CN116973337A - Fine diamond wire surface particle number density measurement system - Google Patents
Fine diamond wire surface particle number density measurement system Download PDFInfo
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- 239000002245 particle Substances 0.000 title claims abstract description 80
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 71
- 239000010432 diamond Substances 0.000 title claims abstract description 71
- 238000001739 density measurement Methods 0.000 title claims description 8
- 238000003384 imaging method Methods 0.000 claims description 11
- 230000007547 defect Effects 0.000 abstract description 7
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- 230000007613 environmental effect Effects 0.000 abstract description 3
- 238000011897 real-time detection Methods 0.000 abstract description 3
- 238000005259 measurement Methods 0.000 description 12
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- 238000005520 cutting process Methods 0.000 description 8
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- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000005070 sampling Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- 230000009191 jumping Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003921 particle size analysis Methods 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
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- 229910000677 High-carbon steel Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
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- 238000006243 chemical reaction Methods 0.000 description 1
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- 239000000428 dust Substances 0.000 description 1
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- 238000009776 industrial production Methods 0.000 description 1
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- 239000010959 steel Substances 0.000 description 1
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- G—PHYSICS
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- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N21/49—Scattering, i.e. diffuse reflection within a body or fluid
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N9/00—Investigating density or specific gravity of materials; Analysing materials by determining density or specific gravity
- G01N9/24—Investigating density or specific gravity of materials; Analysing materials by determining density or specific gravity by observing the transmission of wave or particle radiation through the material
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Abstract
The invention relates to a system for measuring the number density of particles on the surface of a fine diamond wire, which comprises two groups of lasers with different emitted light wavelengths, two groups of collimating lenses, two beam splitting prisms, four groups of reflecting mirror groups and a light receiving unit, wherein the two groups of lasers are arranged at intervals, the two groups of collimating lenses are respectively and correspondingly distributed on the light paths of emitted light of the two groups of lasers, the two beam splitting prisms are respectively arranged on the light paths of two groups of parallel light sources, the four groups of reflecting mirror groups are respectively distributed on the light paths of four light beams divided by the two groups of parallel light sources and are respectively used for reflecting and converging the four light beams to one particle on the surface of the diamond wire to be measured, and the light receiving unit is arranged on the scattered light paths of the particles. The advantages are that: aiming at the defects of slower measuring speed, lower environmental adaptability and the like of the existing diamond wire, the laser Doppler effect principle is adopted to use two groups of double-beam double-scattering light path systems with different wavelengths and beam angles, so that the real-time detection speed, the measuring precision and the repeatability of the diamond wire particles are effectively improved.
Description
Technical Field
The invention relates to the technical field of laser measurement, in particular to a system for measuring the number density of particles on the surface of a micro diamond wire.
Background
The diamond wire is simply called diamond cutting wire, and is made by uniformly solidifying diamond micro powder particles on a bus bar (generally high-carbon steel wire) with a certain distribution density. The cutting purpose can be realized by performing high-speed grinding movement between the diamond wire and the cut object. The diamond wire is used as an auxiliary material for producing silicon wafers in a photovoltaic industry chain, is positioned at the upstream of the industry chain, and the technical performance of the diamond wire directly influences the quality of the silicon wafers and the manufacturing cost of photovoltaic modules, so that the diamond wire is a core technical link for reducing the cost of photovoltaic enterprises.
The diamond wire particles are formed by crushing artificial diamond particles, the granularity is generally smaller than 50 mu m, the diamond wire particles are key materials for cutting diamond wires, and the quality and stability of the diamond wire particles directly influence the quality of the subsequent electroplating process and finished diamond wires. The significance of measuring the diamond wire particle number density is that: the principle of diamond wire cutting silicon wafer is that diamond particles are used for continuously scribing silicon materials, the cutting force of larger diamond particles on the silicon materials is larger, and the cutting capability mainly depends on the diamond particles on the premise that a bus is used as a diamond wire particle carrier as long as strength can be kept continuously, so that the technical core of diamond is not the bus, but the sanding process is adopted, the number of diamond micro powder particles in a unit fixedly connected to the diamond wire bus directly determines the cutting force of the diamond wire, and the diamond wire cutting method is one of the most critical technical indexes for evaluating the quality of the diamond wire.
The existing diamond wire particle measurement technology mainly comprises the following two types:
1. machine vision image recognition technology
The measurement mode is as follows: microscopic images of diamond micro powder particles in a unit view field on a steel wire substrate are shot on line in real time through a high-speed industrial camera, image signals are transmitted to an image processing system in real time and converted into digital signals, the digital image signals are received by a diamond wire production line detection control system in real time, and the number and density data of diamond particles in the unit view field on a bus substrate are calculated in real time. The characteristics are that: the automatic visual recognition detection is used for detecting the appearance and surface defects of products at present, the detection recognition system belongs to two-dimensional machine vision, the technology is mature, the basic process is to acquire images by using a camera, process the acquired images and perform pattern recognition, and detect the required contents.
