CN116770259A - Deposition apparatus for manufacturing display apparatus and deposition method using the same - Google Patents

Deposition apparatus for manufacturing display apparatus and deposition method using the same Download PDF

Info

Publication number
CN116770259A
CN116770259A CN202211157828.9A CN202211157828A CN116770259A CN 116770259 A CN116770259 A CN 116770259A CN 202211157828 A CN202211157828 A CN 202211157828A CN 116770259 A CN116770259 A CN 116770259A
Authority
CN
China
Prior art keywords
temperature
thermal imaging
imaging camera
substrate
deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211157828.9A
Other languages
Chinese (zh)
Inventor
曹踊晧
朴俊河
全洪柱
许明洙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Display Co Ltd
Original Assignee
Samsung Display Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Display Co Ltd filed Critical Samsung Display Co Ltd
Publication of CN116770259A publication Critical patent/CN116770259A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/52—Means for observation of the coating process
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/0275—Control or determination of height or distance or angle information for sensors or receivers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/48—Thermography; Techniques using wholly visual means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating

Abstract

A deposition apparatus for manufacturing a display device includes: a chamber; a depositor disposed inside the chamber and configured to spray a deposition substance; and a thermal imaging camera module, wherein the thermal imaging camera module comprises: a thermal imaging camera configured to measure a temperature of a subject; a lens comprising a first surface and a second surface opposite the first surface and disposed adjacent to the thermal imaging camera; and a thermocouple connected to the lens and configured to measure a temperature of the lens.

