CN110112093A - One kind falls to encapsulate chip flexible top needle operation means and system - Google Patents
One kind falls to encapsulate chip flexible top needle operation means and system Download PDFInfo
- Publication number
- CN110112093A CN110112093A CN201910517814.5A CN201910517814A CN110112093A CN 110112093 A CN110112093 A CN 110112093A CN 201910517814 A CN201910517814 A CN 201910517814A CN 110112093 A CN110112093 A CN 110112093A
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- Prior art keywords
- thimble
- connect
- chip
- operation means
- ejector pin
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- 230000033001 locomotion Effects 0.000 claims abstract description 55
- 230000007246 mechanism Effects 0.000 claims abstract description 47
- 238000005538 encapsulation Methods 0.000 claims description 19
- 238000007667 floating Methods 0.000 claims description 18
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 7
- 239000000835 fiber Substances 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 230000006872 improvement Effects 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000004100 electronic packaging Methods 0.000 description 3
- POIUWJQBRNEFGX-XAMSXPGMSA-N cathelicidin Chemical compound C([C@@H](C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CO)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H]([C@@H](C)CC)C(=O)NCC(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](C(C)C)C(=O)N[C@@H](CCC(N)=O)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CC(N)=O)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](C(C)C)C(=O)N1[C@@H](CCC1)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)O)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CO)C(O)=O)NC(=O)[C@H](CC=1C=CC=CC=1)NC(=O)[C@H](CC(O)=O)NC(=O)CNC(=O)[C@H](CC(C)C)NC(=O)[C@@H](N)CC(C)C)C1=CC=CC=C1 POIUWJQBRNEFGX-XAMSXPGMSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
This application discloses one kind to fall to encapsulate chip flexible top needle operation means and system, it is connect by servo motor with cam, swing rod is connect with cam, therefore the rotation of servo motor driving cam can drive the up and down motion of swing rod, ejector pin component is connect by thimble soft readjustment spring and tension adjustable pole with thimble seat, thimble on thimble seat is held thimble by thimble soft readjustment spring, setting can be adjusted in the pulling force of thimble soft readjustment spring by tension adjustable pole, thimble soft readjustment spring is when being greater than pre set force by external force, thimble can retract, reach the flexible contact of thimble and chip with this, the height of chip jack-up can only be controlled by adjusting the stroke of thimble by solving existing ejector pin mechanism, there is technical issues that thimble damage chip when attachment pushes absorption chip.
Description
Technical field
This application involves Electronic Packagings and manufacturing technology field, more particularly to a kind of encapsulation chip flexibility thimble operation dress
It sets and system.
Background technique
With the fast development of power electronic technique, the market demand of electronic device increasingly increases, and integrated chip, which becomes, to be worked as
The rapid growth point of modern global economic development, becomes the basic and strategic industry concerning national economy and social development.
Later process of the Electronic Packaging as integrated chip industry, chip pick-up process are indispensable in Electronic Packaging
One critical process step completes for the first time transfer of the monolithic die from blue ilm substrate to pick-up head, to be connected subsequent industry
Process, such as vision guide patch, bonding, and the operation that integrated chip is jacked up and is removed need using ejector pin mechanism into
Row, traditional ejector pin mechanism are merely able to complete quickly to jack up thimble, can only jack up by adjusting the stroke of thimble to control chip
Height, with guarantee attachment suction nozzle do not damage chip by pressure in absorption chip, cannot achieve thimble flexible contact chip, there are thimbles
The risk of chip is damaged when attachment pushes absorption chip.
Summary of the invention
The embodiment of the present application provides a kind of encapsulation chip flexible top needle operation means and system, existing to solve
Ejector pin mechanism can only control the height of chip jack-up by adjusting the stroke of thimble, and there are thimbles when attachment pushes absorption chip
The technical issues of damaging the risk of chip.
