CN116936418A - Needle cap lifting type chip demolding mechanism, die bonding equipment and chip demolding method - Google Patents
Needle cap lifting type chip demolding mechanism, die bonding equipment and chip demolding method Download PDFInfo
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- CN116936418A CN116936418A CN202311072961.9A CN202311072961A CN116936418A CN 116936418 A CN116936418 A CN 116936418A CN 202311072961 A CN202311072961 A CN 202311072961A CN 116936418 A CN116936418 A CN 116936418A
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- 230000007246 mechanism Effects 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims abstract description 24
- 230000005540 biological transmission Effects 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 abstract description 11
- 239000013078 crystal Substances 0.000 description 5
- 230000033001 locomotion Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 201000004356 excessive tearing Diseases 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of die bonding equipment, and particularly discloses a pin cap lifting type chip demoulding mechanism, die bonding equipment and a chip demoulding method, wherein a pin cap provided with a plurality of air suction holes, a pin body arranged in the pin cap and a power module for driving the pin cap to move up and down relative to the pin body; the top surface of the thimble cap is provided with a floating state which is driven by the power module to move upwards to be higher than the top end of the thimble body, and a sinking state which is driven by the power module to move downwards to be lower than the top end of the thimble body. The pin cap lifting type chip demoulding mechanism, the die bonding equipment and the chip demoulding method can effectively solve the problem that the existing chip demoulding mechanism is easy to damage a chip body in the process of taking out the chip.
Description
Technical Field
The invention relates to the technical field of die bonding equipment, in particular to a pin cap lifting type chip demoulding mechanism, die bonding equipment and a chip demoulding method.
Background
Referring to fig. 1, when the wafer 100 is fed, the wafer includes a carrier film 100a and a plurality of chip bodies 100b adhered to the carrier film 100a, and before the die bonding operation, the chip bodies 100b need to be lifted up one by using a die release mechanism, so that the chip bodies 100b are separated from the carrier film 100a. The existing chip demoulding mechanism comprises a thimble cap 1 for placing a wafer 100, a thimble body 2 arranged in the thimble cap 1 in a sliding manner, and a power module 3 for driving the thimble body 2 to move up and down.
When the crystal taking operation is carried out, the steps are as follows:
(1) firstly, placing a wafer 100 above an ejector pin cap 1;
(2) then, the mechanical arm 300 drives the suction nozzle 200 to move to a position right above the thimble body 2 and at a small distance from the chip body 100 b;
(3) the power module 3 drives the thimble body 2 to move upwards, so that the upper end of the thimble body 2 pierces the bearing film 100a upwards, and the chip body 100b right above the thimble body 2 is jacked upwards to be sucked by the suction nozzle 200, thereby completing the crystal picking operation.
The problem with the existing chip demoulding mechanism is that in the process of picking up the chip, the ejector pin body 2 needs to actively move, so that the chip body 100b is lifted up, if the lifting force of the ejector pin body 2 is too small, the carrier film 100a cannot be penetrated, and the ejector pin body 2 cannot be lifted up, if the lifting force of the ejector pin body 2 is too large, although the carrier film 100a can be penetrated, the bottom of the chip body 100b is easy to leave an impression of the ejector pin body 2 or cause the chip body 100b to shift, and the chip body 100b is damaged. Further, when the ejector pin body 2 ejects the chip body 100b upward to be sucked by the suction nozzle 200, the top surface of the chip body 100b is easily damaged due to excessive impact.
Therefore, an improvement on the existing chip demolding mechanism is needed to solve the problem that the chip body is easily damaged in the process of taking the crystal.
The above information disclosed in this background section is only included to enhance understanding of the background of the disclosure and therefore may contain information that does not form the prior art that is presently known to those of ordinary skill in the art.
Disclosure of Invention
The invention aims to provide a needle cap lifting type chip demoulding mechanism, die bonding equipment and a chip demoulding method, which can effectively solve the problem that the existing chip demoulding mechanism is easy to damage a chip body in the process of taking out a chip.
