CN116801476A - Circuit board, display panel and display device - Google Patents

Abstract

The disclosure provides a circuit board, a display panel and a display device, wherein the circuit board comprises a device region and a non-device region arranged adjacent to the device region; at least one heat dissipation area is arranged in the non-device area, the heat dissipation area comprises a heat dissipation structure, the heat dissipation structure penetrates through the thickness of the circuit board, and heat of the device area is transferred outwards through the heat dissipation structure. The circuit board effectively solves the problem of serious heating caused by concentrated electronic elements and large load in the circuit board, improves the heat dissipation efficiency and prolongs the service life of the circuit board.

Description

Circuit board, display panel and display device

Technical Field

The disclosure relates to the technical field of circuit boards, and in particular relates to a circuit board, a display panel and a display device.

Background

This section is intended to provide a background or context for the embodiments recited in the claims. The description herein is not admitted to be prior art by inclusion in this section.

The electric energy that electronic component on the circuit board consumed during the during operation, except doing useful work, most conversion becomes the heat and gives off, the heat that electronic equipment produced, make the inside temperature of circuit board rise rapidly, for OLED product, the temperature is along the circuit board transfer to display panel on, lead to the positive temperature of screen can reach 55 high temperature, if not in time give off this heat, display panel can continue to heat up, the use experience sense of direct influence product, long-term high temperature also can influence OLED's organic luminescent material simultaneously, and then influence OLED's light-emitting life, consequently, the design to OLED product cooling is indispensable.

Disclosure of Invention

The following is a summary of the subject matter of the detailed description of the present disclosure. This summary is not intended to limit the scope of the claims.

The present disclosure provides a circuit board, a display panel and a display device.

A first aspect of the present disclosure provides a circuit board comprising a device region and a non-device region disposed adjacent to the device region;

at least one heat dissipation area is arranged in the non-device area, the heat dissipation area comprises a heat dissipation structure, the heat dissipation structure penetrates through the thickness of the circuit board, and heat of the device area is transmitted outwards through the heat dissipation structure.

In some exemplary embodiments, the heat dissipation structure includes a plurality of heat dissipation pillars, the plurality of heat dissipation pillars are arranged at intervals along a side edge of the device region, the heat dissipation pillars are arranged in a single row or multiple rows, and a height of each heat dissipation pillar is the same as a thickness of the circuit board.

In some exemplary embodiments, the direction of extension of a portion of the plurality of heat dissipation posts is at a first angle α to the surface of the circuit board, wherein 0+.α+.90 °.

In some exemplary embodiments, each of the heat dissipation posts includes a heat dissipation layer having a thickness less than or equal to a thickness of the circuit board.

In some exemplary embodiments, the heat dissipation post further includes a first and a second hemming structure, the first and second hemming structures being located at both ends of the heat dissipation post, respectively.

In some exemplary embodiments, the heat dissipating material of the heat dissipating layer includes one or more of the following materials: graphene, heat-conducting silicone grease, heat-conducting insulating material, heat-conducting nonmetallic material and heat-conducting metallic material.

In some exemplary embodiments, the heat dissipation area further includes a heat conduction structure through which the plurality of heat dissipation pillars communicate with each other in the first direction and/or the second direction.

In some exemplary embodiments, the thickness of the heat conductive structure is smaller than the thickness of the heat dissipation post, and the heat conductive structure is embedded inside the circuit board.

In some exemplary embodiments, the cross-section of the heat-dissipating stud is one of the following shapes: cylindrical, rectangular, diamond, oval, semi-circular.

In some exemplary embodiments, a plurality of the heat dissipation pillars are communicated with each other in the non-device region to form a through-type heat dissipation structure.

In some exemplary embodiments, the device region and the heat dissipation region have a spacing therebetween, the spacing being greater than or equal to 0.5mm.

A second aspect of the present disclosure provides a display panel comprising a circuit board as described in the first aspect.