In view of this, the application first aspect provides a kind of encapsulation chip flexible top needle operation means, comprising: bottom
Seat, flexible motion mechanism and ejector pin component；
The flexible motion mechanism is mounted on the base；
The ejector pin component is mounted on the carrier base of the flexible motion mechanism by thimble seat supporting plate；
The flexible motion mechanism include: the carrier base, thimble soft readjustment spring, tension adjustable pole, servo motor,
Cam and swing rod；
The thimble soft readjustment spring is connect with the tension adjustable pole；
The ejector pin component passes through the thimble soft readjustment spring and the tension adjustable pole and the ejector pin component
Thimble seat connection；
The servo motor is connect by the cam with the swing rod；
The swing rod is connect with the thimble seat；
The ejector pin component includes: the thimble seat, thimble, tailstock barrel, thimble lock sleeve and thimble rod；
The thimble seat is mounted on the thimble seat supporting plate, is connect with the thimble rod；
The thimble rod is connect with the thimble；
The tailstock barrel is socketed at the thimble rod and the thimble link position；
The thimble lock sleeve is mounted on the tailstock barrel, for locking the thimble.
Preferably, further includes: thimble guard assembly；
The thimble guard assembly is socketed in the ejector pin component；
The thimble guard assembly includes fixed plate, support base, cover board, floating bushing and sensing chip；
The support base is mounted in the fixed plate；
The fixed plate, the support base and the cover plate central are provided with the through-hole penetrated for the floating bushing；
The floating bushing is connect by tension spring with the carrier base；
Described sensing chip one end is connect with the floating bushing, and the other end is connect with fiber sensor.
Preferably, the ejector pin component further include: thimble cap, thimble equipped with the first vacuum hole and the thimble needle outlet
Bar guide sleeve and sleeve；
The thimble rod guide sleeve is connect with the thimble rod；
The sleeve is socketed in the outermost layer of the ejector pin component；
The side wall of the sleeve is equipped with the second vacuum hole, second vacuum hole by cavity in the sleeve with it is described
The connection of first vacuum hole；
Second vacuum hole is connect with vacuum valve；
The plug for being provided with sealing ring in the sleeve and connecting with the sealing ring forms vacuum chamber with the cavity.
Preferably, further includes: X/Y precision adjusts platform；
The X/Y precision adjustment stage+module is between the pedestal and the flexible motion mechanism.
Preferably, further includes: Z-direction motion platform；
The Z-direction motion platform is mounted between the X/Y precision adjustment platform and the flexible motion mechanism.
Preferably, the quantity of the tension spring is three, and three tension springs are arranged in 120 angles.
Preferably, the ejector pin component further includes tailstock barrel briquetting；
The tailstock barrel briquetting is symmetrically sleeved and fixed on the outside of the tailstock barrel, is fixedly connected with the tailstock barrel；
Described tension adjustable pole one end connects the tailstock barrel briquetting, and other end connection passes through the thimble soft readjustment bullet
Spring connects the thimble seat supporting plate.
Preferably, the Z-direction motion platform is cylinder.
The application second aspect provides a kind of encapsulation chip flexibility thimble operating system, including as described in relation to the first aspect
It is any fall encapsulation chip flexible top needle operation means.
The application third aspect additionally provide it is a kind of fall encapsulation chip flexibility thimble operating system, including controller and such as the
It is any described in one side to fall to encapsulate chip flexible top needle operation means；
The controller and the encapsulation chip flexible top needle operation means electrical connection.
As can be seen from the above technical solutions, the embodiment of the present application has the advantage that
In the application, provide it is a kind of fall encapsulation chip flexible top needle operation means, comprising: pedestal flexible motion mechanism and
Ejector pin component；Flexible motion mechanism is mounted on the base；Ejector pin component is mounted on flexible motion mechanism by thimble seat supporting plate
On carrier base；Flexible motion mechanism include: carrier base, thimble soft readjustment spring, tension adjustable pole, servo motor, cam and
Swing rod；Thimble soft readjustment spring is connect with tension adjustable pole；Ejector pin component is adjusted by thimble soft readjustment spring and pulling force
Bar and the thimble seat of ejector pin component connect；Servo motor is connect by cam with swing rod；Swing rod is connect with thimble seat；Ejector pin component
It include: thimble seat, thimble, tailstock barrel, thimble lock sleeve and thimble rod；Thimble seat is mounted on thimble seat supporting plate, with thimble rod
Connection；Thimble rod is connect with thimble；Tailstock barrel is socketed at thimble rod and thimble link position；Thimble lock sleeve is mounted on thimble
It puts on, for locking thimble.Provided herein falls to encapsulate chip flexible top needle operation means, passes through servo motor and cam
Connection, swing rod are connect with cam, therefore the rotation of servo motor driving cam can drive the up and down motion of swing rod, ejector pin component
It is connect by thimble soft readjustment spring and tension adjustable pole with thimble seat, the thimble on thimble seat passes through thimble soft readjustment bullet
Spring holds thimble, and setting, thimble soft readjustment can be adjusted in the pulling force of thimble soft readjustment spring by tension adjustable pole
When being greater than pre set force by external force, thimble can retract spring, and the flexible contact of thimble and chip is reached with this, solve existing
Ejector pin mechanism can only by adjust thimble stroke come control chip jack-up height, there are thimble attachment push absorption chip
When damage chip risk the technical issues of.
