CN214898372U - Blue membrane chip ejecting device - Google Patents

Abstract

The utility model provides a blue membrane chip ejecting device, belongs to chip assembly technical field, including mounting plate, the last vacuum hood lifter plate that can reciprocate of mounting plate is installed, is equipped with the vacuum hood on the vacuum hood lifter plate, and the vacuum hood top is equipped with the thimble, still installs the vacuum hood lift lead screw motor that drives the vacuum hood lifter plate and reciprocate on the mounting plate, still installs the thimble lift lead screw motor that drives the thimble and reciprocate on the mounting plate, the thimble inserts on the thimble lifter, and the thimble lifter is installed on the ejector pin mounting panel, and the lead screw of thimble lift lead screw motor runs through and connects through the nut behind the ejector pin mounting panel. The utility model discloses in adopt the blue membrane of vacuum hood absorption drop-down to drive the chip and move down the contact thimble and come ejecting chip, the blue membrane drop-down makes chip and blue membrane break away from around the chip is absorbed to the vacuum hood, has eliminated the risk of crushing chip, also eliminates the chip suction nozzle lag thimble in the twinkling of an eye of the ejecting chip of thimble simultaneously and brings the risk of overshooting and damaging the chip.

Description

Blue membrane chip ejecting device

Technical Field

The utility model belongs to the technical field of the chip equipment, a chip stripping off device is related to, especially relate to a blue membrane chip ejecting device.

Background

At present, a motor 3 drives a cam 4 to rotate, the cam 3 drives a shaft connected with a thimble 1 to pass through a ball bush assembly 5, so that the thimble 1 moves up and down to pierce a blue membrane disc to eject a chip, as shown in fig. 1 and 2.

Although the conventional blue film chip ejection device can eject the chip, the following disadvantages exist in the practical use process:

1. when the cam 3 is used for jacking, the chip is jacked out and sucked away by the chip sucker, the thimble 1 and the chip sucker are required to clamp the chip to synchronously move upwards, if the speed of the thimble 1 is greater than the speed of the chip sucker, the chip 1 is extremely easy to crush, if the speed of the thimble 1 is less than the speed of the chip sucker, the chip is difficult to successfully suck due to the viscosity of a blue film, and in an actual use case, due to the problems of processing and assembling of the cam 4, the speed of the thimble 1 and the speed of the chip sucker are required to be adjusted consistently and are very complicated.

2. When the blue film is subjected to a crystal expanding process, the degree of tightness is inconsistent, when the blue film is loose, the vacuum cover 2 of the device cannot be adjusted up and down, and the vacuum cover 2 can collide the side face of the chip on the blue film during left and right movement, so that the chip is failed to be sucked next time, and the risk of chip damage exists.

3. The device can only realize ejection of the ejector pin 1, chip suction is carried out in a mode that the chip is not moved, in the practical use, the upward movement of the chip suction head lags the ejector pin at the moment that the chip is ejected by the ejector pin 1, so that the risk that the chip is broken by ejection exists, if the chip suction head moves before the ejector pin 1 ejects the chip, vacuum is broken, and the risk that chip suction fails exists.

Therefore, in order to solve these problems, the utility model provides a blue membrane chip ejecting device.

Disclosure of Invention

In view of the above drawbacks of the prior art, an object of the present invention is to provide a blue film chip ejection apparatus, which is used to solve the technical problem in the prior art that a blue film chip is easily damaged during ejection.

In order to achieve the above and other related objects, the present invention provides a blue film chip ejection device, which comprises an installation bottom plate, wherein a vacuum cover lifting plate capable of moving up and down along the height direction of the installation bottom plate is installed on the installation bottom plate, a vacuum cover is arranged on the vacuum cover lifting plate, the side wall of the vacuum cover is communicated with a quick coupling, a thimble penetrating through the vacuum cover is arranged in the center of the top of the vacuum cover, and a vacuum cover lifting screw rod assembly for driving the vacuum cover lifting plate to move up and down and a thimble lifting screw rod assembly for driving the thimble to move up and down are also installed on the installation bottom plate.

Preferably, the mounting bottom plate is an L-shaped plate, two miniature linear guide rails are mounted on the side wall of the vertical end of the mounting bottom plate, and the vacuum cover lifting plate is mounted on the two miniature linear guide rails.

Preferably, the top of the mounting bottom plate is provided with a guide rail limiting plate.

