CN116895631A - 模制电子封装及其制造方法 - Google Patents

模制电子封装及其制造方法 Download PDF

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Publication number
CN116895631A
CN116895631A CN202310372228.2A CN202310372228A CN116895631A CN 116895631 A CN116895631 A CN 116895631A CN 202310372228 A CN202310372228 A CN 202310372228A CN 116895631 A CN116895631 A CN 116895631A
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China
Prior art keywords
substrate
spring member
electronic component
contact
package
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CN202310372228.2A
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English (en)
Inventor
詹兴泉
陈伟良
张庭伟
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Nexperia BV
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Nexperia BV
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Publication of CN116895631A publication Critical patent/CN116895631A/zh
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Abstract

本公开的各方面涉及模制电子封装及其制造方法。该模制电子封装包括第一基板、第二基板、布置在第一基板上的电子元件、布置在第二基板、电子元件之间的弹簧件以及固化的模塑料的主体，该弹簧件包括第一接触部和第二接触部，该第一接触部相对于第二基板固定，该第二接触部与电子元件物理接触，该固化的模塑料的主体构造成包封电子元件和弹簧件并且将第一基板、第二基板、电子元件和弹簧件相互固定。第二基板和弹簧件是导电和/或导热的。

Description

模制电子封装及其制造方法
技术领域
本公开的各方面涉及模制电子封装(molded electronic package)及其制造方法。
背景技术
诸如半导体管芯(semiconductor dies)的电子元件可以布置在电子封装内，以保护该电子元件免受例如由于机械应力而导致的外部损坏。在模制电子封装中，电子元件可以部分或全部地被诸如固化的模塑料(solidified molding compound)的封装材料包封，从而保护该电子元件。
已知的模制电子封装中的电子元件包括多个端子，该多个端子可以通过封装触点(package contacts)从封装的外部接通，封装触点至少部分地布置在固化的模塑料的主体的外部。然后，可以将封装安装在诸如印刷电路板(PCB)等外表面(external surface)上，封装触点面向该外表面，用于形成到外部电路的电连接。
通常，封装包括导热基板、导电基板或两者。基板通过诸如焊接材料(soldermaterial)的粘合剂与电子元件连接。就导热基板的来说，基板可以形成用于电子元件的散热器。就导电基板来说，基板可以与电子元件的端子电连接，并且可以形成该封装的封装触点的一部分。例如，可以通过从导电基板的平面部延伸的一个或多个引线形成与至少一个封装触点的电连接，该导电基板布置在电子元件上，并且经由诸如焊接材料的导电粘合剂与电子元件电连接。