Description

Deposition apparatus for manufacturing display apparatus and deposition method using the same
Technical Field
The present invention relates to a deposition apparatus for manufacturing a display device and a deposition method using the same. In more detail, the present invention relates to a deposition apparatus for manufacturing a display device maintaining the inside of a chamber in a vacuum state and a deposition method using the same.
Background
In the case of manufacturing a display device, a horizontal upward deposition method of horizontally disposing a substrate and a mask of a patterned metal material inside a chamber and then depositing a deposition substance onto the substrate by spraying the deposition substance toward the mask is being widely used.
The horizontal upward deposition method is a method in which the substrate and the mask horizontally arranged with respect to the bottom surface of the chamber are aligned with each other and then bonded, and an organic substance is deposited to the substrate in a horizontal state.
On the other hand, when the substrate and the mask are bonded in a misaligned state, a shadow (shadow) phenomenon in which the deposition substance penetrates between the substrate and the mask to cause diffusion of a deposition pattern may occur.
Disclosure of Invention
Technical problem to be solved
An object of the present invention is to provide a deposition apparatus for manufacturing a display device with improved process reliability.
Another object of the present invention is to provide a deposition method using the deposition apparatus for manufacturing a display device.
However, the object of the present invention is not limited to the above object, and various extensions can be made within a range not departing from the spirit and scope of the present invention.
Solution method
In order to achieve the foregoing object of the present invention, a deposition apparatus for manufacturing a display device according to an embodiment of the present invention includes: a chamber; a depositor disposed inside the chamber and configured to spray a deposition substance; and a thermal imaging camera module, wherein the thermal imaging camera module comprises: a thermal imaging camera configured to measure a temperature of a subject; a lens comprising a first surface and a second surface opposite the first surface and disposed adjacent to the thermal imaging camera; and a thermocouple connected to the lens and configured to measure a temperature of the lens.
According to an embodiment, the deposition apparatus for manufacturing a display apparatus may further include: a substrate opposite to the depositor inside the chamber, and the deposition substance is deposited to the substrate; a mask disposed between the substrate and the depositor; and an electrostatic chuck disposed under the substrate and supporting and fixing the substrate.
According to an embodiment, the object may be at least one of the substrate, the mask, and the electrostatic chuck.
According to an embodiment, the thermal imaging camera module may further comprise: a cooling line in contact with the thermal imaging camera and configured to adjust a temperature of the thermal imaging camera and a temperature of the lens.
According to an embodiment, the cooling wire may be wound around a surface of the thermal imaging camera.
According to an embodiment, the thermal imaging camera module may further comprise: a protective tape comprising a transparent substance and disposed on the second surface of the lens.
According to an embodiment, the thermal imaging camera module may further comprise: a main body portion accommodating the thermal imaging camera and the thermocouple; and a leg portion connected to the main body portion.
According to an embodiment, the leg may comprise a bellows (bellows).
According to an embodiment, the body portion may include a first opening, and the lens may be coupled to the body portion through the first opening.
According to an embodiment, the thermal imaging camera module may further comprise: a shutter coupled to the body portion and configured to open and close the second surface of the lens.
According to an embodiment, the body portion may include a second opening, and the thermal imaging camera module may further include: a shutter driving part configured to control an open state or a closed state of the shutter; and a shutter connecting portion connecting the shutter driving portion and the shutter, and coupled to the main body portion through the second opening.
According to an embodiment, the thermal imaging camera module may further comprise: a motor cable disposed inside the main body portion and configured to supply electric power to the shutter driving portion; and a camera cable disposed inside the main body portion and configured to supply power to the thermal imaging camera.
According to an embodiment, an inner space of the thermal imaging camera module sealed by the body portion, the lens, the shutter connection portion, and the leg portion may be in an atmospheric pressure state.
According to an embodiment, the thermal imaging camera module may further comprise: an angle adjusting portion disposed at a boundary of the main body portion and the leg portion and configured to adjust a direction in which the thermal imaging camera performs photographing.
In order to achieve the other object of the present invention as described above, a deposition method using a deposition apparatus for manufacturing a display apparatus according to an embodiment of the present invention may include: providing a chamber comprising a depositor, a base material, an electrostatic chuck arranged on the base material, a thermal imaging camera module comprising a thermal imaging camera and a shutter; a step of opening the shutter to expose the thermal imaging camera; a step of measuring a temperature of the electrostatic chuck using the thermal imaging camera; a step of closing the shutter so as not to expose the thermal imaging camera; and a step of ejecting a deposition substance from the depositor.
According to an embodiment, the deposition method using the deposition apparatus for manufacturing a display apparatus may further include, between the step of measuring the temperature of the electrostatic chuck and the step of closing the shutter: and adjusting the temperature of the electrostatic chuck to a first target temperature.
According to an embodiment, the first target temperature may be 60 ℃ or lower.
According to an embodiment, the deposition method using the deposition apparatus for manufacturing a display apparatus may further include, between the step of adjusting the temperature of the electrostatic chuck to the first target temperature and the step of closing the shutter: a step of positioning a mask inside the chamber by a mask transfer section; a step of measuring a temperature of the mask using the thermal imaging camera; and a step of adjusting the temperature of the mask to a second target temperature.
According to an embodiment, the deposition method using the deposition apparatus for manufacturing a display apparatus may further include, between the step of adjusting the temperature of the mask to the second target temperature and the step of closing the shutter: a step of positioning a substrate between the mask and the electrostatic chuck inside the chamber; a step of measuring a temperature of the substrate using the thermal imaging camera; and a step of adjusting the temperature of the substrate to a third target temperature.
According to an embodiment, the deposition method using the deposition apparatus for manufacturing a display apparatus may further include, between the step of adjusting the temperature of the substrate to a third target temperature and the step of closing the shutter: a step of contacting the mask to the substrate; a step of measuring a temperature of the mask and a temperature of the substrate using the thermal imaging camera; and a step of adjusting the temperature of the mask to a fourth target temperature and adjusting the temperature of the substrate to a fifth target temperature.
Advantageous effects
The deposition apparatus for manufacturing the display apparatus may measure the temperature of the object by including a thermal imaging camera module including a thermal imaging camera. In more detail, the deposition apparatus may directly measure the temperature of the subject, instead of deducing the temperature of the subject from the temperature of the coolant disposed at the periphery of the subject.
By directly measuring the temperature of the subject using a thermal imaging camera before the deposition process for manufacturing the display device is completed, the deposition device can predict in advance a problem that may occur in the deposition process. Therefore, when the temperature of the subject is different from the target temperature, the depositing device can prevent the problem in advance by adjusting the temperature of the subject to the target temperature.
Accordingly, by measuring and adjusting the temperature of the electrostatic chuck to avoid the temperature of the electrostatic chuck from being too high, thermal shock that the electrostatic chuck may be subjected to can be prevented.