Preferably, the vacuum cover lifting plate is provided with a vacuum cover mounting block, and the vacuum cover is mounted on the vacuum cover mounting block.

Preferably, the vacuum cover lifting screw rod assembly comprises a vacuum cover lifting screw rod motor, the vacuum cover lifting screw rod motor is installed on the installation bottom plate through a vacuum cover motor installation plate, and a screw rod of the vacuum cover lifting screw rod motor penetrates through the vacuum cover lifting plate and is connected through a nut.

Preferably, thimble lift lead screw subassembly includes thimble lift lead screw motor, thimble lift lead screw motor passes through thimble motor mounting panel and installs on mounting plate, thimble lift lead screw subassembly still includes the ejector pin mounting panel, install the thimble lifter on the ejector pin mounting panel, stretch into in the vacuum cup after the upper end of thimble lifter runs through vacuum cup lifter, vacuum cup installation piece in proper order, the thimble inserts the upper end of thimble lifter, the lead screw of thimble lift lead screw motor runs through the ejector pin mounting panel and connects through the nut.

Preferably, the top end of the thimble lifting rod is in threaded connection with a thimble clamping cover for clamping a thimble.

Preferably, the side wall of the vacuum cover lifting plate is connected with a wide linear guide rail, the ejector rod mounting plate is an L-shaped plate, one side of the ejector rod mounting plate is mounted on the wide linear guide rail, and the other side of the ejector rod mounting plate is connected with an ejector pin lifting screw rod motor.

Preferably, two photoelectric sensors for limiting are installed on one side, far away from the vacuum cover lifting screw rod motor, of the vacuum cover lifting plate.

Preferably, the top of the vacuum cover is provided with a plurality of adsorption holes.

As above, the utility model discloses a blue membrane chip ejecting device has following beneficial effect:

1. in the utility model, the vacuum cover absorbs the blue film to move downwards, when the bottom surface of the chip is contacted with the thimble, the chip suction head contacts the front surface of the chip, the chip suction head and the thimble are kept in the same position, the chip is not impacted and extruded by the thimble in the middle part, the vacuum cover continuously sucks the blue film downwards, the contact part of the blue film and the bottom of the chip is gradually separated from the chip under the action of the thimble until the thimble pierces the blue film, the bottom surface of the whole chip is completely separated from the blue film, and the whole separation process only has the force action change generated between the blue film and the thimble, the chip can not be impacted by the change of force, the traditional device is just the opposite, when the thimble is needed to push up the blue film, the upper chip can be impacted, therefore, the utility model discloses a motion has eliminated the impact that traditional mode thimble upward movement brought for the chip, very big protection the chip receive the damage when taking out.

2. In the utility model, the up-down stroke is controlled by the lead screw, the position of the thimble can be accurate to 0.01mm, the distance between the chip suction head and the thimble can be stably adjusted according to the thickness of the chip, and the thimble is suitable for chips with different thicknesses; the lead of the lead screw and the rotating speed of the motor form a slope fixed parameter, so that the whole process of separating the blue film from the chip is stable and uniform when the speed of the motor of the lead screw is fixed, the stability of the blue film and the chip in the separation process is ensured, and the chip is further ensured not to be damaged.

3. The utility model discloses in, distance automatically regulated about the tensioning degree that the vacuum cover can be based on blue membrane carries out to this eliminates blue membrane elasticity not the risk that the vacuum cover removed and hit the chip simultaneously.

Drawings

Fig. 1 is a schematic view of an ejection device in the prior art.

Fig. 2 shows a cross-sectional view of a prior art ejector.

Fig. 3 is a schematic view of the middle ejecting device of the present invention.

Fig. 4 is a side view of the ejector device of the present invention.

Fig. 5 is a front view of the ejection device of the present invention.

Fig. 6 is a cross-sectional view of the plane a-a of the present invention.

Fig. 7 shows an enlarged schematic view at a.

Fig. 8 is an enlarged schematic view at B.

Description of the element reference numerals

1-mounting base plate, 2-vacuum hood lifting screw motor, 3-ejector pin lifting screw motor, 4-ejector pin motor mounting plate, 5-vacuum hood motor mounting plate, 6-vacuum hood lifting plate, 7-vacuum hood mounting block, 8-vacuum hood, 9-ejector pin lifting rod, 10-ejector pin clamping cover, 11-ejector pin, 12-guide rail limiting plate, 13-micro linear guide rail, 14-wide linear guide rail, 15-ejector pin mounting plate, 16-photoelectric sensor, 17-ball bush guide assembly, 18-axial glede ring, 19-quick connector, 20-chip suction nozzle, 21-blue film.

