CN116845014A - Groove type wafer cleaning and drying equipment - Google Patents
Groove type wafer cleaning and drying equipment Download PDFInfo
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- CN116845014A CN116845014A CN202311120567.8A CN202311120567A CN116845014A CN 116845014 A CN116845014 A CN 116845014A CN 202311120567 A CN202311120567 A CN 202311120567A CN 116845014 A CN116845014 A CN 116845014A
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- wafer
- air inlet
- drying
- tank body
- main tank
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- 238000001035 drying Methods 0.000 title claims abstract description 118
- 238000004140 cleaning Methods 0.000 title claims abstract description 99
- 238000007789 sealing Methods 0.000 claims abstract description 72
- 230000007246 mechanism Effects 0.000 claims abstract description 66
- 239000007788 liquid Substances 0.000 claims abstract description 24
- 235000012431 wafers Nutrition 0.000 claims description 171
- 238000013519 translation Methods 0.000 claims description 22
- 230000000712 assembly Effects 0.000 claims description 11
- 238000000429 assembly Methods 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 10
- 238000000605 extraction Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 abstract description 13
- 230000008569 process Effects 0.000 abstract description 11
- 230000005540 biological transmission Effects 0.000 abstract description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 84
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 29
- 239000008367 deionised water Substances 0.000 description 27
- 229910021641 deionized water Inorganic materials 0.000 description 27
- 239000007789 gas Substances 0.000 description 23
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 230000006872 improvement Effects 0.000 description 9
- 238000005406 washing Methods 0.000 description 5
- 230000007723 transport mechanism Effects 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 150000003377 silicon compounds Chemical class 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides groove type wafer cleaning and drying equipment which comprises a main groove body, wherein a cleaning groove, a drying component and a conveying mechanism are arranged in the main groove body, cleaning liquid of Cheng Fangjing circles in the cleaning groove, drying gas is introduced into the main groove body by the drying component, and the conveying mechanism drives a wafer to lift so as to separate from the cleaning groove and lift to the drying component; the drying assembly comprises an air inlet pipeline and an air inlet device, the air inlet device is arranged on the outer side of the main tank body, the air inlet pipeline is arranged in the main tank body and is positioned above a notch of the cleaning tank, and a plurality of divergent holes are uniformly formed in the air inlet pipeline along the length direction; the main tank body is connected with a sealing component for opening or closing the notch of the main tank body, and the bottom of the main tank body is connected with a vacuum device. The invention is used for solving the problems that the prior art needs to carry out the transmission between two stations between the wafer cleaning process and the wafer drying process so as to influence the wafer drying efficiency and the prior drying equipment has the problem that the wafer drying process takes too long time.
Description
Technical Field
The invention relates to the technical field of wafer cleaning, in particular to groove type wafer cleaning and drying equipment.
Background
In the process of processing each wafer, the wafer needs to be cleaned because the wafer contacts with pollutants such as various organic matters, particles, metal impurities and the like to cause the pollutants to adhere to the surface of the wafer, and the cleaned wafer needs to be dried to remove water stains on the surface and then is subjected to the subsequent wafer processing. Taking deionized water as a cleaning solution, the surface tension of the deionized water remained on the wafer is reduced by isopropyl alcohol (IPA) steam in the drying process so that the deionized water flows downwards until the deionized water is separated from the surface of the wafer, thereby effectively avoiding the problem of watermark generation of the wafer.
In the prior art, when isopropyl alcohol (IPA) steam is adopted for drying, two devices are generally adopted for a wafer cleaning process and a wafer drying process, namely, firstly, a wafer to be cleaned is put into a wafer cleaning device, after the wafer is cleaned, the wafer is transferred into a drying device, and isopropyl alcohol (IPA) steam is introduced into the drying device through an air pipe in the drying process to achieve the purpose of drying the wafer. In the prior art, a transfer process between different stations is required between the cleaning and drying processes, so as to affect the drying efficiency, and the mode of directly introducing isopropyl alcohol (IPA) vapor into the drying device needs to reach a certain concentration of the isopropyl alcohol (IPA) vapor in the whole drying device to achieve the purpose of reducing the surface tension of deionized water so as to enable the deionized water to fall from the surface of the wafer, so that a longer time is required for the wafer drying process.
In view of this, there is a need for an improved trough type wafer cleaning and drying apparatus in the prior art to solve the above-mentioned problems.
Disclosure of Invention
The invention aims to disclose a groove type wafer cleaning and drying device, which is used for solving the problems that in the prior art, the transmission between two stations is needed between a wafer cleaning process and a wafer drying process so as to influence the wafer drying efficiency, and the deionized water can be removed only by the existing drying device with the internal isopropyl alcohol (IPA) steam concentration reaching a certain degree, so that the wafer drying process takes too long time.
