermined pressing force.

On the other hand, in the outer surface polishing mechanism 149B,
By shortening the swinging air cylinder 167, the swinging arm 160
Of the outer surface polishing cloth 169B of the outer surface polishing drum 150B inclined at a predetermined angle,
As shown in FIG. 29, the semiconductor wafer W is brought into contact with the outer surface S of the semiconductor wafer W in a holding state from a side with a predetermined pressing force. In this state, the polishing liquid supply means is driven so that the polishing liquid is supplied to the polishing cloth 169A for the chamfered surface and the polishing cloth 169B for the outer surface.
Supply on top.

Then, in the chamfered surface polishing mechanism 149A, the drum rotation motor 161 is driven to rotate the chamfered surface polishing drum 150A at a predetermined rotation speed via the endless belt 165, and the chamfered surface polishing cloth 169A is rotated. The chamfered surface M on the front side is polished by sliding in the circumferential direction of the chamfered surface M. On the other hand, the outer surface polishing mechanism 1
At 49B, the drum rotation motor 161 is driven to drive the outer surface polishing drum 1 via the endless belt 165.
50B is rotated at a predetermined rotation speed, and the outer surface polishing cloth 1
The outer surface S is polished by sliding the 69B in the circumferential direction of the outer surface S.

At the same time, the suction disk rotating motor 103 is driven to rotate the semiconductor wafer W together with the wafer suction disk 90. At this time, the rotation of the suction disk rotating motor 103 is set to a predetermined rotation speed by a speed reducer, and the rotation angle of the wafer suction disk 90 is detected by a rotation angle detection sensor. Further, the cam follower rotation motor 156 of the chamfering surface linear motion unit 153A and the cam follower rotation motor 156 of the outer surface linear motion unit 153B are driven to drive the chamfering surface polishing drum 150A and the outer surface polishing drum 150B. It is moved back and forth by a predetermined amount in each axis direction.

That is, the polishing drum 15 for chamfering
0A and the outer surface polishing drum 150B are moved by a predetermined amount in the respective axial directions by the chamfer surface linear motion unit 153A and the outer surface linear motion unit 153B, and the chamfer surface polishing cloth 169A and the outer surface polishing are performed. Cloth 1
By polishing over a wide range on the outer peripheral surface of the 69B, uneven wear can be prevented, and the polishing drum 150A for chamfering can be used.
In addition, the life of the outer surface polishing cloth 169B is extended.

Therefore, the grinding drum 150 for the chamfered surface
A, the chamfered surface drum driving unit 151A and the chamfered surface polishing liquid supply unit supply the polishing liquid to the chamfered surface M of the semiconductor wafer W and cause the chamfered surface polishing cloth 169A to abut against the pressed state to be elastically deformed. At the same time, it functions as a chamfered surface polishing mechanism for supporting the chamfered surface polishing cloth 169A slidably along the circumferential direction of the chamfered surface M.

The outer surface polishing drum 150B, the outer surface drum driving means 151B and the chamfering surface polishing liquid supply means supply the outer surface polishing cloth 169B while supplying the polishing liquid to the outer surface S of the semiconductor wafer W. The outer surface polishing cloth 169B is brought into contact with the pressed state and elastically deformed.
Functions as an outer surface polishing mechanism that slidably supports the outer surface S along the circumferential direction of the outer surface S.

After polishing the chamfered surface M and the outer surface S on the front side, the chamfered surface polishing chamber shutter 1 in the surface polishing chamber 6
Slide 42 to open the chamfered top plate opening 141a. Then, the wafer suction disk 90 holding the semiconductor wafer W is raised to above the chamfered surface polishing chamber top plate 141 by the suction disk lifting air cylinder 102.

While the chamfered surface M on the front side of the semiconductor wafer W held by the one wafer suction plate 90 in the surface polishing chamber 6 is being polished, the other wafer suction plate 90 performs the wafer removal process. Further, another semiconductor wafer W transported to the first transfer section 48 through the wafer positioning step is suction-held in the same manner as the one wafer suction board 90.