Detailed Description

The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.

Please refer to fig. 3 to 8. It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modification, ratio relationship change, or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention. In addition, the terms "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for clarity of description, and are not intended to limit the scope of the present invention, and the relative relationship between the terms and the terms is not to be construed as a scope of the present invention.

Referring to fig. 3-8, the present invention provides a blue film chip ejection device, which includes an installation base plate 1, wherein a vacuum cover lifting plate 6 capable of moving up and down along a height direction of the installation base plate 1 is installed on the installation base plate 1, a vacuum cover 8 is installed on the vacuum cover lifting plate 6, a quick coupling 19 is communicated with a side wall of the vacuum cover 8, a thimble 11 penetrating through the vacuum cover 8 is installed in a center of a top of the vacuum cover 8, and a vacuum cover lifting screw rod assembly driving the vacuum cover lifting plate 6 to move up and down and a thimble lifting screw rod assembly driving the thimble 11 to move up and down are also installed on the installation base plate 1.

In use, the mounting plate 1 provides support for the entire mechanism. The vacuum cover lifting screw rod assembly drives the vacuum cover 8 on the vacuum cover lifting plate 6 to move up and down by driving the vacuum cover lifting plate 6 to move up and down along the height direction of the mounting bottom plate 1, so that the vacuum cover 8 can adjust the up-and-down distance according to the tensioning degree of the blue film 21, and the risk that the vacuum cover 8 moves to crash a chip when the tightness of the blue film 21 is different is eliminated. The thimble lifting screw rod component realizes the up-and-down movement of the thimble 11. In the working process, the blue membrane disc carrying chip is placed above the vacuum cover 8, and the fast joint 19 is communicated with vacuum to suck the blue membrane disc through the vacuum cover 8. The fixing position of the thimble 11 is automatically adjusted by the thimble lifting screw rod assembly according to the thickness of different chips, then the vacuum hood lifting screw rod assembly drives the vacuum hood 8 to suck the blue film 21 to move downwards, when the bottom surface of the chip just contacts with the thimble 11, the chip suction nozzle 20 above the chip descends to contact the front surface of the chip and starts vacuum at the chip suction nozzle 20, so that the chip suction nozzle 20 sucks the chip, the vacuum hood lifting screw rod assembly continues to suck the blue film 21 to move downwards to separate the blue film 21 from the chip, in the process of separating the blue film 21 from the chip, the chip suction nozzle 20, the chip and the thimble 11 keep the positions still, the vacuum hood 8 moves downwards, and after the blue film 21 is separated from the chip, the chip suction nozzle 20 sucks the chip. The process is repeatedly changed, and the chips on the whole blue film disc can be completely taken away. The method changes the traditional mode of lifting and ejecting the chip by the ejector pin 11, adopts the principle that the vacuum cover 8 absorbs the blue film 21 to pull down to drive the chip to move downwards to contact the ejector pin 11 to eject the chip, adjusts the distance between the chip suction nozzle 20 and the ejector pin 11 to the thickness of the chip, and utilizes the principle that the vacuum cover 8 absorbs the blue film 21 around the chip to pull down to separate the chip from the blue film 21, and the novel method can eliminate the risk that the speed of the traditional ejector pin device is not matched with the chip crushing speed when the chip is ejected, and also can eliminate the risk that the chip is damaged by overshoot caused by the fact that the chip suction nozzle 20 lags the ejector pin 11 in the moment that the ejector pin 11 ejects the chip in the traditional device.

In this embodiment, the structure and the operation principle of the chip suction nozzle 20 belong to the prior art, and those skilled in the art can know the prior art and their own knowledge, and further description thereof is omitted in this embodiment.

In this embodiment, the quick coupling 19 is connected to the vacuum device, and the specific structure of the quick coupling 19 and the connection manner between the quick coupling and the vacuum device are known to those skilled in the art from the prior art and their own knowledge, and further description thereof is omitted in this embodiment. In this embodiment, the connection mode between the vacuum cover 8 and the vacuum device is not limited to the connection using the quick connector 19, and other connection modes capable of vacuumizing the vacuum cover 8 through the vacuum device, such as connection through a vacuum tube, may be adopted.

