CN117232440A - System and method for online measurement of surface roughness of ultra-precise cutting machining - Google Patents
System and method for online measurement of surface roughness of ultra-precise cutting machining Download PDFInfo
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- 230000003287 optical effect Effects 0.000 description 11
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- 239000013307 optical fiber Substances 0.000 description 9
- 230000007547 defect Effects 0.000 description 6
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- 238000007689 inspection Methods 0.000 description 1
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- 238000005457 optimization Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000000275 quality assurance Methods 0.000 description 1
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Abstract
The technical scheme belongs to the technical field of ultra-precise machining, and particularly relates to an online measurement system and method for ultra-precise machining surface roughness, wherein the online measurement system comprises a transparent cutter, a laser generating device and a scattered light detecting device; the transparent cutter is arranged on the cutter rest and used for processing the surface of a workpiece arranged on the main shaft; the laser generating device is provided with a transmitting end, the transmitting end is relatively fixed with the transparent cutter, the transmitting end is used for transmitting incident light and enabling the incident light to pass through the transparent cutter and then focus on a measuring point on the surface of a workpiece, and the measuring point is formed after the workpiece is cut by the transparent cutter; the scattered light detection device comprises a processor and a photoelectric detector connected with the processor, wherein the photoelectric detector is provided with a scattered receiving end, the scattered receiving end is used for receiving scattered light scattered by a measuring point, and the processor is used for outputting scattered light intensity P acquired by the photoelectric detector; wherein the roughness of the points is measuredK is a constant. The profile of the ultra-precise cutting machining surface is measured in real time, and the measuring efficiency of the workpiece surface is improved.
Description
Technical Field
The technical scheme relates to the technical field of ultra-precise machining, in particular to an online measurement system and method for the surface roughness of ultra-precise cutting machining.
Background
Ultra-precision machining refers to a machining method with machining precision higher than 0.1 mu m and machining surface roughness less than 10 nm. The ultra-precise cutting processing realizes the processing of the high-precision and ultra-smooth surface based on the characteristics of high hardness, good wear resistance and sharp cutting edge of the diamond cutter. The surface quality of ultra-precise cutting processing not only depends on processing equipment and experimental environment, but also needs real-time feedback and compensation by a precise measurement technology.
Surface roughness detection in conventional ultra-precision cutting is achieved through off-line detection, specifically by moving the workpiece away from the machining location during detection, and measuring and analyzing the workpiece in a standard instrument or other location.
Off-line detection requires moving the workpiece to a designated area to finish measurement, and measurement efficiency is low. .
Disclosure of Invention
In order to improve the workpiece surface measurement efficiency in ultra-precise cutting, the application provides an online measurement system and method for the ultra-precise cutting surface roughness based on laser scattering characteristics.
The technical scheme aims at realizing the following steps:
the system comprises a transparent cutter, a laser generating device and a scattered light detecting device, wherein the transparent cutter is used for generating scattered light;
the transparent cutter is arranged on the cutter rest and used for processing the surface of a workpiece arranged on the main shaft;
the laser generating device is provided with a transmitting end, the transmitting end is fixed relative to the transparent cutter, the transmitting end is used for transmitting incident light and enabling the incident light to pass through the transparent cutter and then to be focused on a measuring point on the surface of a workpiece, and the measuring point is formed after the workpiece is cut by the transparent cutter;
the scattered light detection device comprises a processor and a photoelectric detector connected with the processor, wherein the photoelectric detector is provided with a scattered receiving end, the scattered receiving end is used for receiving scattered light scattered by the measuring point, and the processor is used for outputting scattered light intensity P acquired by the photoelectric detector;
wherein the roughness of the measuring pointK is a constant.
According to the technical scheme, the transparent cutter is used as a laser transmission medium, and moves relative to the whole surface of the workpiece in the cutting process of the transparent cutter, so that scattered light signals of all measurement points are detected in real time in the whole surface machining process, scattered light information of the machined surface of the workpiece is collected, the outline of the ultra-precise cutting machining surface is measured in real time, the workpiece does not need to be removed from the main shaft and then moved to a designated area for surface detection, and the measuring efficiency of the surface of the workpiece is improved.