In addition, by measuring and adjusting the temperature of the substrate and the temperature of the mask to avoid the temperature of the substrate and the temperature of the mask from being too high, the substrate and the mask can be aligned and bonded in an optimal state. Therefore, the shadow phenomenon can be prevented. Further, the properties of the deposition pattern such as the thickness of the deposition pattern deposited on the substrate, the refractive index of the deposition pattern, the molecular arrangement of the deposition pattern, the roughness of the deposition pattern, and the like may be formed to be the same as the target properties. Therefore, defects such as color abnormality, increase in power consumption, and the like of the display device manufactured by the deposition process can be prevented. Accordingly, the yield of the display device manufactured through the deposition process may be improved.
However, the effects of the present invention are not limited to the foregoing effects, and various extensions can be made within the scope not departing from the spirit and scope of the present invention.
Drawings
Fig. 1 is a cross-sectional view illustrating a deposition apparatus for manufacturing a display apparatus according to an embodiment of the present invention.
Fig. 2 is an enlarged cross-sectional view illustrating a portion "a" of fig. 1.
Fig. 3 is an enlarged cross-sectional view illustrating the thermal imaging camera module of fig. 1.
Fig. 4 is a cross-sectional view illustrating the thermal imaging camera module of fig. 3.
Fig. 5 to 9 are cross-sectional views illustrating a deposition method using a deposition apparatus for manufacturing a display apparatus according to an embodiment of the present invention.
Description of the reference numerals
1000: deposition apparatus for manufacturing display device
100: chamber 200: deposition device
300: substrate 400: mask for mask
500: thermal imaging camera module 600: electrostatic chuck
DM: deposition material NZ: nozzle
510: thermal imaging camera 530: lens
S1: first surface S2: a second surface
550: thermocouple 531: protective adhesive tape
520: shutter 521: shutter driving part
523: shutter connection portions 541, 542, 543: video camera cable
544: motor cable 560: angle adjusting part
570: cooling line 700: base material
591: main body 593: leg portion
AA1: first opening AA2: a second opening
Detailed Description
Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The same reference numerals are used for the same constituent elements in the drawings, and repeated description of the same constituent elements will be omitted.
Fig. 1 is a cross-sectional view illustrating a deposition apparatus 1000 for manufacturing a display apparatus according to an embodiment of the present invention.
Referring to fig. 1, a deposition apparatus 1000 for manufacturing a display apparatus may include a chamber 100, a depositor 200, a substrate 300, a mask 400, a thermal imaging camera module 500, an electrostatic chuck 600, and a base material 700.
The deposition apparatus 1000 for manufacturing a display device may include a chemical vapor deposition (chemical vapor deposition; CVD) apparatus. However, the deposition apparatus 1000 for manufacturing the display apparatus is not limited to the above-described chemical vapor deposition apparatus. For example, the deposition apparatus 1000 for manufacturing a display apparatus may include a plasma enhanced chemical vapor deposition (plasma enhanced chemical vapor deposition; PECVD) apparatus. The deposition apparatus 1000 for manufacturing a display apparatus may form constituent elements included in the display apparatus. For example, the deposition apparatus 1000 for manufacturing a display device may form a silicon-based insulating layer, a silicon-based semiconductor layer, or the like included in the above display device.
The chamber 100 may provide a space for performing a deposition process for manufacturing a display device. The chamber 100 may be connected to an exhaust. Accordingly, the inside of the chamber 100 may be maintained in a vacuum state by the above-described exhaust means. The chamber 100 may include stainless steel, but is not limited thereto.
The depositor 200 may include a deposition substance DM. The depositor 200 may be in the form of a spray head including at least one nozzle NZ for spraying the deposition substance DM. The depositor 200 may be disposed at one side of the interior of the chamber 100. The depositor 200 may spray the deposition substance DM stored inside the depositor 200 through the nozzle NZ. The deposition material DM sprayed through the nozzle NZ may be sprayed in a high-temperature environment. Accordingly, in order to perform the above-described deposition process, the temperature of other constituent elements inside the chamber 100 may be increased.
The base material 700 may be disposed at the other side of the interior of the chamber 100. The base material 700 may support the electrostatic chuck 600, the substrate 300, and the mask 400 disposed on the base material 700.
The electrostatic chuck 600 may be disposed on the base material 700. The electrostatic chuck 600 may support the substrate 300. The electrostatic chuck 600 may hold (or clamp) the substrate 300. The electrostatic chuck 600 may fix the substrate 300 using electrostatic force (electrostatic force).
The substrate 300 may be disposed on the electrostatic chuck 600. That is, the electrostatic chuck 600 may be disposed under the substrate 300. Thus, the substrate 300 may be opposite to the depositor 200 inside the chamber 100. The substrate 300 may be fixed by an electrostatic chuck 600. The substrate 300 may include a glass substrate. However, the kind of the substrate 300 is not limited thereto. For example, the substrate 300 may include a quartz substrate, a plastic substrate, and the like. The deposition material DM sprayed by the depositor 200 may be deposited onto the substrate 300. Accordingly, by depositing the deposition material DM on the substrate 300, various deposition patterns may be formed on the substrate 300. The display device may include a substrate 300 including the above-described deposition pattern. For example, the substrate 300 may be a display panel included in the above-described display device.
The mask 400 may be disposed on the substrate 300. That is, the mask 400 may be disposed between the substrate 300 and the depositor 200. Mask 400 may include patterned metal. In other words, the mask 400 may be one constituent including a preset opening. That is, the mask 400 of the illustrated side may not be separated, but may be open as described above.
When the depositor 200 ejects the deposition substance DM toward the substrate 300, the deposition substance DM may be deposited onto the substrate 300 in a patterned manner. In other words, the deposition material DM may be deposited on the substrate 300 only through the above-described openings of the mask 400. Therefore, it is important that the mask 400 and the substrate 300 are bonded in a state in which the above-mentioned opening of the mask 400 is aligned with a position on the substrate 300 where the deposition substance DM is to be deposited.
The above-described deposition process may be performed at a high temperature. On the other hand, the temperature inside the chamber 100 may be different from the temperature of each of the constituent elements inside the chamber 100. In other words, the temperature of the substrate 300, the temperature of the mask 400, the temperature of the electrostatic chuck 600, and the like may be different from each other.
The substance included in the substrate 300 and the substance included in the mask 400 may be different. In other words, the thermal expansion rate of the substrate 300 and the thermal expansion rate of the mask 400 may be different. Therefore, when the above-described deposition process is performed at a high temperature, the substrate 300 and the mask 400 may be bonded in a misaligned state. In this case, the deposition material DM may penetrate between the substrate 300 and the mask 400. Therefore, the shadow (shadow) phenomenon of the deposition pattern diffusion described above may occur.
In addition, the temperature of the substrate 300 and the temperature of the mask 400 may affect the properties of the deposition pattern such as the thickness of the deposition pattern, the refractive index of the deposition pattern, the molecular arrangement of the deposition pattern, the roughness of the deposition pattern, and the like. When the properties of the deposition pattern are different from the target properties, defects such as color abnormality, power consumption increase, and the like may occur in the display device manufactured through the deposition process. Accordingly, the yield of the display device manufactured through the above-described deposition process may be reduced.
In addition, when the temperature of the electrostatic chuck 600 is too high, the electrostatic chuck 600 may receive thermal shock due to thermal expansion and thermal contraction. Accordingly, the electrostatic chuck 600 may be broken.
Therefore, it is necessary to grasp the temperature of the substrate 300, the temperature of the mask 400, and the temperature of the electrostatic chuck 600.