In this embodiment, compared with the conventional blue film chip fixed ejection device, the device mainly has the following differences:

1. the motion mode is as follows: the vacuum cover 8 sucks the blue film 21 to move downwards, when the bottom surface of the chip is contacted with the ejector pins 11, the chip suction nozzle 20 is contacted with the front surface of the chip, the chip suction nozzle 20 and the ejector pins 11 are kept in a fixed position, the chip is not impacted and extruded by the ejector pins 11 in the middle, the vacuum cover 8 continuously sucks the blue film 21 downwards, the contact part of the blue film 21 and the bottom of the chip is gradually separated from the chip under the action of the ejector pins 11 until the ejector pins 11 pierce the blue film 21, the whole bottom surface of the chip is completely separated from the blue film 21, the whole separation process only generates force action change between the blue film 21 and the ejector pins 11, the chip is not impacted by the change of force, the traditional device is just opposite, when the ejector pins 11 are required to upwards eject the blue film 21, the upper chip is impacted by the impact force, so the new motion mode eliminates the impact brought by the upward motion of the ejector pins 11 in the traditional mode to the chip, the chip is greatly protected from being damaged when being taken out;

2. a driving mode: the up-down stroke is controlled by adopting a screw rod, the position of the ejector pin 11 can be accurately 0.01mm, so that the distance between the chip suction nozzle 20 and the ejector pin 11 can be stably adjusted according to the thickness of the chip, and the chip suction nozzle is suitable for chips with different thicknesses; the lead of the screw rod and the rotating speed of the motor form a slope fixed parameter, so that the whole process of separating the blue film 21 from the chip is stable and uniform when the motor speed of the screw rod is fixed, in the actual use condition, the traditional cam control is characterized in that the outline of the cam is an involute curve, when the motor speed is fixed, the ejector pin 11 can perform acceleration and deceleration movement when ejecting the chip, the ejector pin 11 has a chip impact process more and more quickly in the acceleration process, if the cam mechanism wants to control the movement of the ejector pin 11 at a constant speed, the motor can not make corresponding response in the short-distance range, and therefore the traditional cam device can not achieve the precision and the stability of screw rod transmission.

As a further description of the above embodiment, the mounting base plate 1 is an L-shaped plate, two micro linear guide rails 13 are mounted on the vertical end side wall of the mounting base plate 1, and the vacuum hood lifting plate 6 is mounted on the two micro linear guide rails 13.

When the present embodiment is used, the shape of the mounting base plate 1 is not limited to an L-shaped plate, and other shapes capable of supporting the whole mechanism may be used, for example, the mounting base plate 1 is a T-shaped plate.

In this embodiment, the setting up of two miniature linear guide 13 can play a positioning action to vacuum hood lifter plate 6 on the one hand, guarantees being connected between vacuum hood lifter plate 6 and the mounting plate 1, and on the other hand can play a limiting displacement, guarantees that vacuum hood lifter plate 6 can carry out the up-and-down motion along miniature linear guide 13 to drive vacuum hood 8 and carry out the up-and-down motion, realize driving blue membrane 21 downstream and with the chip separation.

In this embodiment, the vacuum hood lifter plate 6 is also an L-shaped plate, the vertical end of the vacuum hood lifter plate 6 is connected with the vertical end of the mounting base plate 1, and the vacuum hood 8 is connected to the horizontal end of the vacuum hood lifter plate 6.

In this embodiment, the connection mode between the vacuum hood lifting plate 6 and the mounting base plate 1 is not limited to the connection through the two micro linear guide rails 13, and other connection modes can be used to realize the connection between the two and realize that the vacuum hood lifting plate 6 can move up and down along the mounting base plate 1. If the vertical end of the mounting base plate 1 is inwards sunken to form two T-shaped clamping grooves (not shown in the figure) which are symmetrically arranged along the vertical central line of the mounting base plate, the opposite surfaces of the vertical end of the vacuum cover lifting plate 6 and the mounting base plate 1 are connected with two T-shaped clamping blocks (not shown in the figure) which are matched with the T-shaped clamping grooves, and the connection between the vacuum cover lifting plate 6 and the mounting base plate 1 is realized through the matching of the T-shaped clamping blocks and the T-shaped clamping grooves.

