CN116936420A - Physical vapor deposition device for producing display panel type semiconductors - Google Patents
Physical vapor deposition device for producing display panel type semiconductors Download PDFInfo
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- CN116936420A CN116936420A CN202311175844.5A CN202311175844A CN116936420A CN 116936420 A CN116936420 A CN 116936420A CN 202311175844 A CN202311175844 A CN 202311175844A CN 116936420 A CN116936420 A CN 116936420A
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- vapor deposition
- physical vapor
- deposition device
- display panel
- panel type
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- 238000005240 physical vapour deposition Methods 0.000 title claims abstract description 59
- 239000004065 semiconductor Substances 0.000 title claims abstract description 53
- 238000004140 cleaning Methods 0.000 claims abstract description 66
- 239000010453 quartz Substances 0.000 claims abstract description 29
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000007788 liquid Substances 0.000 claims description 26
- 210000001503 joint Anatomy 0.000 claims description 19
- 238000001035 drying Methods 0.000 claims description 13
- 238000004891 communication Methods 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 10
- 230000007246 mechanism Effects 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000001883 metal evaporation Methods 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 4
- 230000001737 promoting effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 20
- 230000008569 process Effects 0.000 abstract description 19
- 238000007599 discharging Methods 0.000 abstract description 2
- 238000005406 washing Methods 0.000 description 11
- 230000009471 action Effects 0.000 description 4
- 230000002146 bilateral effect Effects 0.000 description 3
- 239000002775 capsule Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/045—Cleaning involving contact with liquid using perforated containers, e.g. baskets, or racks immersed and agitated in a liquid bath
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention provides a physical vapor deposition device for producing a display panel type semiconductor, which comprises a cleaning tank, wherein the top of the cleaning tank is fixedly connected with a top plate, the bottom of the top plate is provided with a rotating disc capable of rotating positively and negatively through a driving shaft, the circumference of the rotating disc is provided with a plurality of mounting openings, each three mounting openings are in a group, the three mounting openings in a group are respectively and elastically provided with a cleaning seat capable of moving up and down, a physical vapor deposition device base and a charging net disc, the inner bottom of the cleaning tank is fixedly provided with a plurality of first cylinders which are vertically arranged, each group of mounting openings corresponds to one first cylinder, and the telescopic end of each first cylinder is fixedly connected with a pushing plate for pushing the cleaning seat, the physical vapor deposition device base and semiconductor chips in the charging net disc to move up. The device can realize the cleaning process of the semiconductor chip before physical vapor deposition, can realize the automatic feeding and discharging process, and can also realize the automatic cleaning process of a plurality of quartz covers.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a physical vapor deposition device for producing display panel semiconductors.
Background
The semiconductor display panel industry has higher technical barriers, is complex in process, multiple in key technical points of production procedures and flow, high in difficulty, and is a high-tech industry with multiple subjects and strong technical guidance, so that the semiconductor display panel industry has a longer industrial chain, comprises a plurality of sub-industries such as raw materials, semiconductor equipment and optoelectronic devices, and has the characteristics of wide radiation range, strong upstream and downstream industry portability and the like. Specifically, the upstream of the semiconductor display panel industry is mainly the equipment manufacturing, raw material and component industries; the midstream is mainly used for producing and manufacturing a semiconductor display panel, a matched electronic device and a module; the downstream comprises various display terminal applications such as televisions, displays, notebook computers, tablet computers, mobile phones and the like.
The semiconductor chip is an indispensable element in the display panel, physical vapor deposition is needed to be carried out on the semiconductor chip in the production process of the semiconductor chip at present, but the conventional physical vapor deposition device cannot carry out a pre-cleaning process on the semiconductor chip, the condition that residues on the surface of the semiconductor chip influence the quality of the coating due to the processing of the precursor chip easily occurs, and a quartz cover of the physical vapor deposition device needs to be detached to clean the inside after being used for a period of time, so that the conventional physical vapor deposition device is inconvenient.
Disclosure of Invention
In view of the above problems, the present invention provides a physical vapor deposition device for producing a display panel semiconductor, which can realize a cleaning process of a semiconductor chip before physical vapor deposition, an automatic loading and unloading process, and an automatic cleaning process of a plurality of quartz covers.