Detailed description of the invention
Fig. 1 is a kind of overall structure signal of encapsulation chip flexible top needle operation means embodiment provided by the present application
Figure；
Fig. 2 is the structural schematic diagram of the flexible motion mechanism provided in the embodiment of the present application；
Fig. 3 is the thimble guard assembly structural schematic diagram provided in the embodiment of the present application；
Fig. 4 is the partial structural diagram of Fig. 1；
Fig. 5 is the structural schematic diagram of the ejector pin component provided in the embodiment of the present application；
Fig. 6 is the building block structural schematic diagram of the thimble guard assembly in Fig. 5；
Fig. 7 is the structural schematic diagram that X/Y precision adjusts platform；
Wherein, appended drawing reference are as follows:
1, pedestal；2, Z-direction motion platform；3, vacuum valve；4, thimble guard assembly；5, ejector pin component；6, servo motor；7,
Cam；8, swing rod；9, tailstock barrel briquetting；10, fiber sensor；11, sensing chip；12, fixed plate；13, support base；14, cover board；
15, floating bushing；16, thimble seat supporting plate；17, micro actuator；18, thimble cap；19, thimble lock sleeve；20, thimble；21, tailstock barrel；
22, thimble seat；23, thimble rod guide sleeve；24, thimble rod；25, plug；26, sealing ring；27, fabrication hole；28, tension spring；29, Y-direction
Intersect spherical guide；30, X to intersect spherical guide；31, Z-direction intersects spherical guide；32, carrier base；33, thimble soft readjustment
Spring；34, tension adjustable pole；35, X/Y precision adjusts platform；36, the first vacuum hole；37 second vacuum holes.
Specific embodiment
In order to make those skilled in the art more fully understand application scheme, below in conjunction in the embodiment of the present application
Attached drawing, the technical scheme in the embodiment of the application is clearly and completely described, it is clear that described embodiment is only this
Apply for a part of the embodiment, instead of all the embodiments.Based on the embodiment in the application, those of ordinary skill in the art exist
Every other embodiment obtained under the premise of creative work is not made, shall fall in the protection scope of this application.
In order to make it easy to understand, Fig. 1 to Fig. 6 is please referred to, a kind of encapsulation chip flexibility thimble operation dress provided by the present application
One embodiment set, comprising: pedestal 1, flexible motion mechanism and ejector pin component 5；
Flexible motion mechanism is mounted on pedestal 1；
Ejector pin component 5 is mounted on the carrier base 32 of flexible motion mechanism by thimble seat supporting plate 16；
Flexible motion mechanism include: carrier base 32, thimble soft readjustment spring 33, tension adjustable pole 34, servo motor 6,
Cam 7 and swing rod 8；
Thimble soft readjustment spring 33 is connect with tension adjustable pole 34；
Ejector pin component 5 is connect by thimble soft readjustment spring 33 and tension adjustable pole 34 with the thimble seat of ejector pin component 5；
Servo motor 6 is connect by cam 7 with swing rod 8；
Swing rod 8 is connect with thimble seat；
Ejector pin component 5 includes: thimble seat 22, thimble 20, tailstock barrel 21, thimble lock sleeve 19 and thimble rod 24；
Thimble seat 22 is mounted on thimble seat supporting plate 16, is connect with thimble rod 24；
Thimble rod 24 is connect with thimble；
Tailstock barrel 21 is socketed at thimble rod 24 and thimble link position；
Thimble lock sleeve 19 is mounted on tailstock barrel 21, for locking thimble 20.
It should be noted that as shown in Figure 1, the flexible motion mechanism in the embodiment of the present application is mounted on pedestal 1, it is flexible
The structural schematic diagram of movement mechanism is as shown in Fig. 2, flexible motion mechanism includes carrier base 32, thimble soft readjustment spring 33, draws
Draft control lever 34, servo motor 6, cam 7 and swing rod 8；Thimble soft readjustment spring 33 is connect with tension adjustable pole 34；Thimble group
Part 5 is connect by thimble soft readjustment spring 33 and tension adjustable pole 34 with the thimble seat 22 of ejector pin component 5；Servo motor 6 is logical
Cam 7 is crossed to connect with swing rod 8；Swing rod 8 is connect with thimble seat.
