CN218539818U - Deposition apparatus for manufacturing display device - Google Patents

Deposition apparatus for manufacturing display device Download PDF

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Publication number
CN218539818U
CN218539818U CN202222549482.9U CN202222549482U CN218539818U CN 218539818 U CN218539818 U CN 218539818U CN 202222549482 U CN202222549482 U CN 202222549482U CN 218539818 U CN218539818 U CN 218539818U
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CN
China
Prior art keywords
temperature
thermal imaging
imaging camera
substrate
deposition
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Active
Application number
CN202222549482.9U
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Chinese (zh)
Inventor
曹踊晧
朴俊河
全洪柱
许明洙
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Samsung Display Co Ltd
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Samsung Display Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/52—Means for observation of the coating process
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/0275—Control or determination of height or distance or angle information for sensors or receivers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/48—Thermography; Techniques using wholly visual means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating

Abstract

The deposition apparatus for manufacturing a display device includes: a depositor configured to eject a deposition substance; and a thermal imaging camera module, wherein the thermal imaging camera module comprises: a thermal imaging camera configured to measure a temperature of an object; a lens comprising a first surface and a second surface opposite the first surface and disposed adjacent to the thermal imaging camera; and a thermocouple connected to the lens and configured to measure a temperature of the lens.

Description

Deposition apparatus for manufacturing display device
Technical Field
The utility model relates to a deposition apparatus for making display device. More particularly, the present invention relates to a deposition apparatus for manufacturing a display device, which maintains the inside of a chamber in a vacuum state.
Background
In the case of manufacturing a display device, a horizontal upward deposition method of horizontally arranging a substrate and a patterned mask of a metal material inside a chamber and then depositing a deposition substance to the substrate by spraying the deposition substance toward the mask is being widely used.
The horizontal upward deposition method is a method of aligning and bonding the substrate and the mask horizontally arranged with respect to the bottom surface of the chamber to each other, and depositing organic substances to the substrate in a horizontal state.
On the other hand, when the substrate and the mask are bonded in a misaligned state, a shadow (shadow) phenomenon may occur in which the deposition substance penetrates between the substrate and the mask to cause diffusion of a deposition pattern.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
An object of the utility model is to provide a deposition apparatus for manufacturing display device that technology reliability improves.
However, the object of the present invention is not limited to the above-described object, and various extensions can be made without departing from the scope of the idea and field of the present invention.
Solving means
In order to achieve an object of the present invention, a deposition apparatus for manufacturing a display device according to an embodiment of the present invention includes: a depositor configured to eject a deposition substance; and a thermal imaging camera module, wherein the thermal imaging camera module comprises: a thermal imaging camera configured to measure a temperature of an object; a lens comprising a first surface and a second surface opposite the first surface and disposed adjacent to the thermal imaging camera; and a thermocouple connected to the lens and configured to measure a temperature of the lens.
According to an embodiment, the deposition apparatus for manufacturing a display apparatus may further include: a substrate opposite to the depositor and to which the deposition substance is deposited; a mask disposed between the substrate and the depositor; and an electrostatic chuck disposed under the substrate and supporting and fixing the substrate.
According to an embodiment, the object may be at least one of the substrate, the mask, and the electrostatic chuck.
According to an embodiment, the thermal imaging camera module may further comprise: a cooling line in contact with the thermal imaging camera and configured to adjust a temperature of the thermal imaging camera and a temperature of the lens.
According to an embodiment, the cooling wire may be wound around a surface of the thermal imaging camera.
According to an embodiment, the thermal imaging camera module may further comprise: a protective tape comprising a transparent substance and disposed on the second surface of the lens.
According to an embodiment, the thermal imaging camera module may further comprise: a main body portion housing the thermal imaging camera and the thermocouple; and a leg portion connected to the main body portion.
According to an embodiment, the leg may comprise a bellows (bellows).
According to an embodiment, the body portion may include a first opening, and the lens may be coupled to the body portion through the first opening.
According to an embodiment, the thermal imaging camera module may further comprise: a shutter coupled to the body portion and configured to open and close the second surface of the lens.
According to an embodiment, the body portion may include a second opening, and the thermal imaging camera module may further include: a shutter driving section configured to control an open state or a closed state of the shutter; and a shutter connecting part connecting the shutter driving part and the shutter and coupled to the main body part through the second opening.
According to an embodiment, the thermal imaging camera module may further comprise: a motor cable disposed inside the main body portion and configured to supply power to the shutter driving portion; and a camera cable disposed inside the body portion and configured to supply power to the thermal imaging camera.
According to an embodiment, an inner space of the thermal imaging camera module sealed by the main body portion, the lens, the shutter connection portion, and the leg portion may be in an atmospheric pressure state.