In order to solve the problems, the invention adopts the following technical scheme:
the utility model provides a physical vapor deposition device is used in production of display panel class semiconductor, includes the washing pond, but the top fixedly connected with roof of washing pond, but positive and negative pivoted carousel is installed through the drive shaft to the bottom of roof, be equipped with a plurality of installing ports in the circumference of carousel, every three installing port is a set of, and a set of three respectively elastic mounting in the installing port has washing seat, physical vapor deposition device base and the net dish of loading that can reciprocate, the first cylinder of many vertical settings is installed to the inner bottom of washing pond, and every group's installing port corresponds a first cylinder, the flexible end fixedly connected with of first cylinder is used for promoting washing seat, physical vapor deposition device base and the push pedal that the semiconductor chip moved up in the net dish of loading, the middle part of net dish of loading is equipped with the ejecting mouth that supplies the push pedal to pass, but the negative pressure suction mechanism of the semiconductor chip is installed at the interior top of quartz cover corresponding with every group's installing port, set of cover and the second cylinder that the cover and the net of quartz cover set of quartz cover and the top plate are equipped with and the first cylinder of installing port and the net that the second cylinder is connected with in the fixed plate of loading plate that the cylinder corresponds.
Preferably, the top of the physical vapor deposition device base is provided with a metal evaporation device and a vacuumizing tube, the lower end of the vacuumizing tube extends out of the side wall of the physical vapor deposition device base, and the side wall of the physical vapor deposition device base is sleeved with a sealing ring.
Preferably, the two side inner walls of the mounting openings for placing the physical vapor deposition device base and the cleaning seat are respectively provided with a sliding groove, a sliding plate is slidably arranged in each sliding groove, the side walls of the sliding plates extend out of the sliding grooves and are fixedly connected with the corresponding sides of the physical vapor deposition device base and the cleaning seat, and a first spring is elastically connected between the top of each sliding plate and the top of each sliding groove.
Preferably, the slide ways are fixedly connected to the inner walls of the two sides of the mounting opening for placing the charging net tray, extend into the cleaning tank, are elastically connected with sliding blocks through second springs, and the side walls of the sliding blocks are fixedly connected with the corresponding sides of the charging net tray.
Preferably, the negative pressure suction mechanism comprises a connecting pipe rotationally connected to the top of the quartz cover, a suction disc is fixed to the lower end of the connecting pipe, a plurality of negative pressure pipes connected with the connecting pipe are embedded in the inner top of the suction disc, a plurality of negative pressure holes are formed in the bottom of the negative pressure pipes, and an exhaust pipe is abutted to the upper end of the connecting pipe through a rotary joint.
Preferably, the top of cleaning seat rotates and is connected with the commentaries on classics pipe, a plurality of brush rows are installed to the lateral wall of commentaries on classics pipe, and the lateral wall of commentaries on classics pipe still is equipped with a plurality of liquid holes, the lateral wall of cleaning seat is connected with the pipette that extends to in it, the extension end of pipette passes through rotary joint with the lower extreme of commentaries on classics pipe and dock, install the water pump of being connected with the pipette on the washing pond.
Preferably, the rotary mechanism comprises a driving component and a butt joint component, wherein the driving component can drive the plurality of connecting pipes to rotate at the same time, and the butt joint component can realize limit butt joint of the rotary pipe and the suction disc.
Preferably, the driving assembly comprises a mounting plate fixedly mounted above the top plate, a motor is mounted at the bottom of the mounting plate, a large gear is fixed at the output end of the motor, a double-sided gear ring meshed with the large gear is rotatably connected at the bottom of the mounting plate, and a pinion meshed with the double-sided gear ring is fixedly connected on the connecting pipe.
Preferably, the butt joint subassembly is including setting up the butt joint groove in the interior top center department of suction disc, the both sides inner wall of butt joint groove all is equipped with the spacing groove, the top of changeing the pipe is equipped with the round chamber, the round intracavity is through third spring elastic connection has a pair of right angle type limiting plate, a pair of right angle type limiting plate extends respectively and changes the corresponding side of pipe, right angle type limiting plate and spacing groove adaptation.
Preferably, a plurality of drying pipes are further installed on the circumferential inner wall of the cleaning tank, and the drying pipes are in one-to-one correspondence with the plurality of charging net trays.