And the scattered light is detected, and the measurement accuracy is high. The scattered light signal has high profile fluctuation sensitivity on the ultra-precise machining surface, the change is more obvious, the method is suitable for surface measurement with high machining precision, the sensitivity of the reflected light signal to micro defects is weaker than that of the scattered light, the measuring precision is effectively improved by detecting the profile of the workpiece surface through detecting the scattered light, and smaller and tiny machining defects can be identified; meanwhile, timeliness of the measurement result is guaranteed, dynamic changes caused by environmental interference on the processing surface in the process that the workpiece moves to the measurement area are avoided, and accuracy and reliability of the measurement result are improved.
Preferably, the device further comprises a reflected light absorbing device, wherein the reflected light absorbing device is provided with a reflected light receiving end, the reflected light receiving end is relatively fixed with the transparent cutter, and the reflected light receiving end is used for receiving the reflected light reflected by the measuring point and absorbing the reflected light through the reflected light absorbing device.
Through the technical scheme, the reflected light is absorbed in time through the reflected light absorbing device, so that the interference of the reflected light on scattered light measurement is reduced, and the measurement accuracy is improved.
Preferably, the contact point of the transparent tool and the workpiece is a processing point, the measuring point is arranged close to the processing point, and the measuring point is positioned in front of the processing point relative to the rotation direction of the spindle.
Through the technical scheme, the real-time performance is further improved due to the fact that the measuring point is close to the processing point. Namely, the processing point of the workpiece is moved to the focusing point of the incident light to become a measuring point just after being cut by the transparent cutter, so that timeliness is better. In addition, when the transparent cutter machining point cuts the workpiece, the generated cuttings form shielding based on the contact between the transparent cutter and the workpiece, so that the cuttings cannot directly splash to the measured point, and the detection accuracy is better and more stable.
Preferably, a gap is left between the measuring point and the place on the transparent tool where the incident light is transmitted.
Through the technical scheme, the measuring point is not contacted with the end face of the workpiece through the gap, the workpiece is machined at the measuring point to be a fully machined position, and meanwhile, under the condition that the width of the gap is fixed, the light intensity loss is a fixed value, so that the final surface profile condition can be conveniently determined.
Preferably, the laser generating device comprises a laser source and a first confocal assembly, wherein the first confocal assembly comprises a first focusing lens, a first polarizing plate, a second focusing lens, a first diaphragm and an objective lens, which are sequentially used for allowing laser to pass through, and the laser is emitted to the transparent cutter after passing through the first confocal assembly.
Through above-mentioned technical scheme, promote the resolution through copolymerization Jiao Zujian for detect more accurately.
Preferably, the scattered light detecting device comprises a second copolymer Jiao Zujian, and the second confocal assembly comprises a third focusing lens, a second polarizing plate, a fourth focusing lens and a second diaphragm, which are sequentially used for allowing scattered light to pass through, and the scattered light passes through the second confocal assembly and then is emitted to the scattering receiving end.
Preferably, the correction assembly further comprises a deformable mirror, a wavefront sensor, a wavefront controller and a beam splitter, wherein the deformable mirror is positioned between the first polaroid and the second focusing lens and used for guiding incident light, the wavefront controller is connected with the deformable mirror, the beam splitter is positioned between the second polaroid and the fourth focusing lens and used for splitting scattered light passing through the polaroid into two beams of light, one beam of light is directed to the fourth focusing lens, the other beam of light is directed to the wavefront sensor, the wavefront sensor is connected with the wavefront controller, and received signals are transmitted to the wavefront controller to control adjustment of the deformable mirror.
Through the technical scheme, aberration caused by the environment in the measuring process can be corrected through the correction component, and the measuring accuracy is improved.
Preferably, the scattered light detecting device comprises a second copolymer Jiao Zujian, and the second confocal assembly comprises a third focusing lens, a second polarizing plate, a fourth focusing lens and a second diaphragm, which are sequentially used for allowing scattered light to pass through, and the scattered light passes through the second confocal assembly and then is emitted to the scattering receiving end.
Preferably, the focusing lens slides with respect to the transparent tool, and the relative sliding direction of the focusing lens is along the extension direction of the main axis.
The application also provides an online measurement method of the roughness of the ultra-precise cutting surface, which adopts any online measurement system of the roughness of the ultra-precise cutting surface, and comprises the following steps:
adjusting the relative position of the transparent cutter and the workpiece so that the transparent cutter contacts the workpiece to form a processing point;
the on-line measuring system of the ultra-precise cutting surface roughness is adjusted, so that incident light passes through the transparent cutter and is focused on a measuring point, and the scattered light detection device is adjusted to enable the photoelectric detector to detect scattered light;
the workpiece and the transparent cutter move relatively to form cutting, a photoelectric detector collects scattered light of a measuring point and feeds back contour information of the point;
detecting the outline of the machined surface in real time, and processing and analyzing data according to the machining track of the transparent cutter on the surface of the workpiece and the detection signal of the photoelectric detector, and obtaining roughnessAnd matching the detection signal with the processing point and the measuring point to obtain the roughness information of the processing surface.