The invention provides a groove type wafer cleaning and drying device, which comprises: the main tank body is internally provided with a cleaning tank, a drying component and a conveying mechanism, wherein a Cheng Fangjing round cleaning liquid is arranged in the cleaning tank, the drying component is used for introducing drying gas into the main tank body, and the conveying mechanism drives a wafer to lift so as to separate from the cleaning tank and lift to the drying component;
the drying assembly comprises an air inlet pipeline and an air inlet device, the air inlet device is arranged on the outer side of the main tank body, the air inlet pipeline is arranged in the main tank body and is positioned above a notch of the cleaning tank, and a plurality of divergent holes are uniformly formed in the air inlet pipeline along the length direction;
the main tank body is connected with a sealing component for opening or closing the notch of the main tank body, and the bottom of the main tank body is connected with a vacuum device.
As a further improvement of the invention, the two groups of drying assemblies are arranged, each drying assembly comprises an air inlet device and two air inlet pipelines, the axes of the two air inlet pipelines connected with the same air inlet device are parallel to each other, and the connecting line at the midpoint of the axes of the two air inlet pipelines is parallel to the height direction of the main tank body;
the conveying mechanism comprises a wafer basket arranged in the main tank body and a lifting mechanism arranged outside the main tank body and connected with the wafer basket, the lifting mechanism drives the wafer basket to move along the height direction of the main tank body, the wafer basket uniformly forms a plurality of accommodating grooves for accommodating wafers, and the diameters of the wafers in the horizontal direction are parallel to the width direction of the main tank body in the state that the wafers are placed in the accommodating grooves;
the axis of the air inlet pipe is parallel to the length direction of the wafer basket, and a plurality of the diverging holes of the air inlet pipe are formed in one side close to the wafer basket.
As a further improvement of the invention, the main groove body is formed by surrounding two mounting plates which are parallel to each other, two supporting plates which are parallel to each other and a bottom plate, one side, close to each other, of each mounting plate is respectively connected with a group of mounting frames, each mounting frame comprises a sliding rail and a sliding block, the air inlet pipeline slides along the height direction of the mounting plate through the sliding rails and the sliding blocks, the sliding blocks are connected with fixing pieces, a plurality of fixing holes matched with the fixing pieces are uniformly distributed on the sliding rails along the height direction, and the air inlet pipeline is fixed relative to the mounting plates through the matching of the fixing pieces and the fixing holes.
As a further improvement of the invention, the lifting mechanism comprises a linear driving device and a bearing part, the wafer basket is connected with the bearing part through a back plate, and the driving end of the linear driving device drives the bearing part to displace along the height direction of the main groove body;
the linear driving device comprises a screw rod and a driving motor, the screw rod is arranged along the height direction of the main groove body, the driving end of the driving motor is coaxially fixed with the top end of the screw rod, the screw rod is in threaded fit with a driving block, and the driving block is fixedly connected with the bottom end of the bearing part.
As a further improvement of the invention, the sealing component comprises a sealing cover body, a translation mechanism and a pressing component, wherein the translation mechanism is arranged at the position, close to the notch, of the main groove body, and drives the sealing cover body to switch between a state of buckling the notch of the main groove body and a state of moving away from the notch of the main groove body;
the pushing component is arranged on one side, far away from the translation mechanism, of the main groove body and comprises a driving cylinder and a pushing component, the driving cylinder is connected with the main groove body, the top end of the driving cylinder is connected with the pushing component, the sealing cover body is buckled on the notch of the main groove body, and the driving end of the driving cylinder is retracted to enable the pushing component to prop against the top surface of the sealing cover body.
As a further improvement of the invention, the translation mechanism comprises a bearing plate and a translation assembly, wherein the translation assembly comprises a linear driving mechanism and a guide sliding rail, and the bearing plate is provided with a mounting hole for accommodating the linear driving mechanism along the length direction;
the sealing cover body is fixedly connected to the top surface of the driving end of the linear driving mechanism, the guide sliding rail is parallel to the length direction of the linear driving mechanism, the sealing cover body is in sliding fit with the guide sliding rail through the guide sliding block, the side wall of the main groove body is connected with the lifting cylinder, the driving end of the lifting cylinder extends upwards and is connected with the supporting plate, and the driving end of the lifting cylinder drives the supporting plate to lift.
As a further improvement of the invention, the lower surface of the sealing cover body is embedded with a sealing ring, the top surface of the main groove body is provided with a sealing groove around the notch, the sealing groove is embedded with the sealing ring, the sealing cover body is buckled with the notch of the main groove body, and the sealing ring is propped against the lower surface of the sealing cover body when the pressing component is propped against the top surface of the sealing cover body.
As a further improvement of the invention, the two sides of the cleaning tank, which are close to the two mounting plates, are respectively provided with a fixed column, the cleaning tank is arranged in the main tank body through the fixed columns, and a supporting plate which is far away from the lifting mechanism is provided with a liquid inlet and a liquid outlet which are communicated with the cleaning tank.
As a further improvement of the invention, the air inlet device is communicated with the air inlet nozzle, an air storage chamber is formed in the air inlet device, and the bottom surface of the air inlet device is communicated with the air outlet pipe.
As a further improvement of the invention, the bottom plate is provided with an air extraction opening, and the air extraction opening is connected with a vacuum device through an air extraction pipeline.