As a further description of the above embodiment, the mounting baseplate 1 is provided with a rail-restraining plate 12 on top.

In this embodiment, the setting of guide rail limiting plate 12 can play a limiting displacement to vacuum hood lifter plate 6 in vertical removal, prevents that vacuum hood lifter plate 6 from separating and droing with miniature linear guide 13 at the in-process of rebound and causing the damage of device, influences the normal use of device.

In this embodiment, the number of the guide rail limiting plates 12 is two, and the guide rail limiting plates are symmetrically arranged at the top of the vertical end of the installation bottom plate 1 and are located right above the micro linear guide 13. However, the number of the guide rail limiting plates 12 is not limited to two, and may be increased according to actual use requirements. The guide rail limiting plate 12 is not limited to be located directly above the micro linear guide 13, and can be installed at any position of the vertical end of the installation bottom plate 1 as long as the vacuum hood lifting plate 6 can be limited. Meanwhile, the guide rail limiting plate 12 is not limited to be mounted on the mounting base plate 1, and may be mounted on the top of the guide rail of the micro linear guide 13. Therefore, the number and the installation position of the guide rail limiting plates 12 can be adjusted according to actual use requirements.

As a further description of the above embodiment, the vacuum housing lifting plate 6 is mounted with the vacuum housing mounting block 7, and the vacuum housing 8 is mounted on the vacuum housing mounting block 7.

When the vacuum hood lifting plate is used, the vacuum hood mounting block 7 and the vacuum hood lifting plate 6 are welded or fixedly connected in other modes. The vacuum cover 8 and the vacuum cover mounting block 7 are connected by screws, rivets or the like.

As a further description of the above embodiment, the vacuum hood lift screw assembly includes a vacuum hood lift screw motor 2, the vacuum hood lift screw motor 2 is mounted on the mounting base plate 1 through a vacuum hood motor mounting plate 5, and a screw of the vacuum hood lift screw motor 2 is connected through a nut through a vacuum hood lift plate 6.

When the vacuum hood 8 is used in the embodiment, the working principle of the up-and-down movement of the vacuum hood 8 is as follows: the vacuum cover lifting screw rod motor 2 is started, the motor rotates to drive the screw rod connected with the motor to rotate, so that the vacuum cover lifting plate 6 in threaded connection with the screw rod is driven to move upwards or downwards along the length direction of the screw rod, and the vacuum cover 8 on the vacuum cover lifting plate 6 is driven to move upwards or downwards.

As a further description of the above embodiment, the thimble lifting screw assembly includes thimble lifting screw motor 3, thimble lifting screw motor 3 is installed on mounting plate 1 through thimble motor mounting panel 4, thimble lifting screw assembly still includes ejector pin mounting panel 15, install thimble lifter 9 on the ejector pin mounting panel 15, stretch into in the vacuum cup 8 after vacuum cup lifter 6, vacuum cup installation piece 7 is run through in proper order to the upper end of thimble lifter 9, thimble 11 inserts the upper end of thimble lifter 9, the lead screw of thimble lifting screw motor 3 runs through behind the ejector pin mounting panel 15 and connects through the nut.

When the present embodiment is used, the working principle of the up-and-down movement of the thimble 11 is as follows: the thimble lifting screw motor 3 is started, the motor rotates the screw rod electrically connected with the motor to rotate, so that the ejector rod mounting plate 15 in threaded connection with the screw rod is driven to move upwards or downwards along the length direction of the screw rod, the thimble lifting rod 9 connected with the ejector rod mounting plate 15 is driven to move upwards or downwards, and the thimble 11 inserted into the upper end of the thimble lifting rod 9 is driven to move upwards or downwards.

In this embodiment, the thimble lifting rod 9 is connected to the upper surface of the thimble mounting plate 15 by a screw. The connection mode between the ejector pin lifting rod 9 and the ejector pin mounting plate 15 is not limited to the screw connection, and other connection modes capable of realizing stable connection between the two can be adopted.

In this embodiment, the penetrating positions of the ejector pin lifting rod 9, the vacuum cover lifting plate 6 and the vacuum cover mounting block 7 are provided with the ball bush guide assembly 17, and the friction force between the ejector pin lifting rod 9 and the vacuum cover lifting plate 6 as well as the friction force between the ejector pin lifting rod 9 and the vacuum cover mounting block 7 can be reduced by the arrangement of the ball bush guide assembly 17, so that the service life of the ejector pin lifting rod 9 is prolonged while the ejector pin lifting rod 9 is ensured to perform linear motion in the vertical direction.