A third aspect of the present disclosure provides a display device, the display device comprising a middle frame, an adhesive tape layer, and the circuit board according to the first aspect, the circuit board being disposed between the middle frame and the adhesive tape layer, wherein at least a portion of a heat dissipation area of at least one side of the circuit board is exposed.

The utility model provides a circuit board, display panel and display device, design the heat dissipation area in the non-device district around the device district of this circuit board, the inside design of the circuit board that the heat dissipation area is located has the heat dissipation structure with the inside heat outside transmission of device district, because the device district is the region that the electronic component of circuit board was concentrated, consequently, dispel the heat to the region of device district through the heat dissipation structure of peripheral heat dissipation area, effectively solved the electronic component concentrate in the circuit board, the serious problem of generating heat that causes of load is big, not only improved radiating efficiency, and life of circuit board has still been prolonged simultaneously.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description, serve to explain the principles of the embodiments of the disclosure. In the drawings, like reference numerals are used to identify like elements. The drawings, which are included in the description, are some, but not all embodiments of the disclosure. Other figures can be obtained from these figures without inventive effort for a person skilled in the art.

Fig. 1 is a schematic diagram illustrating a structure of a circuit board according to an exemplary embodiment.

Fig. 2 is a cross-sectional view of a heat spreader pillar in a non-device region, according to an example embodiment.

Fig. 3 is a cross-sectional view of a heat spreader post in a non-device region, according to another example embodiment.

Fig. 4 is a cross-sectional view of a heat spreader post in a non-device region, according to another example embodiment.

Fig. 5 is a schematic diagram showing a distribution of heat conductive structures and heat dissipation pillars in a circuit board according to another exemplary embodiment.

Fig. 6 is a schematic diagram showing the distribution of heat conductive structures and heat dissipation pillars in a circuit board according to another exemplary embodiment.

Fig. 7 is a cross-sectional view of a thermally conductive structure and a heat spreader pillar in a non-device region, according to another example embodiment.

Fig. 8 is a schematic diagram illustrating a structure of a circuit board according to an exemplary embodiment.

Fig. 9 is a cross-sectional view of a heat spreader post in a non-device region, according to an example embodiment.

Fig. 10 is a cross-sectional view of a heat spreader pillar in a non-device region, according to another example embodiment.

Fig. 11 is a schematic structural view of a display device according to an exemplary embodiment.

Fig. 12 is a schematic structural view of a display device according to another exemplary embodiment.

Fig. 13 is a schematic structural view of a display device according to another exemplary embodiment.

Detailed Description

For the purposes of making the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure, and it is apparent that the described embodiments are some embodiments of the present disclosure, but not all embodiments. Based on the embodiments in this disclosure, all other embodiments that a person skilled in the art would obtain without making any inventive effort are within the scope of protection of this disclosure. It should be noted that, without conflict, the embodiments of the present disclosure and features of the embodiments may be arbitrarily combined with each other. The disclosure is further described below with reference to the embodiments shown in the drawings.

At present, an OLED (electro-mechanical laser display) is widely used as a display component of an electronic device in various small-size terminal products, and medium-size and large-size OLED display products are gradually applied to a notebook computer, and for large-size products, a display screen is sequentially connected with a terminal host through a COF (chip on film), a PCB, and more components on the PCB mainly include a timing controller (T-CON), a power management chip (PMIC), an interconnection layer (ELIC), various capacitors, resistors, and the like. Compared with the small-size product, the large-size product has large pixel area to be driven, the circuit load is more, the electronic element is larger, the serious heating problem can occur when the electronic element is arranged on the product with larger load, and the temperature of the electronic element of some products can reach about 70 degrees. The temperature of an electronic element of the product which is folded back to the back along the PCB middle frame is transferred to the display surface, so that the temperature of the front surface of the screen also reaches 55 DEG, the use experience of the product is directly influenced, meanwhile, the long-term high-temperature environment also influences the organic luminescent material of the OLED, the luminous life of the OLED is further influenced, and the product cooling design is indispensable for the OLED product.