In order to achieve the above purpose, in one aspect, the invention provides a needle cap lifting type chip demoulding mechanism, which comprises a needle cap provided with a plurality of air suction holes, a needle body arranged in the needle cap, and a power module for driving the needle cap to move up and down relative to the needle body;
the top surface of the thimble cap is provided with a floating state which is driven by the power module to move upwards to be higher than the top end of the thimble body, and a sinking state which is driven by the power module to move downwards to be lower than the top end of the thimble body.
Optionally, an accommodating cavity for accommodating the thimble body is arranged in the thimble cap;
and a pin passing hole for the top end of the thimble body to pass through is arranged in the middle of the top of the accommodating cavity.
Optionally, the power module includes:
a drive mechanism base;
the needle cap base is arranged on the driving mechanism base in a vertically sliding manner, and the thimble cap is arranged and fixed on the needle cap base;
the linear driving mechanism is arranged on the driving mechanism base, and the driving end of the linear driving mechanism is connected with the needle cap base to drive the needle cap base to move up and down relative to the thimble body.
Optionally, the linear driving mechanism includes:
the rotating motor is arranged on the driving mechanism base;
and the cam connecting rod assembly is connected with the driving end of the rotating motor and the needle cap base.
Optionally, the cam link assembly includes:
one end of the transmission cam is fixedly connected with the driving end of the rotating motor;
and one end of the transmission connecting rod is hinged with the other end of the transmission cam, and the other end of the transmission connecting rod is hinged with the needle cap base.
Optionally, the driving mechanism base and the needle cap base are connected in a vertical sliding manner through a sliding block guide rail assembly.
Optionally, a sealing ring is arranged between the needle cap base and the thimble cap.
Optionally, each of the air suction holes is uniformly arranged around the through-needle hole.
On the other hand, a die bonding device is provided, which comprises a suction nozzle, a mechanical arm for driving the suction nozzle to move and any needle cap lifting chip demoulding mechanism.
In still another aspect, a method for demolding a chip is provided, which is applicable to the die bonding equipment, and includes:
placing the wafer on the thimble cap;
the chip bodies on the wafer are visually positioned, and the mechanical arm drives the suction nozzle to move to the chip body right above the thimble body and sucks the chip body from above;
vacuumizing in the thimble cap, and sucking the bearing film from the lower part of the bearing film through the suction hole;
the power module drives the thimble cap to move downwards to a sinking state, so that the sucked chip body is separated from the bearing film.
The invention has the beneficial effects that: providing a needle cap lifting type chip demoulding mechanism, a die bonding device and a chip demoulding method, when a wafer is required to be subjected to a die picking operation, placing a wafer on a thimble cap, vacuumizing the thimble cap, and sucking a bearing film from the lower part of the bearing film through a suction hole; the power module drives the thimble cap to move downwards to a sinking state relative to the thimble body;
in the downward movement process of the thimble cap, on one hand, the bearing film can move downwards along with the thimble cap under the suction action of the suction hole, so that the thimble body pierces the bearing film; on the other hand, because the thimble body can not move downwards or upwards, the upward propping force provided by the thimble body to the chip body is kept unchanged, so that the problem of damage to the chip body caused by overlarge propping force can not occur.
Therefore, the pin cap lifting type chip demoulding mechanism, the die bonding equipment and the chip demoulding method can effectively solve the problem that the existing chip demoulding mechanism is easy to damage a chip body in the process of taking out the chip.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a schematic diagram of a conventional die bonding apparatus according to the related art;
fig. 2 is a schematic structural diagram of a pin cap lifting chip demolding mechanism according to an embodiment;
fig. 3 is a schematic cross-sectional view of a pin cap lifting chip demoulding mechanism according to an embodiment.
In the figure:
100. a wafer; 100a, a carrier film; 100b, a chip body;
200. a suction nozzle;
300. a mechanical arm;
1. a thimble cap; 101. a receiving chamber; 102. passing through the pinholes; 103. an air suction hole;
2. a thimble body;
3. a power module; 301. a drive mechanism base; 302. a needle cap base; 303. a linear driving mechanism; 3031. a rotating electric machine; 3032. a cam link assembly; 3032a, a drive cam; 3032b, a transmission link; 304. a slider rail assembly; 305. a return spring;
4. and (3) sealing rings.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is apparent that the embodiments described below are only some embodiments of the present invention, not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it will be understood that when one component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.