The thermal imaging camera module 500 may be disposed inside the chamber 100 to grasp the temperature of the substrate 300, the temperature of the mask 400, and the temperature of the electrostatic chuck 600. The thermal imaging camera module 500 may measure the temperature of the constituent elements disposed inside the chamber 100 by analyzing the temperature images of the constituent elements. In one embodiment, the thermal imaging camera module 500 may directly measure the temperature of the substrate 300, the temperature of the mask 400, and the temperature of the electrostatic chuck 600. Further, the thermal imaging camera module 500 may measure the temperature of each component by executing an algorithm for separating temperature images of components in contact with each other.
Although one thermal imaging camera module 500 is shown to be disposed at the left and right sides, respectively, the number of thermal imaging camera modules 500 and the thermal imaging camera module 500 positions are not limited thereto.
The thermal imaging camera module 500 will be described in detail with reference to fig. 3 and 4.
Fig. 2 is an enlarged cross-sectional view illustrating a portion "a" of fig. 1.
Referring to fig. 2, the base material 700 may include an aluminum substrate. The base material 700 may be molded and manufactured in a block shape. However, the material of the base material 700 and the type of the base material 700 are not limited thereto. The material of the base material 700 may vary according to the material of the electrostatic chuck 600.
The base material 700 may include at least one cooling line CL. The temperature of the base material 700 can be reduced by the coolant flowing along the cooling line CL. Therefore, when the above-described deposition process is performed at a high temperature, the temperature of the base material 700 may be adjusted by the above-described coolant flowing along the cooling line CL. The temperature of the constituent element in contact with the base material 700 may be adjusted by the coolant flowing along the cooling line CL. For example, the above-described coolant flowing along the cooling line CL may adjust the temperature of the electrostatic chuck 600 disposed on the base material 700, the temperature of the substrate 300 disposed on the electrostatic chuck 600, and the temperature of the mask 400 disposed on the substrate 300.
The electrostatic chuck 600 may be disposed on the base material 700. The electrostatic chuck 600 may form an electric field using an electrode layer CE including an anode (e.g., a first electrode CE 1) and a cathode (e.g., a second electrode CE 2), thereby fixing (or clamping) a substrate 300 such as a glass substrate.
The electrostatic chuck 600 may include an insulating layer IL including a first insulating layer IL1 and a second insulating layer IL2, an electrode layer CE including a first electrode CE1 and a second electrode CE2, a bank DAM, and an embossed EB.
The first insulating layer IL1 may be disposed on the base material 700. The first insulating layer IL1 may serve to insulate between the electrode layer CE and the base material 700. The first insulating layer IL1 may include yttrium oxide (Y 2 O 3 ) But is not limited thereto.
The electrode layer CE may be disposed on the first insulating layer IL 1. The electrode layer CE may include tungsten (W), but is not limited thereto. The electrode layer CE may include anodes and cathodes alternately arranged. For example, the first electrode CE1 may be an anode, and the second electrode CE2 may be a cathode. Accordingly, opposite charges may be induced in the substrate 300 disposed on the electrode layer CE, thereby forming an electric field. For example, a portion of the substrate 300 disposed on the first electrode CE1 as an anode may have negative charges, and a portion of the substrate 300 disposed on the second electrode CE2 as a cathode may have positive charges. Accordingly, the electrostatic chuck 600 may fix the substrate 300 by an electrostatic force.
The second insulating layer IL2 may be disposed on the electrode layer CE. That is, the second insulating layer IL2 may be disposed between the electrode layer CE and the substrate 300. The second insulating layer IL2 may function to insulate between the electrode layer CE and the substrate 300. The second insulating layer IL2 may include aluminum oxide (Al 2 O 3 ) But is not limited thereto.
The bank DAM may be arranged in a circumferential direction of the outermost periphery of the second insulation layer IL 2. The DAM may have a predetermined thickness and a predetermined width. The bank DAM may function as a support substrate 300.
The embossed EB may be disposed inside the bank DAM on the second insulation layer IL 2. The thickness of the embossed EB may be the same as the thickness of the dyke DAM. Thus, the embossed EB and the bank DAM may support the substrate 300. In addition, the embossed EB may be provided in plurality. Therefore, a cooling flow path can be formed between the plurality of embossed EBs. The coolant flowing along the cooling flow path described above can effectively regulate the temperature of the electrostatic chuck 600, the temperature of the substrate 300, and the temperature of the mask 400.
The substrate 300 may be disposed on the bank DAM and the embossed EB. The mask 400 may be disposed on the substrate 300.
In other words, when it is necessary to cool the electrostatic chuck 600, the substrate 300, and the mask 400, the above-described coolant flowing along the cooling line CL and/or the above-described coolant supplied to the above-described cooling flow path between the embossed EBs may be utilized.
However, the temperature of the above-described coolant and/or the temperature of the above-described coolant may be different from the temperature of the electrostatic chuck 600, the temperature of the substrate 300, and the temperature of the mask 400. In other words, the temperature of the electrostatic chuck 600, the temperature of the substrate 300, and the temperature of the mask 400 are inferred only using the temperature of the above-described coolant and/or the temperature of the above-described coolant.
Referring to fig. 1 and 2, the above-described coolant and/or the above-described coolant may change the temperature of the electrostatic chuck 600, the temperature of the substrate 300, and the temperature of the mask 400. The thermal imaging camera module 500 may monitor a temperature change of the electrostatic chuck 600, a temperature change of the substrate 300, and a temperature change of the mask 400. In other words, the thermal imaging camera module 500 may not measure the temperature of the above-described coolant and/or the temperature of the above-described coolant, but the thermal imaging camera module 500 may directly measure the temperature of the electrostatic chuck 600, the temperature of the substrate 300, and the temperature of the mask 400.
Fig. 3 is an enlarged cross-sectional view illustrating the thermal imaging camera module 500 of fig. 1.
Referring to fig. 1 and 3, the thermal imaging camera module 500 may include a thermal imaging camera 510 for measuring a temperature of a subject, a lens 530 and a thermocouple 550, the thermal imaging camera 510 including a first surface S1 and a second surface S2 opposite to the first surface S1 and disposed adjacent to the thermal imaging camera 510, the thermocouple 550 being connected to the lens 530 and for measuring the temperature of the lens 530. The thermal imaging camera module 500 may be connected to an analysis device arranged outside the chamber 100.
The thermal imaging camera 510 may measure the temperature of the subject by sensing infrared rays (infra-red rays) or the like. Further, the thermal imaging camera 510 may measure the surface temperature of each subject by executing an algorithm for separating temperature images of subjects in contact with each other. In more detail, the thermal imaging camera 510 may capture the subject to obtain a temperature image of the subject, and transmit the temperature image to the analysis device. The analysis device may grasp the temperature of the subject by analyzing the temperature image.
The lens 530 may have a first surface S1 and a second surface S2 opposite to the first surface S1. The first surface S1 of the lens 530 may be disposed at a front surface portion of the thermal imaging camera 510. In more detail, the first surface S1 of the lens 530 may be attached to the thermal imaging camera 510. A lens 530 is attached to the thermal imaging camera 510 to adjust the focus of the thermal imaging camera 510 to the subject. The subject may be at least one of the substrate 300, the mask 400, and the electrostatic chuck 600. However, the above-described subject is not limited thereto.
The thermocouples 550 may be metal wires of different kinds from each other that cause a thermoelectric effect. The thermoelectric effect may be an effect of generating an electric potential due to a temperature difference between the metal lines. Accordingly, the thermocouple 550 may measure the temperature difference on the wire. When the temperature of the lens 530 is too high, the above temperature image obtained by the thermal imaging camera 510 through the lens 530 may be distorted. Accordingly, a thermocouple 550 may be connected to the lens 530 to continuously measure the temperature of the lens 530.
Hereinafter, the thermal imaging camera module 500 will be described in detail with reference to fig. 4.
Fig. 4 is a cross-sectional view illustrating the thermal imaging camera module 500 of fig. 3.
Referring to fig. 1, 3 and 4, the thermal imaging camera module 500 may further include a main body portion 591, a leg portion 593, a protective tape 531, a shutter 520, a shutter driving portion 521, a shutter connection portion 523, camera cables 541, 542, 543, a motor cable 544, a cooling line 570, and an angle adjusting portion 560.
