CN116761980A - 电容式传感器 - Google Patents

电容式传感器 Download PDF

Info

Publication number
CN116761980A
CN116761980A CN202280010003.6A CN202280010003A CN116761980A CN 116761980 A CN116761980 A CN 116761980A CN 202280010003 A CN202280010003 A CN 202280010003A CN 116761980 A CN116761980 A CN 116761980A
Authority
CN
China
Prior art keywords
substrate
frame
capacitive sensor
anchor
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202280010003.6A
Other languages
English (en)
Chinese (zh)
Inventor
董春祉
相泽宏幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of CN116761980A publication Critical patent/CN116761980A/zh
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5733—Structural details or topology
    • G01C19/5755—Structural details or topology the devices having a single sensing mass
    • G01C19/5762—Structural details or topology the devices having a single sensing mass the sensing mass being connected to a driving mass, e.g. driving frames
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/025—Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0307—Anchors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/04—Electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Gyroscopes (AREA)
  • Pressure Sensors (AREA)
CN202280010003.6A 2021-02-04 2022-01-17 电容式传感器 Withdrawn CN116761980A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021016755 2021-02-04
JP2021-016755 2021-02-04
PCT/JP2022/001418 WO2022168585A1 (ja) 2021-02-04 2022-01-17 静電容量型センサ

Publications (1)

Publication Number Publication Date
CN116761980A true CN116761980A (zh) 2023-09-15

Family

ID=82740694

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280010003.6A Withdrawn CN116761980A (zh) 2021-02-04 2022-01-17 电容式传感器

Country Status (4)

Country Link
US (1) US20240092630A1 (https=)
JP (1) JPWO2022168585A1 (https=)
CN (1) CN116761980A (https=)
WO (1) WO2022168585A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0918017A (ja) * 1995-06-30 1997-01-17 Omron Corp 半導体加速度センサおよび半導体圧力センサ
JP4847686B2 (ja) * 2004-05-26 2011-12-28 パナソニック電工株式会社 半導体加速度センサ
US11150092B2 (en) * 2017-01-17 2021-10-19 Panasonic Intellectual Property Management Co., Ltd. Sensor
WO2020203011A1 (ja) * 2019-03-29 2020-10-08 パナソニックＩｐマネジメント株式会社 角速度センサ
JP7166238B2 (ja) * 2019-11-06 2022-11-07 株式会社豊田中央研究所 Ｍｅｍｓ構造体

Also Published As

Publication number Publication date
WO2022168585A1 (ja) 2022-08-11
JPWO2022168585A1 (https=) 2022-08-11
US20240092630A1 (en) 2024-03-21

Similar Documents

Publication Publication Date Title
CN101529257B (zh) 传感器
CN103528578B (zh) 微机电系统
CN104237562B (zh) 带有正交误差补偿的角速率传感器
US12259403B2 (en) Inertial sensor module
JPH08145683A (ja) 加速度・角速度検出装置
JP2010127763A (ja) 半導体力学量検出センサ及びそれを用いた制御装置
JP2012163507A (ja) 加速度センサ
CN111551161A (zh) Mems振动式陀螺仪结构及其制造方法
CN113631882B (zh) 角速度传感器
CN116761980A (zh) 电容式传感器
CN119555959A (zh) 悬臂梁式电容mems加速度传感器
JPH10104266A (ja) 力学量センサおよびそれを用いた集積回路
JP2006226770A (ja) 力学量センサ
JP4466283B2 (ja) ジャイロセンサ
JP2001349731A (ja) マイクロマシンデバイスおよび角加速度センサおよび加速度センサ
CN113678000B (zh) 物理量传感器
KR100631218B1 (ko) 병진형 ｍｅｍｓ 자이로스코프
JP2007101203A (ja) 角速度センサ
JP2025014384A (ja) Ｍｅｍｓデバイス
CN121909382A (zh) 静电电容式传感器
JP2023182910A (ja) 加速度センサ
CN117948955A (zh) 具有沿竖直轴线的角速度检测的微机电陀螺仪
JP2006226799A (ja) 力学量センサ
JP2008261772A (ja) 慣性力センサ
JP2009192234A (ja) センサ

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WW01 Invention patent application withdrawn after publication

Application publication date: 20230915

WW01 Invention patent application withdrawn after publication