Furthermore, the terms "long," "short," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship based on that shown in the drawings, for convenience of description of the present invention, and are not intended to indicate or imply that the apparatus or elements referred to must have this particular orientation, operate in a particular orientation configuration, and thus should not be construed as limiting the invention.
The present invention will be described in detail below with reference to specific embodiments shown in the drawings. These embodiments are not intended to limit the invention and structural, methodological, or functional modifications of these embodiments that may be made by one of ordinary skill in the art are included within the scope of the invention.
The invention provides a needle cap lifting type chip demoulding mechanism, a die bonding device and a chip demoulding method, which are suitable for application scenes that a chip body is taken down from a bearing film and then die bonding operation is carried out, and can effectively solve the problem that the chip body is easy to damage in the die picking process of the existing chip demoulding mechanism.
Example 1
The embodiment provides a needle cap lifting type chip demoulding mechanism and die bonding equipment, wherein the die bonding equipment comprises a suction nozzle, a mechanical arm for driving the suction nozzle to move, and the needle cap lifting type chip demoulding mechanism for separating a chip body from a bearing film.
Referring to fig. 2 and 3, in this embodiment, the pin cap lifting chip demolding mechanism includes a pin cap 1 provided with a plurality of air suction holes 103, a pin body 2 disposed in the pin cap 1, and a power module 3 for driving the pin cap 1 to move up and down relative to the pin body 2;
the top surface of the thimble cap 1 has a floating state that is driven by the power module 3 to move upwards to be higher than the top end of the thimble body 2, and a sinking state that is driven by the power module 3 to move downwards to be lower than the top end of the thimble body 2.
When the wafer is required to be subjected to the wafer picking operation, after the wafer is placed on the thimble cap 1, the inside of the thimble cap 1 is vacuumized, and the air suction hole 103 sucks the carrying film from the lower part of the carrying film; the power module 3 drives the thimble cap 1 to move downwards to a sinking state relative to the thimble body 2;
in the process of downward movement of the thimble cap 1, on one hand, the bearing film can move downward along with the thimble cap 1 under the suction action of the suction hole 103, so that the thimble body 2 pierces the bearing film; on the other hand, since the ejector pin body 2 does not move downward or upward, the upward pushing force provided by the ejector pin body 2 to the chip body is kept unchanged, so that the problem of damage to the chip body caused by excessive pushing force does not occur.
Therefore, the needle cap lifting type chip demoulding mechanism and the die bonding equipment provided by the embodiment can effectively solve the problem that the existing chip demoulding mechanism is easy to damage a chip body in the process of taking the crystal.
Optionally, a containing cavity 101 for containing the thimble body 2 is arranged in the thimble cap 1; a pin passing hole 102 for the top end of the thimble body 2 to pass through is arranged in the middle of the top of the accommodating cavity 101. Further, the air suction holes 103 are uniformly arranged around the pin passing holes 102, which is beneficial for the thimble cap 1 to apply uniform downward pulling force to the bearing film, so that the bearing film can uniformly sink along with the thimble cap 1.
In this embodiment, the power module 3 includes a driving mechanism base 301, a needle cap base 302, and a linear driving mechanism 303. The needle cap base 302 is mounted on the driving mechanism base 301 in a vertically sliding manner, and the thimble cap 1 is mounted and fixed on the needle cap base 302; the linear driving mechanism 303 is mounted on the driving mechanism base 301, and the driving end of the linear driving mechanism 303 is connected with the needle cap base 302 to drive the needle cap base 302 to move up and down relative to the thimble body 2.
Further, the linear driving mechanism 303 includes a rotary motor 3031 and a cam link assembly 3032. The rotating motor 3031 is mounted on the driving mechanism base 301; the cam linkage assembly 3032 connects the drive end of the rotary motor 3031 and the needle cap base 302.