Compared with the prior art, the invention has the beneficial effects that: firstly, through drying component and the washing tank that set up from top to bottom in the main tank body, transport mechanism is used for placing a plurality of wafers that wait to wash, transport mechanism drives a plurality of wafers that its deposited and descends to the washing tank after, drive the wafer again and rise to drying component department after the washing is accomplished, the dry gas that gets into the admission line through air inlet unit contacts with the wafer of placing in transport mechanism department through a plurality of hole that diverge that are evenly distributed in the admission line, thereby realize not having required dry gas to be full of whole main tank body can realize good drying effect's purpose to the wafer, simultaneously, through transport mechanism to the wafer in the main tank body in washing tank and the removal of drying component between two processes, realized only through the effect of the washing and the drying of wafer of an equipment realization wafer simultaneously.
Secondly, because every group of drying components comprises an air inlet device and two air inlet pipelines which are parallel to each other, and the drying components are arranged into two groups, when the conveying mechanism drives the wafer to rise between the two groups of drying components, the drying gas flows to different heights of the wafer through the dispersing holes formed in the length direction of the four air inlet pipes, and the drying gas flowing to the wafer through the dispersing holes can uniformly flow between the two wafers through the setting of the direction formed in the accommodating groove of the wafer basket, so that the surface tension of deionized water is reduced by the drying gas, and deionized water is convenient to fall into the cleaning tank.
Finally, after the wafer to be cleaned is placed into the wafer basket through the sealing assembly formed by the sealing cover body, the translation mechanism and the pressing assembly, the conveying mechanism drives the wafer basket to descend into the cleaning tank, then the translation mechanism enables the sealing cover body to slide to the notch of the main tank body, and the pressing assembly abuts against the upper surface of the sealing cover body, so that the main tank body is in a clean environment, and the wafer cleaning effect is guaranteed. After the cleaning is finished, the state that the sealing cover body is buckled at the notch of the main groove body is continuously maintained, the vacuum device is started to enable the pressure in the main groove body to be lower than the external pressure, and the sealing state of the main groove body can be well ensured by the sealing cover body and the pressing component, so that the wafer drying can be normally carried out.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a tank type wafer cleaning and drying apparatus embodying the present invention;
FIG. 2 is a schematic view of the cross-section along the direction F-F in FIG. 1;
FIG. 3 is an exploded view of the present invention showing the assembly relationship of the main tank and the transfer mechanism;
FIG. 4 is a schematic view of a structure for embodying the installation position of the drying module and the cleaning tank in the main tank body in the present invention;
FIG. 5 is an enlarged view of portion A of FIG. 2;
FIG. 6 is a schematic diagram of the structure of FIG. 2, in which part B is enlarged and part B is partly blocked, for showing the matching relationship between the screw and the support part;
FIG. 7 is an exploded view of the present invention showing the assembly of the seal assembly in its entirety with the notch of the main channel;
FIG. 8 is an enlarged view of portion C of FIG. 2;
fig. 9 is an enlarged view of the portion D in fig. 7.
Detailed Description
The present invention will be described in detail below with reference to the embodiments shown in the drawings, but it should be understood that the embodiments are not limited to the present invention, and functional, method, or structural equivalents and alternatives according to the embodiments are within the scope of protection of the present invention by those skilled in the art.
Referring to fig. 1 to 9, compared with the conventional tank type wafer cleaning and drying apparatus, the tank type wafer cleaning and drying apparatus disclosed in fig. 1 to 9 has the advantages that compared with the conventional tank type wafer cleaning and drying apparatus, the cleaning tank 14 and the drying assembly 2 are arranged in the main tank body 1 from bottom to top, the wafer is placed in the conveying mechanism 3, and the conveying mechanism 3 drives a plurality of wafers placed therein to move up and down in the main tank body 1 to achieve the same station, that is, the cleaning and drying processes of the wafer can be sequentially achieved in the main tank body 1, compared with the prior art that the cleaning and drying processes of the wafer are required to be respectively carried out by two apparatuses, the action of transferring the wafer between the two stations at one time is saved, and therefore the cleaning and drying efficiency of the wafer is effectively improved. Further, through the drying component 2 formed by the air inlet pipeline 21 and the air inlet device 22, and a plurality of diffusion holes 211 for the dry gas to flow out are formed along the length direction of the air inlet pipeline 21, when the wafer is cleaned in the cleaning tank 14, the conveying mechanism 3 drives the wafer to rise to the position opposite to the drying component 2, the dry gas diffused by the diffusion holes 211 is directly contacted with the wafer, so that the purpose of reducing the surface tension of the deionized water attached to the wafer after cleaning is achieved, the deionized water is enabled to sink into the cleaning tank 14 under the gravity, and compared with the prior art, the dry gas is directly led into the drying equipment, the dry gas flows in disorder in the drying equipment, and the dry gas in the drying equipment is required to reach a certain concentration to achieve a good drying effect, so that the drying process of the wafer is accelerated, and the drying time of the wafer is further saved.