In this state, the rotation rotary actuator 94 is driven to rotate the rotation shaft member 92, and the one and the other wafer suction disks 90 are respectively rotated by 180 °. That is, the semiconductor wafer W held on one wafer suction disk 90 is transported again above the first transfer unit 48, and the semiconductor wafer W held on the other wafer suction disk 90 is moved to the surface polishing chamber 6. The upper chamfered surface M is polished in the same manner as the semiconductor wafer W transferred above and held by the one wafer suction disk 90.

[Wafer Reversing Step] After the semiconductor wafer W whose surface has been polished is transferred above the first transfer section 48, the second hand 65 is set at a position lower than the wafer suction disk 90 by the second vertical movement cylinder 67. At the same time, it is horizontally moved by the second rodless cylinder 66 below the wafer suction plate 90 of the first transfer section 48.

In this state, the wafer suction plate 90 is lowered and the semiconductor wafer W is placed on the second hand 65. At this time, the suction of the wafer suction disk 90 is released to release the semiconductor wafer W, and the second hand 6
The lower surface of the semiconductor wafer W, that is, the front surface side is sucked by the suction holes 65a of No. 5 to hold the semiconductor wafer W.

Next, the second hand 65 holding the semiconductor wafer W is moved by the second rodless cylinder 66 to the second hand 65.
It moves horizontally to the transfer unit 50. At this time, the semiconductor wafer W is transferred from the second hand 65 to the reversing hand 74 of the reversing unit 52, and after retreating the second hand 65, the reversing actuator 73 is driven to move the reversing hand 74 in the extending direction. Rotate 180 ° as the axis.

After the reversing, the third hand 75 is moved to the second transfer section 50 by the third vertically moving cylinder 77 and the third rodless cylinder 76 to receive the semiconductor wafer W from the reversing hand 74 and to hold the suction hole. The third hand 75, which holds the lower surface of the semiconductor wafer W by suction at the upper surface, ie, the back surface side, by suctioning the semiconductor wafer W, is horizontally moved to the third transfer portion 53 by the third rodless cylinder 76. You.

[Back Grinding Step] After the third hand 75 is placed in the third transfer part 53, the wafer suction plate 90 of the back-surface polishing chamber transfer mechanism 10 previously positioned above the third transfer part 53 is lowered. At the same time, it is brought into contact with the upper surface of the semiconductor wafer W on the third hand 75. At this time, the suction of the third hand 75 is released to release the semiconductor wafer W, and the wafer suction disk 9 of the backside polishing chamber transfer mechanism 10 is moved.
At 0, the upper surface of the semiconductor wafer W, that is, the front surface side is sucked to hold the semiconductor wafer W.

Thereafter, similarly to the front-surface polishing step, the semiconductor wafer W whose rear surface is held downward is transferred into the rear-surface polishing room 9 by the rear-surface polishing chamber transfer mechanism 10, and the entire periphery of the outer edge portion on the rear surface is removed. Of the chamfered surface M and the outer surface S are performed. Then, after the polishing of the chamfered surface M on the back side is completed,
Similarly to the front surface polishing step, the semiconductor wafer W held on the wafer suction disk 90 of the back surface polishing chamber transfer mechanism 10 is transferred again above the third transfer unit 53.

In the same manner as in the front surface polishing step, while the chamfered surface M on the back surface side of the semiconductor wafer W held on one wafer suction plate 90 in the back surface polishing chamber 9 is being polished, the other wafer suction plate is polished. 90 sucks and holds another semiconductor wafer W transferred to the third transfer unit 53 through the surface polishing step and the wafer reversing step in the same manner as the one wafer suction disk 90.

In this state, the rotation rotary actuator 94 is driven to rotate the rotation shaft member 92, and the one and the other wafer suction disks 90 are respectively rotated by 180 °. That is, the semiconductor wafer W held by the one wafer suction disk 90 is transported again above the third transfer section 53, and the semiconductor wafer W held by the other wafer suction disk 90 is moved to the back surface polishing chamber 9 As in the case of the semiconductor wafer W transferred above and held by one of the wafer suction plates 90, the chamfered surface M on the back side is polished.