Compared with the prior art, the technical scheme has the advantages that:
1. the real-time measurement is performed, the measurement efficiency is high, the optical measurement system is integrated into the processing device, the contour of the workpiece is measured in real time in the processing process, the measurement is not required to be performed through other measurement equipment after the processing is finished, the measurement efficiency is effectively improved, and the high timeliness is achieved;
2. in-situ measurement is convenient for secondary compensation processing, a workpiece is not required to be disassembled in the measurement process, the processing defect position is convenient to determine and carry out compensation processing, and the difficulty of secondary processing positioning is avoided;
3. the scattered light is detected, the measuring precision is high, the measuring precision is effectively improved by detecting the surface profile of the workpiece through the scattered light, and smaller and tiny machining defects can be identified; meanwhile, the dynamic change caused by environmental interference on the processing surface from processing to measuring is avoided, and the accuracy and reliability of the measuring result are improved;
4. the processing and measuring are integrated, the processing and measuring device and the process are optimized, so that the processing device has a measuring function, the measuring function can be realized without using other measuring equipment while the processing and measuring are integrated, the measuring steps are simplified, and the measuring cost is reduced;
5. the measuring range is large, the machining and the measuring are synchronously carried out, the measuring range is basically the same as the machining area, and the measuring range is not limited by factors such as a measuring device.
Drawings
FIG. 1 is a schematic view of the construction of the installation of the processing apparatus and the on-line measuring system of the present application;
FIG. 2 is a schematic diagram of an optical system for in-line inspection of ultra-precision machined surfaces in accordance with the present application;
FIG. 3 is a schematic view of the measurement point and the processing point of the present application;
FIG. 4 is a schematic view of the relative movement of the transparent tool and the workpiece according to the present application;
FIG. 5 is a schematic diagram of the real-time measurement of the surface shape of a workpiece during the surface machining process according to the application.
Reference numerals: 1. a base; 2. a first base; 3. a second seat body; 4. a third base; 5. a first rotating seat; 6. a second rotating seat; 7. a main shaft; 8. a tool holder; 9. a workpiece; 10. a transparent cutter; 11. a laser generating device; 111. a laser source; 112. a first confocal assembly; 1121. a first focusing lens; 1122. a first polarizing plate; 1123. a focusing lens II; 1124. a first diaphragm; 1125. an objective lens; 12. scattered light detection means; 121. a processor; 122. a photodetector; 123. a second copolymer Jiao Zujian; 1231. a focusing lens III; 1232. a second polarizing plate; 1233. a focusing lens IV; 1234. a second diaphragm; 13. a reflected light absorbing means; 14. a correction assembly; 141. a deformable mirror; 142. a wavefront sensor; 143. a wavefront controller; 144. a beam splitter.
Detailed Description
With the development of high-tech industry and advanced manufacturing industry, the fields of aerospace, semiconductors, optoelectronics and the like are increasingly in demand for high-precision and high-quality parts. In order to improve the application performance of materials and devices, higher requirements are put on the ultra-precision machining level. The measurement is an indispensable ring in the processing process, and plays a vital role in processing precision control, processing parameter setting, quality assurance, real-time monitoring, process improvement and automation. Measurement is an important way for guaranteeing machining precision, measurement data has a guiding effect on improvement and optimization of a machining process, and problems existing in the machining process are identified and improved through analysis of measurement results, so that machining quality is improved. Meanwhile, the on-line measurement technology can provide important data for automatic processing by detecting the state of a workpiece in real time, so that an intelligent manufacturing system makes real-time decisions, and processing parameters and processes are automatically adjusted, thereby realizing efficient and high-precision production.
The accurate measurement of the surface profile of ultra-precise cutting machining is an important way for improving the machining precision of workpieces and accurately feeding back the machining state.
