CN116770380A - Electroplating shielding process of laminated conductive bar - Google Patents
Electroplating shielding process of laminated conductive bar Download PDFInfo
- Publication number
- CN116770380A CN116770380A CN202310873842.7A CN202310873842A CN116770380A CN 116770380 A CN116770380 A CN 116770380A CN 202310873842 A CN202310873842 A CN 202310873842A CN 116770380 A CN116770380 A CN 116770380A
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- Prior art keywords
- laminated
- electroplating
- row
- soft
- laminated conductive
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- 238000009713 electroplating Methods 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000007598 dipping method Methods 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 22
- 230000000873 masking effect Effects 0.000 claims abstract description 11
- 239000003292 glue Substances 0.000 claims abstract description 10
- 239000007788 liquid Substances 0.000 claims abstract description 7
- 238000005538 encapsulation Methods 0.000 claims description 7
- 238000004804 winding Methods 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 abstract description 12
- 238000005260 corrosion Methods 0.000 abstract description 12
- 230000000149 penetrating effect Effects 0.000 abstract description 4
- 230000003405 preventing effect Effects 0.000 abstract description 3
- 238000010073 coating (rubber) Methods 0.000 abstract 2
- 238000007747 plating Methods 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
An electroplating shielding process of a laminated conducting bar comprises the following steps: masking a soft row region of the laminated conductive row with a flexible material; taking out the laminated conducting bars after the integral dipping of the laminated conducting bars, and solidifying the glue; stripping the hard row area of the laminated conductive row to completely expose the part to be electroplated; immersing the whole laminated conducting bar into electroplating liquid, and electroplating the hard bar area; and carrying out shielding stripping treatment on the soft row area of the laminated conducting bar. According to the application, the flexible material is used for wrapping and shielding the soft-row area of the conductive row, so that glue is prevented from penetrating into the soft-row area of the conductive row through the section of the soft-row area in the process of dipping; through gum dipping treatment, rubber coating is generated on the flexible material wrapped in the soft row area of the conductive row, and the rubber coating has a strong corrosion resistance while shielding and seepage preventing effect on the soft row area; the problem that electroplating liquid enters the conductive bar through the section part of the soft bar area to cause corrosion due to poor corrosion resistance of the shielding structure in the subsequent electroplating process can be avoided.
Description
Technical Field
The application relates to the technical field of laminated conducting bar electroplating, in particular to an electroplating shielding process of laminated conducting bars.
Background
There is a conductive strip comprising a hard strip region and a soft strip region connected to each other. Currently, in order to improve corrosion resistance of the connection end of the conductive bar, a nickel sheet is generally welded to the front or back of the conductive bar (fig. 1). However, the structure cannot provide corrosion resistance protection for the section of the conductive bar, and the service life of the conductive bar is greatly influenced.
Based on this, it is proposed to implement an electroplating process on the hard bar region of the conductive bar by electroplating to provide corrosion-resistant protection to the section of the conductive bar. However, in the actual operation, it was found that, when the conductive bars were immersed in the plating solution, the plating solution penetrated from the cross section of the soft-row regions of the conductive bars to the inner corroded structures even if only the hard-row regions of the conductive bars were immersed in the plating solution.
Therefore, it is also conceivable to wrap and shield the soft-drain region of the conductive drain by tape winding to prevent the plating solution from penetrating into the inside from the cross-sectional portion of the soft-drain region of the conductive drain during the plating process. However, in the practical operation process, the plating solution is found to have strong corrosiveness, and the adhesive part of the adhesive tape is easily corroded from the edge to the inside in the plating solution, so that the plating solution is turned over and gaps are generated, and the plating solution still permeates into the inside through the section part of the soft row area of the conductive row (fig. 2).
Therefore, in order to solve the above-mentioned problems, it is necessary to design a plating masking process for the laminated conductive bars.
Disclosure of Invention
In order to overcome the defects in the prior art, the application aims to provide an electroplating shielding process of a laminated conducting bar.
To achieve the above and other related objects, the present application provides the following technical solutions: an electroplating shielding process of a laminated conducting bar comprises the following steps:
step 1: masking a soft row region of the laminated conductive row with a flexible material;
step 2: taking out the laminated conducting bars after the integral dipping of the laminated conducting bars, and solidifying the glue;
step 3: stripping the hard row area of the laminated conducting bar to completely expose the part to be electroplated;
step 4: immersing the whole laminated conducting bar into electroplating liquid, and electroplating the hard bar area;
step 5: and carrying out shielding stripping treatment on the soft row area of the laminated conductive row.
The preferable technical scheme is as follows: in the step 1, the flexible material used in the shielding treatment is a flexible impermeable coiled material.
The preferable technical scheme is as follows: in the step 1, the specific step of shielding treatment is to wrap and shield the soft row area of the laminated conductive row by the flexible anti-seepage coiled material in a winding mode.
The preferable technical scheme is as follows: in the step 2, glue used in the gum dipping treatment is DT-3 special-purpose strippable protective rubber for electroplating.
