CN116925594A - 一种电路板加工用油墨及其制备方法 - Google Patents
一种电路板加工用油墨及其制备方法 Download PDFInfo
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- C07D301/28—Condensation of epihalohydrins or halohydrins with compounds containing active hydrogen atoms by reaction with hydroxyl radicals
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- C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
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Abstract
本发明公开了一种电路板加工用油墨,该油墨包括如下重量份的原料:水性聚氨酯15.6‑20.3份、改性环氧树脂12.5‑20.8份、颜料5.5‑7.5份、固化剂2.2‑4.5份、酚醛树脂8‑10.1份、改性填料4.4‑6.8份、交联剂2‑5份、无水乙醇35.1‑40.3份、聚氧丙烯甘油醚10.2‑15.6份;本发明还公开了该油墨的制备方法,将水性聚氨酯、改性环氧树脂、改性填料等在氮气作保护气的条件下以无水乙醇作为溶剂制备出一种电路板加工用油墨,其中改性环氧树脂是由有机硅与环氧树脂在分子内反应,有效解决两者不相容而会形成分相结构的问题,使油墨在提升韧性的同时增添其耐热性的特点,同时添加的改性填料,使油墨具有优异的导电特性,扩大其应用范围,有利于市场推广。
Description
技术领域
本发明属于油墨生产技术领域,涉及一种电路板加工用油墨及其制备方法。
背景技术
油墨是电路板制造中所需的重要材料之一,是覆盖在电路板外层的特殊外衣,用于防止各种元件焊接时产生线间短路,同时调节焊锡附着量,减少焊缝中铜的溶解污染,最终达到节约焊锡料、增加绝缘度、适应配线的高密度、以及避免虚焊、保护线路避免氧化擦伤、提高检验速度等目的。根据固化方式,阻焊油墨有感光显影型的油墨,有热固化的热固油墨,还有UV光固化的UV油墨。而根据板材分类,又有PCB硬板阻焊油墨,FPC软板阻焊油墨,还有铝基板阻焊油墨,铝基板油墨也可以用在陶瓷板上面。
传统的阻焊油墨对固化膜的附着力、硬度以及耐药性等比较关注,而对其耐热性则无太多要求,所以涂膜固化后一般耐热性较差,无法适应高温环境下的应用。
发明内容
本发明的目的在于提供一种电路板加工用油墨及其制备方法,解决背景技术中提及的油墨耐热性差的问题。
本发明的目的可以通过以下技术方案实现:
一种电路板加工用油墨,包括如下重量份的原料:
水性聚氨酯15.6-20.3份、改性环氧树脂12.5-20.8份、颜料5.5-7.5份、固化剂2.2-4.5份、酚醛树脂8-10.1份、改性填料4.4-6.8份、交联剂2-5份、无水乙醇35.1-40.3份、聚氧丙烯甘油醚10.2-15.6份;
该电路板加工用油墨由如下步骤制成:
步骤A1,将水性聚氨酯、改性环氧树脂、酚醛树脂和一半无水乙醇加入三口烧瓶中,加热至60℃,保温1h后通入氮气排出空气,控制搅拌速度为125-130rpm,搅拌10-15min,升温至93℃,保温1h,得到溶液a;
步骤A2,将颜料、改性填料和另一半无水乙醇加入烧杯中,45℃水浴加热,140-150rpm搅拌17-20min后加入固化剂,升温至70-74℃,继续搅拌30min,得到溶液b;