The beneficial effects of the invention are as follows:
1. through installation carousel and a plurality of quartz cover, set up multiunit installing port on the carousel, set up cleaning seat, physical vapor deposition device base and loading net dish respectively in every three installing port, only need place a plurality of semiconductor chips respectively in a plurality of loading net dish, can drive the carousel through the drive shaft and rotate forward and backward in a certain limit, rotate the position of corresponding intercommunication mouth with required installing port, can go on unloading, physical vapor deposition and quartz cover inside cleaning process respectively, can carry out the physical vapor deposition process of a plurality of semiconductor chips simultaneously.
2. Through installing cleaning tank, loading net dish, second cylinder and drying tube, place the semiconductor chip in loading net dish, start the second cylinder and drive the butt plate and move down, can cover loading net dish and to the cleaning tank in, the cleaning tank is equipped with the washing liquid, and the semiconductor chip submerges in the washing liquid and carries out the cleaning process, and loading net dish moves up after the washing, through the stoving of drying tube can get into waiting the coating film stage.
3. Through installing first cylinder and push pedal, after the installation mouth of required step changes to corresponding push pedal position, only need start first cylinder and drive the push pedal and shift up, can promote the washing seat or physical vapor deposition device base and shift up, also can pass the top export, with the semiconductor chip top in the net dish of loading to the quartz cover in, accomplish automatic feeding process through negative pressure suction mechanism, physical vapor deposition device base shifts up the butt joint intercommunication mouth, through the sealing washer is sealed, accomplish sealing process, can heat metal and evacuation process this moment.
4. Through installing commentaries on classics pipe, a plurality of brush row and rotary mechanism, when needs are washd a plurality of quartz hoods inside, only need with wasing the seat top to the intercommunication mouth in, commentaries on classics pipe and brush row get into quartz hoods inside, commentaries on classics pipe top and the spacing butt joint of suction disc this moment, start the water pump, pump into the washing liquid to changeing intraductal through the pipette, the rethread is a plurality of liquid outlet hole spouts to quartz hoods on the inner wall, start the motor simultaneously and drive the gear wheel rotation, drive bilateral ring gear rotation again, and then drive a plurality of connecting pipes through a plurality of pinion and rotate, the connecting pipe drives suction disc and commentaries on classics pipe rotation, realize the scrubbing process to the inner wall, the cleaning performance is good.
Drawings
FIG. 1 is a top view of a turntable according to the present invention;
FIG. 2 is a top plan view of a top plate according to the present invention;
FIG. 3 is a bottom view of a mounting plate according to the present invention;
FIG. 4 is a bottom plan view of the top plate according to the present invention;
FIG. 5 is a top view of a cleaning tank according to the present invention;
FIG. 6 is an enlarged schematic view of the structure at A in FIG. 1;
FIG. 7 is an enlarged schematic view of the structure at B in FIG. 1;
FIG. 8 is a cross-sectional view of a quartz cover in accordance with the present invention;
FIG. 9 is a cross-sectional view of a rotor tube according to the present invention;
fig. 10 is a front view of a base of a physical vapor deposition apparatus according to the present invention.
In the figure: 1 cleaning pool, 2 turntables, 3 driving shafts, 4 mounting ports, 5 physical vapor deposition device bases, 6 loading net trays, 7 top outlets, 8 metal evaporation devices, 9 rotary pipes, 10 cleaning seats, 11 vacuumizing pipes, 12 water pumps, 13 drying pipes, 14 sealing rings, 15 sliding plates, 16 first springs, 17 sliding grooves, 18 sliding ways, 19 sliding blocks, 20 second springs, 21 quartz covers, 22 air extraction pipes, 23 second cylinders, 24 bilateral gear rings, 25 large gears, 26 communication ports, 27 small gears, 28 connecting pipes, 29 sucking discs, 30 butt joint grooves, 31 negative pressure pipes, 32 top plates, 33 butt joint plates, 34 brush rows, 35 right-angle limiting plates, 36 third springs, 37 liquid suction pipes, 38 first cylinders, 39 push plates and 40 mounting plates.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit or scope of the invention, which is therefore not limited to the specific embodiments disclosed below.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Referring to fig. 1-10, a physical vapor deposition device for producing a display panel type semiconductor comprises a cleaning tank 1, wherein a top plate 32 is fixedly connected to the top of the cleaning tank 1, a rotatable turntable 2 capable of rotating positively and negatively is installed at the bottom of the top plate 32 through a driving shaft 3, a plurality of mounting openings 4 are circumferentially arranged on the turntable 2, each three mounting openings 4 are a group, a cleaning seat 10 capable of moving up and down, a physical vapor deposition device base 5 and a loading net disk 6 are elastically installed in each of the three mounting openings 4 of the group, a plurality of first cylinders 38 which are vertically arranged are fixedly installed at the inner bottom of the cleaning tank 1, each group of mounting openings 4 corresponds to one first cylinder 38, a push plate 39 for pushing the cleaning seat 10, the physical vapor deposition device base 5 and semiconductor chips in the loading net disk 6 are fixedly connected to the telescopic end of the first cylinders 38, an ejection opening 7 through which the push plate 39 passes is arranged in the middle of the loading net disk 6, the turntable 2 can be driven to rotate positively and negatively in a certain range through the driving shaft 3, the required mounting opening 4 is rotated to a position corresponding to a communication opening 26, and the physical vapor deposition process of depositing and the semiconductor chips can be carried out respectively.