The traditional ultra-precision machining surface profile measuring method is to measure through a white light interferometer and a confocal microscope, wherein the white light interferometer is a measuring instrument based on interference phenomenon, and the optical path difference is measured through the interference phenomenon of white light, so that the information such as the shape of an object to be measured is obtained. The confocal microscope utilizes the confocal principle to process and analyze the reflected light, and a three-dimensional image of the sample is obtained
In the white light interferometer, continuous spectrum light emitted from a white light source is split into two beams by a beam splitter. A beam of light is used as a reference beam and directed onto the detector. The other beam reaches the workpiece surface and interferes with the reference beam. When the two rays meet at the detector, a phase difference is caused due to the presence of an optical path difference. If the phase difference between the two light beams is constant, interference fringes are generated, which are formed due to the phase superposition effect of the light beams. The change in profile of the sample surface results in a change in the optical path difference between the light passing through the sample and another light not passing through the sample. By observing the form of the interference fringes, the change of the optical path difference is reversely pushed, so that the outline of the workpiece is obtained. To obtain more profile information, the workpiece surface is typically scanned so that the change in optical path difference can be measured at different locations. Finally, reconstructing the contour of the surface of the workpiece through data processing.
During confocal microscopy, a light source emits laser light, and a very small focal point, i.e., focal plane, is formed in the sample by an optical lens system. Only the sample area at the focal plane is capable of producing a distinct reflected light signal. The reflected light signal in the sample is then collected onto a detector through an optical lens system. By scanning each region of the sample, light signals at different focal planes are acquired, thereby reconstructing a three-dimensional image of the sample.
Measurement by a conventional white light interferometer and confocal microscope suffers from several disadvantages: (1) The measurement range of the white light interferometer and the confocal microscope is limited by the size of the detector, control software, the mechanical structure of the instrument and other factors, the measurement range is usually less than 500 mu m, the measurement range is limited, the large-area processed workpiece can be characterized only by a sampling measurement method, the whole surface processing quality of the workpiece is difficult to accurately reflect, and the reliability of the measurement result is low; (2) The white light interferometer and confocal microscope measuring method belongs to offline measurement, is interfered by environmental factors, and a measured workpiece is possibly in a dynamic change state, so that an offline measuring result has no timeliness, the processing state cannot be accurately reflected, and a measuring error exists; (3) The white light interferometer and confocal microscope measuring method belongs to ex-situ measurement, the detected processing defects are usually compensated through secondary processing, the ex-situ measurement needs to clamp the workpiece again, the position of the workpiece changes after clamping, the processing defects are difficult to position, and the compensation processing difficulty is high; (4) The confocal microscope reconstructs a three-dimensional profile by detecting reflected light signals of the laser on the surface of the sample, and the reflected light has limited sensitivity to morphological changes of the ultra-precisely machined surface, resulting in limited measurement accuracy.
Aiming at the situation, the application provides an online measurement system and method for the roughness of the ultra-precise cutting surface based on the laser scattering characteristic.
The following describes the specific embodiments of the present technical solution in further detail with reference to the accompanying drawings.
Examples:
a processing device, see fig. 1, comprises a machine base 1, a first base 2, a second base 3, a third base 4, a first rotating base 5, a second rotating base 6, a main shaft 7 and a tool rest 8. The first seat body 2, the second seat body 3 and the third seat body 4 are all connected in a sliding manner by the machine base 1, the sliding direction of the first seat body 2 is along the Y-axis direction, the sliding direction of the second seat body 3 is along the Z-axis direction, and the sliding direction of the third seat body 4 is along the X-axis direction, wherein any two of the three X-axis, the Y-axis and the Z-axis are all perpendicular to each other. During actual installation, specific slip connection can be realized through guide rail guidance, and the drive of sliding can be realized connecting through corresponding screw pair, drives the screw through the motor and rotates the realization drive of sliding.
In this example, the second base 3 is mounted on the first base 2 and slides relative to the first base 2, the first rotating base 5 is mounted on the second base 3, the spindle 7 is rotatably connected to the first rotating base 5 around its own axis, the rotation axis of the spindle 7 is parallel to the X axis, and the spindle 7 is used for mounting and fixing the workpiece 9. The second rotating seat 6 is fixedly arranged on the third seat body 4, the tool rest 8 is rotationally connected with the second rotating seat 6, the rotating axis of the tool rest 8 is parallel to the Z axis, and the tool rest 8 is used for mounting a tool. The sliding of the second seat body 3 along the Z axis is matched with the rotation of the tool rest 8, so that the relative position of the workpiece 9 and the tool can be conveniently adjusted. The third seat body 4 moves along the X-axis direction to control the machining depth, and the sliding of the first seat body 2 along the Y-axis direction and the cooperative control of the rotation of the main shaft 7 realize the movement of the workpiece 9 relative to the cutter.