步骤A3,将溶液a加入溶液b中,225-230rpm搅拌16-20min,加入聚氧丙烯甘油醚和交联剂,超声分散30-60min,再以9200-9500rpm转速搅拌1h后转移至干燥箱80-85℃干燥2-3h,得到产物;
步骤A4,将产物转移至球磨机球磨,制得电路板加工用油墨。
进一步,步骤A2所述颜料为酞青绿、酞青兰、炭黑、群青、锌钡白、永固紫、永固黄、钛白粉中任意一种。
进一步,步骤A2所述固化剂为乙烯基三胺、DETA和三亚乙基四胺中的一种或多种以任意比例混合。
进一步,步骤A3所述交联剂为过氧化二异丙苯、二亚乙基三胺和三羟甲基丙烷中的一种或多种以任意比例混合。
进一步,步骤A4所述球磨机的转速为2200-2500rpm。
其中改性环氧树脂由如下步骤制得:
步骤S1,将苯基硅烷三醇、氢氧化钾、丙酮加入反应釜中,在转速为150-200rpm,温度为25-30℃的条件下,进行搅拌20-30min后,加入二甲基一溴硅烷,在温度为70-75℃的条件下,进行反应5-8h,制得中间体1;
反应过程如下:
步骤S2,向烧瓶中加入丁香酚、环氧氯丙烷、苄基三乙基氯化铵搅拌均匀后在110℃油浴中反应2-3h后,加入质量分数20%的氢氧化钠溶液,在80℃下继续反应5-6h,所得混合物用去离子水洗涤2-3次,并真空蒸馏,再与甲醇混合冷却至-5℃,过滤,得到中间体2;
反应过程如下:
步骤S3,向烧瓶中加入中间体2、karstedt催化剂,升温至35-39℃搅拌2-2.5h,向其中加入中间体1,升温至98-99℃反应20-23h,经真空蒸馏纯化,得到改性环氧树脂。
反应过程如下:
进一步,步骤S1所述苯基硅烷三醇、氢氧化钾、丙酮、二甲基一溴硅烷的用量比为0.05-0.06mol:0.07-0.08mol:14-18mL:0.03-0.04mol。
进一步,步骤S2所述丁香酚、环氧氯丙烷、苄基三乙基氯化铵、氢氧化钠溶液的用量比为5.2-5.5g:17.1-17.4g:1.7-1.8g:6-7g。
进一步,步骤S3所述中间体2、karstedt催化剂、中间体1的用量比为2.1-2.3g:0.05-0.08g:2-2.1g。
其中改性填料由如下步骤制得:
步骤C1,向烧瓶中加入碳纳米管、质量分数40%的硝酸溶液,超声震荡40-50min,加热煮沸后,过滤,沉淀经去离子水清洗、烘干后,得到多缺陷碳纳米管;
步骤C2,向烧杯中加入氯金酸、去离子水,搅拌溶解后加热煮沸,得到氯金酸溶液;
步骤C3,将柠檬酸钠溶解于去离子水中,得到还原剂;
步骤C4,将还原剂滴到氯金酸溶液中,不断搅拌至溶液由黄色变为深红色,继续加热30min,得到酒红色的金溶胶溶液;
步骤C5,将多缺陷碳纳米管放入无水乙醇中超声震荡10min,加入金溶胶溶液,超声震荡7.5-13min,经抽滤,得到改性填料。
进一步,步骤C1所述碳纳米管、质量分数40%的硝酸溶液的用量比为0.05-0.08g:40-50mL。
进一步,步骤C2所述氯金酸、去离子水的用量比为26-30mg:160-180mL。
进一步,步骤C3所述柠檬酸钠、去离子水的用量比为0.12-0.14g:25-30mL。
进一步,步骤C5所述多缺陷碳纳米管、无水乙醇、金溶胶溶液的用量比为35-38mg:25-28mL:45-48mL。
一种电路板加工用油墨,包括如下制备方法:
步骤A1,将水性聚氨酯、改性环氧树脂、酚醛树脂和一半无水乙醇加入三口烧瓶中,加热至60℃,保温1h后通入氮气排出空气,控制搅拌速度为125-130rpm,搅拌10-15min,升温至93℃,保温1h,得到溶液a;
步骤A2,将颜料、改性填料和另一半无水乙醇加入烧杯中,45℃水浴加热,140-150rpm搅拌17-20min后加入固化剂,升温至70-74℃,继续搅拌30min,得到溶液b;