In a conventional circuit board, for example, a circuit board (hereinafter referred to as PCBA) structure design scheme of an electronic component is assembled, the heat dissipation scheme of the conventional structure does not consider the heat dissipation in the board, but only adds a graphite layer in the back glue to dissipate the heat, and since the added graphite layer is arranged on the back surface of the PCBA device area and is separated from the front surface by a plate, the heat dissipation in the front surface and the PCBA is limited, and therefore, the heat dissipation effect is poor. However, if the heat generated by the heating element cannot be timely dissipated, the temperature of the electronic element can be rapidly increased, the use of the circuit board can be affected, and the service life of the circuit board can be shortened, so that improvement is needed.

In order to solve the technical problem, the present disclosure provides a circuit board, in which a heat dissipation area is designed in a non-device area around a device area of the circuit board, a heat dissipation structure for transferring heat inside the device area outwards is designed inside the heat dissipation area, the device area can be an area where electronic elements of the circuit board are concentrated, and the area of the device area is dissipated through the heat dissipation structure of the peripheral heat dissipation area, so that the problem of serious heat generated due to concentrated electronic elements and heavy load in the circuit board is solved, heat dissipation efficiency is improved, and meanwhile, the service life of the circuit board is prolonged.

In an exemplary embodiment of the present disclosure, a circuit board is provided, as shown in fig. 1, fig. 1 shows a schematic structural diagram of the circuit board provided according to an exemplary embodiment of the present disclosure, and the circuit board in the present embodiment is described below with reference to fig. 2 to 7. Fig. 1 to 7 in the present embodiment are partial schematic views of a circuit board, and other structures of the peripheral area of the circuit board are not shown.

The circuit board may be a PCB, PCBA, foldable circuit board, etc., and the present embodiment is not limited to the circuit board. The PCBA will be described below as an example, but the present embodiment is not limited thereto, and the circuit board in the present embodiment may have other structures.

As shown in fig. 1, an exemplary embodiment of the present disclosure provides a circuit board 100, including: a device region 110 and a non-device region 120 disposed adjacent to the device region 110;

at least one heat dissipation area 200 is disposed in the non-device area 120, the heat dissipation area 200 includes a heat dissipation structure 210, the heat dissipation structure 210 penetrates through the thickness of the circuit board 100, and heat of the device area 110 is transferred outwards through the heat dissipation structure 210.

As shown in fig. 1, for example, electronic components 130 are concentrated in the device area 110 of the circuit board 100, where the electronic components 130 are, for example, radio frequency power amplifiers, FPGA chips, and power products, and the electronic components 130 consume electric energy during operation, and most of the electric energy is converted into useful work and dissipated heat, and the temperature inside the device area 110 rises rapidly due to the heat generated by the electronic components 130. In order to timely conduct out heat inside the device region 110 to reduce the temperature of the device region 110, at least one heat dissipation region 200 is disposed in the non-device region 120, and the heat dissipation region 200 may be disposed near the region where the electronic components 130 are gathered, so as to timely conduct out heat generated by the electronic components 130. The heat dissipation structure 210 is disposed in the heat dissipation area 200, and the heat dissipation structure 210 penetrates through the thickness of the circuit board 100, so that the interior of the circuit board 100 contacts with the surface of the heat dissipation structure 210, and the heat dissipated by the electronic component 130 is timely absorbed, so that the heat is prevented from being accumulated on the electronic component 130 and the circuit mounting layer, the use effect of the circuit board 100 is improved, and the service life of the circuit board 100 is prolonged. The heat dissipation structure 210 may partially penetrate through the thickness of the circuit board 100, for example, one end of the heat dissipation structure 210 extends to half the thickness of the circuit board 100, and the end surface of the other end of the heat dissipation structure 210 may be flush with the upper surface or the lower surface of the circuit board 100; the heat dissipation structure 210 may also completely penetrate through the thickness of the circuit board 100, so that the end surfaces at two ends of the heat dissipation structure 210 are respectively formed on the upper surface and the lower surface of the circuit board 100.

