WO2023185924A1 - Cleaning device for vacuum hole of chip bonding head - Google Patents

Cleaning device for vacuum hole of chip bonding head Download PDF

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Publication number
WO2023185924A1
WO2023185924A1 PCT/CN2023/084687 CN2023084687W WO2023185924A1 WO 2023185924 A1 WO2023185924 A1 WO 2023185924A1 CN 2023084687 W CN2023084687 W CN 2023084687W WO 2023185924 A1 WO2023185924 A1 WO 2023185924A1
Authority
WO
WIPO (PCT)
Prior art keywords
ejector pin
block
positioning
ejector
cleaning device
Prior art date
Application number
PCT/CN2023/084687
Other languages
French (fr)
Chinese (zh)
Inventor
陈秀龙
Original Assignee
颀中科技(苏州)有限公司
合肥颀中科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 颀中科技(苏州)有限公司, 合肥颀中科技股份有限公司 filed Critical 颀中科技(苏州)有限公司
Publication of WO2023185924A1 publication Critical patent/WO2023185924A1/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/30Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00Accessories or details of general applicability for machines or apparatus for cleaning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25BTOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to the technical field of semiconductor production, and in particular to a vacuum hole cleaning device for chip pressure joints.
  • Bonding is a common process in the chip packaging production process.
  • Chip crimping joints are mainly used to crimp the aligned products.
  • the above-mentioned chip pressure joint is provided with a number of vacuum holes.
  • the corresponding chip is adsorbed on the surface of the chip pressure joint through the negative pressure formed in the vacuum hole and moves toward the substrate as the chip pressure joint moves.
  • the chip pressure joint is also used to attach the chip pressure joint to the substrate.
  • the surface of the metal bumps of the chip is heated and melted, so that the metal bumps are fixedly connected to the corresponding pins on the surface of the substrate.
  • the object of the present invention is to provide a chip pressure joint vacuum hole cleaning device, which facilitates the adjustment of the ejector pin, improves the adjustment accuracy of the ejector pin protrusion length, and can be better applied to various applications.
  • the same chip crimping joint avoids ejector pin damage caused by improper ejector pin setting.
  • the vacuum hole cleaning device of the chip pressure joint provided by the present invention includes a bracket, a bearing component for positioning the chip pressure joint, and an ejector pin assembly; the ejector pin assembly is slidably disposed on the bracket along the vertical direction and is located on the side of the bearing component. upper side;
  • the ejector pin assembly includes an ejector pin installation block, an ejector pin, a positioning block that presses and fixes the ejector pin on the ejector pin installation block, and an ejector pin fine-tuning mechanism;
  • the ejector pin fine-adjustment mechanism includes a micro-adjustment member, an ejector support block and a positioning component for positioning the ejector pin on the ejector support block; the micro-adjustment member extends along the vertical direction and is threadedly connected to the ejector pin. On the mounting block; the micro-adjustment member cooperates with the ejector pin support block so that the ejector pin support block can move in the vertical direction when the micro-adjustment member is screwed.
  • the ejector pin support block is installed on the micro-adjustment member along the circumferential rotation of the micro-adjustment member, and the ejector pin support block is configured to limit the axial direction of the micro-adjustment member. direction movement.
  • the micro-adjustment member is provided with a connecting portion for installing the ejector mounting block and axial limiting portions provided on both upper and lower sides of the connecting portion; the ejector support block is provided with a connecting portion corresponding to the ejector pin mounting block.
  • the connection part is matched with a support block mounting hole; the ejector support block is sleeved outside the connection part and is vertically limited by the axial limiting parts on both sides.
  • the positioning assembly includes an ejector pin positioning groove and an ejector pin pressing member provided on the ejector pin support block.
  • the ejector pin pressing member is threadedly connected to the ejector pin support block and connects the ejector pin The ejector pin is pressed and positioned in the pressing groove.
  • the ejector pin assembly also has a guide mechanism provided on the ejector pin mounting block, and the ejector pin mounting block is provided with a guide hole that matches the guide mechanism, and the The guide mechanism can move up and down along the guide hole; the guide mechanism has a columnar structure and extends along the vertical direction, and the guide mechanism is parallel to the micro-adjustment member.
  • the front side of the ejector pin mounting block is provided with a positioning groove that opens toward the front side; the positioning block is detachably installed and fixed on the ejector pin mounting block. After the positioning block is locked and fixed, the positioning block presses and positions the ejector pin in the positioning groove.
  • the depth of the positioning groove is smaller than the diameter of the ejector pin.
  • the ejector pin mounting block also has a rotation limiting portion protruding in the forward direction, the rotation limiting portion is provided on the ejector pin mounting block, and the rotation limiting portion is provided On the side of the positioning block, and used to abut with the positioning block to limit the rotation of the positioning block.
  • the ejection pin mounting block includes a body part and a mounting part disposed on the front side of the body part and close to the bottom, the mounting part protrudes from the body part to the front side; the positioning part The block is provided on the mounting part.
  • the bottom end of the positioning block is flush with the bottom end of the mounting part, and the size of the positioning block is adapted to the size of the mounting part.
  • the embodiment of the present invention can conveniently adjust the position of the ejector pin through the setting of the fine-tuning mechanism.
  • the fine-tuning mechanism adopts a threaded micro-adjusting member for adjustment, and the ejector pin is controlled by controlling the depth of the screw-in of the micro-adjusting member.
  • Figure 1 is a schematic diagram of the overall working state of the vacuum hole cleaning device of the chip pressure joint of the present application
  • Figure 2 is a schematic plan view of the vacuum hole cleaning device of the chip pressure joint in Figure 1;
  • Figure 3 is a schematic plan view of the vacuum hole cleaning device of the chip pressure joint in Figure 2 from another angle;
  • Figure 4 is a partial structural cross-section of the vacuum hole cleaning device of the chip pressure joint in Figure 2 along the AA direction. view;
  • Figure 5 is a partial structural schematic diagram of the vacuum hole cleaning device of the chip pressure joint of the present application.
  • Figure 6 is a structural schematic diagram from another angle of the partial structure of the vacuum hole cleaning device of the chip pressure joint in Figure 5;
  • Figure 7 is an exploded structural schematic diagram of part of the structure of the vacuum hole cleaning device of the chip pressure joint in Figure 5;
  • Figure 8 is a schematic structural diagram of the ejector pin in the vacuum hole cleaning device of the chip pressure joint applied for after being positioned by the micro-adjustment mechanism;
  • Figure 9 is an exploded view of Figure 8.
  • Figure 10 is a schematic diagram of the disassembled structure of the drive shaft and operating rod in the vacuum hole cleaning device of the chip pressure joint;
  • Figure 11 is a schematic structural diagram of the installation box in the vacuum hole cleaning device of the chip pressure joint
  • 100-Chip pressure joint vacuum hole cleaning device 10-bracket; 11-bottom plate; 12-back plate; 121-first slide rail; 122-connection hole; 123-auxiliary stroke limiter; 13-side plate; 131- The second slide rail; 14-installation box; 141-drive positioning groove; 142-extension arm avoidance groove; 20-carrying component; 21-first adjustment mechanism; 211-first base plate; 212-first adjustment plate; 22- Second adjustment mechanism; 221-second base plate; 222-second adjustment plate; 223-adjustment piece; 224-limiting plate; 225-locking piece; 23-carrying plate; 24-pressure joint positioning block; 25-stroke Limit block; 30-ejector pin assembly; 301-ejector pin; 31-ejector pin installation block; 311-body part; 312-installation part; 313-rotation limit part; 32-ejector pin support block; 321-micro-adjustment piece; 3211- Threaded section; 3212-connection part; 3213-axial limit part; 3214
  • the chip pressure joint vacuum hole cleaning device 100 provided by the present invention is mainly used to clear and clean the vacuum holes of the chip pressure joint 200.
  • the chip pressure joint vacuum hole cleaning device 100 includes a bracket 10, installed on The bearing assembly 20, the ejector assembly 30 and the driving assembly are on the bracket.
  • the carrying component 20 is used to position the chip crimping joint 200 and adjust the position of the chip crimping joint 200 so that the chip crimping joint 200 is positioned relative to the ejection pin assembly 30;
  • the ejection pin assembly 30 includes a movable extension to The ejector pin 301 is inserted into the vacuum hole of the chip pressing joint 200 to complete the cleaning work;
  • the driving component is used to drive the ejector pin component 30 to move toward or away from the carrying component 20 .
  • the vacuum hole of the chip pressing head 200 positioned on the carrier assembly 20 is opposite to the position of the ejection pin 301.
  • the driving assembly is used to control the ejection pin assembly 30 to move closer to or away from the carrier assembly 20, so that The ejector pin 301 moves in and out of the vacuum hole, thereby clearing the vacuum hole.
  • the ejector pin assembly 30 is slidably disposed on the bracket 10 in the vertical direction, and the ejector pin assembly 30 is disposed on the bearing in the vertical direction.
  • the driving assembly drives the ejector assembly 30 to slide on the bracket 10 in the vertical direction, and approach or move away from the load-bearing assembly 20 during the sliding process to clean the ejector pin assembly 30 positioned on the load-bearing assembly 20. Vacuum hole of die press head 200.
  • the ejector assembly 30 is arranged in the vertical direction of the bearing assembly 20, and the driving assembly only needs to pass By applying a downward force, the ejector pin assembly 30 can be controlled to move toward the load-bearing assembly 20 located on the lower side, making manipulation more convenient.
  • the driving assembly includes a reset mechanism
  • the ejector pin assembly 30 includes an ejector pin frame, the ejector pin 301 is positioned on the ejector pin frame, the ejector pin frame is slidably disposed on the bracket 10 in the vertical direction, and the driving mechanism drives the The ejector pin holder slides along the bracket 10 .
  • the bracket 10 includes a bottom plate 11 , a back plate 12 and a side plate 13 .
  • the bottom plate 11 is arranged horizontally, and the load-bearing component 20 is fixedly installed on the bottom plate 11;
  • the back plate 12 is arranged in a vertical direction, and the load-bearing component 20 and the ejector assembly 30 are located on the back plate 12 Front side;
  • the side plate 13 is also arranged in the vertical direction, and the load-bearing assembly 20 and the ejector assembly 30 are located on the same side of the side plate 13 .
  • the aforementioned “horizontal”, “vertical” and “front side” are only for convenience of understanding, and are described based on the accompanying drawings when the chip pressure head vacuum hole cleaning device 100 is in a predetermined placement state.
  • the ejector pin rack is slidably disposed on the back plate 12 in the vertical direction, and the ejector pin rack is also slidably disposed on the side plate 13 in the vertical direction.
  • the side plate 13 can make the up and down sliding of the ejector pin frame more stable. Since the ejector pin needs to penetrate the vacuum hole during its up and down movement, the gap between the two is relatively small.
  • the stable sliding of the ejector pin holder can effectively avoid the deviation of the ejector pin holder position due to errors during the sliding process, thereby causing The position of the ejector pin 301 is shifted, so that the ejector pin 301 and the vacuum hole are not properly connected, which effectively avoids the problem of the ejector pin 301 being damaged after not being inserted into the vacuum hole.
  • the side plates 13 are arranged perpendicularly to the back plate 12 , and both the side plates 13 and the back plate 12 are perpendicularly arranged on the bottom plate 11 .
  • the side plate 13 is provided only on one side of the back plate 12 , thereby forming a working space opening toward the front side and opening toward the side on the bracket 10 .
  • the side plate 13 is provided only on one side so that the other side opposite to the side plate 13 is open to the outside.
  • the arrangement of the above structure can more conveniently realize the adjustment of the position of the load-bearing assembly 20 . Since the carrier assembly 20 needs to be adjusted in the horizontal direction along the front, rear, left and right directions to realize the docking of the vacuum hole on the chip crimping joint 200 positioned on the carrier assembly 20 with the ejection pin 301, it is necessary to leave a large enough space for the adjustment of the carrier assembly 20. room for adjustment.
  • the arrangement of the above structure not only facilitates the adjustment of the carrier component 20 but also facilitates the installation and positioning of the chip pressure joint 200 on the carrier component 20 .
  • the side plate 13 provided on one side of the bracket 10 ensures the support strength of the bracket 10 while providing stable sliding support for the ejector pin frame, and also provides the bracket 10 with a wider operating space.
  • the ejector rack is provided with a first slider 36 that is slidably disposed along the back plate 12 and a second slider 38 that is slidably disposed along the side plate 13 .
  • a first slide rail 121 is adapted to the slide block 36.
  • the side plate 13 is provided with a second slide rail 131 that is adapted to the second slide block 38.
  • the first slide rail 121 and the second slide rail 121 are provided on the side plate 13.
  • the slide rails 131 are arranged to extend vertically.
  • the first slide block 36 is formed with a first guide groove 361 that matches the first slide rail 121 .
  • first slide rail 121 and the first guide groove 361 are only exemplary structural descriptions of the present application.
  • guide rails may be provided on the first slide block 36 and in the The back plate 12 is provided with guide grooves, which will not be described again here.
  • the second slide block 38 is formed with a second guide groove 381 that matches the second slide rail 131 .
  • the ejector pin frame includes a first fixing plate 34, a second fixing plate 37 arranged perpendicularly to each other, and an ejector mounting block 31 provided on the first fixing plate 34 and the second fixing plate 37.
  • the first sliding The block 36 is fixed on the first fixing plate 34
  • the first fixing plate 34 extends in a direction parallel to the back plate 12
  • the second fixing plate 37 extends in a direction parallel to the side plate 13 Extended
  • the second slider 38 is fixed on the second fixing plate 37 .
  • the ejector pin mounting block 31 is fixed on the first fixing plate 34 and the second fixing plate 37 at the same time.
  • the driving assembly drives the first fixing plate 34 to move up and down in the vertical direction.
  • the front side of the ejector pin mounting block 31 is provided with a positioning groove that opens toward the front side.
  • the ejector pin 301 is positioned in the positioning groove. After the ejector pin 301 is positioned in the positioning groove, one end of the ejector pin 301
  • the bottom surface of the ejection pin mounting block 31 protrudes downward, and the protruding part of the ejection pin 301 is used to be inserted into the vacuum adsorption hole on the chip pressure connector 200 and used to clean the vacuum adsorption hole.