Referring to fig. 1 to 9, in the present embodiment, a tank type wafer cleaning and drying apparatus (hereinafter referred to as a cleaning and drying apparatus) includes: the main tank body 1, a cleaning tank 14, a drying component 2 and a conveying mechanism 3 are arranged in the main tank body 1, cheng Fangjing round cleaning liquid is arranged in the cleaning tank 14, the drying component 2 is used for introducing drying gas into the main tank body 14, and the conveying mechanism 3 drives the wafer to lift so as to separate from the cleaning tank 14 and lift to the drying component 2; the drying assembly 2 comprises an air inlet pipeline 21 and an air inlet device 22, the air inlet device 22 is arranged on the outer side of the main tank body 1, the air inlet pipeline 21 is arranged in the main tank body 1 and is positioned above a notch of the cleaning tank 14, and a plurality of divergent holes 211 are uniformly formed in the air inlet pipeline 21 along the length direction; the main tank body 1 is connected with a sealing component 5 for opening or closing the notch of the main tank body 1, and the bottom of the main tank body 1 is connected with a vacuum device 4.
When the wafer is required to be cleaned and dried sequentially, the wafer is put into the conveying mechanism 3 in batches by a conveying device (not shown) such as a mechanical arm, and after the placement is completed, the conveying mechanism 3 drives the wafer to descend until the wafer is immersed into the wafer cleaning liquid contained in the cleaning tank 14, and it should be noted that deionized water contained in the cleaning tank 14 is used as the wafer cleaning liquid in the embodiment, however, the wafer cleaning liquid capable of being contained in the cleaning tank 14 may be any liquid medicine for cleaning the wafer. After the wafer is cleaned, the conveying mechanism 3 drives the wafer to rise to the drying component 2 above the notch of the cleaning tank 14, dry gas is introduced into the air inlet device 22, enters the main tank body 1 through the air inlet pipeline 21 communicated with the air inlet device 22, and escapes to be in direct contact with the wafer placed on the conveying mechanism 3 through the dispersing holes 211, so that the aim of enabling deionized water remaining on the surface of the wafer to fall into the cleaning tank 14 is achieved.
Because the surface of the wafer has fine structures such as grooves, platforms, lines, cavities and the like, after the wafer is cleaned, liquid cleaning agents such as deionized water can be gathered in the fine structures such as the grooves and the like, and the liquid adheres to the surface of the wafer due to the surface tension existing in the liquid. The wafer is a semiconductor substrate made of silicon material, deionized water is an aggressive solvent, and when the wafer is cleaned by adopting the deionized water, the phenomenon that the wafer is dissolved is difficult to occur due to shorter contact time in the cleaning process, but deionized water attached to the surface of the wafer after the wafer is cleaned possibly reacts with the surface of the wafer in the drying process to generate a small amount of silicon compounds, and the silicon compounds are attached to the surface of the wafer to generate watermarks along with the drying process of the wafer. And in the method for drying the wafer by adopting isopropyl alcohol (IPA) steam, the isopropyl alcohol (IPA) steam is dissolved in deionized water remained on the surface of the wafer so as to reduce the surface tension of the deionized water and enable the deionized water to flow downwards to be separated from the surface of the wafer, thereby effectively avoiding the generation of watermarks.
Referring to fig. 2 to 6, the drying assemblies 2 are provided in two groups, and each of the two groups of drying assemblies 2 includes one air inlet device 22 and two air inlet pipes 21, axes of the two air inlet pipes 21 connected to the same air inlet device 22 are parallel to each other, and a line at a midpoint of the axes of the two air inlet pipes 21 is parallel to a height direction of the main tank body 1. The air inlet device 22 is communicated with the air inlet nozzle 221, an air storage chamber 222 is formed in the air inlet device 22, and the bottom surface of the air inlet device 22 is communicated with the air outlet pipe 223. The conveying mechanism 3 comprises a wafer basket 31 arranged in the main tank body 1 and a lifting mechanism 32 arranged outside the main tank body 1 and connected with the wafer basket 31, the lifting mechanism 32 drives the wafer basket 31 to move along the height direction of the main tank body 1, the wafer basket 31 uniformly forms a plurality of containing grooves 312 for containing wafers, and the diameter of the horizontal direction of the wafers is parallel to the width direction of the main tank body 1 in the state that the plurality of wafers are placed in the containing grooves 312; the axis of the air inlet pipe 21 is parallel to the length direction of the wafer basket 31, and the divergent holes 211 of the plurality of air inlet pipes 21 are all opened at the side close to the wafer basket 31. The main tank body 1 is enclosed by two mounting plates 11 which are parallel to each other, two supporting plates 12 which are parallel to each other and a bottom plate 13, one side, close to each other, of the two mounting plates 11 is respectively connected with a group of mounting frames 15, each mounting frame 15 comprises a sliding rail 151 and a sliding block 152, an air inlet pipeline 21 slides along the height direction of the mounting plate 11 through the sliding rail 151 and the sliding block 152, the sliding block 152 is connected with a fixing piece 153, the sliding rail 151 is uniformly distributed with a plurality of fixing holes 1511 which are matched with the fixing piece 153 along the height direction, and the air inlet pipeline 21 is fixed relative to the mounting plate 11 through the matching of the fixing piece 153 and the fixing holes 1511.