An ultra-precise cutting machining surface roughness on-line measuring system, see fig. 1, comprises a transparent cutter 10, a laser generating device 11, a scattered light detecting device 12 and a reflected light absorbing device 13. The transparent tool 10 is a tool having a hardness larger than that of the workpiece 9 and transparent, and a transparent diamond tool is generally used. A transparent tool 10 is fixedly mounted to the tool holder 8 for machining a surface of a workpiece 9 mounted on the spindle 7.
Referring to fig. 1 and 2, the laser generating device 11 includes a laser source 111, an emitting end, and a first confocal assembly 112, the laser source 111 employs a laser generator for generating laser light to form incident light. The first confocal assembly 112 includes a first focusing lens 1121, a first polarizing plate 1122, a second focusing lens 1123, a first diaphragm 1124, and an objective lens 1125, which pass incident light in order. The incident light generated by the laser source 111 may first pass through the emission end and then pass through the first confocal assembly 112, or the incident light generated by the laser source 111 may first pass through the first confocal assembly 112 and then pass through the emission end and then be emitted to the transparent cutter 10, where the resolution of the incident light is increased by the first confocal assembly. In practical use, the first confocal assembly 112 can be selectively installed according to the actual requirements. The emitting end is fixed relative to the transparent tool 10, and in most cases is fixedly mounted directly to the tool holder 8. In order to realize the relative fixation of the emitting end and the transparent cutter 10, the laser generating device 11 may be directly fixed to the cutter holder 8, alternatively, the laser source 111 may be installed near the processing device, the incident light may be guided by an optical fiber, and the end of the optical fiber, which is far away from the laser source 111, is the emitting end, so as to ensure that the end of the optical fiber, which is far away from the laser source 111, is relatively fixed to the transparent cutter 10.
Referring to fig. 3 and 4, the incident light generated by the laser source 111 passes through the first confocal assembly 112 and the emission end, then passes through the transparent cutter 10, and then is focused on a measurement point on the surface of the workpiece 9, where the measurement point is formed after the workpiece 9 is cut by the transparent cutter 10. The contact point of the transparent cutter 10 and the workpiece 9 is a machining point, the measuring point is located in front of the machining point with respect to the rotation direction of the spindle 7, and the measuring point is located near the machining point.
The processing point of the workpiece 9 is moved to the focusing point of the incident light to become a measuring point just after being cut by the transparent cutter 10, and timeliness is better. In addition, when the transparent cutter 10 machining point cuts the workpiece 9, the generated cuttings form shielding based on the contact between the transparent cutter 10 and the workpiece 9, so that the cuttings cannot splash to the measured point directly, and the measuring precision is better.
Referring to fig. 2 and 4, when the incident light is focused on the measurement point, scattered light is formed, and the scattered light detecting means 12 is for detecting the intensity of the scattered light. The scattered light detecting means 12 comprises a processor 121, a photodetector 122 connected to the processor 121 and a second copolymer Jiao Zujian, the processor 121 typically being a computer. The photodetector 122 has a scattering receiving end, the axis of the scattering receiving end is perpendicular to the measured surface of the workpiece 9, the scattering receiving end is used for receiving scattered light scattered by the measuring point, and after the photodetector 122 transmits a signal to the processor 121, the processor 121 outputs the scattered light intensity P obtained by the photodetector 122. Roughness of measuring pointsK is a constant.
Wherein the scattering receiving end is fixed relative to the transparent cutter 10, and the photoelectric detector 122 can be directly fixed on the cutter frame 8; alternatively, the photodetector 122 may be installed near the processing device, and the scattered light is guided by an optical fiber, where the end of the optical fiber, which is far away from the photodetector 122, is the scattering receiving end, so that the end of the optical fiber, which is far away from the photodetector 122, is ensured to be relatively fixed with the transparent cutter 10.
The second copolymer Jiao Zujian 123 is located between the workpiece 9 and the photodetector 122, and the second confocal assembly 123 includes a third focusing lens 1231, a second polarizing plate 1232, a fourth focusing lens 1233, and a second aperture 1234, which sequentially pass scattered light, which is directed to the scattering receiving end through the second copolymer Jiao Zujian 123. The second copolymer Jiao Zujian 123 is used to enhance the resolution of scattered light entering the scattering receiving end. The third focusing lens 1231 slides relative to the transparent cutter 10, and the relative sliding direction of the focusing lens is along the direction perpendicular to the measured end face of the workpiece 9, so that scattered light can be conveniently obtained through the position adjustment of the third focusing lens 1231.