Further, the metal evaporation device 8 and the vacuumizing tube 11 are installed on the top of the physical vapor deposition device base 5, the lower end of the vacuumizing tube 11 extends out of the side wall of the physical vapor deposition device base 5, the side wall of the physical vapor deposition device base 5 is sleeved with the sealing ring 14, the first air cylinder 38 is started, and the physical vapor deposition device base 5 can be pushed into the communication port 26, and sealing is achieved through the sealing ring 14.
Further, sliding grooves 17 are formed in the inner walls of two sides of two mounting openings 4 for placing the physical vapor deposition device base 5 and the cleaning seat 10, a sliding plate 15 is slidably mounted in the sliding grooves 17, the side walls of the sliding plate 15 extend out of the sliding grooves 17 and are fixedly connected with corresponding sides of the physical vapor deposition device base 5 and the cleaning seat 10, a first spring 16 is elastically connected between the top of the sliding plate 15 and the top of the sliding groove 17, a sliding rail 18 is fixedly connected to the inner walls of two sides of the mounting opening 4 for placing the charging net tray 6, the sliding rail 18 extends into the cleaning tank 1, a sliding block 19 is elastically connected to the sliding rail 18 through a second spring 20, the side walls of the sliding block 19 are fixedly connected with corresponding sides of the charging net tray 6, and the first spring 16 and the second spring 20 can realize a resetting process of the cleaning seat 10, the charging net tray 6 and the physical vapor deposition device base 5.
The top of roof 32 fixed mounting has the quartz capsule 21 of a plurality of vapor deposition devices that correspond with every group of installing port 4, but the negative pressure suction means of absorption semiconductor chip is installed at the interior top of quartz capsule 21, negative pressure suction means is including rotating the connecting pipe 28 of connecting at quartz capsule 21 top, the lower extreme of connecting pipe 28 is fixed with and absorbs dish 29, the interior top of absorbing dish 29 inlays and is equipped with many negative pressure pipes 31 that are connected with connecting pipe 28, the bottom of negative pressure pipe 31 is equipped with a plurality of negative pressure holes, the upper end of connecting pipe 28 has exhaust tube 22 through rotary joint butt joint, exhaust tube 22 is taken out, make negative pressure pipe 31 produce the negative pressure, and then adsorb semiconductor chip through a plurality of negative pressure holes.
The top plate 32 is provided with a communication port 26 which is communicated with the cover port of the quartz cover 21 and matched with the mounting port 4, the top plate 32 is fixedly provided with a second cylinder 23 corresponding to the charging net tray 6 in each group, the telescopic end of the second cylinder 23 penetrates through the top plate 32 and is fixedly provided with a retaining plate 33 which is matched with the charging net tray 6, the second cylinder 23 is started to drive the retaining plate 33 to move downwards, the retaining plate 33 is driven to move downwards into the cleaning tank 1 after covering the charging net tray 6, the cleaning tank 1 is filled with cleaning liquid, and the semiconductor chip is immersed in the cleaning liquid to complete the cleaning process.
Further, the top of the cleaning seat 10 is rotatably connected with a rotary pipe 9, a plurality of brush rows 34 are arranged on the side wall of the rotary pipe 9, a plurality of liquid outlet holes are further formed in the side wall of the rotary pipe 9, a liquid suction pipe 37 extending into the side wall of the cleaning seat 10 is connected with the side wall of the cleaning seat 10, the extending end of the liquid suction pipe 37 is in butt joint with the lower end of the rotary pipe 9 through a rotary joint, a water pump 12 connected with the liquid suction pipe 37 is arranged on the cleaning tank 1, the water pump 12 is started, cleaning liquid is pumped into the rotary pipe 9 through the liquid suction pipe 37, and the cleaning liquid is sprayed onto the inner wall of the quartz cover 21 through the liquid outlet holes.