According to an embodiment, the thermal imaging camera module may further comprise: an angle adjusting part disposed at a boundary of the main body part and the leg part and configured to adjust a direction in which the thermal imaging camera photographs.
Advantageous effects
The deposition apparatus for manufacturing the display apparatus may measure the temperature of the object by including a thermal imaging camera module including a thermal imaging camera. In more detail, the deposition apparatus may directly measure the temperature of the object, rather than inferring the temperature of the object from the temperature of a coolant disposed around the object.
By directly measuring the temperature of the subject using a thermal imaging camera before completing a deposition process for manufacturing a display device, the deposition device can predict in advance problems that may occur in the deposition process. Therefore, when the temperature of the object is different from a target temperature, the deposition apparatus can prevent the problem in advance by adjusting the temperature of the object to the target temperature.
Therefore, by measuring and adjusting the temperature of the electrostatic chuck to avoid the temperature of the electrostatic chuck from being excessively high, thermal shock that the electrostatic chuck may receive may be prevented.
Further, by measuring and adjusting the temperature of the substrate and the temperature of the mask to avoid the temperature of the substrate and the temperature of the mask from being excessively high, the substrate and the mask can be aligned and bonded in an optimal state. Therefore, the shadow phenomenon can be prevented. In addition, properties of the deposition pattern, such as a thickness of the deposition pattern deposited on the substrate, a refractive index of the deposition pattern, a molecular arrangement of the deposition pattern, roughness of the deposition pattern, and the like, may be formed to be the same as target properties. Accordingly, defects such as color abnormality, increase in power consumption, and the like of the display device manufactured by the deposition process can be prevented. Accordingly, the yield of the display device manufactured by the deposition process may be improved.
However, the effects of the present invention are not limited to the aforementioned effects, and various extensions can be made within the scope not departing from the spirit and field of the present invention.
Drawings
Fig. 1 is a sectional view illustrating a deposition apparatus for manufacturing a display device according to an embodiment of the present invention.
Fig. 2 is an enlarged sectional view illustrating a portion "a" of fig. 1.
Fig. 3 is an enlarged sectional view illustrating the thermal imaging camera module of fig. 1.
Fig. 4 is a sectional view illustrating the thermal imaging camera module of fig. 3.
Fig. 5 to 9 are sectional views illustrating a deposition method using a deposition apparatus for manufacturing a display device according to an embodiment of the present invention.
Description of reference numerals
1000: deposition apparatus for manufacturing display device
100: the chamber 200: deposition apparatus
300: substrate 400: mask and method for manufacturing the same
500: thermal imaging camera module 600: electrostatic chuck
DM: deposition substance NZ: nozzle for spraying liquid
510: thermal imaging camera 530: lens and lens assembly
S1: first surface S2: second surface
550: thermocouple 531: protective adhesive tape
520: the shutter 521: shutter driving unit
523: shutter connection portions 541, 542, 543: camera cable
544: motor cable 560: angle adjusting part
570: cooling line 700: base material
591: main body portion 593: leg part
AA1: first opening AA2: second opening
Detailed Description
Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The same reference numerals are used for the same constituent elements in the drawings, and a repetitive description thereof will be omitted.
Fig. 1 is a cross-sectional view illustrating a deposition apparatus 1000 for manufacturing a display device according to an embodiment of the present invention.
Referring to fig. 1, a deposition apparatus 1000 for manufacturing a display device may include a chamber 100, a depositor 200, a substrate 300, a mask 400, a thermal imaging camera module 500, an electrostatic chuck 600, and a parent material 700.
The deposition apparatus 1000 for manufacturing the display device may include a Chemical Vapor Deposition (CVD) apparatus. However, the deposition apparatus 1000 for manufacturing the display device is not limited to the above-described chemical vapor deposition apparatus. For example, the deposition apparatus 1000 for manufacturing a display device may include a Plasma Enhanced Chemical Vapor Deposition (PECVD) apparatus. The deposition apparatus 1000 for manufacturing a display device may form a constituent element included in the display device. For example, the deposition apparatus 1000 for manufacturing a display device may form a silicon-based insulating layer, a silicon-based semiconductor layer, and the like included in the above-described display device.
The chamber 100 may provide a space to perform a deposition process for manufacturing a display device. The chamber 100 may be connected to an exhaust. Therefore, the inside of the chamber 100 may be maintained in a vacuum state by the above-described exhaust means. The chamber 100 may include stainless steel, but is not limited thereto.
The depositor 200 may include a deposition substance DM. The depositor 200 may be in the form of a showerhead comprising at least one nozzle NZ for ejecting the deposition substance DM. The depositor 200 may be disposed at one side of the interior of the chamber 100. The depositor 200 may eject the deposition substance DM stored inside the depositor 200 through the nozzle NZ. The deposition material DM sprayed through the nozzle NZ may be sprayed in an environment of high temperature. Accordingly, in order to perform the above-described deposition process, the temperature of other components inside the chamber 100 may be increased.