The body portion 591 may house the thermal imaging camera 510 and the thermocouple 550. The body portion 591 may include a first opening AA1 and a second opening AA2. The lens 530 may be coupled to the body portion 591 through the first opening AA 1.
The leg portion 593 may be connected to the body portion 591. Leg 593 may include bellows (bellows). The bellows may be an elastic member having a corrugated shape.
The protective tape 531 may include a transparent substance. For example, the protective tape 531 may include polyimide (polyimide). A protective tape 531 may be disposed on the second surface S2 of the lens 530. In more detail, a protective tape 531 may be attached to the second surface S2 of the lens 530. Thus, the protective tape 531 may prevent the lens 530 from being exposed to the deposition material DM. The protective tape 531 may be a material in a tape state, and the protective tape 531 may be attached and detached. Therefore, when the protective tape 531 is damaged, the protective tape 531 may be replaced.
The shutter 520 may be coupled to the body portion 591. The shutter 520 may be disposed outside the main body portion 591. The shutter 520 may open and close the second surface S2 of the lens 530. In other words, when the shutter 520 opens the second surface S2 of the lens 530, the thermal imaging camera 510 can measure the temperature of the subject through the lens 530. When the shutter 520 closes the second surface S2 of the lens 530, the thermal imaging camera 510 cannot measure the temperature of the above-mentioned object through the lens 530. However, when the shutter 520 closes the second surface S2 of the lens 530, the shutter 520 may minimize the possibility of impurities such as the deposition material DM adhering to the lens 530 and the protective tape 531.
The shutter driving portion 521 may be disposed inside the main body portion 591. The shutter driving part 521 may control an opened state or a closed state of the shutter 520.
The shutter connection part 523 may connect the shutter driving part 521 and the shutter 520. The shutter connection portion 523 may be coupled with the body portion 591 through the second opening AA2 of the body portion 591. In other words, the shutter connection portion 523 may separate the positions of the shutter 520 and the shutter driving portion 521 such that the shutter 520 is disposed outside the main body portion 591 and the shutter driving portion 521 is disposed inside the main body portion 591. In more detail, in the case where the shutter driving part 521 drives the shutter 520, the shutter connection part 523 may seal a space inside the body part 591 so that the inside of the body part 591 is not exposed to the outside of the body part 591.
The interior of the chamber 100 may be in a vacuum state. The internal space of the thermal imaging camera module 500 sealed by the main body portion 591, the lens 530 coupled to the first opening AA1 of the main body portion 591, the shutter connection portion 523 coupled to the second opening AA2 of the main body portion 591, and the leg portion 593 connected to the main body portion 591 may be in an atmospheric pressure state. In other words, the internal space of the above-described sealed thermal imaging camera module 500 can protect the constituent elements of the thermal imaging camera 510, the thermocouple 550, and the like disposed inside the chamber 100 from the vacuum state.
The camera cables 541, 542, 543 and the motor cable 544 may be arranged inside the main body portion 591. The camera cables 541, 542, 543 may supply power to the thermal imaging camera 510. The motor cable 544 may supply power to the shutter driving portion 521. The camera cables 541, 542, 543 and the motor cable 544 may be connected to a power supply line 545 arranged inside the main body portion 591 and extending toward the inside of the leg portion 593.
The cooling line 570 may be in contact with the thermal imaging camera 510. The cooling line 570 may regulate the temperature of the thermal imaging camera 510 with cooling substances flowing along the cooling line 570. In addition, the cooling line 570 may adjust the temperature of the lens 530 attached to the thermal imaging camera 510. In other words, when the temperature of the thermal imaging camera 510 and the temperature of the lens 530 are too high, the temperature image obtained by the thermal imaging camera 510 may be distorted, and thus, the cooling line 570 may reduce the temperature of the thermal imaging camera 510 and the temperature of the lens 530.
The cooling line 570 may include a first cooling line 571 and a second cooling line 573, the cooling substance entering the cooling line 570 through the first cooling line 571 and the cooling substance exiting the cooling line 570 through the second cooling line 573. The first cooling line 571 and the second cooling line 573 may be connected to each other. The cooling wire 570 may be wrapped around the surface of the thermal imaging camera 510. In other words, the cooling wire 570 contacts the surface of the thermal imaging camera 510 in a rotating surrounding manner, thereby maximizing the contact area of the cooling wire 570 with the thermal imaging camera 510. That is, the cooling line 570 may effectively reduce the temperature of the thermal imaging camera 510 and the temperature of the lens 530.
The angle adjusting part 560 may be disposed at a boundary of the body part 591 and the leg part 593. The angle adjusting section 560 can adjust the direction in which the thermal imaging camera 510 performs photographing. That is, the angle adjusting part 560 may adjust the orientation of the second surface S2 of the lens 530 attached to the thermal imaging camera 510. In other words, the angle adjusting section 560 may adjust the direction in which the thermal imaging camera 510 performs photographing so that the thermal imaging camera 510 faces the position of the subject at which the temperature is measured.
Fig. 5 to 9 are cross-sectional views illustrating a deposition method using a deposition apparatus for manufacturing a display apparatus according to an embodiment of the present invention.
Referring to fig. 1, 4 and 5, a deposition method using a deposition apparatus for manufacturing a display apparatus may include: providing a chamber 100, the chamber 100 including a depositor 200, a base material 700, an electrostatic chuck 600 disposed on the base material 700, and a thermal imaging camera module 500 including a thermal imaging camera 510 and a shutter 520; a step of opening the shutter 520 to expose the thermal imaging camera 510; a step of measuring the temperature of the electrostatic chuck 600 using the thermal imaging camera 510; and a step of closing the shutter 520 so that the thermal imaging camera 510 is not exposed.
When the temperature of the electrostatic chuck 600 is excessively higher than the first target temperature, the electrostatic chuck 600 may be broken by thermal shock due to thermal expansion and thermal contraction. Accordingly, the above-described deposition method using the deposition apparatus for manufacturing the display apparatus may confirm the temperature of the electrostatic chuck 600 by including the step of measuring the temperature of the electrostatic chuck 600 using the above-described thermal imaging camera 510, thereby predicting in advance that a problem may occur in the above-described deposition process.
The deposition method using the deposition apparatus for manufacturing a display apparatus may further include a step of adjusting the temperature of the electrostatic chuck 600 to the first target temperature between the step of measuring the temperature of the electrostatic chuck 600 and the step of closing the shutter 520. The first target temperature may be 60 ℃ or lower. Therefore, problems in the above-described deposition process can be prevented in advance.
Referring to fig. 2 together, in the step of adjusting the temperature of the electrostatic chuck 600 to the first target temperature, the temperature of the electrostatic chuck 600 may be adjusted by using a cooling line CL included in the base material 700 supporting the electrostatic chuck 600.
Further, the above-described deposition method using the deposition apparatus for manufacturing the display apparatus may minimize the possibility of impurities such as the deposition substance DM adhering to the lens 530 and the protective tape 531 by including the above-described step of opening the shutter 520 and the above-described step of closing the shutter 520. In other words, damage of the lens 530 and the protective tape 531 can be reduced, thereby improving durability.
Referring to fig. 6, the deposition method using the deposition apparatus for manufacturing a display apparatus may further include, between the step of adjusting the temperature of the electrostatic chuck 600 to the first target temperature and the step of closing the shutter 520: a step of positioning the mask 400 inside the chamber 100 using the mask transfer part 450, a step of measuring the temperature of the mask 400 using the thermal imaging camera 510, and a step of adjusting the temperature of the mask 400 to a second target temperature.