  • the ejector pin assembly also has a positioning block 33 provided on the ejector pin installation block 31.
  • the positioning block 33 is detachably installed and fixed on the ejector pin installation block 31.
  • the ejector pin 301 is pressed and positioned in the locating groove after the positioning block 33 is locked and positioned on the ejector pin mounting block 31 .
  • the depth of the positioning groove is smaller than the diameter of the ejector pin 301, so that after the ejector pin 301 is positioned in the positioning groove, part of the ejector pin 301 protrudes from the positioning groove in the opening direction of the positioning groove, that is, the positioning groove is positioned.
  • the slot cannot completely accommodate the ejector pin 301; the positioning block 33 is provided with a contact portion opposite to the position of the positioning groove and relatively abutting. After the positioning block 33 is installed and positioned, the contact portion and the protruding positioning Some of the ejector pins 301 in the grooves are in contact with each other to realize the installation and fixation of the ejector pins 301 .
  • the positioning block 33 can be fixed on the ejector pin installation block 31 by bolts. After the bolts are threadedly connected to the ejector pin installation block 31, the positioning block 33 is pressed and fixed on the ejector pin installation block 31. After the positioning block 33 is pressed and fixed on the ejector pin mounting block 31, the positioning block 33 presses and fixes the ejector pin 301.
  • the setting of the above structure can adjust the positioning of the ejector pin 301 by adjusting the tightening of the bolt.
  • the ejector pin 301 is locked and positioned in the positioning groove.
  • the positioning block 33 resists the ejector pin 301.
  • the ejector pin 301 can move in the vertical direction in the positioning groove, thereby adjusting the length of the ejector pin 301 protruding downward from the ejector pin mounting block 31 to be suitable for various chip crimping joints 200 .
  • the positioning block 33 is provided with bolt holes that are adapted to the bolts.
  • the bolts pass through the bolt holes and are threadedly connected to the thimble mounting block 31 , and the nuts of the bolts are pressed against the bolt holes.
  • the outer surface of the positioning block 33 is provided with bolt holes that are adapted to the bolts.
  • the ejector pin mounting block 31 includes a body part 311 and a mounting part 312 disposed on the front side of the body part 311 and close to the bottom.
  • the mounting part 312 extends from the body part 311. 311 protrudes from the front side, and the body portion 311 is fixed on the side plate 13 and the back plate 12 .
  • the positioning groove is provided on the mounting part 312 and penetrates the mounting part 312 in the vertical direction.
  • the positioning block 33 is installed on the mounting part 312 .
  • the size of the mounting portion 312 in the vertical direction is smaller than the size of the body portion 311 in the vertical direction. The installation and fixation of the ejector pin can be conveniently achieved by the arrangement of the mounting portion 312 .
  • the bottom end of the positioning block 33 is flush with the bottom end of the mounting part 312, and the size of the positioning block 33 is consistent with the size of the mounting part 312.
  • the arrangement of such a structure enables the positioning block 33 to realize the pressing and positioning of the positioning ejector pin 301 in the vertical direction of the entire mounting part 312 when positioning the ejector pin 301.
  • the ejector pin mounting block 31 also has a rotation limiter 313 protruding in the forward direction.
  • the rotation limiter The rotation limiting portion 313 is provided on the body portion 131 and the rotation limiting portion 313 is provided on the side of the positioning block 33 and is used to abut the positioning block 33 to limit the positioning block 33 in the circumferential direction of the bolt. of rotation.
  • the bolts need to be loosened first to slow down the pressing force of the positioning block 33 on the positioning ejector pin 301.
  • the positioning ejector pin 301 can move in the vertical direction in the positioning groove, but In actual use, the adjustment of the downward protruding length of the positioning ejector pin 301 is mostly controlled by human hands, which has poor accuracy and may easily cause inaccurate control of the protruding length of the positioning ejector pin 301 .
  • this The embodiment also has an ejector fine-tuning mechanism, which includes a fine-adjusting member 321 and an ejector support block 32 that cooperates with the fine-adjusting member 321.
  • Part of the ejector support block 32 is extended on the mounting part 312. side, and has a positioning component for positioning the ejector pin 301, and the ejector pin 301 is positioned on the ejector pin support block 32 through the positioning component.
  • the ejector pin support block 32 is installed on the micro-adjustment member 321 along the circumferential rotation of the micro-adjustment member 321, and the ejector pin support block 32 is configured to limit movement in the axial direction of the micro-adjustment member 321;
  • the ejector pin mounting block 31 is provided with a threaded hole that opens upward.
  • the micro-adjusting member 321 is provided with a threaded section 3211 that matches the threaded hole.
  • the ejector pin is driven by screwing the micro-adjusting member 321.
  • the support block 32 moves in the vertical direction to adjust the height of the ejector pin 301 in the vertical direction.
  • the micro-adjusting member 321 is threadedly installed on the rotation limiting portion 313. Since the rotation limiting portion 313 is formed by protruding outward from the body portion 311, connection and fixation can be achieved more conveniently.
  • the micro-adjustment member 321 is provided with a connecting portion 3212 for installing the ejector pin mounting block 31 and axial limiting portions 3213 provided on the upper and lower sides of the connecting portion 3212 .
  • the ejector pin support block 32 It is sleeved outside the connecting part 3212 and is vertically limited by the axial limiting parts 3213 on both sides.
  • the connecting portion 3212 and the axial limiting portions 3213 on both sides form a trough, and the ejector support block 32 is positioned in the trough. It can be understood that the ejector support block 32 is provided with a support block mounting hole 323 that is adapted to the connecting portion 3212 .
  • the ejector pin support block 32 is provided with a notch that communicates with the support block installation hole 323.
  • the notch is connected to the support block installation hole 323.
  • the arrangement is actually to form a support block positioning groove on the ejector support block 32 that matches the connection part 3212, and the support block positioning groove is locked on the connection part 3212.
  • the positioning assembly includes an ejector pin positioning groove 325 provided on the ejector pin support block 32 and an ejector pin pressing member 326.
  • the ejector pin pressing member 326 is threadedly connected to the ejector pin support block 32 and has a function to offset the ejector pin 301. Connected to the pressing part, the ejector pin pressing member 326 presses and positions the ejector pin 301 in the pressing groove 326.
  • the ejector pin pressing member 326 is a bolt threadedly connected to the ejector pin support block 32 .
  • the micro-adjustment member 321 is also provided with a rotation control part 3214.
  • the rotation control part 3214 is coaxially arranged with the thread segment 3211, and the rotation control part 3214 is coaxial with the threaded section 3211.
  • the threaded segments 3211 are disposed oppositely at both ends of the fine adjustment member 321 , and the connecting portion 3212 is disposed between the rotation control portion 3214 and the threaded segments 3211 .
  • the cross-section of the rotary control part 3214 is circular, and the cross-sectional size of the rotary control part 3214 is larger than the cross-sectional size of the threaded section 3211, so that the rotation of the threaded section 3211 can be controlled conveniently.
  • the ejector pin assembly also has a guide mechanism 322 provided on the ejector pin installation block 31, so
  • the ejector pin mounting block 31 is provided with a guide hole that is adapted to the guide mechanism 322.
  • the guide hole has a clearance fit with the guide mechanism 322, and the guide mechanism 322 can move along the guide mechanism 322.
  • the guide hole moves up and down.
  • the guide mechanism 322 has a columnar structure and extends along the vertical direction.
  • the micro-adjusting member 321 also has a columnar structure and extends along the vertical direction.
  • the guide mechanism 322 and the micro-adjustment member 322 are connected with each other.
  • the adjusting members 321 are arranged side by side and their extending directions are parallel to each other.
  • the cross-section shape of the guide mechanism 322 may be circular or rectangular. In this embodiment, the cross-section of the guide mechanism 322 is square.
  • the guide hole is a blind hole provided on the ejector pin mounting block 31 .
  • the ejector pin assembly 30 also has an auxiliary support block provided on the ejector pin installation block 31.
  • the auxiliary support block is installed and fixed with the ejector pin installation block 31 in the vertical direction, and the auxiliary support block The front side of the ejector pin support block 32 is adjacent to the ejector pin support block 32.
  • the arrangement of the auxiliary support block can also effectively prevent the ejector pin support block 32 from rotating with the micro-adjustment member 321 during the adjustment process of the micro-adjustment member 321.
  • the reset mechanism includes a compression spring 43 and a spring positioning plate 44.
  • the spring positioning plate 44 is provided on the bracket 10.
  • One end of the compression spring 43 is positioned on the spring positioning plate 44.
  • the compression spring The other end of 43 is located on the lower side of the ejector pin assembly 30 and is used to offset the ejector pin assembly 30 .
  • the ejector pin assembly 30 moves downward under the action of external force. After moving to the position of the compression spring 43, it offsets the compression spring 43 and compresses the compression spring 43. At this time, the compression spring 43 accumulates rebound force. After the external force is removed, the rebound force of the compression spring 43 The elastic force drives the ejector pin assembly 30 to move upward.
  • the setting of the reset mechanism facilitates the reset movement of the ejector pin assembly 30, thereby facilitating the reuse of the device.
  • the ejector pin assembly 30 is provided with a first spring positioning hole for positioning the compression spring 43
  • the spring positioning plate 44 is provided with a first spring positioning hole for positioning the compression spring 43.
  • the second spring positioning hole 441 has two ends of the compression spring 43 positioned in the first spring positioning hole and the second spring positioning hole 441 respectively.
  • Connecting and fixing the two ends of the compression spring 43 with the ejector pin assembly 30 and the spring positioning plate 44 respectively can better realize the use of the compression spring 43, making the compression spring 43 more efficient during use. of stability.
  • the load-bearing assembly 20 includes a first adjustment mechanism 21 , a second adjustment mechanism 22 and a load-bearing plate 23 that are stacked in sequence.
  • the first adjustment mechanism 21 includes a first base plate 211 fixed on the bottom plate 11 of the bracket 10 and a first adjustment plate 212 slidably disposed on the first base plate along the first direction X;
  • the second adjustment mechanism 22 includes a second base plate 221 fixed on the first adjustment plate 212 and a second adjustment plate 222 slidably disposed along a second direction Y perpendicular to the first direction X;
  • the carrier plate 23 is fixed on the first adjustment plate 212 .
  • the two adjustment plates 222 are used to position the chip pressing head 200 .
  • the first direction X and the second direction Y are the front-to-back and left-right directions respectively.
  • the first adjustment mechanism 21 and the second adjustment mechanism 22 jointly realize the position adjustment of the carrier plate 23 and the chip pressure joint 200 in the horizontal direction. .
  • the first adjustment plate 212 has a dovetail groove with an opening facing the first base plate 211, and the first base plate 211 is provided with a dovetail groove that is suitable for the dovetail groove.
  • the first base plate 211 is also provided with a locking mechanism for locking and fixing the relative positional relationship between the first base plate 211 and the first adjustment plate 212 .
  • the second adjustment plate 222 has a dovetail groove that opens toward the second base plate 221, and the second base plate 221 is provided with a dovetail tenon that matches the dovetail groove; the second base plate 221 is also provided with a locking mechanism for locking and fixing the relative positional relationship between the second base plate 221 and the second adjustment plate 222 .
  • the locking mechanism includes an adjustment member 223, a limiting plate 224 fixed on the second base plate 221, and a locking member 225.
  • the position of the second adjusting plate 222 in the second direction Y is first adjusted through the adjusting member 223, and then the position of the second adjusting plate 222 is adjusted through the locking member 223.
  • the fastener 225 locks the second adjustment plate 222 and the second base plate 221 .
  • the limiting plate 224 is also formed with a strip hole extending along the second direction Y, and the locking member 225 is inserted through the strip hole.
  • the structural designs of the first adjustment mechanism 21 and the second adjustment mechanism 22 are similar and will not be described again.
  • the bearing plate 23 is provided with a crimping head positioning groove and a crimping head positioning block 24 arranged next to the crimping head positioning groove.
  • the crimping head positioning block 24 is detachably installed and fixed on the bearing plate 23 and has an extension.
  • the crimping positioning part is provided on the upper side of the crimping joint positioning groove.
  • the chip crimping joint 200 generally includes a base 201 and a crimping part 202 fixed on the base 201 ; the crimping joint positioning groove is provided on the upper surface of the carrier plate 23 .
  • the press joint positioning block 24 is generally configured as a pressure plate and securely mounts the base 201 of the chip press joint 200 on the carrier plate 23 through fixing bolts.
  • the load-bearing assembly 20 also includes a ejector pin assembly 30 fixed on the load-carrying plate 23 and matching with the ejector pin assembly 30 .
  • the stroke limiting block 25 is disposed on the lower side of the ejector pin assembly 30 and is used to limit the maximum descending stroke of the ejector pin assembly 30 .
  • the travel limiter 25 can be directly provided on the bracket 10 or on the load-bearing assembly 20 .
  • the limiting block 25 is disposed on the bearing plate 23 of the bearing assembly 20 .
  • the driving assembly includes a driving shaft 41 rotatably installed on the bracket 10 and an extension arm 411 provided on the side wall of the driving shaft 41.
  • the ejector pin assembly 30 is provided with a driving Block 35, the driving block 35 is provided with a driving bearing portion 351; the driving block 35 is fixed between the ejection pin mounting block 31 and the back plate 12, and the driving block 35 is installed and fixed on the ejection pin.
  • the drive shaft 41 has an initial state and a pressed state:
  • the extension arm 411 extends above the drive bearing part 351; in the initial state, the position of the drive shaft rear 41 prevents the extension arm 411 from pressing down on the drive bearing part 351. ;
  • the driving shaft 41 rotates and drives the extension arm 411 to swing.
  • the end of the extension arm 411 away from the driving shaft 41 is against the driving bearing part 351 and presses down the driving bearing part 351.
  • the driving bearing The portion 351 is pressed down and moves and drives the ejector pin assembly 30 to move downward.