[Wafer Cleaning Step] After the semiconductor wafer W whose back surface has been polished is transferred above the third transfer section 53, the semiconductor wafer W is placed on the unloader hand 85 of the unloader unit 55 previously arranged in the third transfer section 53. The wafer W is placed. At this time, the suction of the wafer suction disk 90 is released to release the semiconductor wafer W, and the semiconductor wafer W is sucked and held by the suction holes 85a of the unloader hand 85.

The unloader hand 85 holding the semiconductor wafer W is driven by the horizontal moving device 82 and the rotary actuator for up and down movement, and the cleaning tank 170 is moved.
To move upward. Further, the swing rotary actuator is driven to swing the unloader hand 85 so that the tip is directed downward, and the held semiconductor wafer W is changed from the horizontal state to the vertical state. At this time, the semiconductor wafer W is placed on the pair of cylindrical scrubbers 1 in plan view.
71 is disposed at an intermediate position.

Next, the unloader hand 85 is lowered by the rotary actuator for vertical movement, and the semiconductor wafer W is put into the cleaning tank 170 and inserted between the pair of cylindrical scrubbers 171. Further, the semiconductor wafer W is released from the unloader hand 85 by releasing the suction and is rotatably supported by the plurality of support rollers 191a.

In this state, the scrubber unit 172 is driven to clean the semiconductor wafer W. That is, first, the pair of scrubber connecting members 183A and 183B are extended by extending the scrubber pressing air cylinder 180.
Are rotated so that the tips approach each other. At this time,
A pair of cylindrical scrubbers 171 attached to these scrubber connecting members 183A and 183B are brought close to each other and the semiconductor wafer W is sandwiched therebetween.

Then, the scrubber driving motor 178 is driven to rotate the pair of cylindrical scrubbers 171 in opposite directions via the scrubber endless belt 190.
At this time, at the same time, the cleaning water is supplied from the cleaning water supply source through the circulation hole 184a of the scrubber shaft member 184 and the through hole 185a of the scrubber mounting cylinder 185.
Spout outside of 1. That is, the semiconductor wafer W
Since the cleaning water from the cylindrical scrubber 171 and the cylindrical scrubber 171 come into contact with each other, scrub cleaning is performed to remove polishing liquid and the like, and one side in the radial direction is sandwiched by the cylindrical scrubber 171. Scrubber 171
And is washed over the entire circumference.

[Wafer Storage Step] After the cleaning, the pressing air cylinder 180 for the scrubber is shortened,
The pair of cylindrical scrubbers 171 are separated from each other, and the semiconductor wafer W sandwiched therebetween is released. Then, the semiconductor wafer W is sucked again into the suction holes 85 a of the unloader hand 85 and held by the unloader hand 85.

Next, the unloader hand 85 holding the semiconductor wafer W in a vertical state is raised and horizontally moved to a predetermined position above the water tank section 193.
Then, the unloader hand 85 is lowered again, the semiconductor wafer W is transferred to a predetermined position of the storage cassette C2 in the water tank portion 193, and the storage is completed by releasing the suction and mounting the semiconductor wafer W.

After a predetermined number of semiconductor wafers W are stored in the storage cassette C2 by the above-described steps, the cassette support portion 196 on which the storage cassette C2 is mounted is raised by the air cylinder 195 for lifting and lowering. The cassette C2 is arranged above the water tank unit 193. Thereafter, the semiconductor wafer W is taken out of the water tank section 193 together with the storage cassette C2 and transferred to the next step.

In this apparatus for polishing a chamfered surface of a semiconductor wafer, the semiconductor wafer W is sequentially transferred to each polishing mechanism by each transfer mechanism.
Are sequentially polished, further cleaned after polishing, and finally stored in the storage cassette C2, so that the V notch V
The polishing, cleaning and storage of all the chamfered surfaces M including the above are efficiently performed.

Since the V notch V is accurately oriented by the notch positioning mechanism 27 immediately before the semiconductor wafer W is transferred to the notch polishing mechanism 5, polishing of the V notch V by the notch polishing mechanism 5 is performed. Performed accurately and well. Then, a polishing liquid or the like during polishing is applied to the semiconductor wafer W.
Since the V-notch V is positioned before the V-notch is attached, no polishing liquid or the like adheres to the notch positioning mechanism 27.