When the temperature of the mask 400 is excessively higher than the second target temperature, the mask 400 may not be aligned at a preset position on the substrate 300. Further, when the deposition material DM is sprayed onto the substrate 300 to form a deposition pattern, the properties of the deposition pattern may be different from the target properties. Accordingly, the above-described deposition method using the deposition apparatus for manufacturing the display apparatus may confirm the temperature of the mask 400 by including the above-described step of measuring the temperature of the mask 400 using the thermal imaging camera 510, thereby predicting in advance that a problem may occur in the above-described deposition process.
The above-described deposition method using the deposition apparatus for manufacturing the display apparatus may prevent problems from occurring in the above-described deposition process in advance by including the step of adjusting the temperature of the mask 400 to the above-described second target temperature. The above-described step of adjusting the temperature of the mask 400 to the above-described second target temperature may be performed by a mask coolant included in the mask transfer part 450.
In addition, the above-described deposition method using the deposition apparatus for manufacturing the display apparatus may further include a step of opening the shutter 520 before the step of measuring the temperature of the mask 400, and may include a step of closing the shutter 520 after the step of measuring the temperature of the mask 400.
By including the step of opening the shutter 520 and the step of closing the shutter 520, the possibility of impurities such as the deposition substance DM adhering to the lens 530 and the protective tape 531 can be minimized. In other words, a step of opening the shutter 520 may be included before each step of using the thermal imaging camera 510, and a step of closing the shutter 520 may be included after each step of using the thermal imaging camera 510. That is, the possibility that impurities such as the deposition substance DM adhere to the lens 530 and the protective tape 531 can be minimized by minimizing the time of the open state of the shutter 520.
Referring to fig. 7, the deposition method using the deposition apparatus for manufacturing a display apparatus may further include, between the step of adjusting the temperature of the mask 400 to the second target temperature and the step of closing the shutter 520: a step of positioning the substrate 300 between the mask 400 and the electrostatic chuck 600 inside the chamber 100, a step of measuring the temperature of the substrate 300 using the thermal imaging camera 510, and a step of adjusting the temperature of the substrate 300 to a third target temperature.
When the temperature of the substrate 300 is excessively higher than the third target temperature, the mask 400 may not be aligned at a preset position on the substrate 300. Further, when the deposition material DM is sprayed onto the substrate 300 to form a deposition pattern, the properties of the deposition pattern may be different from the target properties. Accordingly, the above-described deposition method using the deposition apparatus for manufacturing the display apparatus may confirm the temperature of the substrate 300 by including the step of measuring the temperature of the substrate 300 using the above-described thermal imaging camera 510, thereby predicting that a problem may occur in the above-described deposition process in advance.
The above-described deposition method using the deposition apparatus for manufacturing the display apparatus may prevent problems from occurring in the above-described deposition process in advance by including the step of adjusting the temperature of the substrate 300 to the above-described third target temperature. The step of adjusting the temperature of the substrate 300 to the third target temperature may be performed by a coolant flowing along the cooling flow path between the cooling line CL and the embossed EB included in the base material 700.
In addition, the above-described deposition method using the deposition apparatus for manufacturing the display apparatus may further include a step of opening the shutter 520 before the step of measuring the temperature of the substrate 300, and may include a step of closing the shutter 520 after the step of measuring the temperature of the substrate 300.
By including the step of opening the shutter 520 described above and the step of closing the shutter 520 described above, the possibility of impurities such as the deposition substance DM adhering to the lens 530 and the protective tape 531 can be minimized. In other words, a step of opening the shutter 520 may be included before each step of using the thermal imaging camera 510, and a step of closing the shutter 520 may be included after each step of using the thermal imaging camera 510. That is, the possibility that impurities such as the deposition substance DM adhere to the lens 530 and the protective tape 531 can be minimized by minimizing the time of the open state of the shutter 520.
Referring to fig. 8, the deposition method using the deposition apparatus for manufacturing a display apparatus may further include, between the step of adjusting the temperature of the substrate 300 to the third target temperature and the step of closing the shutter 520: a step of bringing the mask 400 into contact with the substrate 300, a step of measuring the temperature of the mask 400 and the temperature of the substrate 300 using the thermal imaging camera 510, and a step of adjusting the temperature of the mask 400 to a fourth target temperature and the temperature of the substrate 300 to a fifth target temperature.
The fourth target temperature may be the same as the second target temperature, and the fifth target temperature may be the same as the third target temperature. The fourth target temperature may be the temperature of the optimal mask 400 to perform the above-described deposition process of ejecting the deposition material DM. The fifth target temperature may be the temperature of the substrate 300 optimal for performing the above-described deposition process of ejecting the deposition material DM. The fourth target temperature and the fifth target temperature may be temperatures differently preset according to the kind of the deposition material DM, the kind of the mask 400, the kind of the substrate 300, the target properties of the deposition pattern, and the like.
When the mask 400 and the substrate 300 are in contact, the temperature of the mask 400 may deviate from the second target temperature, and the temperature of the substrate 300 may deviate from the third target temperature. Accordingly, the above-described deposition method using the deposition apparatus for manufacturing the display apparatus may be performed at the optimal temperature of the mask 400 and the optimal temperature of the substrate 300 by including the above-described step of measuring the temperature of the mask 400 and the temperature of the substrate 300 using the thermal imaging camera 510 and the above-described step of adjusting the temperature of the mask 400 to the fourth target temperature and the temperature of the substrate 300 to the fifth target temperature.
In addition, the above-described deposition method using the deposition apparatus for manufacturing the display apparatus may further include a step of opening the shutter 520 before the step of measuring the temperature of the mask 400 and the temperature of the substrate 300, and may include a step of closing the shutter 520 after the step of measuring the temperature of the mask 400 and the temperature of the substrate 300.
By including the step of opening the shutter 520 described above and the step of closing the shutter 520 described above, the possibility of impurities such as the deposition substance DM adhering to the lens 530 and the protective tape 531 can be minimized. In other words, a step of opening the shutter 520 may be included before each step of using the thermal imaging camera 510, and a step of closing the shutter 520 may be included after each step of using the thermal imaging camera 510. That is, the possibility that impurities such as the deposition substance DM adhere to the lens 530 and the protective tape 531 can be minimized by minimizing the time of the open state of the shutter 520.
Referring to fig. 9, the above-described deposition method using the deposition apparatus for manufacturing the display apparatus may further include a step of spraying the deposition material DM from the depositor 200. Accordingly, the above-described deposition process may form a deposition pattern on the substrate 300 under optimal conditions.
In the foregoing, the present invention has been described with reference to exemplary embodiments thereof, and it will be understood by those skilled in the art that various modifications and changes may be made thereto without departing from the spirit and scope of the invention as set forth in the following claims.
The present invention may be applied to a deposition process using a substrate and a mask. In more detail, the method may be applied to a deposition process in a manufacturing process of a display device. For example, the method can be applied to a deposition process for manufacturing a display device of a high-resolution smart phone, a mobile phone, a smart board, a smart watch, a tablet PC, a navigation system for a vehicle, a television, a computer display, a notebook computer, or the like.