  • the rotation of the drive shaft 41 realizes the swing of the extension arm 411 and controls the movement of the drive bearing part 351 when the extension arm 411 swings.
  • the arrangement of the above structure facilitates the movement control of the ejector pin assembly 30 .
  • the extension arm 411 has a fixed end fixed on the drive shaft 41 and a free end opposite to the fixed end; There is a cam structure 412 protruding toward the drive bearing portion 351 .
  • the arrangement of the cam structure 412 makes the free end of the extension arm 411 tend to move toward the driving block bearing portion 351 , and the movement control of the driving block 35 can be easily realized during the swing of the driving shaft 41 .
  • a cam structure is provided at the end of the extension arm 411 so that the The extension arm 411 will not cause damage to the surface of the driving bearing portion 351 during the pressing fit with the driving bearing portion 351 .
  • the driving block 35 is provided with an extension arm through hole 350.
  • the drive bearing portion 351 is a bearing surface provided on the bottom wall of the extension arm through hole 350.
  • the extension arm 411 extends within the extension arm through hole 350. , and the size of the extending arm through hole 350 in the vertical direction is consistent with the size of the cam structure 412 in the vertical direction.
  • the extension arm perforation 350 is provided to position the extension arm 411 perforation, so that the swing of the extension arm 411 and the driving block 35 can be synchronized conveniently, thereby realizing the synchronous movement of the extension arm 411 and the ejection pin assembly 30, and conveniently realizing the ejection pin assembly according to the
  • the position of the ejection pin assembly 30 is determined by the position of the extension arm 411, thereby better controlling the ejection pin assembly 30 by the extension arm 411.
  • the ejector pin assembly 30 is slidably installed on the back plate 12 along the vertical direction; in order to facilitate the installation of the drive shaft 41, the drive shaft 41 is rotatably installed on the back plate 12 away from the back plate 12.
  • a connection hole 122 matching the extension arm 411 is formed on the back plate 12. After the drive shaft 41 is installed and positioned, the extension arm 411 passes through the connection hole 122. , and the driving shaft 41 is disposed at the middle position of the connecting hole 122 in the vertical direction.
  • the driving shaft 41 is disposed in the middle of the connecting hole 122 , and a space for swinging the extension arm 411 is formed between the driving shaft 41 and the bottom wall of the connecting hole 122 .
  • Arranging the drive shaft 41 on the side of the back plate 12 away from the ejector assembly 30 can better realize the installation and fixation of the drive shaft 41 , facilitate the disassembly and maintenance of the drive shaft 41 , and effectively prevent the drive shaft 41 from being arranged on the ejector pin.
  • Mutual interference occurs when components 30 are on the same side.
  • the bottom wall of the connecting hole 122 is formed with a hole for abutting the extension arm 411 to limit the
  • the auxiliary stroke limiter 123 restricts the downward movement of the extension arm 411.
  • the arrangement of the auxiliary stroke limiter 123 can limit the downward movement stroke of the entire ejector pin mechanism 30 by limiting the movement stroke of the extension arm 411, thereby effectively preventing the problem of ejector pin damage caused by excessive descent of the ejector pin mechanism 30.
  • the bracket 10 also has a mounting box 14 that is detachably mounted and fixed on the side of the back plate 12 away from the ejector assembly 30.
  • the mounting box 14 is provided with a mounting box facing the back plate.
  • a drive shaft positioning groove 141 with an opening of 12 and an extension arm relief groove 142 with an opening toward the back plate 12 are provided on the lower side of the drive shaft positioning groove 141 and connected with the drive shaft.
  • the positioning grooves 141 are connected, the driving shaft 41 is set and positioned in the driving shaft positioning groove 141 by the cover, and the driving shaft 41 can rotate in the circumferential direction in the driving shaft positioning groove 141 .
  • the installation box 14 is provided and detachably installed and fixed on the back plate 12 to facilitate the maintenance and disassembly of the drive shaft 41 .
  • the driving assembly also has an operating rod 42 fixedly connected to the driving shaft 41 , and the operating rod 42 extends along the radial direction of the driving shaft 41 .
  • One end of the driving shaft 41 extends outside the bracket 10 and is formed with an operating lever mounting portion 413 .
  • the operating lever 42 is detachably mounted and fixed on the operating lever mounting portion 413 .
  • the operating lever mounting portion 413 has a rectangular cross-section, and the operating lever 42 is provided with an operating lever positioning hole 421 that matches the operating lever mounting portion 413.
  • the driving mechanism also has an operating lever locking mechanism 45, so The operating rod locking mechanism 45 is threadedly installed on the operating rod mounting portion 413 and locks the operating rod 42 on the operating rod mounting portion 413 .
  • the extension arm 411 extends along the radial direction of the drive shaft 41, and the extension The extending direction of the arm 411 intersects the extending direction of the operating lever 42.
  • the extending direction of the operating lever 42 extends obliquely upward relative to the horizontal direction.
  • the predetermined chip pressure joint 200 is first fixed on the carrier component 20, and the first adjustment mechanism 21 and the second adjustment mechanism 22 are used to achieve precise positioning of the chip pressure joint 200, so that the predetermined vacuum hole is exactly Located at the lower end of the ejector pin 301; and then use the operating rod 42 to drive the ejector pin assembly 30 downward to complete the cleaning operation.
  • the position of the ejector pin 301 can also be fine-tuned on site; repeat the operation, and the above steps can be completed one after another. Dredge and clean the vacuum hole of the chip crimping joint 200 .
  • the chip pressure joint vacuum hole cleaning device 100 can conveniently drive the ejector pin 301 of the ejector pin assembly 30 to move through the driving assembly to clean the vacuum hole of the chip pressure joint 200.
  • the on-site operation is more convenient, is conducive to improving production efficiency, and effectively reduces the cost of the chip pressure joint.
  • the risk of abnormal damage during the cleaning process of the chip press head 200 is eliminated to better meet production needs.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A cleaning device (100) for a vacuum hole of a chip bonding head, comprising a support (10), a bearing assembly (20), and an ejector pin assembly (30); the ejector pin assembly (30) is slidably provided on the support (10); the ejector pin assembly (30) comprises an ejector pin mounting block (31), an ejector pin (301), a positioning block (33) and an ejector pin fine adjustment mechanism; the ejector pin fine adjustment mechanism comprises a fine adjustment member (321), an ejector pin supporting block (32) and a positioning assembly; the fine adjustment member (321) is threadedly connected to the ejector pin mounting block (31); the fine adjustment member (321) is mated with the ejector pin supporting block (32). The positioning of the ejector pin (301) is controlled by controlling the fine adjustment member (321), so that the adjustment precision of a protruding length of the ejector pin (301) is improved.

Description

芯片压接头真空孔清洁装置Chip press joint vacuum hole cleaning device 技术领域Technical field
本发明涉及半导体生产技术领域,特别涉及一种芯片压接头真空孔清洁装置。The invention relates to the technical field of semiconductor production, and in particular to a vacuum hole cleaning device for chip pressure joints.
背景技术Background technique
邦定(bonding)是芯片封装生产过程中的常用工艺,主要采用芯片压接头将完成对位的产品进行压接。通常地,上述芯片压接头设置有若干真空孔,通过真空孔内形成的负压将相应的芯片吸附在芯片压接头表面并随着芯片压接头向基板移动,所述芯片压接头还用以对芯片的金属凸块表面进行加热熔融,以使得所述金属凸块与基板表面对应的引脚固定连接。Bonding is a common process in the chip packaging production process. Chip crimping joints are mainly used to crimp the aligned products. Usually, the above-mentioned chip pressure joint is provided with a number of vacuum holes. The corresponding chip is adsorbed on the surface of the chip pressure joint through the negative pressure formed in the vacuum hole and moves toward the substrate as the chip pressure joint moves. The chip pressure joint is also used to attach the chip pressure joint to the substrate. The surface of the metal bumps of the chip is heated and melted, so that the metal bumps are fixedly connected to the corresponding pins on the surface of the substrate.
实际的生产过程中,由于晶圆背面常有残胶的存留,残留的胶材在负压作用下容易进入到芯片压接头的真空孔内;另一方面,现场还会定期采用磨石对芯片压接头表面进行清洁,避免胶材残留,但无法对真空孔进行疏通清理,并且磨石本身在与芯片压接头摩擦时也会产生一些细微粉末(氧化铝)被吸入真空孔,高温条件(400℃)下与残留胶材生成质地坚硬、难以清除的堵塞物。现有办法是先将芯片压接头冷却到常温,将芯片压接头拆卸下来后采用顶针对真空孔进行人工手动清理,操作繁琐,费时费力。In the actual production process, because there is often residual glue on the back of the wafer, the residual glue easily enters the vacuum hole of the chip pressure joint under the action of negative pressure; on the other hand, grinding stones are regularly used on-site to clean the chip. The surface of the crimping joint should be cleaned to avoid glue residue, but the vacuum hole cannot be cleared and cleaned. Moreover, when the grindstone itself rubs against the chip crimping joint, some fine powder (aluminum oxide) will be produced and sucked into the vacuum hole. High temperature conditions (400 ℃) and residual adhesive material to form hard and difficult-to-remove blockages. The existing method is to first cool the chip crimping joint to normal temperature, disassemble the chip crimping joint, and then use an ejection needle to manually clean the vacuum hole. The operation is cumbersome, time-consuming and labor-intensive.
鉴于此,有必要提供一种新的芯片压接头真空孔清洁装置。In view of this, it is necessary to provide a new vacuum hole cleaning device for chip press joints.
发明内容Contents of the invention
本发明的目的是提供一种芯片压接头真空孔清洁装置,它方便实现了顶针的调整,提高了顶针凸伸出长度的调整精度,能够更好的适用不 同的芯片压接头,避免了顶针设置不当造成的顶针损伤The object of the present invention is to provide a chip pressure joint vacuum hole cleaning device, which facilitates the adjustment of the ejector pin, improves the adjustment accuracy of the ejector pin protrusion length, and can be better applied to various applications. The same chip crimping joint avoids ejector pin damage caused by improper ejector pin setting.
本发明提供的芯片压接头真空孔清洁装置,包括支架、用于定位芯片压接头的承载组件和顶针组件;所述顶针组件沿竖向方向滑动设置在所述支架上并位于所述承载组件的上侧;The vacuum hole cleaning device of the chip pressure joint provided by the present invention includes a bracket, a bearing component for positioning the chip pressure joint, and an ejector pin assembly; the ejector pin assembly is slidably disposed on the bracket along the vertical direction and is located on the side of the bearing component. upper side;
所述顶针组件包括顶针安装块、顶针、将所述顶针压紧固定在所述顶针安装块上的定位块和顶针微调机构;The ejector pin assembly includes an ejector pin installation block, an ejector pin, a positioning block that presses and fixes the ejector pin on the ejector pin installation block, and an ejector pin fine-tuning mechanism;
所述顶针微调机构包括微调节件、顶针支撑块和用于将所述顶针定位在所述顶针支撑块上的定位组件;所述微调节件沿竖向方向延伸设置并螺纹连接在所述顶针安装块上;所述微调节件与所述顶针支撑块配合以在旋拧所述微调节件时所述顶针支撑块可沿竖向方向移动。The ejector pin fine-adjustment mechanism includes a micro-adjustment member, an ejector support block and a positioning component for positioning the ejector pin on the ejector support block; the micro-adjustment member extends along the vertical direction and is threadedly connected to the ejector pin. On the mounting block; the micro-adjustment member cooperates with the ejector pin support block so that the ejector pin support block can move in the vertical direction when the micro-adjustment member is screwed.
作为本发明的进一步改进,所述顶针支撑块沿所述微调节件的周向转动安装在所述微调节件上,且所述顶针支撑块被设置为限制沿所述微调节件的轴向方向移动。As a further improvement of the present invention, the ejector pin support block is installed on the micro-adjustment member along the circumferential rotation of the micro-adjustment member, and the ejector pin support block is configured to limit the axial direction of the micro-adjustment member. direction movement.
作为本发明的进一步改进,所述微调节件上设置有用于安装顶针安装块的连接部和设置在所述连接部上下两侧的轴向限位部;所述顶针支撑块上设置有与所述连接部相适配的支撑块安装孔;所述顶针支撑块套设在所述连接部外并在竖向上被两侧的轴向限位部限位。As a further improvement of the present invention, the micro-adjustment member is provided with a connecting portion for installing the ejector mounting block and axial limiting portions provided on both upper and lower sides of the connecting portion; the ejector support block is provided with a connecting portion corresponding to the ejector pin mounting block. The connection part is matched with a support block mounting hole; the ejector support block is sleeved outside the connection part and is vertically limited by the axial limiting parts on both sides.
作为本发明的进一步改进,所述定位组件包括设置在所述顶针支撑块上的顶针定位槽和顶针压紧件,所述顶针压紧件螺纹连接在所述顶针支撑块上,并将所述顶针压紧定位在所述压紧槽内。As a further improvement of the present invention, the positioning assembly includes an ejector pin positioning groove and an ejector pin pressing member provided on the ejector pin support block. The ejector pin pressing member is threadedly connected to the ejector pin support block and connects the ejector pin The ejector pin is pressed and positioned in the pressing groove.
作为本发明的进一步改进,所述顶针组件还具有设置在所述顶针安装块上的导引机构,所述顶针安装块上设置有与所述导引机构相适配的导引孔,所述导引机构可沿着所述导引孔上下活动;所述导引机构具有柱状结构并沿竖向方向延伸设置,且所述导引机构与所述微调节件平行设置。As a further improvement of the present invention, the ejector pin assembly also has a guide mechanism provided on the ejector pin mounting block, and the ejector pin mounting block is provided with a guide hole that matches the guide mechanism, and the The guide mechanism can move up and down along the guide hole; the guide mechanism has a columnar structure and extends along the vertical direction, and the guide mechanism is parallel to the micro-adjustment member.