What is provided in the embodiment of the present application falls to encapsulate chip flexible top needle operation means, passes through servo motor 6 and cam 7 connects
It connects, swing rod 8 is connect with cam 7, therefore the rotation of the driving cam 7 of servo motor 6 can drive the up and down motion of swing rod 8, thimble
Component 5 is connect by thimble soft readjustment spring 33 and tension adjustable pole 34 with thimble seat 22, and the thimble on thimble seat 22 passes through
Thimble soft readjustment spring 33 holds thimble 20, and the pulling force of thimble soft readjustment spring 33 can be carried out by tension adjustable pole 34
Adjust setting, thimble soft readjustment spring 33 by external force be greater than pre set force when, thimble can retract, with this reach thimble 20 with
The flexible contact of chip, the height of chip jack-up can only be controlled by adjusting the stroke of thimble 20 by solving existing ejector pin mechanism
Degree there is technical issues that thimble damage chip when attachment pushes absorption chip.
In order to make it easy to understand, please referring to Fig. 1 to Fig. 6, the application provides the another of encapsulation chip flexible top needle operation means
One embodiment, comprising: pedestal 1, flexible motion mechanism and ejector pin component 5；
Flexible motion mechanism is mounted on pedestal 1；
Ejector pin component 5 is mounted on the carrier base 32 of flexible motion mechanism by thimble seat supporting plate 16；
Flexible motion mechanism include: carrier base 32, thimble soft readjustment spring 33, tension adjustable pole 34, servo motor 6,
Cam 7 and swing rod 8；
Thimble soft readjustment spring 33 is connect with tension adjustable pole 34；
Ejector pin component 5 is connected by thimble soft readjustment spring 33 and tension adjustable pole 34 and the thimble seat 22 of ejector pin component 5
It connects；
Servo motor 6 is connect by cam 7 with swing rod 8；
Swing rod 8 is connect with thimble seat 22；
Ejector pin component 5 includes: thimble seat 22, thimble 20, tailstock barrel 21, thimble lock sleeve 19 and thimble rod 24；
Thimble seat 22 is mounted on thimble seat supporting plate 16, is connect with thimble rod 24；
Thimble rod 24 is connect with thimble 20；
Tailstock barrel 21 is socketed at thimble rod 24 and 20 link position of thimble；
Thimble lock sleeve 19 is mounted on tailstock barrel 21, for locking thimble 20.
Further, further includes: thimble guard assembly 4；
Thimble guard assembly 4 includes fixed plate 12, support base 13, cover board 14, floating bushing 15 and sensing chip 11；
Support base 13 is mounted in fixed plate 12；
Fixed plate 12, support base 13 and 14 center of cover board are provided with the through-hole penetrated for floating bushing 15；
Floating bushing 15 is connect by tension spring 28 with carrier base 32；
11 one end of sensing chip is connect with floating bushing 15, and the other end is connect with fiber sensor 10.
It should be noted that as an improvement, the embodiment of the present application on the basis of previous embodiment, is pushed up for preferably protection
The safety of needle 20 at work has installed additional on the outside of ejector pin component 5 and has been additionally provided with thimble guard assembly 4, in the embodiment of the present application
4 structural schematic diagram of thimble guard assembly of offer as shown in figure 3, Fig. 6 is the building block structural schematic diagram of thimble guard assembly,
Floating bushing 15 is connect by three tension springs 28 with carrier base 32,32 center of carrier base is suspended in, when floating bushing 15 is by any side
To external force when, floating bushing 15 will be swung, at the same drive sensing chip 11 move, achieve the purpose that judgement, can effectively prevent pushing up
Needle 20 when moving to Wafer plate edge, damage thimble 20 by wafer fixed disk, therefore, when no matter from all directions power
When pressing on the floating bushing 15 of thimble guard assembly 4, floating bushing 15 can be subjected to displacement, and fiber sensor 10 is with regard to detectable change
Change, reaches the state of shutdown, to protect the work safety of thimble 20.