Further, the notch polishing mechanism 5 includes an annular notch polishing cloth 136 and a wheel rotation drive unit 121 for rotating and sliding the notch polishing cloth 136 to the V notch V. The polishing cloth can be slid by contacting the polishing cloth to the back, and the entire chamfered surface M at the V notch V is polished well.

Then, the outer surface polishing cloth 169B is brought into contact with the chamfered surface polishing mechanism 149A while supplying a polishing liquid to the outer surface S of the semiconductor wafer W held by the suction disk supporting portion 91. Surface polishing mechanism 149 that supports the polishing cloth 169B for sliding in the circumferential direction of the outer surface S.
B, the chamfered surface polishing mechanism 149A polishes the chamfered surface M, and at the same time, the outer surface polishing pad 169B causes the outer surface polishing cloth 169B to be polished by the outer surface S.
The outer surface S is also polished by abutting and sliding on the outer surface S.

Further, the chamfered surface polishing mechanism 149A includes a chamfered surface polishing drum 150A and a chamfered surface drum driving means 151A, and the outer surface polishing mechanism 149B includes an outer surface polishing drum 150B and an outer surface drum. Since the driving means 151B is provided, the outer peripheral surfaces of the rotating polishing drum 150A for the chamfer surface and the outer polishing surface 150B for the outer surface come into contact with the chamfer surface M and the outer surface S of the semiconductor wafer W to rotate and slide. Thereby, the chamfered surface M and the outer surface S are polished stably and satisfactorily with the chamfered surface polishing cloth 169A and the outer side surface polishing cloth 169B, respectively.

The polishing was performed by sliding the polishing cloth 169A for the chamfered surface in the circumferential direction of the chamfered surface M by the chamfered surface polishing mechanism 149A, as shown in FIG. When the polishing is performed by sliding the polishing cloth 169A for chamfering, as shown in FIG.
A phenomenon occurs in which the flattening of the unevenness of the chamfered surface M becomes insufficient and microscopic undulations remain in the circumferential direction.

As described above, if the unevenness is not sufficiently flattened,
At the time of handling the semiconductor wafer, when the semiconductor wafer is slid, there is a problem that the uneven portion is caught and easily chipped, and the surface roughness is low, so that fine dust easily adheres. On the contrary,
In the present embodiment, the polishing is performed by sliding in the circumferential direction of the chamfered surface M. Therefore, as shown in FIG.
This has the advantage that the unevenness of the surface is almost flattened smoothly and the above-mentioned waving phenomenon in the circumferential direction hardly occurs. In particular, in polishing a chamfered surface in a large diameter semiconductor wafer, sliding the chamfered surface polishing cloth in the circumferential direction is more preferable than sliding the chamfered surface polishing cloth in a direction perpendicular to the circumferential direction due to the above effect. Flatness can be obtained.

The present invention also includes the following embodiments. (1) Although the semiconductor wafer W is polished by one polishing drum 150A for the chamfered surface and the polishing drum 150B for the outer surface, a plurality of polishing drums for the chamfered surface or the outer surface may be employed. in this case,
The greater the number of the polishing drums for the chamfered surface and the outer surface, the smaller the distance between the respective polishing drums in the circumferential direction, that is, the respective polishing cloths. The rotation angle of the semiconductor wafer required for the process is reduced, and the processing time can be further reduced.

(2) In the above embodiment, the polishing is performed while the polishing liquid is supplied to the polishing drum 150A for the chamfered surface and the polishing drum 150B for the outer surface by the polishing liquid supply means for the chamfered surface and the outer peripheral surface. The polishing may be performed in a state where the polishing drum for the chamfered surface and the polishing drum for the outer surface are immersed in a polishing liquid tank in which a polishing liquid is stored.

(3) In the above embodiment, polishing is performed by rotating the wafer suction plate 90, the chamfering surface polishing drum 150A, and the outer surface polishing drum 150B of the front surface polishing chamber 6 and the back surface polishing chamber 9 in predetermined directions. However, they are all rotatable in the opposite directions, and are set so that these rotation directions can be appropriately combined.