作为本发明的进一步改进,所述顶针安装块的前侧面上设置有朝前侧开口设置的定位槽;所述定位块可拆卸的安装固定在所述顶针安装块 上,并在所述定位块锁紧固定后,所述定位块将所述顶针压紧定位在所述定位槽内。As a further improvement of the present invention, the front side of the ejector pin mounting block is provided with a positioning groove that opens toward the front side; the positioning block is detachably installed and fixed on the ejector pin mounting block. After the positioning block is locked and fixed, the positioning block presses and positions the ejector pin in the positioning groove.
作为本发明的进一步改进,所述定位槽的深度小于所述顶针的直径,在所述顶针在定位到定位槽后,部分顶针向定位槽的开口方向突伸出定位槽,所述定位块上设置有与所述定位槽位置相对并相抵接的抵接部。As a further improvement of the present invention, the depth of the positioning groove is smaller than the diameter of the ejector pin. After the ejector pin is positioned in the positioning groove, some of the ejector pins protrude out of the positioning groove in the opening direction of the positioning groove. A contact portion is provided that is opposite to and abuts against the positioning groove.
作为本发明的进一步改进,所述顶针安装块上还具有向前侧方向突伸形成的旋转限位部,所述旋转限位部设置在所述顶针安装块上并且所述旋转限位部设置在所述定位块的旁侧,并用于与定位块相抵接以限制所述定位块旋转。As a further improvement of the present invention, the ejector pin mounting block also has a rotation limiting portion protruding in the forward direction, the rotation limiting portion is provided on the ejector pin mounting block, and the rotation limiting portion is provided On the side of the positioning block, and used to abut with the positioning block to limit the rotation of the positioning block.
作为本发明的进一步改进,所述顶针安装块包括本体部和设置在所述本体部前侧并靠近底部的安装部,所述安装部自所述本体部向前侧突伸形成;所述定位块设置在所述安装部上。As a further improvement of the present invention, the ejection pin mounting block includes a body part and a mounting part disposed on the front side of the body part and close to the bottom, the mounting part protrudes from the body part to the front side; the positioning part The block is provided on the mounting part.
作为本发明的进一步改进,所述定位块底端与所述安装部的底端齐平,且所述定位块的尺寸与所述安装部的尺寸相适配。As a further improvement of the present invention, the bottom end of the positioning block is flush with the bottom end of the mounting part, and the size of the positioning block is adapted to the size of the mounting part.
本发明具备的有益效果:本发明实施例通过微调机构的设置能够方便的实现对顶针位置的调整,微调机构采用螺纹连接的微调节件进行调整,通过控制微调节件旋拧进入的深度控制顶针定位的位置,并在顶针调整后通过定位块对顶针的底部进行定位,方便实现了顶针的调整,提高了顶针凸伸出长度的调整精度,能够更好的适用不同的芯片压接头,避免了顶针设置不当造成的顶针损伤。Beneficial effects of the present invention: The embodiment of the present invention can conveniently adjust the position of the ejector pin through the setting of the fine-tuning mechanism. The fine-tuning mechanism adopts a threaded micro-adjusting member for adjustment, and the ejector pin is controlled by controlling the depth of the screw-in of the micro-adjusting member. Position the position, and use the positioning block to position the bottom of the ejector pin after the ejector pin is adjusted, which facilitates the adjustment of the ejector pin, improves the adjustment accuracy of the ejector pin protrusion length, and can better apply to different chip crimping joints, avoiding Damage to the ejector pin caused by improper ejector pin setting.
附图说明Description of drawings
图1是本申请芯片压接头真空孔清洁装置的整体工作状态示意图;Figure 1 is a schematic diagram of the overall working state of the vacuum hole cleaning device of the chip pressure joint of the present application;
图2是图1中芯片压接头真空孔清洁装置的平面结构示意图;Figure 2 is a schematic plan view of the vacuum hole cleaning device of the chip pressure joint in Figure 1;
图3是图2中芯片压接头真空孔清洁装置另一角度的平面示意图;Figure 3 is a schematic plan view of the vacuum hole cleaning device of the chip pressure joint in Figure 2 from another angle;
图4是图2中芯片压接头真空孔清洁装置沿A-A方向的部分结构剖 视图;Figure 4 is a partial structural cross-section of the vacuum hole cleaning device of the chip pressure joint in Figure 2 along the AA direction. view;
图5是本申请芯片压接头真空孔清洁装置的部分结构示意图;Figure 5 is a partial structural schematic diagram of the vacuum hole cleaning device of the chip pressure joint of the present application;
图6是图5中芯片压接头真空孔清洁装置部分结构的另一角度结构示意图;Figure 6 is a structural schematic diagram from another angle of the partial structure of the vacuum hole cleaning device of the chip pressure joint in Figure 5;
图7是图5中芯片压接头真空孔清洁装置部分结构的分解结构示意图;Figure 7 is an exploded structural schematic diagram of part of the structure of the vacuum hole cleaning device of the chip pressure joint in Figure 5;
图8是申请芯片压接头真空孔清洁装置中顶针被微调节机构定位后的结构示意图;Figure 8 is a schematic structural diagram of the ejector pin in the vacuum hole cleaning device of the chip pressure joint applied for after being positioned by the micro-adjustment mechanism;
图9是图8的分解图;Figure 9 is an exploded view of Figure 8;
图10是申请芯片压接头真空孔清洁装置中的驱动轴与操作杆的拆解结构示意图;Figure 10 is a schematic diagram of the disassembled structure of the drive shaft and operating rod in the vacuum hole cleaning device of the chip pressure joint;
图11是申请芯片压接头真空孔清洁装置中的安装盒的结构示意图;Figure 11 is a schematic structural diagram of the installation box in the vacuum hole cleaning device of the chip pressure joint;
100-芯片压接头真空孔清洁装置;10-支架;11-底板;12-背板;121-第一滑轨;122-连接孔;123-辅助行程限位部;13-侧板;131-第二滑轨;14-安装盒;141-驱动定位槽;142-延伸臂避让槽;20-承载组件;21-第一调节机构;211-第一基板;212-第一调节板;22-第二调节机构;221-第二基板;222-第二调节板;223-调节件;224-限位板;225-锁紧件;23-承载板;24-压接头定位块;25-行程限位块;30-顶针组件;301-顶针;31-顶针安装块;311-本体部;312-安装部;313-旋转限位部;32-顶针支撑块;321-微调节件;3211-螺纹段;3212-连接部;3213-轴向限位部;3214-旋转操控部;322-导引机构;323-支撑块安装孔;325-顶针定位槽;326-顶针压紧件;33-定位块;34-第一固定板;35-驱动块;350-延伸臂穿孔;351-驱动承载部;352-延伸臂穿孔;36-第一滑块;361-第一导槽;37-第二固定板;38-第二滑块;381-第二导槽;41-驱动轴;411-延伸臂;412-凸轮结构;413-操作杆安装部;42-操作杆;421-操作杆定位孔;43-复位弹簧;44-弹簧定位板;441-第二弹簧定位孔;45-操作杆锁紧机构;200-芯片压接头;201-基部;202-压接部。 100-Chip pressure joint vacuum hole cleaning device; 10-bracket; 11-bottom plate; 12-back plate; 121-first slide rail; 122-connection hole; 123-auxiliary stroke limiter; 13-side plate; 131- The second slide rail; 14-installation box; 141-drive positioning groove; 142-extension arm avoidance groove; 20-carrying component; 21-first adjustment mechanism; 211-first base plate; 212-first adjustment plate; 22- Second adjustment mechanism; 221-second base plate; 222-second adjustment plate; 223-adjustment piece; 224-limiting plate; 225-locking piece; 23-carrying plate; 24-pressure joint positioning block; 25-stroke Limit block; 30-ejector pin assembly; 301-ejector pin; 31-ejector pin installation block; 311-body part; 312-installation part; 313-rotation limit part; 32-ejector pin support block; 321-micro-adjustment piece; 3211- Threaded section; 3212-connection part; 3213-axial limit part; 3214-rotation control part; 322-guide mechanism; 323-support block mounting hole; 325-ejector pin positioning groove; 326-ejector pin pressing piece; 33- Positioning block; 34-first fixed plate; 35-driving block; 350-extension arm perforation; 351-drive bearing part; 352-extension arm perforation; 36-first slide block; 361-first guide groove; 37-th Two fixed plates; 38-second slide block; 381-second guide groove; 41-driving shaft; 411-extension arm; 412-cam structure; 413-operating rod mounting part; 42-operating rod; 421-operating rod positioning hole; 43-return spring; 44-spring positioning plate; 441-second spring positioning hole; 45-operating rod locking mechanism; 200-chip crimping joint; 201-base; 202-crimping part.
具体实施方式Detailed ways
以下将结合附图所示的实施方式对本发明进行详细描述。但该实施方式并不限制本发明,本领域的普通技术人员根据该实施方式所做出的结构、方法、或功能上的变换均包含在本发明的保护范围内。The present invention will be described in detail below with reference to the embodiments shown in the drawings. However, this embodiment does not limit the present invention. Structural, method, or functional changes made by those of ordinary skill in the art based on this embodiment are all included in the protection scope of the present invention.
参图1-11所示,本发明提供的芯片压接头真空孔清洁装置100主要用于芯片压接头200的真空孔的疏通清理,所述芯片压接头真空孔清洁装置100包括支架10、安装在所述支架上的承载组件20、顶针组件30与驱动组件。所述承载组件20用以定位芯片压接头200并调节所述芯片压接头200的位置,以实现芯片压接头200与所述顶针组件30的位置相对;所述顶针组件30包括可移动探伸至芯片压接头200的真空孔内以完成清洁工作的顶针301;所述驱动组件则用以驱使所述顶针组件30朝向或背离所述承载组件20移动。Referring to Figures 1-11, the chip pressure joint vacuum hole cleaning device 100 provided by the present invention is mainly used to clear and clean the vacuum holes of the chip pressure joint 200. The chip pressure joint vacuum hole cleaning device 100 includes a bracket 10, installed on The bearing assembly 20, the ejector assembly 30 and the driving assembly are on the bracket. The carrying component 20 is used to position the chip crimping joint 200 and adjust the position of the chip crimping joint 200 so that the chip crimping joint 200 is positioned relative to the ejection pin assembly 30; the ejection pin assembly 30 includes a movable extension to The ejector pin 301 is inserted into the vacuum hole of the chip pressing joint 200 to complete the cleaning work; the driving component is used to drive the ejector pin component 30 to move toward or away from the carrying component 20 .
通过调整承载组件20使定位在承载组件20上的芯片压接头200的真空孔与顶针301位置相对,在调整完成后,通过驱动组件控制顶针组件30靠近或远离所述承载组件20移动,以使顶针301进出真空孔,从而实现对真空孔的清除。By adjusting the carrier assembly 20, the vacuum hole of the chip pressing head 200 positioned on the carrier assembly 20 is opposite to the position of the ejection pin 301. After the adjustment is completed, the driving assembly is used to control the ejection pin assembly 30 to move closer to or away from the carrier assembly 20, so that The ejector pin 301 moves in and out of the vacuum hole, thereby clearing the vacuum hole.
为了提升顶针组件30活动过程中的稳定性,在本实施例中所述顶针组件30沿竖向滑动设置在所述支架10上,且在竖向方向上所述顶针组件30设置在所述承载组件20的上方,所述驱动组件驱动所述顶针组件30沿竖向方向滑动在所述支架10上,并在滑动过程中靠近或远离所述承载组件20,以清理定位在承载组件20上的芯片压接头200的真空孔。In order to improve the stability of the ejector pin assembly 30 during its movement, in this embodiment, the ejector pin assembly 30 is slidably disposed on the bracket 10 in the vertical direction, and the ejector pin assembly 30 is disposed on the bearing in the vertical direction. Above the assembly 20, the driving assembly drives the ejector assembly 30 to slide on the bracket 10 in the vertical direction, and approach or move away from the load-bearing assembly 20 during the sliding process to clean the ejector pin assembly 30 positioned on the load-bearing assembly 20. Vacuum hole of die press head 200.
将顶针组件30设置在承载组件20竖向方向上,驱动组件只需要通 过施加向下作用力就能控制顶针组件30向位于下侧的承载组件20的移动,能够更方便的实现操控。The ejector assembly 30 is arranged in the vertical direction of the bearing assembly 20, and the driving assembly only needs to pass By applying a downward force, the ejector pin assembly 30 can be controlled to move toward the load-bearing assembly 20 located on the lower side, making manipulation more convenient.
在实际使用过程中一般需要顶针组件30多次的往复运动才能清除真空孔内的堵塞物,在顶针组件30下落后需要将顶针组件30抬升以便于下次清洁使用。为了方便的实现顶针组件30的自动抬升复位,所述驱动组件包括复位机构;In actual use, it generally requires more than 30 reciprocating movements of the ejector pin assembly to clear the blockage in the vacuum hole. After the ejector pin assembly 30 falls, the ejector pin assembly 30 needs to be lifted up to facilitate next cleaning use. In order to conveniently realize the automatic lifting and reset of the ejector pin assembly 30, the driving assembly includes a reset mechanism;
当外力通过驱动组件作用到顶针组件30上的时候,外力转化为在竖向方向上驱动顶针组件30向下移动的作用力,并在顶针组件30向下移动的过程中,复位机构积蓄复位回弹力;When an external force acts on the ejector pin assembly 30 through the driving assembly, the external force is converted into a force that drives the ejector pin assembly 30 to move downward in the vertical direction, and during the downward movement of the ejector pin assembly 30, the reset mechanism accumulates and resets. Elasticity;
当作用在顶针组件30上的下压的外力撤销后,在复位机构复位回弹力的作用下所述顶针组件30向上复位移动。When the external pressing force acting on the ejector pin assembly 30 is removed, the ejector pin assembly 30 will reset and move upward under the action of the reset resilience of the reset mechanism.
在本实施例中所述顶针组件30包括顶针架,所述顶针301定位在所述顶针架上,所述顶针架沿竖向方向滑动设置在所述支架10上,所述驱动机构驱动所述顶针架沿支架10滑动。In this embodiment, the ejector pin assembly 30 includes an ejector pin frame, the ejector pin 301 is positioned on the ejector pin frame, the ejector pin frame is slidably disposed on the bracket 10 in the vertical direction, and the driving mechanism drives the The ejector pin holder slides along the bracket 10 .
