CN214152865U - Thimble with adjustable XYZ three-direction - Google Patents
Thimble with adjustable XYZ three-direction Download PDFInfo
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- CN214152865U CN214152865U CN202023287634.XU CN202023287634U CN214152865U CN 214152865 U CN214152865 U CN 214152865U CN 202023287634 U CN202023287634 U CN 202023287634U CN 214152865 U CN214152865 U CN 214152865U
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Abstract
The utility model discloses a thimble with adjustable XYZ three-direction, include: the fixing base is arranged on the fixing base in an X direction adjusting assembly, a Y direction adjusting assembly and a Z direction adjusting assembly, the Y direction adjusting assembly is arranged on the fixing base, the Y direction adjusting assembly is arranged on a first driving device, the ejector pin assembly is connected with the output end of the first driving device, and the adsorption assembly is sleeved on the ejector pin assembly. The utility model discloses a relative position of X to adjusting part, Y to adjusting part, Z to adjusting part adjustment adsorption component, thimble assembly and brilliant ring for adsorption component, thimble assembly and brilliant ring are in the centering position, effectively improve and paste the dress precision.
Description
Technical Field
The utility model relates to a wafer pastes the dress field, especially relates to a thimble with adjustable XYZ three-direction.
Background
The wafer mounter is generally provided with an ejector pin device for sucking the wafer and lifting up the wafer so that the wafer is separated from the wafer ring. In the prior art, the thimble device usually adopts a direct suction mode, and force points do not exist below a wafer, so that the wafer is not easy to fall off and is easy to damage; on the other hand, the ejector pin device in the prior art cannot adjust the position (X, Y, Z three directions) before adsorbing the wafer, cannot accurately center, causes the problems of deflection in ejection and breaking of the wafer ring film, and reduces the mounting precision.
Accordingly, the prior art is deficient and needs improvement.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects of the prior art, and provides an adjustable thimble in XYZ three directions, which solves the problems that the wafer has no stress point when being absorbed and is easy to fall off and damage in the prior art; the problem of can't carry out thimble device position adjustment before adsorbing is solved.
The technical scheme of the utility model as follows: an XYZ three-direction adjustable thimble comprises: the device comprises a fixed seat, an X-direction adjusting assembly, a Y-direction adjusting assembly, a Z-direction adjusting assembly, a first driving device, a thimble assembly and an adsorption assembly, wherein the X-direction adjusting assembly, the Y-direction adjusting assembly and the Z-direction adjusting assembly are arranged on the fixed seat; the X-direction adjusting assembly is used for adjusting the positions of the ejector pin assembly and the adsorption assembly in the X direction, the Y-direction adjusting assembly is used for adjusting the positions of the ejector pin assembly and the adsorption assembly in the Y direction, and the Z-direction adjusting assembly is used for adjusting the height from the adsorption assembly to the crystal ring; the adsorption component is used for adsorbing the wafer, and the ejector pin component is used for jacking up the wafer and enabling the wafer to be separated from the wafer ring. Before the wafer is adsorbed, the relative positions of the adsorption component, the thimble component and the crystal ring are respectively adjusted through the X-direction adjusting component, the Y-direction adjusting component and the Z-direction adjusting component, so that the adsorption component, the thimble component and the crystal ring are in the centering position, and the surface mounting precision is effectively improved; on the other hand, set up thimble assembly in adsorption component, when adsorbing the wafer, the one end of thimble assembly, adsorption component all contacts with the wafer for the wafer has the impetus when being in the adsorption state, thereby guarantees the stability among the adsorption process, prevents that the wafer from droing and damaging.
Further, the X-direction adjusting assembly comprises: the sliding table comprises a first fixed block, a first sliding table arranged on the first fixed block, a first adjusting block arranged on one side of the first fixed block, and a first adjusting rod in threaded connection with the first adjusting block; the first adjusting rod is connected with the first sliding table.