The parent material 700 may be disposed at the other side of the inside of the chamber 100. The mother substrate 700 may support the electrostatic chuck 600, the substrate 300, and the mask 400 disposed on the mother substrate 700.
The electrostatic chuck 600 may be disposed on the parent material 700. The electrostatic chuck 600 may support the substrate 300. The electrostatic chuck 600 may fix (or clamp) the substrate 300. The electrostatic chuck 600 may use an electrostatic force (electrostatic force) to fix the substrate 300.
The substrate 300 may be disposed on the electrostatic chuck 600. That is, the electrostatic chuck 600 may be disposed under the substrate 300. Accordingly, the substrate 300 may be opposite to the depositor 200 inside the chamber 100. The substrate 300 may be fixed by the electrostatic chuck 600. The substrate 300 may include a glass substrate. However, the kind of the substrate 300 is not limited thereto. For example, the substrate 300 may include a quartz substrate, a plastic substrate, and the like. The deposition material DM sprayed by the depositor 200 may be deposited onto the substrate 300. Accordingly, by depositing the deposition substance DM on the substrate 300, various deposition patterns may be formed on the substrate 300. The display device may include a substrate 300 including the above-described deposition pattern. For example, the substrate 300 may be a display panel included in the display device.
The mask 400 may be disposed on the substrate 300. That is, the mask 400 may be disposed between the substrate 300 and the depositor 200. The mask 400 may include a patterned metal. In other words, the mask 400 may be one constituent element including a predetermined opening. That is, the mask 400 of the illustrated side may not be separated, but may be one exhibiting the above-described opening.
When the depositor 200 ejects the deposition substance DM toward the substrate 300, the deposition substance DM may be deposited onto the substrate 300 in a patterned manner. In other words, the deposition substance DM may be deposited onto the substrate 300 only through the above-described opening of the mask 400. Therefore, it is important that the mask 400 and the substrate 300 are bonded in a state where the above-mentioned opening of the mask 400 is aligned with a position on the substrate 300 where the deposition substance DM is to be deposited.
The deposition process described above may be performed at high temperatures. On the other hand, the temperature inside the chamber 100 may be different from the temperature of each of the constituent elements inside the chamber 100. In other words, the temperature of the substrate 300, the temperature of the mask 400, the temperature of the electrostatic chuck 600, and the like may be different from each other.
The substance included in the substrate 300 and the substance included in the mask 400 may be different. In other words, the thermal expansion rate of the substrate 300 and the thermal expansion rate of the mask 400 may be different. Therefore, when the above deposition process is performed at a high temperature, the substrate 300 and the mask 400 may be bonded in a misaligned state. In this case, the deposition material DM may penetrate between the substrate 300 and the mask 400. Therefore, the shadow (shadow) phenomenon in which the deposition pattern is diffused as described above may occur.
In addition, the temperature of the substrate 300 and the temperature of the mask 400 may affect the properties of the deposition pattern, such as the thickness of the deposition pattern, the refractive index of the deposition pattern, the molecular arrangement of the deposition pattern, the roughness of the deposition pattern, and the like. When the properties of the deposition pattern are different from the target properties, the display device manufactured by the deposition process may suffer from defects such as color abnormality, increase in power consumption, and the like. Therefore, the yield of the display device manufactured by the above deposition process may be reduced.
In addition, when the temperature of the electrostatic chuck 600 is excessively high, the electrostatic chuck 600 may receive thermal shock due to thermal expansion and thermal contraction. Accordingly, the electrostatic chuck 600 may be broken.
Therefore, it is necessary to grasp the temperature of the substrate 300, the temperature of the mask 400, and the temperature of the electrostatic chuck 600.
The thermal imaging camera module 500 may be disposed inside the chamber 100 to grasp the temperature of the substrate 300, the temperature of the mask 400, and the temperature of the electrostatic chuck 600. The thermal imaging camera module 500 may measure the temperature of the components disposed inside the chamber 100 by analyzing temperature images of the components. In an embodiment, the thermal imaging camera module 500 may directly measure the temperature of the substrate 300, the temperature of the mask 400, and the temperature of the electrostatic chuck 600. Further, the thermal imaging camera module 500 may measure the temperature of each component by executing an algorithm for separating temperature images of components in contact with each other.
Although it is illustrated that one thermal imaging camera module 500 is disposed at the left and right sides, respectively, the number of thermal imaging camera modules 500 and the position of the thermal imaging camera modules 500 are not limited thereto.
The thermal imaging camera module 500 will be described in detail with reference to fig. 3 and 4.
Fig. 2 is an enlarged sectional view illustrating a portion "a" of fig. 1.