在本实施例中,结合图2至图5所示,所述支架10包括底板11、背板12与侧板13。所述底板11呈水平设置,所述承载组件20固定安装在所述底板11上;所述背板12沿竖直方向设置,所述承载组件20、顶针组件30均位于所述背板12的前侧;所述侧板13同样沿竖直方向设置,且所述承载组件20、顶针组件30位于所述侧板13的同一侧。在此需说明的是,前述“水平”、“竖直”、“前侧”仅为方便理解,依据附图就所述芯片压接头真空孔清洁装置100处于既定摆放状态时所作的描述。 In this embodiment, as shown in FIGS. 2 to 5 , the bracket 10 includes a bottom plate 11 , a back plate 12 and a side plate 13 . The bottom plate 11 is arranged horizontally, and the load-bearing component 20 is fixedly installed on the bottom plate 11; the back plate 12 is arranged in a vertical direction, and the load-bearing component 20 and the ejector assembly 30 are located on the back plate 12 Front side; the side plate 13 is also arranged in the vertical direction, and the load-bearing assembly 20 and the ejector assembly 30 are located on the same side of the side plate 13 . It should be noted here that the aforementioned "horizontal", "vertical" and "front side" are only for convenience of understanding, and are described based on the accompanying drawings when the chip pressure head vacuum hole cleaning device 100 is in a predetermined placement state.
在本实施例中所述顶针架沿竖向方向滑动设置在所述背板12上,且所述顶针架同时沿竖向方向滑动设置在所述侧板13上。In this embodiment, the ejector pin rack is slidably disposed on the back plate 12 in the vertical direction, and the ejector pin rack is also slidably disposed on the side plate 13 in the vertical direction.
侧板13的设置在增强支架10稳定性的前提下,能够使顶针架的上下滑动更加的稳定。由于顶针在上下活动的过程中需要穿设真空孔,两者之间的间隙相对较小,顶针架的稳定滑动能够有效的避免因滑动过程中的误差造成的顶针架位置的偏移,从而造成顶针301的位置的偏移,从而出现顶针301与真空孔对接不到位的情况,有效的避免顶针301未穿插入真空孔后被损伤的问题。On the premise of enhancing the stability of the bracket 10, the side plate 13 can make the up and down sliding of the ejector pin frame more stable. Since the ejector pin needs to penetrate the vacuum hole during its up and down movement, the gap between the two is relatively small. The stable sliding of the ejector pin holder can effectively avoid the deviation of the ejector pin holder position due to errors during the sliding process, thereby causing The position of the ejector pin 301 is shifted, so that the ejector pin 301 and the vacuum hole are not properly connected, which effectively avoids the problem of the ejector pin 301 being damaged after not being inserted into the vacuum hole.
所述侧板13与所述背板12垂直设置,并且所述侧板13和所述背板12均垂直设置在所述底板11上。在本实施例中仅在所述背板12的一侧设置有所述侧板13,从而在支架10上形成朝向前侧开口且同时朝侧向开口设置的工作空间。The side plates 13 are arranged perpendicularly to the back plate 12 , and both the side plates 13 and the back plate 12 are perpendicularly arranged on the bottom plate 11 . In this embodiment, the side plate 13 is provided only on one side of the back plate 12 , thereby forming a working space opening toward the front side and opening toward the side on the bracket 10 .
将侧板13仅设置在一侧使与侧板13位置相对的另一侧面向外开放,上述结构的设置能够更方便的实现承载组件20位置的调整。由于承载组件20需要在水平方向上沿前后左右方向调整,以实现定位在承载组件20上的芯片压接头200上的真空孔与顶针301的对接,因此需要为承载组件20的调整留有足够大的调整空间。上述结构的设置不仅能够方便的实现承载组件20的调整也能够方便的实现芯片压接头200在承载组件20上的安装定位。The side plate 13 is provided only on one side so that the other side opposite to the side plate 13 is open to the outside. The arrangement of the above structure can more conveniently realize the adjustment of the position of the load-bearing assembly 20 . Since the carrier assembly 20 needs to be adjusted in the horizontal direction along the front, rear, left and right directions to realize the docking of the vacuum hole on the chip crimping joint 200 positioned on the carrier assembly 20 with the ejection pin 301, it is necessary to leave a large enough space for the adjustment of the carrier assembly 20. room for adjustment. The arrangement of the above structure not only facilitates the adjustment of the carrier component 20 but also facilitates the installation and positioning of the chip pressure joint 200 on the carrier component 20 .
在支架10的一侧设置的侧板13为顶针架提供稳定的滑动支撑的前提下保证了支架10支撑强度,同时也使支架10具备了更开阔的操作空间。 The side plate 13 provided on one side of the bracket 10 ensures the support strength of the bracket 10 while providing stable sliding support for the ejector pin frame, and also provides the bracket 10 with a wider operating space.
可以理解的是,所述顶针架上设置有沿背板12滑动设置的第一滑块36和沿所述侧板13滑动设置的第二滑块38,所述背板12上设置有与第一滑块36相适配的第一滑轨121,所述侧板13上设置有与第二滑块38相适配的第二滑轨131,所述第一滑轨121和所述第二滑轨131均沿竖向延伸设置。It can be understood that the ejector rack is provided with a first slider 36 that is slidably disposed along the back plate 12 and a second slider 38 that is slidably disposed along the side plate 13 . A first slide rail 121 is adapted to the slide block 36. The side plate 13 is provided with a second slide rail 131 that is adapted to the second slide block 38. The first slide rail 121 and the second slide rail 121 are provided on the side plate 13. The slide rails 131 are arranged to extend vertically.
所述第一滑块36形成有与所述第一滑轨121相配合的第一导槽361。可以理解地,所述第一滑轨121、第一导槽361仅是本申请示例性的结构描述,在本申请的其它实施方式中,可以在所述第一滑块36上设置导轨并在背板12上设置导槽,此处不再赘述。类似地,所述第二滑块38形成有与所述第二滑轨131相配合的第二导槽381。The first slide block 36 is formed with a first guide groove 361 that matches the first slide rail 121 . It can be understood that the first slide rail 121 and the first guide groove 361 are only exemplary structural descriptions of the present application. In other embodiments of the present application, guide rails may be provided on the first slide block 36 and in the The back plate 12 is provided with guide grooves, which will not be described again here. Similarly, the second slide block 38 is formed with a second guide groove 381 that matches the second slide rail 131 .
所述顶针架包括相互垂直设置的第一固定板34、第二固定板37和设置在所述第一固定板34和所述第二固定板37上的顶针安装块31,所述第一滑块36固定在所述第一固定板34上,所述第一固定板34沿平行于所述背板12的方向延伸设置,所述第二固定板37沿平行于所述侧板13的方向延伸设置,所述第二滑块38固定在所述第二固定板37上。所述顶针安装块31同时固定在所述第一固定板34和第二固定板37上。所述驱动组件驱动所述第一固定板34沿竖向方向上下活动。The ejector pin frame includes a first fixing plate 34, a second fixing plate 37 arranged perpendicularly to each other, and an ejector mounting block 31 provided on the first fixing plate 34 and the second fixing plate 37. The first sliding The block 36 is fixed on the first fixing plate 34 , the first fixing plate 34 extends in a direction parallel to the back plate 12 , and the second fixing plate 37 extends in a direction parallel to the side plate 13 Extended, the second slider 38 is fixed on the second fixing plate 37 . The ejector pin mounting block 31 is fixed on the first fixing plate 34 and the second fixing plate 37 at the same time. The driving assembly drives the first fixing plate 34 to move up and down in the vertical direction.
所述顶针安装块31的前侧面上设置有朝前侧开口设置的定位槽,所述顶针301定位在所述定位槽内,在所述顶针301定位在所述定位槽后,顶针301的一端向下突伸出所述顶针安装块31的底面,顶针301上突伸出的一部分用于插入到芯片压接头200上的真空吸附孔内,并用于对真空吸附孔进行清除。 The front side of the ejector pin mounting block 31 is provided with a positioning groove that opens toward the front side. The ejector pin 301 is positioned in the positioning groove. After the ejector pin 301 is positioned in the positioning groove, one end of the ejector pin 301 The bottom surface of the ejection pin mounting block 31 protrudes downward, and the protruding part of the ejection pin 301 is used to be inserted into the vacuum adsorption hole on the chip pressure connector 200 and used to clean the vacuum adsorption hole.
如图5-9所示,为了方便的实现顶针301的定位,所述顶针组件还具有设置在所述顶针安装块31上的定位块33,所述定位块33可拆卸的安装固定在所述顶针安装块31上,并在所述定位块33锁紧定位在所述顶针安装块31上之后将所述顶针301压紧定位在所述定位槽内。As shown in Figures 5-9, in order to conveniently position the ejector pin 301, the ejector pin assembly also has a positioning block 33 provided on the ejector pin installation block 31. The positioning block 33 is detachably installed and fixed on the ejector pin installation block 31. The ejector pin 301 is pressed and positioned in the locating groove after the positioning block 33 is locked and positioned on the ejector pin mounting block 31 .
可以理解的是,所述定位槽的深度小于所述顶针301的直径,以在所述顶针301在定位到定位槽后,部分顶针301向定位槽的开口方向突伸出定位槽,也就是定位槽不能完全容置所述顶针301;所述定位块33上设置有与所述定位槽位置相对设置并相对抵接的抵接部,在定位块33安装定位后抵接部与凸伸出定位槽的部分顶针301相抵接以实现顶针301的安装固定。It can be understood that the depth of the positioning groove is smaller than the diameter of the ejector pin 301, so that after the ejector pin 301 is positioned in the positioning groove, part of the ejector pin 301 protrudes from the positioning groove in the opening direction of the positioning groove, that is, the positioning groove is positioned. The slot cannot completely accommodate the ejector pin 301; the positioning block 33 is provided with a contact portion opposite to the position of the positioning groove and relatively abutting. After the positioning block 33 is installed and positioned, the contact portion and the protruding positioning Some of the ejector pins 301 in the grooves are in contact with each other to realize the installation and fixation of the ejector pins 301 .
在本实施例中所述定位块33可以通过螺栓固定在所述顶针安装块31上,螺栓在了螺纹连接到顶针安装块31上之后并将所述定位块33压紧固定在顶针安装块31上,在定位块33压紧固定在顶针安装块31上之后定位块33将所述顶针301压紧固定。In this embodiment, the positioning block 33 can be fixed on the ejector pin installation block 31 by bolts. After the bolts are threadedly connected to the ejector pin installation block 31, the positioning block 33 is pressed and fixed on the ejector pin installation block 31. After the positioning block 33 is pressed and fixed on the ejector pin mounting block 31, the positioning block 33 presses and fixes the ejector pin 301.
上述结构的设置可以通过调整螺栓的旋拧松紧情况调整顶针301的定位状况,当螺栓拧紧的时候顶针301被锁紧定位在定位槽内,当螺栓拧松的时候定位块33对顶针301的抵接作用力减弱,此时顶针301可以在定位槽内沿竖向方向移动,从而实现调整顶针301向下突伸出所述顶针安装块31的长度,以适用多种芯片压接头200。The setting of the above structure can adjust the positioning of the ejector pin 301 by adjusting the tightening of the bolt. When the bolt is tightened, the ejector pin 301 is locked and positioned in the positioning groove. When the bolt is loosened, the positioning block 33 resists the ejector pin 301. When the contact force weakens, the ejector pin 301 can move in the vertical direction in the positioning groove, thereby adjusting the length of the ejector pin 301 protruding downward from the ejector pin mounting block 31 to be suitable for various chip crimping joints 200 .
可以理解的是,所述定位块33上设置有与螺栓相适配的螺栓穿孔,所述螺栓穿设螺栓穿孔并螺纹连接在所述顶针安装块31上,并且螺栓的螺帽抵紧在所述定位块33的外表面。 It can be understood that the positioning block 33 is provided with bolt holes that are adapted to the bolts. The bolts pass through the bolt holes and are threadedly connected to the thimble mounting block 31 , and the nuts of the bolts are pressed against the bolt holes. The outer surface of the positioning block 33.
为了方便的实现所述顶针301的安装固定,所述顶针安装块31包括本体部311和设置在所述本体部311前侧并靠近底部的安装部312,所述安装部312自所述本体部311向前侧突伸形成,所述本体部311固定在所述侧板13和所述背板12上。所述定位槽设置在所述安装部312上,并且沿竖向方向贯穿所述安装部312,所述定位块33安装在所述安装部312上。所述安装部312在竖向方向上的尺寸小于所述本体部311在竖向方向上的尺寸,通过安装部312的设置能够方便实现顶针的安装固定。In order to conveniently install and fix the ejector pin 301, the ejector pin mounting block 31 includes a body part 311 and a mounting part 312 disposed on the front side of the body part 311 and close to the bottom. The mounting part 312 extends from the body part 311. 311 protrudes from the front side, and the body portion 311 is fixed on the side plate 13 and the back plate 12 . The positioning groove is provided on the mounting part 312 and penetrates the mounting part 312 in the vertical direction. The positioning block 33 is installed on the mounting part 312 . The size of the mounting portion 312 in the vertical direction is smaller than the size of the body portion 311 in the vertical direction. The installation and fixation of the ejector pin can be conveniently achieved by the arrangement of the mounting portion 312 .
为了更好的实现对顶针301的保护和包覆,所述定位块33底端与所述安装部312的底端齐平,且所述定位块33的尺寸与所述安装部312的尺寸相适配,这样结构的设置使定位块33在定位顶针301的时候能够在整个安装部312的竖向方向上都实现对定位顶针301的压紧定位。In order to better protect and cover the ejector pin 301, the bottom end of the positioning block 33 is flush with the bottom end of the mounting part 312, and the size of the positioning block 33 is consistent with the size of the mounting part 312. Adaptation, the arrangement of such a structure enables the positioning block 33 to realize the pressing and positioning of the positioning ejector pin 301 in the vertical direction of the entire mounting part 312 when positioning the ejector pin 301.