(4) The rotating speed of the polishing drum 150A for the chamfered surface, the polishing drum 150B for the outer surface, and the wafer suction disk 90 can be set to a predetermined speed as appropriate. The rotation speed of W may be set to be higher or lower than the rotation speed of the polishing drum 150A for the chamfered surface or the polishing drum 150B for the outer surface to be brought into contact.

(5) The rotating speed and rotating direction of the notch polishing cloth 136 can be set to predetermined speeds and directions as appropriate, and the polishing characteristics of the chamfered surface at the V notch V can be adjusted. (6) Although the ring-shaped notch polishing cloth 136 is used, a disc-shaped notch polishing cloth may be used.

[0153]

According to the present invention, the following effects can be obtained. (1) According to the semiconductor wafer chamfering surface polishing apparatus of the first aspect, the semiconductor wafer is sequentially conveyed to the notch polishing mechanism, the front surface polishing mechanism, and the back surface polishing mechanism by the unpolished wafer conveyance mechanism and the inter-polishing mechanism conveyance mechanism. Therefore, each chamfered surface of the semiconductor wafer is sequentially polished, and further polished, transported to a wafer cleaning mechanism by a polished wafer transport mechanism, washed and finally stored in a storage section, and all the notch portions are included. Polishing, cleaning and storage of the chamfered surface can be performed efficiently.

(2) According to the apparatus for polishing a chamfered surface of a semiconductor wafer according to the second aspect, there is provided a notch positioning mechanism for directing a notch portion in a predetermined direction, and the unpolished wafer transport mechanism transports the semiconductor wafer to the notch positioning mechanism. Since the semiconductor wafer is set to be transferred to the notch polishing mechanism after positioning, the notch positioning mechanism accurately directs the notch portion just before the semiconductor wafer is transferred to the notch polishing mechanism. Polishing of the notch portion can be performed accurately and favorably. In addition, since the notch portion is positioned before the polishing liquid or the like adheres to the semiconductor wafer during polishing, the polishing liquid or the like does not adhere to the notch positioning mechanism, and there is no need to consider the influence of the polishing liquid. There is.

(3) According to the apparatus for polishing a chamfered surface of a semiconductor wafer according to the third aspect, the notch polishing mechanism has a disk-shaped or annular notch polishing cloth, and the notch polishing cloth is rotated and slid on the notch portion. Since a notch polishing cloth driving mechanism is provided, the polishing cloth can be brought into contact with the back of the notch and slid, and the entire chamfered surface at the notch can be polished satisfactorily. Further, the polishing characteristics can be adjusted by controlling the rotation speed of the notch polishing cloth.

(4) According to the apparatus for polishing a chamfered surface of a semiconductor wafer according to the fourth aspect, the front side polishing mechanism and the rear side polishing mechanism include a chamfered surface polishing mechanism and an outer side surface polishing mechanism, respectively. , The chamfered surface polishing mechanism and the outer surface polishing mechanism simultaneously form the chamfered surface and the outer peripheral surface smoothly and obtain good surface roughness, improve the processing accuracy of the semiconductor wafer, and improve the yield during manufacturing and the characteristics of the semiconductor wafer. Deterioration can be suppressed.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of an apparatus for polishing a chamfered surface of a semiconductor wafer according to the present invention.

FIG. 2 is a sectional view taken along line XX of FIG.

FIG. 3 is a plan view of a wafer positioning unit in one embodiment of the semiconductor wafer chamfering surface polishing apparatus according to the present invention.

FIG. 4 is a front view of a wafer positioning unit in one embodiment of the semiconductor wafer chamfering surface polishing apparatus according to the present invention.

FIG. 5 is a side view of a wafer positioning unit in one embodiment of the semiconductor wafer chamfering surface polishing apparatus according to the present invention.

FIG. 6 is a plan view showing a wafer transfer mechanism in one embodiment of the semiconductor wafer chamfering surface polishing apparatus according to the present invention.

FIG. 7 is a side view showing a first transfer section of a wafer transfer mechanism in one embodiment of the semiconductor wafer chamfering surface polishing apparatus according to the present invention.

FIG. 8 is a front view showing a wafer transfer mechanism in one embodiment of the semiconductor wafer chamfering surface polishing apparatus according to the present invention.