Further, a first limiting plate is further arranged on one side of the first fixing block, a first limiting hole is formed in the first limiting plate, and a first limiting block is arranged in the first limiting hole; the first limiting block is connected with the first sliding table. Through rotating first regulation pole, first regulation pole drives first slip table and removes on first fixed block to drive thimble subassembly, absorption subassembly and remove in X axle direction, set up the first limiting plate of first stopper cooperation and restrict the sliding range of first slip table on first fixed plate, concrete sliding range is decided by the size in first spacing hole, can set up first spacing hole into corresponding size according to different regulation requirements, and the practicality is strong.
Further, the Y-direction adjustment assembly includes: the second sliding table is arranged on the second fixed block, the second adjusting block is arranged on one side of the second fixed block, and the second adjusting rod is in threaded connection with the second adjusting block; the second adjusting rod is connected with the second sliding table, and the second fixing block is installed on the first sliding table.
Further, a second limiting plate is further arranged on one side of the second fixing block, a second limiting hole is formed in the second limiting plate, and a second limiting block is arranged in the second limiting hole; the second limiting block is connected with the second sliding table. Through rotating the second adjusting rod, the second adjusting rod drives the second sliding table to move on the second fixing block, so that the ejector pin assembly and the adsorption assembly are driven to move in the Y-axis direction, the second limiting block is arranged to be matched with the second limiting plate to limit the sliding range of the second sliding table on the second fixing plate, the specific sliding range is determined by the size of the second limiting hole, the second limiting hole can be set to be corresponding according to different adjusting requirements, and the practicability is high.
Further, the fixing base includes: the base is arranged on the adjusting seat on one side of the base; the Z-direction adjusting assembly comprises: the hand-screwed screw is in threaded connection with the base, and the first spring is sleeved on the hand-screwed screw; one end of the hand-screwed screw rod is connected with the adjusting seat. The X-direction adjusting assembly and the Y-direction adjusting assembly are arranged on the adjusting seat, the hand-screwed screw is arranged on the base, a sliding groove is formed in the base, and the adjusting seat is arranged in the sliding groove; and in the Z-direction adjusting process, a hand-operated screw rod is screwed, and the hand-operated screw rod drives the adjusting seat to move in the sliding groove, so that the lifting is realized, and the distance from the adsorption component to the crystal ring is adjusted.
Further, a mounting seat is arranged on the second sliding table, and the first driving device and the adsorption assembly are mounted on the mounting seat.
Further, the thimble assembly includes: the guide shaft, the steel needle chuck arranged at one end of the guide shaft, the thimble arranged on the steel needle chuck, the second spring sleeved on the guide shaft and the positioning block sleeved on the guide shaft; the guide shaft is connected with the output end of the first driving device, and the second spring is arranged between the positioning block and the mounting seat. The first driving device drives the guide shaft to move towards the side close to the ejector pin, the second spring is compressed, the guide shaft pushes the steel pin chuck and the ejector pin to move upwards, and the ejector pin jacks up the wafer so that the wafer is separated from the wafer ring; the positioning block can limit the ascending and descending positions of the guide shaft driven by the first driving device.
Further, the adsorption assembly includes: the electromagnetic valve is connected with the top needle cylinder. After the centering and positioning are finished, the electromagnetic valve is started, so that the ejector pin cylinder is sucked to be vacuum, and the wafer is adsorbed on the ejector pin cylinder.
Furthermore, a grating ruler is further arranged on the mounting seat.
By adopting the scheme, the utility model provides an adjustable thimble of XYZ three-direction can adjust the position of adsorption component, thimble subassembly in X, Y, Z direction for adsorption component, thimble subassembly and brilliant ring are in the centering position, avoid pushing up phenomenons such as inclined to one side, bursting brilliant ring membrane, improve and paste dress precision; when the wafer is adsorbed, one ends of the ejector pin component and the adsorption component are in contact with the wafer, so that the wafer has an acting point in an adsorption state, the stability in the adsorption process is ensured, and the wafer is prevented from falling off and being damaged.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural view of another aspect of the present invention;
FIG. 3 is a schematic structural view of the thimble assembly of the present invention;
FIG. 4 is a schematic structural view of the fixing base and the Z-direction adjusting assembly of the present invention;
fig. 5 is a schematic structural diagram of the X-direction adjusting assembly and the Y-direction adjusting assembly of the present invention.