如图7所示,为了避免在顶针301在调整状态的时候定位块33产生旋转,所述顶针安装块31上还具有向前侧方向突伸形成的旋转限位部313,所述旋转限位部313设置在所述本体部131上并且所述旋转限位部313设置在所述定位块33的旁侧,并用于与定位块33相抵接以限制所述定位块33沿螺栓的周向方向的旋转。As shown in Figure 7, in order to prevent the positioning block 33 from rotating when the ejector pin 301 is in the adjustment state, the ejector pin mounting block 31 also has a rotation limiter 313 protruding in the forward direction. The rotation limiter The rotation limiting portion 313 is provided on the body portion 131 and the rotation limiting portion 313 is provided on the side of the positioning block 33 and is used to abut the positioning block 33 to limit the positioning block 33 in the circumferential direction of the bolt. of rotation.
上述结构在调整定位顶针301的过程中需要先将螺栓调松,以减缓定位块33对定位顶针301的压紧作用力,此时定位顶针301可以在定位槽内沿着竖向方向活动,但实际使用中定位顶针301向下突伸出的长度的调整多通过人手进行控制,其精度较差,容易造成定位顶针301的突伸出的长度控制不准确。In the process of adjusting the positioning ejector pin 301 in the above structure, the bolts need to be loosened first to slow down the pressing force of the positioning block 33 on the positioning ejector pin 301. At this time, the positioning ejector pin 301 can move in the vertical direction in the positioning groove, but In actual use, the adjustment of the downward protruding length of the positioning ejector pin 301 is mostly controlled by human hands, which has poor accuracy and may easily cause inaccurate control of the protruding length of the positioning ejector pin 301 .
为了方便精准的实现定位顶针301位置的调整,如图8-9所述,本 实施例还具有顶针微调机构,所述顶针微调机构包括微调节件321和与所述微调节件321配合的顶针支撑块32,部分所述顶针支撑块32延伸设置在所述安装部312的上侧,并具有用于定位所述顶针301的定位组件,所述顶针301通过定位组件定位在所述顶针支撑块32上。In order to realize the adjustment of the position of the positioning ejector pin 301 conveniently and accurately, as shown in Figure 8-9, this The embodiment also has an ejector fine-tuning mechanism, which includes a fine-adjusting member 321 and an ejector support block 32 that cooperates with the fine-adjusting member 321. Part of the ejector support block 32 is extended on the mounting part 312. side, and has a positioning component for positioning the ejector pin 301, and the ejector pin 301 is positioned on the ejector pin support block 32 through the positioning component.
所述顶针支撑块32沿所述微调节件321的周向转动安装在所述微调节件321上,且所述顶针支撑块32被设置为限制沿微调节件321的轴向方向移动;The ejector pin support block 32 is installed on the micro-adjustment member 321 along the circumferential rotation of the micro-adjustment member 321, and the ejector pin support block 32 is configured to limit movement in the axial direction of the micro-adjustment member 321;
所述顶针安装块31上设置有朝上开口设置的螺纹孔,所述微调节件321上设置有与所述螺纹孔配合的螺纹段3211,通过旋拧所述微调节件321带动所述顶针支撑块32沿竖向方向移动以调整所述顶针301在竖向方向上的高度。在具体实施例中所述微调节件321螺纹安装在所述旋转限位部313上,由于旋转限位部313是自本体部311向外突伸形成,因此能够更方便的实现连接固定。The ejector pin mounting block 31 is provided with a threaded hole that opens upward. The micro-adjusting member 321 is provided with a threaded section 3211 that matches the threaded hole. The ejector pin is driven by screwing the micro-adjusting member 321. The support block 32 moves in the vertical direction to adjust the height of the ejector pin 301 in the vertical direction. In a specific embodiment, the micro-adjusting member 321 is threadedly installed on the rotation limiting portion 313. Since the rotation limiting portion 313 is formed by protruding outward from the body portion 311, connection and fixation can be achieved more conveniently.
如图9所示,所述微调节件321上设置有用于安装顶针安装块31的连接部3212和设置在所述连接部3212上下两侧的轴向限位部3213,所述顶针支撑块32套设在所述连接部3212外并在竖向上被两侧的轴向限位部3213限位。As shown in FIG. 9 , the micro-adjustment member 321 is provided with a connecting portion 3212 for installing the ejector pin mounting block 31 and axial limiting portions 3213 provided on the upper and lower sides of the connecting portion 3212 . The ejector pin support block 32 It is sleeved outside the connecting part 3212 and is vertically limited by the axial limiting parts 3213 on both sides.
所述连接部3212与两侧的轴向限位部3213围成一槽体,所述顶针支撑块32定位在该槽体内。可以理解的是,所述顶针支撑块32上设置有与所述连接部3212相适配的支撑块安装孔323。The connecting portion 3212 and the axial limiting portions 3213 on both sides form a trough, and the ejector support block 32 is positioned in the trough. It can be understood that the ejector support block 32 is provided with a support block mounting hole 323 that is adapted to the connecting portion 3212 .
为了方便的实现顶针支撑块32的装配所述顶针支撑块32上设置有与所述支撑块安装孔323连通的缺口,所述缺口与所述支撑块安装孔323 的设置实际上是在所述顶针支撑块32上形成与所述连接部3212相适配的支撑块定位槽,支撑块定位槽卡接在连接部3212上。In order to facilitate the assembly of the ejector pin support block 32, the ejector pin support block 32 is provided with a notch that communicates with the support block installation hole 323. The notch is connected to the support block installation hole 323. The arrangement is actually to form a support block positioning groove on the ejector support block 32 that matches the connection part 3212, and the support block positioning groove is locked on the connection part 3212.
所述定位组件包括设置在所述顶针支撑块32上的顶针定位槽325和顶针压紧件326,所述顶针压紧件326螺纹连接在所述顶针支撑块32上,并具有与顶针301相抵接的压紧部,顶针压紧件326将所述顶针301压紧定位在所述压紧槽326内。所述顶针压紧件326为螺纹连接在所述顶针支撑块32上的螺栓。The positioning assembly includes an ejector pin positioning groove 325 provided on the ejector pin support block 32 and an ejector pin pressing member 326. The ejector pin pressing member 326 is threadedly connected to the ejector pin support block 32 and has a function to offset the ejector pin 301. Connected to the pressing part, the ejector pin pressing member 326 presses and positions the ejector pin 301 in the pressing groove 326. The ejector pin pressing member 326 is a bolt threadedly connected to the ejector pin support block 32 .
为了方便的实现微调节件321的旋转调节,所述微调节件321上还具有旋转操控部3214,所述旋转操控部3214与所述螺纹段3211同轴设置,并且所述旋转操控部3214与所述螺纹段3211相对设置在所述微调节件321的两端,所述连接部3212设置在所述旋转操控部3214和所述螺纹段3211之间。所述旋转操控部3214的截面为圆形,且所述旋转操控部3214的截面尺寸大于所述螺纹段3211的截面尺寸,从而能够方便的实现对螺纹段3211旋转的调控。In order to conveniently realize the rotation adjustment of the micro-adjustment member 321, the micro-adjustment member 321 is also provided with a rotation control part 3214. The rotation control part 3214 is coaxially arranged with the thread segment 3211, and the rotation control part 3214 is coaxial with the threaded section 3211. The threaded segments 3211 are disposed oppositely at both ends of the fine adjustment member 321 , and the connecting portion 3212 is disposed between the rotation control portion 3214 and the threaded segments 3211 . The cross-section of the rotary control part 3214 is circular, and the cross-sectional size of the rotary control part 3214 is larger than the cross-sectional size of the threaded section 3211, so that the rotation of the threaded section 3211 can be controlled conveniently.
进一步的,为了提高顶针支撑块32在沿竖向方向上移动过程中的稳定性,在本实施例中,所述顶针组件还具有设置在所述顶针安装块31上的导引机构322,所述顶针安装块31上设置有与所述导引机构322相适配的导引孔,所述导引孔与所述导引机构322间隙配合,所述导引机构322能够沿着所述导引孔上下活动,所述导引机构322具有柱状结构并沿竖向方向延伸设置,所述微调节件321也具有柱状结构并沿竖向方向延伸设置,所述导引机构322与所述微调节件321并列设置并且两者延伸方向相互平行。 Furthermore, in order to improve the stability of the ejector pin support block 32 during movement in the vertical direction, in this embodiment, the ejector pin assembly also has a guide mechanism 322 provided on the ejector pin installation block 31, so The ejector pin mounting block 31 is provided with a guide hole that is adapted to the guide mechanism 322. The guide hole has a clearance fit with the guide mechanism 322, and the guide mechanism 322 can move along the guide mechanism 322. The guide hole moves up and down. The guide mechanism 322 has a columnar structure and extends along the vertical direction. The micro-adjusting member 321 also has a columnar structure and extends along the vertical direction. The guide mechanism 322 and the micro-adjustment member 322 are connected with each other. The adjusting members 321 are arranged side by side and their extending directions are parallel to each other.
所述导引机构322的截面的形状可以为圆形或者矩形,在本实施例中所述导引机构322的截面为正方型。The cross-section shape of the guide mechanism 322 may be circular or rectangular. In this embodiment, the cross-section of the guide mechanism 322 is square.
所述导引孔为设置在所述顶针安装块31上的盲孔。The guide hole is a blind hole provided on the ejector pin mounting block 31 .
进一步的,所述顶针组件30还具有设置在所述顶针安装块31上的副支撑块,所述副支撑块在竖向方向上与所述顶针安装块31安装固定,并且所述副支撑块的前侧面与所述顶针支撑块32相邻,副支撑块的设置也能够有效的避免顶针支撑块32在微调节件321调整过程中随微调节件321旋转。在本实施例中所述复位机构包括压缩弹簧43和弹簧定位板44,所述弹簧定位板44设置在所述支架10上,所述压缩弹簧43的一端定位在弹簧定位板44上,压缩弹簧43的另一端位于所述顶针组件30的下侧并用于与所述顶针组件30相抵。Furthermore, the ejector pin assembly 30 also has an auxiliary support block provided on the ejector pin installation block 31. The auxiliary support block is installed and fixed with the ejector pin installation block 31 in the vertical direction, and the auxiliary support block The front side of the ejector pin support block 32 is adjacent to the ejector pin support block 32. The arrangement of the auxiliary support block can also effectively prevent the ejector pin support block 32 from rotating with the micro-adjustment member 321 during the adjustment process of the micro-adjustment member 321. In this embodiment, the reset mechanism includes a compression spring 43 and a spring positioning plate 44. The spring positioning plate 44 is provided on the bracket 10. One end of the compression spring 43 is positioned on the spring positioning plate 44. The compression spring The other end of 43 is located on the lower side of the ejector pin assembly 30 and is used to offset the ejector pin assembly 30 .
外力作用下顶针组件30向下移动,在移动到压缩弹簧43的位置后与压缩弹簧43相抵并压缩压缩弹簧43,此时,压缩弹簧43积蓄回弹力,在外力作用撤销后压缩弹簧43的回弹力驱使所述顶针组件30向上移动。The ejector pin assembly 30 moves downward under the action of external force. After moving to the position of the compression spring 43, it offsets the compression spring 43 and compresses the compression spring 43. At this time, the compression spring 43 accumulates rebound force. After the external force is removed, the rebound force of the compression spring 43 The elastic force drives the ejector pin assembly 30 to move upward.
复位机构的设置方便的实现了顶针组件30的复位移动,从而方便的实现了设备的再次使用。The setting of the reset mechanism facilitates the reset movement of the ejector pin assembly 30, thereby facilitating the reuse of the device.
为了更好的实现压缩弹簧43的安装固定,所述顶针组件30上设置有用于定位所述压缩弹簧43的第一弹簧定位孔,所述弹簧定位板44上设置有用于定位所述压缩弹簧43的第二弹簧定位孔441,所述压缩弹簧43的两端分别定位在第一弹簧定位孔和第二弹簧定位孔441内。In order to better install and fix the compression spring 43, the ejector pin assembly 30 is provided with a first spring positioning hole for positioning the compression spring 43, and the spring positioning plate 44 is provided with a first spring positioning hole for positioning the compression spring 43. The second spring positioning hole 441 has two ends of the compression spring 43 positioned in the first spring positioning hole and the second spring positioning hole 441 respectively.
将压缩弹簧43的两端分别与顶针组件30和弹簧定位板44连接固定能够更好的实现压缩弹簧43的使用,使压缩弹簧43在使用过程中更加 的稳定。Connecting and fixing the two ends of the compression spring 43 with the ejector pin assembly 30 and the spring positioning plate 44 respectively can better realize the use of the compression spring 43, making the compression spring 43 more efficient during use. of stability.
如图1-3所示,所述承载组件20包括依次层叠设置的第一调节机构21、第二调节机构22与承载板23。所述第一调节机构21包括固定在所述支架10的底板11上的第一基板211、沿第一方向X可滑动设置在第一基板上的第一调节板212;所述第二调节机构22包括固定在所述第一调节板212上的第二基板221、沿垂直于第一方向X的第二方向Y可滑动设置的第二调节板222;所述承载板23固定在所述第二调节板222上并用以定位芯片压接头200。其中,所述第一方向X、第二方向Y分别为前后、左右方向,通过第一调节机构21、第二调节机构22共同实现所述承载板23与芯片压接头200在水平方向的位置调节。As shown in FIGS. 1-3 , the load-bearing assembly 20 includes a first adjustment mechanism 21 , a second adjustment mechanism 22 and a load-bearing plate 23 that are stacked in sequence. The first adjustment mechanism 21 includes a first base plate 211 fixed on the bottom plate 11 of the bracket 10 and a first adjustment plate 212 slidably disposed on the first base plate along the first direction X; the second adjustment mechanism 22 includes a second base plate 221 fixed on the first adjustment plate 212 and a second adjustment plate 222 slidably disposed along a second direction Y perpendicular to the first direction X; the carrier plate 23 is fixed on the first adjustment plate 212 . The two adjustment plates 222 are used to position the chip pressing head 200 . The first direction X and the second direction Y are the front-to-back and left-right directions respectively. The first adjustment mechanism 21 and the second adjustment mechanism 22 jointly realize the position adjustment of the carrier plate 23 and the chip pressure joint 200 in the horizontal direction. .