Alternatively, the cam linkage assembly 3032 includes a drive cam 3032a and a drive link 3032b. One end of the transmission cam 3032a is fixedly connected with the driving end of the rotating motor 3031; one end of the transmission link 3032b is hinged to the other end of the transmission cam 3032a, and the other end of the transmission link 3032b is hinged to the needle cap base 302.
When the driving end of the rotating motor 3031 rotates, the driving cam 3032a is driven to rotate, so that the driving connecting rod 3032b is driven to swing up and down, and finally the needle cap base 302 is driven to move up and down.
Of course, in some other embodiments, the linear driving mechanism 303 may be a motor screw linear module or other direct driving mechanisms such as an electric cylinder, which is not limited in this embodiment.
Optionally, the driving mechanism base 301 and the needle cap base 302 are connected by a sliding block and guide rail assembly 304 in a sliding manner, so as to improve the smoothness of the needle cap base 302 when sliding up and down.
In this embodiment, a sealing ring 4 is disposed between the needle cap base 302 and the needle cap 1, so as to improve the air tightness of the accommodating cavity 101, and ensure the suction effect of the suction hole 103 on the bearing film.
Optionally, a return spring 305 is disposed between the driving mechanism base 301 and the needle cap base 302, and is used for driving the needle cap base 302 to slide upwards. When the crystal picking operation is not performed, even if the power module 3 does not work, the reset spring 305 can drive the thimble cap 1 to move upwards to a floating state, so as to protect the thimble body 2 from being damaged.
To sum up, the pin cap lifting type chip demoulding mechanism and the die bonding equipment provided by the embodiment have the following advantages:
(1) the traditional up-and-down motion structure of the thimble body 2 is changed into the up-and-down motion structure of the thimble cap 1, and the upward propping force provided by the thimble body 2 to the chip body is kept unchanged in the process of demolding the chip body, so that the problem of damage to the chip body caused by overlarge propping force can be avoided; in the application of minisize LED and higher-end semiconductor chip mounting, the process can completely avoid defects such as marks (damages) on the bottom of the chip body, and the mounting precision is also more ensured;
(2) the upward propping force provided by the thimble body 2 to the chip body is kept unchanged, so that the problems that the bearing film is seriously deformed and finally the chip body is seriously shifted due to overlarge propping force of the thimble body 2 and excessive tearing of the bearing film can be effectively avoided, and the final die bonding and mounting precision is improved;
(3) the ejector pin body 2 can not jack up the chip body to the suction nozzle, prevents severe collision between the chip body and the suction nozzle, avoids the top surface of the chip body to be damaged, and is favorable for improving the final die bonding and mounting precision.
Example 2
The embodiment provides a chip demolding method, which is executed by the die bonding equipment described in embodiment 1 and has the same functions and beneficial effects.
In this embodiment, the method for demolding a chip includes:
s10: placing a wafer on the thimble cap 1;
s20: the chip bodies on the wafer are visually positioned, and the mechanical arm drives the suction nozzle to move to the chip body right above the thimble body 2 and sucks the chip body from above;
s30: vacuumizing in the thimble cap 1, and sucking the bearing film from the lower part of the bearing film through the suction hole 103;
s40: the power module 3 drives the thimble cap 1 to move downwards to a sinking state, so that the sucked chip body is separated from the bearing film.
Specifically, the linear driving mechanism 303 drives the needle cap base 302 to move downward to a sinking state relative to the thimble body 2, so that the sucked chip body is separated from the carrier film. Finally, the mechanical arm can drive the suction nozzle to suck the chip body after the demolding to carry out die bonding operation.
It should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is for clarity only, and that the skilled artisan should recognize that the embodiments may be combined as appropriate to form other embodiments that will be understood by those skilled in the art.
The above list of detailed descriptions is only specific to practical embodiments of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent embodiments or modifications that do not depart from the spirit of the present invention should be included in the scope of the present invention.