As shown in FIG. 1, two heat dissipation areas 200 are illustratively shown. In view of the fact that the PCB is fixedly connected to other electronic components, a certain space is reserved between the boundary between the heat dissipation area 200 and the device area 110, which are disposed in the non-device area 120, and the space may be a safe distance between the device area 110 and the heat dissipation area 200, and the space may be greater than or equal to 0.5mm, for example, the space may be in a range of 0.5mm,0.8mm, 1mm, 2mm, etc., which is not limited herein. In other exemplary embodiments, the pitch may also range from 0.5mm to 1mm.

The heat dissipation structure is a structure that can transfer the inside of the circuit board to the outside, and may be formed of a heat dissipation material, and referring to fig. 1, the heat dissipation structure 210 is exemplarily formed of a plurality of heat dissipation columns 220, and the heat dissipation columns 220 may be distributed in the heat dissipation area 200 in a single row arrangement manner, or may be distributed in the heat dissipation area 200 in two or more rows arrangement manner, and the heat dissipation effect on the circuit board 100 is better as the number of the heat dissipation columns 220 is greater. The plurality of heat dissipation pillars 220 may be spaced along the side of the device region 110, and the distribution of the heat dissipation pillars 220 may be distributed in other manners according to the size of the non-device region 120, which is not particularly limited herein. In addition, the spacing between the heat-dissipating studs 220 can be adjusted according to the heat-generating condition of the electronic component 130, and when the electronic component 130 in the device region 110 generates serious heat, the spacing between the heat-dissipating studs 220 can be properly reduced to increase the density of the heat-dissipating studs 220; when the electronic component 130 within the device region 110 generates heat generally, the spacing between the heat-dissipating studs 220 may be increased appropriately to reduce the density of the heat-dissipating studs 220.

Referring to fig. 1 and 2, each of the heat dissipation posts 220 has a through hole 221, and the shape of the cross section of the through hole 221 may determine the shape of the cross section of the heat dissipation post 220, and the cross section of the through hole 221 of the heat dissipation post 220 is one of the following shapes: cylindrical, rectangular, diamond, oval, semi-circular. Illustratively, the radius of the heat dissipating studs 220 ranges from 0.2mm to 1mm.

Referring to fig. 1 and 2, the depth of the through hole 221 may also determine the height of the heat dissipation post 220, and for example, the through hole 221 may partially penetrate through the thickness of the circuit board 100, or may penetrate through the thickness of the circuit board 100, e.g., the depth of the through hole 221 may be smaller than the thickness of the circuit board 100 to form the heat dissipation post 220 partially penetrating through the thickness of the circuit board 100, and the depth of the through hole 221 may be consistent with the thickness of the circuit board 100 to form the heat dissipation post 220 that completes penetrating through the thickness of the circuit board 100.

Referring to fig. 2, a heat dissipation material is filled in the through hole 221 to form a heat dissipation layer 222, and the heat dissipation layer 222 may be formed by an injection molding process, and the heat dissipation layer 222 is in contact connection with the inner wall of the circuit board 100, so that heat in the device region 110 is directly transferred to the heat dissipation layer 222 through the circuit board 100, and the heat is transferred to the outside of the circuit board 100 by using the heat dissipation layer 222. Referring to fig. 2, when the through hole 221 completely penetrates the thickness of the circuit board 100, the thickness of the heat dissipation layer 222 may be equal to the thickness of the circuit board 100, and when the thickness of the heat dissipation layer 222 is identical to the thickness of the circuit board 100, the thickness of the heat dissipation layer 222 is the height of the heat dissipation post 220.