This measurement has the following technical drawbacks:
the machine vision surface defect detection, especially on-line detection, is characterized by huge data volume, more redundant information and high feature space dimension, and meanwhile, the algorithm capability for extracting limited defect information from mass data is insufficient and the real-time performance is not high by considering the diversity of real machine vision facing objects and problems. Meanwhile, the measurement precision of the machine vision online image recognition technology is limited by the performance of equipment, for example, the depth of field of an industrial camera is relatively smaller (generally about 10 mm), and the requirements on the jumping amplitude and the jumping frequency of the diamond wire are higher; parameters such as sensor frame rate and pixels directly influence measurement accuracy errors (about 5% is known in the market), and the maximum movement speed of the diamond wire (150 m/min is known in the market). The accurate measurement in the operation of the visual recognition system is influenced by natural environment including temperature, sunlight irradiation, switching power supply conversion, dust, ambient humidity, interference signals thereof and the like, wherein the interference signals are influence factors which are difficult to avoid in the field of industrial production inspection, and particularly have serious influence on weak current installation power supply circuits such as an industrial camera power supply circuit, a network signal transmission power supply circuit and the like.
2. Laser particle size analyzer
The measurement mode is as follows: particle size is measured using scattering phenomena of particles against light. That is, when light encounters diamond wire particles during traveling, a part of the light deviates from the original traveling direction, and the smaller the particle size is, the larger the deviation amount is, and the larger the particle size is, and the smaller the deviation amount is. The intensity of the scattered light represents the number of particles of this size. The particle size distribution of the sample can be obtained by measuring the intensity of the scattered light at different angles. The characteristics are that: the dynamic range of the measurement is large, namely the ratio of the minimum particles to the maximum particles which can be measured by the instrument, and the larger the dynamic range is, the more convenient the measurement is naturally. The repeatability is good, the sampling amount of the laser particle size analyzer is more than that of other instruments, and the photoelectric sampling is carried out for more than 100 times on the same sampling, so that the measurement repeatability is high, and the typical accuracy of the average particle size can be within 1%.
This measurement has the following technical drawbacks:
the laser particle size analysis method is a fitting approximate analysis method, is not calibrated, has poor traceability and comparability and low resolution, and is not suitable for measuring samples with narrow distribution range. The laser particle size method is accurate in analysis of large-size particles, but the analysis error of the particle size below 10 microns is large, and the requirement of abrasive particle size analysis cannot be met. Therefore, the laser particle sizer often checks a defective product as an acceptable product, and also often checks a defective product as a defective product, so that a user has a detection error phenomenon when performing quality inspection by the laser particle sizer.
Disclosure of Invention
The invention aims to provide a system for measuring the number density of particles on the surface of a fine diamond wire, which effectively overcomes the defects of the prior art.
The technical scheme for solving the technical problems is as follows:
the system comprises two groups of lasers with different emitted light wavelengths, two groups of collimating lenses, two beam splitting prisms, four groups of reflecting mirror groups and a light receiving unit, wherein the two groups of lasers are arranged at intervals, the two groups of collimating lenses are respectively and correspondingly distributed on the light paths of emitted light of the two groups of lasers, the two groups of point light sources emitted by the two groups of lasers are collimated into two groups of parallel light sources, the two beam splitting prisms are respectively arranged on the light paths of the two groups of parallel light sources, the two groups of parallel light sources are respectively divided into two light beams with 90-degree included angles and equal light intensity, the four groups of reflecting mirror groups are respectively distributed on the light paths of four light beams divided by the two groups of parallel light sources, the four light beams are respectively reflected and converged at one particle position on the surface of a diamond wire to be measured, and the light receiving unit is arranged on the scattered light paths of the particles and is used for receiving scattered light.
On the basis of the technical scheme, the invention can be improved as follows.
Further, the light receiving unit includes an imaging lens for receiving the scattered light and a photodetector for receiving the scattered light passing through the imaging lens.
Further, the photodetector is an avalanche diode.
Further, the imaging lens is a cemented lens.
Further, each of the above mirror groups includes at least one total reflection mirror.
The beneficial effects of the invention are as follows: aiming at the defects of slower measuring speed, lower environmental adaptability and the like of the existing diamond wire, the laser Doppler effect principle is adopted to use two groups of double-beam double-scattering light path systems with different wavelengths and beam angles, so that the real-time detection speed, the measuring precision and the repeatability of the diamond wire particles are effectively improved.