FIG. 9 is a side view including a partial cross section showing an unloader unit of the wafer transfer mechanism in one embodiment of the semiconductor wafer chamfering surface polishing apparatus according to the present invention.

FIG. 10 is a cross-sectional view showing an unloader unit and a wafer cleaning mechanism in one embodiment of the semiconductor wafer chamfering surface polishing apparatus according to the present invention.

FIG. 11 is a cross-sectional view showing a front surface polishing chamber transfer mechanism and a rear surface polishing chamber transfer mechanism in one embodiment of the semiconductor wafer chamfering surface polishing apparatus according to the present invention.

FIG. 12 is a plan view showing a notch polishing chamber in an embodiment of a chamfering surface polishing apparatus for a semiconductor wafer according to the present invention.

FIG. 13 is a front view showing a notch polishing chamber in one embodiment of the semiconductor wafer chamfering surface polishing apparatus according to the present invention.

FIG. 14 is a partially enlarged cross-sectional view showing a notch polishing chamber in an embodiment of a chamfering surface polishing apparatus for a semiconductor wafer according to the present invention.

FIG. 15 is a cross-sectional plan view showing a notch polishing mechanism in one embodiment of the chamfered surface polishing apparatus for a semiconductor wafer according to the present invention.

FIG. 16 is an explanatory view showing a position of a notch polishing drum in a notch polishing chamber in one embodiment of a chamfering surface polishing apparatus for a semiconductor wafer according to the present invention.

FIG. 17 is a front view showing a notch polishing mechanism in one embodiment of a chamfered surface polishing apparatus for a semiconductor wafer according to the present invention.

FIG. 18 is a plan view including a partial cross-section showing a chamfered surface polishing mechanism and an outer surface polishing mechanism in an embodiment of the semiconductor wafer chamfered surface polishing apparatus according to the present invention.

FIG. 19 is a front view showing an arrangement of a chamfered surface polishing mechanism and an outer surface polishing mechanism in an embodiment of the semiconductor wafer chamfered surface polishing apparatus according to the present invention.

FIG. 20 is a side view showing a chamfered surface polishing mechanism in an embodiment of the semiconductor wafer chamfered surface polishing apparatus according to the present invention.

FIG. 21 is a side view showing an outer surface polishing mechanism in one embodiment of the semiconductor wafer chamfering surface polishing apparatus according to the present invention.

FIG. 22 is a front view showing an outer surface polishing mechanism in one embodiment of the semiconductor wafer chamfering surface polishing apparatus according to the present invention.

FIG. 23 is an explanatory diagram showing a positional relationship between a cam follower, a groove provided in a linearly moving portion, and a rotation center of a cam follower rotating motor in one embodiment of the semiconductor wafer chamfering surface polishing apparatus according to the present invention.

FIG. 24 is a side view showing a wafer cleaning mechanism in one embodiment of the semiconductor wafer chamfering surface polishing apparatus according to the present invention.

FIG. 25 is a sectional view showing an unloader unit and a wafer accommodating mechanism in one embodiment of the semiconductor wafer chamfering surface polishing apparatus according to the present invention.

FIG. 26 is a partially cutaway plan view showing a wafer cleaning mechanism and a wafer storage mechanism in one embodiment of the semiconductor wafer chamfering surface polishing apparatus according to the present invention.

FIG. 27 is an external perspective view showing one embodiment of a chamfered surface polishing apparatus for a semiconductor wafer according to the present invention.

FIG. 28 is a schematic cross-sectional view for explaining polishing of a chamfered surface in an embodiment of a chamfered surface polishing apparatus for a semiconductor wafer according to the present invention.

FIG. 29 is a schematic cross-sectional view for explaining polishing of an outer surface in a chamfered surface polishing apparatus according to an embodiment of the present invention.

FIG. 30 is a cross-sectional view for explaining a polishing state of a chamfered surface in a polishing direction and another polishing direction in an embodiment of a semiconductor wafer chamfered surface polishing apparatus according to the present invention.

FIG. 31 is a schematic cross-sectional view for explaining polishing of a chamfered surface in a conventional example of the apparatus for polishing a chamfered surface of a semiconductor wafer according to the present invention.