Referring to fig. 2 and 3, exemplary heat dissipating materials comprising heat dissipating layer 222 include one or more of the following materials: graphene, heat-conducting silicone grease, heat-conducting insulating material, heat-conducting nonmetallic material and heat-conducting metallic material. When the heat dissipation material is a powdery material such as graphene, in order to avoid the phenomenon that the heat dissipation effect is affected due to scattering of the heat dissipation material in the heat dissipation post 220, a first edge-wrapping structure 223 and a second edge-wrapping structure 224 are respectively disposed at two ends of the through hole 221 of the heat dissipation post 220, so as to plug the two ends of the through hole 221. The first and/or second edge-covering structures 223, 224 may be formed of a thermally conductive non-metallic material, and may be formed by injection molding. The first and/or second hemming structures 223, 224 include, but are not limited to, being formed from a hemming filler including, but not limited to, a thermally conductive resin. In this embodiment, the thickness of the heat dissipation layer 222 needs to be appropriately smaller than the thickness of the circuit board of the non-device region 120 in order to reserve space for the first and second edge-covering structures 223 and 224, and in this embodiment, the structure of the heat dissipation post 220 is composed of the first edge-covering structure 223, the heat dissipation layer 222, and the second edge-covering structure 224.

Referring to fig. 1 and 4, the plurality of heat dissipation pillars 220 may or may not extend in the same direction in the circuit board 100, and illustratively, the extending direction of a portion of the heat dissipation pillars 220 in the plurality of heat dissipation pillars 220 forms a first angle α with the surface of the circuit board 100, wherein 0 ° - α -90 °. .

Referring to fig. 1 and 2, the extending directions of the partial heat dissipation posts 220 are the same, and the extending direction of each heat dissipation post 220 is disposed at right angles to the surface of the circuit board 100, so that the heat dissipation posts 220 are vertically disposed to transfer heat of the circuit board 100 to the outside in the shortest path. Referring to fig. 4, the extending direction of the partially dispersed thermal pillars 220 may also be disposed at an acute angle to the surface of the circuit board 100, such as the first angle α of 0 °, 5 °, 25 °, 30 °, 45 °, 80 °, 90 °, etc. As shown in fig. 4, the through holes 221 of the heat dissipation post 220 may be disposed in the non-device region 120 of the circuit board in an inclined state to increase the contact area between the heat dissipation layer 222 and the circuit board 100, thereby improving heat dissipation efficiency. In other exemplary embodiments, the heat dissipation post may also have a fold line structure, for example, a V-shaped structure disposed transversely, so that one end of the heat dissipation post is located in the internal structure of the circuit board, and the heat dissipation post can draw heat from the interior of the circuit board to the heat dissipation area.

Another embodiment of the present disclosure also provides a circuit board, which is substantially the same as the previous embodiment, and mainly differs in that: as shown in fig. 1 and 5-7, the heat dissipation area 200 further includes a heat conductive structure 230, and the plurality of heat dissipation columns 220 are communicated with each other in a first direction X and/or a second direction Y parallel to the surface of the circuit board 100 through the heat conductive structure 230. The circuit board provided in another embodiment of the present disclosure will be described below with reference to the accompanying drawings, and the same or corresponding parts as those of the previous embodiment may be referred to for the corresponding description of the previous embodiment, which will not be repeated herein.

Referring to fig. 5 to 6, a plurality of heat conductive structures 230 are further disposed in the heat dissipation area 200, the plurality of heat conductive structures 230 may be embedded in the internal structure of the circuit board of the non-device area 120, referring to fig. 6, one end of the heat conductive structure 230 may be disposed close to the device area 110, the other end of the heat conductive structure 230 may extend in a direction away from the device area 110, referring to fig. 5 and 6, the extending direction of the heat conductive structure 230 may intersect with the extending direction of the heat dissipation pillars 220 to form a connection structure for the plurality of heat dissipation pillars 220 in the first direction X, and may also form a connection structure for the plurality of heat dissipation pillars 220 in the second direction Y. Referring to fig. 6 and 7, the heat conductive structure 230 crossing the heat dissipation post 220 may be one or more. The heat conducting structure 230 conducts heat generated by the electronic component 130 (refer to fig. 1) in the device region 110 to the heat dissipating studs 220, and then transfers the heat to the outside for dissipating heat by using the heat dissipating studs 220, so that the heat conducting structure 230 has a better heat transfer effect than the circuit board 100 itself, and can increase the heat transfer speed and improve the heat dissipation efficiency and effect.