Drawings
FIG. 1 is a schematic diagram of a system for measuring the number density of particles on the surface of a fine diamond wire according to the present invention;
FIG. 2 is a schematic diagram showing four light beams converging to one point at a particle in the fine diamond line surface particle number density measurement system according to the present invention;
FIG. 3 is a plot of striped spots of two different pitches generated by two lasers in the system for measuring the number density of particles on the surface of a fine diamond line according to the present invention;
FIG. 4 (a) is a fringe spot contrast diagram for 6 μm diamond wire particles at a laser wavelength of 780nm and a beam angle of 3.75;
FIG. 4 (b) is a fringe spot contrast diagram for 6 μm diamond wire particles at a laser wavelength of 685nm and a beam angle of 2.45;
FIG. 5 (a) is a fringe spot contrast diagram for an 8 μm diamond wire particle at a laser wavelength of 780nm and a beam angle of 3.75;
FIG. 5 (b) is a fringe spot contrast diagram for an 8 μm diamond wire particle at a laser wavelength of 685nm and a beam angle of 2.45.
In the drawings, the list of components represented by the various numbers is as follows:
1. a laser; 2. a collimating lens; 3. a beam-splitting prism; 4. an imaging lens; 5. a photodetector; 6. a total reflection mirror.
Detailed Description
The principles and features of the present invention are described below with reference to the drawings, the examples are illustrated for the purpose of illustrating the invention and are not to be construed as limiting the scope of the invention.
Examples: as shown in fig. 1, the system for measuring the number density of particles on the surface of a fine diamond wire according to the present embodiment includes two sets of lasers 1 with different emitted light wavelengths, two sets of collimating lenses 2, two beam splitting prisms 3, four sets of reflecting mirror sets and a light receiving unit, where the two sets of lasers 1 are arranged at intervals, the two sets of collimating lenses 2 are respectively and correspondingly distributed on the light paths of the emitted light of the two sets of lasers 1, and are used for collimating two paths of point light sources emitted by the two sets of lasers 1 into two sets of parallel light sources, the two beam splitting prisms 3 are respectively arranged on the light paths of the two sets of parallel light sources, and are used for respectively splitting the two sets of parallel light sources into two light beams with an included angle of 90 ° and equal light intensity, the four sets of reflecting mirror sets are respectively distributed on the light paths of the four light beams split by the two sets of parallel light sources, and are respectively used for reflecting and converging the four light beams onto one particle (denoted by P in the figure) on the surface of the diamond wire a to be measured, and the light receiving unit is arranged on the scattered light paths of the particles.
Aiming at the defects of low measuring speed, low environmental adaptability and the like of the existing diamond wire, the system for measuring the number density of the particles on the surface of the micro diamond wire adopts a laser Doppler effect principle to use two groups of double-beam double-scattering light path systems with different wavelengths and light beam angles, and effectively improves the real-time detection speed, the measuring precision and the repeatability of the diamond wire particles.
In fig. 1, two types of lasers 1 with two different design wavelengths are used as light sources. (b) Two point light sources emitted by a part of the laser 1 are respectively converted into two groups of parallel light sources after passing through two groups of collimating lenses 2. As shown in (c), a spectral ratio of 1:1, the beam splitting prism 3 equally divides the incident light source into two beams with equal light intensity and 90-degree included angleA light beam. (d) After part of the light passes through the reflector group, four beams of light are converged into one point to irradiate the surface (particle P) of the diamond wire to be detected. (e) Part of the incident beam is received and calculated by the light receiving part via particle scattering. The light receiving section includes an imaging lens 4 for receiving scattered light and a photodetector 5 for receiving the scattered light passing through the imaging lens 4. The light needs to be split by the beam splitting prism 3 to reach the object to be measured, and the effective light energy loss is about 20% due to the change of the light source medium during the process, so that the imaging lens 4 adopts a large-aperture cemented lens to improve the signal strength in order to improve the signal to noise ratio and simplify the signal processing scheme. Since the divergent light actually received by the photodetector 5 is weak, an avalanche diode with an internal gain is used (gain effect 10 2 -10 5 ) As a photodetector.
In this embodiment, each of the above-mentioned mirror groups includes at least one total reflection mirror 6 (that is, a total reflection mirror 6 may be disposed on the optical path of the four beams to reflect to the particle, or may be disposed at intervals of multiple total reflection mirrors 6 to reflect the optical path of the beam until the beam is incident and converged at the particle). The four light beams can be well reflected and converged to particles on the surface of the diamond wire to be measured.