上述已知装置的缺点是在制造过程中电子元件顶部的导电粘合剂可能具有不一致的体积，可能导致基板在与电子元件连接之后倾斜。这会影响安装到外表面的封装的性能。此外，在将基板安装到电子元件之后，可能无法通过焊剂清洗工艺完全去除电子元件上的焊剂残留物或焊料颗粒。这可能显著影响封装的可靠性，甚至可能导致例如由于离子污染引起的电子元件的故障。
发明内容
本公开的各方面涉及模制电子封装及其制造方法，在本公开中，上述缺点不发生或几乎不发生。
下文将概述本文公开的某些实施例的各方面。应当理解，呈现这些方面仅为了向读者提供这些特定实施例的简要概述，并且这些方面不旨在限制本公开的范围。实际上，本公开可以涵盖可能未阐述的各方面和/或方面的组合。
根据本公开的一方面，提供一种模制电子封装，所述模制电子封装包括第一基板、第二基板和电子元件，所述电子元件布置在所述第一基板上。模制电子封装还包括弹簧件，所述弹簧件布置在所述第二基板和所述电子元件之间。所述弹簧件包括第一接触部和第二接触部，所述第一接触部相对于所述第二基板固定，所述第二接触部与所述电子元件物理接触。此外，所述模制电子封装包括固化的模塑料的主体，所述固化的模塑料的主体构造成包封所述电子元件和所述弹簧件并且将所述第一基板、所述第二基板、所述电子元件和所述弹簧件相互固定。所述第二基板和所述弹簧件是导电和/或导热的。
在根据本公开的模制电子封装中，所述第二基板经由所述弹簧件与所述电子元件连接，在制造期间，所述弹簧件变形并且压靠所述电子元件，从而在不需要粘合剂的情况下形成热连接和/或电连接。固化的模塑料的主体将所述第一和第二基板、电子元件和弹簧件相互固定，并且因此保持所述弹簧件和所述电子元件之间的物理连接。
所述弹簧件可以通过所述粘合层固定到所述第二基板，粘合层优选地包括诸如焊接材料的导电粘合材料。另外或可替代地，所述弹簧件可以通过所述第二基板中的凹槽固定到第二基板，第一接触部布置在所述凹槽中，所述凹槽构造成在平行于第二基板的方向上机械地锁定弹簧件的位置。另外或可替代地，所述弹簧件可以通过从第二基板延伸并且围绕所述第一接触部的一个或多个突起固定到第二基板，所述一个或多个突起构造成在平行于第二基板的方向上机械地锁定弹簧件的位置。
以这种方式，在制造模制电子封装期间，弹簧件可以相对于电子元件精确地定位。
第二基板和弹簧件可以各自是导热的。在另一实施例中，所述第二基板的表面的至少一部分可以暴露到模制电子封装的外部。以这种方式，所述第二基板可以形成用于电子元件的散热器，将来自电子元件的热量导出电子元件和朝向模制电子封装的外部传导。
另外或可替代地，所述第二基板和弹簧件可以是导电的。在另一实施例中，所述第二基板可以包括平面部，弹簧件布置在平面部和电子元件之间。所述第二基板还可以包括第一引线，所述第一引线与平面部一体地连接，从所述平面部延伸且延伸到固化的模塑料的主体的外部。所述第一引线可以经由所述平面部和弹簧件与所述电子元件的端子电连接，并且所述第一引线可以形成模制电子封装的封装触点。
第二基板可以包括印刷电路板(PCB)，所述印刷电路板包括介电层和布置在所述介电层上的电路。所述电路可以通过弹簧件与电子元件电连接。
弹簧件可包括含铜合金(例如铍铜合金或钛铜合金)。
第一基板可以是导电的，并且可以与电子元件的端子电连接。第一基板可以包括焊盘部，电子元件布置在焊盘部上。
焊盘部可以包括暴露到模制电子封装的外部的表面，并且所述表面可以形成模制电子封装的封装触点。另外或可替代地，第一基板还可包括与焊盘部一体形成的第二引线，所述第二引线从所述焊盘部延伸并延伸到固化的模塑料的主体的外部。所述第二引线可以形成模制电子封装的封装触点。
所述电子元件可以包括集成有电路的半导体管芯，所述电路包括与电子元件的端子相对应的多个端子。第一基板可以包括管芯焊盘。
模制电子封装还可以包括另一(a further)封装触点，所述另一封装触点的第一端在固化的模塑料的主体的外部，并且所述另一封装触点的第二端由固化的模塑料的主体包封。此外，模制电子封装可以包括另一弹簧件，所述另一弹簧件包括第一另一接触部和第二另一接触部，所述第一另一接触部接触第二基板，所述第二另一接触部接触另一封装触点。所述另一弹簧件可以是导电的。在一些实施例中，所述另一弹簧件可以与所述弹簧件一体地连接。
平面部和焊盘部可以基本上彼此平行地延伸。