Referring specifically to fig. 3 and 4, fig. 3 is a schematic structural view showing only the cleaning tank 14, the conveying mechanism 3 and the drying assembly 2 after the main tank 1 is removed, and specifically, a schematic state in which the wafer basket 31 is located in the cleaning tank 14, and fig. 4 is a partially enlarged view showing a mating relationship between a set of drying assemblies 2 and the mounting frame 15 in fig. 2. The mounting frame 15 specifically includes two sliding rails 151 disposed along the height direction of the mounting plate 11 and a sliding block 152 slidably matched with the two sliding rails 151, and two ends of two air inlet pipelines 21 forming the same group of drying assemblies 2 are fixedly connected with the two sliding blocks 152 respectively, and connection points between two ends of the two air inlet pipelines 21 and the two sliding blocks 152 are distributed up and down. The fixing piece 153 is connected to one slide block 152 of the same group of mounting frames 15, and in the process that the fixing piece 153 slides up and down along with the slide block 152, the fixing holes 1511 correspondingly formed in the slide rail 151 are screwed up through bolts (not labeled), so that the purpose of adjusting the heights of the two air inlet pipelines 21 is achieved, and the height of the air inlet pipelines 21 is conveniently fixed while the heights of the air inlet pipelines 21 are adjusted according to different wafer drying requirements.
Further, after the wafers are placed in the wafer basket 31, the wafers are sequentially placed in the plurality of accommodating grooves 312 formed in the wafer basket 31 in the same direction, and the above description indicates that when the wafers are sequentially placed in the plurality of accommodating grooves 312, the diameter of the wafers in the horizontal direction is consistent with the width direction of the main groove body 1, i.e. the plane of the wafers is parallel to the plane of the support plate 12. Meanwhile, as the two groups of drying assemblies 2 are respectively connected to the two parallel mounting plates 11 through the two groups of mounting frames 15, and the length directions of the four air inlet pipelines 21 are all arranged along the length direction of the main tank body 1, namely the width direction of the mounting plates 11, when the wafer basket 3 drives the wafer to be lifted between the two groups of drying assemblies 2 from the inside of the cleaning tank 14, the air inlet pipelines 21 are uniformly distributed in the dispersing holes 211 of the four air inlet pipelines 21 to blow out drying gas to the wafer basket 31, and due to the arrangement mode of the accommodating groove 312 and the air inlet pipelines 21, the drying gas blown out by the dispersing holes 211 can flow between two adjacent wafers and directly contact with the surfaces of the wafers under the condition of not being blocked by the thickness of the wafers, so that the surface tension of deionized water on the surfaces of the wafers is directly reduced, and compared with the aim of enabling the deionized water to fall, the aim that the concentration of the isopropyl alcohol (IPA) steam in the disordered drying equipment flowing in the drying equipment in the prior art can be effectively removed, and the whole wafer drying process efficiency is further improved.
Further, in the present embodiment, the air inlet device 22 of each set of drying assemblies 2 is connected to two air inlet pipes 21 through two connecting pipes 224, and the connecting pipes 224 are made of a hose material, so that the normal lifting of the air inlet pipes 21 along the sliding rails 151 is not affected. Through the structural design of the air inlet device 22, when the wafer is dried by adopting independent isopropyl alcohol (IPA) steam or mixed gas of isopropyl alcohol (IPA) steam and nitrogen, the mixed gas is directly introduced through the air inlet nozzle 221; if the wafer is dried by introducing isopropyl alcohol (IPA) vapor through the air inlet device 22 and then introducing nitrogen into the air inlet device 22, the isopropyl alcohol (IPA) vapor and the nitrogen need to be introduced into the air inlet device 22 through the air inlet nozzle 221. The air storage chamber 222 formed in the air inlet device 22 can retain a small amount of the drying gas, and the air outlet pipe 223 communicated with the air storage chamber 222 is in a closed state, so that the retained drying gas can be used for next wafer drying, and if other drying gases need to be replaced, the air outlet pipe 223 is opened to discharge the residual gas, thereby avoiding the occurrence of the condition that the drying gas is polluted. The nitrogen gas introduced into the gas inlet device 22 is heated nitrogen gas, isopropyl alcohol (IPA) vapor is used to remove deionized water from the wafer surface, and the heated nitrogen gas is used to dry the wafer.
Referring to fig. 2 to 6, the lifting mechanism 32 includes a linear driving device 321 and a supporting portion 322, the wafer basket 31 is connected to the supporting portion 322 through the back plate 311, and a driving end of the linear driving device 321 drives the supporting portion 322 to displace along the height direction of the main tank 1; the linear driving device 321 comprises a screw rod 3211 and a driving motor 3212, the screw rod 3211 is arranged along the height direction of the main groove body 1, the driving end 3212 of the driving motor is coaxially fixed with the top end of the screw rod 3211, the screw rod 3211 is in threaded fit with a driving block 323, and the driving block 323 is fixedly connected with the bottom end of the supporting portion 322. Specifically, the supporting portion 322 is composed of a supporting block 3221 and a supporting column 3222, as shown in fig. 5, the supporting block 3221 is fixedly connected to a side surface of the driving block 323, the bottom end of the supporting column 3222 is connected to the upper surface of the supporting block 3221, and the top end of the supporting column 3222 passes through the main tank body 1 through the connecting block 324 to vertically fix the back plate 311. It should be noted that the connection block 324 passes through the support plate 12 far from the air inlet device 22, and the support plate 12 forms a lifting hole 123 for lifting the connection block 324 up and down, and the outer sides of the lifting hole 123 and the support column 3222 cover the sealing cover 16, and the top end of the sealing cover 16 abuts against the top plate (not labeled) of the main tank 1.
