CN116918469A - 冷却装置 - Google Patents

冷却装置 Download PDF

Info

Publication number
CN116918469A
CN116918469A CN202280018954.8A CN202280018954A CN116918469A CN 116918469 A CN116918469 A CN 116918469A CN 202280018954 A CN202280018954 A CN 202280018954A CN 116918469 A CN116918469 A CN 116918469A
Authority
CN
China
Prior art keywords
cooling tank
liquid
refrigerant liquid
cooling
refrigerant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280018954.8A
Other languages
English (en)
Chinese (zh)
Inventor
小原公和
柴田上仁
河本阳一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of CN116918469A publication Critical patent/CN116918469A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D9/00—Devices not associated with refrigerating machinery and not covered by groups F25D1/00 - F25D7/00; Combinations of devices covered by two or more of the groups F25D1/00 - F25D7/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202280018954.8A 2021-03-10 2022-02-11 冷却装置 Pending CN116918469A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-037980 2021-03-10
JP2021037980A JP7574701B2 (ja) 2021-03-10 2021-03-10 冷却装置
PCT/JP2022/005522 WO2022190766A1 (ja) 2021-03-10 2022-02-11 冷却装置

Publications (1)

Publication Number Publication Date
CN116918469A true CN116918469A (zh) 2023-10-20

Family

ID=83227586

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280018954.8A Pending CN116918469A (zh) 2021-03-10 2022-02-11 冷却装置

Country Status (4)

Country Link
US (1) US20230413482A1 (https=)
JP (1) JP7574701B2 (https=)
CN (1) CN116918469A (https=)
WO (1) WO2022190766A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12250791B2 (en) * 2021-11-24 2025-03-11 Microsoft Technology Licensing, Llc Systems and methods for recovering fluid in immersion-cooled datacenters
CN119678254A (zh) * 2022-11-02 2025-03-21 加特可株式会社 冷却装置
TWI881493B (zh) * 2023-10-12 2025-04-21 國立雲林科技大學 液冷散熱裝置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017150715A (ja) * 2016-02-24 2017-08-31 富士通株式会社 冷却装置及び電子装置
US20170295670A1 (en) * 2016-04-07 2017-10-12 Hamilton Sundstrand Corporation Immersion cooled electronic assemblies
JP2019016764A (ja) * 2017-07-05 2019-01-31 富士通株式会社 液浸冷却装置及び情報処理装置
CN109757060A (zh) * 2017-11-03 2019-05-14 阿里巴巴集团控股有限公司 冷却设备
US20190297754A1 (en) * 2019-06-14 2019-09-26 Intel Corporation Liquid cooling system with sub atmospheric pressure coolant

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2748732B2 (ja) * 1991-07-19 1998-05-13 日本電気株式会社 液体冷媒循環システム
US8619425B2 (en) * 2011-10-26 2013-12-31 International Business Machines Corporation Multi-fluid, two-phase immersion-cooling of electronic component(s)
JP6278053B2 (ja) * 2016-03-28 2018-02-14 富士通株式会社 液浸冷却装置
JP6658888B2 (ja) 2016-07-26 2020-03-04 富士通株式会社 冷却装置及び電子装置
US11064631B2 (en) * 2017-07-05 2021-07-13 Fujitsu Limited Liquid immersion cooling device and information processing apparatus
JP7235959B2 (ja) * 2019-02-05 2023-03-09 富士通株式会社 液浸冷却装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017150715A (ja) * 2016-02-24 2017-08-31 富士通株式会社 冷却装置及び電子装置
US20170295670A1 (en) * 2016-04-07 2017-10-12 Hamilton Sundstrand Corporation Immersion cooled electronic assemblies
JP2019016764A (ja) * 2017-07-05 2019-01-31 富士通株式会社 液浸冷却装置及び情報処理装置
CN109757060A (zh) * 2017-11-03 2019-05-14 阿里巴巴集团控股有限公司 冷却设备
US20190297754A1 (en) * 2019-06-14 2019-09-26 Intel Corporation Liquid cooling system with sub atmospheric pressure coolant

Also Published As

Publication number Publication date
JP2022138221A (ja) 2022-09-26
US20230413482A1 (en) 2023-12-21
JP7574701B2 (ja) 2024-10-29
WO2022190766A1 (ja) 2022-09-15

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