As shown in fig. 2 and 3, the emitted light of the two lasers 1 is split into two beams of laser light by the beam splitter prism 3 on the optical path, and then reflected by a corresponding group of reflecting mirror groups, and then meets the surface of the measured object to generate light-dark interference fringe light spots with constant spacing. The light interference fringe light spots with alternate brightness diverge diamond wire particles on the surface of the measured object, and the flicker frequency is in direct proportion to the movement speed of the diamond wire particles on the surface of the measured object. Meanwhile, when the particle size exceeds the spot fringe spacing, the scattered light signal frequency period directly affects the signal frequency of the avalanche diode. The two lasers 1 respectively generate two interference fringe light spots d1 and d2 with different pitches, because the laser beam angles are different, the two groups of laser systems can generate two measuring depth of field a1 and a2, and the two groups of fringe light spots are simultaneously used in the actual calculation process of the number of diamond wire particles, so that the effective depth of field takes a smaller value of 50mm (+ -25 mm).
The specific calculation method is as follows:
the optical interference fringe spacing calculation method is based on the laser Doppler effect, and comprises the following steps:
wherein, d: stripe spacing; lambda: a laser wavelength; k: beam angle (e.g., k1, k2 in fig. 1).
The avalanche diode frequency is calculated mainly in relation to the scattered light frequency of the diamond wire particles of the emitted light beam on the surface of the measured object, is inversely proportional to the period of the scattered light signal, is directly proportional to the movement speed of the measured object, and is inversely proportional to the interval of the optical interference fringes, and is as follows:
wherein f: avalanche diode signal frequency; t: an optical signal period; v: the speed of the measured object; d: light interference fringe spacing; k: scaling factor.
Examples: the method for calculating the scheme calculates the interference fringe spacing generated by two lasers:
(1) d1= 8.012 μm when the laser wavelength is 685nm and the beam angle is 2.45 °.
(2) D2= 5.963 μm when the laser wavelength is 780nm and the beam angle is 3.75 °.
Because four beams of light generated by the two lasers 1 are converged into one point on the measured object, the signal frequency received by the avalanche diode is only related to the space between the optical interference fringes and the signal period, and the rest parameters are constant values.
As shown in fig. 4 and 5, the frequency of the signal received by the avalanche diode does not change when the double beam emitted light generated by the 685nm laser scans the non-particle region and the region below the particle size of 8 μm of the diamond wire. The frequency of the signal received by the avalanche diode is not changed when the dual-emission light generated by the 780nm laser scans the non-particle area and the area with the particle size of less than 6 mu m of the diamond wire, when the particle size of the diamond wire is larger than 6 mu m, the particle size is larger than the fringe spacing, the frequency of the signal received by the avalanche diode is changed, and the number of the diamond wire particles with the particle size of 6-8 mu m can be obtained by calculating the periodic variation difference value of the signals generated by the two reflected light.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.
Claims (5)
1. The utility model provides a fine diamond wire surface particle number density measurement system which characterized in that: the laser comprises two groups of lasers (1) with different emission light wavelengths, two groups of collimating lenses (2), two beam splitting prisms (3), four groups of reflecting mirror groups and a light receiving unit, wherein the two groups of lasers (1) are arranged at intervals, the two groups of collimating lenses (2) are respectively and correspondingly distributed on light paths of emitted light of the two groups of lasers (1) and are used for collimating two paths of point light sources emitted by the two groups of lasers (1) into two groups of parallel light sources, the two beam splitting prisms (3) are respectively arranged on light paths of the two groups of parallel light sources and are used for respectively dividing the two groups of parallel light sources into two light beams with 90-degree included angles and equal light intensity, the four groups of reflecting mirror groups are respectively distributed on light paths of the four light beams divided by the two groups of parallel light sources and are respectively used for reflecting and converging the four light beams to one particle position on the surface of a diamond wire to be measured, and the light receiving unit is arranged on the scattered light paths of the particles and is used for receiving scattered light.
2. The fine diamond wire surface particle number density measurement system according to claim 1, wherein: the light receiving unit comprises an imaging lens (4) and a photoelectric detector (5), wherein the imaging lens (4) is used for receiving scattered light, and the photoelectric detector (5) is used for receiving the scattered light passing through the imaging lens (4).
3. A micro diamond wire surface particle number density measurement system according to claim 2, wherein: the photodetector (5) is an avalanche diode.
4. A micro diamond wire surface particle number density measurement system according to claim 2, wherein: the imaging lens (4) is a cemented lens.
5. The fine diamond wire surface particle number density measurement system according to claim 1, wherein: each of said mirror groups comprises at least one total reflection mirror (6).
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