The preferable technical scheme is as follows: in the step 2, the specific step of the gum dipping treatment is that the laminated conductive bar is taken out after the first gum dipping treatment is carried out at room temperature, and is taken out after the second gum dipping treatment is carried out on the laminated conductive bar after waiting for 2 hours, thus completing gum dipping.
The preferable technical scheme is as follows: in the step 2, the specific step of gel treatment is that the laminated conductive bars after gum dipping treatment are placed indoors and naturally air-dried for 12-20 hours at room temperature.
The preferable technical scheme is as follows: in the step 2, the specific step of gel treatment is that the laminated conductive bars after gum dipping treatment are placed in an oven, the temperature of the oven is adjusted to 50-60 ℃, and the laminated conductive bars are baked for 3-4 hours.
The preferable technical scheme is as follows: in the step 3, the hard row area of the laminated conductive row is subjected to stripping treatment by hand or laser so that the part needing electroplating is completely exposed.
The preferable technical scheme is as follows: in the step 5, the specific step of the shielding stripping treatment is to strip the encapsulation of the soft row area of the laminated conducting bar, strip the flexible material of the soft row area of the laminated conducting bar, and finally check the whole appearance.
Due to the application of the technical scheme, the application has the following beneficial effects:
according to the electroplating shielding process for the laminated conducting bar, the soft bar area of the laminated conducting bar is covered and shielded by using the flexible material, so that glue is prevented from penetrating into the laminated conducting bar through the section of the soft bar area in the dipping process; through gum dipping treatment, an encapsulation is generated on the flexible material wrapped in the soft row area of the laminated conducting bar, and the encapsulation has a strong corrosion resistance while shielding and seepage preventing effect on the soft row area; the problem that electroplating liquid enters the conductive bar through the section part of the soft bar area to cause corrosion due to poor corrosion resistance of the shielding structure in the subsequent electroplating process can be avoided.
Drawings
Fig. 1 is a photograph of a conductive strip that has been corrosion-protected using a welded nickel plate in the background art.
Fig. 2 is a photograph of a prior art conductive strip using a wrapping tape to mask plating.
Fig. 3 is a schematic diagram of a conductive bar electroplating shielding process according to the present application.
Fig. 4 is a photograph of a laminated conductive bar prepared by the electroplating masking process according to the present application after the electroplating process without masking stripping.
Fig. 5 is a schematic view of the flexible material used in step 1 of the present application after masking the soft row area of the laminated conductive row.
Fig. 6 is a schematic diagram of the laminated conductive bar after the entire dipping in the paste in step 2 of the present application.
Fig. 7 is a schematic diagram of the stripping treatment of the hard row area of the laminated conductive row in step 3 to completely expose the portion to be plated.
FIG. 8 is a schematic view of the present application after the entire laminated conductive strip is immersed in the plating solution to plate the hard strip region in step 4.
Detailed Description
Further advantages and effects of the present application will become apparent to those skilled in the art from the disclosure of the present application, which is described by the following specific examples.
Please refer to fig. 1-8. It should be noted that, in the description of the present application, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or directions or positional relationships in which the inventive product is conventionally put in use, are merely for convenience of describing the present application and for simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance. The terms "horizontal," "vertical," "overhang," and the like do not denote that the component is required to be absolutely horizontal or overhang, but may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediary, or communicating between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
Examples:
according to one general technical concept of the present application, there is provided an electroplating shielding process of a laminated conductive bar, including the steps of:
step 1: masking a soft row region of the laminated conductive row with a flexible material;
step 2: taking out the laminated conducting bars after the integral dipping of the laminated conducting bars, and solidifying the glue;
step 3: stripping the hard row area of the laminated conducting bar to completely expose the part to be electroplated;
step 4: immersing the whole laminated conducting bar into electroplating liquid, and electroplating the hard bar area;
step 5: and carrying out shielding stripping treatment on the soft row area of the laminated conductive row.
In one exemplary embodiment of the present application, as shown in fig. 3-8, the flexible material used in the masking process is a flexible impermeable web in step 1.
In an exemplary embodiment of the present application, as shown in fig. 3 to 8, in step 1, the masking process is specifically performed by wrapping the flexible impermeable web material around the soft row area of the laminated conductive row by winding.
In an exemplary embodiment of the present application, as shown in fig. 3 to 8, the glue used in the dipping process is DT-3 plating dedicated strippable protective rubber in step 2.
As shown in fig. 3 to 8, in an exemplary embodiment of the present application, in the step 2, the dipping treatment is specifically performed by taking out the laminated conductive bars after the first dipping treatment at room temperature, taking out the laminated conductive bars after waiting for 2 hours, and then taking out the laminated conductive bars after the second dipping treatment, thereby completing the dipping.
In an exemplary embodiment of the present application, as shown in fig. 3 to 8, in step 2, the specific step of the gel treatment is to place the laminated conductive bars after the gum dipping treatment in a room, and naturally air-dry for 12-20 hours at room temperature.