根据本公开的另一实施例，提出一种上述模制电子封装的制造方法。所述方法包括a)提供第一基板、第二基板、电子元件和弹簧件。所述电子元件布置在所述第一基板上。所述第二基板和弹簧件是导电和/或导热的。所述方法还包括b)将所述弹簧件布置在所述第二基板和电子元件之间，其中弹簧件的第一接触部相对于第二基板固定，并且其中弹簧件的第二接触部布置成接触电子元件。
所述方法还包括c)施加模塑料，以及d)允许所述模塑料固化，从而形成固化的模塑料的主体，所述固化的模塑料的主体封装电子元件和弹簧件并且将第一基板、第二基板、电子元件和弹簧件相互固定。
所述方法还包括至少在步骤d)的至少一部分期间向第二基板施加力，所述力允许弹簧件的第二接触部变形并压靠在电子元件上。
在制造期间，施加力以使弹簧件变形并且将弹簧件压靠在电子元件上，这在弹簧件与电子元件之间形成物理接触，而不需要诸如导电粘合剂的粘合材料。当模塑料充分固化时，不再需要施加力，因为固化的模塑料的主体将弹簧件与电子元件相互固定。因此，可以减轻在电子元件上使用粘合剂的缺点。
步骤b)还可以包括通过粘合层相对于第二基板固定弹簧件，粘合层优选地包括诸如焊接材料的导电粘合材料。另外或可替代地，步骤b)还可以包括通过第二基板中的凹槽相对于第二基板固定弹簧件，第一接触部布置在所述凹槽中，所述凹槽构造成在平行于第二基板的方向上机械地锁定弹簧件的位置。另外或可替代地，步骤b)还可以包括通过从第二基板延伸并且围绕第一接触部的一个或多个突起相对于第二基板固定弹簧件，所述一个或多个突起构造成在平行于第二基板的方向上机械地锁定弹簧件的位置。
所述第二基板的表面的至少一部分可以保持不接触(be kept clear of)模塑料，并且所述力施加在第二基板的表面的所述部分上。在这种情况下，优选地，所述表面的所述部分位于弹簧件和电子元件的正上方。另外或可替代地，通过保持第二基板的表面的所述部分清洁，在第二基板是导热的情况下，第二基板可以形成用于电子元件的散热器。
第二基板的第一端部和相对的第二端部可以保持不接触模塑料，并且所述力可以施加在所述第一端部和第二端部上。优选地，根据所述力，可以以平衡的方式施加力，使得与弹簧件直接相邻的第一端部和第二端部之间的中间部分朝向电子元件直接在弹簧件上施加压力。以这种方式，不需要暴露第二基板的表面就可以施加力。
第二基板和弹簧件可以是导电的。弹簧件可与电子元件的端子电连接，并且第一端部和第二端部中的至少一者可形成模制电子封装的封装触点(例如以引线的形式)。
所述方法还可以包括提供另一封装触点和另一弹簧件，所述另一弹簧件是导电的并且优选地与所述弹簧件一体地连接。此外，所述方法可以包括将另一弹簧件布置在第二基板和所述另一封装触点之间，其中所述另一弹簧件的第一另一接触部接触第二基板，并且所述另一弹簧件的第二另一接触部接触所述另一封装触点。
所述另一封装触点可以包括保持不接触模塑料的端部，并且固化的模塑料的主体可以将第一基板、第二基板、电子元件、弹簧件以及所述一个或多个另一弹簧件相互固定。施加的所述力或另外施加的力可允许另一弹簧件的第一另一接触部或第二另一接触部变形并分别压靠在第二基板或另一封装触点上。
电子元件可以借助粘合层固定于第一基板，粘合层优选地为诸如使用焊接材料的导电粘合剂。或者，所述方法可包括使用粘合层将电子元件固定到第一基板。
附图说明
接下来，将参考附图更详细地描述本公开，其中：
图1是根据本公开的实施例的模制电子封装的分解图；
图2是根据本公开的实施例的模制电子封装的截面图；
图3A和3B是根据本公开的实施例的模制电子封装的立体图；
图4是根据本公开的实施例的模制电子封装的截面图；
图5是根据本公开的实施例的模制电子封装的分解图；
图6是根据本公开的实施例的模制电子封装的截面图；以及
图7A和图7B是根据本公开的实施例的模制电子封装的立体图。
具体实施方式
现结合附图描述本公开。要强调的是，根据工业中的标准实践，各种特征没有按比例绘制。事实上，为了清楚地讨论，各种特征的尺寸可以任意地增加或减小。
在附图中，类似的部件和/或特征可以具有相同的附图标记。此外，相同类型的各种部件可通过在附图标记之后加上破折号和区分类似部件的第二附图标记来区分。如果在说明书中仅使用第一附图标记，则该描述适用于具有相同第一附图标记的类似部件中的任一个，而与第二附图标记无关。