The rotary mechanism comprises a driving assembly and a butting assembly, the driving assembly can drive the connecting pipes 28 to rotate simultaneously, the butting assembly can realize limit butting of the rotary pipe 9 and the suction disc 29, the driving assembly comprises a mounting plate 40 fixedly mounted above the top plate 32, a motor is mounted at the bottom of the mounting plate 40, a large gear 25 is fixed at the output end of the motor, a double-sided gear 24 meshed with the large gear 25 is rotationally connected at the bottom of the mounting plate 40, a small gear 27 meshed with the double-sided gear 24 is fixedly connected on the connecting pipes 28, the butting assembly comprises a butting groove 30 arranged at the center of the inner top of the suction disc 29, limit grooves are formed in the inner walls of the two sides of the butting groove 30, a round cavity is formed in the top end of the rotary pipe 9, a pair of right-angle limit plates 35 are elastically connected in the round cavity through a third spring 36, and the right-angle limit plates 35 extend out of the corresponding sides of the rotary pipe 9 respectively, and the right-angle limit plates 35 are matched with the limit grooves.
In addition, a plurality of drying pipes 13 are further arranged on the circumferential inner wall of the cleaning tank 1, the plurality of drying pipes 13 are in one-to-one correspondence with the plurality of charging net trays 6, the charging net trays 6 move upwards under the action of the second springs 20, and the blown hot air can be used for drying and preheating semiconductor chips through the positions of the drying pipes 13.
The semiconductor chips are placed in the plurality of loading net trays 6, at the moment, the positions of the loading net trays 6 correspond to the positions of the second air cylinders 23, the second air cylinders 23 are started to drive the retaining plates 33 to move downwards, the retaining plates 33 are driven to move downwards into the cleaning tank 1 after covering the loading net trays 6, cleaning liquid is filled in the cleaning tank 1, the semiconductor chips are immersed in the cleaning liquid to complete the cleaning process, then the second air cylinders 23 shrink, the loading net trays 6 move upwards under the action of the second springs 20, and the blown hot air can be used for drying and preheating the semiconductor chips through the positions of the drying pipes 13.
The driving shaft 3 is started to drive the rotary table 2 to rotate, the loading net disk 6 is rotated to the position corresponding to the communication port 26, the first cylinder 38 is started to drive the push plate 39 to move upwards, the semiconductor chips in the loading net disk 6 are pushed into the corresponding quartz covers 21 through the top outlet 7 until being pushed into the suction disk 29, the suction pipe 22 is used for sucking air to enable the negative pressure pipe 31 to generate negative pressure, the semiconductor chips are further adsorbed through a plurality of negative pressure holes, the push plate 39 is reset, the physical vapor deposition device base 5 is then rotated to the position corresponding to the communication port 26, the first cylinder 38 is started again, the physical vapor deposition device base 5 can be pushed into the communication port 26, sealing is achieved through the sealing ring 14, at the moment, the interior of the quartz covers 21 is vacuumized through the vacuumizing pipe 11, and then the metal evaporation device 8 heats metal, so that metal vapor is formed to carry out a coating process on the semiconductor chips above.
After the film is coated, the base 5 of the physical vapor deposition device is reset, the charging net disk 6 is rotated to the position of the communication port 26 again, the pushing plate 39 is lifted to the position close to the suction disk 29, the negative pressure is eliminated, the semiconductor chip can be released to the pushing plate 39, and the semiconductor chip returns to the charging net disk 6 along with the pushing plate 39, so that the discharging process is completed.