As an improvement, the embodiment of the present application is on the basis of previous embodiment, further includes: X/Y precision adjusts platform 35 and Z
To motion platform 2；X/Y precision adjustment platform 35 is mounted between pedestal 1 and flexible motion mechanism；Z-direction motion platform 2 is mounted on
X/Y precision adjusts between platform 35 and flexible motion mechanism.
It should be noted that as shown in Figure 1, what is provided in the embodiment of the present application falls to encapsulate chip flexible top needle operation means
Including pedestal 1, X/Y precision adjustment platform 35, Z-direction motion platform 2, flexible motion mechanism and ejector pin component 5, pass through X/Y precision
The displacement in X-direction and Y-direction to ejector pin component 5 may be implemented in adjustment platform 35, may be implemented by Z-direction motion platform 2
To the displacement in the Z-direction of ejector pin component 5, the X/Y precision adjustment platform 35 and Z-direction motion platform 2 of thimble are rolled by X to intersection
Pearl guide rail and Y-direction intersect spherical guide, connect with pedestal 1, and it is complete to adjust the micro actuator 17 on 35 connecting plate of platform by X/Y precision
At X, the accurate adjustment of Y-direction, the structure of the X/Y precision adjustment platform 35 in the application is as shown in fig. 7, X/Y in the application
Precision adjustment platform 35 is the prior art, is not carried out in structure to existing X/Y precision adjustment platform 35 in the embodiment of the present application
Improvement, herein without being described in detail.Z-direction motion platform 2 can be cylinder, realize thimble group by the piston motion of cylinder
The Z-direction of part 5 is displaced.
What is provided in the embodiment of the present application falls to encapsulate chip flexible top needle operation means, passes through X/Y precision and adjusts platform 35
The travel displacement on tri- directions X, Y and Z of ejector pin component 5, servo motor 6 and cam 7 may be implemented with Z-direction motion platform 2
Connection, swing rod 8 are connect with cam 7, therefore servo motor 6 drives the rotation of cam 7 that can drive the up and down motion of swing rod 8, pushes up
Needle assemblies 5 are connect by thimble soft readjustment spring 33 and tension adjustable pole 34 with thimble seat 22, and the thimble on thimble seat 22 is logical
Thimble soft readjustment spring 33 is crossed to hold thimble 20, the pulling force of thimble soft readjustment spring 33 can by tension adjustable pole 34 into
Row adjusts setting, and when being greater than pre set force by external force, thimble 20 can retract thimble soft readjustment spring 33, reach thimble with this
20 with the flexible contact of chip, the height of chip jack-up can only be controlled by adjusting the stroke of thimble by solving existing ejector pin mechanism
Degree there is technical issues that thimble damage chip when attachment pushes absorption chip.
As an improvement, the quantity of the tension spring 28 in the embodiment of the present application is three, three tension springs 28 can in the setting of 120 angles
To realize the stress balance on 360 degree of directions, the accuracy of judging result is improved.
Further, ejector pin component 5 further includes 21 briquetting 9 of tailstock barrel；
21 briquetting 9 of tailstock barrel is symmetrically sleeved and fixed in 21 outside of tailstock barrel, is fixedly connected with tailstock barrel 21；
34 one end of tension adjustable pole connects 21 briquetting 9 of tailstock barrel, and other end connection is connected by thimble soft readjustment spring 33
Connect thimble seat supporting plate 16.
It should be noted that as an improvement, what is provided in the embodiment of the present application falls to encapsulate chip flexible top needle operation means
Including 21 briquetting 9 of tailstock barrel, for fastening ejector pin component 5, thus in thimble soft readjustment spring 33 and tension adjustable pole 34
Under effect, the movement of ejector pin component 5 is driven.
In order to make it easy to understand, please referring to Fig. 1 to Fig. 6, the application provides encapsulation chip flexible top needle operation means again
One embodiment, comprising: pedestal 1, flexible motion mechanism and ejector pin component 5；
Flexible motion mechanism is mounted on pedestal 1；
Ejector pin component 5 is mounted on the carrier base 32 of flexible motion mechanism by thimble seat supporting plate 16；
Flexible motion mechanism include: carrier base 32, thimble soft readjustment spring 33, tension adjustable pole 34, servo motor 6,
Cam 7 and swing rod 8；
Thimble soft readjustment spring 33 is connect with tension adjustable pole 34；
Ejector pin component 5 is connect by thimble soft readjustment spring 33 and tension adjustable pole 34 with the thimble seat of ejector pin component 5；
Servo motor 6 is connect by cam 7 with swing rod 8；
Swing rod 8 is connect with thimble seat；
Ejector pin component 5 includes: thimble seat, thimble, tailstock barrel 21, thimble lock sleeve 19 and thimble rod 24；
Thimble seat 22 is mounted on thimble seat supporting plate 16, is connect with thimble rod 24；
Thimble rod 24 is connect with thimble 20；
Tailstock barrel 21 is socketed at thimble rod 24 and 20 link position of thimble；
Thimble lock sleeve 19 is mounted on tailstock barrel 21, for locking thimble 20.