When the incident light is focused on the measuring point, reflected light is formed in addition to scattered light, and the reflected light absorbing means 13 is used to absorb the reflected light. The reflected light absorbing device 13 is a light trap, and the reflected light absorbing device 13 has a reflected light receiving end, which is relatively fixed to the transparent cutter 10, and is configured to receive the reflected light reflected by the measurement point and absorb the reflected light by the light trap.
In order to realize the relative fixation of the reflected light receiving end and the transparent cutter 10, the reflected light absorbing device 13 can be directly fixedly arranged on the cutter frame 8; alternatively, the light trap may be installed near the processing device, and the reflected light is guided by the optical fiber, and at this time, the end of the optical fiber, which is far away from the light trap, is the reflected light receiving end, so that the end of the optical fiber, which is far away from the light trap, is ensured to be relatively fixed with the transparent cutter 10. The light trap is the prior art, and the light is completely absorbed by utilizing the interference and reflection of light, and the influence of the reflected light on the detection result is reduced by timely absorbing the reflected light.
Referring to fig. 2 and 4, the on-line measuring system for the roughness of the ultra-precision machined surface further includes a correction component 14, wherein the correction component 14 includes a deformable mirror 141, a wavefront sensor 142, a wavefront controller 143, and a beam splitter 144, the deformable mirror 141 is located between the first polarizer 1122 and the second focusing lens 1123 for guiding incident light, the wavefront controller 143 is connected to the deformable mirror 141, and the beam splitter 144 is located between the second polarizer 1232 and the fourth focusing lens 1233 for splitting scattered light passing through the second polarizer 1232 into two beams, one beam is directed to the fourth focusing lens 1233, the other beam is directed to the wavefront sensor 142, the wavefront sensor 142 is connected to the wavefront controller 143, and the received signal is transmitted to the wavefront controller 143 for controlling the adjustment of the deformable mirror 141.
Ideally, the incident light should be focused on the processing point, the measuring point coincides with the processing point, and the measuring data is the contour information of the real-time processing point. In practical situations, the processing point is in a processing state, and before the processing is not finished, the contour of the workpiece 9 is inconsistent with the information fed back by scattered light, so that the measuring point is slightly below the processing point and is continuously close to the processing point, but is not overlapped with the processing point, and the first time after the processing of the processing point is finished is converted into the measuring point as long as the processing point is not interfered with the measuring point.
In practice, a gap exists between the light-transmitting part of the transparent cutter 10 and the measuring point; the air in the transparent cutter 10 and the gap is a light propagation medium, the incident light focused by the objective lens 1125 sequentially passes through the air in the diamond and the gap and is focused on a measuring point, and the light intensity is lost in the process; under the condition that the width of the gap of the diamond cutter is fixed, the light intensity loss is a fixed value; the profile of the workpiece 9 is detected by scattered light, the relative height of the profile is obtained according to the relative change of the intensity of the scattered light, and in the measuring process, only the change of the surface roughness of the workpiece 9 can influence the intensity and the roughness of the scattered light
In measurement, the layout of an optical system, the angle of incident light and the relative position of an optical device can influence the K value; when the above factors change, the calibration needs to be performed again through the standard roughness block. The influence factor K is determined by adopting a roughness sample block of a measurement standard and measuring the roughness sample block with a standard instrument (such as a white light interferometer); the air in the gap can generate light intensity loss, and is a fixed value under the condition of determining the light path system, the cutter and the initial gap width, and the light intensity loss can be determined by a calibration method, and the light intensity loss is contained in the influence factor K and does not interfere with the roughness measurement of the workpiece 9.
The application also provides an online measurement method of the surface roughness of the ultra-precise cutting machining, which adopts the online measurement system of the surface roughness of the ultra-precise cutting machining and comprises the following steps:
s1, adjusting the relative positions of the transparent cutter 10 and the workpiece 9, and adjusting the relative positions of the transparent cutter 10 and the workpiece 9 by matching the rotation of the cutter rest 8 through X-axis movement and Z-axis movement, so that one point of the transparent cutter 10 is contacted with the workpiece 9 to form a processing point, and the initial position of the processing point is positioned at the rotation center of the workpiece 9 rotating around the axis of the spindle 7.