为了方便的实现对承载板23的位置的调整,所述第一调节板212上具有开口朝向所述第一基板211的燕尾槽,所述第一基板211上设置有与所述燕尾槽相适配的燕尾榫;所述第一基板211上还设置有用于锁紧固定所述第一基板与211与所述第一调节板212相对位置关系的锁紧机构。In order to conveniently adjust the position of the carrying plate 23, the first adjustment plate 212 has a dovetail groove with an opening facing the first base plate 211, and the first base plate 211 is provided with a dovetail groove that is suitable for the dovetail groove. The first base plate 211 is also provided with a locking mechanism for locking and fixing the relative positional relationship between the first base plate 211 and the first adjustment plate 212 .
同样的,所述第二调节板222上具有开口朝向所述第二基板221的燕尾槽,所述第二基板221上设置有与所述燕尾槽相适配的燕尾榫;所述第二基板221上还设置有用于锁紧固定所述第二基板与221与所述第二调节板222相对位置关系的锁紧机构。Similarly, the second adjustment plate 222 has a dovetail groove that opens toward the second base plate 221, and the second base plate 221 is provided with a dovetail tenon that matches the dovetail groove; the second base plate 221 is also provided with a locking mechanism for locking and fixing the relative positional relationship between the second base plate 221 and the second adjustment plate 222 .
以图2所示出的第二调节机构22为例说明,锁紧机构包括调节件223、固定在第二基板221上的限位板224以及锁紧件225。实际操作中,先通过调节件223调整第二调节板222在第二方向Y的位置,再通过锁 紧件225锁定所述第二调节板222与第二基板221。其中,所述限位板224还形成有沿第二方向Y延伸设置的条形孔,所述锁紧件225穿设于所述条形孔。所述第一调节机构21、第二调节机构22的结构设计类似,不再赘述。Taking the second adjustment mechanism 22 shown in FIG. 2 as an example, the locking mechanism includes an adjustment member 223, a limiting plate 224 fixed on the second base plate 221, and a locking member 225. In actual operation, the position of the second adjusting plate 222 in the second direction Y is first adjusted through the adjusting member 223, and then the position of the second adjusting plate 222 is adjusted through the locking member 223. The fastener 225 locks the second adjustment plate 222 and the second base plate 221 . Wherein, the limiting plate 224 is also formed with a strip hole extending along the second direction Y, and the locking member 225 is inserted through the strip hole. The structural designs of the first adjustment mechanism 21 and the second adjustment mechanism 22 are similar and will not be described again.
所述承载板23上设置有压接头定位槽和设置在压接头定位槽旁侧的压接头定位块24,所述压接头定位块24可拆卸的安装固定在所述承载板23上并具有延伸设置在压接头定位槽上侧的压接定位部。The bearing plate 23 is provided with a crimping head positioning groove and a crimping head positioning block 24 arranged next to the crimping head positioning groove. The crimping head positioning block 24 is detachably installed and fixed on the bearing plate 23 and has an extension. The crimping positioning part is provided on the upper side of the crimping joint positioning groove.
所述芯片压接头200通常包括基部201及固定于所述基部201的压接部202;所述压接头定位槽设置在承载板23的上表面。所述压接头定位块24一般设置为压板并藉由固定螺栓将芯片压接头200的基部201稳固安装在所述承载板23上。The chip crimping joint 200 generally includes a base 201 and a crimping part 202 fixed on the base 201 ; the crimping joint positioning groove is provided on the upper surface of the carrier plate 23 . The press joint positioning block 24 is generally configured as a pressure plate and securely mounts the base 201 of the chip press joint 200 on the carrier plate 23 through fixing bolts.
为避免所述顶针组件30向下移动过程中碰撞冲击所述芯片压接头200,造成异常损伤,所述承载组件20还包括固定在所述承载板23上并与所述顶针组件30相配合的行程限位块25。所述行程限位块25设置在所述顶针组件30的下侧并用于限制所述顶针组件30的最大下降行程。In order to prevent the ejector pin assembly 30 from colliding with the chip crimping joint 200 during the downward movement and causing abnormal damage, the load-bearing assembly 20 also includes a ejector pin assembly 30 fixed on the load-carrying plate 23 and matching with the ejector pin assembly 30 . Travel limit block 25. The stroke limiting block 25 is disposed on the lower side of the ejector pin assembly 30 and is used to limit the maximum descending stroke of the ejector pin assembly 30 .
所述行程限位块25可以直接设置在所述支架10上或设置在所述承载组件20上。在本实施例中所述形成限位块25设置在所述承载组件20的承载板23上。The travel limiter 25 can be directly provided on the bracket 10 or on the load-bearing assembly 20 . In this embodiment, the limiting block 25 is disposed on the bearing plate 23 of the bearing assembly 20 .
通过所述行程限位块25的设计,配合所述顶针301的高度位置调整,使得实际操作过程中,只有所述顶针会向下插入芯片压接头200的真空孔中预设深度,所述顶针组件30的其它构件则不会与所述芯片压接头200相接触。 Through the design of the stroke limiter 25 and the adjustment of the height position of the ejector pin 301, during actual operation, only the ejector pin will be inserted downward into the vacuum hole of the chip pressure joint 200 to a preset depth. Other components of the assembly 30 will not come into contact with the die press head 200 .
如图6-10所示,所述驱动组件包括转动安装在所述支架10上的驱动轴41和设置在所述驱动轴41侧壁上的延伸臂411,所述顶针组件30上设置有驱动块35,所述驱动块35上设置有驱动承载部351;所述驱动块35固定在所述顶针安装块31与所述背板12之间,并且所述驱动块35安装固定在所述顶针安装块31上;所述驱动轴41具有初始状态和下压状态:As shown in Figures 6-10, the driving assembly includes a driving shaft 41 rotatably installed on the bracket 10 and an extension arm 411 provided on the side wall of the driving shaft 41. The ejector pin assembly 30 is provided with a driving Block 35, the driving block 35 is provided with a driving bearing portion 351; the driving block 35 is fixed between the ejection pin mounting block 31 and the back plate 12, and the driving block 35 is installed and fixed on the ejection pin. On the mounting block 31; the drive shaft 41 has an initial state and a pressed state:
在初始状态下,所述延伸臂411延伸在所述驱动承载部351之上;在初始状态下,所述驱动轴后41所在的位置使所述延伸臂411对驱动承载部351无下压作用;In the initial state, the extension arm 411 extends above the drive bearing part 351; in the initial state, the position of the drive shaft rear 41 prevents the extension arm 411 from pressing down on the drive bearing part 351. ;
在下压状态下,驱动轴41旋转并带动延伸臂411摆动,所述延伸臂411上远离所述驱动轴41的一端与所述驱动承载部351相抵并下压所述驱动承载部351,驱动承载部351被下压移动并带动所述顶针组件30向下移动。In the depressed state, the driving shaft 41 rotates and drives the extension arm 411 to swing. The end of the extension arm 411 away from the driving shaft 41 is against the driving bearing part 351 and presses down the driving bearing part 351. The driving bearing The portion 351 is pressed down and moves and drives the ejector pin assembly 30 to move downward.
通过驱动轴41转动实现延伸臂411的摆动并在延伸臂411摆动的时候控制驱动承载部351的移动,上述结构的设置方便的实现了顶针组件30的移动控制。The rotation of the drive shaft 41 realizes the swing of the extension arm 411 and controls the movement of the drive bearing part 351 when the extension arm 411 swings. The arrangement of the above structure facilitates the movement control of the ejector pin assembly 30 .
进一步的,为了更好的实现对顶针组件30的控制,所述延伸臂411具有固定在所述驱动轴41上的固定端和与所述固定端相对设置的自由端;所述自由端上设置有朝所述驱动承载部351突伸的凸轮结构412。Further, in order to better control the ejector assembly 30, the extension arm 411 has a fixed end fixed on the drive shaft 41 and a free end opposite to the fixed end; There is a cam structure 412 protruding toward the drive bearing portion 351 .
此外凸轮结构412的设置使延伸臂411的自由端形成向驱动块承载部351方向运动的趋势,驱动轴41摆动的过程中就能方便的实现对驱动块35的运动控制。所述延伸臂411的末端设置的凸轮结构,以使得所述 延伸臂411在与所述驱动承载部351抵压配合的过程中,不会造成驱动承载部351表面损伤。In addition, the arrangement of the cam structure 412 makes the free end of the extension arm 411 tend to move toward the driving block bearing portion 351 , and the movement control of the driving block 35 can be easily realized during the swing of the driving shaft 41 . A cam structure is provided at the end of the extension arm 411 so that the The extension arm 411 will not cause damage to the surface of the driving bearing portion 351 during the pressing fit with the driving bearing portion 351 .
所述驱动块35上设置有延伸臂穿孔350,所述驱动承载部351为设置在所述延伸臂穿孔350底壁上的承载面,所述延伸臂411延伸设置在所述延伸臂穿孔350内,且在竖向方向上所述延伸臂穿孔350的尺寸与所述凸轮结构412在竖向方向上的尺寸一致。The driving block 35 is provided with an extension arm through hole 350. The drive bearing portion 351 is a bearing surface provided on the bottom wall of the extension arm through hole 350. The extension arm 411 extends within the extension arm through hole 350. , and the size of the extending arm through hole 350 in the vertical direction is consistent with the size of the cam structure 412 in the vertical direction.
设置延伸臂穿孔350对延伸臂411穿孔进行定位,从而能够方便的实现延伸臂411的摆动与驱动块35的同步,也就实现了延伸臂411与顶针组件30的同步移动,方便实现根据顶针组件30的位置判断延伸臂411的位置,从而更好的实现延伸臂411对顶针组件30的控制。The extension arm perforation 350 is provided to position the extension arm 411 perforation, so that the swing of the extension arm 411 and the driving block 35 can be synchronized conveniently, thereby realizing the synchronous movement of the extension arm 411 and the ejection pin assembly 30, and conveniently realizing the ejection pin assembly according to the The position of the ejection pin assembly 30 is determined by the position of the extension arm 411, thereby better controlling the ejection pin assembly 30 by the extension arm 411.
在本实施例中,所述顶针组件30沿竖向方向滑动设置在所述背板12上;为了方便的实现驱动轴41的设置,所述驱动轴41转动安装在背板12上背离所述顶针组件30的一侧,且所述背板12上形成有与所述延伸臂411相适配的连接孔122,所述驱动轴41安装定位后所述延伸臂411穿设所述连接孔122,且在竖向方向上所述驱动轴41设置在所述连接孔122的中间位置。In this embodiment, the ejector pin assembly 30 is slidably installed on the back plate 12 along the vertical direction; in order to facilitate the installation of the drive shaft 41, the drive shaft 41 is rotatably installed on the back plate 12 away from the back plate 12. On one side of the ejector assembly 30, a connection hole 122 matching the extension arm 411 is formed on the back plate 12. After the drive shaft 41 is installed and positioned, the extension arm 411 passes through the connection hole 122. , and the driving shaft 41 is disposed at the middle position of the connecting hole 122 in the vertical direction.
驱动轴41设置在所述连接孔122的中间位置,在驱动轴41与连接孔122的底壁之间形成可以使延伸臂411摆动的空间。将驱动轴41设置在背板12上背离所述顶针组件30的一侧能够更好的实现驱动轴41的安装固定,方便驱动轴41的拆卸维修,同时能够有效的避免驱动轴41设置在顶针组件30同侧的时候产生的相互干扰。The driving shaft 41 is disposed in the middle of the connecting hole 122 , and a space for swinging the extension arm 411 is formed between the driving shaft 41 and the bottom wall of the connecting hole 122 . Arranging the drive shaft 41 on the side of the back plate 12 away from the ejector assembly 30 can better realize the installation and fixation of the drive shaft 41 , facilitate the disassembly and maintenance of the drive shaft 41 , and effectively prevent the drive shaft 41 from being arranged on the ejector pin. Mutual interference occurs when components 30 are on the same side.
所述连接孔122的底壁上形成有用于与所述延伸臂411相抵接以限 制所述延伸臂411向下运动行程的辅助行程限位部123。辅助行程限位部123的设置能够通过对延伸臂411运动行程的限制实现对整个顶针机构30向下移动行程的限制,从而有效的保障了顶针机构30下降过度造成的顶针损坏的问题。The bottom wall of the connecting hole 122 is formed with a hole for abutting the extension arm 411 to limit the The auxiliary stroke limiter 123 restricts the downward movement of the extension arm 411. The arrangement of the auxiliary stroke limiter 123 can limit the downward movement stroke of the entire ejector pin mechanism 30 by limiting the movement stroke of the extension arm 411, thereby effectively preventing the problem of ejector pin damage caused by excessive descent of the ejector pin mechanism 30.
如图11所示,所述支架10上还具有可拆卸安装固定在所述背板12上背离所述顶针组件30一侧的安装盒14,所述安装盒14上设置有朝所述背板12开口设置的驱动轴定位槽141和朝所述背板12开口设置的延伸臂避让槽142,所述延伸臂避让槽142设置在所述驱动轴定位槽141的下侧并与所述驱动轴定位槽141连通,所述驱动轴41被罩设定位在所述驱动轴定位槽141内,且所述驱动轴41在驱动轴定位槽141内可沿周向转动。As shown in Figure 11, the bracket 10 also has a mounting box 14 that is detachably mounted and fixed on the side of the back plate 12 away from the ejector assembly 30. The mounting box 14 is provided with a mounting box facing the back plate. A drive shaft positioning groove 141 with an opening of 12 and an extension arm relief groove 142 with an opening toward the back plate 12 are provided on the lower side of the drive shaft positioning groove 141 and connected with the drive shaft. The positioning grooves 141 are connected, the driving shaft 41 is set and positioned in the driving shaft positioning groove 141 by the cover, and the driving shaft 41 can rotate in the circumferential direction in the driving shaft positioning groove 141 .