When a plurality of quartz covers 21 need to be cleaned in a period of time, only the cleaning seat 10 is needed to be propped into the communication port 26, the rotary tube 9 and the brush row 34 enter the quartz cover 21, the top end of the rotary tube 9 is propped into the butt joint groove 30, the pair of right-angle limiting plates 35 at the top end of the rotary tube 9 retract into the circular cavity under the action of the inclined planes and the third springs 36, the top end of the rotary tube 9 enters the butt joint groove 30 and is butted with the suction disc 29, the water pump 12 is started, cleaning liquid is pumped into the rotary tube 9 through the liquid suction tube 37, then the cleaning liquid is sprayed onto the inner wall of the quartz cover 21 through the plurality of liquid outlet holes, meanwhile, the motor is started to drive the large gear 25 to rotate, the bilateral gear ring 24 is driven to rotate, the connecting tubes 28 are driven to rotate through the plurality of small gears 27, the connecting tubes 28 drive the suction disc 29 to rotate, and then the right-angle limiting plates 35 can automatically spring into the limiting grooves at the positions corresponding to the right-angle limiting plates 35 at the moment, the right-angle limiting plates 35 can enable the rotary tube 9 and the suction disc 29 to synchronously rotate, the inner wall brushing and cleaning effect is achieved through the brush row 34, and the cleaning effect is good, and the cleaning seat 10 is reset under the action of the spring 16.
The foregoing description of the preferred embodiments of the invention is not intended to limit the invention to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the invention are intended to be included within the scope of the invention.
Claims (10)
1. The utility model provides a physical vapor deposition device for display panel type semiconductor production, includes washs pond (1), its characterized in that, the top fixedly connected with roof (32) of washs pond (1), but carousel (2) of positive and negative rotation are installed through drive shaft (3) in the bottom of roof (32), be equipped with a plurality of installing ports (4) in the circumference of carousel (2), every three installing port (4) are a set of, and a set of three respectively elastic mounting in installing port (4) can reciprocate wash seat (10), physical vapor deposition device base (5) and loading net dish (6), the inner bottom fixed mounting of washs pond (1) has many first cylinders (38) of vertical setting, and the flexible end fixedly connected with of first cylinder (38) is used for promoting washseat (10), physical vapor deposition device base (5) and loading net dish (6) semiconductor chip upward movement's push pedal (39), but loading net dish (6) are equipped with respectively in the elastic mounting in the installation that support seat (5) and loading net dish (6) is equipped with the quartz that the bottom of a plurality of installing ports (21) are equipped with in the top of the corresponding installation of roof (21) of quartz mask (21) and the loading net dish (21), the top plate (32) is provided with a communication port (26) communicated with a cover port of the quartz cover (21) and matched with the mounting port (4), the top plate (32) is fixedly provided with a second cylinder (23) corresponding to the charging net disc (6) in each group, and the telescopic end of the second cylinder (23) penetrates through the top plate (32) and is fixedly provided with a resisting plate (33) for adapting to the charging net disc (6).
2. The physical vapor deposition device for producing the display panel type semiconductor according to claim 1, wherein the top of the physical vapor deposition device base (5) is provided with a metal evaporation device (8) and a vacuumizing tube (11), the lower end of the vacuumizing tube (11) extends out of the side wall of the physical vapor deposition device base (5), and the side wall of the physical vapor deposition device base (5) is sleeved with a sealing ring (14).
3. The physical vapor deposition device for producing the display panel type semiconductor according to claim 1, wherein sliding grooves (17) are formed in inner walls of two sides of two mounting ports (4) for placing the physical vapor deposition device base (5) and the cleaning seat (10), sliding plates (15) are slidably mounted in the sliding grooves (17), side walls of the sliding plates (15) extend out of the sliding grooves (17) and are fixedly connected with corresponding sides of the physical vapor deposition device base (5) and the cleaning seat (10), and first springs (16) are elastically connected between the tops of the sliding plates (15) and the tops of the sliding grooves (17).
4. The physical vapor deposition device for producing the display panel type semiconductors according to claim 1, wherein sliding ways (18) are fixedly connected to the inner walls of two sides of the mounting opening (4) for placing the loading net tray (6), the sliding ways (18) extend into the cleaning tank (1), sliding blocks (19) are elastically connected to the sliding ways (18) through second springs (20), and the side walls of the sliding blocks (19) are fixedly connected with the corresponding sides of the loading net tray (6).
5. The physical vapor deposition device for producing the display panel type semiconductor according to claim 1, wherein the negative pressure suction mechanism comprises a connecting pipe (28) rotatably connected to the top of the quartz cover (21), a suction disc (29) is fixed to the lower end of the connecting pipe (28), a plurality of negative pressure pipes (31) connected with the connecting pipe (28) are embedded in the inner top of the suction disc (29), a plurality of negative pressure holes are formed in the bottom of the negative pressure pipes (31), and the upper ends of the connecting pipes (28) are butt-jointed with exhaust pipes (22) through rotary joints.