S2, adjusting an on-line measuring system of the ultra-precise cutting surface roughness to enable incident light to pass through the transparent cutter 10 and then focus on a measuring point, and adjusting the scattered light detection device 12 to enable the photoelectric detector 122 to detect scattered light without being interfered by reflected light. The incident light is generally a coherent light source emitted by a helium-neon laser, red visible light has the wavelength of 632.8nm, the power of 21mW, the collimation of the incident light beam and the spot diameter of 0.7mm. The angle between the incident light and the normal direction of the workpiece is generally 45 degrees.
S3, the workpiece 9 and the transparent cutter 10 move relatively to form cutting, the workpiece 9 moves relatively to the cutter through the cooperative control of the Y-axis linear motion and the rotary motion axis of the main shaft 7, and the processing track of the cutter on the workpiece 9 is shown in fig. 5 (a) and covers the whole surface of the workpiece 9.
And detecting scattered light signals. The transparent cutter 10 cuts the workpiece 9 at a single point, and the photodetector 122 collects scattered light from the processing point and feeds back profile information of the point. As the tool moves relative to the whole surface of the workpiece 9, the photoelectric detector 122 detects scattered light signals of the whole surface after processing in real time, and as shown in fig. 5 (b), the photoelectric detector 122 collects scattered light of a measuring point and feeds back profile information of the point;
and detecting the outline of the machined surface in real time. Detection of signals by the photodetector 122 based on the processing track of the transparent tool 10 on the surface of the workpiece 9Roughness after data processing and analysis
Such as:
| material | Ra(nm) | P(nw) | K |
| Copper (Cu) | 10 | 750 | 0.36 |
| Silicon (Si) | 15 | 1200 | 0.43 |
The detection signal is matched with the processing point to obtain the roughness information of the processing surface, as shown in fig. 5 (c), the measurement process and the processing process are synchronously carried out, the measurement range is consistent with the processing range, and the roughness information of the whole surface profile can be obtained after the processing is finished.
The foregoing shows and describes the basic principles and main features of the present technical solution and the advantages of the present technical solution. It will be appreciated by persons skilled in the art that the present application is not limited to the embodiments described above, and that the embodiments and descriptions described herein are merely illustrative of the principles of the application, and that various changes and modifications may be made therein without departing from the spirit and scope of the application, which is defined by the appended claims. The scope of protection of the technical solution is defined by the appended claims and equivalents thereof.
Claims (10)
1. An ultra-precise cutting machining surface roughness on-line measuring system is applied to machining equipment, the machining equipment comprises a main shaft (7) for installing a workpiece (9) and a tool rest (8) for installing a tool, the tool rest (8) can slide relative to the main shaft (7), and the relative sliding direction of the tool rest (8) and the main shaft (7) is along the direction perpendicular to the rotation axis of the main shaft (7), and the system is characterized by comprising a transparent tool (10), a laser generating device (11) and a scattered light detecting device (12);
the transparent cutter (10) is arranged on the cutter rest (8) and is used for processing the surface of a workpiece (9) arranged on the main shaft (7);
the laser generating device (11) is provided with a transmitting end, the transmitting end is fixed relative to the transparent cutter (10), the transmitting end is used for transmitting incident light and enabling the incident light to pass through the transparent cutter (10) and then to be focused on a measuring point on the surface of the workpiece (9), and the measuring point is formed after the workpiece (9) is cut by the transparent cutter (10);
the scattered light detection device (12) comprises a processor (121) and a photoelectric detector (122) connected with the processor (121), wherein the photoelectric detector (122) is provided with a scattered receiving end, the scattered receiving end is used for receiving scattered light scattered by the measuring point, and the processor (121) is used for outputting scattered light intensity P acquired by the photoelectric detector (122);
wherein the roughness R of the measuring point a =kvp, K is a constant.
2. The ultra-precise machined surface roughness on-line measurement system of claim 1, wherein: the measuring device also comprises a reflected light absorbing device (13), wherein the reflected light absorbing device (13) is provided with a reflected light receiving end, the reflected light receiving end is relatively fixed with the transparent cutter (10), and the reflected light receiving end is used for receiving the reflected light reflected by the measuring point and absorbing the reflected light through the reflected light absorbing device (13).
3. The ultra-precise machined surface roughness on-line measurement system of claim 1, wherein: the contact point of the transparent cutter (10) and the workpiece (9) is a processing point, the measuring point is arranged close to the processing point, and the measuring point is positioned in front of the processing point relative to the rotating direction of the spindle (7).