Wherein: the device comprises a fixed seat 1, a base 10, an adjusting seat 11, an X-direction adjusting assembly 2, a first fixed block 20, a first sliding table 21, a first adjusting block 22, a first adjusting rod 23, a first limiting plate 24, a first limiting hole 25, a first limiting block 26, a Y-direction adjusting assembly 3, a second fixed block 30, a second sliding table 31, a second adjusting block 32, a second adjusting rod 33, a second limiting plate 34, a second limiting hole 35, a second limiting block 36, a Z-direction adjusting assembly 4, a hand-screwed screw 40, a first spring 41, a thimble assembly 5, a guide shaft 50, a steel needle clamp head 51, a thimble 52, a second spring 53, a positioning block 54, an adsorption assembly 6, an electromagnetic valve 60, a thimble tube 61, a mounting seat 7, a first driving device 70 and a grating ruler 71.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1-5, the present invention provides an adjustable thimble in XYZ three directions, including: the device comprises a fixed seat 1, an X-direction adjusting component 2, a Y-direction adjusting component 3, a Z-direction adjusting component 4, a first driving device 70, an ejector pin component 5 and an adsorption component 6, wherein the X-direction adjusting component 2, the Y-direction adjusting component 3 and the Z-direction adjusting component 4 are arranged on the fixed seat 1; the X-direction adjusting assembly 2 is used for adjusting the positions of the ejector pin assembly 5 and the adsorption assembly 6 in the X direction, the Y-direction adjusting assembly 3 is used for adjusting the positions of the ejector pin assembly 5 and the adsorption assembly 6 in the Y direction, and the Z-direction adjusting assembly 4 is used for adjusting the height from the adsorption assembly 6 to a wafer ring; the adsorption component 6 is used for adsorbing the wafer, and the thimble component 5 is used for jacking up the wafer and separating the wafer from the wafer ring. Before the wafer is adsorbed, the relative positions of the adsorption component 6, the thimble component 5 and the wafer ring are respectively adjusted through the X-direction adjusting component 2, the Y-direction adjusting component 3 and the Z-direction adjusting component 4, so that the adsorption component 6, the thimble component 5 and the wafer ring are in the centering position, and the surface mounting precision is effectively improved; on the other hand, set up thimble assembly 5 in adsorption component 6, when adsorbing the wafer, the one end of thimble assembly 5, adsorption component 6 all contacts with the wafer for the wafer has the impetus when being in the adsorption state, thereby guarantees the stability in the adsorption process, prevents that the wafer from droing and damaging.
Specifically, in this embodiment, the X-direction adjustment assembly 2 includes: the sliding table adjusting mechanism comprises a first fixed block 20, a first sliding table 21 arranged on the first fixed block 20, a first adjusting block 22 arranged on one side of the first fixed block 20, and a first adjusting rod 23 in threaded connection with the first adjusting block 22; the first adjusting rod 23 is connected with the first sliding table 21. A first limit plate 24 is further arranged on one side of the first fixed block 20, a first limit hole 25 is arranged on the first limit plate 24, and a first limit block 26 is arranged in the first limit hole 25; the first stopper 26 is connected to the first sliding table 21. Through rotating first regulation pole 23, first regulation pole 23 drives first slip table 21 and moves on first fixed block 20 to drive thimble subassembly 5, adsorption component 6 removes in the X axle direction, set up the slip range of first slip table 21 on first fixed plate 20 of the first limiting plate 24 of first stopper 26 cooperation restriction, specific slip range is decided by the size of first spacing hole 25, can set up first spacing hole 25 into corresponding size according to different regulation requirements, the practicality is strong.