Claims (10)
1. The needle cap lifting type chip demoulding mechanism is characterized by comprising a needle cap (1) provided with a plurality of air suction holes (103), a needle body (2) arranged in the needle cap (1) and a power module (3) for driving the needle cap (1) to move up and down relative to the needle body (2);
the top surface of the thimble cap (1) is provided with a floating state which is driven by the power module (3) to move upwards to be higher than the top end of the thimble body (2), and a sinking state which is driven by the power module (3) to move downwards to be lower than the top end of the thimble body (2).
2. The needle cap lifting chip demoulding mechanism according to claim 1, wherein a containing cavity (101) for containing the needle body (2) is arranged in the needle cap (1);
the middle position of the top of the accommodating cavity (101) is provided with a pin passing hole (102) for the top end of the thimble body (2) to pass through.
3. The pin cap lifting chip demoulding mechanism according to claim 2, characterized in that said power module (3) comprises:
a drive mechanism base (301);
the needle cap base (302), the needle cap base (302) is arranged on the driving mechanism base (301) in a vertically sliding manner, and the thimble cap (1) is arranged and fixed on the needle cap base (302);
the linear driving mechanism (303) is arranged on the driving mechanism base (301), and the driving end of the linear driving mechanism (303) is connected with the needle cap base (302) to drive the needle cap base (302) to move up and down relative to the thimble body (2).
4. A cap-lifting die stripping mechanism as claimed in claim 3, characterized in that the linear drive mechanism (303) comprises:
a rotating electric machine (3031), the rotating electric machine (3031) being mounted on the driving mechanism base (301);
and a cam link assembly (3032), wherein the cam link assembly (3032) is connected with the driving end of the rotating motor (3031) and the needle cap base (302).
5. The cap-lifting die release mechanism of claim 4, wherein the cam link assembly (3032) comprises:
a transmission cam (3032 a), wherein one end of the transmission cam (3032 a) is fixedly connected with the driving end of the rotating motor (3031);
and one end of the transmission connecting rod (3032 b) is hinged with the other end of the transmission cam (3032 a), and the other end of the transmission connecting rod (3032 b) is hinged with the needle cap base (302).
6. A cap-lifting chip demoulding mechanism according to claim 3, characterized in that the driving mechanism base (301) and the cap base (302) are connected in a sliding manner up and down through a sliding block guide rail assembly (304).
7. A pin cap lifting chip demoulding mechanism according to claim 3, characterized in that a sealing ring (4) is arranged between the pin cap base (302) and the thimble cap (1).
8. The cap-lifting die stripping mechanism as claimed in claim 2, wherein each of the suction holes (103) is uniformly arranged around the through-needle hole (102).
9. A die bonding apparatus comprising a suction nozzle, a mechanical arm for driving the suction nozzle to move, and the pin cap lifting chip demoulding mechanism according to any one of claims 1 to 8.
10. A method of die ejection adapted to the die bonding apparatus of claim 9, comprising:
placing a wafer on the thimble cap (1);
the chip bodies on the wafer are visually positioned, and the mechanical arm drives the suction nozzle to move to the chip body right above the thimble body (2) and sucks the chip body from above;
vacuumizing in the thimble cap (1), and sucking the bearing film from the lower part of the bearing film through the suction hole (103);
the power module (3) drives the thimble cap (1) to move downwards to a sinking state, so that the sucked chip body is separated from the bearing film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311072961.9A CN116936418A (en) | 2023-08-23 | 2023-08-23 | Needle cap lifting type chip demolding mechanism, die bonding equipment and chip demolding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311072961.9A CN116936418A (en) | 2023-08-23 | 2023-08-23 | Needle cap lifting type chip demolding mechanism, die bonding equipment and chip demolding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116936418A true CN116936418A (en) | 2023-10-24 |
Family
ID=88382713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311072961.9A Pending CN116936418A (en) | 2023-08-23 | 2023-08-23 | Needle cap lifting type chip demolding mechanism, die bonding equipment and chip demolding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116936418A (en) |
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2023
- 2023-08-23 CN CN202311072961.9A patent/CN116936418A/en active Pending
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