The driving end of the driving motor 3212 drives the screw rod 3211 to rotate, and the driving block 323 in threaded fit with the screw rod 3211 is lifted along the screw rod 3211, so that the supporting block 3221 and the supporting column 3222 are sequentially driven to move, and the wafer basket 31 is driven to lift through the connecting block 324 and the backboard 311. In the initial state, the wafer basket 31 is positioned at the notch near the main tank body 1, the wafers are placed in the wafer basket 31 in batches by a conveying device (not shown) such as a mechanical arm, and the driving motor 3212 is started to enable the wafer basket 31 to descend into the cleaning tank 14 and then the driving motor 3212 is closed. After the wafer cleaning is completed, the driving motor 3212 is started again to lift the wafer basket 31 from the cleaning tank 14 to a position between the two drying assemblies 2, and then the driving motor 3212 is turned off. After the completion of the wafer drying, the driving motor 3212 is started again to lift the wafer basket 31 to a position close to the notch of the main tank body 1, and the wafers are taken out in batch by a transfer apparatus (not shown) such as a robot. The lifting mechanism 32 drives the wafer basket 31 to switch among three heights in the main tank body 1 so as to carry out four steps of placing, cleaning, drying and lifting of the wafer, and the structure is simple and easy to control. It should be noted that, the screw rod 3211 is rotatably connected to the inside of the supporting column 33, the driving motor 3212 is fixed to the top end of the supporting column 33, a cavity (not labeled) with the width identical to that of the driving block 323 is formed in the supporting column 33, and two sides of the driving block 323 are respectively attached to two sides of the cavity (not labeled) so as to achieve the guiding function of the driving block 323.
Referring to fig. 7 to 9, the sealing assembly 5 includes a sealing cover 51, a translation mechanism 52 and a pressing assembly 54, the translation mechanism 52 is disposed at a position of the main groove 1 near the notch, and the translation mechanism 52 drives the sealing cover 51 to switch between a state of buckling the notch of the main groove 1 and a state of moving away from the notch 1 of the main groove; the pushing component 54 is disposed on one side of the main tank body 1 far away from the translation mechanism 52, the pushing component 54 includes a driving cylinder 541 and a pushing member 542, the driving cylinder 541 is connected to the main tank body 1, the top end of the driving cylinder 541 is connected to the pushing member 542, and the sealing cover 51 is buckled in the notch state of the main tank body 1, and the driving end of the driving cylinder 541 retracts to enable the pushing member 542 to prop against the top surface of the sealing cover 51.
Referring to fig. 7 to 9, the translation mechanism 52 includes a support plate 521 and a translation assembly 522, the translation assembly 522 includes a linear driving mechanism 5221 and a guide rail 5222, and the support plate 521 is provided with a mounting hole 523 for accommodating the linear driving mechanism 5221 in a length direction; the sealed lid 51 rigid coupling is in the drive end top surface of linear drive mechanism 5221, and guide slide 5222 is on a parallel with linear drive mechanism 5221's length direction setting, and sealed lid 51 is through guide slider 531 and guide slide 5222 sliding fit, and lift cylinder 55 is connected to main tank body lateral wall 1, and the drive end of lift cylinder 55 upwards extends and links to each other with the bearing board 521, and the drive end of lift cylinder 55 drives the bearing board 521 and goes up and down. The top surface of the main tank body 1 is provided with a sealing groove 511 around the notch, a sealing ring (not shown) is embedded in the sealing groove 511, and the sealing cover body 51 is buckled on the notch of the main tank body 1 and the sealing ring (not shown) abuts against the lower surface of the sealing cover body 51 in a state that the pressing member 542 abuts against the top surface of the sealing cover body 51.