步骤A3,将溶液a加入溶液b中,225-230rpm搅拌16-20min,加入聚氧丙烯甘油醚和交联剂,超声分散30-60min,再以9200-9500rpm转速搅拌1h后转移至干燥箱80-85℃干燥2-3h,得到产物;
步骤A4,将产物转移至球磨机球磨,制得电路板加工用油墨。
发明的有益效果:本发明的目在制备电路板加工用油墨过程中,将水性聚氨酯、改性环氧树脂、改性填料等作为原料,在氮气作保护气的条件下以无水乙醇作为溶剂制备出一种电路板加工用油墨,具有较高的粘性、耐热性和导电性,应用范围较广,有利于市场推广。
其中为改善环氧树脂较强的脆性,引入有机硅与其反应,在提升韧性的同时增添其耐热性的特点。有机硅具有无机物的耐热性也具有有机物的易反应加工性能,且硅氧烷链段具有良好的柔韧性,原因在于Si-O键的键长更长,键角更大,这就意味着硅氧烷链段的旋转和伸缩的空间更大,活动更加自由,链段也更加柔顺。目前采用有机硅改性环氧树脂的研究较多,大部分方法采用大分子链段的有机桂进行改性,但通常由于与环氧树脂不相容而会形成一定的分相结构。因此本发明将硅氧烷小链段分散于环氧树脂中,从分子内改性环氧树脂得到有机硅树脂。此外,有机硅原料中引入极性稍强的苯基,可以增强有机硅的极性,增大与环氧树脂的相容性。有机硅树脂的Si–O键具有较大的断裂能(460kJ/mol),比C–C键能(346kJ/mol)和C–O键能(358kJ/mol)要高,其主链更为稳定,赋予有机硅树脂以优异的热稳定性,进而增强电路板加工用油墨的耐热性能。
其次,有机硅的加入可以增强环氧树脂的润湿性,树脂体积收缩率增大,进而使得分散在环氧树脂中的导电填料接触更加紧密,形成良好的导电通道,降低了油墨的方块电阻值。
另外,本发明添加改性填料,使油墨具有优异的导电特性,有机硅的添加使环氧树脂和改性填料的结合较好,且整个油墨体系中改性填料的分散也是十分均匀的,有效阻止团聚现象的发生。改性填料本质是金掺杂的碳纳米管,用酸刻蚀碳纳米管使其表面产生大量缺陷,金纳米粒子切入缺陷中,金掺杂属于P型掺杂,电子会转移至金上,碳纳米管会生成电子空穴,从而降低碳纳米管的费米能级和载流子密度,提高碳纳米管的导电性,进而提高油墨的导电性。
具体实施方式
下面将结合本发明实施例,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。
实施例1
改性环氧树脂由如下步骤制得:
步骤S1,将0.05mol苯基硅烷三醇、0.07mol氢氧化钾、14mL丙酮加入反应釜中,在转速为150rpm,温度为25℃的条件下,进行搅拌20min后,加入0.03mol二甲基一溴硅烷,在温度为70℃的条件下,进行反应5h,制得中间体1;
步骤S2,向烧瓶中加入5.2g丁香酚、17.1g环氧氯丙烷、1.7g苄基三乙基氯化铵搅拌均匀后在110℃油浴中反应2h后,加入6g质量分数20%的氢氧化钠溶液,在80℃下继续反应5h,所得混合物用去离子水洗涤2次,并真空蒸馏,再与甲醇混合冷却至-5℃,过滤,得到中间体2;
步骤S3,向烧瓶中加入2.1g中间体2、0.05g karstedt催化剂,升温至35℃搅拌2h,向其中加入2g中间体1,升温至98℃反应20h,经真空蒸馏纯化,得到改性环氧树脂。
实施例2
改性环氧树脂由如下步骤制得:
步骤S1,将0.055mol苯基硅烷三醇、0.075mol氢氧化钾、16mL丙酮加入反应釜中,在转速为170rpm,温度为27℃的条件下,进行搅拌25min后,加入0.035mol二甲基一溴硅烷,在温度为72℃的条件下,进行反应7h,制得中间体1;
步骤S2,向烧瓶中加入5.3g丁香酚、17.3g环氧氯丙烷、1.75g苄基三乙基氯化铵搅拌均匀后在110℃油浴中反应2h后,加入6.5g质量分数20%的氢氧化钠溶液,在80℃下继续反应5h,所得混合物用去离子水洗涤2次,并真空蒸馏,再与甲醇混合冷却至-5℃,过滤,得到中间体2;