Referring to fig. 2, the base material 700 may include an aluminum substrate. The base material 700 may be molded and manufactured in a block type. However, the material of the parent material 700 and the type of the parent material 700 are not limited thereto. The material of the parent material 700 may vary according to the material of the electrostatic chuck 600.
The parent material 700 may include at least one cooling line CL. The temperature of the base material 700 can be lowered by the temperature lowering agent flowing along the temperature lowering line CL. Therefore, when the above deposition process is performed at a high temperature, the temperature of the parent material 700 may be adjusted by the above temperature reducing agent flowing along the temperature reduction line CL. The temperature lowering agent flowing along the cooling line CL may adjust the temperature of the components in contact with the base material 700. For example, the above temperature reducing agent flowing along the temperature reduction line CL may adjust the temperature of the electrostatic chuck 600 disposed on the mother material 700, the temperature of the substrate 300 disposed on the electrostatic chuck 600, and the temperature of the mask 400 disposed on the substrate 300.
The electrostatic chuck 600 may be disposed on the base material 700. The electrostatic chuck 600 may form an electric field using an electrode layer CE including an anode (e.g., a first electrode CE 1) and a cathode (e.g., a second electrode CE 2) to fix (or clamp) the substrate 300 such as a glass substrate.
The electrostatic chuck 600 may include an insulating layer IL including a first insulating layer IL1 and a second insulating layer IL2, an electrode layer CE including a first electrode CE1 and a second electrode CE2, a bank DAM, and an emboss EB.
The first insulating layer IL1 may be disposed on the base material 700. The first insulating layer IL1 may serve to insulate the electrode layer CE from the base material 700. The first insulating layer IL1 may include yttrium oxide (Y) 2 O 3 ) But is not limited thereto.
The electrode layer CE may be disposed on the first insulating layer IL 1. The electrode layer CE may include tungsten (W), but is not limited thereto. The electrode layer CE may include anodes and cathodes alternately arranged. For example, the first electrode CE1 may be an anode, and the second electrode CE2 may be a cathode. Accordingly, opposite charges may be induced in the substrate 300 disposed on the electrode layer CE, thereby forming an electric field. For example, a portion of the substrate 300 disposed on the first electrode CE1, which is an anode, may have a negative charge, and a portion of the substrate 300 disposed on the second electrode CE2, which is a cathode, may have a positive charge. Accordingly, the electrostatic chuck 600 may fix the substrate 300 by an electrostatic force.
The second insulating layer IL2 may be disposed on the electrode layer CE. That is, the second insulating layer IL2 may be disposed between the electrode layer CE and the substrate 300. The second insulating layer IL2 may function to insulate the electrode layer CE from the substrate 300. The second insulating layer IL2 may include aluminum oxide (Al) 2 O 3 ) But is not limited thereto.
The DAM portions DAM may be arranged in a circumferential direction of an outermost periphery of the second insulating layer IL 2. The DAM may have a predetermined thickness and a predetermined width. The DAM may function as a support substrate 300.
The embossments EB may be disposed inside the DAM portions DAM on the second insulating layer IL 2. The embossments EB may have the same thickness as the DAM portions DAM. Accordingly, the embossments EB and the DAM portions DAM may support the substrate 300. Further, the embossing EB may be provided in plurality. Therefore, a cooling flow path may be formed between the plurality of embossings EB. The coolant flowing along the cooling flow path described above can effectively regulate the temperature of the electrostatic chuck 600, the temperature of the substrate 300, and the temperature of the mask 400.
The substrate 300 may be disposed on the DAM portions DAM and the emboss EB. The mask 400 may be disposed on the substrate 300.
In other words, when it is necessary to cool the electrostatic chuck 600, the substrate 300, and the mask 400, the above-described temperature reducing agent flowing along the temperature reduction line CL and/or the above-described coolant supplied to the above-described cooling flow path between the embossings EB may be utilized.
However, the temperature of the temperature reducer and/or the temperature of the coolant may be different from the temperature of the electrostatic chuck 600, the temperature of the substrate 300, and the temperature of the mask 400. In other words, the temperature of the electrostatic chuck 600, the temperature of the substrate 300, and the temperature of the mask 400 are inferred only by the temperature of the temperature lowering agent and/or the temperature of the coolant.
Referring to fig. 1 and 2, the temperature lowering agent and/or the coolant may change the temperature of the electrostatic chuck 600, the temperature of the substrate 300, and the temperature of the mask 400. The thermal imaging camera module 500 may monitor temperature changes of the electrostatic chuck 600, temperature changes of the substrate 300, and temperature changes of the mask 400. In other words, the thermal imaging camera module 500 may not measure the temperature of the coolant and/or the temperature of the coolant, but the thermal imaging camera module 500 may directly measure the temperature of the electrostatic chuck 600, the temperature of the substrate 300, and the temperature of the mask 400.