Illustratively, referring to fig. 5, at least one heat-conducting structure 230 is provided between two adjacent heat-dissipating studs 220, the heat-conducting structure 230 may also be formed of a heat-dissipating material, the heat-dissipating material of the heat-conducting structure 230 may be the same as or different from that of the heat-dissipating stud 220, and a single heat-conducting structure 230 may be the same as or different from that of a single heat-dissipating stud 220. The heat conducting structure may be formed by a heat dissipating layer made of a heat dissipating material, or may be a structure with a covered edge structure on both sides and a heat dissipating layer in the middle. The thermally conductive structure 230 may also be considered as a heat sink 220 that extends partially through the thickness of the circuit board 100 (see fig. 1).

Another embodiment of the present disclosure also provides a circuit board, which is substantially the same as the previous embodiment, and mainly differs in that: referring to fig. 8 and 9, two heat dissipation areas, a first heat dissipation area 200a and a second heat dissipation area 200b, are exemplarily shown, and the first heat dissipation area 200a is exemplarily described, and a plurality of heat dissipation pillars 220 (refer to fig. 1) in the first heat dissipation area 200a are communicated with each other between the non-device areas 120, so as to form a through-type heat dissipation structure 210.

Referring to fig. 8, the heat dissipation structure 210 in the first heat dissipation area 200a may be, for example, a through rectangular structure, where the through rectangular structure is formed by connecting heat dissipation columns 220 (referring to fig. 2) from top to bottom and from left to right to form the rectangular structure shown in fig. 8, and referring to fig. 9, the heat dissipation structure 210 of the rectangular structure penetrates through the thickness of the circuit board 100 from top to bottom, and the heat dissipation structure 210 may be formed by connecting a plurality of rectangular structures. Illustratively, referring to fig. 8, a through-type heat dissipation structure 210 formed of two rectangular structures is shown, the inside of the heat dissipation structure 210 may be formed of a heat dissipation layer 222, and referring to fig. 10, the heat dissipation structure 210 may also be formed of a first bank structure 223, a heat dissipation layer 222, and a second bank structure 224 stacked in this order from top to bottom. In this embodiment, the through-type heat dissipation structure 210 may be filled with a heat dissipation material with a higher density, referring to fig. 8, so as to form a surrounding or semi-surrounding first heat dissipation area 200a around the device area 110, so that the heat of the device area 110 is transferred outwards through the heat dissipation structure 210, so that the heat generated by the electronic component 130 of the circuit board 100 is effectively dissipated in time, and the service life of the circuit board 100 is prolonged.

In an exemplary embodiment, referring to fig. 9, the through-type heat dissipation structure 210 may also be formed of rectangular through holes 221 and a heat dissipation layer 222, and the thickness of the heat dissipation layer 222 is consistent with the thickness of the circuit board of the non-device region 120.

In the exemplary embodiment of the disclosure, a display panel is provided, where the display panel includes the circuit board 100 provided in the foregoing embodiment, referring to fig. 1, a heat dissipation area 200 is designed in a non-device area 120 disposed adjacent to a device area 110 in the circuit board 100, a heat dissipation structure 210 for transferring heat in the device area 110 to the outside is designed in the circuit board 100 where the heat dissipation area 200 is located, and since the device area 110 is a region where the electronic elements 130 of the circuit board 100 are concentrated, the heat dissipation is performed on the region of the device area 110 through the heat dissipation structure 210 of the peripheral heat dissipation area 200, so that the problem of serious heat generated due to the concentration and heavy load of the electronic elements 130 in the circuit board 100 is effectively solved, not only is the heat dissipation efficiency improved, but also the service life of the circuit board 100 is prolonged.