FIG. 32 is a plan view showing a semiconductor wafer in which a V notch is formed.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 wafer removal mechanism (unpolished wafer transport mechanism) 3 wafer transport mechanism (transfer mechanism between polishing mechanisms) 5 notch polishing mechanism 7 surface polishing chamber transport mechanism (transfer mechanism between polishing mechanisms) 8 surface polishing mechanism 10 back polishing chamber transport mechanism ( (Transfer mechanism between polishing mechanisms) 11 Backside polishing mechanism 12 Wafer cleaning mechanism 27 Notch positioning mechanism 55 Unloader unit (polished wafer transport mechanism) 91 Adsorber support unit (wafer rotating mechanism) 121 Wheel rotation driving unit (notch polishing cloth drive) Mechanism) 136 notch polishing cloth 149A chamfering surface polishing mechanism 149B outer surface polishing mechanism 150A chamfering surface polishing drum 150B outer side polishing drum 151A chamfering surface drum driving means 151B outer surface drum driving means 169A chamfering surface polishing cloth 169B Polishing cloth for outer surface C2 Set (storage unit) M chamfered surface S outer surface V V notch W semiconductor wafer

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Akira Kawaguchi 985 Ino No. 1, Ginya, Ikuno-cho, Asago-gun, Hyogo Prefecture 1 Ikuno Works, Mitsubishi Materials Corporation

Claims (4)

[Claims] 1. A semiconductor wafer chamfering surface polishing apparatus for polishing a chamfered surface formed on a peripheral edge of a semiconductor wafer, comprising: a notch polishing mechanism for polishing a chamfered surface of a notch portion of the semiconductor wafer; A front side polishing mechanism for polishing a chamfered surface on a front side, a back side polishing mechanism for polishing a chamfered surface on a back side of the semiconductor wafer, a wafer cleaning mechanism for cleaning the semiconductor wafer, and the unpolished semiconductor wafer. The notch polishing mechanism, the unpolished wafer transport mechanism for transporting to any one of the front side polishing mechanism or the back side polishing mechanism, and the semiconductor wafer polished by the one polishing mechanism to the other two An inter-polishing mechanism transport mechanism for sequentially transporting the semiconductor wafer to the polishing mechanism; Chamfer polishing apparatus of a semiconductor wafer, comprising and a polished wafer transfer mechanism for accommodating and transporting a semiconductor wafer that has been cleaned by the transport further the mechanism to the cleaning mechanism in the storage unit. 2. The apparatus for polishing a chamfered surface of a semiconductor wafer according to claim 1, further comprising: a notch positioning mechanism for directing a notch portion of the semiconductor wafer in a predetermined direction; A chamfered surface polishing apparatus for a semiconductor wafer, wherein the semiconductor wafer is set to be conveyed to the notch positioning mechanism, positioned by the mechanism, and then conveyed to the notch polishing mechanism. 3. The apparatus for polishing a chamfered surface of a semiconductor wafer according to claim 1, wherein the notch polishing mechanism includes a disk-shaped or annular notch polishing cloth, and the notch polishing cloth is an axis of the semiconductor wafer. A notch polishing cloth driving mechanism that rotatably supports the notch portion while supplying the polishing liquid to the notch portion while rotating and supporting the notch portion while having an axis in a direction perpendicular to the notch portion and rotating and sliding. An apparatus for polishing a chamfered surface of a semiconductor wafer, comprising: 4. The apparatus for chamfering a chamfered surface of a semiconductor wafer according to claim 1, wherein the front side polishing mechanism and the rear side polishing mechanism rotatably rotate the semiconductor wafer in a circumferential direction thereof. A wafer rotating mechanism for holding, a chamfered surface polishing mechanism for abutting a slidable chamfering surface polishing cloth while supplying a polishing liquid to the chamfered surface of the semiconductor wafer held by the wafer rotating mechanism, and slidably supporting the semiconductor wafer; And an outer surface polishing mechanism that slidably supports the outer surface polishing cloth while supplying the polishing liquid to the outer surface of the semiconductor wafer held by the wafer rotating mechanism. Semiconductor wafer chamfer polishing machine.