Fig. 3 is an enlarged sectional view illustrating the thermal imaging camera module 500 of fig. 1.
Referring to fig. 1 and 3, the thermal imaging camera module 500 may include a thermal imaging camera 510, a lens 530, and a thermocouple 550, the thermal imaging camera 510 for measuring a temperature of a subject, the lens 530 including a first surface S1 and a second surface S2 opposite to the first surface S1 and being disposed adjacent to the thermal imaging camera 510, the thermocouple 550 being connected to the lens 530 and for measuring a temperature of the lens 530. The thermal imaging camera module 500 may be connected to an analysis device disposed outside the chamber 100.
The thermal imaging camera 510 can measure the temperature of the object by sensing infrared rays (infrared ray) or the like. Further, the thermal imaging camera 510 can measure the surface temperature of each object by executing an algorithm for separating temperature images of objects that are in contact with each other. In more detail, the thermal imaging camera 510 may capture the object to obtain a temperature image of the object, and transmit the temperature image to the analysis device. The analysis device may grasp the temperature of the subject by analyzing the temperature image.
The lens 530 may have a first surface S1 and a second surface S2 opposite to the first surface S1. The first surface S1 of the lens 530 may be disposed at a front surface portion of the thermal imaging camera 510. In more detail, the first surface S1 of the lens 530 may be attached to the thermal imaging camera 510. A lens 530 is attached to the thermal imaging camera 510 to adjust the focus of the thermal imaging camera 510 to the subject described above. The above object may be at least one of the substrate 300, the mask 400, and the electrostatic chuck 600. However, the above-described object is not limited thereto.
The thermocouples 550 may be different kinds of metal wires from each other causing a thermoelectric effect. The thermoelectric effect may be an effect of generating an electric potential due to a temperature difference between the metal lines. Accordingly, the thermocouple 550 can measure the temperature difference on the wire. When the temperature of the lens 530 is excessively high, the above-described temperature image obtained by the thermal imaging camera 510 through the lens 530 may be distorted. Accordingly, the thermocouple 550 may be connected to the lens 530 to continuously measure the temperature of the lens 530.
Hereinafter, the thermal imaging camera module 500 will be described in detail with reference to fig. 4.
Fig. 4 is a sectional view illustrating the thermal imaging camera module 500 of fig. 3.
Referring to fig. 1, 3 and 4, the thermal imaging camera module 500 may further include a main body part 591, a leg part 593, a protective tape 531, a shutter 520, a shutter driving part 521, a shutter connecting part 523, camera cables 541, 542, 543, a motor cable 544, a cooling wire 570 and an angle adjusting part 560.
The body portion 591 may house the thermal imaging camera 510 and the thermocouple 550. The body portion 591 may include a first opening AA1 and a second opening AA2. Through the first opening AA1, the lens 530 may be coupled to the body portion 591.
The leg portion 593 may be connected with the body portion 591. The leg 593 may include bellows (bellows). The bellows may be an elastic member having a bellows shape.
The protective tape 531 may include a transparent substance. For example, the protective tape 531 may include polyimide (polyimide). A protective tape 531 may be disposed on the second surface S2 of the lens 530. In more detail, the protective tape 531 may be attached to the second surface S2 of the lens 530. Accordingly, the protective tape 531 may prevent the lens 530 from being exposed to the deposition substance DM. The protective tape 531 may be a material in a tape (tape) state, and the protective tape 531 may be attached and detached. Therefore, when the protective tape 531 is damaged, the protective tape 531 may be replaced.
The shutter 520 may be coupled to the body portion 591. The shutter 520 may be disposed outside the main body portion 591. The shutter 520 may open and close the second surface S2 of the lens 530. In other words, when the shutter 520 opens the second surface S2 of the lens 530, the thermal imaging camera 510 may measure the temperature of the object through the lens 530. When the shutter 520 closes the second surface S2 of the lens 530, the thermal imaging camera 510 cannot measure the temperature of the above-described object through the lens 530. However, when the shutter 520 closes the second surface S2 of the lens 530, the shutter 520 may minimize the possibility that impurities such as the deposition substance DM may be attached to the lens 530 and the protective tape 531.
The shutter driving part 521 may be disposed inside the main body part 591. The shutter driving part 521 may control an opened state or a closed state of the shutter 520.
The shutter connecting part 523 may connect the shutter driving part 521 and the shutter 520. The shutter connecting portion 523 may be combined with the main body portion 591 through a second opening AA2 of the main body portion 591. In other words, the shutter connecting section 523 may separate the positions of the shutter 520 and the shutter driving section 521 such that the shutter 520 is disposed outside the main body section 591 and the shutter driving section 521 is disposed inside the main body section 591. In more detail, in the case where the shutter driving part 521 drives the shutter 520, the shutter connecting part 523 may seal a space inside the main body part 591 so that the inside of the main body part 591 is not exposed to the outside of the main body part 591.
The inside of the chamber 100 may be in a vacuum state. The internal space of the thermal imaging camera module 500 sealed by the main body portion 591, the lens 530 coupled to the first opening AA1 of the main body portion 591, the shutter connection portion 523 coupled to the second opening AA2 of the main body portion 591, and the leg portion 593 connected to the main body portion 591 may be in an atmospheric pressure state. In other words, the inner space of the above-described sealed thermal imaging camera module 500 may protect the constituent elements of the thermal imaging camera 510, the thermocouple 550, and the like, which are disposed inside the chamber 100, from the vacuum state.
The camera cables 541, 542, 543 and the motor cable 544 may be arranged inside the body portion 591. The camera cables 541, 542, 543 may supply power to the thermal imaging camera 510. The motor cable 544 may supply power to the shutter driving part 521. The camera cables 541, 542, 543 and the motor cable 544 may be connected to a power supply line 545 arranged inside the main body portion 591 and extending to the inside of the leg portion 593.
The cooling line 570 may be in contact with the thermal imaging camera 510. The cooling line 570 may regulate the temperature of the thermal imaging camera 510 by a cooling substance flowing along the cooling line 570. In addition, the cooling line 570 may regulate the temperature of the lens 530 attached to the thermal imaging camera 510. In other words, when the temperature of the thermal imaging camera 510 and the temperature of the lens 530 are too high, the temperature image obtained by the thermal imaging camera 510 may be distorted, and thus, the cooling line 570 may lower the temperature of the thermal imaging camera 510 and the temperature of the lens 530.
The cooling lines 570 may include a first cooling line 571 through which the cooling substance enters the cooling line 570 and a second cooling line 573 through which the cooling substance exits the cooling line 570. The first cooling line 571 and the second cooling line 573 may be connected to each other. The cooling wire 570 may be wrapped around the surface of the thermal imaging camera 510. In other words, the cooling wire 570 contacts the surface of the thermal imaging camera 510 in a rotationally surrounding manner, thereby maximizing the contact area of the cooling wire 570 with the thermal imaging camera 510. That is, the cooling line 570 may effectively reduce the temperature of the thermal imaging camera 510 and the temperature of the lens 530.
The angle adjusting portion 560 may be disposed at a boundary of the body portion 591 and the leg portion 593. The angle adjustment part 560 may adjust the direction in which the thermal imaging camera 510 performs photographing. That is, the angle adjusting part 560 may adjust the orientation of the second surface S2 of the lens 530 attached to the thermal imaging camera 510. In other words, the angle adjustment section 560 may adjust the direction in which the thermal imaging camera 510 performs photographing so that the thermal imaging camera 510 is directed to the position of the object whose temperature is measured.
Fig. 5 to 9 are sectional views illustrating a deposition method using a deposition apparatus for manufacturing a display device according to an embodiment of the present invention.
Referring to fig. 1, 4 and 5, a deposition method using a deposition apparatus for manufacturing a display apparatus may include: a step of providing a chamber 100, the chamber 100 including a depositor 200, a parent material 700, an electrostatic chuck 600 disposed on the parent material 700, and a thermal imaging camera module 500 including a thermal imaging camera 510 and a shutter 520; a step of opening the shutter 520 to expose the thermal imaging camera 510; a step of measuring the temperature of the electrostatic chuck 600 with the thermal imaging camera 510; and a step of closing the shutter 520 so that the thermal imaging camera 510 is not exposed.
When the temperature of the electrostatic chuck 600 is excessively higher than the first target temperature, the electrostatic chuck 600 may be thermally shocked due to thermal expansion and thermal contraction to crack. Accordingly, the above-described deposition method using the deposition apparatus for manufacturing a display apparatus may confirm the temperature of the electrostatic chuck 600 by including the step of measuring the temperature of the electrostatic chuck 600 using the above-described thermal imaging camera 510, thereby predicting in advance that a problem may occur in the above-described deposition process.
The deposition method using the deposition apparatus for manufacturing a display device may further include a step of adjusting the temperature of the electrostatic chuck 600 to the first target temperature between the step of measuring the temperature of the electrostatic chuck 600 and the step of closing the shutter 520. The first target temperature may be 60 ℃ or lower. Therefore, it is possible to prevent problems from occurring in the above deposition process in advance.
Referring to fig. 2 together, in the step of adjusting the temperature of the electrostatic chuck 600 to the first target temperature, the temperature of the electrostatic chuck 600 may be adjusted by using a cooling line CL included in the base material 700 supporting the electrostatic chuck 600.
Further, the above-described deposition method using the deposition apparatus for manufacturing the display apparatus may minimize the possibility that impurities such as the deposition substance DM are attached to the lens 530 and the protective tape 531 by including the above-described step of opening the shutter 520 and the above-described step of closing the shutter 520. In other words, damage to the lens 530 and the protective tape 531 can be reduced, thereby improving durability.
Referring to fig. 6, the deposition method using the deposition apparatus for manufacturing a display device, between the step of adjusting the temperature of the electrostatic chuck 600 to the first target temperature and the step of closing the shutter 520, may further include: a step of positioning the mask 400 inside the chamber 100 using the mask transfer part 450, a step of measuring the temperature of the mask 400 using the thermal imaging camera 510, and a step of adjusting the temperature of the mask 400 to a second target temperature.
When the temperature of the mask 400 is excessively higher than the second target temperature, the mask 400 may not be aligned at a predetermined position on the substrate 300. In addition, when the deposition substance DM is sprayed onto the substrate 300 to form a deposition pattern, the properties of the deposition pattern may be different from target properties. Accordingly, the above-described deposition method using the deposition apparatus for manufacturing the display apparatus may confirm the temperature of the mask 400 by including the above-described step of measuring the temperature of the mask 400 using the thermal imaging camera 510, thereby predicting in advance that a problem may occur in the above-described deposition process.
The above-described deposition method using the deposition apparatus for manufacturing a display apparatus may prevent problems from occurring in the above-described deposition process in advance by including the step of adjusting the temperature of the mask 400 to the above-described second target temperature. The step of adjusting the temperature of the mask 400 to the second target temperature may be performed by a mask coolant included in the mask transfer part 450.
In addition, the above-described deposition method using a deposition apparatus for manufacturing a display apparatus may further include a step of opening the shutter 520 before the step of measuring the temperature of the mask 400, and may include a step of closing the shutter 520 after the step of measuring the temperature of the mask 400.
By including the step of opening the shutter 520 and the step of closing the shutter 520, the possibility of impurities such as the deposition substance DM adhering to the lens 530 and the protective tape 531 can be minimized. In other words, the step of opening the shutter 520 may be included before each step of using the thermal imaging camera 510, and the step of closing the shutter 520 may be included after each step of using the thermal imaging camera 510. That is, the possibility of impurities such as the deposition substance DM adhering to the lens 530 and the protective tape 531 may be minimized by minimizing the time of the open state of the shutter 520.
Referring to fig. 7, the deposition method using the deposition apparatus for manufacturing a display apparatus, between the step of adjusting the temperature of the mask 400 to the second target temperature and the step of closing the shutter 520, may further include: a step of positioning the substrate 300 between the mask 400 and the electrostatic chuck 600 inside the chamber 100, a step of measuring the temperature of the substrate 300 using the thermal imaging camera 510, and a step of adjusting the temperature of the substrate 300 to a third target temperature.
When the temperature of the substrate 300 is excessively higher than the third target temperature, the mask 400 may not be aligned at a predetermined position on the substrate 300. In addition, when the deposition substance DM is sprayed onto the substrate 300 to form a deposition pattern, the properties of the deposition pattern may be different from target properties. Accordingly, the deposition method using the deposition apparatus for manufacturing a display apparatus described above may confirm the temperature of the substrate 300 by including the step of measuring the temperature of the substrate 300 using the thermal imaging camera 510 described above, thereby predicting in advance that a problem may occur in the deposition process described above.
The above-described deposition method using the deposition apparatus for manufacturing a display device may prevent problems from occurring in the above-described deposition process in advance by including the step of adjusting the temperature of the substrate 300 to the above-described third target temperature. The step of adjusting the temperature of the substrate 300 to the third target temperature may be performed by a coolant flowing along the cooling flow path between the cooling line CL and the emboss EB included in the base material 700.
In addition, the above-described deposition method using a deposition apparatus for manufacturing a display apparatus may further include a step of opening the shutter 520 before the above-described step of measuring the temperature of the substrate 300, and may include a step of closing the shutter 520 after the above-described step of measuring the temperature of the substrate 300.
By including the above-described step of opening the shutter 520 and the above-described step of closing the shutter 520, the possibility that impurities such as the deposition substance DM adhere to the lens 530 and the protective tape 531 can be minimized. In other words, the step of opening the shutter 520 may be included before each step of utilizing the thermal imaging camera 510, and the step of closing the shutter 520 may be included after each step of utilizing the thermal imaging camera 510. That is, the possibility of impurities such as the deposition substance DM adhering to the lens 530 and the protective tape 531 may be minimized by minimizing the time of the open state of the shutter 520.
Referring to fig. 8, the deposition method using the deposition apparatus for manufacturing a display apparatus, between the step of adjusting the temperature of the substrate 300 to the third target temperature and the step of closing the shutter 520, may further include: a step of bringing the mask 400 into contact with the substrate 300, a step of measuring the temperature of the mask 400 and the temperature of the substrate 300 with the thermal imaging camera 510, and a step of adjusting the temperature of the mask 400 to a fourth target temperature and the temperature of the substrate 300 to a fifth target temperature.
The fourth target temperature may be the same as the second target temperature, and the fifth target temperature may be the same as the third target temperature. The fourth target temperature may be a temperature of the mask 400 optimal to perform the above-described deposition process of spraying the deposition substance DM. The fifth target temperature may be a temperature of the substrate 300 optimal to perform the above-described deposition process of spraying the deposition substance DM. The fourth target temperature and the fifth target temperature may be temperatures differently preset according to the kind of the deposition substance DM, the kind of the mask 400, the kind of the substrate 300, the target property of the above-described deposition pattern, and the like.
When the mask 400 and the substrate 300 are in contact, the temperature of the mask 400 may deviate from the above-described second target temperature, and the temperature of the substrate 300 may deviate from the above-described third target temperature. Accordingly, the deposition method using the deposition apparatus for manufacturing a display apparatus may allow the deposition process to be performed at the optimal temperature of the mask 400 and the optimal temperature of the substrate 300 by including the step of measuring the temperature of the mask 400 and the temperature of the substrate 300 using the thermal imaging camera 510 and the step of adjusting the temperature of the mask 400 to the fourth target temperature and the temperature of the substrate 300 to the fifth target temperature.
In addition, the above-described deposition method using the deposition apparatus for manufacturing the display apparatus may further include a step of opening the shutter 520 before the step of measuring the temperature of the mask 400 and the temperature of the substrate 300, and may include a step of closing the shutter 520 after the step of measuring the temperature of the mask 400 and the temperature of the substrate 300.
By including the above-described step of opening the shutter 520 and the above-described step of closing the shutter 520, the possibility that impurities such as the deposition substance DM adhere to the lens 530 and the protective tape 531 can be minimized. In other words, the step of opening the shutter 520 may be included before each step of using the thermal imaging camera 510, and the step of closing the shutter 520 may be included after each step of using the thermal imaging camera 510. That is, the possibility of impurities such as the deposition substance DM adhering to the lens 530 and the protective tape 531 may be minimized by minimizing the time of the open state of the shutter 520.
Referring to fig. 9, the above-described deposition method using a deposition apparatus for manufacturing a display apparatus may further include a step of spraying the deposition substance DM from the depositor 200. Accordingly, the deposition process described above can form a deposition pattern on the substrate 300 under optimal conditions.
In the above, the description has been made with reference to the exemplary embodiments of the present invention, but it will be understood by those skilled in the art that various modifications and changes may be made to the present invention without departing from the spirit and scope of the present invention as set forth in the claims.
The present invention can be applied to a deposition process using a substrate and a mask. In more detail, it may be applied to a deposition process in a manufacturing process of a display device. For example, it may be applied to a deposition process for manufacturing display devices of high-resolution smart phones, mobile phones, smart boards, smart watches, tablet PCs, navigation systems for vehicles, televisions, computer displays, notebook computers, and the like.

Claims (5)

1. A deposition apparatus for manufacturing a display apparatus, comprising:
a depositor configured to eject a deposition substance; and
a thermal imaging camera module for a thermal imaging camera,
wherein the thermal imaging camera module comprises:
a thermal imaging camera configured to measure a temperature of an object;
a lens comprising a first surface and a second surface opposite the first surface and disposed adjacent to the thermal imaging camera; and
a thermocouple connected to the lens and configured to measure a temperature of the lens.
2. The deposition apparatus for manufacturing a display device according to claim 1, further comprising:
a substrate opposite to the depositor and to which the deposition substance is deposited;
a mask disposed between the substrate and the depositor; and
an electrostatic chuck disposed under the substrate and supporting and fixing the substrate.
3. The deposition apparatus for manufacturing a display device according to claim 1, wherein the thermal imaging camera module further comprises:
a cooling line in contact with the thermal imaging camera and configured to adjust a temperature of the thermal imaging camera and a temperature of the lens.
4. The deposition apparatus for manufacturing a display device according to claim 1, wherein the thermal imaging camera module further comprises:
a main body portion housing the thermal imaging camera and the thermocouple; and
and a leg part connected with the main body part.
5. The deposition apparatus for manufacturing a display device according to claim 4, wherein the thermal imaging camera module further comprises:
an angle adjusting part disposed at a boundary of the main body part and the leg part and configured to adjust a direction in which the thermal imaging camera photographs.
CN202222549482.9U 2022-03-11 2022-09-22 Deposition apparatus for manufacturing display device Active CN218539818U (en)

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KR10-2022-0030913 2022-03-11

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