6. The physical vapor deposition device for producing the display panel type semiconductors according to claim 1, wherein the top of the cleaning seat (10) is rotationally connected with a rotating pipe (9), a plurality of brush rows (34) are arranged on the side wall of the rotating pipe (9), a plurality of liquid outlet holes are further formed in the side wall of the rotating pipe (9), a liquid suction pipe (37) extending into the side wall of the cleaning seat (10) is connected with the side wall of the cleaning seat, the extending end of the liquid suction pipe (37) is in butt joint with the lower end of the rotating pipe (9) through a rotary joint, and a water pump (12) connected with the liquid suction pipe (37) is arranged on the cleaning pool (1).
7. The physical vapor deposition device for producing the display panel type semiconductors according to claim 6, further comprising a rotating mechanism capable of driving the rotating tube (9) to rotate, wherein the rotating mechanism comprises a driving assembly and a butting assembly, the driving assembly can simultaneously drive the plurality of connecting tubes (28) to rotate, and the butting assembly can realize limit butting of the rotating tube (9) and the suction disc (29).
8. The physical vapor deposition device for producing a display panel type semiconductor according to claim 7, wherein the driving assembly comprises a mounting plate (40) fixedly mounted above a top plate (32), a motor is mounted at the bottom of the mounting plate (40), a large gear (25) is fixed at the output end of the motor, a double-sided gear ring (24) meshed with the large gear (25) is rotatably connected at the bottom of the mounting plate (40), and a small gear (27) meshed with the double-sided gear ring (24) is fixedly connected on the connecting pipe (28).
9. The physical vapor deposition device for producing the display panel type semiconductors according to claim 7, wherein the butt joint assembly comprises a butt joint groove (30) arranged at the center of the inner top of the suction disc (29), limit grooves are formed in the inner walls of two sides of the butt joint groove (30), a round cavity is formed in the top end of the rotary tube (9), a pair of right-angle limit plates (35) are elastically connected in the round cavity through a third spring (36), the pair of right-angle limit plates (35) extend out of the corresponding sides of the rotary tube (9) respectively, and the right-angle limit plates (35) are matched with the limit grooves.
10. The physical vapor deposition device for producing the display panel type semiconductors according to claim 1, wherein a plurality of drying pipes (13) are further installed on the circumferential inner wall of the cleaning tank (1), and the plurality of drying pipes (13) are in one-to-one correspondence with the plurality of charging net trays (6).
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| CN202311175844.5A CN116936420B (en) | 2023-09-13 | 2023-09-13 | Physical vapor deposition device for producing display panel type semiconductors |
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| CN202311175844.5A CN116936420B (en) | 2023-09-13 | 2023-09-13 | Physical vapor deposition device for producing display panel type semiconductors |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100056273A (en) * | 2008-11-19 | 2010-05-27 | 주식회사 아이피에스 | Apparatus for depositing thin film on wafer and method for cleaning the apparatus |
| CN102484040A (en) * | 2009-06-23 | 2012-05-30 | 瑞必尔 | Apparatus for fabricating semiconductor wafers and apparatus for the deposition of materials by evaporation using a molecular beam |
| CN104752275A (en) * | 2013-12-29 | 2015-07-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Processing chamber and semiconductor processing equipment |
| CN108735580A (en) * | 2018-06-05 | 2018-11-02 | 汪玉洁 | A kind of semiconductor chip production physical vapor deposition device |
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- 2023-09-13 CN CN202311175844.5A patent/CN116936420B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100056273A (en) * | 2008-11-19 | 2010-05-27 | 주식회사 아이피에스 | Apparatus for depositing thin film on wafer and method for cleaning the apparatus |
| CN102484040A (en) * | 2009-06-23 | 2012-05-30 | 瑞必尔 | Apparatus for fabricating semiconductor wafers and apparatus for the deposition of materials by evaporation using a molecular beam |
| CN104752275A (en) * | 2013-12-29 | 2015-07-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Processing chamber and semiconductor processing equipment |
| CN108735580A (en) * | 2018-06-05 | 2018-11-02 | 汪玉洁 | A kind of semiconductor chip production physical vapor deposition device |
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| CN116936420B (en) | 2023-11-21 |
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