除非上下文明确要求，否则在整个说明书和权利要求书中，词语“包括”、“包含”等应被解释为包含性的意义，而不是排他性或穷举性的意义；也就是说，在“包括但不限于”的意义上。如本文所用，术语“连接”、“耦合”或其任何变体是指两个或多个元件之间的任何直接或间接连接或耦合；元件之间的耦合或连接可以是物理的、逻辑的、电磁的或其组合。另外，词语“本文”、“以上”、“以下”和类似含义的词语在用于本申请时是指本申请的整体而不是本申请的任何特定部分。在上下文允许的情况下，在详细描述中使用单数或复数的词语也可以分别包括复数或单数。关于两个或多个项目的列表的词语“或”覆盖了该词语的所有以下解释：列表中的任何项目、列表中的所有项目、以及列表中的项目的任何组合。
本文提供的技术的教导可以应用于其他系统，而不必应用于下面描述的系统。可以组合以下描述的各种示例的元素和动作以提供本技术的另一实施方案。本技术的一些替代实施方案不仅可包含除下文所提及的那些实施方案之外的额外元件，而且可包含更少元件。
根据以下详细描述，可以对该技术进行这些和其他改变。尽管本说明书描述了本技术的某些示例，并且描述了期望的最佳模式，但是无论本说明书显得多么详细，本技术都可以以许多方式来实现。系统的细节在其特定实施方式中可以有相当大的变化，同时仍然被本文公开的技术所包含。如上所述，当描述本技术的某些特征或方面时使用的特定术语不应被认为暗示该术语在这里被重新定义为限于该术语所关联的本技术的任何特定性质、特征或方面。通常，在以下权利要求中使用的术语不应被解释为将技术限制在说明书中公开的具体示例中，除非具体实施方式部分明确地定义了这样的术语。因此，本技术的实际范围不仅包括所公开的示例，而且还包括在权利要求下实践或实现本技术的所有等效方式。
为了减少权利要求的数量，下面以某些权利要求的形式呈现本技术的某些方面，但是申请人考虑了任何数量的权利要求形式的本技术的各个方面。
在图1中，示出了根据本公开的实施例的模制电子封装1a的一部分的分解图。图2示出了根据本公开的实施例的模制电子封装1a的截面图，并且图3A和图3B示出了模制电子封装1a的对应的立体图。
模制电子封装1a包括具有多个端子的电子元件4。例如，电子元件4是集成有电路的半导体管芯，该电路包括该多个端子。该多个端子可以布置在电子元件4的外表面处(例如顶表面和底表面)或在该外表面处可接通。
如图2、图3A和3B所示，模制电子封装1a包括固化模塑料6的主体，该固化模塑料6的主体封装电子元件4，以防止或至少限制该电子元件4例如由于机械或热应力而引起的损坏。
电子元件4布置在第一基板2的焊盘部2a上。在一个实施例中，电子元件4例如通过粘合层7与焊盘部2a连接。在一个示例中，电子元件4是半导体管芯，第一基板2是芯片焊盘。
第一基板2可以是导电的，并且可以与布置在电子元件4底表面处的电子元件4的端子电连接。例如，粘合层7可以是导电的，并且第一基板2可以通过粘合层7与电子元件4电连接。导电粘合层的示例包括诸如锡的焊料层或烧结层。如图2所示，第一基板2的表面可暴露到模制电子封装1a的外部，并可形成封装触点，通过该封装触点可接通电子元件4的端子。另外或可替代地，一个或一个以上引线可从焊盘部2a延伸，可经由该引线接通电子元件4的端子。在这种情况下，焊盘部2a也可由固化的模塑料6的主体包封。
另外或可替代地，第一基板2可以是导热的，并且可以至少部分地形成用于电子元件4的散热器。例如，来自电子元件4的热量可以至少部分地经由第一基板2传导到模制电子封装1a的外部。在本实施例中，由于没有在平面部3a的顶表面施加压力，所以该平面部3a可以由固化的模塑料6的主体包封，并且不需要在制造之后暴露到模制电子封装1a的外部。
模制电子封装1a还包括第二基板3，该第二基板3包括平面部3a和引线3b。在本实施例中，第二基板3是导电的。引线3b从该平面部3a延伸到固化的模塑料6的主体的外部而到达模制电子封装1a的外部。这里，引线3b可以构造成提供到电子元件的端子的外部通路(external access)。在一个示例中，引线3b与平面部3a一体地连接。
此外，模制电子封装1a包括弹簧件5，弹簧件5具有第一接触部5a和第二接触部5b。在本实施例中，弹簧件5是导电的。弹簧件5可以是弹性元件，当力直接或间接地施加到该弹性元件时，该弹性元件可以从其原始形状变形。弹簧件5可包括例如柔性导电材料(例如铍铜合金)。