In an exemplary embodiment of the present disclosure, a display panel is provided, and referring to fig. 11, the display device includes a middle frame 300, an adhesive tape layer 400, and a circuit board 100 provided in any of the above embodiments, the circuit board 100 being disposed between the middle frame 300 and the adhesive tape layer 400.

Referring to fig. 11, in the third direction Z, the circuit board 100 is located between the middle frame 300 and the tape layer 400. For example, the middle portion of the circuit board 100 is a device region 110, a non-device region 120 is disposed adjacent to the device region 110, a heat dissipation region 200 is disposed in the non-device region 120, and a plurality of heat dissipation pillars 220 in the heat dissipation region 200 are formed in the circuit board of the non-device region 120. The plurality of heat dissipation columns 220 are arranged at intervals in the first direction X, and in the third direction Z, the thickness of each heat dissipation column 220 is consistent with the thickness of the circuit board 100, so that two ends of each heat dissipation column 220 can be respectively in contact connection with the middle frame 300 and the adhesive tape layer 400, heat in the circuit board 100 can be respectively transferred to the middle frame 300 and the adhesive tape layer 400 through the heat dissipation columns 220 to dissipate heat, the problem that the electronic elements 130 (refer to figure 1) on the circuit board 100 in the display device are concentrated and have large loads, and heat generation is serious is effectively solved, heat dissipation efficiency is improved, and meanwhile, the service life of the display device is prolonged.

Referring to fig. 12 and 13, in order to improve the efficiency of heat transfer to the outside of the circuit board 100 to improve the heat dissipation effect, at least a portion of the heat dissipation area 200 of at least one side of the circuit board 100 may be exposed so that the heat dissipation area 200 is in direct contact with the outside, so that heat may be taken away by using a heat transfer medium, which may be a heat dissipation medium in a heat dissipation system of the display device, such as an air cooling system, and the heat dissipation medium is cool air.

Referring to fig. 12, the adhesive tape layer 400 above the heat dissipation area 200 is subjected to a disconnection process to form a first opening 500, so that the heat dissipation area 200 on the side where the circuit board 100 is in contact with the adhesive tape layer 400 is exposed in the first opening 500, when the electronic component 130 (refer to fig. 1) in the circuit board 100 in the display device generates heat, the heat can be transferred to the heat dissipation post 220 through the heat conduction structure 230 (refer to fig. 5) or the circuit board 100, and as one end of the heat dissipation post 220 is exposed, the heat dissipation medium in the heat dissipation system in the display device can be utilized to dissipate heat, for example, the heat dissipation medium enters from the first opening 500 and flows to the exposed heat dissipation area 200 to take away the heat in the heat dissipation post 220, so that the circulation can effectively solve the problem of serious heat generated due to the concentration and heavy load of the electronic component 130 (refer to fig. 1) on the circuit board 100 in the display device, thereby prolonging the service life and improving the display effect of the display device.

Referring to fig. 13, the adhesive tape layer 400 located above the heat dissipation area 200 is disconnected, and the heat dissipation area 200 on the side where the circuit board 100 is connected to the middle frame 300 is also exposed, for example, a part of the structure of the circuit board 100 is in a suspended state, so that a space is reserved below a part of the area of the circuit board 100, and thus, both sides of the heat dissipation area 200 of the circuit board 100 are exposed, when the electronic components 130 (refer to fig. 1) in the circuit board 100 in the display device generate heat, the heat can be transferred to the heat dissipation post 220 through the heat conduction structure 230 (refer to fig. 5) or the circuit board 100, and as both ends of the heat dissipation post 220 are exposed, heat dissipation medium in the heat dissipation system in the display device can be utilized to dissipate heat, for example, the heat dissipation medium flows through the second opening 600 and/or the first opening 500 to the exposed heat dissipation area 200, so that the heat of the heat dissipation post 220 is taken away, and the circulation can effectively solve the serious problem of heat generated by the electronic components 130 (refer to fig. 1) on the circuit board 100 in the display device, which causes large load, and the service life and display device are improved.