Further, ejector pin component 5 further include: thimble cap 18, thimble equipped with the first vacuum hole 36 and thimble needle outlet
Seat, 24 guide sleeve 23 of thimble rod and sleeve；
24 guide sleeve 23 of thimble rod is connect with thimble rod 24；
Sleeve is socketed in the outermost layer of ejector pin component 5；
The side wall of sleeve is equipped with the second vacuum hole 37, and the second vacuum hole 37 passes through the cavity and the first vacuum hole 36 in sleeve
Connection；
Second vacuum hole 37 is connect with vacuum valve 3；
It is provided with sealing ring 26 and the plug connecting with sealing ring 26 25 in sleeve, forms vacuum chamber with cavity.
It should be noted that improvement embodiment of the embodiment of the present application as both of the aforesaid embodiment, traditional thimble machine
Realize that the mode of vacuum suction chip uses circumscribed in structure, volume is larger, so that ejector pin mechanism can not minimize, mechanism cannot
It is simplified and optimizes, for the micromation for realizing ejector pin mechanism, it is necessary to improve to this problem, be in the embodiment of the present application
The structure design method of the second vacuum hole 37 is opened in the micromation for realizing ejector pin mechanism using sleeve lateral wall, is connected to 21 chamber of tailstock barrel
Body, thus realize that vacuum can make the first vacuum hole 36 of thimble cap 18 generate vacuum by the second vacuum hole 37 of side, it is real
The micromation of existing vacuum mechanism.To adsorb the blue film on wafer, guarantee that thimble smoothly ejects chip, the application is real
The structural schematic diagram of the ejector pin component 5 provided in example is applied as shown in figure 5, needing to adsorb on wafer when 20 contact chip of thimble
When blue film, the valve by opening vacuum valve 3 carries out vacuumize process to vacuum cavity, when needing to remove chip, by true
The valve that empty valve 3 closes vacuum valve 3 releases vacuum suction effect and removes chip.
Additionally provided in the application it is a kind of fall to encapsulate the embodiment of chip flexibility thimble operating system, in the embodiment of the present application
The encapsulation chip flexibility thimble operating system of falling provided includes in aforementioned encapsulation chip flexible top needle operation means embodiment
It is any to fall to encapsulate chip flexible top needle operation means.
Another embodiment for encapsulating chip flexibility thimble operating system, the embodiment of the present application are additionally provided in the application
The encapsulation chip flexibility thimble operating system of falling of middle offer includes controller and aforementioned encapsulation chip flexible top needle operation means
Any one of embodiment, which is fallen, encapsulates chip flexible top needle operation means, controller and the encapsulation chip flexible top needle operation means that fall
Electrical connection.
The above, above embodiments are only to illustrate the technical solution of the application, rather than its limitations；Although referring to before
Embodiment is stated the application is described in detail, those skilled in the art should understand that: it still can be to preceding
Technical solution documented by each embodiment is stated to modify or equivalent replacement of some of the technical features；And these
It modifies or replaces, the spirit and scope of each embodiment technical solution of the application that it does not separate the essence of the corresponding technical solution.
Claims (10)
1. one kind falls to encapsulate chip flexible top needle operation means characterized by comprising pedestal, flexible motion mechanism and thimble
Component；
The flexible motion mechanism is mounted on the base；
The ejector pin component is mounted on the carrier base of the flexible motion mechanism by thimble seat supporting plate；
The flexible motion mechanism includes: the carrier base, thimble soft readjustment spring, tension adjustable pole, servo motor, cam
And swing rod；
The thimble soft readjustment spring is connect with the tension adjustable pole；
The thimble that the ejector pin component passes through the thimble soft readjustment spring and the tension adjustable pole and the ejector pin component
Seat connection；
The servo motor is connect by the cam with the swing rod；
The swing rod is connect with the thimble seat；
The ejector pin component includes: the thimble seat, thimble, tailstock barrel, thimble lock sleeve and thimble rod；
The thimble seat is mounted on the thimble seat supporting plate, is connect with the thimble rod；
The thimble rod is connect with the thimble；
The tailstock barrel is socketed at the thimble rod and the thimble link position；
The thimble lock sleeve is mounted on the tailstock barrel, for locking the thimble.