Claims (10)

1. A deposition apparatus for manufacturing a display device, comprising:
a chamber;
a depositor disposed inside the chamber and configured to spray a deposition substance; and
a thermal imaging camera module is provided for thermally imaging the object,
wherein the thermal imaging camera module comprises:
a thermal imaging camera configured to measure a temperature of a subject;
a lens comprising a first surface and a second surface opposite the first surface and disposed adjacent to the thermal imaging camera; and
a thermocouple connected to the lens and configured to measure a temperature of the lens.
2. The deposition apparatus for manufacturing a display apparatus according to claim 1, further comprising:
a substrate opposite to the depositor inside the chamber, and the deposition substance is deposited to the substrate;
a mask disposed between the substrate and the depositor; and
an electrostatic chuck disposed under the substrate and supporting and fixing the substrate.
3. The deposition apparatus for manufacturing a display apparatus according to claim 1, wherein the thermal imaging camera module further comprises:
a cooling line in contact with the thermal imaging camera and configured to adjust a temperature of the thermal imaging camera and a temperature of the lens.
4. The deposition apparatus for manufacturing a display apparatus according to claim 1, wherein the thermal imaging camera module further comprises:
a main body portion accommodating the thermal imaging camera and the thermocouple; and
and a leg portion connected to the main body portion.
5. The deposition apparatus for manufacturing a display apparatus according to claim 4, wherein the thermal imaging camera module further comprises:
an angle adjusting portion disposed at a boundary of the main body portion and the leg portion and configured to adjust a direction in which the thermal imaging camera performs photographing.
6. A deposition method using a deposition apparatus for manufacturing a display apparatus, comprising:
providing a chamber comprising a depositor, a base material, an electrostatic chuck arranged on the base material, a thermal imaging camera module comprising a thermal imaging camera and a shutter;
a step of opening the shutter to expose the thermal imaging camera;
a step of measuring a temperature of the electrostatic chuck using the thermal imaging camera;
a step of closing the shutter so as not to expose the thermal imaging camera; and
a step of ejecting a deposition material from the depositor.
7. The deposition method using a deposition apparatus for manufacturing a display apparatus according to claim 6, wherein between the step of measuring the temperature of the electrostatic chuck and the step of closing the shutter further comprises:
and adjusting the temperature of the electrostatic chuck to a first target temperature.
8. The deposition method using a deposition apparatus for manufacturing a display apparatus according to claim 7, wherein between the step of adjusting the temperature of the electrostatic chuck to the first target temperature and the step of closing the shutter further comprises:
a step of positioning a mask inside the chamber by a mask transfer section;
a step of measuring a temperature of the mask using the thermal imaging camera; and
and adjusting the temperature of the mask to a second target temperature.
9. The deposition method using a deposition apparatus for manufacturing a display apparatus according to claim 8, wherein between the step of adjusting the temperature of the mask to the second target temperature and the step of closing the shutter further comprises:
a step of positioning a substrate between the mask and the electrostatic chuck inside the chamber;
a step of measuring a temperature of the substrate using the thermal imaging camera; and
and adjusting the temperature of the substrate to a third target temperature.
10. The deposition method using a deposition apparatus for manufacturing a display apparatus according to claim 9, wherein between the step of adjusting the temperature of the substrate to the third target temperature and the step of closing the shutter further comprises:
a step of contacting the mask to the substrate;
a step of measuring a temperature of the mask and a temperature of the substrate using the thermal imaging camera; and
and a step of adjusting the temperature of the mask to a fourth target temperature and adjusting the temperature of the substrate to a fifth target temperature.
CN202211157828.9A 2022-03-11 2022-09-22 Deposition apparatus for manufacturing display apparatus and deposition method using the same Pending CN116770259A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020220030913A KR20230134061A (en) 2022-03-11 2022-03-11 Deposition device for manufacturing display device and deposition method using the same
KR10-2022-0030913 2022-03-11