设置安装盒14并将安装盒14可拆卸的安装固定在背板12上以能够方便的实现对驱动轴41的维修拆卸。The installation box 14 is provided and detachably installed and fixed on the back plate 12 to facilitate the maintenance and disassembly of the drive shaft 41 .
所述驱动组件还具有与所述驱动轴41连接固定的操作杆42,所述操作杆42沿所述驱动轴41的径向方向延伸设置。The driving assembly also has an operating rod 42 fixedly connected to the driving shaft 41 , and the operating rod 42 extends along the radial direction of the driving shaft 41 .
所述驱动轴41的一端延伸设置在所述支架10外并形成有操作杆安装部413,所述操作杆42可拆卸安装固定在所述操作杆安装部413上。One end of the driving shaft 41 extends outside the bracket 10 and is formed with an operating lever mounting portion 413 . The operating lever 42 is detachably mounted and fixed on the operating lever mounting portion 413 .
所述操作杆安装部413的截面为矩形,所述操作杆42上设置有与操作杆安装部413相适配的操作杆定位孔421,所述驱动机构还具有操作杆锁紧机构45,所述操作杆锁紧机构45螺纹安装在所述操作杆安装部413上并将所述操作杆42锁紧固定在操作杆安装部413上。The operating lever mounting portion 413 has a rectangular cross-section, and the operating lever 42 is provided with an operating lever positioning hole 421 that matches the operating lever mounting portion 413. The driving mechanism also has an operating lever locking mechanism 45, so The operating rod locking mechanism 45 is threadedly installed on the operating rod mounting portion 413 and locks the operating rod 42 on the operating rod mounting portion 413 .
所述延伸臂411沿所述驱动轴41的径向方向延伸设置,且所述延伸 臂411的延伸方向与所述操作杆42的延伸方向相交,在所述延伸臂411沿水平方向延伸时,所述操作杆42的延伸方向相对水平方向朝斜向上延伸。The extension arm 411 extends along the radial direction of the drive shaft 41, and the extension The extending direction of the arm 411 intersects the extending direction of the operating lever 42. When the extending arm 411 extends in the horizontal direction, the extending direction of the operating lever 42 extends obliquely upward relative to the horizontal direction.
实际应用中,先将既定芯片压接头200固定在承载组件20上,所述第一调节机构21、第二调节机构22则用以实现所述芯片压接头200的精确定位,使得既定真空孔恰位于所述顶针301的下端;再通过操作杆42驱使所述顶针组件30向下移动,便可完成清理操作,所述顶针301的位置也能现场进行微调;重复操作,并能逐次完成所述芯片压接头200的真空孔的疏通清理。In practical applications, the predetermined chip pressure joint 200 is first fixed on the carrier component 20, and the first adjustment mechanism 21 and the second adjustment mechanism 22 are used to achieve precise positioning of the chip pressure joint 200, so that the predetermined vacuum hole is exactly Located at the lower end of the ejector pin 301; and then use the operating rod 42 to drive the ejector pin assembly 30 downward to complete the cleaning operation. The position of the ejector pin 301 can also be fine-tuned on site; repeat the operation, and the above steps can be completed one after another. Dredge and clean the vacuum hole of the chip crimping joint 200 .
所述芯片压接头真空孔清洁装置100能够方便地通过驱动组件驱使顶针组件30的顶针301移动,以实现芯片压接头200的真空孔的清洁,现场操作更为便捷,利于提高生产效率,有效降低芯片压接头200清洁过程中异常受损的风险,更好地满足生产需求。The chip pressure joint vacuum hole cleaning device 100 can conveniently drive the ejector pin 301 of the ejector pin assembly 30 to move through the driving assembly to clean the vacuum hole of the chip pressure joint 200. The on-site operation is more convenient, is conducive to improving production efficiency, and effectively reduces the cost of the chip pressure joint. The risk of abnormal damage during the cleaning process of the chip press head 200 is eliminated to better meet production needs.
应当理解,虽然本说明书按照实施方式加以描述,但并非每个实施方式仅包含一个独立的技术方案,说明书的这种叙述方式仅仅是为清楚起见,本领域技术人员应当将说明书作为一个整体,各实施方式中的技术方案也可以经适当组合,形成本领域技术人员可以理解的其他实施方式。It should be understood that although this specification is described in terms of implementations, not each implementation only contains an independent technical solution. This description of the specification is only for the sake of clarity. Persons skilled in the art should take the specification as a whole and understand each individual solution. The technical solutions in the embodiments can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
上文所列出的一系列的详细说明仅仅是针对本发明的可行性实施方式的具体说明,它们并非用以限制本发明的保护范围,凡未脱离本发明技艺精神所作的等效实施方式或变更均应包含在本发明的保护范围之内。 The series of detailed descriptions listed above are only specific descriptions of feasible implementations of the present invention. They are not intended to limit the protection scope of the present invention. Any equivalent implementations or implementations that do not deviate from the technical spirit of the present invention are not intended to limit the protection scope of the present invention. All changes should be included in the protection scope of the present invention.

Claims (10)

  1. 一种芯片压接头真空孔清洁装置,其特征在于:包括支架、用于定位芯片压接头的承载组件和顶针组件;所述顶针组件沿竖向方向滑动设置在所述支架上并位于所述承载组件的上侧;A vacuum hole cleaning device for chip crimping joints, characterized by: comprising a bracket, a bearing component for positioning the chip crimping joint, and an ejector pin assembly; the ejector pin assembly is slidably disposed on the bracket along the vertical direction and is located on the bearing the upper side of the component;
    所述顶针组件包括顶针安装块、顶针、将所述顶针压紧固定在所述顶针安装块上的定位块和顶针微调机构;The ejector pin assembly includes an ejector pin installation block, an ejector pin, a positioning block that presses and fixes the ejector pin on the ejector pin installation block, and an ejector pin fine-tuning mechanism;
    所述顶针微调机构包括微调节件、顶针支撑块和用于将所述顶针定位在所述顶针支撑块上的定位组件;所述微调节件沿竖向方向延伸设置并螺纹连接在所述顶针安装块上;所述微调节件与所述顶针支撑块配合以在旋拧所述微调节件时所述顶针支撑块可沿竖向方向移动。The ejector pin fine-adjustment mechanism includes a micro-adjustment member, an ejector support block and a positioning component for positioning the ejector pin on the ejector support block; the micro-adjustment member extends along the vertical direction and is threadedly connected to the ejector pin. On the mounting block; the micro-adjustment member cooperates with the ejector pin support block so that the ejector pin support block can move in the vertical direction when the micro-adjustment member is screwed.
  2. 根据权利要求1所述的芯片压接头真空孔清洁装置,其特征在于:所述顶针支撑块沿所述微调节件的周向转动安装在所述微调节件上,且所述顶针支撑块被设置为限制沿所述微调节件的轴向方向移动。The chip pressure joint vacuum hole cleaning device according to claim 1, characterized in that: the ejector pin support block is mounted on the micro-adjustment member to rotate along the circumferential direction of the micro-adjustment member, and the ejector pin support block is mounted on the micro-adjustment member. Set to limit movement along the axial direction of the fine adjustment member.
  3. 根据权利要求2所述的芯片压接头真空孔清洁装置,其特征在于:所述微调节件上设置有用于安装顶针安装块的连接部和设置在所述连接部上下两侧的轴向限位部;所述顶针支撑块上设置有与所述连接部相适配的支撑块安装孔;所述顶针支撑块套设在所述连接部外并在竖向上被两侧的轴向限位部限位。The chip pressure joint vacuum hole cleaning device according to claim 2, characterized in that: the micro-adjustment member is provided with a connection part for installing the ejector mounting block and axial limits provided on both upper and lower sides of the connection part. part; the ejector support block is provided with a support block mounting hole that matches the connection part; the ejector support block is sleeved outside the connection part and is vertically protected by axial limiting parts on both sides Limit.
  4. 根据权利要求1所述的芯片压接头真空孔清洁装置,其特征在于:所述定位组件包括设置在所述顶针支撑块上的顶针定位槽和顶针压紧件,所述顶针压紧件螺纹连接在所述顶针支撑块上,并将所述顶针压紧定位在所述压紧槽内。The chip pressure joint vacuum hole cleaning device according to claim 1, characterized in that: the positioning assembly includes an ejector pin positioning groove and an ejector pin pressing member provided on the ejector pin support block, and the ejector pin pressing member is threadedly connected On the ejector pin support block, press and position the ejector pin in the pressing groove.
  5. 根据权利要求1所述的芯片压接头真空孔清洁装置,其特征在于:所述顶针组件还具有设置在所述顶针安装块上的导引机构,所述顶针安装块上设置有与所述导引机构相适配的导引孔,所述导引机构可沿着所述导引孔上下活动;所述导引机构具有柱状结构并沿竖向方向延伸设置,且所述导引机构与所述微调节件平行设置。The chip pressure joint vacuum hole cleaning device according to claim 1, characterized in that: the ejector pin assembly also has a guide mechanism provided on the ejector pin mounting block, and the ejector pin mounting block is provided with a guide mechanism that is connected to the guide mechanism. The guide mechanism has a guide hole that matches the guide hole, and the guide mechanism can move up and down along the guide hole; the guide mechanism has a columnar structure and extends along the vertical direction, and the guide mechanism is connected to the guide hole. The fine adjustment components are arranged in parallel.
  6. 根据权利要求1所述的芯片压接头真空孔清洁装置,其特征在于:所述顶针安装块的前侧面上设置有朝前侧开口设置的定位槽;所述定位块可拆卸的安装固定在所述顶针安装块上,并在所述定位块锁紧固定后, 所述定位块将所述顶针压紧定位在所述定位槽内。The chip pressure joint vacuum hole cleaning device according to claim 1, characterized in that: the front side of the ejection pin mounting block is provided with a positioning groove that opens toward the front side; the positioning block is detachably installed and fixed on the The ejector pin is installed on the block, and after the positioning block is locked and fixed, The positioning block presses and positions the ejector pin in the positioning groove.
  7. 根据权利要求6所述的芯片压接头真空孔清洁装置,其特征在于:所述定位槽的深度小于所述顶针的直径,在所述顶针在定位到定位槽后,部分顶针向定位槽的开口方向突伸出定位槽,所述定位块上设置有与所述定位槽位置相对并相抵接的抵接部。The chip pressure joint vacuum hole cleaning device according to claim 6, characterized in that: the depth of the positioning groove is smaller than the diameter of the ejector pin, and after the ejector pin is positioned in the positioning groove, part of the ejector pin moves toward the opening of the positioning groove. A positioning groove protrudes in a direction, and the positioning block is provided with a contact portion that is opposite to and abuts against the positioning groove.
  8. 根据权利要求7所述的芯片压接头真空孔清洁装置,其特征在于:所述顶针安装块上还具有向前侧方向突伸形成的旋转限位部,所述旋转限位部设置在所述顶针安装块上并且所述旋转限位部设置在所述定位块的旁侧,并用于与定位块相抵接以限制所述定位块旋转。The chip pressure joint vacuum hole cleaning device according to claim 7, characterized in that: the ejection pin mounting block also has a rotation limiter protruding in the forward direction, and the rotation limiter is provided on the The ejector pin is mounted on the block and the rotation limiting portion is provided on the side of the positioning block and is used to abut with the positioning block to limit the rotation of the positioning block.
  9. 根据权利要求6所述的芯片压接头真空孔清洁装置,其特征在于:所述顶针安装块包括本体部和设置在所述本体部前侧并靠近底部的安装部,所述安装部自所述本体部向前侧突伸形成;所述定位块设置在所述安装部上。The chip pressure joint vacuum hole cleaning device according to claim 6, wherein the ejection pin mounting block includes a body part and a mounting part disposed on the front side of the body part and close to the bottom, and the mounting part extends from the The body part protrudes forward and forms; the positioning block is provided on the mounting part.
  10. 根据权利要求9所述的芯片压接头真空孔清洁装置,其特征在于:所述定位块底端与所述安装部的底端齐平,且所述定位块的尺寸与所述安装部的尺寸相适配。 The chip pressure joint vacuum hole cleaning device according to claim 9, characterized in that: the bottom end of the positioning block is flush with the bottom end of the mounting part, and the size of the positioning block is the same as the size of the mounting part. suitable.
PCT/CN2023/084687 2022-04-01 2023-03-29 Cleaning device for vacuum hole of chip bonding head WO2023185924A1 (en)

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CN110112093A (en) * 2019-06-14 2019-08-09 深圳市哈德胜精密科技股份有限公司 One kind falls to encapsulate chip flexible top needle operation means and system
CN111739833A (en) * 2020-07-06 2020-10-02 颀中科技(苏州)有限公司 Chip crimping joint vacuum hole through hole device
CN215590065U (en) * 2021-04-07 2022-01-21 昭泉印刷江苏有限公司 Automatic clear useless device of high stability carton
CN215896358U (en) * 2021-09-24 2022-02-22 北京北方华创微电子装备有限公司 Thimble assembly and semiconductor process equipment
CN114733807A (en) * 2022-04-01 2022-07-12 颀中科技(苏州)有限公司 Chip crimping joint vacuum hole cleaning device
CN114733806A (en) * 2022-04-01 2022-07-12 颀中科技(苏州)有限公司 Chip crimping joint vacuum hole cleaning device
CN217094569U (en) * 2022-04-01 2022-08-02 颀中科技(苏州)有限公司 Chip crimping joint vacuum hole cleaning device

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CN117476539A (en) * 2023-10-07 2024-01-30 昆山同兴达芯片封测技术有限责任公司 Adjustment mechanism convenient to adjust thimble seat height
CN117476539B (en) * 2023-10-07 2024-05-03 昆山日月同芯半导体有限公司 Adjustment mechanism convenient to adjust thimble seat height
CN117672942A (en) * 2024-02-01 2024-03-08 深圳市森美协尔科技有限公司 Level adjustment device and wafer detection system
CN117672942B (en) * 2024-02-01 2024-04-12 深圳市森美协尔科技有限公司 Level adjustment device and wafer detection system

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