Specifically, in this embodiment, the Y-direction adjusting assembly 3 includes: the sliding table device comprises a second fixed block 30, a second sliding table 31 arranged on the second fixed block 30, a second adjusting block 32 arranged on one side of the second fixed block 31, and a second adjusting rod 33 in threaded connection with the second adjusting block 32; the second adjusting rod 33 is connected with the second sliding table 31, and the second fixing block 30 is mounted on the first sliding table 21. A second limiting plate 34 is further arranged on one side of the second fixing block 30, a second limiting hole 35 is formed in the second limiting plate 34, and a second limiting block 36 is arranged in the second limiting hole 35; the second stopper 36 is connected to the second slide table 31. Through rotating second regulation pole 33, second regulation pole 33 drives second slip table 31 and moves on second fixed block 30 to drive thimble subassembly 5, adsorption component 6 removes in Y axle direction, it restricts the slip range of second slip table 31 on second fixed plate 30 to set up second stopper 36 cooperation second limiting plate 34, specific slip range is decided by the size of the spacing hole 35 of second, can set up the spacing hole 35 of second into corresponding size according to different regulation requirements, therefore, the clothes hanger is strong in practicability. The second sliding table 31 is provided with a mounting seat 7, and the first driving device 70 and the adsorption assembly 6 are both mounted on the mounting seat 7. And a grating ruler 71 is further arranged on the mounting seat 7.
Specifically, in this embodiment, the fixing base 1 includes: a base 10, an adjusting seat 11 arranged on one side of the base 10; the Z-direction adjusting component 4 comprises: a hand screw 40 in threaded connection with the base 10, and a first spring 41 sleeved on the hand screw 40; one end of the hand-screwed screw rod 41 is connected with the adjusting seat 11. The X-direction adjusting assembly 2 and the Y-direction adjusting assembly 3 are both arranged on the adjusting seat 11, the hand-screwed screw 40 is arranged on the base 10, the base 10 is provided with a sliding groove, and the adjusting seat 11 is arranged in the sliding groove; in the Z-direction adjusting process, the manual screw 40 is screwed, and the manual screw 40 drives the adjusting seat 11 to move in the sliding groove, so that the lifting is realized, and the distance from the adsorption component 6 to the crystal ring is adjusted.
Specifically, in this embodiment, the ejector pin assembly 5 includes: the device comprises a guide shaft 50, a steel needle chuck 51 arranged at one end of the guide shaft 50, a thimble 52 arranged on the steel needle chuck 51, a second spring 53 sleeved on the guide shaft 50, and a positioning block 54 sleeved on the guide shaft 50; the guide shaft 50 is connected to an output end of the first driving device 70, and the second spring 53 is disposed between the positioning block 54 and the mounting seat 7. The first driving device 70 drives the guide shaft 50 to move towards the side close to the thimble 52, the second spring 53 is compressed, the guide shaft 50 pushes the steel needle chuck 51 and the thimble 50 to move upwards, and the thimble 50 jacks up the wafer, so that the wafer is separated from the wafer ring; the positioning block 54 can limit the position where the first driving device 70 drives the guide shaft 50 to ascend and descend. The adsorption component 6 includes: an electromagnetic valve 60, and a thimble tube 61 connected to the electromagnetic valve 60. After the centering positioning is completed, the solenoid valve 60 is actuated to suck a vacuum in the top cylinder 61, thereby sucking the wafer onto the top cylinder 61.
To sum up, the utility model provides an adjustable thimble in XYZ three directions, can adjust the position of adsorption component, thimble subassembly in X, Y, Z directions, make adsorption component, thimble subassembly and brilliant ring be in the centering position, avoid pushing up phenomenons such as inclined to one side, bursting brilliant ring membrane, improve and paste dress precision; when the wafer is adsorbed, one ends of the ejector pin component and the adsorption component are in contact with the wafer, so that the wafer has an acting point in an adsorption state, the stability in the adsorption process is ensured, and the wafer is prevented from falling off and being damaged.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The utility model provides a thimble with adjustable XYZ three-direction, its characterized in that includes: the device comprises a fixed seat, an X-direction adjusting assembly, a Y-direction adjusting assembly, a Z-direction adjusting assembly, a first driving device, a thimble assembly and an adsorption assembly, wherein the X-direction adjusting assembly, the Y-direction adjusting assembly and the Z-direction adjusting assembly are arranged on the fixed seat; the X-direction adjusting assembly is used for adjusting the positions of the ejector pin assembly and the adsorption assembly in the X direction, the Y-direction adjusting assembly is used for adjusting the positions of the ejector pin assembly and the adsorption assembly in the Y direction, and the Z-direction adjusting assembly is used for adjusting the height from the adsorption assembly to the crystal ring; the adsorption component is used for adsorbing the wafer, and the ejector pin component is used for jacking up the wafer and enabling the wafer to be separated from the wafer ring.