In the description of the present specification, descriptions of the terms "example," "exemplary embodiment," "some embodiments," "illustrative embodiments," "examples," and the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure.

In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In the description of the present disclosure, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present disclosure.

It will be understood that the terms "first," "second," and the like, as used in this disclosure, may be used to describe various structures, but these structures are not limited by these terms. These terms are only used to distinguish one structure from another structure.

In one or more of the drawings, like elements are referred to by like reference numerals. For clarity, the various parts in the drawings are not drawn to scale. Furthermore, some well-known portions may not be shown. The structure obtained after several steps may be depicted in one figure for simplicity. Numerous specific details of the present disclosure, such as device structures, materials, dimensions, processing techniques and technologies, are set forth in the following description in order to provide a more thorough understanding of the present disclosure. However, as will be understood by those skilled in the art, the present disclosure may be practiced without these specific details.

The various embodiments in this disclosure are described in a progressive manner, and identical and similar parts of the various embodiments are all referred to each other, and each embodiment is mainly described as different from other embodiments.

The scope of the present disclosure is not limited to the above-described embodiments, and it is apparent that various modifications and variations can be made to the present disclosure by those skilled in the art without departing from the scope and spirit of the disclosure. Such modifications and variations are intended to be included herein within the scope of the following claims and their equivalents.

Claims (13)

1. A circuit board, wherein the circuit board comprises a device region and a non-device region disposed adjacent to the device region;

at least one heat dissipation area is arranged in the non-device area, the heat dissipation area comprises a heat dissipation structure, the heat dissipation structure penetrates through the thickness of the circuit board, and heat of the device area is transmitted outwards through the heat dissipation structure.

2. The circuit board of claim 1, wherein the heat dissipation structure comprises a plurality of heat dissipation posts, the plurality of heat dissipation posts are arranged at intervals along the side edge of the device region, the arrangement structure of the heat dissipation posts is in a single row or a plurality of rows, and the height of each heat dissipation post is the same as the thickness of the circuit board.

3. The circuit board of claim 2, wherein a portion of the plurality of heat dissipating studs extends at a first angle α to a surface of the circuit board, wherein 0 ° - α -90 °.

4. The circuit board of claim 2, wherein each of the heat dissipation posts comprises a heat dissipation layer having a thickness less than or equal to a thickness of the circuit board.

5. The circuit board of claim 4, wherein the heat dissipation post further comprises a first and a second edge-covering structure, the first and second edge-covering structures being located at two ends of the heat dissipation post, respectively.

6. The circuit board of claim 4, wherein the heat sink material of the heat sink layer comprises one or more of the following materials: graphene, heat-conducting silicone grease, heat-conducting insulating material, heat-conducting nonmetallic material and heat-conducting metallic material.

7. The circuit board of claim 2, wherein the heat dissipation area further comprises a heat conductive structure through which the plurality of heat dissipation posts communicate with each other in the first direction and/or the second direction.

8. The circuit board of claim 7, wherein the thickness of the heat conducting structure is less than the thickness of the heat dissipating stud, and the heat conducting structure is embedded inside the circuit board.

9. The circuit board of claim 2, wherein the heat dissipation post has a cross-section of one of the following shapes: cylindrical, rectangular, diamond, oval, semi-circular.

10. The circuit board of claim 2, wherein a plurality of the heat dissipation posts are in communication with one another in the non-device region to form a through-type heat dissipation structure.

11. The circuit board of any one of claims 1 to 10, wherein the device region and the heat dissipation region have a spacing therebetween, the spacing being greater than or equal to 0.5mm.

12. A display panel comprising the circuit board according to any one of claims 1 to 11.

13. A display device comprising a center frame, a tape layer, and the circuit board of any one of claims 1 to 11 disposed between the center frame and the tape layer, wherein at least a portion of a heat dissipation area of at least one side of the circuit board is exposed.