It should be noted that, the connecting plate 53 is disposed below the supporting plate 521, two sides of the connecting plate 53 span two sides of the supporting plate 521 and are connected to the sealing cover 51, in this embodiment, the guide sliding rails 5222 are connected to the lower surface of the supporting plate 521, the guide sliding blocks 531 are mounted on the upper surface of the connecting plate 53 and are slidably matched with the guide sliding rails 5222, the guide sliding rails 5222 are disposed in two and symmetrically distributed on two sides of the mounting hole 523, and the number of the guide sliding blocks 531 is equal to that of the guide sliding rails 5222. The linear driving mechanism 5221 may be a linear motor, a linear cylinder, or other components capable of achieving a linear driving effect, in this embodiment, the linear driving mechanism 5221 is a rodless linear cylinder, the sealing cover 51 is connected to the driving end thereof as shown in fig. 6, after the wafer is placed in the wafer basket 31, the linear driving mechanism 5221 drives the sealing cover 51 to move toward the notch of the main tank 1 until completely covering the notch of the main tank 1, and the connecting plate 53 and the guide slider 531 slide synchronously along with the sealing cover 51 in the moving process. The connection plate 53 is used only for mounting the guide slider 531 as shown in fig. 6, and thus has a very small width without interfering with the movement of the sealing cover 51. When the sealing cover 51 completely covers the notch of the main tank 1, the piston rod of the driving cylinder 541 is lowered to drive the pressing member 542 to abut against the upper surface of the sealing cover 51, and a sealing ring (not shown) embedded in the sealing groove 511 cooperates with the sealing cover 51 to achieve a good sealing effect on the main tank 1. Further, the lifting cylinder 55 connected with the supporting plate 521 can adjust the overall height of the sealing assembly 5, so as to adjust the height of the sealing cover 51, thereby avoiding serious friction caused by too close distance between the sealing cover 51 and the main tank 1 in the moving process, or reducing the sealing effect caused by too small distance between the sealing cover 51 and the main tank 1.
Referring to fig. 1 and 2, the two sides of the cleaning tank 14 close to the two mounting plates 11 form fixing columns 141, the cleaning tank 14 is mounted in the main tank body 1 through the fixing columns 141, and the supporting plate 12 far away from the lifting mechanism 3 is provided with a liquid inlet 121 and a liquid outlet 122 for communicating the cleaning tank 14. The bottom plate 13 is provided with an air extraction opening 131, and the air extraction opening 131 is connected with the vacuum device 14 through an air extraction pipeline 132. It should be noted that, in this embodiment, the liquid inlet 121 and the liquid outlet 122 formed in the main tank body 1 may be respectively connected to the cleaning tank 14 through hoses (not shown), one end of each hose (not shown) is connected to the liquid inlet 121 or the liquid outlet 122, and the other end of each hose is directly placed in the cleaning tank 14 through a notch, deionized water is first introduced into the cleaning tank 14 through the liquid inlet 121 to fill the cleaning tank 14, during the wafer cleaning process, the liquid outlet 122 draws out deionized water in the cleaning tank 14 through the hoses (not shown) and simultaneously introduces clean deionized water into the cleaning tank through the liquid inlet 121, so as to maintain the flowing state and the cleaning degree of the deionized water in the cleaning tank 14, thereby improving the wafer cleaning effect. The fixing columns 141 formed at both sides of the cleaning tank 14 may be fixed through a tank body (not shown) which is opened near the bottom of the main tank body 1, or may be fixed through the fixing columns 141 in any other manner, which will not be described herein. In this embodiment, the vacuum device 4 is set as an air pump, and the vacuum device 4 is started after the wafer cleaning is completed, and at this time, the sealing cover 51 seals the top of the main tank 1, so that the vacuum device 4 is started to effectively reduce the air pressure in the main tank 1, and improve the water printing effect of wafer drying.
The above list of detailed descriptions is only specific to practical embodiments of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent embodiments or modifications that do not depart from the spirit of the present invention should be included in the scope of the present invention.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (10)
1. A tank wafer cleaning and drying apparatus, comprising: the main tank body is internally provided with a cleaning tank, a drying component and a conveying mechanism, wherein a Cheng Fangjing round cleaning liquid is arranged in the cleaning tank, the drying component is used for introducing drying gas into the main tank body, and the conveying mechanism drives a wafer to lift so as to separate from the cleaning tank and lift to the drying component;
the drying assembly comprises an air inlet pipeline and an air inlet device, the air inlet device is arranged on the outer side of the main tank body, the air inlet pipeline is arranged in the main tank body and is positioned above a notch of the cleaning tank, and a plurality of divergent holes are uniformly formed in the air inlet pipeline along the length direction;
the main tank body is connected with a sealing component for opening or closing the notch of the main tank body, and the bottom of the main tank body is connected with a vacuum device.
2. The tank wafer cleaning and drying apparatus according to claim 1, wherein the drying assemblies are arranged in two groups, each of the two groups of drying assemblies comprises an air inlet device and two air inlet pipelines, the axes of the two air inlet pipelines connected with the same air inlet device are parallel to each other, and the connecting line at the midpoint of the axes of the two air inlet pipelines is parallel to the height direction of the main tank body;
the conveying mechanism comprises a wafer basket arranged in the main tank body and a lifting mechanism arranged outside the main tank body and connected with the wafer basket, the lifting mechanism drives the wafer basket to move along the height direction of the main tank body, the wafer basket uniformly forms a plurality of accommodating grooves for accommodating wafers, and the diameters of the wafers in the horizontal direction are parallel to the width direction of the main tank body in the state that the wafers are placed in the accommodating grooves;
the axis of the air inlet pipe is parallel to the length direction of the wafer basket, and a plurality of the diverging holes of the air inlet pipe are formed in one side close to the wafer basket.