In an exemplary embodiment of the present application, as shown in fig. 3 to 8, in step 2, the specific step of the gel treatment is to place the laminated conductive bars after the gum dipping treatment in an oven, adjust the oven temperature to 50-60 degrees celsius, and bake for 3-4 hours. Compared with the air-drying gel mode, the oven gel mode has the advantage of high gel speed and can improve the productivity.
In an exemplary embodiment of the present application, as shown in fig. 3 to 8, in step 3, the hard row area of the laminated conductive row is stripped manually or by laser to completely expose the portion to be plated.
In an exemplary embodiment of the present application, as shown in fig. 3 to 8, the masking and peeling process is specifically performed in step 5 by peeling off the encapsulation of the laminated busbar region, peeling off the flexible material of the laminated busbar region, and finally inspecting the overall appearance.
Therefore, the application has the following advantages:
according to the electroplating shielding process for the laminated conducting bar, the soft bar area of the laminated conducting bar is covered and shielded by using the flexible material, so that glue is prevented from penetrating into the laminated conducting bar through the section of the soft bar area in the dipping process; through gum dipping treatment, an encapsulation is generated on the flexible material wrapped in the soft row area of the laminated conducting bar, and the encapsulation has a strong corrosion resistance while shielding and seepage preventing effect on the soft row area; the problem that electroplating liquid enters the conductive bar through the section part of the soft bar area to cause corrosion due to poor corrosion resistance of the shielding structure in the subsequent electroplating process can be avoided.
The above embodiments are merely illustrative of the principles of the present application and its effectiveness, and are not intended to limit the application. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the application. Accordingly, it is intended that all equivalent modifications and variations which can be accomplished by persons skilled in the art without departing from the spirit and technical spirit of the present application shall be covered by the appended claims.
Claims (9)
1. An electroplating shielding process of a laminated conducting bar is characterized by comprising the following steps of:
step 1: masking a soft row region of the laminated conductive row with a flexible material;
step 2: taking out the laminated conducting bars after the integral dipping of the laminated conducting bars, and solidifying the glue;
step 3: stripping the hard row area of the laminated conducting bar to completely expose the part to be electroplated;
step 4: immersing the whole laminated conducting bar into electroplating liquid, and electroplating the hard bar area;
step 5: and carrying out shielding stripping treatment on the soft row area of the laminated conductive row.
2. The electroplating shielding process of the laminated conductive strip of claim 1, wherein: in the step 1, the flexible material used in the shielding treatment is a flexible impermeable coiled material.
3. The electroplating shielding process of the laminated conductive strip of claim 2, wherein: in the step 1, the specific step of shielding treatment is to wrap and shield the soft row area of the laminated conductive row by the flexible anti-seepage coiled material in a winding mode.
4. The electroplating shielding process of the laminated conductive strip of claim 1, wherein: in the step 2, glue used in the gum dipping treatment is DT-3 special-purpose strippable protective rubber for electroplating.
5. The electroplating shielding process of the laminated conductive strip of claim 1, wherein: in the step 2, the specific step of the gum dipping treatment is that the laminated conductive bar is taken out after the first gum dipping treatment is carried out at room temperature, and is taken out after the second gum dipping treatment is carried out on the laminated conductive bar after waiting for 2 hours, thus completing gum dipping.
6. The electroplating shielding process of the laminated conductive strip of claim 1, wherein: in the step 2, the specific step of gel treatment is that the laminated conductive bars after gum dipping treatment are placed indoors and naturally air-dried for 12-20 hours at room temperature.
7. The electroplating shielding process of the laminated conductive strip of claim 1, wherein: in the step 2, the specific step of gel treatment is that the laminated conductive bars after gum dipping treatment are placed in an oven, the temperature of the oven is adjusted to 50-60 ℃, and the laminated conductive bars are baked for 3-4 hours.
8. The electroplating shielding process of the laminated conductive strip of claim 1, wherein: in the step 3, the hard row area of the laminated conductive row is subjected to stripping treatment by hand or laser so that the part needing electroplating is completely exposed.
9. The electroplating shielding process of the laminated conductive strip of claim 1, wherein: in the step 5, the specific step of the shielding stripping treatment is to strip the encapsulation of the soft row area of the laminated conducting bar, strip the flexible material of the soft row area of the laminated conducting bar, and finally check the whole appearance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310873842.7A CN116770380A (en) | 2023-07-17 | 2023-07-17 | Electroplating shielding process of laminated conductive bar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310873842.7A CN116770380A (en) | 2023-07-17 | 2023-07-17 | Electroplating shielding process of laminated conductive bar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116770380A true CN116770380A (en) | 2023-09-19 |
Family
ID=88008172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310873842.7A Pending CN116770380A (en) | 2023-07-17 | 2023-07-17 | Electroplating shielding process of laminated conductive bar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116770380A (en) |
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2023
- 2023-07-17 CN CN202310873842.7A patent/CN116770380A/en active Pending
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