KR20230134061A - Deposition device for manufacturing display device and deposition method using the same - Google Patents

Abstract

A deposition apparatus for manufacturing a display device includes a chamber, a vaporizer disposed inside the chamber and spraying a deposition material, a thermal imaging camera that measures the temperature of an object, a first side, and a second side opposing the first side, It includes a thermal imaging camera module including a lens disposed adjacent to a thermal imaging camera, and a thermocouple connected to the lens and measuring the temperature of the lens.

Description

Deposition device for manufacturing a display device and deposition method using the same {DEPOSITION DEVICE FOR MANUFACTURING DISPLAY DEVICE AND DEPOSITION METHOD USING THE SAME}

The present invention relates to a deposition apparatus for manufacturing a display device and a deposition method using the same. More specifically, the present invention relates to a vacuum deposition apparatus for manufacturing a display device that maintains the interior of a chamber in a vacuum state and a vacuum deposition method using the same.

When manufacturing a display device, the horizontal upward deposition method is widely applied, in which a substrate and a patterned metal mask are placed horizontally inside a chamber and then the deposition material is sprayed toward the mask to deposit the deposition material on the substrate. It is becoming.

The horizontal upward deposition method is a method of depositing an organic material on the substrate in a horizontal state by aligning the substrate and the mask arranged horizontally with respect to the bottom surface of the chamber and then bonding them.

Meanwhile, when the substrate and the mask are bonded without alignment, the deposition material may seep between the substrate and the mask, causing a shadow phenomenon in which the deposition pattern is spread.

One object of the present invention is to provide a deposition apparatus for manufacturing a display device with improved process reliability.

Another object of the present invention is to provide a deposition method using the deposition apparatus for manufacturing a display device.

However, the purpose of the present invention is not limited to the above-mentioned purposes, and may be expanded in various ways without departing from the spirit and scope of the present invention.

In order to achieve the above-described object of the present invention, a deposition apparatus for manufacturing a display device according to an embodiment of the present invention includes a chamber, a vaporizer disposed inside the chamber, spraying a deposition material, and measuring the temperature of the subject. A thermal imaging camera, including a first surface and a second surface opposing the first surface, a lens disposed adjacent to the thermal imaging camera, and a thermocouple connected to the lens and measuring the temperature of the lens. It may include a thermal imaging camera module.

According to one embodiment, the deposition apparatus for manufacturing a display device faces the deposition machine inside the chamber and includes a substrate on which the deposition material is deposited, a mask disposed between the substrate and the deposition machine, and disposed below the substrate, , and may further include an electrostatic chuck for supporting and fixing the substrate.

According to one embodiment, the subject may be at least one of the substrate, the mask, and the electrostatic chuck.

According to one embodiment, the thermal imaging camera module may further include a cooling line that contacts the thermal imaging camera and adjusts the temperature of the thermal imaging camera and the temperature of the lens.

According to one embodiment, the cooling line may wrap around the surface of the thermal imaging camera.

According to one embodiment, the thermal imaging camera module may include a transparent material and may further include a protective tape disposed on the second surface of the lens.

According to one embodiment, the thermal imaging camera module may further include a body portion that accommodates the thermal imaging camera and the thermocouple, and a leg portion connected to the body portion.

According to one embodiment, the leg portion may include bellows.

According to one embodiment, the body portion includes a first opening, and the lens may be coupled to the body portion through the first opening.

According to one embodiment, the thermal imaging camera module may further include a shutter that is coupled to the body and opens and closes the second surface of the lens.

According to one embodiment, the body portion includes a second opening, and the thermal imaging camera module includes a shutter driver that controls an open or closed state of the shutter, and connects the shutter driver and the shutter, and the second opening. 2 It may further include a shutter connection part coupled to the body part through the opening.

According to one embodiment, the thermal imaging camera module includes a motor cable disposed inside the body portion and supplying power to the shutter driving unit, and a motor cable disposed inside the body portion and supplying power to the thermal imaging camera. Additional camera cables may be included.

According to one embodiment, the internal space of the thermal imaging camera module sealed by the body portion, the lens, the shutter connection portion, and the leg portion may be in a standby state.

According to one embodiment, the thermal imaging camera module may be disposed at a boundary between the body portion and the leg portion and include an angle adjusting portion that adjusts a shooting direction of the thermal imaging camera.

In order to achieve another object of the present invention described above, a deposition method using a deposition apparatus for manufacturing a display device according to an embodiment of the present invention includes a evaporator, a base material, an electrostatic chuck disposed on the base material, and a thermal imaging camera and shutter. Providing a chamber including a thermal imaging camera module, opening the shutter to expose the thermal imaging camera, measuring the temperature of the electrostatic chuck using the thermal imaging camera, the thermal imaging camera It may include closing the shutter to prevent exposure, and spraying a deposition material from the deposition device.

According to one embodiment, the deposition method using the deposition apparatus for manufacturing a display device further includes adjusting the temperature of the electrostatic chuck to be a first target temperature between measuring the temperature of the electrostatic chuck and closing the shutter. It can be included.

According to one embodiment, the first target temperature may be 60°C or lower.