2. The XYZ three-direction adjustable thimble according to claim 1, wherein the X-direction adjusting assembly comprises: the sliding table comprises a first fixed block, a first sliding table arranged on the first fixed block, a first adjusting block arranged on one side of the first fixed block, and a first adjusting rod in threaded connection with the first adjusting block; the first adjusting rod is connected with the first sliding table.
3. The XYZ three-direction adjustable thimble according to claim 2, wherein a first limiting plate is further disposed on one side of the first fixing block, a first limiting hole is disposed on the first limiting plate, and a first limiting block is disposed in the first limiting hole; the first limiting block is connected with the first sliding table.
4. The XYZ three-direction adjustable thimble according to claim 2, wherein said Y-direction adjusting unit comprises: the second sliding table is arranged on the second fixed block, the second adjusting block is arranged on one side of the second fixed block, and the second adjusting rod is in threaded connection with the second adjusting block; the second adjusting rod is connected with the second sliding table, and the second fixing block is installed on the first sliding table.
5. The XYZ three-direction adjustable thimble according to claim 4, wherein a second limiting plate is further disposed on one side of the second fixing block, a second limiting hole is disposed on the second limiting plate, and a second limiting block is disposed in the second limiting hole; the second limiting block is connected with the second sliding table.
6. The XYZ three-direction adjustable thimble according to claim 1, wherein said fixing base comprises: the base is arranged on the adjusting seat on one side of the base; the Z-direction adjusting assembly comprises: the hand-screwed screw is in threaded connection with the base, and the first spring is sleeved on the hand-screwed screw; one end of the hand-screwed screw rod is connected with the adjusting seat.
7. The XYZ three-direction adjustable ejector pin according to claim 4, wherein the second slide table is provided with a mounting seat, and the first driving device and the adsorption assembly are both mounted on the mounting seat.
8. The XYZ three-direction adjustable thimble according to claim 7, wherein said thimble assembly comprises: the guide shaft, the steel needle chuck arranged at one end of the guide shaft, the thimble arranged on the steel needle chuck, the second spring sleeved on the guide shaft and the positioning block sleeved on the guide shaft; the guide shaft is connected with the output end of the first driving device, and the second spring is arranged between the positioning block and the mounting seat.
9. The XYZ three-direction adjustable thimble according to claim 1, wherein said adsorption assembly comprises: the electromagnetic valve is connected with the top needle cylinder.
10. The XYZ three-direction adjustable thimble according to claim 7, wherein said mounting base is further provided with a grating ruler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023287634.XU CN214152865U (en) | 2020-12-29 | 2020-12-29 | Thimble with adjustable XYZ three-direction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023287634.XU CN214152865U (en) | 2020-12-29 | 2020-12-29 | Thimble with adjustable XYZ three-direction |
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| Publication Number | Publication Date |
|---|---|
| CN214152865U true CN214152865U (en) | 2021-09-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023287634.XU Active CN214152865U (en) | 2020-12-29 | 2020-12-29 | Thimble with adjustable XYZ three-direction |
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| Country | Link |
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| CN (1) | CN214152865U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114211248A (en) * | 2021-12-31 | 2022-03-22 | 深圳新益昌科技股份有限公司 | Automatic chip mounting device |
-
2020
- 2020-12-29 CN CN202023287634.XU patent/CN214152865U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114211248A (en) * | 2021-12-31 | 2022-03-22 | 深圳新益昌科技股份有限公司 | Automatic chip mounting device |
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