In this embodiment, the penetrating position of the thimble lifting rod 9 and the top of the vacuum cover mounting block 7 is provided with an axial greige ring 18, and the arrangement of the axial greige ring 18 can play a role in sealing, so as to ensure the sealing performance of the vacuum cover 8, and further ensure the adsorption effect of the vacuum cover 8 on the blue film 21.

As a further description of the above embodiment, the top end of the needle lifting rod 9 is threadedly connected with a needle clamping cover 10 for clamping a needle 11.

When the thimble lifting rod 9 is used in this embodiment, a thimble insertion hole is formed in the top of the thimble lifting rod 9, and the thimble 11 is inserted into the thimble insertion hole formed in the top of the thimble lifting rod 9. The top of the thimble lifting rod 9 is provided with an external thread, and the thimble clamping cover 10 is in threaded connection with the thimble lifting rod 9, so that the stability of the installation of the thimble 11 is ensured.

In this embodiment, the thimble clamping cover 10 is a hollow cuboid or cylinder with an open bottom, a through hole is formed in the top of the thimble clamping cover 10, and an internal thread is formed on the inner wall of the thimble clamping cover 10.

In this embodiment, the top of the thimble lifting rod 9 is provided with a tapered section along the circumferential direction thereof, and the tapered section is convenient for the thimble clamping cover 10 to enter and clamp the thimble 11.

As a further description of the above embodiment, the side wall of the vacuum hood lifting plate 6 is connected with a wide linear guide 14, the ejector rod mounting plate 15 is an L-shaped plate, one side of the ejector rod mounting plate 15 is mounted on the wide linear guide 14, and the other side of the ejector rod mounting plate 15 is connected with the ejector pin lifting screw motor 3.

When the ejector pin mounting plate is used in the embodiment, the wide linear guide rail 14 is arranged to facilitate fixing of the ejector pin mounting plate 15 on one hand, and limit the ejector pin mounting plate 15 on the other hand, so that the ejector pin mounting plate 15 can only move up and down along the guide rail direction of the wide linear guide rail 14, and the ejector pin 11 can move up and down.

As a further description of the above embodiment, two photoelectric sensors 16 for limiting are installed on the vacuum hood lifting plate 6 at a side far from the vacuum hood lifting screw motor 2.

When the ejector pin mounting plate is used, the movement of the ejector pin mounting plate 15 can be limited by the photoelectric sensor 16, and the ejector pin 11 is prevented from damaging a chip.

As a further description of the above embodiment, the vacuum hood 8 has a plurality of suction holes formed at the top thereof.

When the embodiment is used, the arrangement of the adsorption holes is convenient for adsorbing the blue film 21 and driving the blue film 21 to move downwards to realize the separation of the blue film 21 and the chip.

The working principle of the blue film ejection device is as follows: the blue membrane disc carrying chip is placed above the vacuum cover 8, and the fast joint 19 is connected with vacuum to suck the blue membrane disc through the vacuum cover 8. The thimble lifting screw motor 3 is started, the thimble lifting screw motor 3 drives the ejector rod mounting plate 15 to move upwards, so that the thimble lifting rod 9 connected with the ejector rod mounting plate 15 is driven to move upwards, the thimble 11 at the top of the thimble lifting rod 9 is driven to move upwards, and the fixing position of the thimble 11 is automatically adjusted according to the thicknesses of different chips. Then the vacuum hood lifting screw motor 2 drives the vacuum hood lifting plate 6 to move so that the vacuum hood 8 on the vacuum hood lifting plate 6 sucks the blue film 21 to move downwards, when the bottom surface of the chip just contacts with the ejector pin 11, the chip suction nozzle 20 above the chip descends to contact the front surface of the chip and opens the vacuum at the chip suction nozzle 20 so that the chip suction nozzle 20 sucks the chip, the vacuum hood lifting screw motor 2 continues to suck the blue film 21 to move downwards so that the blue film 21 is separated from the chip, in the process of separating the blue film 21 from the chip, the chip suction nozzle 20, the chip and the ejector pin 11 are kept in the same position, the vacuum hood 8 moves downwards, and after the blue film 21 is separated from the chip, the chip suction nozzle 20 sucks the chip. The process is repeatedly changed, and all chips on the whole blue film 21 disc can be taken away.