第一接触部5a相对于第二基板3固定，并且可以与第二基板3物理接触或者可以与第二基板3连接。在一个示例中，第一接触部5a在平行于平面部3a的方向上与第二基板3机械地锁定。例如，第一接触部5a可以布置在平面部3a中的凹槽中，防止或限制第一接触部5a在平行于平面部3a的该方向上的移动。可替代地或另外，平面部3a包括一个或多个突起，该一个或多个突起布置成机械地锁定第一接触部5a。本公开还设想了将弹簧件5例如通过诸如导电粘合剂(例如，锡)的粘合剂、通过焊接等方式固定到第二基板3的其它方式。在本实施例中，弹簧件5与第二基板3电连接。
第二接触部5b与电子元件4的端子物理接触并且电连接。以这种方式，引线3b和/或平面部3a通过弹簧件5与该端子间接电连接，并可提供从模制电子封装1a的外部到该端子的外部通路。
固化的模塑料6的主体将第一基板2、第二基板3、电子元件4和弹簧件5相互固定。
可选地，第二基板3还包括用于在模制过程期间和之后增加模塑料的粘附性的模锁定结构(mold-lock structure)3c，将在下面进一步描述。此外，模锁定结构3c防止或限制了在固化的模塑料6的主体模制后和成型后，弹簧件5的回弹效应。模锁定结构3c也可作为热应力时的应力释放结构，以提升模制电子封装1a的可靠度。在一个实施例中，模锁定结构3c包括在第二基板3的平面部3a中的一个或多个凹槽(例如，如图1和2所示的三角形凹槽)。该凹槽可以在模制期间与模塑料接合，并且在模制之后与固化的模塑料6的主体接合。
接下来，参照图1和图2描述根据本公开的实施例的用于制造模制电子封装1a的方法。
在第一步骤中，提供第一基板2、第二基板3、电子元件4和弹簧件5。电子元件4可以已经设置在第一基板2上，或者该方法可以包括将电子元件4布置在第一基板2上或者经由粘合层7将电子元件4与第一基板2连接。此外，弹簧件5可以相对于第二基板3固定，或者该方法还可以包括如上所述的将弹簧件5固定到第二基板3。弹簧件5可以在相对于第二基板3固定弹簧件5之前、期间或之后布置在电子元件4和第二基板3之间。
接下来，施加模塑料以包封电子元件4和弹簧件5。如图2所示，模塑料也可部分地围绕第一基板2和第二基板3布置。随后，允许模塑料固化，从而形成固化的模塑料6的主体。
至少在允许模塑料固化的步骤的至少一部分期间，在第二基板3施加力P1以使弹簧件5变形，并且将第二接触部5b压靠在电子元件4上。在该步骤期间，可以在第一基板2上施加相反的另一力，或者在外表面上放置该结构，第一基板2面向该外表面。
弹簧件5的变形可增加第二接触部5b和电子元件4之间的接触面积。在一个示例中，电子元件4是半导体管芯，第二接触部5b可被压靠在该半导体管芯的金属化层上，其中该金属化层形成集成在半导体管芯上的电路的端子，或与集成在半导体管芯上的电路的端子电连接。
例如，当弹簧件5处于未变形状态时，第二接触部5b可具有弯曲表面。当施加力以将弹簧件5压靠在电子元件4上时，第二接触部5b可从其原始弯曲形状变形，从而使第二接触部5b与电子元件4之间的接触面积增加。这样做可以实现改进的按压接触，可有利于电子元件与弹簧件5之间的热接触或附加的电接触。由于弹簧件5相对于电子元件4固定，在模制步骤之后由固化的模塑料6基本上维持此接触面积。
如图1和图2所示，第一接触部5a可以是基本上平面的，而第二接触部5b是弯曲的。特别地，弹簧件5可以具有O形或U形形状，弹簧件5的一部分形成第二接触部5b。然而，可以设想弹簧件5具有其它形状，以允许根据模制期间施加的力而增加接触面积，并且本申请不限于任何这种特定形状。
通过调节模制期间施加的力的大小，可以相应地调节接触面积的尺寸。例如，可以调节接触面积的尺寸为大致与电子元件4的表面的面积一致，以最大化电子元件4和弹簧件5之间的接触面积以及导热性和/或导电性。因此，弹簧件5可以以适合于待封装的相应电子元件4的方式变形。
一旦模塑料充分固化，例如当固化模塑料6的主体已形成时，就不再需要力P1，因为弹簧件5在其变形形状下与电子元件4相互固定，并且即使不施加力P1，弹簧件5与电子元件4之间的接触也被维持。固化的模塑料6的主体保护电子元件4免受外部损坏，并且将第一基板2、第二基板3、电子元件4和弹簧件5相互固定。
如图2和3B所示，在模塑料固化后，平面部3a的一部分仍然可以暴露。只要第二基板3是导热的，该暴露的部分就可以用作电子元件4的散热器，并且可以允许在操作期间，电子元件4中耗散的部分热量经由该平面部3a从模制电子封装1a中传输出来。
在形成固化的模塑料6的主体后，引线3b可以例如成形为使得引线3b的表面与模制电子封装1a的底表面对准。这允许模制电子封装1容易地安装到平面的外表面(例如印刷电路板(PCB))。例如，引线3b可以成形为鸥翼形。或者，在施加模塑料并允许模塑料固化之前，引线3b已经预先形成为所需形状。例如，当提供第二基板3时，引线3b可以已经预先形成。
第一基板2可以以多个该第一基板(未示出)的行或阵列的形式提供，以基本上同时制造多个模制电子封装。为此，第一基板2可以包括突出部分2b，如图1所示，第一基板2通过该突出部分与诸如引线框架的框架(未示出)连接。在一个示例中，模制电子封装1a可以通过物理地切断突出部分2b与该框架之间的连接而从该框架分离。切断可包括来自由冲压和切割组成的群组的一个或一个以上动作，并且还可以包括形成引线，并且可以例如在施加模塑料且允许模塑料固化之后执行。
类似地，第二基板3可以设置成包括多个该第二基板(未示出)的行或阵列，用于基本上同时制造多个模制电子封装。此外，多个弹簧件5可以设置在各个第二基板3上。第二基板3可以包括突出部分(未示出)，第二基板3通过该突出部分与诸如引线框架的框架(未示出)连接。在一个示例中，模制电子封装1a可以通过物理地切断所述突出部分和所述框架之间的连接而从所述框架分离。切单(singulation)可包括来自由冲压或切割组成的群组的一个或一个以上动作，并且还可以包括形成引线，并且可以例如在施加模塑料且允许模塑料固化之后执行。
在图4中，示出了根据本公开的另一实施例的模制电子封装1a的截面图。图4中所示的各种元件可以与图2中的相同或相似。因此省略其详细描述。
图4中的横截面与图2中所示的横截面的主要区别在于，第二基板3的各个部分在相反侧延伸到固化的模塑料6的主体的外部。例如，第一引线3b可以布置在模制电子封装1a的两侧。在本实施例中，在制造过程中，力P2和P3可以以平衡的方式施加到第二基板3的两侧以使弹簧件5变形，并且将第二接触部5b压靠在电子元件4上，以在弹簧件5和电子元件4之间形成物理连接和电连接。在模塑料充分固化之后，形成固化的模塑料6的主体，固化的模塑料6的主体将电子元件4和弹簧件5相互固定，并且保持弹簧件5与电子元件4物理接触和电接触。
在图5中，示出了根据本公开的另一实施例的模制电子封装1b的一部分的分解图。图6示出了根据本公开的实施例的模制电子封装1b的截面图，并且图7A和7B示出了模制电子封装1b的对应的立体图。
图5-图7B的模制电子封装1b与图1-图4的模制电子封装1a的主要区别在于，模制电子封装1b还包括另一封装触点9和另一弹簧件，该另一弹簧件包括第一另一接触部8a和第二另一接触部8b。此外，在本实施例中，第二基板3可以是导热的，并且不需要包括任何引线。在本实施例中，第二基板3包括至少部分地暴露到模制电子封装1b的外部的表面，并且第二基板3可以形成用于电子元件4的散热器。
在本实施例中，所述另一弹簧件与弹簧件5一体地连接。然而，本公开不限于此，并且所述另一弹簧件可被代替为单独的和/或间隔开的弹簧件。
与弹簧件5类似，该另一弹簧件布置成相对于第二基板3固定。例如，第一另一接触部8a经由诸如导热粘合层的粘合层与第二基板3连接。第二另一接触部8b与另一封装触点9物理接触并且电连接。
此外，与弹簧件5类似，至少在允许模塑料固化的步骤的至少部分期间，通过施加到第二基板3的力，该另一弹簧件可以变形并且第二另一接触部8a可以压靠在另一封装触点9上。
作为上述方案的替代方案，尽管图中未示出，但是当该另一弹簧件没有与弹簧件5一体地连接时，该另一弹簧件相对于封装触点9固定，并且施加的所述力可以允许该另一弹簧件变形，使得第一另一接触部8a压靠在第二基板3上。
在模塑料已经固化之后，固化的模塑料6的主体可以将第一基板2、第二基板3、电子元件4、弹簧件5和该另一弹簧件相互固定。此外，固化的模塑料的主体可以保持第二另一接触部8b与封装触点9物理接触和电接触。
如本领域技术人员将理解的，在制造期间，另一封装触点9可以包括在与第一基板2或第二基板3相同的引线框架中。在这种情况下，模制电子封装1b的切单还可以包括切断封装触点9和引线框架之间的物理连接。
此外，另一封装触点9可以延伸到固化的模塑料6的主体的外部，并且提供到电子元件4的一个或多个端子的外部通路。在本实施例中，由于弹簧件5和该另一弹簧件是一体连接的，第二基板3不需要是导电的，并且另一封装触点9经由弹簧件5以及该另一弹簧件与电子元件电连接。在另一实施例中，弹簧件5和该另一弹簧件不是一体连接的，并且第二基板3是导电的，使得另一封装触点9经由弹簧件5、第二基板3以及该另一弹簧件与电子元件4电连接。
尽管图中未示出，但是可以布置附加的封装触点，并且例如通过使用附加的另一弹簧件、接合线等，附加的封装触点与电子元件4的附加端子电连接。
在上述实施例中，第二基板3形成散热器和/或形成电连接，该电连接提供到电子元件4的端子的外部通路。然而，本公开不限于此。虽然在图中未示出，但是在另一实施例中，第二基板3可以包括布置有电路的PCB，该电路经由弹簧件5与电子元件4电连接。该电路可布置在该PCB的介电层上。
以上随后的描述仅提供了优选的(多个)示例性实施例，并且不旨在限制本公开的范围、适用性或配置。相反，随后对优选示例性实施例的描述将为本领域技术人员提供用于实现本公开的优选示例性实施例的使能描述，应当理解，在不背离由所附权利要求限定的本公开的范围的情况下，可以对元件的功能和布置执行各种改变，包括来自不同实施例的特征的各种修改和/或组合。

Claims (15)

1.一种模制电子封装，包括：
第一基板；
第二基板；
电子元件，所述电子元件布置在所述第一基板上；
弹簧件，所述弹簧件布置在所述第二基板和所述电子元件之间，所述弹簧件包括第一接触部和第二接触部，所述第一接触部相对于所述第二基板固定，所述第二接触部与所述电子元件物理接触，所述弹簧件已被压靠在所述电子元件上，从而使所述第二接触部变形并增加所述第二接触部和所述电子元件之间的接触面积；以及
固化的模塑料的主体，所述固化的模塑料的主体包封所述电子元件和所述弹簧件并且将所述第一基板、所述第二基板、所述电子元件和所述变形的弹簧件相互固定，
其中所述第二基板和所述弹簧件是导电和/或导热的。
2.根据权利要求1所述的模制电子封装，其中，所述弹簧件借助以下结构固定到所述第二基板：
粘合层，所述粘合层优选地包括导电粘合材料，例如焊接材料；和/或
所述第二基板中的凹槽，所述第一接触部布置在所述凹槽中，所述凹槽构造成在平行于所述第二基板的方向上机械地锁定所述弹簧件的位置；和/或
一个或多个突起，所述一个或多个突起从所述第二基板延伸并且围绕所述第一接触部，所述一个或多个突起构造成在平行于所述第二基板的方向上机械地锁定所述弹簧件的位置。
3.根据前述权利要求中任一项所述的模制电子封装，其中所述第二基板和所述弹簧件是导热的，其中所述第二基板的表面的至少一部分暴露到所述模制电子封装的外部，所述第二基板形成用于所述电子元件的散热器。
4.根据前述权利要求中任一项所述的模制电子封装，其中所述第二基板和所述弹簧件是导电的，并且其中所述第二基板包括：
平面部，所述弹簧件布置在所述平面部和所述电子元件之间；以及
第一引线，所述第一引线与所述平面部一体地连接，并且所述第一引线从所述平面部延伸并且延伸到所述固化的模塑料的主体的外部，
其中，所述第一引线经由所述平面部和所述弹簧件与所述电子元件的端子电连接，并且所述第一引线形成所述模制电子封装的封装触点。
5.根据权利要求1或2所述的模制电子封装，其中，所述第二基板包括印刷电路板PCB，所述印刷电路板PCB包括介电层和布置在所述介电层上的电路，其中，所述电路通过所述弹簧件与所述电子元件电连接。
6.根据前述权利要求中任一项所述的模制电子封装，其中所述弹簧件包括诸如铍铜合金或钛铜合金的含铜合金。
7.根据前述权利要求中任一项所述的模制电子封装，其中所述第一基板是导电的并且与所述电子元件的端子电连接，其中，所述第一基板包括布置有所述电子元件的焊盘部，并且其中所述焊盘部包括暴露到所述模制电子封装的外部的表面，所述表面形成所述模制电子封装的封装触点，和/或其中所述第一基板还包括与所述焊盘部一体形成的第二引线，所述第二引线从所述焊盘部延伸并且延伸到所述固化的模塑料的主体的外部，其中所述第二引线形成所述模制电子封装的封装触点；和/或
其中，所述电子元件包括集成有电路的半导体管芯，其中，所述电路包括与所述电子元件的端子相对应的多个端子，其中，所述第一基板优选地包括管芯焊盘。
8.根据前述权利要求中任一项所述的模制电子封装，还包括：
另一封装触点，所述另一封装触点的第一端在所述固化的模塑料的主体外部，并且所述另一封装触点的第二端由所述固化的模塑料的主体包封；
另一弹簧件，所述另一弹簧件包括第一另一接触部和第二另一接触部，所述第一另一接触部接触所述第二基板，所述第二另一接触部接触所述另一封装触点，其中所述另一弹簧件是导电的，
其中，优选地，所述另一弹簧件与所述弹簧件一体地连接。
9.根据权利要求4和7所述的模制电子封装，其中所述平面部和所述焊盘部基本上彼此平行地延伸。
10.一种用于制造模制电子封装的方法，所述方法包括：
a)提供第一基板、第二基板、电子元件和弹簧件，其中所述电子元件布置在所述第一基板上，其中所述第二基板和所述弹簧件是导电和/或导热的；
b)将所述弹簧件布置在所述第二基板与所述电子元件之间，其中所述弹簧件的第一接触部相对于所述第二基板固定，并且其中所述弹簧件的第二接触部布置成与所述电子元件物理接触；
c)施加模塑料；以及
d)允许所述模塑料固化，从而形成固化的模塑料的主体，所述固化的模塑料的主体封装所述电子元件和所述弹簧件并且将所述第一基板、所述第二基板、所述电子元件和所述弹簧件相互固定，
其中所述方法还包括至少在步骤d)的至少一部分期间将力施加到所述第二基板，所述力允许所述弹簧件的所述第二接触部变形并且压靠在所述电子元件上，从而增加所述第二接触部与所述电子元件之间的接触面积。
11.根据权利要求10所述的方法，其中步骤b)还包括借助以下结构相对于所述第二基板固定所述弹簧件：
粘合层，优选地包括导电粘合材料，例如焊接材料；和/或
所述第二基板中的凹槽，第一接触部布置在所述凹槽中，所述凹槽构造成在平行于所述第二基板的方向上机械地锁定所述弹簧件的位置；和/或
一个或多个突起，所述一个或多个突起从所述第二基板延伸并且围绕所述第一接触部，所述一个或多个突起构造成在平行于所述第二基板的方向上机械地锁定所述弹簧件的位置。
12.根据权利要求10或11所述的方法，其中，所述第二基板的表面的至少一部分保持不接触模塑料，并且其中，所述力施加在所述第二基板的表面的所述部分；和/或
其中，所述第二基板的第一端部和相对的第二端部保持不接触模塑料，并且其中，所述力施加在所述第一端部和第二端部；和/或
其中所述第二基板是导热的并且形成用于电子元件的散热器。
13.根据权利要求10-12中任一项所述的方法，其中所述第二基板和所述弹簧件是导电的，并且其中所述弹簧件与所述电子元件的端子电连接，
其中，在引用权利要求12的情况下，所述第一端部和所述第二端部中的至少一者优选地形成模制电子封装的封装触点。
14.根据权利要求10-13中任一项所述的方法，其中所述方法还包括：
提供另一封装触点和另一弹簧件，所述另一弹簧件是导电的，并且所述另一弹簧件优选地与所述弹簧件一体地连接；以及
将所述另一弹簧件布置在所述第二基板和所述另一封装触点之间，其中所述另一弹簧件的第一另一接触部接触所述第二基板，并且所述另一弹簧件的第二另一接触部接触所述另一封装触点，
其中所述另一封装触点包括保持不接触模塑料的端部，其中所述固化的模塑料的主体将所述第一基板、所述第二基板、所述电子元件、所述弹簧件和所述另一弹簧件相互固定，
其中，施加的所述力或另外施加的力允许所述另一弹簧件的所述第一另一接触部或所述第二另一接触部变形并相应地压靠在所述第二基板或所述另一封装触点上。
15.根据权利要求10-14中任一项所述的方法，
其中，所述电子元件借助粘合层固定于所述第一基板，所述粘合层优选地为诸如焊接材料的导电粘合剂，或者
其中，所述方法包括使用粘合层将所述电子元件固定到所述第一基板。
CN202310372228.2A 2022-04-11 2023-04-10 模制电子封装及其制造方法 Pending CN116895631A (zh)

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