According to one embodiment, the deposition method using the deposition apparatus for manufacturing the display device is between adjusting the temperature of the electrostatic chuck to the first target temperature and closing the shutter, using a mask transfer unit to inside the chamber. It may further include positioning a mask, measuring the temperature of the mask using the thermal imaging camera, and adjusting the temperature of the mask to be the second target temperature.

According to one embodiment, the deposition method using the deposition apparatus for manufacturing the display device is between the step of adjusting the temperature of the mask to the second target temperature and the step of closing the shutter, the mask and the electrostatic discharge inside the chamber. It may further include placing the substrate between the chucks, measuring the temperature of the substrate using the thermal imaging camera, and adjusting the temperature of the substrate to be a third target temperature.

According to one embodiment, the deposition method using the deposition apparatus for manufacturing a display device includes contacting the mask on the substrate between adjusting the temperature of the substrate to a third target temperature and closing the shutter. , measuring the temperature of the mask and the temperature of the substrate using the thermal imaging camera, and adjusting the temperature of the mask to be a fourth target temperature and adjusting the temperature of the substrate to be a fifth target temperature. Additional steps may be included.

A deposition apparatus for manufacturing a display device can measure the temperature of a subject by including a thermal imaging camera module including a thermal imaging camera. More specifically, the deposition device can directly measure the temperature of the subject without inferring the temperature of the subject through the temperature of the coolant disposed around the subject.

Before completing the deposition process for manufacturing a display device, by directly measuring the temperature of the subject using a thermal imaging camera, the deposition device can predict problems that may occur during the deposition process in advance. Accordingly, when the temperature of the subject is different from the target temperature, the deposition apparatus can prevent the above problem in advance by adjusting the temperature of the subject to the target temperature.

Therefore, by measuring and controlling the temperature of the electrostatic chuck so that the temperature of the electrostatic chuck is not excessively high, thermal shock that the electrostatic chuck may receive can be prevented.

In addition, by measuring and controlling the temperature of the substrate and controlling the temperature of the mask so that the temperature of the substrate and mask are not excessively high, the substrate and the mask can be aligned and bonded in an optimal state. . Accordingly, the shadow phenomenon can be prevented. Additionally, the properties of the deposition pattern, such as the thickness of the deposition pattern deposited on the substrate, the refractive index of the deposition pattern, the molecular arrangement of the deposition pattern, and the roughness of the deposition pattern, may be formed to be the same as the target properties. Accordingly, defects such as color abnormality and increased current consumption of the display device manufactured through the deposition process can be prevented. Accordingly, the yield of the display device manufactured through the deposition process can be improved.

However, the effects of the present invention are not limited to the effects described above, and may be expanded in various ways without departing from the spirit and scope of the present invention.

1 is a cross-sectional view showing a deposition apparatus for manufacturing a display device according to an embodiment of the present invention.
Figure 2 is an enlarged cross-sectional view showing part 'A' of Figure 1.
FIG. 3 is an enlarged cross-sectional view showing the thermal imaging camera module of FIG. 1.
Figure 4 is a cross-sectional view showing the thermal imaging camera module of Figure 3.
5 to 9 are cross-sectional views showing a deposition method using a deposition apparatus for manufacturing a display device according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the attached drawings. The same reference numerals will be used for the same components in the drawings, and duplicate descriptions of the same components will be omitted.

FIG. 1 is a cross-sectional view showing a deposition apparatus 1000 for manufacturing a display device according to an embodiment of the present invention.

Referring to FIG. 1, the deposition apparatus 1000 for manufacturing a display device includes a chamber 100, a deposition machine 200, a substrate 300, a mask 400, a thermal imaging camera module 500, an electrostatic chuck 600, and It may include a base material (700).

The deposition device 1000 for manufacturing a display device may include a chemical vapor deposition (CVD) device. However, the deposition apparatus 1000 for manufacturing a display device is not limited to the chemical vapor deposition apparatus. For example, the deposition apparatus 1000 for manufacturing a display device may include a plasma enhanced chemical vapor deposition (PECVD) apparatus. The deposition apparatus 1000 for manufacturing a display device can form components included in the display device. For example, the deposition apparatus 1000 for manufacturing a display device can form a silicon-based insulating layer, a silicon-based semiconductor layer, etc. included in the display device.

The chamber 100 may provide a space for performing a deposition process for manufacturing a display device. Chamber 100 may be connected to an exhaust device. Accordingly, the interior of the chamber 100 can be maintained in a vacuum state by the exhaust device. Chamber 100 may include, but is not limited to, stainless steel.

The depositor 200 may include deposition material (DM). The deposition device 200 may be in the form of a shower head including at least one nozzle (NZ) for spraying the deposition material (DM). The deposition device 200 may be placed on one side of the interior of the chamber 100. The vapor deposition device 200 may spray the deposition material DM stored therein through the nozzle NZ. The deposition material (DM) sprayed through the nozzle (NZ) may be sprayed in a high temperature environment. Accordingly, to perform the deposition process, the temperature of other components inside the chamber 100 may increase.

The base material 700 may be placed on the other inside of the chamber 100. The base material 700 may support the electrostatic chuck 600, the substrate 300, and the mask 400 disposed on the base material 700.

The electrostatic chuck 600 may be placed on the base material 700. The electrostatic chuck 600 may support the substrate 300 . The electrostatic chuck 600 may fix (or chucking) the substrate 300. The electrostatic chuck 600 may use electrostatic force to fix the substrate 300.

The substrate 300 may be placed on the electrostatic chuck 600. That is, the electrostatic chuck 600 may be placed below the substrate 300. Accordingly, the substrate 300 may face the deposition device 200 inside the chamber 100. The substrate 300 may be fixed by an electrostatic chuck 600. The substrate 300 may include a glass substrate. However, the type of substrate 300 is not limited thereto. For example, the substrate 300 may include a quartz substrate, a plastic substrate, etc. The deposition material DM sprayed by the vapor deposition device 200 may be deposited on the substrate 300 . Accordingly, by depositing a deposition material on the substrate 300, various deposition patterns can be formed on the substrate 300. The display device may include a substrate 300 including the deposition pattern. For example, the substrate 300 may be a display panel included in the display device.

The mask 400 may be disposed on the substrate 300 . That is, the mask 400 may be disposed between the substrate 300 and the deposition machine 200. Mask 400 may include patterned metal. In other words, the mask 400 may be one component including preset openings. That is, the mask 400 whose side surface is shown may not be separated, and the openings may be expressed.

When the deposition device 200 sprays the deposition material DM toward the substrate 300, the deposition material DM may be patterned and deposited on the substrate 300. In other words, the deposition material DM can be deposited on the substrate 300 only through the openings of the mask 400. Accordingly, it may be important that the openings of the mask 400 are aligned and adhered to the location where the deposition material DM on the substrate 300 is to be deposited.

The deposition process may be carried out at high temperature. Meanwhile, the temperature inside the chamber 100 may be different from the temperature of each component within the chamber 100. In other words, the temperature of the substrate 300, the temperature of the mask 400, the temperature of the electrostatic chuck 600, etc. may be different from each other.

The material included in the substrate 300 and the material included in the mask 400 may be different. In other words, the coefficient of thermal expansion of the substrate 300 and the coefficient of thermal expansion of the mask 400 may be different. Therefore, when the deposition process is performed at a high temperature, the substrate 300 and the mask 400 may be bonded in an unaligned state. In this case, the deposition material DM may permeate between the substrate 300 and the mask 400. As a result, a shadow phenomenon in which the deposition pattern spreads may occur.

In addition, the temperature of the substrate 300 and the temperature of the mask 400 may affect the properties of the deposition pattern, such as the thickness of the deposition pattern, the refractive index of the deposition pattern, the molecular arrangement of the deposition pattern, and the roughness of the deposition pattern. You can. If the properties of the deposition pattern are different from the target properties, the display device manufactured through the deposition process may have defects such as color abnormality and increased current consumption. Accordingly, the yield of the display device manufactured through the deposition process may decrease.

Additionally, if the temperature of the electrostatic chuck 600 is excessively high, the electrostatic chuck 600 may receive thermal shock due to thermal expansion and contraction. Therefore, the electrostatic chuck 600 may be broken.

Therefore, there is a need to determine the temperature of the substrate 300, the temperature of the mask 400, and the temperature of the electrostatic chuck 600.

The thermal imaging camera module 500 may be placed inside the chamber 100 to determine the temperature of the substrate 300, the temperature of the mask 400, and the temperature of the electrostatic chuck 600. The thermal imaging camera module 500 may analyze temperature images of components placed inside the chamber 100 and measure the temperatures of the components. In one embodiment, the thermal imaging camera module 500 can directly measure the temperature of the substrate 300, the temperature of the mask 400, and the temperature of the electrostatic chuck 600. Additionally, the thermal imaging camera module 500 can measure the temperatures of each component by performing an algorithm to separate temperature images of components that are in contact with each other.

The thermal imaging camera module 500 is shown as being arranged one each on the left and right sides, but the number of thermal imaging camera modules 500 and the location of the thermal imaging camera module 500 are not limited.

The thermal imaging camera module 500 will be described in detail with reference to FIGS. 3 and 4.

Figure 2 is an enlarged cross-sectional view showing part 'A' of Figure 1.

Referring to FIG. 2, the base material 700 may include an aluminum substrate. The base material 700 may be molded into a bulk type. However, the material of the base material 700 and the type of the base material 700 are not limited to this. The material of the base material 700 may vary depending on the material of the electrostatic chuck 600.

The base material 700 may include at least one cooling line (CL). The temperature of the base material 700 may be reduced by the cooling agent flowing along the cooling line CL. Therefore, when the deposition process is performed at a high temperature, the temperature of the base material 700 can be adjusted by the cooling agent flowing along the cooling line CL. Additionally, the cooling agent flowing along the cooling line CL can also control the temperatures of components in contact with the base material 700. For example, the cooling agent flowing along the cooling line CL determines the temperature of the electrostatic chuck 600 disposed on the base material 700, the temperature of the substrate 300 disposed on the electrostatic chuck 600, and the substrate. The temperatures of the mask 400 disposed on 300 can be adjusted.

The electrostatic chuck 600 may be placed on the base material 700. The electrostatic chuck 600 forms an electric field using an electrode layer (CE) of an anode (e.g., first electrode CE1) and a cathode (e.g., second electrode CE2), thereby forming an electric field, such as a glass substrate, etc. The substrate 300 may be fixed (or chucking).

The electrostatic chuck 600 includes an insulating layer (IL) including a first insulating layer (IL1) and a second insulating layer (IL2), and an electrode layer (CE) including a first electrode (CE1) and a second electrode (CE2). , dam portion (DAM), and embossing (EB).

The first insulating layer IL1 may be disposed on the base material 700. The first insulating layer IL1 may serve to insulate between the electrode layer CE and the base material 700. The first insulating layer IL1 may include yttrium oxide (Y ₂ O ₃ ), but is not limited thereto.

The electrode layer CE may be disposed on the first insulating layer IL1. The electrode layer (CE) may include tungsten (W), but is not limited thereto. The electrode layer (CE) may include anodes and cathodes arranged alternately. For example, the first electrode (CE1) may be an anode and the second electrode (CE2) may be a cathode. Due to this, opposite charges may be induced in the substrate 300 disposed on the electrode layer CE, thereby forming an electric field. For example, a portion of the substrate 300 disposed on the first electrode CE1 having an anode may have a negative charge, and a portion of the substrate 300 disposed on the second electrode CE2 having a cathode may have a negative charge. can have a positive charge. Because of this, the electrostatic chuck 600 can fix the substrate 300 through electric force.

The second insulating layer IL2 may be disposed on the electrode layer CE. That is, the second insulating layer IL2 may be disposed between the electrode layer CE and the substrate 300. The second insulating layer IL2 may serve to insulate between the electrode layer CE and the substrate 300. The second insulating layer IL2 may include aluminum oxide (Al- ₂ O ₃ ), but is not limited thereto.

The dam portion DAM may be disposed in the outermost circumferential direction on the second insulating layer IL2. The dam portion (DAM) may have a predetermined thickness and a predetermined width. The dam portion (DAM) may serve to support the substrate 300.

The embossing (EM) may be disposed inside the dam portion (DAM) on the second insulating layer (IL2). The thickness of the embossing (EM) may be the same as the thickness of the dam portion (DAM). Accordingly, the embossing (EM) and the dam portion (DAM) can support the substrate 300. Additionally, embossing (EM) may be provided in plural ways. Accordingly, a cooling passage may be formed between the plurality of embossings (EM). The coolant flowing along the cooling passage can effectively control the temperature of the electrostatic chuck 600, the temperature of the substrate 300, and the temperature of the mask 400.

The substrate 300 may be placed on the dam portion (DAM) and the embossing portion (EM). The mask 400 may be disposed on the substrate 300 .

In other words, when it is necessary to cool the electrostatic chuck 600, the substrate 300, and the mask 400, the cooling passage between the cooling agent and/or the embossing (EM) flowing along the cooling line (CL) The coolant supplied may be used.

However, the temperature of the cooling agent and/or the temperature of the coolant may be different from the temperature of the electrostatic chuck 600, the temperature of the substrate 300, and the temperature of the mask 400. In other words, the temperature of the electrostatic chuck 600, the temperature of the substrate 300, and the temperature of the mask 400 may only be inferred using the temperature of the cooling agent and/or the temperature of the coolant.

Referring to FIGS. 1 and 2 , the cooling agent and/or the coolant may change the temperature of the electrostatic chuck 600, the temperature of the substrate 300, and the temperature of the mask 400. The thermal imaging camera module 500 may monitor changes in the temperature of the electrostatic chuck 600, changes in the temperature of the substrate 300, and changes in the temperature of the mask 400. In other words, the thermal imaging camera module 500 may not measure the temperature of the cooling agent and/or the temperature of the coolant, and the thermal imaging camera module 500 may measure the temperature of the electrostatic chuck 600 and the temperature of the substrate 300. ), and the temperatures of the mask 400 can be directly measured.

FIG. 3 is an enlarged cross-sectional view showing the thermal imaging camera module 500 of FIG. 1.

Referring to Figures 1 and 3, the thermal imaging camera module 500 includes a thermal imaging camera 510 that measures the temperature of the subject, a first surface (S1), and a second surface (S1) opposite the first surface (S1). S2), and may include a lens 530 disposed adjacent to the thermal imaging camera 510, and a thermocouple 550 connected to the lens 530 and measuring the temperature of the lens 530. The thermal imaging camera module 500 may be connected to an analysis device placed outside the chamber 100.

The thermal imaging camera 510 can measure the temperature of a subject by detecting infrared rays, etc. Additionally, the thermal imaging camera 510 can measure the surface temperature of each subject by performing an algorithm to separate temperature images of subjects in contact with each other. More specifically, the thermal imaging camera 510 can obtain a temperature image of the subject by photographing the subject, and transmit the temperature image to the analysis device. The analysis device may determine the temperature of the subject by analyzing the temperature image.

The lens 530 may have a first surface (S1) and a second surface (S2) opposing the first surface (S1). The first surface S1 of the lens 530 may be disposed on the front part of the thermal imaging camera 510. More specifically, the first surface S1 of the lens 530 may be attached to the thermal imaging camera 510. The lens 530 is attached to the thermal imaging camera 510 and can adjust the focus of the thermal imaging camera 510 to the subject. The subject may be at least one of the substrate 300, the mask 400, and the electrostatic chuck 600. However, the subject is not limited to this.

The thermocouple 550 may be different types of metal wires that produce a thermoelectric effect. The thermoelectric effect may be an effect in which electromotive force is generated due to a temperature difference on the metal wire. Because of this, the thermocouple 550 can measure the temperature difference on the metal wire. If the temperature of the lens 530 is excessively high, the temperature image obtained by the thermal imaging camera 510 through the lens 530 may be distorted. Accordingly, the thermocouple 550 can be connected to the lens 530 to continuously measure the temperature of the lens 530.

Hereinafter, the thermal imaging camera module 500 will be described in detail with reference to FIG. 4.

FIG. 4 is a cross-sectional view showing the thermal imaging camera module 500 of FIG. 3.

Referring to FIGS. 1, 3, and 4, the thermal imaging camera module 500 includes a body portion 591, a leg portion 593, a protective tape 531, a shutter 520, a shutter driver 521, It may further include a shutter connection unit 523, camera cables 541, 542, and 543, a motor cable 544, a cooling line 570, and an angle adjustment unit 560.

The body portion 591 can accommodate a thermal imaging camera 510 and a thermocouple 550. The body portion 591 may include a first opening (AA1) and a second opening (AA2). The lens 530 may be coupled to the body portion 591 through the first opening AA1.

The leg portion 593 may be connected to the body portion 591. The leg portion 593 may include bellows. The bellows may be a bellows-shaped elastic element.

The protective tape 531 may include a transparent material. For example, the protective tape 531 may include polyimide. The protective tape 531 may be disposed on the second surface S2 of the lens 530. More specifically, the protective tape 531 may be attached to the second surface S2 of the lens 530. Accordingly, the protective tape 531 may not expose the lens 530 to the deposition material DM. The protective tape 531 is a tape-like material, and the protective tape 531 can be attached and detached. Accordingly, if the protective tape 531 is damaged, the protective tape 531 can be replaced.

Shutter 520 may be coupled to body portion 591. Shutter 520 may be disposed outside of body portion 591. The shutter 520 may open and close the second surface S2 of the lens 530. In other words, when the shutter 520 opens the second surface S2 of the lens 530, the thermal imaging camera 510 can measure the temperature of the subject through the lens 530. When the shutter 520 closes the second surface S2 of the lens 530, the thermal imaging camera 510 cannot measure the temperature of the subject through the lens 530. However, when the shutter 520 closes the second surface S2 of the lens 530, the shutter 520 prevents foreign substances such as deposition material (DM) from attaching to the lens 530 and the protective tape 531. It can be minimized.

The shutter driving unit 521 may be disposed inside the body unit 591. The shutter driver 521 can control the open or closed state of the shutter 520.

The shutter connection unit 523 may connect the shutter driver 521 and the shutter 520. The shutter connection part 523 may be coupled to the body 591 through the second opening AA2 of the body 591. In other words, the shutter connection portion 523 connects the shutter 520 and the shutter driver 521 so that the shutter 520 is disposed outside the body portion 591 and the shutter driver 521 is disposed inside the body portion 591. ) can be separated. More specifically, when the shutter driver 521 drives the shutter 520, the space inside the body 591 must be sealed so that the inside of the body 591 is not exposed to the outside of the body 591. You can.

The interior of the chamber 100 may be in a vacuum state. A body portion 591, a lens 530 coupled to the first opening (AA1) of the body portion 591, a shutter connection portion 523 coupled to the second opening (AA2) of the body portion 591, and the body portion. The internal space of the thermal imaging camera module 500 sealed by the leg portion 593 connected to 591 may be in a standby state. In other words, the sealed internal space of the thermal imaging camera module 500 can protect components such as the thermal imaging camera 510 and thermocouple 550 disposed inside the chamber 100 from a vacuum state.

Camera cables 541, 542, and 543 and motor cable 544 may be disposed inside the body portion 591. Camera cables 541, 542, and 543 may supply power to the thermal imaging camera 510. The motor cable 544 may supply power to the shutter driver 521. The camera cables 541, 542, and 543 and the motor cable 544 are disposed inside the body portion 591 and may be connected to a power supply line 545 extending into the leg portion 593.

Cooling line 570 may be in contact with thermal imaging camera 510. The cooling line 570 can control the temperature of the thermal imaging camera 510 by the cooling material flowing along the cooling line 570. Additionally, the cooling line 570 can control the temperature of the lens 530 attached to the thermal imaging camera 510. In other words, if the temperature of the thermal imaging camera 510 and the temperature of the lens 530 are excessively high, the temperature image obtained by the thermal imaging camera 510 may be distorted, so the cooling line 570 The temperature of the camera 510 and the temperature of the lens 530 can be lowered.

The cooling line 570 may include a first cooling line 571 through which the cooling material enters the cooling line 570 and a second cooling line 573 through which the cooling material flows out of the cooling line 570. The first and second cooling lines 571 and 573 may be connected to each other. The cooling line 570 may wrap around the surface of the thermal imaging camera 510. In other words, the cooling line 570 makes contact while rotating and surrounding the surface of the thermal imaging camera 510, thereby maximizing the contact area between the cooling line 570 and the thermal imaging camera 510. That is, the cooling line 570 can effectively lower the temperature of the thermal imaging camera 510 and the temperature of the lens 530.

The angle adjusting unit 560 may be disposed at the boundary between the body unit 591 and the leg unit 593. The angle adjustment unit 560 can adjust the direction in which the thermal imaging camera 510 captures images. That is, the angle adjustment unit 560 can adjust the direction in which the second surface S2 of the lens 530 attached to the thermal imaging camera 510 is viewed. In other words, the angle adjusting unit 560 can adjust the direction in which the thermal imaging camera 510 captures images so that the thermal imaging camera 510 faces the location of the subject whose temperature is being measured.

5 to 9 are cross-sectional views showing a deposition method using a deposition apparatus for manufacturing a display device according to an embodiment of the present invention.

Referring to FIGS. 1, 4, and 5, a deposition method using a deposition apparatus for manufacturing a display device includes a deposition machine 200, a base material 700, an electrostatic chuck 600 disposed on the base material, and a thermal imaging camera 510. ) and a thermal imaging camera module 500 including a shutter 520, providing a chamber 100, opening the shutter 520 to expose the thermal imaging camera 510, thermal imaging camera ( It may include measuring the temperature of the electrostatic chuck 600 using 510) and closing the shutter 520 so that the thermal imaging camera 510 is not exposed.

If the temperature of the electrostatic chuck 600 is excessively higher than the first target temperature, the electrostatic chuck 600 may be broken by receiving thermal shock due to thermal expansion and contraction. Therefore, the deposition method using the deposition apparatus for manufacturing a display device includes the step of measuring the temperature of the electrostatic chuck 600 using the thermal imaging camera 510, thereby confirming the temperature of the electrostatic chuck 600 and performing the deposition. Problems that may arise during the process can be predicted in advance.

Between measuring the temperature of the electrostatic chuck 600 and closing the shutter 520, the deposition method using the deposition apparatus for manufacturing a display device is such that the temperature of the electrostatic chuck 600 is the first target temperature. A further adjustment step may be included. The first target temperature may be 60°C or lower. Because of this, it is possible to prevent problems from occurring during the deposition process.

Referring to FIG. 2, the step of adjusting the temperature of the electrostatic chuck 600 to the first target temperature is performed by using the cooling line CL included in the base material 700 supporting the electrostatic chuck 600. The temperature of the electrostatic chuck 600 can be adjusted.

In addition, the deposition method using the deposition apparatus for manufacturing the display device includes the steps of opening the shutter 520 and closing the shutter 520, thereby depositing a deposition material (DM) on the lens 530 and the protective tape 531. ) can minimize the adhesion of foreign substances such as In other words, durability can be improved by reducing damage to the lens 530 and the protective tape 531.

Referring to FIG. 6, between the step of adjusting the temperature of the electrostatic chuck 600 to the first target temperature and the step of closing the shutter 520, the deposition method using the deposition apparatus for manufacturing the display device includes a mask transfer unit. Positioning the mask 400 inside the chamber 100 using 450, measuring the temperature of the mask 400 using the thermal imaging camera 510, and determining the temperature of the mask 400. A step of adjusting to reach the second target temperature may be further included.

If the temperature of the mask 400 is excessively higher than the second target temperature, the mask 400 may not be aligned at a preset position on the substrate 300. Additionally, when the deposition material DM is sprayed on the substrate 300 to form a deposition pattern, the properties of the deposition pattern may be different from the target properties. Therefore, the deposition method using the deposition apparatus for manufacturing a display device includes the step of measuring the temperature of the mask 400 using the thermal imaging camera 510, thereby confirming the temperature of the mask 400 during the deposition process. You can predict in advance that problems will occur.

The deposition method using the deposition apparatus for manufacturing a display device includes the step of adjusting the temperature of the mask 400 to the second target temperature, thereby preventing problems from occurring during the deposition process. The step of adjusting the temperature of the mask 400 to the second target temperature may be performed using a mask coolant included in the mask transfer unit 450.

In addition, the deposition method using the deposition apparatus for manufacturing a display device includes opening the shutter 520 before measuring the temperature of the mask 400, and measuring the temperature of the mask 400. Afterwards, the step of closing the shutter 520 may be further included.

By including the step of opening the shutter 520 and the step of closing the shutter 520, attachment of foreign substances such as deposition material (DM) to the lens 530 and the protective tape 531 can be minimized. In other words, it may include opening the shutter 520 before each step of using the thermal imaging camera 510, and closing the shutter 520 after each step of using the thermal imaging camera 510. That is, by minimizing the time in which the shutter 520 is open, it is possible to minimize the attachment of foreign substances such as deposition material (DM) to the lens 530 and the protective tape 531.

Referring to FIG. 7, between the step of adjusting the temperature of the mask 400 to the second target temperature and the step of closing the shutter 520, the deposition method using the deposition apparatus for manufacturing the display device is a chamber 100. ), placing the substrate 300 between the mask 400 and the electrostatic chuck 600, measuring the temperature of the substrate 300 using a thermal imaging camera 510, and It may further include adjusting the temperature to become the third target temperature.

If the temperature of the substrate 300 is excessively higher than the third target temperature, the mask 400 may not be aligned at a preset position on the substrate 300. Additionally, when the deposition material DM is sprayed on the substrate 300 to form a deposition pattern, the properties of the deposition pattern may be different from the target properties. Therefore, the deposition method using the deposition apparatus for manufacturing a display device includes the step of measuring the temperature of the substrate 300 using the thermal imaging camera 510, thereby confirming the temperature of the substrate 300 during the deposition process. You can predict in advance that problems will occur.

The deposition method using the deposition apparatus for manufacturing a display device includes the step of adjusting the temperature of the substrate 300 to the third target temperature, thereby preventing problems from occurring during the deposition process. The step of adjusting the temperature of the substrate 300 to the third target temperature is performed by the coolant flowing along the cooling passage between the cooling line (CL) and the embossing (EM) included in the base material 700. You can.

In addition, the deposition method using the deposition apparatus for manufacturing a display device includes opening the shutter 520 before measuring the temperature of the substrate 300, and measuring the temperature of the substrate 300. Afterwards, the step of closing the shutter 520 may be further included.

By including the step of opening the shutter 520 and the step of closing the shutter 520, attachment of foreign substances such as deposition material (DM) to the lens 530 and the protective tape 531 can be minimized. In other words, it may include opening the shutter 520 before each step of using the thermal imaging camera 510, and closing the shutter 520 after each step of using the thermal imaging camera 510. That is, by minimizing the time that the shutter 520 is in an open state, it is possible to minimize the attachment of foreign substances such as deposition material (DM) to the lens 530 and the protective tape 531.

Referring to FIG. 8, between the step of adjusting the temperature of the substrate 300 to the third target temperature and the step of closing the shutter 520, the deposition method using the deposition apparatus for manufacturing the display device includes a mask 400 ) on the substrate 300, measuring the temperature of the mask 400 and the temperature of the substrate 300 using a thermal imaging camera 510, and the temperature of the mask 400 is adjusted to the fourth target. The step of adjusting the temperature so that the temperature of the substrate 300 becomes the fifth target temperature may be further included.

The fourth target temperature may be the same as the second target temperature, and the fifth target temperature may be the same as the third target temperature. The fourth target temperature may be the temperature of the mask 400 that is optimal for performing the deposition process of spraying the deposition material DM. The fifth target temperature may be the temperature of the substrate 300 that is optimal for performing the deposition process of spraying the deposition material DM. The fourth and fifth target temperatures may be different preset temperatures depending on the type of deposition material DM, the type of the mask 400, the type of the substrate 300, and the properties of the targeted deposition pattern.

When the mask 400 and the substrate 300 come into contact, the temperature of the mask 400 may deviate from the second target temperature and the temperature of the substrate 300 may deviate from the third target temperature. Therefore, the deposition method using the deposition apparatus for manufacturing a display device includes measuring the temperature of the mask 400 and the temperature of the substrate 300 using the thermal imaging camera 510, and the temperature of the mask 400 is By including the steps of adjusting the temperature to the 4 target temperature and adjusting the temperature of the substrate 300 to the fifth target temperature, the deposition process is performed at the optimal temperature of the mask 400 and the optimal temperature of the substrate 300. It can proceed.

In addition, the deposition method using the deposition apparatus for manufacturing a display device includes opening the shutter 520 before measuring the temperature of the mask 400 and the temperature of the substrate 300, and the mask 400 ) and the temperature of the substrate 300, the step of closing the shutter 520 may be further included.

By including the step of opening the shutter 520 and the step of closing the shutter 520, attachment of foreign substances such as deposition material (DM) to the lens 530 and the protective tape 531 can be minimized. In other words, it may include opening the shutter 520 before each step of using the thermal imaging camera 510, and closing the shutter 520 after each step of using the thermal imaging camera 510. That is, by minimizing the time that the shutter 520 is in an open state, it is possible to minimize the attachment of foreign substances such as deposition material (DM) to the lens 530 and the protective tape 531.

Referring to FIG. 9 , the deposition method using the deposition apparatus for manufacturing a display device may further include spraying the deposition material DM from the deposition device 200. Because of this, the deposition process can form the deposition pattern on the substrate 300 under optimal conditions.

In the above, the present invention has been described with reference to exemplary embodiments, but those skilled in the art will understand the present invention without departing from the spirit and scope of the present invention as set forth in the following claims. You will understand that it can be modified and changed in various ways.

The present invention can be applied to a deposition process using a substrate and mask. More specifically, it can be applied to a deposition process during the manufacturing process of a display device. For example, the present invention can be applied to a deposition process for manufacturing display devices such as high-resolution smartphones, mobile phones, smart pads, smart watches, tablet PCs, vehicle navigation systems, televisions, computer monitors, and laptops.

1000: Deposition device for manufacturing display devices
100: Chamber 200: Evaporator
300: Substrate 400: Mask
500: thermal imaging camera module 600: electrostatic chuck
DM: Deposition material NZ: Nozzle
510: thermal imaging camera 530: lens
S1: 1st side S2: 2nd side
550: thermocouple 531: protective tape
520: shutter 521: shutter driving unit
523: Shutter connection 541,542,543: Camera cable
544: motor cable 560: angle adjustment unit
570: Cooling line 700: Base material
591: body part 593: leg part
AA1: first opening AA2: second opening

Claims (20)

chamber;
A deposition device disposed inside the chamber and spraying a deposition material; and
Thermal imaging camera that measures the temperature of the subject;
a lens including a first surface and a second surface opposing the first surface, and disposed adjacent to the thermal imaging camera; and
A deposition apparatus for manufacturing a display device, comprising a thermal imaging camera module connected to the lens and including a thermocouple for measuring the temperature of the lens. According to claim 1,
a substrate facing the deposition device inside the chamber and onto which the deposition material is deposited;
a mask disposed between the substrate and the deposition machine; and
A deposition apparatus for manufacturing a display device, further comprising an electrostatic chuck disposed below the substrate and supporting and fixing the substrate. The deposition apparatus of claim 2, wherein the subject is at least one of the substrate, the mask, and the electrostatic chuck. The method of claim 1, wherein the thermal imaging camera module,
A deposition apparatus for manufacturing a display device, further comprising a cooling line that is in contact with the thermal imaging camera and controls the temperature of the thermal imaging camera and the temperature of the lens. The deposition apparatus of claim 4, wherein the cooling line wraps around the surface of the thermal imaging camera. The method of claim 1, wherein the thermal imaging camera module,
A deposition apparatus for manufacturing a display device, comprising a transparent material and further comprising a protective tape disposed on the second surface of the lens. The method of claim 1, wherein the thermal imaging camera module,
A deposition apparatus for manufacturing a display device, further comprising a body portion that accommodates the thermal imaging camera and the thermocouple, and a leg portion connected to the body portion. The deposition apparatus of claim 7, wherein the leg portion includes bellows. The deposition apparatus of claim 7, wherein the body portion includes a first opening, and the lens is coupled to the body portion through the first opening. The method of claim 7, wherein the thermal imaging camera module,
A deposition apparatus for manufacturing a display device, further comprising a shutter coupled to the body and opening and closing the second surface of the lens. 11. The method of claim 10, wherein the body portion includes a second opening,
The thermal imaging camera module,
a shutter driver that controls the open or closed state of the shutter; and
A deposition apparatus for manufacturing a display device, further comprising a shutter connection part that connects the shutter driver and the shutter and is coupled to the body part through the second opening. The method of claim 11, wherein the thermal imaging camera module,
a motor cable disposed inside the body unit and supplying power to the shutter driving unit; and
A deposition apparatus for manufacturing a display device, further comprising a camera cable disposed inside the body portion and supplying power to the thermal imaging camera. The deposition apparatus for manufacturing a display device according to claim 11, wherein an internal space of the thermal imaging camera module sealed by the body portion, the lens, the shutter connection portion, and the leg portion is in a standby state. The method of claim 7, wherein the thermal imaging camera module,
A deposition apparatus for manufacturing a display device, comprising: an angle adjustment unit disposed at a boundary between the body unit and the leg unit, and controlling a direction in which the thermal imaging camera captures images. Providing a chamber including a vapor deposition device, a base material, an electrostatic chuck disposed on the base material, and a thermal imaging camera module including a thermal imaging camera and a shutter;
opening the shutter to expose the thermal imaging camera;
measuring the temperature of the electrostatic chuck using the thermal imaging camera;
closing the shutter so that the thermal imaging camera is not exposed; and
A deposition method using a deposition apparatus for manufacturing a display device, comprising the step of spraying a deposition material from the deposition device. The method of claim 15, between measuring the temperature of the electrostatic chuck and closing the shutter,
A deposition method using a deposition apparatus for manufacturing a display device, further comprising adjusting the temperature of the electrostatic chuck to be the first target temperature. The deposition method according to claim 16, wherein the first target temperature is 60°C or lower. The method of claim 16, between adjusting the temperature of the electrostatic chuck to be the first target temperature and closing the shutter,
Placing a mask inside the chamber using a mask transfer unit;
measuring the temperature of the mask using the thermal imaging camera; and
A deposition method using a deposition apparatus for manufacturing a display device, further comprising adjusting the temperature of the mask to be the second target temperature. The method of claim 18, between adjusting the temperature of the mask to the second target temperature and closing the shutter,
positioning a substrate between the mask and the electrostatic chuck inside the chamber;
measuring the temperature of the substrate using the thermal imaging camera; and
A deposition method using a deposition apparatus for manufacturing a display device, further comprising adjusting the temperature of the substrate to a third target temperature. The method of claim 19, between adjusting the temperature of the substrate to the third target temperature and closing the shutter,
contacting the mask on the substrate;
measuring the temperature of the mask and the temperature of the substrate using the thermal imaging camera; and
A deposition method using a deposition apparatus for manufacturing a display device, further comprising adjusting the temperature of the mask to a fourth target temperature and adjusting the temperature of the substrate to a fifth target temperature.

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