In summary, the vacuum hood of the present invention sucks the blue film to move downward, and when the bottom surface of the chip contacts with the thimble, the chip suction head contacts the front surface of the chip, the chip suction head and the thimble are kept in the same position, the middle part of the chip is not impacted and extruded by the thimble, the vacuum cover continuously sucks the blue film downwards, the contact part of the blue film and the bottom of the chip is gradually separated from the chip under the action of the thimble until the thimble pierces the blue film, the bottom surface of the whole chip is completely separated from the blue film, and the whole separation process only has the force action change generated between the blue film and the thimble, the chip can not be impacted by the change of force, the traditional device is just the opposite, when the thimble is needed to push up the blue film, the upper chip can be impacted, therefore, the utility model discloses a motion has eliminated the impact that traditional mode thimble upward movement brought for the chip, very big protection the chip receive the damage when taking out. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.

The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims (10)

1. The utility model provides a blue membrane chip ejecting device, includes mounting plate (1), its characterized in that: install vacuum cover lifter plate (6) that can follow mounting plate (1) direction of height and reciprocate on mounting plate (1), be equipped with vacuum cover (8) on vacuum cover lifter plate (6), vacuum cover (8) lateral wall intercommunication has quick-operation joint (19), and vacuum cover (8) top center is equipped with thimble (11) that run through vacuum cover (8), still install on mounting plate (1) and drive vacuum cover lifting screw subassembly that vacuum cover lifter plate (6) reciprocated and drive thimble (11) and carry out the thimble lifting screw subassembly that reciprocates.

2. The blue film chip ejection device according to claim 1, wherein: the vacuum hood lifting plate is characterized in that the mounting base plate (1) is an L-shaped plate, two miniature linear guide rails (13) are mounted on the side wall of the vertical end of the mounting base plate (1), and the vacuum hood lifting plate (6) is mounted on the two miniature linear guide rails (13).

3. The blue film chip ejection device according to claim 1, wherein: and a guide rail limiting plate (12) is arranged at the top of the mounting bottom plate (1).

4. The blue film chip ejection device according to claim 1, wherein: the vacuum cover lifting plate (6) is provided with a vacuum cover mounting block (7), and the vacuum cover (8) is mounted on the vacuum cover mounting block (7).

5. The blue film chip ejection device according to claim 1, wherein: the vacuum cover lifting screw rod assembly comprises a vacuum cover lifting screw rod motor (2), the vacuum cover lifting screw rod motor (2) is installed on the installation bottom plate (1) through a vacuum cover motor installation plate (5), and a screw rod of the vacuum cover lifting screw rod motor (2) penetrates through the vacuum cover lifting plate (6) and then is connected through a nut.

6. The blue film chip ejection device according to claim 1, wherein: thimble lift lead screw subassembly includes thimble lift lead screw motor (3), install on mounting plate (1) thimble lift lead screw motor (3) through thimble motor mounting panel (4), thimble lift lead screw subassembly still includes ejector pin mounting panel (15), install thimble lifter (9) on ejector pin mounting panel (15), stretch into behind vacuum jacket lifter (6), the vacuum jacket installation piece (7) in proper order in the upper end of thimble lifter (9), thimble (11) insert the upper end of thimble lifter (9), the lead screw of thimble lift lead screw motor (3) is connected through the nut after running through ejector pin mounting panel (15).

7. The blue film chip ejection device according to claim 6, wherein: the top end of the thimble lifting rod (9) is in threaded connection with a thimble clamping cover (10) for clamping a thimble (11).

8. The blue film chip ejection device according to claim 6, wherein: the lateral wall of vacuum hood lifter plate (6) is connected with broad width linear guide (14), ejector pin mounting panel (15) are the L template, and one side of ejector pin mounting panel (15) is installed on broad width linear guide (14), and the opposite side and the thimble lift lead screw motor (3) of ejector pin mounting panel (15) are connected.

9. The blue film chip ejection device according to claim 5, wherein: two photoelectric sensors (16) used for limiting are mounted on one side, far away from the vacuum cover lifting screw motor (2), of the vacuum cover lifting plate (6).

10. The blue film chip ejection device according to claim 1, wherein: the top of the vacuum cover (8) is provided with a plurality of adsorption holes.

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