2. according to claim 1 fall to encapsulate chip flexible top needle operation means, which is characterized in that further include: thimble is anti-
Protecting assembly；
The thimble guard assembly is socketed in the ejector pin component；
The thimble guard assembly includes fixed plate, carrier base, cover board, floating bushing and sensing chip；
The carrier base is mounted in the fixed plate；
The fixed plate, the carrier base and the cover plate central are provided with the through-hole penetrated for the floating bushing；
The floating bushing is connect by tension spring with the carrier base；
Described sensing chip one end is connect with the floating bushing, and the other end is connect with fiber sensor.
3. according to claim 1 or 2 fall to encapsulate chip flexible top needle operation means, which is characterized in that the thimble group
Part further include: thimble cap, thimble rod guide sleeve and sleeve equipped with the first vacuum hole and the thimble needle outlet；
The thimble rod guide sleeve is connect with the thimble rod；
The sleeve is socketed in the outermost layer of the ejector pin component；
The side wall of the sleeve is equipped with the second vacuum hole, and second vacuum hole passes through the cavity and described first in the sleeve
Vacuum hole connection；
Second vacuum hole is connect with vacuum valve；
The plug for being provided with sealing ring in the sleeve and connecting with the sealing ring forms vacuum chamber with the cavity.
4. according to claim 1 fall to encapsulate chip flexible top needle operation means, which is characterized in that further include: X/Y is accurate
Adjust platform；
The X/Y precision adjustment stage+module is between the pedestal and the flexible motion mechanism.
5. according to claim 4 fall to encapsulate chip flexible top needle operation means, which is characterized in that further include: Z-direction movement
Platform；
The Z-direction motion platform is mounted between the X/Y precision adjustment platform and the flexible motion mechanism.
6. according to claim 2 fall to encapsulate chip flexible top needle operation means, which is characterized in that the quantity of the tension spring
It is three, three tension springs are arranged in 120 angles.
7. according to claim 1 or 2 fall to encapsulate chip flexible top needle operation means, which is characterized in that the thimble group
Part further includes tailstock barrel briquetting；
The tailstock barrel briquetting is symmetrically sleeved and fixed on the outside of the tailstock barrel, is fixedly connected with the tailstock barrel；
Described tension adjustable pole one end connects the tailstock barrel briquetting, and other end connection is connected by the thimble soft readjustment spring
Connect the thimble seat supporting plate.
8. according to claim 5 fall to encapsulate chip flexible top needle operation means, which is characterized in that the Z-direction movement is flat
Platform is cylinder.
9. one kind falls to encapsulate chip flexibility thimble operating system, which is characterized in that including as described in any one of claim 1-8
Fall encapsulation chip flexible top needle operation means.
10. one kind falls to encapsulate chip flexibility thimble operating system, which is characterized in that including controller and as in claim 1-8
It is described in any item to fall to encapsulate chip flexible top needle operation means；
The controller and the encapsulation chip flexible top needle operation means electrical connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910517814.5A CN110112093B (en) | 2019-06-14 | 2019-06-14 | Flexible ejector pin operating device and system for inverted packaging chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910517814.5A CN110112093B (en) | 2019-06-14 | 2019-06-14 | Flexible ejector pin operating device and system for inverted packaging chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110112093A true CN110112093A (en) | 2019-08-09 |
| CN110112093B CN110112093B (en) | 2024-02-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910517814.5A Active CN110112093B (en) | 2019-06-14 | 2019-06-14 | Flexible ejector pin operating device and system for inverted packaging chip |
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| CN115451097A (en) * | 2022-11-11 | 2022-12-09 | 上海捷策创电子科技有限公司 | High-thrust high-precision jacking and pulling-down device for chip testing |
| WO2023185924A1 (en) * | 2022-04-01 | 2023-10-05 | 颀中科技（苏州）有限公司 | Cleaning device for vacuum hole of chip bonding head |
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| Publication number | Publication date |
|---|---|
| CN110112093B (en) | 2024-02-09 |
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