4. The ultra-precise machined surface roughness on-line measurement system of claim 1, wherein: a gap is reserved between the measuring point and the transmission position of incident light on the transparent cutter (10).
5. The ultra-precise machined surface roughness on-line measurement system of claim 1, wherein: the laser generating device (11) comprises a laser source (111) and a first confocal assembly (112), wherein the first confocal assembly (112) comprises a first focusing lens (1121), a first polarizing plate (1122), a second focusing lens (1123), a first diaphragm (1124) and an objective lens (1125) which are sequentially used for allowing incident light to pass through, and the incident light passes through the first confocal assembly (112) and then is emitted to the transparent cutter (10).
6. The ultra-precise machined surface roughness on-line measurement system of claim 5, wherein: the scattered light detection device (12) comprises a second copolymer Jiao Zujian (123), the second copolymer Jiao Zujian (123) comprises a third focusing lens (1231), a second polarizing plate (1232), a fourth focusing lens (1233) and a second diaphragm (1234) which sequentially allow scattered light to pass through, and the scattered light passes through the second copolymer Jiao Zujian (123) and then is emitted to the scattered receiving end.
7. The ultra-precise machined surface roughness on-line measurement system of claim 6, wherein: the device comprises a first polarizer (1122) and a second focusing lens (1123), and is characterized by further comprising a correction component (14), wherein the correction component (14) comprises a deformable mirror (141), a wavefront sensor (142), a wavefront controller (143) and a beam splitter (144), the deformable mirror (141) is positioned between the first polarizer (1122) and the second focusing lens (1123) and is used for guiding incident light, the wavefront controller (143) is connected with the deformable mirror (141), the beam splitter (144) is positioned between the second polarizer (1232) and the fourth focusing lens (1233) and is used for dividing scattered light passing through the polarizer into two beams of light, one beam of light is emitted to the fourth focusing lens (1233), the other beam of light is emitted to the wavefront sensor (142), and the wavefront sensor (142) is connected with the second focusing lens (1123) and transmits received signals to the second focusing lens (143) to control the adjustment of the deformable mirror (141).
8. The ultra-precise machined surface roughness on-line measurement system of claim 1, wherein: the scattered light detection device (12) comprises a second copolymer Jiao Zujian (123), the second copolymer Jiao Zujian (123) comprises a third focusing lens (1231), a second polarizing plate (1232), a fourth focusing lens (1233) and a second diaphragm (1234) which sequentially allow scattered light to pass through, and the scattered light passes through the second copolymer Jiao Zujian (123) and then is emitted to the scattered receiving end.
9. The ultra-precise machined surface roughness on-line measurement system of claim 8, wherein: the focusing lens III (1231) slides relative to the transparent cutter (10), and the relative sliding direction of the focusing lens is along the extending direction of the main shaft (7).
10. An on-line measuring method for the roughness of ultra-precise cutting surface is characterized in that: an online measurement system for the roughness of the surface of ultra-precise cutting machining, which adopts any one of claims 1 to 9, and comprises the following steps:
adjusting the relative position of the transparent cutter (10) and the workpiece (9) so that the transparent cutter (10) contacts the workpiece (9) to form a processing point;
adjusting an on-line measuring system of the ultra-precise cutting surface roughness to enable incident light to pass through the transparent cutter (10) and then focus on a measuring point, and adjusting a scattered light detection device (12) to enable a photoelectric detector (122) to detect scattered light;
the workpiece (9) and the transparent cutter (10) move relatively to form cutting, and the photoelectric detector (122) collects scattered light of a measuring point and feeds back contour information of the measuring point;
detecting the outline of the machined surface in real time, processing the track on the surface of the workpiece (9) according to the transparent cutter (10) and detecting signals of the photoelectric detector (122), and processing and analyzing data to obtain the roughness R a =kvp, and the detection signal is matched with the machining point and the measurement point to obtain machined surface roughness information.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117739875A (en) * | 2024-02-19 | 2024-03-22 | 湖南沃尔博精密工具有限公司 | Photoelectric effect-based cutter coating uniformity detection system and method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117739875A (en) * | 2024-02-19 | 2024-03-22 | 湖南沃尔博精密工具有限公司 | Photoelectric effect-based cutter coating uniformity detection system and method |
| CN117739875B (en) * | 2024-02-19 | 2024-04-23 | 湖南沃尔博精密工具有限公司 | Photoelectric effect-based cutter coating uniformity detection system and method |
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