步骤S3,向烧瓶中加入2.2g中间体2、0.07g karstedt催化剂,升温至37℃搅拌2h,向其中加入2g中间体1,升温至98℃反应21h,经真空蒸馏纯化,得到改性环氧树脂。
实施例3
改性环氧树脂由如下步骤制得:
步骤S1,将0.06mol苯基硅烷三醇、0.08mol氢氧化钾、18mL丙酮加入反应釜中,在转速为200rpm,温度为30℃的条件下,进行搅拌30min后,加入0.04mol二甲基一溴硅烷,在温度为75℃的条件下,进行反应8h,制得中间体1;
步骤S2,向烧瓶中加入5.5g丁香酚、17.4g环氧氯丙烷、1.8g苄基三乙基氯化铵搅拌均匀后在110℃油浴中反应3h后,加入7g质量分数20%的氢氧化钠溶液,在80℃下继续反应6h,所得混合物用去离子水洗涤3次,并真空蒸馏,再与甲醇混合冷却至-5℃,过滤,得到中间体2;
步骤S3,向烧瓶中加入2.3g中间体2、0.08g karstedt催化剂,升温至39℃搅拌2.5h,向其中加入2.1g中间体1,升温至99℃反应23h,经真空蒸馏纯化,得到改性环氧树脂。
实施例4
改性填料由如下步骤制得:
步骤C1,向烧瓶中加入0.05g碳纳米管、40mL质量分数40%的硝酸溶液,超声震荡40min,加热煮沸后,过滤,沉淀经去离子水清洗、烘干后,得到多缺陷碳纳米管;
步骤C2,向烧杯中加入26mg氯金酸、160mL去离子水,搅拌溶解后加热煮沸,得到氯金酸溶液;
步骤C3,将0.12g柠檬酸钠溶解于25mL去离子水中,得到还原剂;
步骤C4,将还原剂滴到氯金酸溶液中,不断搅拌至溶液由黄色变为深红色,继续加热30min,得到酒红色的金溶胶溶液;
步骤C5,将多缺陷碳纳米管放入无水乙醇中超声震荡10min,加入金溶胶溶液,超声震荡7.5min,经抽滤,得到改性填料。
实施例5
改性填料由如下步骤制得:
步骤C1,向烧瓶中加入0.06g碳纳米管、47mL质量分数40%的硝酸溶液,超声震荡45min,加热煮沸后,过滤,沉淀经去离子水清洗、烘干后,得到多缺陷碳纳米管;
步骤C2,向烧杯中加入28mg氯金酸、175mL去离子水,搅拌溶解后加热煮沸,得到氯金酸溶液;
步骤C3,将0.13g柠檬酸钠溶解于27mL去离子水中,得到还原剂;
步骤C4,将还原剂滴到氯金酸溶液中,不断搅拌至溶液由黄色变为深红色,继续加热30min,得到酒红色的金溶胶溶液;
步骤C5,将多缺陷碳纳米管放入无水乙醇中超声震荡10min,加入金溶胶溶液,超声震荡9min,经抽滤,得到改性填料。
实施例6
改性填料由如下步骤制得:
步骤C1,向烧瓶中加入0.08g碳纳米管、50mL质量分数40%的硝酸溶液,超声震荡50min,加热煮沸后,过滤,沉淀经去离子水清洗、烘干后,得到多缺陷碳纳米管;
步骤C2,向烧杯中加入30mg氯金酸、180mL去离子水,搅拌溶解后加热煮沸,得到氯金酸溶液;
步骤C3,将0.14g柠檬酸钠溶解于30mL去离子水中,得到还原剂;
步骤C4,将还原剂滴到氯金酸溶液中,不断搅拌至溶液由黄色变为深红色,继续加热30min,得到酒红色的金溶胶溶液;
步骤C5,将多缺陷碳纳米管放入无水乙醇中超声震荡10min,加入金溶胶溶液,超声震荡13min,经抽滤,得到改性填料。
实施例7
一种电路板加工用油墨,包括如下重量份的原料:
水性聚氨酯15.6份、改性环氧树脂12.5份、酞青绿5.5份、乙烯基三胺2.2份、酚醛树脂8份、改性填料4.4份、过氧化二异丙苯2份、无水乙醇35.1份、聚氧丙烯甘油醚10.2份;
该电路板加工用油墨由如下步骤制成:
步骤A1,将水性聚氨酯、实施例1制备的改性环氧树脂、酚醛树脂和一半无水乙醇加入三口烧瓶中,加热至60℃,保温1h后通入氮气排出空气,控制搅拌速度为125rpm,搅拌10min,升温至93℃,保温1h,得到溶液a;