3. The tank wafer cleaning and drying device according to claim 2, wherein the main tank body is surrounded by two mounting plates which are parallel to each other, two support plates which are parallel to each other and a bottom plate, two mounting plates are respectively connected with a group of mounting frames on one side which is close to each other, the mounting frames comprise a sliding rail and a sliding block, the air inlet pipeline slides along the height direction of the mounting plates through the sliding rail and the sliding block, the sliding block is connected with a fixing piece, a plurality of fixing holes which are matched with the fixing piece are uniformly distributed on the sliding rail along the height direction, and the air inlet pipeline is fixed relative to the mounting plates through the matching of the fixing piece and the fixing holes.
4. The tank wafer cleaning and drying apparatus according to claim 3, wherein the lifting mechanism comprises a linear driving device and a supporting part, the wafer basket is connected with the supporting part through a back plate, and the driving end of the linear driving device drives the supporting part to displace along the height direction of the main tank body;
the linear driving device comprises a screw rod and a driving motor, the screw rod is arranged along the height direction of the main groove body, the driving end of the driving motor is coaxially fixed with the top end of the screw rod, the screw rod is in threaded fit with a driving block, and the driving block is fixedly connected with the bottom end of the bearing part.
5. The tank wafer cleaning and drying apparatus according to claim 2, wherein the sealing assembly comprises a sealing cover body, a translation mechanism and a pressing assembly, the translation mechanism is arranged at a position, close to the notch, of the main tank body, and the translation mechanism drives the sealing cover body to switch between a state of buckling the notch of the main tank body and a state of moving away from the notch of the main tank body;
the pushing component is arranged on one side, far away from the translation mechanism, of the main groove body and comprises a driving cylinder and a pushing component, the driving cylinder is connected with the main groove body, the top end of the driving cylinder is connected with the pushing component, the sealing cover body is buckled on the notch of the main groove body, and the driving end of the driving cylinder is retracted to enable the pushing component to prop against the top surface of the sealing cover body.
6. The tank wafer cleaning and drying apparatus according to claim 5, wherein the translation mechanism comprises a support plate and a translation assembly, the translation assembly comprises a linear driving mechanism and a guide slide rail, and the support plate is provided with a mounting hole for accommodating the linear driving mechanism along a length direction;
the sealing cover body is fixedly connected to the top surface of the driving end of the linear driving mechanism, the guide sliding rail is parallel to the length direction of the linear driving mechanism, the sealing cover body is in sliding fit with the guide sliding rail through the guide sliding block, the side wall of the main groove body is connected with the lifting cylinder, the driving end of the lifting cylinder extends upwards and is connected with the supporting plate, and the driving end of the lifting cylinder drives the supporting plate to lift.
7. The tank wafer cleaning and drying apparatus according to claim 6, wherein the top surface of the main tank body is provided with a sealing groove around the notch, a sealing ring is embedded in the sealing groove, and the sealing ring abuts against the lower surface of the sealing cover in a state that the sealing cover is buckled on the notch of the main tank body and the pressing member abuts against the top surface of the sealing cover.
8. The tank wafer cleaning and drying device according to claim 4, wherein the cleaning tank is formed with fixing columns near two sides of the two mounting plates, the cleaning tank is mounted in the main tank body through the fixing columns, and a supporting plate far away from the lifting mechanism is provided with a liquid inlet and a liquid outlet for communicating with the cleaning tank.
9. The apparatus of claim 8, wherein the air inlet device is connected to the air inlet nozzle, an air storage chamber is formed in the air inlet device, and the bottom surface of the air inlet device is connected to the air outlet pipe.
10. The tank wafer cleaning and drying apparatus according to claim 3, wherein the bottom plate is provided with an air extraction opening, and the air extraction opening is connected with a vacuum device through an air extraction pipeline.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311120567.8A CN116845014B (en) | 2023-09-01 | 2023-09-01 | Groove type wafer cleaning and drying equipment |
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| CN202311120567.8A CN116845014B (en) | 2023-09-01 | 2023-09-01 | Groove type wafer cleaning and drying equipment |
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| CN116845014A true CN116845014A (en) | 2023-10-03 |
| CN116845014B CN116845014B (en) | 2023-11-21 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117542766A (en) * | 2024-01-08 | 2024-02-09 | 山东联盛电子设备有限公司 | Wafer cleaning and drying device |
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| CN210628254U (en) * | 2019-11-08 | 2020-05-26 | 弘塑科技股份有限公司 | Wafer cleaning and drying device |
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| CN218884491U (en) * | 2022-09-22 | 2023-04-18 | 常州捷佳创精密机械有限公司 | Drying tank, drying device and cleaning equipment |
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| CN103231303A (en) * | 2013-05-15 | 2013-08-07 | 清华大学 | Chemical mechanical polishing device |
| CN110299311A (en) * | 2019-06-21 | 2019-10-01 | 德淮半导体有限公司 | A kind of wafer cleaning drying device and method |
| CN210628254U (en) * | 2019-11-08 | 2020-05-26 | 弘塑科技股份有限公司 | Wafer cleaning and drying device |
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| CN117542766B (en) * | 2024-01-08 | 2024-03-22 | 山东联盛电子设备有限公司 | Wafer cleaning and drying device |
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| CN116845014B (en) | 2023-11-21 |
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