Publications (1)

Publication Number Publication Date
CN116770259A true CN116770259A (en) 2023-09-19

Family

ID=85275007

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202222549482.9U Active CN218539818U (en) 2022-03-11 2022-09-22 Deposition apparatus for manufacturing display device
CN202211157828.9A Pending CN116770259A (en) 2022-03-11 2022-09-22 Deposition apparatus for manufacturing display apparatus and deposition method using the same

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN202222549482.9U Active CN218539818U (en) 2022-03-11 2022-09-22 Deposition apparatus for manufacturing display device

Country Status (3)

Country Link
JP (1) JP2023133091A (en)
KR (1) KR20230134061A (en)
CN (2) CN218539818U (en)

Also Published As

Publication number Publication date
CN218539818U (en) 2023-02-28
JP2023133091A (en) 2023-09-22
KR20230134061A (en) 2023-09-20

Similar Documents

Publication Publication Date Title
US8852687B2 (en) Organic layer deposition apparatus
US10644240B2 (en) Deposition mask, apparatus for manufacturing display apparatus, and method of manufacturing display apparatus
US9997708B2 (en) Mask frame assembly, apparatus and method for manufacturing a display apparatus
US9279177B2 (en) Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
CN109722635B (en) Evaporation source device, film forming method, and method for manufacturing electronic device
US9076991B2 (en) Mask management system and method for OLED encapsulation
WO2013147481A1 (en) Apparatus and cluster equipment for selective epitaxial growth
US8609442B2 (en) Vapor deposition method, vapor deposition device and organic EL display device
JPH10214880A (en) Substrate support member
US20140306192A1 (en) Display apparatus having sealing portion and fabrication method thereof
JP2015130522A (en) heat treatment apparatus
CN107779816A (en) Deposition mas component
CN218539818U (en) Deposition apparatus for manufacturing display device
TWI782747B (en) Thermal profile monitoring wafer and methods of monitoring temperature
US20200373195A1 (en) Processing chamber for thermal processes
WO2017209349A1 (en) Non-contact type infrared temperature sensor module
US9887387B2 (en) Organic EL display panel
CN113725082A (en) Mask assembly and manufacturing device for display device
JP3325384B2 (en) Temperature measurement device for heat treatment furnace
WO2023063657A1 (en) Monitoring device enabling large-scale measurement
WO2023075280A1 (en) Susceptor
CN112824558B (en) Film forming apparatus, film forming method using film forming apparatus, and method for manufacturing electronic device
CN219280029U (en) Cooling device of chemical vapor deposition equipment
WO2021002605A1 (en) Substrate processing apparatus
KR102526465B1 (en) A heating system

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication