CN116848208A - 黏合剂组合物、膜状黏合剂、切割晶粒接合一体型膜、以及半导体装置及其制造方法 - Google Patents
黏合剂组合物、膜状黏合剂、切割晶粒接合一体型膜、以及半导体装置及其制造方法 Download PDFInfo
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- CN116848208A CN116848208A CN202280008971.3A CN202280008971A CN116848208A CN 116848208 A CN116848208 A CN 116848208A CN 202280008971 A CN202280008971 A CN 202280008971A CN 116848208 A CN116848208 A CN 116848208A
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/000553 WO2022149277A1 (fr) | 2021-01-08 | 2021-01-08 | Composition d'adhésif, adhésif sous forme de film, film intégré de découpage en dés et fixation de puce, et dispositif à semi-conducteurs ainsi que procédé de fabrication de celui-ci |
| JPPCT/JP2021/000553 | 2021-01-08 | ||
| PCT/JP2022/000139 WO2022149581A1 (fr) | 2021-01-08 | 2022-01-05 | Composition d'adhésif, adhésif sous forme de film, film intégré de découpage en dés et fixation de puce, et dispositif à semi-conducteurs ainsi que procédé de fabrication de celui-ci |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116848208A true CN116848208A (zh) | 2023-10-03 |
Family
ID=82357724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280008971.3A Pending CN116848208A (zh) | 2021-01-08 | 2022-01-05 | 黏合剂组合物、膜状黏合剂、切割晶粒接合一体型膜、以及半导体装置及其制造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2022149581A1 (fr) |
| KR (1) | KR20230129234A (fr) |
| CN (1) | CN116848208A (fr) |
| TW (1) | TW202237786A (fr) |
| WO (2) | WO2022149277A1 (fr) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5532575B2 (ja) * | 2007-10-22 | 2014-06-25 | 日立化成株式会社 | 接着シート |
| JP2009231469A (ja) * | 2008-03-21 | 2009-10-08 | Hitachi Chem Co Ltd | ダイボンドフィルム |
| JP5454018B2 (ja) * | 2009-09-01 | 2014-03-26 | 日立化成株式会社 | フィルム状接着剤、接着シート及び半導体装置 |
| KR20160139043A (ko) | 2012-03-08 | 2016-12-06 | 히타치가세이가부시끼가이샤 | 접착시트 및 반도체 장치의 제조 방법 |
| JP5924145B2 (ja) * | 2012-06-12 | 2016-05-25 | 日立化成株式会社 | フィルム状接着剤、接着シート、及び半導体装置の製造方法 |
| JP6135202B2 (ja) * | 2013-03-08 | 2017-05-31 | 日立化成株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP6676884B2 (ja) * | 2015-06-02 | 2020-04-08 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板 |
| KR101953774B1 (ko) * | 2015-07-10 | 2019-05-17 | 주식회사 엘지화학 | 반도체 접착용 수지 조성물 및 다이싱 다이본딩 필름 |
| JP7298613B2 (ja) | 2018-07-11 | 2023-06-27 | 株式会社レゾナック | 半導体装置の製造方法、熱硬化性樹脂組成物及びダイシング・ダイボンディング一体型フィルム |
-
2021
- 2021-01-08 WO PCT/JP2021/000553 patent/WO2022149277A1/fr active Application Filing
-
2022
- 2022-01-05 CN CN202280008971.3A patent/CN116848208A/zh active Pending
- 2022-01-05 WO PCT/JP2022/000139 patent/WO2022149581A1/fr active Application Filing
- 2022-01-05 JP JP2022574059A patent/JPWO2022149581A1/ja active Pending
- 2022-01-05 KR KR1020237022628A patent/KR20230129234A/ko unknown
- 2022-01-06 TW TW111100544A patent/TW202237786A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022149277A1 (fr) | 2022-07-14 |
| TW202237786A (zh) | 2022-10-01 |
| KR20230129234A (ko) | 2023-09-07 |
| JPWO2022149581A1 (fr) | 2022-07-14 |
| WO2022149581A1 (fr) | 2022-07-14 |
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