步骤A2,将酞青绿、实施例4制备的改性填料和另一半无水乙醇加入烧杯中,45℃水浴加热,140rpm搅拌17min后加入乙烯基三胺,升温至70℃,继续搅拌30min,得到溶液b;
步骤A3,将溶液a加入溶液b中,225rpm搅拌16min,加入聚氧丙烯甘油醚和过氧化二异丙苯,超声分散30min,再以9200rpm转速搅拌1h后转移至干燥箱80℃干燥2h,得到产物;
步骤A4,将产物转移至球磨机球磨,转速为2200rpm,制得电路板加工用油墨。
实施例8
一种电路板加工用油墨,包括如下重量份的原料:
水性聚氨酯17.2份、改性环氧树脂16.7份、炭黑7.1份、DETA 3.4份、酚醛树脂9份、改性填料5.2份、二亚乙基三胺3.2份、无水乙醇38.5份、聚氧丙烯甘油醚13.4份;
该电路板加工用油墨由如下步骤制成:
步骤A1,将水性聚氨酯、实施例2制备的改性环氧树脂、酚醛树脂和一半无水乙醇加入三口烧瓶中,加热至60℃,保温1h后通入氮气排出空气,控制搅拌速度为128rpm,搅拌12min,升温至93℃,保温1h,得到溶液a;
步骤A2,将炭黑、实施例5制备的改性填料和另一半无水乙醇加入烧杯中,45℃水浴加热,146rpm搅拌18min后加入DETA,升温至72℃,继续搅拌30min,得到溶液b;
步骤A3,将溶液a加入溶液b中,228rpm搅拌18min,加入聚氧丙烯甘油醚和二亚乙基三胺,超声分散45min,再以9300rpm转速搅拌1h后转移至干燥箱82℃干燥2h,得到产物;
步骤A4,将产物转移至球磨机球磨,转速为2350rpm,制得电路板加工用油墨。
实施例9
一种电路板加工用油墨,包括如下重量份的原料:
水性聚氨酯20.3份、改性环氧树脂20.8份、永固黄7.5份、三亚乙基四胺5份、酚醛树脂10.1份、改性填料.8份、三羟甲基丙烷5份、无水乙醇40.3份、聚氧丙烯甘油醚15.6份;
该电路板加工用油墨由如下步骤制成:
步骤A1,将水性聚氨酯、实施例3制备的改性环氧树脂、酚醛树脂和一半无水乙醇加入三口烧瓶中,加热至60℃,保温1h后通入氮气排出空气,控制搅拌速度为130rpm,搅拌15min,升温至93℃,保温1h,得到溶液a;
步骤A2,将永固黄、实施例6制备的改性填料和另一半无水乙醇加入烧杯中,45℃水浴加热,150rpm搅拌20min后加入三亚乙基四胺,升温至74℃,继续搅拌30min,得到溶液b;
步骤A3,将溶液a加入溶液b中,230rpm搅拌20min,加入聚氧丙烯甘油醚和三羟甲基丙烷,超声分散60min,再以9500rpm转速搅拌1h后转移至干燥箱85℃干燥3h,得到产物;
步骤A4,将产物转移至球磨机球磨,转速为2500rpm,制得电路板加工用油墨。
对比例1
深圳市腾宇高新材料有限公司生产的丝印碳浆导电油墨。
对比例2
对比例2的油墨的制备方法参照实施例7,不同点在于不添加改性环氧树脂。
对比例3
对比例3的油墨的制备方法参照实施例7,不同点在于不添加改性填料。
将上述实施例7-9和对比例1-3得到的油墨以PET塑料膜为基底,使用200目的网版,进行丝网印刷,再在一定条件下干燥固化30min,最终得到厚度为10μm左右的固化的油墨膜,做如下测试:(1)硬度,根据GB/T 6739-2006,用具有规定尺寸、形状和硬度铅笔芯的铅笔推过油墨膜表面时,根据油墨膜表面产生一系列缺陷判断油墨膜硬度;(2)附着力,选用BGD 501自动型划圈法附着力测试仪,按国家标准GB/T1720-2020对样品进行附着力测试,附着力的等级分为1-7级,其中1级最好,7级最差;(3)导电性,使用四端子法(LorestaGPMCP-T610)对表面抵抗值进行测定,根据下述式计算体积电阻率,对导电性进行了评价,体积电阻率(μΩcm)=表面抵抗率×膜厚,(4)耐热性,热重测试,测试结果见表1:
表1
由表1可知,相较于对比例1-3,实施例7-9制备的油墨附着力好、硬度高、体积电阻率小,耐热温度高,故导电性能和耐热性更佳。
在说明书的描述中,参考术语“一个实施例”、“示例”、“具体示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上内容仅仅是对本发明所作的举例和说明,所属本技术领域的技术人员对所描述的具体实施例做各种各样的修改或补充或采用类似的方式替代,只要不偏离发明或者超越本权利要求书所定义的范围,均应属于本发明的保护范围。
Claims (8)
1.一种电路板加工用油墨,其特征在于,包括如下重量份的原料:水性聚氨酯15.6-20.3份、改性环氧树脂12.5-20.8份、颜料5.5-7.5份、固化剂2.2-4.5份、酚醛树脂8-10.1份、改性填料4.4-6.8份、交联剂2-5份、无水乙醇35.1-40.3份、聚氧丙烯甘油醚10.2-15.6份;
其中改性环氧树脂由如下步骤制得:
步骤S1,将苯基硅烷三醇、氢氧化钾、丙酮混合,升温25-30℃,加入二甲基一溴硅烷,升温70-75℃反应5-8h,制得中间体1;
步骤S2,将丁香酚、环氧氯丙烷、苄基三乙基氯化铵搅拌均匀后油浴2-3h后,加入氢氧化钠溶液,在80℃下反应5-6h,经水洗、蒸馏、过滤,得到中间体2;
步骤S3,将中间体2、karstedt催化剂,在35-39℃下搅拌均匀,加入中间体1,升温至98-99℃反应20-23h,蒸馏得到改性环氧树脂。
2.根据权利要求1所述的一种电路板加工用油墨,其特征在于:步骤S1所述苯基硅烷三醇、氢氧化钾、丙酮、二甲基一溴硅烷的用量比为0.05-0.06mol:0.07-0.08mol:14-18mL:0.03-0.04mol。
3.根据权利要求1所述的一种电路板加工用油墨,其特征在于:步骤S2所述丁香酚、环氧氯丙烷、苄基三乙基氯化铵、氢氧化钠溶液的用量比为5.2-5.5g:17.1-17.4g:1.7-1.8g:6-7g。
4.根据权利要求1所述的一种电路板加工用油墨,其特征在于:步骤S3所述中间体2、karstedt催化剂、中间体1的用量比为2.1-2.3g:0.05-0.08g:2-2.1g。
5.根据权利要求1所述的一种电路板加工用油墨的制备方法,其特征在于:包括如下制备步骤:
步骤A1,将水性聚氨酯、改性环氧树脂、酚醛树脂和一半无水乙醇加入三口烧瓶中,加热至60℃,保温1h后通入氮气排出空气,搅拌10-15min,升温至93℃,保温1h,得到溶液a;
步骤A2,将颜料、改性填料和另一半无水乙醇加入烧杯中,45℃水浴加热,搅拌均匀后加入固化剂,升温至70-74℃,继续搅拌30min,得到溶液b;
步骤A3,将溶液a加入溶液b中,搅拌均匀后,加入聚氧丙烯甘油醚和交联剂,超声分散,再搅拌1h后干燥,得到产物;
步骤A4,将产物转移至球磨机球磨,制得电路板加工用油墨。
6.根据权利要求5所述的一种电路板加工用油墨的制备方法,其特征在于:步骤A2所述颜料为酞青绿、酞青兰、炭黑、群青、锌钡白、永固紫、永固黄、钛白粉中任意一种,固化剂为乙烯基三胺、DETA和三亚乙基四胺中的一种或多种以任意比例混合。
7.根据权利要求5所述的一种电路板加工用油墨的制备方法,其特征在于:步骤A3所述交联剂为过氧化二异丙苯、二亚乙基三胺和三羟甲基丙烷中的一种或多种以任意比例混合。
8.根据权利要求5所述的一种电路板加工用油墨的制备方法,其特征在于:步骤A4所述球磨机的转速为2200-2500rpm。
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